3D heat conduction device and manufacturing method thereof

Abstract

The invention discloses a 3D heat conduction device and a manufacturing method thereof. The 3D heat conduction device is composed of a lower plate, an upper plate, at least one special-shaped cavity, at least one capillary supporting body and the like. Wherein the special-shaped cavity penetrates upwards from an opening in the back face of the upper plate to be combined and fixed, the upper plate and the lower plate are combined and sealed, meanwhile, the end, protruding out of the opening of the special-shaped cavity, of the capillary supporting body is combined and fixed to the interior of the lower plate, and after assembly and sealing, one end of the capillary supporting body abuts against the interior of the special-shaped cavity; the other end abuts against the interior of the lower plate. According to the heat conduction device, the strength of the special-shaped cavity is improved through supporting of the capillary supporting body in the special-shaped cavity, the deformation resistance of the special-shaped cavity is improved, and the heat dissipation effect of the heat conduction device is improved through the capillary structure of the capillary supporting body.

Description

TECHNICAL FIELD

[0001] The present application relates to a 3D heat conduction device and a manufacturing method thereof. BACKGROUND

[0002] The existing 3D heat conduction device, such as Taiwan patent application No. 106112614, a heat conduction structure and a manufacturing method thereof, wherein the heat conduction structure includes a heat spreader, a heat pipe and a working fluid, the heat spreader includes an upper shell and a lower shell, a cavity is formed between the lower shell and the upper shell, the upper shell is provided with a through hole communicating with the cavity, a first capillary structure is laid on the inner surface of the upper shell, and a through hole is provided in the first capillary structure corresponding to the position of the through hole; the heat pipe includes a pipe body and a second capillary structure, the second capillary structure is arranged in the pipe body and extends out of the pipe body to form an exposed section, the heat pipe penetrates the through hole, and the exposed section passes through the through hole to be connected with the first capillary structure; the working fluid is filled in the cavity. Taiwan patent application No. 110117321, a 3D heat dissipation device, includes a heat spreader, a heat pipe and a solder joint. The heat spreader includes an inner chamber and a first joint, and the first joint has a passage communicating with the inner chamber. The heat pipe has an inner space and a second joint, and the second joint is sleeved around the first joint so that the end surface of the second joint directly contacts one surface of the heat spreader. The inner space is connected to the inner chamber through the passage. A working fluid is filled in the inner space and the inner chamber, and the solder joint combines the heat pipe and the heat spreader into one body. Taiwan patent application No. 111213245, a 3D heat spreader, includes a heat spreader and at least one pipe body, the heat spreader has an upper plate and a lower plate, the upper plate is provided with at least one opening penetrating the upper plate, the upper plate and the lower plate are combined to define a plate-shaped cavity communicating with the opening, a working fluid and a capillary structure are arranged in the plate-shaped cavity, the inner side of the upper plate and the lower plate, the pipe body has a closed end and an open end at each end, the open end extends outward to form a trumpet-shaped lip connected with the inner side of the upper plate, the closed end penetrates the opening in the inner side of the upper plate and extends outward, and the closed end and the open end jointly define a tubular cavity communicating with the open end and the plate-shaped cavity, and a plurality of grooves are arranged in the inner side of the tubular cavity and the lip, and the grooves of the lip are connected with the capillary structure of the inner side of the upper plate. Taiwan patent application No. 112208826, a penetrating 3D heat spreader structure, the convex body of the lower plate of the heat spreader is tightly combined with the hollow pipe body, penetrates the upper plate, and allows the working fluid and internal steam to flow in each cavity, and the powder sintering body is laid on multiple positions such as the inner wall of the lower plate to improve the generation of capillary phenomenon.

[0003] In summary, the existing heat conduction device, the vapor chamber is provided with a heat pipe, the heat pipe and the vapor chamber adjacent to the plane, in the manufacturing process of welding will occur welding zone material and the welding material is not easy to operate and other problems, prone to manufacturing process of time-consuming and labor-intensive, also let the device increase and other shortcomings. In addition, the traditional heat pipe due to the narrow tube, the external heat dissipation area is insufficient also will cause the heat dissipation efficiency is limited, this is another disadvantage.

