Accurate laser evaporation device for semiconductor substrate reflector

Abstract

The invention relates to the technical field of evaporation, in particular to a precise laser evaporation device for a semiconductor substrate reflector, which comprises a vacuumizing box, the inner wall of the vacuumizing box is fixedly connected with a first heat insulation spacing plate, the inner wall of the vacuumizing box is fixedly connected with a second heat insulation spacing plate, and the inner bottom surface of the vacuumizing box is fixedly connected with a servo motor. The output end of the servo motor is fixedly connected with a magnetic disc, a square groove is formed in the upper surface of the second heat insulation partition plate, and quartz glass is fixedly connected to the inner wall of the square groove. The inclination angles of the multiple annularly-arranged laser heads are aligned with the upper end of the substrate reflector, it is ensured that laser energy uniformly covers the surface of a substrate, the servo motor drives the magnetic disc and the iron disc to rotate synchronously, and the thickness deviation of a film layer is finally controlled within the extremely small range in combination with positioning of the substrate reflector through the annular blocking strips in the cylindrical grooves. And the core requirement of a semiconductor on high-precision evaporation is met.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of evaporation, and particularly relates to a laser precision evaporation device for a semiconductor substrate reflector. BACKGROUND

[0002] In the fields of optoelectronics, integrated circuits and laser communication, as a core optical element, the precision and quality of the surface functional film layer of the semiconductor substrate reflector directly determine the optical performance, stability and service life of the device.

[0003] The existing laser evaporation technology still has many deficiencies in actual application. In the evaporation process, the film layer thickness deviation often exceeds the precision requirement, and the film layer thickness deviation cannot meet the use standard of high-precision semiconductor elements. In addition, the micro-bubbles generated during the formation of the film layer during evaporation easily cause the film layer to be loose and have pinhole defects. In addition, the device has poor adaptability to semiconductor substrates of different sizes and specifications, and the equipment parameters need to be frequently adjusted when the substrate is replaced, which is complicated to operate and affects the production efficiency. Therefore, the laser precision evaporation device for the semiconductor substrate reflector solves the above problems. SUMMARY

[0004] The application aims to provide a laser precision evaporation device for a semiconductor substrate reflector to solve the problems in the background art.

[0005] The technical scheme of the application is as follows: a laser precision evaporation device for a semiconductor substrate reflector, comprising a vacuumizing box, a first heat insulation partition plate is fixedly connected to the inner wall of the vacuumizing box, a second heat insulation partition plate is fixedly connected to the inner wall of the vacuumizing box, a servo motor is fixedly connected to the inner bottom surface of the vacuumizing box, a magnetic disc is fixedly connected to the output end of the servo motor, a square groove is formed in the upper surface of the second heat insulation partition plate, quartz glass is fixedly connected to the inner wall of the square groove, a cross-shaped supporting rod is fixedly connected to the inner wall of the square groove, a group of supporting columns are fixedly connected to the upper surface of the second heat insulation partition plate, a plurality of ring-shaped laser heads are fixedly connected to the inner top surface of the vacuumizing box through a support, an iron disc is inserted into the upper surface of the first heat insulation partition plate, a heat insulation plate is fixedly connected to the upper end of the iron disc, a square block is fixedly connected to the upper surface of the heat insulation plate, a cylindrical groove is formed in the upper surface of the square block, an annular baffle is fixedly connected to the inner wall of the cylindrical groove, a large ceramic spring is fixedly connected to the inner bottom surface of the cylindrical groove, a piston is fixedly connected to the other end of the large ceramic spring, a substrate reflector is fixedly connected to the upper end of the piston, two symmetrical vibrators are arranged in the square block, and a plurality of ring-shaped strip-shaped communication grooves are formed in the circumferential side of the square block.

[0006] Preferably, a plurality of square chutes are arranged in the square block, the inner wall of each square chute is slidably provided with a square partition, the side wall of each square partition is provided with a large ventilation groove, the side wall of each square partition is provided with a small ventilation groove, a plurality of first connecting grooves are arranged in the square block, the upper surface of each square partition is fixedly connected with a first steel rope, and the upper surface of each square partition is fixedly connected with a first small ceramic spring.

