Chamfer laser machining method and system based on AOD and galvanometer cooperation

Abstract

The invention discloses a chamfering laser machining method and system based on AOD and galvanometer collaboration, and the method comprises the steps that a workpiece is sequentially divided into i layers from bottom to top in the axial direction of the workpiece; determining a galvanometer scanning track and a galvanometer scanning speed when laser scanning is carried out on each layer; determining a deflection vector when the acousto-optic deflection unit deflects the laser pulse; obtaining a correction deflection vector; controlling a laser device to output laser pulses, and controlling a galvanometer system to scan along a galvanometer scanning track at a galvanometer scanning speed so as to form an annular laser pulse array area; and the laser focus is controlled to move downwards, the steps are repeated, and finally the chamfering structure is formed on the workpiece. The laser pulse is deflected through cooperation of the acousto-optic deflection unit and the galvanometer system, the galvanometer system only needs to scan along one galvanometer scanning track, a complete annular laser pulse array area can be formed on the same layer at a time, and therefore the chamfering machining efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, specifically to a chamfering laser processing method and system based on AOD and galvanometer collaboration. Background Technology

[0002] In existing technologies, depending on the functional requirements of different scenarios, it is often necessary to form an inner chamfer structure on a ring-shaped workpiece. Currently, the inner chamfer structure is mostly formed by stamping using a module, but this method has problems such as low processing efficiency, obvious edge burrs, and high mold opening costs.

[0003] In response, a laser processing system based on a galvanometer has been developed to complete the aforementioned chamfering process. However, the scanning speed of the galvanometer is limited by factors such as the mechanical oscillation inertia of the motor, which also leads to the problem of low chamfering efficiency.

[0004] Acousto-optic deflectors (AODs) have advantages such as no inertia and fast response. Currently, AOD applications are mainly focused on laser drilling, and there is no technical solution to combine them with a galvanometer system to achieve efficient chamfering. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a chamfering laser processing method and system based on AOD and galvanometer collaboration. This method uses an acousto-optic deflection unit and a galvanometer system to collaboratively deflect laser pulses. It only requires the galvanometer system to scan along a single galvanometer scanning trajectory to form a complete annular laser pulse array region on the same layer in a single operation, thereby significantly shortening processing time and substantially improving chamfering efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] On the one hand, a chamfering laser processing method based on AOD and galvanometer collaboration is provided, which includes the following steps:

[0008] Along the axial direction of the workpiece from bottom to top, the workpiece is divided into i layers in sequence, and at least one circular trajectory is set on the first layer, and concentric circular trajectories containing several circular trajectories are set on each layer from the second to the i layer.

[0009] Determine the galvanometer scanning trajectory and galvanometer scanning speed when performing laser scanning on each layer;

[0010] Determine the deflection amount when the acousto-optic deflection unit deflects the laser pulse;

[0011] The deflection amount is corrected to obtain a corrected deflection amount;

[0012] The laser outputs laser pulses, and the galvanometer system is controlled to scan along the uppermost layer of the galvanometer scanning track at the galvanometer scanning speed, so that the laser pulses sequentially pass through the acousto-optic deflection unit and the galvanometer system and act on the uppermost layer of the workpiece to form a ring-shaped laser pulse array region on the uppermost layer.

[0013] The laser focal point is controlled to move downward, and the above steps are repeated until the material removal of each layer is completed, and finally a chamfer structure is formed on the workpiece.

[0014] In another aspect, a chamfer laser processing system is provided, which comprises:

[0015] a laser for outputting laser pulses;

[0016] an acousto-optic deflection unit for deflecting each laser pulse according to the correction deflection vector;

[0017] a galvanometer system for deflecting the laser pulses to act on the surface of the workpiece to form a ring-shaped laser pulse array region on the surface of the workpiece, and further removing the material of the ring-shaped laser pulse array region by laser energy;

[0018] and a control unit for controlling the laser focal point to move downward after completing the material removal of a layer on the workpiece, so that the acousto-optic deflection unit and the galvanometer system deflect the laser pulses to remove the material of the next layer on the workpiece until the material removal of each layer is completed, and finally a chamfer structure is formed on the workpiece.

