Nested double-frequency ultrasonic composite vibrator for chemical mechanical polishing

Abstract

The invention relates to the technical field of chemical mechanical polishing, in particular to a nested double-frequency ultrasonic composite vibrator for chemical mechanical polishing, which comprises a retaining sleeve, a low-frequency ultrasonic vibrator is coaxially mounted in the retaining sleeve, a loading disc is mounted on the vibrating surface of the low-frequency ultrasonic vibrator, and a flange plate is fixedly assembled on the outer side surface of the retaining sleeve. A connecting base is installed on the lower surface of the flange plate, a connecting plate is fixed to the lower surface of the connecting base, an end cover is coaxially fixed to the lower surface of the connecting plate, a protruding ring A and a protruding ring B are coaxially arranged on the lower surface of the end cover in an extending mode, a high-frequency ultrasonic vibration plate is arranged below the end cover, and a protruding ring C and a protruding ring D are coaxially arranged on the upper surface of the high-frequency ultrasonic vibration plate in an extending mode. The outer side face of the convex ring D is matched with the inner side face of the convex ring B. A high-frequency piezoelectric ceramic piece is fixed to the upper surface of the high-frequency ultrasonic vibration plate. The method solves the problems that an existing chemical mechanical polishing technology is low in polishing speed and poor in surface quality after polishing, and is suitable for the fields of semiconductor manufacturing, optical device machining and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chemical mechanical polishing technology, and particularly relates to a nested double-frequency ultrasonic compound vibrator for chemical mechanical polishing. BACKGROUND

[0002] Chemical mechanical polishing technology is an ultra-precision machining technology that realizes material removal on the surface of a workpiece by the synergistic effect of chemistry and mechanics, and is widely applied in the fields of semiconductor manufacturing and optical device processing. However, in actual application, the existing chemical mechanical polishing technology has the problems of low polishing liquid mass transfer efficiency, slow chemical reaction speed, and slow mechanical removal speed, which result in slow polishing speed and poor surface quality after polishing. Therefore, it is necessary to invent a nested double-frequency ultrasonic compound vibrator for chemical mechanical polishing to solve the problems of slow polishing speed and poor surface quality after polishing of the existing chemical mechanical polishing technology. SUMMARY

[0003] The present application provides a nested double-frequency ultrasonic compound vibrator for chemical mechanical polishing to solve the problems of slow polishing speed and poor surface quality after polishing of the existing chemical mechanical polishing technology.

[0004] The present application is implemented by adopting the following technical scheme: The nested double-frequency ultrasonic compound vibrator for chemical mechanical polishing comprises a retaining sleeve in a cylindrical structure; a low-frequency ultrasonic vibrator with a vibrating surface facing downward is coaxially installed in the retaining sleeve; a carrier disk is installed on the vibrating surface of the low-frequency ultrasonic vibrator; A flange plate is fixedly assembled to the outer side surface of the retaining sleeve; a connecting seat is installed to the lower surface of the flange plate; a connecting plate in an annular structure is fixed to the lower surface of the connecting seat and coaxially surrounds the retaining sleeve; an end cover in an annular structure is coaxially fixed to the lower surface of the connecting plate; a convex ring A and a convex ring B are coaxially extended to the lower surface of the end cover, and the convex ring B is located outside the convex ring A; An ultrasonic vibration plate in an annular structure is arranged below the end cover; a convex ring C and a convex ring D are coaxially extended to the upper surface of the ultrasonic vibration plate, and the convex ring D is located outside the convex ring C; a threading hole is formed through the inner side surface and the outer side surface of the convex ring C; the upper surface of the convex ring C and the lower surface of the convex ring A are mutually butted; the outer side surface of the convex ring D and the inner side surface of the convex ring B are mutually matched; a high-frequency piezoelectric ceramic piece is fixed to the upper surface of the ultrasonic vibration plate and is located between the convex ring C and the convex ring D.

