Method and device for acquiring grinding and polishing amount of metallographic specimen
By forming regular concave structures on metallographic samples and measuring dimensional changes using a microscope, the problem of low accuracy in measuring grinding and polishing amount was solved, enabling precise measurement of grinding and polishing amount, simplifying the measurement process and reducing costs.
Patent Information
- Application Number
- CN202511348926.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-19
- Publication Date
- 2025-12-23
AI Technical Summary
In the existing technology, the measurement of the polishing amount of metallographic specimens is affected by the accuracy of sample preparation and the accuracy of measuring tools, making it difficult to accurately measure the polishing amount of metallographic specimens before and after polishing, especially in small areas where the measurement accuracy is not high.
By forming a regularly shaped concave structure in the area to be measured on the metallographic sample, a hard indenter is used to press in and measure the size of the first concave structure. Then, a grinding and polishing process is performed to form a second concave structure, and the size of the second concave structure is measured again. The grinding and polishing amount is obtained using a metallographic microscope measurement system, thus avoiding dependence on the accuracy of sample preparation and vernier calipers.
It improves the measurement accuracy of polishing amount, simplifies the measurement process, reduces measurement costs, and enables accurate acquisition of polishing amount in small areas.
Smart Images
Figure CN121185705A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of metallographic specimen detection of metal materials, and particularly relates to a method and device for obtaining the polishing amount of a metallographic specimen. BACKGROUND
[0002] The key procedure of metallographic structure analysis of metal materials is preparation of a metallographic specimen, and the preparation process of the metallographic specimen generally includes the following main steps: cutting of the specimen, rough grinding, fine grinding, polishing and etching.
[0003] In the fine grinding and polishing process, the polishing amount of the metallographic specimen is very small and can be ignored. However, in special inspection requirements, people will pay attention to the specific value of the polishing amount. Generally, people will measure the size of the metallographic specimen before and after polishing by using a vernier caliper or a micrometer, and then the polishing amount can be obtained by calculating the difference between the two measurement values.
[0004] The above measurement method is greatly affected by the sample preparation accuracy and measurement accuracy, so it is difficult to accurately measure the polishing amount of the metallographic specimen before and after polishing. SUMMARY
[0005] The embodiments of the present application provide a method and device for obtaining the polishing amount of a metallographic specimen, so as to accurately obtain the polishing amount of a small area of the polishing surface of the metallographic specimen.
[0006] In a first aspect, the embodiments of the present application provide a method for obtaining the polishing amount of a metallographic specimen, comprising:
[0007] a hard indenter with a regular shape is pressed into a to-be-measured area of the metallographic specimen, so as to form a first recess structure with a regular shape in the to-be-measured area;
[0008] a first size of the first recess structure along a first straight line on the surface of the to-be-measured area is measured;
[0009] the to-be-measured area of the metallographic specimen is polished to form a second recess structure;
[0010] a second size of the second recess structure along a second straight line on the surface of the to-be-measured area is measured; the first straight line and the second straight line are both in a first plane perpendicular to the surface of the to-be-measured area;
[0011] the polishing amount of the metallographic specimen in a first direction perpendicular to the surface of the to-be-measured area is obtained according to the first size and the second size.
[0012] Secondly, embodiments of the present invention provide a device for obtaining the polishing amount of a metallographic sample, applicable to the method for obtaining the polishing amount of a metallographic sample provided in any embodiment of the present invention, comprising: an indentation pressing mechanism, a hard indenter, a measuring system, a polishing mechanism, and a controller; the controller is electrically connected to the indentation pressing mechanism, the measuring system, and the polishing mechanism respectively;
[0013] The controller controls the indentation indentation mechanism to press a hard indenter with a regular shape into the area to be measured of the metallographic sample, so that the area to be measured forms a first indentation structure with a regular shape.