[0004] The present application mainly aims at the shortcomings of the existing vapor chamber, and provides a 3D heat conduction device and a manufacturing method thereof. SUMMARY

[0005] The main purpose of the present application is a 3D heat conduction device and a manufacturing method thereof, which can form a flat welding area plane at the joint between the opening end of the special-shaped cavity and the upper plate, so as to improve the complex structure and manufacturing process of the welding area in the traditional manufacturing process, and improve the production efficiency.

[0006] Another purpose of the present application is a 3D heat conduction device and a manufacturing method thereof, which uses the structure design of setting a capillary support body in the special-shaped cavity, and increases the strength of the special-shaped cavity through the support of the capillary support body, so as to improve the deformation resistance of the special-shaped cavity.

[0007] Still another purpose of the present application is a 3D heat conduction device and a manufacturing method thereof, which uses the structure design of setting a capillary support body in the special-shaped cavity, and improves the speed of the liquid phase working fluid returning to the vapor chamber through the capillary structure of the support body, so as to improve the heat dissipation effect of the heat conduction device.

[0008] In order to achieve the above purpose, the present application provides the following technical scheme:

[0009] A 3D heat conduction device, comprising: a lower plate, an upper plate, at least one special-shaped cavity and at least one capillary support body, wherein,

[0010] The lower plate forms a vapor chamber inside and has an opening;

[0011] The upper plate has at least one hole passing through the upper plate;

[0012] The at least one special-shaped cavity has an opening at one end and is closed at other surfaces, and forms a special-shaped cavity chamber inside;

[0013] The at least one capillary support body is arranged inside the special-shaped cavity, one end of which abuts against the inside of the closed end opposite to the opening end of the special-shaped cavity, and the other end protrudes from the opening end of the special-shaped cavity;

[0014] The special-shaped cavity is inserted into the opening on the back of the upper plate and fixed, and the upper plate is assembled and sealed with the lower plate, and the end of the capillary support body protruding from the opening of the special-shaped cavity is fixed in the interior of the lower plate, so that the end of the capillary support body abuts against the interior of the special-shaped cavity and the other end abuts against the interior of the lower plate after the assembly and sealing.

[0015] Preferably, the shape of the opening end of the special-shaped cavity matches the opening of the upper plate.

[0016] Preferably, the special-shaped cavity has a thin-walled cavity structure, and is a rectangular body, a tubular body, or other irregular shapes.

[0017] Preferably, the interior of the housing of the lower plate is provided with a chamber capillary structure, the side of the upper plate facing the opening of the lower plate is provided with a lower plate capillary structure, and the interior of the special-shaped cavity is provided with a capillary structure, which forms a complete internal capillary structure with the support capillary structure provided by the capillary support body.

[0018] Preferably, the length of the capillary support body protruding from the opening end of the special-shaped cavity matches the thickness of the uniform plate chamber of the lower plate.

[0019] Preferably, a flange is formed around the opening end of the special-shaped cavity, a groove is formed around the opening of the side of the upper plate facing the opening end of the lower plate, and the flange and the groove match to form a plane after matching.

[0020] A manufacturing method of a 3D three-dimensional heat conduction device, comprising a lower plate, an upper plate, at least one special-shaped cavity, and at least one capillary support body, and the steps of the manufacturing method are as follows:

[0021] Step S10: The special-shaped cavity is formed in a stretching manner to have a thin-walled cavity structure, and has an opening at one end.

[0022] Step S20: At least one capillary support body is arranged in the interior of the special-shaped cavity, one end of the capillary support body abuts against the interior of the closed end opposite to the opening end of the special-shaped cavity, and the other end protrudes from the opening end of the special-shaped cavity.

[0023] Step S30: At least one opening is punched through the upper plate, and the size and shape of the opening match the shape of the opening end of the special-shaped cavity.