[0005] Further, the four-way conductive slip ring is coaxially arranged in the retaining sleeve; a gap is left between the outer ring of the four-way conductive slip ring and the inner side of the retaining sleeve; the inner ring of the four-way conductive slip ring is fixedly assembled with a transmission shaft; a support beam arranged in the radial direction is fixed between the side lower end of the transmission shaft and the inner side of the retaining sleeve, and the support beam is located above the low-frequency ultrasonic vibrator; the first pair of inner ring connecting terminals of the four-way conductive slip ring are electrically connected with the pair of connecting terminals of the low-frequency ultrasonic vibrator; the second pair of inner ring connecting terminals of the four-way conductive slip ring are electrically connected with the pair of connecting terminals of the high-frequency piezoelectric ceramic sheet.

[0006] Further, the outer side of the convex ring B is fixed with a temperature monitor.

[0007] Further, the side wall of the retaining sleeve is provided with a fastening screw hole; a fastening bolt is arranged in the fastening screw hole, and the tail end of the fastening bolt is tightly pressed against the side of the low-frequency ultrasonic vibrator; the inner side of the retaining sleeve is a stepped surface with a thin upper part and a thick lower part, and the upper surface of the low-frequency ultrasonic vibrator is in contact with the transition section of the stepped surface.

[0008] Further, the vibration surface of the low-frequency ultrasonic vibrator is provided with a blind hole; the object carrier is fixedly embedded in the blind hole.

[0009] Further, the surface of the flange plate is provided with an assembly hole A; the connecting seat is provided with an assembly hole B; an assembly bolt is arranged in the assembly hole A and the assembly hole B, and the head of the assembly bolt is tightly pressed against the flange plate; an assembly nut is screwed on the assembly bolt, and the assembly nut is tightly pressed against the connecting seat.

[0010] Further, the connecting seat and the end cover are both made of iron; the connecting plate is made of a magnetic material; the connecting plate is adsorbed and fixed to the lower surface of the connecting seat; and the end cover is adsorbed and fixed to the lower surface of the connecting plate.

[0011] Further, the inner side of the convex ring B is provided with an internal thread; the outer side of the convex ring D is provided with an external thread; and the outer side of the convex ring D and the inner side of the convex ring B are screwed together.

[0012] Further, the lower surface of the retaining sleeve is provided with a drainage groove A arranged in the radial direction; the lower surface of the high-frequency ultrasonic vibration plate is provided with a drainage groove B arranged in the radial direction, and the drainage groove B and the drainage groove A are in communication with each other.

[0013] Further, the side wall of the retaining sleeve is provided with a hollow hole.

[0014] The nested double-frequency ultrasonic compound vibrator for chemical mechanical polishing provided by the application realizes the double improvement of polishing speed and surface quality after polishing by adopting the high-low frequency nested structure. Specifically, the high-frequency ultrasonic vibration is used to induce the acoustic streaming effect of the polishing liquid, the acoustic streaming effect can significantly improve the mass transfer efficiency and chemical reaction speed of the polishing liquid, and can effectively reduce the cavitation threshold, so that the cavitation effect is more likely to occur, and the low-frequency ultrasonic vibration is used to induce the severe cavitation effect of the polishing liquid, the severe cavitation effect can produce high-energy shock waves and micro-jets, thereby significantly improving the mechanical removal speed. Due to the significant improvement of the mass transfer efficiency, chemical reaction speed and mechanical removal speed of the polishing liquid, the polishing speed and surface quality after polishing are significantly improved.

[0015] The application effectively solves the problems of slow polishing speed and poor surface quality after polishing of the existing chemical mechanical polishing technology, and is suitable for the fields of semiconductor manufacturing, optical device processing and the like. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic diagram of the application.

[0017] Figure 2 is a partial structural schematic diagram of Figure 1 . Figure 1

[0018] Figure 3 is a partial structural schematic diagram of Figure 2 . Figure 1

[0019] Figure 4 is another angle structural schematic diagram of Figure 3 .

[0020] Figure 5 is a partial structural schematic diagram of Figure 4 . Figure 1

[0021] Figure 6 is a sectional view of Figure 5 .