[0007] Preferably, a plurality of annular first strip-shaped sliding grooves are arranged in the square block, the inner wall of each first strip-shaped sliding groove is slidably provided with a strip-shaped sliding block, the side wall of each strip-shaped sliding block is fixedly connected with a moving rod, the side wall of each moving rod is fixedly connected with a group of first strip-shaped stop blocks, a medium-shaped ceramic spring is arranged in each first strip-shaped sliding groove, one end of each moving rod is sleeved with a sleeve rod, a strip-shaped moving groove is arranged in each sleeve rod, and a second small ceramic spring is arranged in each strip-shaped moving groove.

[0008] Preferably, a second strip-shaped sliding groove is arranged in each sleeve rod, a second strip-shaped stop block is slidably arranged in each second strip-shaped sliding groove, a second connecting groove is arranged in each sleeve rod, the upper surface of each second strip-shaped stop block is fixedly connected with a second steel rope, the upper surface of each second strip-shaped stop block is fixedly connected with a first micro ceramic spring, a plurality of extrusion blocks are arranged in the cylindrical groove, the side wall of each extrusion block is fixedly connected with a stop piece, a strip-shaped limiting sliding groove is arranged in each sleeve rod, a limiting column is fixedly connected in each strip-shaped limiting sliding groove, a limiting plate is sleeved on the surface of each limiting column, and a second micro ceramic spring is sleeved on the surface of each limiting column.

[0009] Preferably, the upper end of the magnetic disc is matched with the lower end of the iron disc, the square groove is in communication with the lower surface of the second heat insulation partition, the lower surface of the quartz glass is matched with the upper surface of the cross-shaped supporting rod, the upper ends of a group of supporting columns are fixedly connected with the inner top surface of the vacuumizing box, the inclination angles of a plurality of laser heads are aligned with the upper end of the base mirror, the surface of the piston is matched with the inner wall of the cylindrical groove, the outer diameter of the base mirror is the same as the inner diameter of the annular stop strip, the height of the base mirror is equal to the height of the annular stop strip, the amplitudes of two vibrators are vacuumizing box-laser head μm, the frequencies of the vibrators are strip-shaped communication groove-first micro ceramic spring kHz, and a plurality of strip-shaped communication grooves are in communication with the inner wall of the cylindrical groove.

[0010] Preferably, each of the square sliding grooves is communicated with a strip-shaped communication groove, the initial position of each of the square partitions is located in the lower half of the square sliding groove, the initial position of each of the large ventilation grooves is in a closed state in the square sliding groove, the initial position of each of the tiny ventilation grooves is in a communicated state in the strip-shaped communication groove, each of the first connecting grooves is communicated with the square sliding groove and the first strip-shaped sliding groove, respectively, the other end of each of the first steel wires extends into the first strip-shaped sliding groove through the first connecting groove and is fixedly connected with the surface of the moving rod, each of the first small ceramic springs is sleeved on the surface of the first steel wire, and the other end of each of the first small ceramic springs is fixedly connected with the inner wall of the square sliding groove, and a group of ventilation channels communicated with the inner wall of the cylindrical groove are formed in each of the first strip-shaped sliding grooves.

[0011] Preferably, the surface of each of the first strip-shaped stop blocks is fitted with the inner wall of the strip-shaped moving groove, one end of each of the medium ceramic springs is fixedly connected with the side wall of the strip-shaped sliding block, the other end of each of the medium ceramic springs is fixedly connected with the inner wall of the first strip-shaped sliding groove, each of the sleeve rods extends into the cylindrical groove through the inner wall of the first strip-shaped sliding groove, the lower surface of each of the sleeve rods is in the same horizontal plane as the upper end of the annular stop strip and the base reflector, one end of each of the second small ceramic springs is fixedly connected with one end of the moving rod, and the other end of each of the second small ceramic springs is fixedly connected with the inner wall of the sleeve rod.