[0014] The measurement system is controlled to measure the first dimension of the first recessed structure along a first straight line on the surface of the area to be measured;
[0015] The grinding and polishing mechanism is controlled to grind and polish the area to be measured of the metallographic sample to form a second concave structure;
[0016] The measurement system is controlled to measure the second dimension of the second recessed structure along a second straight line on the surface of the area to be measured; both the first straight line and the second straight line are located in a first plane perpendicular to the surface of the area to be measured;
[0017] The controller is used to obtain the amount of polishing of the metallographic sample in a first direction perpendicular to the surface of the area to be measured, based on the first dimension and the second dimension.
[0018] In this invention, a regularly shaped hard indenter is pressed into the measurement area of a metallographic sample to form a first regularly shaped recessed structure. The first dimension of the first recessed structure along a first straight line on the surface of the measurement area is measured. Afterwards, the metallographic sample undergoes polishing, resulting in a second recessed structure. The first dimension of the second recessed structure along a second straight line on the surface of the measurement area is then measured. It is important to note that both the first and second straight lines belong to a first plane, which is perpendicular to the surface of the measurement area. The difference between the first and second dimensions reflects the amount of polishing in the metallographic sample in a first direction perpendicular to the surface of the measurement area. This invention obtains the polishing amount by setting a recessed structure and observing and measuring the dimensional changes of the recessed structure before and after polishing. This method of measuring the polishing amount is not affected by the sample preparation accuracy of the metallographic sample or the detection accuracy of the vernier caliper, further improving the measurement accuracy of the polishing amount. Furthermore, the measurement process of this invention is simple and effectively saves measurement costs. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the metallographic specimens before and after grinding and polishing, provided in an embodiment of the present invention.
[0020] Figure 2A schematic flowchart illustrating a method for obtaining the polishing amount of a metallographic sample according to an embodiment of the present invention;
[0021] Figure 3 This is a schematic diagram of the structure of a hard indenter provided in an embodiment of the present invention;
[0022] Figure 4 This is a schematic diagram of another hard indenter provided in an embodiment of the present invention;
[0023] Figure 5 This is a schematic diagram of a hard indenter pressing into a metallographic sample according to an embodiment of the present invention;
[0024] Figure 6 A schematic flowchart of another method for obtaining the polishing amount of a metallographic sample provided in an embodiment of the present invention;
[0025] Figure 7 This is a schematic diagram showing the dimensions of a conical recessed structure provided in an embodiment of the present invention;
[0026] Figure 8 This is a schematic diagram showing the dimensions of a multi-faceted pyramidal recessed structure provided in an embodiment of the present invention;
[0027] Figure 9 This is a schematic diagram of another structure for pressing a metallographic sample with a hard indenter, provided in an embodiment of the present invention;
[0028] Figure 10 This is a schematic diagram of a device for obtaining the polishing amount of a metallographic sample, provided in an embodiment of the present invention. Detailed Implementation
[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0030] The preparation process of metallographic specimens generally includes several main steps: specimen cutting, rough grinding, fine grinding, polishing, and etching. After grinding and polishing, the amount of material removed is very small. For example... Figure 1 As shown, Figure 1This is a schematic diagram of the metallographic specimens before and after polishing according to an embodiment of the present invention. The solid line represents the surface of the metallographic specimen before polishing, and the dashed line represents the surface of the metallographic specimen after polishing. The difference in height between the two surfaces is the polishing amount. Existing technology measures this polishing amount using measuring tools such as vernier calipers or micrometers. However, due to the precision of metallographic specimen preparation and the accuracy of the measuring tools, the accuracy of the polishing amount measurement is not high, especially for the small areas of the polished surface of the metallographic specimen, which are even more difficult to adjust.
[0031] To address the above problems, this invention provides a method for obtaining the polishing amount of a metallographic sample. Figure 2 This is a flowchart illustrating a method for obtaining the polishing amount of a metallographic sample according to an embodiment of the present invention, as shown below. Figure 2 As shown, the method in this embodiment includes the following steps:
[0032] Step S101: Press a hard indenter with a regular shape into the area to be measured of the metallographic sample so that the area to be measured forms a first concave structure with a regular shape.