[0022] Figure 7 is a partial structural schematic diagram of Figure 4 . Figure 2

[0023] Figure 8 is a partial structural schematic diagram of Figure 2 . Figure 2

[0024] Figure 9 is another angle structural schematic diagram of Figure 8 .

[0025] Figure 10 is​​​​​Figure 1 Partial structural diagram Figure 2 .

[0026] Figure 11 yes Figure 10 Partial structural diagram Figure 1 .

[0027] Figure 2 yes Figure 13 Partial structural diagram Figure 12 .

[0028] Figure 1 yes Figure 14 Partial structural diagram Figure 13 .

[0029] Figure 15 yes Figure 12 Another structural diagram from another angle.

[0030] Figure 2 yes Figure 16 Partial structural diagram Figure 12 .

[0031] Figure 17 yes Figure 16 Another structural diagram from another angle.

[0032] Figure 18 yes Figure 1 A sectional view.

[0033] ​ yes ​ Another structural diagram from another angle.

[0034] In the diagram: 1-Retaining sleeve, 1.1-Fasting screw hole, 1.2-Drainage slot A, 1.3-Hollow hole, 2-Low-frequency ultrasonic transducer, 2.1-Blind hole, 3-Carrying tray, 4-Flange, 4.1-Assembly hole A, 5-Connecting seat, 5.1-Assembly hole B, 6-Connecting plate, 7-End cap, 7.1-Protruding ring A, 7.2-Protruding ring B, 8-High-frequency ultrasonic transducer plate, 8.1-Protruding ring C, 8.2-Protruding ring D, 8.3-Wire hole, 8.4-Drainage slot B, 9-High-frequency piezoelectric ceramic sheet, 10-Outer ring of four-channel conductive slip ring, 11-Inner ring of four-channel conductive slip ring, 12-Drive shaft, 13-Support beam, 14-Temperature monitor, 15-Fasting bolt, 16-Assembly bolt, 17-Assembly nut. Detailed Implementation

[0035] A nested dual-frequency ultrasonic composite vibrator for chemical mechanical polishing includes a cylindrical retaining sleeve 1; a low-frequency ultrasonic vibrator 2 with its vibration surface facing downward is coaxially mounted inside the retaining sleeve 1; and a carrier disk 3 is mounted on the vibration surface of the low-frequency ultrasonic vibrator 2. The outer side of the retaining sleeve 1 is fixedly provided with a flange plate 4; the lower surface of the flange plate 4 is provided with a connecting seat 5; the lower surface of the connecting seat 5 is fixedly provided with a connecting plate 6 in a ring structure, and the connecting plate 6 coaxially surrounds the retaining sleeve 1; the lower surface of the connecting plate 6 is fixedly provided with an end cover 7 in a ring structure; the lower surface of the end cover 7 is coaxially provided with a convex ring A7.1 and a convex ring B7.2, and the convex ring B7.2 is located at the outer side of the convex ring A7.1; The lower side of the end cover 7 is provided with a high-frequency ultrasonic vibration plate 8 in a ring structure; the upper surface of the high-frequency ultrasonic vibration plate 8 is coaxially provided with a convex ring C8.1 and a convex ring D8.2, and the convex ring D8.2 is located at the outer side of the convex ring C8.1; the inner side and the outer side of the convex ring C8.1 are provided with a threading hole 8.3; the upper surface of the convex ring C8.1 and the lower surface of the convex ring A7.1 are mutually butted; the outer side of the convex ring D8.2 and the inner side of the convex ring B7.2 are mutually matched; the upper surface of the high-frequency ultrasonic vibration plate 8 is fixedly provided with a high-frequency piezoelectric ceramic sheet 9, and the high-frequency piezoelectric ceramic sheet 9 is located between the convex ring C8.1 and the convex ring D8.2.