[0024] Step S40: The special-shaped cavity is inserted into the opening on the back of the upper plate and fixed, and the special-shaped cavity and the upper plate are fixed together.

[0025] Step S50: The upper plate is assembled and sealed with the lower plate, and the end of the capillary support body protruding from the opening of the special-shaped cavity is fixed in the interior of the lower plate, forming a uniform plate, so that the uniform plate and the at least one special-shaped cavity thereon form an integrated heat dissipation device.

[0026] Step S60, through the degassing device degassing vacuum and filling working fluid operation, the space of the uniform temperature plate chamber and the space of the special-shaped cavity chamber are communicated with each other, and the state of being closed and containing a predetermined amount of working fluid in vacuum is presented;

[0027] Wherein,

[0028] The one end of the capillary support body is assembled and sealed against the inside of the special-shaped cavity, and the other end is assembled and sealed against the inside of the lower plate.

[0029] Preferably, the capillary structure is arranged at a predetermined position in the uniform temperature plate composed of the upper plate and the lower plate, the capillary structure is arranged in the inside of the special-shaped cavity, and the support body capillary structure is arranged at a predetermined position of the capillary support body.

[0030] Preferably, the capillary support body is arranged in a combined manner of welding, bonding, or other combined fixing manner.

[0031] Preferably, the special-shaped cavity is manufactured by a mold in a deep extension manner to form a thin-walled cavity with only an open end and a closed end being a flat surface.

[0032] The present application increases the strength of the special-shaped cavity, improves the heat dissipation effect of the heat conduction device, and uses a relatively simple manufacturing method of the special-shaped cavity to improve production efficiency and reduce production cost. BRIEF DESCRIPTION OF DRAWINGS

[0033] The above structure and advantages of the present application will become apparent and easy to understand from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0034] Figure 1 is a three-dimensional exploded view of the 3D heat conduction device of the present application;

[0035] Figure 2 is a three-dimensional assembled view of the 3D heat conduction device of the present application;

[0036] Figure 3 is a three-dimensional exploded view of the 3D heat conduction device of the present application Figure 2 ;

[0037] Figure 4 is a three-dimensional exploded view of another embodiment of the 3D heat conduction device of the present application;

[0038] Figure 5 is a three-dimensional exploded view of another embodiment of the 3D heat conduction device of the present application Figure 4 ;

[0039] Figure 6 is a manufacturing flowchart of the manufacturing method of the 3D heat conduction device of the present application.

[0040] The reference signs in the above figures are explained as follows:

[0041] 10 - lower plate, 20 - upper plate, 30 - profiled cavity, 40 - capillary support, 50 - uniform temperature plate;

[0042] 11 - uniform temperature plate cavity, 12 - cavity capillary structure;

[0043] 21 - opening, 22 - lower plate capillary structure, 23 - groove;

[0044] 31 - profiled cavity cavity, 32 - flange, 33 - capillary structure;

[0045] 41 - support capillary structure, 42 - fixing portion. DETAILED DESCRIPTION

[0046] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below by reference to the drawings are exemplary only and are used merely for the purpose of explanation and are not to be construed as limiting the present application.