[0033] In this embodiment, to accurately calculate the polishing amount in minute areas of the metallographic sample's polished surface, an indentation is formed on the surface of the sample, and the polishing amount in the minute area is obtained based on the change in the indentation before and after polishing. This embodiment forms an indentation by pressing a hard indenter into the area to be measured on the metallographic sample. Specifically, a first recessed structure with a shape consistent with the hard indenter is formed in the area to be measured. The hardness of the hard indenter is much higher than the hardness of the metallographic sample; for example, the hard indenter can be a cemented carbide indenter. The area to be measured is at least a portion of the surface to be polished. In this embodiment, the first recessed structure is formed in the area to be measured, thereby calculating the polishing amount of the entire surface. Furthermore, to facilitate obtaining the degree of change in the indentation, this embodiment needs to form a first recessed structure with a regular shape, which facilitates subsequent accurate calculation of the polishing amount.
[0034] Figure 3 This is a schematic diagram of a hard indenter provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of another hard indenter provided in an embodiment of the present invention. Optionally, the regular-shaped hard indenter 11 can be... Figure 3 The conical or Figure 4 The polygonal pyramid shown Figure 4 The following illustration uses a hard indenter 11 made of a four-sided pyramid as an example. This embodiment uses a hard indenter 11 with a pointed tip to facilitate the formation of indentations.
[0035] Step S102: Measure the first dimension of the first recessed structure along the first straight line on the surface of the area to be measured.
[0036] Figure 5 This is a schematic diagram of a hard indenter pressing into a metallographic sample, provided in an embodiment of the present invention. Figure 5 The following diagram illustrates a conical hard indenter 11. When the hard indenter 11 is pressed into the surface of the area to be measured on the metallographic sample 12, a first recessed structure 121 is formed. The opening length of the first recessed structure 121 along the first straight line L1, i.e., the first dimension d1, is measured. The first straight line is a straight line on the surface of the area to be measured. Optionally, the first dimension d1 can be measured using the metallographic microscope's own measurement system. Thus, while observing the first recessed structure 121 with the metallographic microscope, the first dimension d1 can be measured using the metallographic microscope's own measurement system. This eliminates the need for a separate measurement system, simplifies the measurement process, and reduces the size of the device for obtaining the polishing amount of the metallographic sample.
[0037] Step S103: Polish the area to be measured of the metallographic sample to form a second concave structure.
[0038] After the first recessed structure 121 is formed, the surface of the metallographic sample 12 to be polished needs to be ground and polished. The area to be measured can be a part of the surface to be polished. The surface layer of the first recessed structure 121 will then be ground away, such as... Figure 5 As shown, the polishing amount is Then the first recessed structure 121 forms the second recessed structure 122.
[0039] Optionally, the grinding and polishing process may include at least one of the following: rough grinding, fine grinding, and polishing. Because the metallographic sample preparation process includes grinding and polishing processes such as rough grinding, fine grinding, and polishing, the grinding and polishing amount of the micro-area in this embodiment can be measured separately for the rough grinding process, or separately for the fine grinding process, or separately for the polishing process. Alternatively, the grinding and polishing amount formed by the two steps of rough grinding and fine grinding, or the grinding and polishing amount formed by the fine grinding and polishing processes, or even the grinding and polishing amount formed by the three steps of rough grinding, fine grinding, and polishing can be obtained.
[0040] Step S104: Measure the second dimension of the second recessed structure along the second straight line on the surface of the area to be measured; both the first straight line and the second straight line are located in a first plane perpendicular to the surface of the area to be measured.
[0041] After polishing, the first recessed structure 121 forms a second recessed structure 122. The opening length of the second recessed structure 122 along the second straight line L2 can be measured, i.e., the second dimension d2. Optionally, the second dimension d2 can be measured using the measurement system of a metallurgical microscope. Thus, while observing the second recessed structure 122 with a metallurgical microscope, the second dimension d2 can be measured using the microscope's own measurement system. This eliminates the need for a separate measurement system, simplifies the measurement process, and reduces the size of the device for obtaining the polishing amount of the metallographic sample.