[0036] In work, the upper surface of the polishing pad of the chemical mechanical polishing machine is smeared with polishing liquid. The retaining sleeve 1 is eccentrically placed on the upper surface of the polishing pad, and the retaining sleeve 1 is rotatably clamped in the clamp of the chemical mechanical polishing machine. The lower surface of the carrier disc 3 is adhered with a workpiece, and the workpiece is in contact with the upper surface of the polishing pad. The side of the chemical mechanical polishing machine is provided with a low-frequency ultrasonic generator and a high-frequency ultrasonic generator. The low-frequency ultrasonic vibrator 2 is electrically connected with the low-frequency ultrasonic generator. The high-frequency piezoelectric ceramic sheet 9 is electrically connected with the high-frequency ultrasonic generator.

[0037] The specific working process is as follows: first, start the chemical mechanical polishing machine, so that the polishing pad rotates. Based on the friction force between the retaining sleeve 1 and the polishing pad, the polishing pad drives the retaining sleeve 1 to rotate in the clamp, and the retaining sleeve 1 drives the low-frequency ultrasonic vibrator 2, the carrier disc 3, the workpiece, the flange plate 4, the connecting seat 5, the connecting plate 6, the end cover 7, the high-frequency ultrasonic vibration plate 8, and the high-frequency piezoelectric ceramic sheet 9 to rotate, thereby making the workpiece and the polishing pad rub. Then, start the low-frequency ultrasonic generator and the high-frequency ultrasonic generator. The low-frequency ultrasonic generator converts the mains into an ultrasonic alternating current signal, and transmits the ultrasonic alternating current signal to the low-frequency ultrasonic vibrator 2, and the low-frequency ultrasonic vibrator 2 converts the ultrasonic alternating current signal into low-frequency ultrasonic vibration, thereby making the present application and the workpiece vibrate together. The high-frequency ultrasonic generator converts the mains into an ultrasonic alternating current signal, and transmits the ultrasonic alternating current signal to the high-frequency piezoelectric ceramic sheet 9, and the high-frequency piezoelectric ceramic sheet 9 converts the ultrasonic alternating current signal into high-frequency ultrasonic vibration, thereby making the present application and the workpiece vibrate together.

[0038] Based on the friction between the workpiece and the polishing pad, and in cooperation with the polishing liquid, the chemical mechanical polishing of the workpiece is realized. In the polishing process, the high-frequency ultrasonic vibration induces the acoustic streaming effect of the polishing liquid, which can significantly improve the mass transfer efficiency and chemical reaction speed of the polishing liquid, and effectively reduce the cavitation threshold, so that the cavitation effect is more likely to occur. At the same time, the low-frequency ultrasonic vibration induces the intense cavitation effect of the polishing liquid, which can produce high-energy shock waves and micro-jets, thereby significantly improving the mechanical removal rate. Due to the significant improvement in the mass transfer efficiency, chemical reaction speed, and mechanical removal rate of the polishing liquid, the polishing speed and the surface quality after polishing are significantly improved.

[0039] A four-channel conductive slip ring is coaxially arranged in the retaining sleeve 1; a gap is left between the outer ring 10 of the four-channel conductive slip ring and the inner side of the retaining sleeve 1; the inner ring 11 of the four-channel conductive slip ring is fixedly fitted with a transmission shaft 12; a support beam 13 arranged in the radial direction is fixed between the side lower end of the transmission shaft 12 and the inner side of the retaining sleeve 1, and the support beam 13 is located above the low-frequency ultrasonic vibrator 2; the first pair of inner ring terminal of the four-channel conductive slip ring is electrically connected with a pair of terminal of the low-frequency ultrasonic vibrator 2; the second pair of inner ring terminal of the four-channel conductive slip ring is electrically connected with a pair of terminal of the high-frequency piezoelectric ceramic sheet 9. In operation, the first pair of outer ring terminal of the four-channel conductive slip ring is electrically connected with a pair of terminal of the low-frequency ultrasonic generator. The second pair of outer ring terminal of the four-channel conductive slip ring is electrically connected with a pair of terminal of the high-frequency ultrasonic generator. The low-frequency ultrasonic generator converts the mains into an ultrasonic frequency alternating current signal, and transmits the ultrasonic frequency alternating current signal to the low-frequency ultrasonic vibrator 2 through the four-channel conductive slip ring. The high-frequency ultrasonic generator converts the mains into an ultrasonic frequency alternating current signal, and transmits the ultrasonic frequency alternating current signal to the high-frequency piezoelectric ceramic sheet 9 through the four-channel conductive slip ring.