[0047] A 3D heat conduction device provided by the present application, please refer to Figure 1 , Figure 2 and Figure 3 ; as Figure 1 shown, is a three-dimensional exploded view of the 3D heat conduction device; as Figure 2 shown, is a three-dimensional assembly view of the 3D heat conduction device; as Figure 3 shown, Figure 2Figure 3-3 is a cross-sectional view of the 3D solid heat conduction device. The 3D solid heat conduction device comprises a lower plate 10, an upper plate 20, at least one profiled cavity 30, and at least one capillary support 40. The lower plate 10 is a thin shell with an internal uniform plate cavity 11 and an opening. The upper plate 20 is a thin cover with a size that can cover the opening of the lower plate 10. The upper plate 20 has at least one hole 21 that penetrates the upper plate 20. The size and shape of the hole 21 correspond to the profiled cavity 30. The upper plate 20 is sealed to the lower plate 10 to form a uniform plate 50. The profiled cavity 30 has an opening at one end and is closed on all other sides. The profiled cavity 30 has a profiled cavity chamber 31 inside. The shape of the opening of the profiled cavity 30 corresponds to the hole 21 of the upper plate 20. The profiled cavity 30 is preferably manufactured by deep drawing to form a thin-walled cavity structure. The profiled cavity 30 can be a rectangular body, a tube, or other irregular shapes. For example, the profiled cavity 30 can be a thin rectangular body. The present application uses a rectangular body as an example, but is not limited to this. Any shape that maximizes the volume of the profiled cavity chamber 31 inside the profiled cavity 30 and maximizes the heat dissipation area of the profiled cavity 30 is feasible. The lower plate 10, the upper plate 20, and the profiled cavity 30 can be made of copper, aluminum, stainless steel, or other alloys with good heat dissipation properties. The capillary support 40 is placed at a predetermined position inside the profiled cavity 30. One end of the capillary support 40 is inside the closed end opposite the opening of the profiled cavity 30, and the other end protrudes out of the opening of the profiled cavity 30. The protruding length of the capillary support 40 corresponds to the thickness of the uniform plate cavity 11 of the lower plate 10. Therefore, when the present application is assembled and sealed, one end of the capillary support 40 is inside the profiled cavity 30, and the other end is inside the lower plate 10 (see Figure 3-3). The capillary support 40 is preferably made of copper, aluminum, stainless steel, or other alloys with good heat dissipation properties. Figure 3), to increase the ability of the special-shaped cavity 30 to resist deformation with its supporting force. The capillary support 40 forms a support capillary structure 41 along the left and right sides of the long axis direction of the special-shaped cavity 30, which can match the capillary structure inside the upper plate 10 and the lower plate 20 after the special-shaped cavity 30 is combined, to form a complete capillary structure inside the special-shaped cavity 30. The front and back surfaces of the capillary support 40 along the short axis direction of the special-shaped cavity 30, which are in contact with the inner surface of the special-shaped cavity 30, form a fixing part 42, to connect and fix the capillary support 40 at a predetermined position inside the special-shaped cavity 30. Because the fixing part 42 and the inner surface of the special-shaped cavity 30 are both flat surfaces in contact, the capillary support 40 is relatively easy to fix inside the special-shaped cavity 30 using welding, bonding, or other methods. Because the fixing part 42 and the inner surface of the special-shaped cavity 30 are both flat surfaces, the welding operation is relatively simple in practice, so the manufacturing process can be simplified and the operation is relatively easy. In actual use, the heat conduction device often deforms due to internal negative pressure caused by receiving a large amount of heat generated by electronic equipment, causing damage to the equipment, which is one of the main shortcomings of existing devices. The present application increases the strength of the special-shaped cavity 30 through the support of the capillary support 40, which can resist deformation and improve the shortcomings of existing devices. In addition, the capillary support 40 has a support capillary structure 41 that can improve the speed of the liquid-phase working fluid returning to the uniform temperature plate cavity 11, thereby improving the heat dissipation effect of the 3D heat conduction device of the present application. The present embodiment uses a capillary support 40 as an example, and one or more capillary supports 40 can be used as long as the number can match the selection and design of the space inside the special-shaped cavity 30. The combination method is to first set at least one capillary support 40 at a predetermined position inside the special-shaped cavity 30, with one end against the inside of the closed end opposite the open end of the special-shaped cavity 30, and the other end protruding from the open end of the special-shaped cavity 30, and the protruding length matches the thickness of the uniform temperature plate cavity 11 of the lower plate 10. The capillary support 40 can be set and combined in a way that can be selected from welding, bonding, or other fixed combination methods. Then the special-shaped cavity 30 is inserted into the opening 21 on the back of the upper plate 20, and the open end of the special-shaped cavity 30 is flush with the opening 21 on the back of the upper plate 20, to facilitate the subsequent combination operation (such as welding) between the two. Then the special-shaped cavity 30 and the upper plate 20 are combined, and the preferred method is to use welding, but other methods that can combine and fix the special-shaped cavity 30 and the upper plate 20 together and are airtight are also feasible.Finally, the upper plate 20 is assembled and welded to the lower plate 10 for sealing. Simultaneously, the end of the capillary support 40 protruding from the opening of the irregular cavity 30 is fixed inside the lower plate 10, forming a heat spreader 50. Through a degassing pipe, a vacuum is drawn and working fluid is filled, making the heat spreader 50 and at least one irregular cavity 30 on it form an integrated heat dissipation device. At this time, the space of the heat spreader chamber 11 will be interconnected with the space of the irregular cavity chamber 31, and will be in a sealed vacuum containing a predetermined amount of working fluid. This working fluid can be pure water or other fluids that easily undergo two-phase conversion. Of course, to improve the heat dissipation effect, a chamber capillary structure 12 can be provided inside the shell of the lower plate 10, a lower plate capillary structure 22 can be provided on the side of the upper plate 20 facing the opening of the lower plate 10, and a capillary structure 33 can be provided inside the irregular cavity 30 (e.g., ...). Figure 3 (As shown). These capillary structures can be metal braids, powder sintered bodies, or grooves. At this time, one end of the support capillary structure 41 contacts the internal capillary structure 33 of the irregular cavity 30, and the other end contacts the chamber capillary structure 12 inside the lower plate 10, forming a complete internal capillary structure. In use, one side of the heat spreader 50 is the condensation end, and the other side is the evaporation end. The support capillary structure 41 inside the irregular cavity 30 assists the liquid working fluid to quickly flow back to the heat spreader chamber 11, achieving rapid heat dissipation. Of course, the present invention can also add heat dissipation fins outside the irregular cavity 30 to increase the heat dissipation area and assist in heat dissipation.