[0012] Preferably, the initial position of each of the second strip-shaped stop blocks is located in the lower half of the second strip-shaped sliding groove, the side wall of each of the second strip-shaped stop blocks interferes with the side wall of the first strip-shaped stop block, each of the second connecting grooves is communicated with the second strip-shaped sliding groove and the strip-shaped limiting sliding groove, respectively, the other end of each of the second steel wires extends into the strip-shaped limiting sliding groove through the second connecting groove and is fixedly connected with the surface of the extrusion block, the other end of each of the first tiny ceramic springs is fixedly connected with the inner wall of the second strip-shaped sliding groove, each of the extrusion blocks extends into the strip-shaped limiting sliding groove through the surface of the sleeve rod and the inner wall of the strip-shaped limiting sliding groove and extends into the strip-shaped moving groove, the surface of each of the limiting plates is fixedly connected with the surface of the extrusion block, one end of each of the second tiny ceramic springs abuts against the surface of the limiting plate, and the other end of each of the second tiny ceramic springs abuts against the inner wall of the strip-shaped limiting sliding groove.

[0013] The laser precision evaporation device for a semiconductor base reflector is improved in the application, and compared with the prior art, has the following improvements and advantages: One: the application realizes accurate energy distribution through the annular laser head and the stable rotating mechanism, the inclination angles of the multiple annular laser heads are aligned with the upper end of the substrate mirror, the laser energy is uniformly covered on the substrate surface, the servo motor drives the magnetic disk and the iron disk to rotate synchronously, the positioning of the substrate mirror is combined with the annular file in the cylindrical groove, and finally the film layer thickness deviation is controlled in a small range, so that the core demand of the semiconductor on high-precision evaporation is met.

[0014] Second: the application removes bubbles through micro-vibration, optimizes the film layer quality, the vibrator amplitude and frequency in the square block adapt to the evaporation scene to produce micro-vibration, assist to remove the small bubbles generated in the film layer forming process, and avoid pinhole defects.

[0015] Third: the application is flexibly adapted to the structure, the multi-stage adjusting structure of the device, such as the cooperation of the extrusion block and the second micro-ceramic spring, the sliding connection of the sleeve rod and the moving rod, can adapt to different sizes of semiconductors, the micro-adjustment of the semiconductor clamping force is realized by adjusting the position of the extrusion block, the quick matching connection of the iron disk and the magnetic disk simplifies the substrate loading and unloading process, improves the batch production efficiency, and enhances the adaptability of the device to the processing demand of different semiconductor substrate mirrors. BRIEF DESCRIPTION OF DRAWINGS

[0016] The application will be further explained in combination with the drawings and embodiments: Figure 1 is a front view structure schematic diagram of the application; Figure 2 is a partial internal display schematic diagram of the application; Figure 3 is a partial internal display schematic diagram of the application; Figure 4 is a partial sectional view schematic diagram of the application; Figure 5 is Figure 4 the enlarged structure schematic diagram of A in the figure; Figure 6 is Figure 4 the enlarged structure schematic diagram of B in the figure Figure 7 is Figure 6 the enlarged structure schematic diagram of B1 in the figure Figure 8 is Figure 6 the enlarged structure schematic diagram of B2 in the figure Explanation of reference signs: 1, vacuum box; 2, first heat insulation panel; 3, second heat insulation panel; 4, servo motor; 5, magnetic disc; 6, square groove; 7, quartz glass; 8, cross support rod; 9, support column; 10, laser head; 11, iron disc; 12, heat insulation plate; 13, square block; 14, cylindrical groove; 15, annular stop; 16, large ceramic spring; 17, piston; 18, base mirror; 19, vibrator; 20, strip-shaped communication groove; 21, square sliding groove; 22, square partition; 23, large air passage; 24, micro air passage; 25, first connecting groove; 26, first steel rope; 27, first small ceramic spring; 28, first strip-shaped sliding groove; 29, strip-shaped sliding block; 30, moving rod; 31, first strip-shaped stop; 32, medium ceramic spring; 33, sleeve rod; 34, strip-shaped moving groove; 35, second small ceramic spring; 36, second strip-shaped sliding groove; 37, second strip-shaped stop; 38, second connecting groove; 39, second steel rope; 40, first micro ceramic spring; 41, extrusion block; 42, stop piece; 43, strip-shaped limiting sliding groove; 44, limiting column; 45, limiting plate; 46, second micro ceramic spring. DETAILED DESCRIPTION