[0019] Compared with the prior art, the present application has the following advantages:

[0020] The present application deflects the laser pulses through the acousto-optic deflection unit and the galvanometer system, which only needs to make the galvanometer system scan along one galvanometer scanning track, and synchronously deflect the laser pulses through the AOD during the scanning process, without the need for the galvanometer system to repeatedly jump, so that a complete ring-shaped laser pulse array region can be formed on the same layer at one time, thereby greatly shortening the processing time and significantly improving the chamfer processing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The step flow chart of the chamfer laser processing method based on AOD and galvanometer cooperation of the present application;

[0022] Figure 2 The circular track distribution diagram on different layers of the workpiece in the present application;

[0023] Figure 3 The schematic diagram of the galvanometer scanning track C in the present application;

[0024] Figure 4This is a schematic diagram showing the positional relationship between two adjacent laser pulses on the same circular trajectory in this invention;

[0025] Figure 5 This is a schematic diagram showing the positional relationship between the deflection pulse position and the theoretical pulse position in this invention;

[0026] Figure 6 This is a schematic diagram illustrating the steps of determining the transformation matrix M(α,β), rotation transformation matrix R(θ), and graphic scaling ratio s based on theoretical and actual graphics in this invention.

[0027] Figure 7 In this invention, the coordinate system O of the scanning area of ​​the acousto-optic deflection unit is adjusted by scaling, rotation, and mirror transformation. A -X A Y A A schematic diagram illustrating the steps for aligning with the galvanometer coordinate system O-XY;

[0028] Figure 8 This is a schematic diagram of the laser pulse array region formed on the workpiece in this invention;

[0029] Figure 9 This is a schematic diagram of the scanning area of ​​the acousto-optic deflection unit in this invention;

[0030] Figure 10 This is a schematic diagram of the chamfering laser processing system in this invention. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example 1:

[0033] like Figure 1 As shown, this embodiment provides a chamfering laser processing method based on AOD and galvanometer collaboration, which includes the following steps:

[0034] S1. Divide the workpiece P into layers 1, 2, ..., i sequentially from bottom to top along the axial direction of the workpiece P. Set at least one circular trajectory on layer 1, and set a concentric circular trajectory containing several circular trajectories on each layer from layer 2 to i, where i is a positive integer greater than or equal to 2. Preferably, a concentric circular trajectory can also be set on layer 1.

[0035] Furthermore, from bottom to top, the difference in the number of circular tracks between adjacent layers is a fixed value, such as 1; at the same time, the center of the circular track in each layer is on the axial direction of the workpiece P, and the distance between two adjacent circular tracks in the same layer is d. In the layer with concentric circular tracks, the distance between two adjacent circular tracks in each layer is d.

[0036] For example, in this embodiment, such as Figure 2 As shown, workpiece P is divided into 6 layers from bottom to top along the axial direction of the workpiece P, namely layer 1 to layer 6. Only one circular trajectory is set in layer 1, and concentric circular trajectories are set in each layer from layer 2 to layer 6. The number of circular trajectories in layers 2 to 6 are 2, 3, 4, 5 and 6 respectively.

[0037] Furthermore, taking the 6th layer as an example, it has a total of 6 concentric circular trajectories circle1, circle2, ..., circle6, with the spacing between any two adjacent circular trajectories being d; similarly, for layers 2-5, the spacing between any two adjacent circular trajectories in each layer is also d; if the 1st layer also has concentric circular trajectories, the spacing between any two adjacent circular trajectories is also d.

[0038] S2. Determine the galvanometer scanning trajectory C and galvanometer scanning speed v during laser scanning of each layer. mid ;

[0039] Among them, such as Figure 3 As shown, the radius r of the galvanometer scanning trajectory C mid =r min +(n-1)·d / 2, r min Let r be the radius of the innermost circular trajectory in the current layer. When there is only one circular trajectory in the first layer, the radius of that circular trajectory is r. min ; n is the number of circular trajectories in the current layer; d is the spacing between two adjacent circular trajectories in the concentric circular trajectories of the current layer, when the th...