[0042] It should be noted that in this embodiment, the first straight line L1 and the second straight line L2 are both located on the first plane P1, which is perpendicular to the surface of the area to be measured. Figure 5 This shows a cross-sectional view of the hard indenter 11 and the metallographic sample 12 within the first plane P1. Within the first plane P1, the first recessed structure 121 forms the first cross-section. Based on the first cross-section, the thickness of the surface of the area to be measured can be directly observed, that is, the amount of polishing of the metallographic sample 12 in the first direction Z perpendicular to the surface of the area to be measured.
[0043] Step S105: Based on the first dimension and the second dimension, obtain the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured.
[0044] Based on the above embodiments, the hard indenter 11 can be conical or pyramidal, and its apex angle parameter is known. Therefore, the apex angle θ of the first cross-section of the first recessed structure 121 or the second recessed structure 122 formed by it within the first plane P1 is known. Furthermore, since the apex angle θ of the first recessed structure 121 and the second recessed structure 122 is the same, the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured can be calculated based on the first dimension d1 and the second dimension d2. Even if the polishing area is very small, the amount of polishing can be calculated by pressing in the recessed structure and measuring its dimensional changes before and after polishing using a metallographic microscope.
[0045] In this embodiment of the invention, a regularly shaped hard indenter is pressed into the measurement area of the metallographic sample to form a regularly shaped first recessed structure. The first dimension of the first recessed structure along a first straight line on the surface of the measurement area is measured. Then, the metallographic sample is polished, forming a second recessed structure. The first dimension of the second recessed structure along a second straight line on the surface of the measurement area is measured. It should be noted that both the first and second straight lines belong to a first plane, which is perpendicular to the surface of the measurement area. The difference between the first and second dimensions reflects the amount of polishing in the metallographic sample in a first direction perpendicular to the surface of the measurement area. This invention obtains the polishing amount by setting a recessed structure and observing and measuring the dimensional changes of the recessed structure before and after polishing. This method of measuring the polishing amount is not affected by the sample preparation accuracy of the metallographic sample or the detection accuracy of the vernier caliper, further improving the measurement accuracy of the polishing amount. Furthermore, the measurement process of this invention is simple and effectively saves measurement costs.
[0046] The above is the core idea of this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0047] Continue to refer to Figure 5 Optionally, pressing a regularly shaped hard indenter into the measurement area of the metallographic sample can include: pressing the axis of the hard indenter perpendicular to the surface of the measurement area into the metallographic sample. The axis φ is the central axis of the conical or pyramidal hard indenter 11. Preferably, the first plane P1 can be a plane passing through the axis φ, thereby facilitating the measurement system to measure the larger dimensions of the hard indenter 11 and improving the measurement accuracy of the polishing amount. Figure 5 As shown, the axis φ of the hard indenter 11 is pressed into the metallographic sample 12 perpendicular to the surface of the area to be measured. Within the first cross-section, the first recessed structure 121 and the second recessed structure 122 form an isosceles triangle. This facilitates the accurate measurement of the polishing amount based on the first dimension d1 and the second dimension d2.
[0048] In one specific embodiment, when the axis φ of the hard indenter 11 is pressed into the metallographic sample 12 perpendicular to the surface of the area to be measured, the process of "obtaining the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured according to the first and second dimensions" is described in detail, such as... Figure 6 As shown, Figure 6 This is a flowchart illustrating another method for obtaining the polishing amount of a metallographic sample according to an embodiment of the present invention. The method of this embodiment includes the following steps:
[0049] Step S201: Press the metallographic sample into the area to be measured with the axis of the hard indenter perpendicular to the surface of the area to be measured, so that the area to be measured forms a first conical or pyramidal concave structure.
[0050] The carbide indenter of the Rockwell hardness tester is pressed into the desired measurement location on the polished surface of the metallographic sample, thus creating a regular indentation. For example, the indenter tip angle θ can be 120°.
[0051] Step S202: Measure the first dimension of the first recessed structure along the first straight line on the surface of the area to be measured.