[0017] The present application will be described in detail below, and the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0018] The present application provides a laser precision evaporation device for semiconductor base mirror by improvement. The technical solutions of the present application are as follows: As Figure 1 - Figure 8As shown, a kind of laser precision evaporation device of semiconductor substrate mirror, including vacuum box 1, the inner wall of vacuum box 1 is fixedly connected with first heat insulation interplate 2, the inner wall of vacuum box 1 is fixedly connected with second heat insulation interplate 3, the inside bottom of vacuum box 1 is fixedly connected with servo motor 4, the output of servo motor 4 is fixedly connected with magnetic disk 5, the upper surface of second heat insulation interplate 3 is equipped with square groove 6, the inner wall of square groove 6 is fixedly connected with quartz glass 7, the inner wall of square groove 6 is fixedly connected with cross support rod 8, the upper surface of second heat insulation interplate 3 is fixedly connected with a group of support columns 9, the inside top of vacuum box 1 is fixedly connected with multiple annular laser heads 10 by support, the upper surface of first heat insulation interplate 2 is inserted with iron dish 11, the upper end of iron dish 11 is fixedly connected with heat insulation plate 12, the upper surface of heat insulation plate 12 is fixedly connected with square block 13, the upper surface of square block 13 is equipped with cylindrical groove 14, the inner wall of cylindrical groove 14 is fixedly connected with annular baffle 15, the inside bottom of cylindrical groove 14 is fixedly connected with large ceramic spring 16, the other end of large ceramic spring 16 is fixedly connected with piston 17, the upper end of piston 17 is fixedly connected with substrate mirror 18, two symmetrical vibrators 19 are arranged in square block 13, and multiple annular strip communication grooves 20 are respectively formed in the circumferential side of square block 13.

[0019] Further, a plurality of square sliding grooves 21 are formed in square block 13, the inner wall of each square sliding groove 21 is slidably provided with square partition plate 22, the side wall of each square partition plate 22 is equipped with large air passage 23, the side wall of each square partition plate 22 is equipped with micro air passage 24, a plurality of first connecting grooves 25 are formed in square block 13, the upper surface of each square partition plate 22 is fixedly connected with first steel wire 26, the upper surface of each square partition plate 22 is fixedly connected with first small ceramic spring 27, in the initial state, micro air passage 24 is communicated and large air passage 23 is closed, so that trace exhaust can be realized in the equipment starting stage, the impact of sudden drop of vacuum environment on internal precision components is avoided, and the fine adjustment requirement in low vacuum stage is met.

[0020] Further, a plurality of annular first strip sliding grooves 28 are formed in square block 13, the inner wall of each first strip sliding groove 28 is slidably provided with strip sliding block 29, the side wall of each strip sliding block 29 is fixedly connected with moving rod 30, the side wall of each moving rod 30 is fixedly connected with a group of first strip stoppers 31, each first strip sliding groove 28 is provided with medium ceramic spring 32, one end of each moving rod 30 is sleeved with sleeve rod 33, each sleeve rod 33 is equipped with strip moving groove 34, and second small ceramic spring 35 is arranged in each strip moving groove 34, through the design of annular first strip sliding groove 28, multiple strip sliding blocks 29 and moving rods 30 are uniformly arranged in circumference, uniform force can be formed on the core components in subsequent cylindrical groove 14, and clamping relaxation is avoided.