[0040] When there is only one circular trajectory on the first layer, take d=0;

[0041] In addition, scanning speed Where f is the laser frequency and N is the total number of laser pulses that fall on all circular trajectories on the current layer after being deflected by the acousto-optic deflection unit and the galvanometer system when the current layer is scanned by laser.

[0042] Furthermore, the total number of laser pulses on all circular trajectories in the current layer. Among them, such as Figure 2As shown, Δθ is the angular interval between two adjacent laser pulses on each circular trajectory in the current layer. In this embodiment, the angular interval between two adjacent laser pulses on each circular trajectory in each layer is Δθ.

[0043] S3. Determine the deflection amount of the acousto-optic deflection unit when deflecting the laser pulse according to the following formula. :

[0044]

[0045] Among them, (x n ,y n The coordinates of the theoretical pulse position are: the position of the laser pulse on the machining surface when the laser beam is deflected along the galvanometer scanning trajectory C by only the galvanometer system, so that all laser pulses fall on the galvanometer scanning trajectory C. This theoretical position of the laser pulse can be determined by the known radius r of the innermost circular trajectory. min The distance d between two adjacent circular trajectories and the angular interval Δθ are determined; (x n,m ,y n,m ) represents the theoretical pulse position coordinates (x n ,y n The coordinates of the deflection pulse after the laser pulse at point () is deflected by the acousto-optic deflection unit;

[0046] For example, such as Figure 4 As shown, an O-XY coordinate system is established on the machining surface with the center of the galvanometer scanning trajectory C as the point, and the X-axis passes through the center of laser pulse p1. The angular interval Δθ between two adjacent laser pulses p1 and p2 and the radius r of the galvanometer scanning trajectory C are known. mid Then the theoretical position coordinates of laser pulse p1 are (r mid The theoretical position coordinates of laser pulse p2 are (r, 0), mid cosΔθ, r mid Since all laser pulses are evenly spaced along the galvanometer scanning trajectory C, the theoretical position coordinates of each laser pulse can be obtained.

[0047] The deflection pulse position coordinates (x) n,m ,y n,m This can be obtained through the following steps:

[0048] Along the forward direction of the galvanometer scanning trajectory C of the current layer (e.g., counterclockwise), the laser pulses on the galvanometer scanning trajectory C are divided into several pulse groups, and each pulse group contains laser pulses corresponding to the number of circular trajectories on the current layer; for example, as shown in Figure 5, the number of circular trajectories on the current layer is 5, and from the inside out they are c1, c2, c3, c4, and c5, then the laser pulses on the galvanometer scanning trajectory C are divided into several pulse groups along the counterclockwise direction, and each pulse group contains 5 laser pulses, namely p1, p2, p3, p4, and p5;

[0049] According to the output time of the laser pulses, each laser pulse in each pulse group is deflected sequentially (for example, by using an acousto-optic deflection unit) to its corresponding circular trajectory. Each laser pulse in the same pulse group is deflected to its unique corresponding circular trajectory, and each circular trajectory receives only one laser pulse. For example, if five laser pulses p1, p2, p3, p4, and p5 are output sequentially in time, then laser pulses p1, p2, p3, p4, and p5 are deflected to circular trajectories c1, c2, c3, c4, and c5 arranged sequentially from the inside out, respectively. Alternatively, laser pulses p1, p2, p3, p4, and p5 are deflected to their corresponding circular trajectories c1, c2, c3, c4, and c5 arranged sequentially from the inside out. 2. p3, p4, and p5 are respectively deflected onto circular trajectories c5, c4, c3, c2, and c1 arranged from the outside to the inside. Alternatively, laser pulses p1, p2, p3, p4, and p5 are randomly deflected onto circular trajectories c5, c2, c4, c3, and c1, as long as each laser pulse is ultimately matched with a circular trajectory. Preferably, the laser pulses in all pulse groups are deflected in the same way as the circular trajectories. For example, laser pulses p1, p2, p3, p4, and p5 are mapped onto circular trajectories c1, c2, c3, c4, and c5 arranged from the inside to the outside.