[0052] The regular indentation locations were observed using a metallographic microscope, and the first dimension d1 of the indentation (first recessed structure) within the first plane P1 was measured using the metallographic microscope's own measurement system.
[0053] Step S203: Polish the area to be measured of the metallographic sample to form a second concave structure.
[0054] Step S204: Measure the second dimension of the second recessed structure along the second straight line on the surface of the area to be measured; both the first straight line and the second straight line are located in a first plane perpendicular to the surface of the area to be measured.
[0055] After the measurement is completed, the metallographic sample is polished. Then, the second concave structure formed by polishing the first concave structure is observed using a metallographic microscope. The second dimension d2 of the indentation (second concave structure) in the first plane P1 is measured using the metallographic microscope's own measurement system.
[0056] The aforementioned "obtaining the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured based on the first and second dimensions" specifically includes the following steps S204 to S206:
[0057] Step S205: Based on the first dimension and the apex angle, obtain the first height of the first recessed structure in the first cross section.
[0058] Because within the first cross-section, the isosceles triangles of the first recessed structure 121 and the second recessed structure 122, which are parallel to the axis φ in the first direction Z, bisect the vertex angle θ and also bisect the first dimension d1 and the second dimension d2, the first height of the first recessed structure in the first cross-section can be obtained. d1 is the first dimension; θ is the vertex angle; tan is the tangent function.
[0059] Step S206: Based on the second dimension and the apex angle, obtain the second height of the second recessed structure in the first cross section.
[0060] Similarly, because within the first cross-section, the isosceles triangles of the first recessed structure 121 and the second recessed structure 122, which are parallel to the axis φ of the first direction Z, bisect the vertex angle θ and also bisect the first dimension d1 and the second dimension d2, the second height of the second recessed structure in the first cross-section can be obtained. d2 is the first dimension.
[0061] Step S207: Based on the first height and the second height, obtain the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured.
[0062] The polishing amount of metallographic sample 12 in the first direction Z, perpendicular to the surface of the area to be measured, is obtained. .
[0063] Because the concave structure can be either conical or pyramidal, such as Figure 7 As shown and Figure 8 As shown, Figure 7 This is a schematic diagram showing the dimensions of a conical recessed structure provided in an embodiment of the present invention. Figure 8 This is a schematic diagram showing the dimensions of a pyramidal concave structure provided in an embodiment of the present invention. The first concave structure 121 and the second concave structure 122 form a circle parallel to the surface of the area to be measured, with the first dimension d1 and the second dimension d2 being the diameter of the circle. Alternatively, the first concave structure 121 and the second concave structure 122 can form a square parallel to the surface of the area to be measured, with the first dimension d1 and the second dimension d2 being the side length in the positive direction. Of course, for the pyramidal concave structure, the first dimension d1 and the second dimension d2 can be line segments passing through the axis φ in any direction; this embodiment does not limit this.
[0064] In this embodiment, a hard indenter is pressed into the area to be measured with its axis perpendicular to the surface of the area to be measured. The first and second recessed structures formed are symmetrically arranged with the axis as the axis of symmetry. This makes it easy to obtain the first height of the first recessed structure and the second height of the second recessed structure in the first cross section through the function of the apex angle. The difference between the first height and the second height is used as the polishing amount, which improves the measurement accuracy of the polishing amount. Moreover, the measurement process is only applicable to the measurement system of a metallographic microscope, and the measurement method is simple.
[0065] In a specific example, the vertex angle θ is 120°, therefore we can obtain:
[0066] ;
[0067] If the metallographic microscope measures d1 = 662.50 μm and d2 = 652.56 μm, then the amount of polishing in a small area of the polished surface can be accurately determined. =h1-h2=0.289×(662.50-652.56)=2.87μm.
[0068] Figure 9 This is a schematic diagram illustrating another structure for pressing a hard indenter into a metallographic sample, provided by an embodiment of the present invention. In another embodiment, optionally, pressing a hard indenter with a regular shape into the area to be measured of the metallographic sample may include: pressing the hard indenter into the area to be measured of the metallographic sample, wherein the first included angle between the axis of the hard indenter and the first direction is known. In this embodiment, the axis φ of the hard indenter may not be parallel to the first direction Z, and may also have a first included angle α with the first direction Z. Similarly, the polishing amount can be obtained based on the first dimension d1, the second dimension d2, the apex angle θ, and the first included angle α.