[0021] Further, the second strip-shaped sliding slot 36 is arranged in each sleeve rod 33, the second strip-shaped block 37 is slidably arranged in each second strip-shaped sliding slot 36, the second connecting slot 38 is arranged in each sleeve rod 33, the second steel wire 39 is fixedly connected to the upper surface of each second strip-shaped block 37, the first micro ceramic spring 40 is fixedly connected to the upper surface of each second strip-shaped block 37, the extrusion block 41 is arranged in the cylindrical groove 14, the side wall of each extrusion block 41 is fixedly connected with the baffle 42, the strip-shaped limiting sliding slot 43 is arranged in each sleeve rod 33, the limiting column 44 is fixedly connected in each strip-shaped limiting sliding slot 43, the limiting plate 45 is sleeved on the surface of each limiting column 44, the second micro ceramic spring 46 is sleeved on the surface of each limiting column 44, the mechanical interlocking is formed by the mutual interference of the second strip-shaped block 37 and the first strip-shaped block 31, and the movable rod 30 can be prevented from being misoperated under the non-expected working condition.

[0022] Further, the upper end of the magnetic disc 5 is matched with the lower end of the iron disc 11, the square groove 6 is communicated with the lower surface of the second heat insulation plate 3, the lower surface of the quartz glass 7 is fitted with the upper surface of the cross support rod 8, the upper end of the group of support columns 9 is fixedly connected with the inner top surface of the vacuumizing box 1, the inclination angle of the plurality of laser heads 10 is aligned with the upper end of the base reflecting mirror 18, the surface of the piston 17 is fitted with the inner wall of the cylindrical groove 14, the outer diameter of the base reflecting mirror 18 is same as the inner diameter of the annular blocking strip 15, the height of the base reflecting mirror 18 is equal to the height of the annular blocking strip 15, the amplitude of the two vibrators 19 is the vacuumizing box 1-laser head 10 μm, the frequency is the strip-shaped communication groove 20-first micro ceramic spring 40 kHz, the plurality of strip-shaped communication grooves 20 are communicated with the inner wall of the cylindrical groove 14, the reliable magnetic attraction positioning or power transmission can be realized through the matching of the magnetic disc 5 and the iron disc 11, the transmission error caused by loose connection is avoided, and the stable power transmission of the equipment is ensured.

[0023] Further, each square chute 21 is respectively connected with the strip-shaped communication groove 20, the initial position of each square baffle 22 is located in the lower half of the square chute 21, the initial position of each large ventilation groove 23 is in a closed state in the square chute 21, the initial position of each micro ventilation groove 24 is in a communication state in the strip-shaped communication groove 20, each first connecting groove 25 is respectively connected with the square chute 21 and the first strip-shaped chute 28, the other end of each first steel wire 26 extends into the first strip-shaped chute 28 and is fixedly connected with the surface of the moving rod 30 through the first connecting groove 25, each first small ceramic spring 27 is sleeved on the surface of the first steel wire 26, and the other end of each first small ceramic spring 27 is fixedly connected with the inner wall of the square chute 21, a group of ventilation channels connected with the inner wall of the cylindrical groove 14 are arranged in each first strip-shaped chute 28, the initial position of the square baffle 22 is located in the lower half of the chute, the large ventilation groove 23 is closed, and the micro ventilation groove 24 is communicated, so that the initial state can realize a trace exhaust mode when the equipment starts, impact on internal components caused by sudden pressure drop during initial vacuumization can be avoided, and fine adjustment of exhaust volume during a low vacuum stage can be met, thereby laying a foundation for stable establishment of a subsequent high vacuum environment.