[0050] Based on the radius r of the innermost circular trajectory of the current layer min The position coordinates of the laser pulse deflected onto the current circular trajectory can be determined by the distance d between two adjacent circular trajectories and the angular interval Δθ. These coordinates are used as the position coordinates of the deflection pulse. The method for obtaining these position coordinates is the same as that for obtaining the theoretical position coordinates, and will not be repeated here.

[0051] For example, if the theoretical position coordinates of laser pulse p1 are (x1, y1), when it is deflected onto the circular trajectory c1, the position coordinates of laser pulse p1 can be redefined. These redefined coordinates can then be used as the deflection pulse position coordinates (x2, y2) corresponding to the theoretical position coordinates (x1, y1).

[0052] S4. Obtain the coordinate system O of the scanning area of ​​the acousto-optic deflection unit. A -X A Y AThe deflection angle φ relative to the galvanometer coordinate system O-XY, the image scaling ratio s, and the mirror transformation matrix M(α,β) specifically include the following steps:

[0053] like Figure 6 As shown, a theoretical pattern is set in the galvanometer coordinate system O-XY. The theoretical pattern refers to the processing pattern generated by the laser beam only under the action of the galvanometer system. The theoretical pattern includes a cross shape M1 and an arc M2. The intersection point of the cross shape M1 and the center of the arc M2 coincide with the origin O of the galvanometer coordinate system. The vertical and horizontal lines of the cross shape M1 are respectively aligned with the X-axis and Y-axis. G The axes coincide, the arc M2 has a direction pointing mark (such as a triangular arrow pointing in the clockwise direction), and the radius r of the arc M2 is known, such as 0.16mm;

[0054] According to the processing parameters of the theoretical pattern, only the acousto-optic deflection unit is controlled to deflect the laser beam to form an actual pattern on the workpiece in the galvanometer coordinate system O-XY. The actual pattern includes an actual cross shape M1' and an actual arc M2', wherein the intersection point of the actual cross shape M1' and the center of the actual arc M2' coincide, and the actual arc M2' has directional markings (such as arrows).

[0055] Meanwhile, the actual line segment M3' is generated only under the action of the galvanometer system, and the actual line segment M3' is parallel or coincident with the X-axis of the galvanometer coordinate system O-XY;

[0056] Calculate the angle between the actual and theoretical graphics to serve as the coordinate system O for the scanning area of ​​the acousto-optic deflection unit. A -X A Y A The deflection angle φ relative to the galvanometer coordinate system O-XY; for example, the deflection angle φ can be determined based on the angle between the horizontal line of the actual line segment M3' and the actual cross shape M1', and then the rotation matrix R(φ) can be calculated using the following formula:

[0057]

[0058] The scaling factor 's' is calculated based on the size ratio of the actual graphic and the theoretical graphic. This size ratio includes one of the following: radius ratio, length ratio, or area ratio. For example, in this embodiment, the scaling factor 's' is calculated as 's' / r', where r' is the radius of the actual arc M2'. Measurements show r' = 0.18 mm, therefore 's' = 0.18 / 0.16 = 1.125. The scaling matrix S is then further calculated using the following formula:

[0059]

[0060] Furthermore, the actual graphic is rotated and scaled according to the rotation transformation matrix R(θ) and the scaling matrix S, so that the actual graphic is aligned with the theoretical graphic in the galvanometer coordinate system O-XY and the scale is consistent.

[0061] Then, based on the actual graphic obtained after rotation and scaling transformation (i.e. Figure 6 In the "scaling + rotation transformation of graphics" (in the text), the direction of the actual "+" shaped graphic M1' or the actual arc M2' is marked to determine the mirror relationship between the actual graphic and the theoretical graphic;

[0062] In this embodiment, the mirror transformation matrix α and β are the Y-axis mirror coefficients and X-axis mirror coefficients, respectively. α = 1 or -1, β = 1 or -1. When α = -1, it indicates that the coordinate system O of the scanning area of ​​the acousto-optic deflection unit is... A -X A Y A Regarding its Y A When the axis is mirrored, β=-1 indicates that the coordinate system of the scanning area of ​​the acousto-optic deflection unit is mirrored about its X-axis. A When the axis is mirrored and α=β=1, it means that no mirror transformation is performed on the coordinate system of the scanning area of ​​the acousto-optic deflection unit.