[0048] Please also refer to Figure 4 and Figure 5 , Figure 4 This is an exploded perspective view of another embodiment of the 3D heat conduction device of the present invention; Figure 5 for Figure 4 An exploded three-dimensional view of the back of A, viewed from bottom to top, is provided. This embodiment of the 3D heat-conducting device also includes: a lower plate 10, an upper plate 20, at least one irregularly shaped cavity 30, and at least one capillary support 40. The main difference is that a flange 32 is formed around the opening end of the irregularly shaped cavity 30, while a groove 23 (e.g., [missing information]) is formed around the opening 21 on the side of the upper plate 20 facing the opening end of the lower plate 10, matching the shape, size, and depth of the flange 32. Figure 5Therefore, when the opening end of the special-shaped cavity 30 is sleeved into the opening 21 of the upper plate 20, the flange 32 of the special-shaped cavity 30 can be embedded into the groove 23 of the upper plate 20, and the two form a plane after embedding, facilitating the welding operation and making the special-shaped cavity 30 and the uniform temperature plate 50 more stably combined together. The flange 32 around the opening end of the special-shaped cavity 30 is outwardly expanded and has a predetermined angle, which can form a flat welding area plane with the groove 23 around the opening 21 of the upper plate 20 on the plane of the side of the upper plate 20 facing the opening end of the lower plate 10, facilitating the welding operation and improving the current industry's disadvantage that the 3D three-dimensional heat conduction structure is not easy to weld. The predetermined angle is preferably 90 degrees with the special-shaped cavity 30, so that the groove 23 is also 90 degrees recessed on the plane of the side of the upper plate 20 facing the opening end of the lower plate 10, so that the two form a plane after embedding.