[0069] In another specific embodiment, when there is a first included angle between the axis of the hard indenter and the first direction, the process of "obtaining the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured according to the first size and the second size" is described in detail. Optionally, obtaining the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured according to the first size and the second size may include: obtaining the first height of the first recessed structure in the first cross section according to the first size, the apex angle and the first included angle; obtaining the second height of the second recessed structure in the first cross section according to the second size, the apex angle and the first included angle; and obtaining the polishing amount of the metallographic sample in the first direction perpendicular to the surface of the area to be measured according to the first height and the second height.
[0070] Continue to refer to Figure 9 Because within the first cross-section, the isosceles triangles of the first recessed structure 121 and the second recessed structure 122 are parallel to the axis φ in the first direction Z and bisect the vertex angle θ, the first height of the first recessed structure 121 in the first cross-section can be obtained. Similarly, the second height of the second recessed structure 122 in the first cross-section can be obtained. Finally, the polishing amount of metallographic sample 12 in the first direction Z, perpendicular to the surface of the area to be measured, can be obtained. =h1-h2. This embodiment provides another way to obtain the polishing amount.
[0071] Based on the same concept, embodiments of the present invention also provide a device for obtaining the polishing amount of a metallographic sample. Figure 10 This is a schematic diagram of a device for obtaining the polishing amount of a metallographic sample according to an embodiment of the present invention, as shown below. Figure 10As shown, the device for obtaining the polishing amount of metallographic specimens provided in this embodiment of the invention is applicable to the method for obtaining the polishing amount of metallographic specimens provided in any embodiment of the invention, and includes: an indentation pressing mechanism 21, a hard indenter 22, a measuring system 23, a polishing mechanism 24, and a controller 25; the controller 25 is electrically connected to the indentation pressing mechanism 21, the measuring system 23, and the polishing mechanism 24 respectively.
[0072] The controller 25 controls the indentation pressing mechanism 21 to press the hard indenter 22 with a regular shape into the area to be measured of the metallographic sample, so that the area to be measured forms a first indentation structure with a regular shape.
[0073] The control measurement system measures the first dimension of the first recessed structure along a first straight line on the surface of the area to be measured;
[0074] The grinding and polishing mechanism 24 is controlled to grind and polish the area to be measured of the metallographic sample to form a second concave structure.
[0075] The control measurement system measures the second dimension of the second recessed structure along a second straight line on the surface of the area to be measured; both the first and second straight lines are located in a first plane perpendicular to the surface of the area to be measured.
[0076] The controller 25 is used to obtain the amount of polishing of the metallographic sample in a first direction perpendicular to the surface of the area to be measured, based on the first dimension and the second dimension.
[0077] In this embodiment of the invention, a regularly shaped hard indenter is pressed into the measurement area of the metallographic sample to form a regularly shaped first recessed structure. The first dimension of the first recessed structure along a first straight line on the surface of the measurement area is measured. Then, the metallographic sample is polished, forming a second recessed structure. The first dimension of the second recessed structure along a second straight line on the surface of the measurement area is measured. It should be noted that both the first and second straight lines belong to a first plane, which is perpendicular to the surface of the measurement area. The difference between the first and second dimensions reflects the amount of polishing in the metallographic sample in a first direction perpendicular to the surface of the measurement area. This invention obtains the polishing amount by setting a recessed structure and observing and measuring the dimensional changes of the recessed structure before and after polishing. This method of measuring the polishing amount is not affected by the sample preparation accuracy of the metallographic sample or the detection accuracy of the vernier caliper, further improving the measurement accuracy of the polishing amount. Furthermore, the measurement process of this invention is simple and effectively saves measurement costs.
[0078] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.