[0063] Furthermore, if the actual graphic (such as...) Figure 6 (As shown in the "scaling + rotation transformation graph" in the image), the theoretical graph about Y... G If we mirror the axis, then we take α = -1 and β = 1. If we consider the relationship with respect to X... G If we want to mirror the axis, we take α=1 and β=-1, and thus determine the mirror transformation matrix M(α,β).

[0064] S5. Based on the deflection angle φ, the scaling ratio s of the processed graphic, and the mirror transformation matrix M(α,β), adjust the deflection amount. To perform correction and obtain the corrected deviation amount, the following steps are included:

[0065] Construct the mirror transformation matrix M(α,β), the scaling matrix S, and the rotation matrix R(φ). The expressions for each matrix are as shown in step S4 above, and will not be repeated here.

[0066] The corrected deflection steering variable is constructed based on the mirror transformation matrix M(α,β), the scaling matrix S, and the rotation matrix R(φ). :

[0067]

[0068] like Figure 7 As shown, due to the coordinate system O of the scanning area of ​​the acousto-optic deflection unit... A -X A Y AThe inconsistency in attitude and scale between the acousto-optic deflection unit and the galvanometer coordinate system O-XY causes the displacement generated by the acousto-optic deflection unit (i.e., the displacement in the acousto-optic deflection unit scanning area coordinate system, such as a leftward shift of 0.2 mm) to be scaled, rotated, and affected by the expected displacement in the galvanometer coordinate system (such as a rightward shift of 0.15 mm) relative to the acousto-optic deflection unit scanning area coordinate system O. A -X A Y A Since the coordinate axes undergo a mirror transformation, a coordinate transformation is required using the mirror transformation matrix M(α,β), the scaling matrix S, and the rotation matrix R(φ) to make the coordinate system O of the acousto-optic deflection unit's scanning area so that... A -X A Y A Align with the galvanometer coordinate system O-XY, that is, by aligning the scanning plane coordinate system O of the acousto-optic deflection unit. A -X A Y A Scaling, rotation, and mirror transformation are performed to make it consistent with the pose (i.e., the X-axis and Y-axis directions of the two coordinate systems) and scale of the galvanometer coordinate system O-XY. This ensures that the displacement of the acousto-optic deflection unit in the scanning area coordinate system under the action of the acousto-optic deflection unit is consistent with the expected displacement in the galvanometer coordinate system. For example, the displacement of 0.2mm to the left under the action of the acousto-optic deflection unit is scaled, rotated, and mirror transformed to make it a displacement of 0.15mm to the right in the galvanometer coordinate system.

[0069] S6. Control the laser to output laser pulses, and control the galvanometer system to scan along the uppermost galvanometer trajectory C at the galvanometer scanning speed v. mid The scanning process involves sequentially deflecting the laser pulses through an acousto-optic deflection unit and a galvanometer system before applying them to the uppermost layer of the workpiece P, thereby forming a ring-shaped laser pulse array region on the uppermost layer (e.g., ...). Figure 8 (As shown), further material in the region of the ring laser pulse array is removed using laser energy;

[0070] The acousto-optic deflection unit deflects the laser pulse by: calling a correction deflection amount. and according to the corrected deflection amount Deflect each laser pulse;

[0071] S7. Control the laser focus to move downwards and repeat S6 to complete the removal of material from the next layer;

[0072] And, S8, repeat the above steps S7 until the material of each layer is removed, and finally a chamfered structure is formed on the workpiece.

[0073] In existing technologies, a galvanometer system typically scans along several concentric circles on the same plane one by one. Therefore, after completing a scan along one concentric circle, the galvanometer system needs to jump to a predetermined position to scan along the next concentric circle. For example, as shown in part (a) of the figure, after the galvanometer system completes a scan along concentric circle 6, it must jump to a predetermined position to continue scanning along concentric circle 5. The more concentric circles there are, the more times the galvanometer system jumps, leading to longer processing time and the accumulation of positional errors during the jumping process, thus affecting the accuracy of hole drilling.