[0049] The manufacturing method of the 3D three-dimensional heat conduction device of the present application, please refer to Figure 3 and Figure 6 , Figure 6A flow chart of the manufacturing process of the 3D heat conducting device of the present application. The 3D heat conducting device comprises a lower plate 10, an upper plate 20, at least one profiled cavity 30 and at least one capillary support 40, etc. The manufacturing process is as follows: Step S10, first, the profiled cavity 30 is formed by deep drawing or other manufacturing methods to have a thin-walled cavity structure with an open end. The manufacturing method of the profiled cavity 30 is, for example, by a mold to form a cavity with only an open end and a closed end with a flat surface by deep drawing process. That is, the profiled cavity 30 is preferably formed by deep drawing to have a thin-walled cavity structure. The shape of the profiled cavity 30 can be a rectangular body, a tube or other irregular shape, for example, one of the preferred shapes is a thin rectangular body. The present application is exemplified by a rectangular body, not intended to limit the present application, any shape design that can maximize the volume of the hollow interior of the profiled cavity 30 and maximize the heat dissipation area of the profiled cavity 30 is a feasible option. Step S20, then at least one capillary support 40 is arranged at a predetermined position inside the profiled cavity 30, one end of which abuts against the inside of the closed end opposite to the open end of the profiled cavity 30, and the other end protrudes out of the open end of the profiled cavity 30, and the protruding length is matched with the thickness of the uniform plate cavity 11 of the lower plate 10. The arrangement and combination of the capillary support 40 can be selected by welding, bonding or other combination fixation methods. Step S30, then at least one hole 21 is punched through the upper plate 20. The size and shape of the hole 21 are matched with the shape of the open end of the profiled cavity 30. Step S40, the profiled cavity 30 is inserted into the hole 21 from the back of the upper plate 20, and is combined and fixed with the upper plate 20 by welding or other combination methods. Step S50, then the upper plate 20 is assembled and welded with the lower plate 10 to be sealed, and at the same time, the capillary support 40 protruding out of the open end of the profiled cavity 30 is combined and fixed inside the lower plate 10 to form a uniform plate 50, so that the uniform plate 50 and the at least one profiled cavity 30 thereon form an integrated heat dissipation device. Step S60, the deaeration device (e.g. deaeration pipe, not shown in the figure) is used to perform deaeration, vacuumization and filling operations, so that the space of the uniform plate cavity 11 and the space of the profiled cavity chamber 31 are in communication with each other, and are in a state of closed vacuum containing a predetermined amount of working fluid. The completed 3D heat conducting device can be used as a heat dissipation module, which is installed inside electronic products or other related products as a heat dissipation device. Because a small amount of working fluid is injected into the uniform plate cavity 11, the working fluid will quickly form liquid and vapor phases under vacuum environment, thereby increasing the heat conducting and heat dissipating functions.In addition, a flange 32 can be formed around the opening end of the irregular cavity 30, and a recess 23 can be formed around the opening 21 on the surface of the upper plate 20 facing the opening end of the lower plate 10, the recess 23 having a shape, size and depth matching those of the flange 32, so that the two can be embedded to form a flat surface, making the welding operation of the irregular cavity 30 and the upper plate 20 easier to perform. In this case, the flange 32 around the opening end of the irregular cavity 30 extends outwardly at a predetermined angle, which is preferably 90 degrees with respect to the irregular cavity 30. Of course, in the manufacturing process, a chamber capillary structure 12 can also be added inside the housing of the lower plate 10, a lower plate capillary structure 22 can be provided on the surface of the upper plate 20 facing the opening of the lower plate 10, and a capillary structure 33 can be provided inside the irregular cavity 30. Thus, one end of the capillary support capillary structure 41 of the capillary support 40 is in contact with the capillary structure 33 inside the irregular cavity 30, and the other end is in contact with the chamber capillary structure 12 inside the lower plate 10, forming a complete internal capillary structure. The capillary structures can be metal woven bodies, powder sintered bodies or groove structures.

[0050] The above detailed description of the structure, features and effects of the present application is based on the embodiments shown in the drawings, and the above description is only a preferred embodiment of the present application, but the present application is not limited to the embodiments shown in the drawings. Any changes or modifications made in accordance with the concept of the present application, or equivalent embodiments that do not exceed the spirit of the description and drawings, are within the scope of protection of the present application.