Claims
1. A method for obtaining the polishing amount of a metallographic sample, characterized in that, include: A hard indenter with a regular shape is pressed into the area to be measured of the metallographic sample, so that the area to be measured forms a first recessed structure with a regular shape. Measure the first dimension of the first recessed structure along a first straight line on the surface of the area to be measured; The area to be measured of the metallographic sample is polished to form a second concave structure. Measure the second dimension of the second recessed structure along a second straight line on the surface of the area to be measured; both the first straight line and the second straight line are located in a first plane perpendicular to the surface of the area to be measured; Based on the first dimension and the second dimension, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained.
2. The method for obtaining the polishing amount of a metallographic sample according to claim 1, characterized in that, The grinding and polishing process includes at least one of the following: coarse grinding process, fine grinding process, and polishing process.
3. The method for obtaining the polishing amount of a metallographic sample according to claim 1, characterized in that, The hard indenter is conical or pyramidal; the apex angle of the first cross-section of the first recessed structure in the first plane is known.
4. The method for obtaining the polishing amount of a metallographic sample according to claim 3, characterized in that, A hard indenter with a regular shape is pressed into the area to be measured of a metallographic specimen, including: The hard indenter is pressed into the metallographic sample with its axis perpendicular to the surface of the area to be measured.
5. The method for obtaining the polishing amount of a metallographic sample according to claim 4, characterized in that, Based on the first dimension and the second dimension, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained, including: Based on the first dimension and the apex angle, obtain the first height of the first recessed structure in the first cross section; Based on the second dimension and the apex angle, obtain the second height of the second recessed structure in the first cross section; Based on the first height and the second height, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained.
6. The method for obtaining the polishing amount of a metallographic sample according to claim 4, characterized in that, Based on the first dimension and the second dimension, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained, including: Obtain the first height of the first recessed structure at the first cross-section. d1 is the first dimension; θ is the vertex angle; tan is the tangent function; Obtain the second height of the second recessed structure at the first cross-section. d2 is the first dimension; The polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained. .
7. The method for obtaining the polishing amount of a metallographic sample according to claim 3, characterized in that, A hard indenter with a regular shape is pressed into the area to be measured of a metallographic specimen, including: The hard indenter is pressed into the area to be measured of the metallographic specimen, and the first angle between the axis of the hard indenter and the first direction is known.
8. The method for obtaining the polishing amount of a metallographic specimen according to claim 7, characterized in that, Based on the first dimension and the second dimension, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained, including: Based on the first dimension, the apex angle, and the first included angle, the first height of the first recessed structure in the first cross section is obtained; Based on the second dimension, the apex angle, and the first included angle, the second height of the second recessed structure in the first cross section is obtained; Based on the first height and the second height, the polishing amount of the metallographic sample in a first direction perpendicular to the surface of the area to be measured is obtained.
9. The method for obtaining the polishing amount of a metallographic sample according to claim 1, characterized in that, The first dimension and the second dimension were measured using a metallographic microscope measurement system.
10. A device for obtaining the polishing amount of a metallographic sample, characterized in that, A method for obtaining the polishing amount of a metallographic specimen according to any one of claims 1-9 includes: an indentation indentation mechanism, a hard indenter, a measuring system, a polishing mechanism, and a controller; the controller is electrically connected to the indentation indentation mechanism, the measuring system, and the polishing mechanism, respectively. The controller controls the indentation indentation mechanism to press a hard indenter with a regular shape into the area to be measured of the metallographic sample, so that the area to be measured forms a first indentation structure with a regular shape. The measurement system is controlled to measure the first dimension of the first recessed structure along a first straight line on the surface of the area to be measured; The grinding and polishing mechanism is controlled to grind and polish the area to be measured of the metallographic sample to form a second concave structure; The measurement system is controlled to measure the second dimension of the second recessed structure along a second straight line on the surface of the area to be measured; both the first straight line and the second straight line are located in a first plane perpendicular to the surface of the area to be measured; The controller is used to obtain the amount of polishing of the metallographic sample in a first direction perpendicular to the surface of the area to be measured, based on the first dimension and the second dimension.