[0074] In this embodiment, the laser pulse is deflected in coordination by the acousto-optic deflection unit and the galvanometer system. It only requires the galvanometer system to scan along a single galvanometer scanning trajectory C. During the scanning process, the laser pulse is synchronously deflected by the acousto-optic deflection unit. Without the galvanometer system repeatedly jumping, a complete annular laser pulse array area can be formed on the same layer at once to complete the removal of the material in that layer. This eliminates the need for the galvanometer system to repeatedly jump and scan along multiple concentric circular trajectories, thereby significantly shortening the processing time and greatly improving the chamfering efficiency.

[0075] Example 2:

[0076] The only difference between this embodiment and Embodiment 1 is that, in order to ensure the formation of a ring-shaped laser pulse array region at a predetermined position, the theoretical pulse position coordinates (x... n ,y n ), deflection pulse position coordinates (x) n,m ,y n,m The following constraints must be met:

[0077]

[0078] Among them, l aod The scanning area of ​​the acousto-optic deflection unit is the side length. In this embodiment, the scanning area of ​​the acousto-optic deflection unit is a square region.

[0079] Example 3:

[0080] This embodiment provides a chamfering laser processing system, which can implement the chamfering laser processing method described in Embodiment 1 or 2, such as... Figure 10 As shown, the chamfering laser processing system includes:

[0081] Laser 1, which is used to output laser pulses;

[0082] Acousto-optic deflection unit 2 (i.e., AOD) is used to correct the deflection amount as described above. Deflect each laser pulse;

[0083] The galvanometer system 3 is used to deflect the laser pulse so that it acts on the surface of the workpiece P to form a ring laser pulse array region on the surface of the workpiece P, and further remove the material in the ring laser pulse array region by laser energy.

[0084] And a control unit, which controls the laser focus to move downward after the previous layer of material is removed from the workpiece, so that the acousto-optic deflection unit 2 and the galvanometer system 3 deflect the laser pulse to remove the next layer of material from the workpiece, until the material of each layer is removed, and finally a chamfer structure is formed on the workpiece.

[0085] In summary, this invention deflects laser pulses in collaboration with an acousto-optic deflection unit and a galvanometer system. It only requires the galvanometer system to scan along a single galvanometer scanning trajectory, and the laser pulses are synchronously deflected via AOD during the scanning process. Without the need for the galvanometer system to repeatedly jump, a complete annular laser pulse array region can be formed on the same layer at once to complete the layer-by-layer removal of material, ultimately forming a chamfer structure on the workpiece. This significantly shortens the processing time and greatly improves the chamfering efficiency.

[0086] It should be noted that the technical features in embodiments 1 to 3 above can be combined arbitrarily, and the resulting technical solutions all fall within the protection scope of this application. Furthermore, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0087] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chamfering laser processing method based on AOD and galvanometer synergy, characterized in that, Includes the following steps: Along the axial direction of the workpiece from bottom to top, the workpiece is divided into i layers in sequence, and at least one circular trajectory is set on the first layer, and concentric circular trajectories containing several circular trajectories are set on each layer from the second to the i layer. Determine the galvanometer scanning trajectory and galvanometer scanning speed when performing laser scanning on each layer; Determine the deflection amount when the acousto-optic deflection unit deflects the laser pulse; The deflection amount is corrected to obtain a corrected deflection amount; The laser is controlled to output laser pulses, and the galvanometer system is controlled to scan along the uppermost galvanometer scanning trajectory at the galvanometer scanning speed, so that the laser pulses pass through the acousto-optic deflection unit and the galvanometer system in sequence and then act on the uppermost layer of the workpiece to form a ring laser pulse array region on the uppermost layer. Control the laser focus to move downwards and repeat the above steps until the material of each layer is removed, finally forming a chamfered structure on the workpiece.