Claims

1. A 3D heat-conducting device, comprising: a lower plate, an upper plate, at least one irregularly shaped cavity, and at least one capillary support; wherein, The lower plate has an internal temperature-equalizing chamber and an opening. The upper plate has at least one opening that penetrates through it. The at least one irregularly shaped cavity is open at one end and closed on all other sides, forming an irregularly shaped cavity chamber inside; characterized in that... The at least one capillary support is disposed inside the irregular cavity, with one end abutting against the inside of the closed end opposite to the opening end of the irregular cavity, and the other end protruding from the opening end of the irregular cavity. The irregular cavity is inserted and fixed through the opening on the back of the upper plate. The upper plate is then assembled and sealed with the lower plate. At the same time, the end of the capillary support protruding from the opening of the irregular cavity is fixed inside the lower plate. After assembly and sealing, one end of the capillary support presses against the inside of the irregular cavity, and the other end presses against the inside of the lower plate.

2. The 3D stereoscopic heat conduction device as described in claim 1, characterized in that, The shape of the opening end of the irregular cavity matches the opening of the upper plate.

3. The 3D stereoscopic heat conduction device as described in claim 1, characterized in that, This irregular cavity has a thin-walled cavity structure, and it can be rectangular, tubular, or other irregular shapes.

4. The 3D stereoscopic heat conduction device as described in claim 1, characterized in that, The lower plate has a capillary structure inside its shell, and the upper plate has a capillary structure on the side facing the opening of the lower plate. The irregular cavity has a capillary structure inside, which, together with the capillary support structure, forms a complete internal capillary structure.

5. The 3D stereoscopic heat conduction device as described in claim 1, characterized in that, The length of the opening end of the capillary support protruding from the irregular cavity matches the thickness of the temperature equalization plate chamber of the lower plate.

6. The 3D stereoscopic heat conduction device as described in claim 1, characterized in that, A flange is formed around the opening end of the irregular cavity, and a groove is formed around the opening end of the upper plate facing the lower plate. The flange and the groove can form a plane after they are matched.

7. A method for manufacturing a 3D stereoscopic heat-conducting device, comprising: a lower plate, an upper plate, at least one irregularly shaped cavity, and at least one capillary support; characterized in that, The manufacturing process involves the following steps: Step S10: The irregular cavity is formed into a cavity structure with thin walls by an extension manufacturing method, and one end of the cavity has an opening; Step S20: At least one capillary support is provided inside the irregular cavity, with one end of the support pressing against the inside of the closed end opposite to the opening end of the irregular cavity, and the other end protruding from the opening end of the irregular cavity. Step S30: Punch at least one hole through the upper plate, the size and shape of which match the shape of the opening end of the irregular cavity; Step S40: Insert the irregular cavity upward through the opening on the back of the upper plate and fix the irregular cavity to the upper plate. Step S50: Assemble and seal the upper plate and lower plate together, and at the same time fix the end of the capillary support protruding from the opening of the irregular cavity to the inside of the lower plate to form a heat dissipation plate, so that the heat dissipation plate and at least one irregular cavity on it form an integral heat dissipation device. Step S60: The degassing device is used to perform degassing, vacuuming and filling of working fluid, so that the space of the uniform temperature plate chamber and the space of the irregular cavity chamber are connected to each other and present a state of sealed vacuum containing a predetermined amount of working fluid. in, After assembly and sealing, one end of the capillary support abuts against the inside of the irregular cavity, while the other end abuts against the inside of the lower plate.

8. The manufacturing method of the 3D stereoscopic heat conduction device as described in claim 7, characterized in that, The upper and lower plates together form a temperature equalization plate with a capillary structure at a predetermined position inside. The irregular cavity is also provided with a capillary structure, and the capillary support is provided with a support capillary structure at a predetermined position.

9. The manufacturing method of the 3D stereoscopic heat conduction device as described in claim 7, characterized in that, The capillary support is assembled by welding, bonding, or other bonding and fixing methods.

10. The manufacturing method of the 3D stereoscopic heat conduction device as described in claim 7, characterized in that, The irregular cavity is manufactured by deep drawing the sheet metal using a mold, forming a thin-walled cavity with only one open end and a flat closed end.

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