[0024] Further, the surface of each group of first strip-shaped stoppers 31 is attached to the inner wall of the strip-shaped moving groove 34, one end of each medium-shaped ceramic spring 32 is fixedly connected with the side wall of the strip-shaped sliding block 29, the other end of each medium-shaped ceramic spring 32 is fixedly connected with the inner wall of the first strip-shaped chute 28, each sleeve rod 33 penetrates through the inner wall of the first strip-shaped chute 28 and extends into the cylindrical groove 14, the lower surface of each sleeve rod 33 is at the same level as the upper end of the annular stop bar 15 and the base reflecting mirror 18, one end of each second small ceramic spring 35 is fixedly connected with one end of the moving rod 30, and the other end of each second small ceramic spring 35 is fixedly connected with the inner wall of the sleeve rod 33, the fixed connection mode of the two ends of the medium-shaped ceramic spring 32 can provide the strip-shaped sliding block 29 with continuous and constant reset elastic force, the moving rod 30 can be accurately returned to the initial position without external force, part jamming or reset deviation can be avoided, and the risk of equipment failure can be reduced.

[0025] Further, the initial position of each second bar-shaped stop block 37 is located in the lower half of the second bar-shaped sliding groove 36, the side wall of each second bar-shaped stop block 37 interferes with the side wall of the first bar-shaped stop block 31, each second connecting groove 38 is in communication with the second bar-shaped sliding groove 36 and the bar-shaped limiting sliding groove 43 respectively, the other end of each second steel wire 39 passes through the second connecting groove 38 and extends into the bar-shaped limiting sliding groove 43 and is fixedly connected with the surface of the extrusion block 41, the other end of each first micro ceramic spring 40 is fixedly connected with the inner wall of the second bar-shaped sliding groove 36, each extrusion block 41 penetrates the surface of the sleeve rod 33, extends to the inner wall of the bar-shaped limiting sliding groove 43 and extends into the bar-shaped moving groove 34, the surface of each limiting plate 45 is fixedly connected with the surface of the extrusion block 41, one end of each second micro ceramic spring 46 abuts against the surface of the limiting plate 45, and the other end of each second micro ceramic spring 46 abuts against the inner wall of the bar-shaped limiting sliding groove 43, the guiding effect of the second connecting groove 38 on the second steel wire 39 ensures the smoothness of the linkage between the extrusion block 41 and the second bar-shaped stop block 37, reduces the frictional loss of the steel wire and the groove wall, and improves the precision and stability of the linkage control.

[0026] Working principle: in use first open the sealed door, then put the semiconductor on the base mirror 18, then close the sealed door, at this time start the vacuum box 1 to vacuum, then the gas extraction pressure will be through the air passage to the strip-shaped slider 29 to the direction of the cylindrical groove 14, then the strip-shaped slider 29 will drive the moving rod 30 to move outward, then the second strip-shaped block 37 will resist the first strip-shaped block 31, so that the moving rod 30 drives the sleeve rod 33 to move, then when it moves to contact the semiconductor, the baffle 42 will resist the edge of the semiconductor, then the semiconductor will be placed in position and clamped, then the baffle 42 will move backward due to extrusion again, then the baffle 42 drives the extrusion block 41 to move into the strip-shaped moving groove 34, when moving, the extrusion block 41 drives the second steel wire 39 to pull the second strip-shaped block 37 into the second strip-shaped groove 36, then the restraint on the first strip-shaped block 31 is released, at this time the sleeve rod 33 is sleeved into one end of the moving rod 30, then the second small ceramic spring 35 will resist the strip-shaped moving groove 34 in the sleeve rod 33 to control the length of the sleeve rod 33 and the moving rod 30 in real time, to automatically fit and clamp the semiconductor of different sizes, when the strip-shaped slider 29 moves, it will drive the first steel wire 26 to pull the square baffle 22 to move upward into the square sliding groove 21, then the large air passage 23 will be connected with the strip-shaped communication groove 20, at this time the suction force will greatly extract the air below the piston 17 in the cylindrical groove 14, then the piston 17 will move downward due to suction and compression spring, then the semiconductor will be suspended and contact the empty area, then start the laser head 10, servo motor 4, vibrator 19, the vibrator 19 starts to vibrate through the accessories to the semiconductor, then the servo motor 4 drives the magnetic disk 5 to rotate slowly, then the magnetic disk 5 drives the iron disk 11 to rotate through suction, then the iron disk 11 drives the heat insulation plate 12 and the square block 13 to rotate, the square block 13 drives the accessories inside to rotate and the semiconductor, then the laser will pass through the quartz glass 7 to irradiate on the base mirror 18, then divide the laser into many, at the same time of laser irradiation, the evaporated particle elements will be guided to the semiconductor around for evaporation.