2. The chamfering laser processing method as described in claim 1, characterized in that, The difference in the number of circular trajectories between two adjacent layers is a fixed value, and the distance between two adjacent circular trajectories in the same layer is d. In addition, in the layer with concentric circular trajectories, the distance between two adjacent circular trajectories in each layer is d.

3. The chamfering laser processing method as described in claim 2, characterized in that, The radius r of the galvanometer scanning trajectory C mid =r min +(n-1)·d / 2, r min It represents the radius of the innermost circular trajectory on the current layer.

4. The chamfering laser processing method as described in claim 3, characterized in that, Scan speed Where f is the laser frequency and N is the total number of laser pulses that fall on all circular trajectories on the current layer after being deflected by the acousto-optic deflection unit and the galvanometer system when the current layer is scanned by laser.

5. The chamfering laser processing method as described in claim 4, characterized in that, Total number of laser pulses on all circular trajectories on the current layer , where Δθ is the angular interval between two adjacent laser pulses on each circular trajectory in the current layer.

6. The chamfering laser processing method as described in claim 1, characterized in that, The deflection direction of the acousto-optic deflection unit when deflecting a laser pulse ; Among them, (x n ,y n (x) represents the theoretical pulse position coordinates. n,m ,y n,m ) represents the theoretical pulse position coordinates (x n ,y n The coordinates of the deflected pulse after the laser pulse at point ) is deflected by the acousto-optic deflection unit.

7. The chamfering laser processing method as described in claim 6, characterized in that, The deflection pulse position coordinates are obtained through the following steps: Along the forward direction of the galvanometer scanning trajectory of the current layer, the laser pulses on the galvanometer scanning trajectory are divided into several pulse groups, and each pulse group contains laser pulses corresponding to the number of circular trajectories on the current layer. According to the output time of the laser pulse, each laser pulse in each pulse group is deflected to the corresponding circular trajectory one by one, and each laser pulse in the same pulse group is deflected to the circular trajectory that corresponds to it only, and each circular trajectory receives only one laser pulse. Based on the radius r of the innermost circular trajectory of the current layer min The distance d between two adjacent circular trajectories and the angular interval Δθ determine the position coordinates of the laser pulse deflected onto the current circular trajectory, which are used as the position coordinates of the deflection pulse.

8. The chamfering laser processing method as described in claim 6, characterized in that, Correction of deflection ; Where M, S, and R(φ) are the mirror transformation matrix, scaling matrix, and rotation matrix, respectively, and we have: ； ； ； in, Let be the deflection angle of the acousto-optic deflection unit's scanning area coordinate system relative to the galvanometer coordinate system, and s be the image scaling factor s; α and β are the Y-axis mirror coefficient and X-axis mirror coefficient, respectively, where α = 1 or -1, β = 1 or -1. When α = -1, it indicates that the acousto-optic deflection unit's scanning area coordinate system is deflected relative to its Y-axis mirror coordinate system. A When the axis is mirrored, β=-1 indicates that the coordinate system of the scanning area of ​​the acousto-optic deflection unit is mirrored about its X-axis. A The axis is mirrored.

9. The chamfering laser processing method as described in claim 6, characterized in that, The theoretical pulse position coordinates (x) n ,y n ), deflection pulse position coordinates (x) n,m ,y n,m The following constraints must be met: ； Among them, l aod This represents the side length of the scanning area of ​​the acousto-optic deflection unit in the square region.

10. A chamfering laser processing system, characterized in that, include: A laser, which is used to output laser pulses; An acousto-optic deflection unit is used to deflect each laser pulse according to the corrected deflection amount; A galvanometer system is used to deflect laser pulses so that they act on the surface of a workpiece to form a ring-shaped laser pulse array region on the workpiece surface, and then remove the material in the ring-shaped laser pulse array region by laser energy. And a control unit, which controls the laser focus to move downward after the previous layer of material is removed from the workpiece, so that the acousto-optic deflection unit and the galvanometer system deflect the laser pulse to remove the next layer of material from the workpiece, until the material of each layer is removed, and finally a chamfer structure is formed on the workpiece.

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