[0027] The above description enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser precision evaporation device for semiconductor substrate reflectors, comprising a vacuum chamber (1), characterized in that: The inner wall of the vacuum chamber (1) is fixedly connected to a first heat insulation plate (2), and the inner wall of the vacuum chamber (1) is fixedly connected to a second heat insulation plate (3). The bottom surface of the vacuum chamber (1) is fixedly connected to a servo motor (4), and the output end of the servo motor (4) is fixedly connected to a disk (5). A square groove (6) is opened on the upper surface of the second heat insulation plate (3). Quartz glass (7) is fixedly connected to the inner wall of the square groove (6). A cross support rod (8) is fixedly connected to the inner wall of the square groove (6). A set of support columns (9) is fixedly connected to the upper surface of the second heat insulation plate (3). Multiple circularly arranged laser heads (10) are fixedly connected to the top surface of the vacuum chamber (1) through a bracket. The first heat insulation plate (2) An iron plate (11) is inserted into the upper surface of the iron plate (11). A heat insulation plate (12) is fixedly connected to the upper end of the iron plate (11). A square block (13) is fixedly connected to the upper surface of the heat insulation plate (12). A cylindrical groove (14) is opened on the upper surface of the square block (13). An annular baffle (15) is fixedly connected to the inner wall of the cylindrical groove (14). A large ceramic spring (16) is fixedly connected to the inner bottom surface of the cylindrical groove (14). A piston (17) is fixedly connected to the other end of the large ceramic spring (16). A base reflector (18) is fixedly connected to the upper end of the piston (17). Two symmetrical vibrators (19) are arranged inside the square block (13). Multiple annular strip-shaped connecting grooves (20) are opened on the periphery of the square block (13).

2. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 1, characterized in that: The square block (13) has multiple square grooves (21) inside. Each square groove (21) has a square partition (22) slidably installed on its inner wall. Each square partition (22) has a large ventilation groove (23) on its side wall and a small ventilation groove (24) on its side wall. The square block (13) has multiple first connecting grooves (25). Each square partition (22) has a first steel rope (26) fixedly connected to its upper surface and a first small ceramic spring (27) fixedly connected to its upper surface.

3. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 1, characterized in that: The square block (13) has multiple annular first strip grooves (28) inside. Each first strip groove (28) has a strip slider (29) slidably mounted on its inner wall. Each strip slider (29) has a moving rod (30) fixedly connected to its side wall. Each moving rod (30) has a set of first strip blocks (31) fixedly connected to its side wall. Each first strip groove (28) has a medium-sized ceramic spring (32). Each moving rod (30) has a sleeve rod (33) fitted at one end. Each sleeve rod (33) has a strip moving groove (34) inside. Each strip moving groove (34) has a second small ceramic spring (35) inside.

4. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 3, characterized in that: Each of the sleeve rods (33) is provided with a second strip groove (36), and a second strip block (37) is slidably arranged in each of the second strip grooves (36). Each of the sleeve rods (33) is provided with a second connecting groove (38). A second steel rope (39) is fixedly connected to the upper surface of each of the second strip block (37). A first miniature ceramic spring (40) is fixedly connected to the upper surface of each of the second strip block (37). A plurality of extrusion blocks (41) are provided in the cylindrical groove (14). A baffle plate (42) is fixedly connected to the side wall of each extrusion block (41). Each of the sleeve rods (33) is provided with a strip-shaped limiting groove (43). A limiting post (44) is fixedly connected in each of the strip-shaped limiting grooves (43). A limiting plate (45) is sleeved on the surface of each limiting post (44). A second miniature ceramic spring (46) is sleeved on the surface of each limiting post (44).

5. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 1, characterized in that: The upper end of the disk (5) matches the lower end of the iron disk (11), the square groove (6) is connected to the lower surface of the second heat insulation plate (3), the lower surface of the quartz glass (7) is in contact with the upper surface of the cross support rod (8), the upper end of a set of support columns (9) is fixedly connected to the inner top surface of the vacuum box (1), the tilt angle of the multiple laser heads (10) is aligned with the upper end of the base reflector (18), and the surface of the piston (17) is aligned with the cylindrical groove. The inner wall of (14) is attached to each other. The outer diameter of the base reflector (18) is the same as the inner diameter of the annular baffle (15). The height of the base reflector (18) is equal to the height of the annular baffle (15). The amplitude of the two vibrators (19) is from vacuum box (1) to laser head (10) μm and the frequency is from strip-shaped connecting groove (20) to first micro ceramic spring (40) kHz. The multiple strip-shaped connecting grooves (20) are all connected to the inner wall of the cylindrical groove (14).

6. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 2, characterized in that: Each of the square sluices (21) is connected to the strip-shaped connecting groove (20). The initial position of each square partition (22) is located in the lower half of the square sluice (21). The initial position of each large ventilation groove (23) is in a closed state within the square sluice (21). The initial position of each small ventilation groove (24) is in a connected state within the strip-shaped connecting groove (20). Each of the first connecting grooves (25) is connected to the square sluice (21) and the first strip-shaped sluice (28) respectively. The other end of each of the first steel ropes (26) passes through the first connecting groove (25) and extends into the first strip groove (28) and is fixedly connected to the surface of the moving rod (30). Each of the first small ceramic springs (27) is sleeved on the surface of the first steel rope (26). The other end of each of the first small ceramic springs (27) is fixedly connected to the inner wall of the square groove (21). Each of the first strip grooves (28) has a set of ventilation channels connected to the inner wall of the cylindrical groove (14).

7. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 3, characterized in that: The surface of each group of first strip-shaped blocks (31) is in contact with the inner wall of the strip-shaped moving groove (34). One end of each medium-sized ceramic spring (32) is fixedly connected to the side wall of the strip-shaped slider (29). The other end of each medium-sized ceramic spring (32) is fixedly connected to the inner wall of the first strip-shaped sliding groove (28). Each sleeve rod (33) penetrates the inner wall of the first strip-shaped sliding groove (28) and extends into the cylindrical groove (14). The lower surface of each sleeve rod (33) is at the same level as the upper end of the annular stop bar (15) and the base reflector (18). One end of each second small ceramic spring (35) is fixedly connected to one end of the moving rod (30). The other end of each second small ceramic spring (35) is fixedly connected to the inner wall of the sleeve rod (33).

8. The laser precision evaporation apparatus for a semiconductor substrate reflector according to claim 4, characterized in that: The initial position of each second strip-shaped stop (37) is located in the lower half of the second strip-shaped groove (36). The sidewall of each second strip-shaped stop (37) interferes with the sidewall of the first strip-shaped stop (31). Each second connecting groove (38) is connected to the second strip-shaped groove (36) and the strip-shaped limiting groove (43) respectively. The other end of each second steel rope (39) passes through the second connecting groove (38) and extends into the strip-shaped limiting groove (43) to be fixedly connected to the surface of the extrusion block (41). Each first micro ceramic The other end of each of the two springs (40) is fixedly connected to the inner wall of the second strip groove (36). Each of the extrusion blocks (41) penetrates the surface of the sleeve rod (33) and the inner wall of the strip limiting groove (43) and extends into the strip moving groove (34). The surface of each limiting plate (45) is fixedly connected to the surface of the extrusion block (41). One end of each of the second micro ceramic springs (46) abuts against the surface of the limiting plate (45), and the other end of each of the second micro ceramic springs (46) abuts against the inner wall of the strip limiting groove (43).

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