[0040] The outer side of the convex ring B7.2 is fixed with a temperature monitor 14. In operation, the temperature monitor 14 monitors and displays the working temperature of the present application in real time, and the working staff adjusts the working time of the present application flexibly accordingly.

[0041] The side wall of the retaining sleeve 1 is provided with a fastening screw hole 1.1; a fastening bolt 15 is arranged in the fastening screw hole 1.1, and the tail end of the fastening bolt 15 tightly presses the side of the low-frequency ultrasonic vibrator 2; the inner side of the retaining sleeve 1 is a stepped surface with a thin upper part and a thick lower part, and the upper surface of the low-frequency ultrasonic vibrator 2 is in contact with the transition section of the stepped surface. In operation, this design can ensure that the low-frequency ultrasonic vibrator 2 is firmly installed in the retaining sleeve 1.

[0042] The vibration surface of the low-frequency ultrasonic vibrator 2 is provided with a blind hole 2.1; the object carrier 3 is fixedly embedded in the blind hole 2.1. In operation, this design can ensure that the object carrier 3 is firmly installed on the vibration surface of the low-frequency ultrasonic vibrator 2.

[0043] The flange plate 4 is provided with an assembly hole A4.1 on the surface; the connecting seat 5 is provided with an assembly hole B5.1; the assembly hole A4.1 and the assembly hole B5.1 are provided with an assembly bolt 16, and the head of the assembly bolt 16 is tightly pressed against the flange plate 4; the assembly bolt 16 is screwed with an assembly nut 17, and the assembly nut 17 is tightly pressed against the connecting seat 5. During operation, the design can ensure that the connecting seat 5 is firmly installed on the lower surface of the flange plate 4.

[0044] The connecting seat 5 and the end cover 7 are made of iron; the connecting plate 6 is made of magnetic material; the connecting plate 6 is adsorbed and fixed on the lower surface of the connecting seat 5; and the end cover 7 is adsorbed and fixed on the lower surface of the connecting plate 6. During operation, the design can realize quick disassembly and assembly between the connecting seat 5 and the end cover 7.

[0045] The inner side of the convex ring B7.2 is provided with internal threads; the outer side of the convex ring D8.2 is provided with external threads; and the outer side of the convex ring D8.2 and the inner side of the convex ring B7.2 are screwed together. During operation, the design can realize quick disassembly and assembly between the end cover 7 and the high-frequency ultrasonic vibration plate 8.

[0046] The lower surface of the retaining sleeve 1 is provided with a radial drainage groove A1.2; the lower surface of the high-frequency ultrasonic vibration plate 8 is provided with a radial drainage groove B8.4, and the drainage groove B8.4 and the drainage groove A1.2 are in communication. During operation, the polishing liquid can be replenished at any time through the drainage groove B8.4 and the drainage groove A1.2.

[0047] The sidewall of the retaining sleeve 1 is provided with a hollow hole 1.3. During operation, the heat generated by the low-frequency ultrasonic vibrator 2 can be quickly dissipated through the hollow hole 1.3.

[0048] In particular implementation, the low-frequency ultrasonic generator is a kilohertz ultrasonic generator, and the high-frequency ultrasonic generator is a megahertz ultrasonic generator. The two pairs of inner ring connection terminals of the four-path conductive slip ring are downward, the first pair of inner ring connection terminals are electrically connected with a pair of connection terminals of the low-frequency ultrasonic vibrator 2 through a pair of wires located in the retaining sleeve 1, and the second pair of inner ring connection terminals are electrically connected with a pair of connection terminals of the high-frequency piezoelectric ceramic sheet 9 through another pair of wires, and the pair of wires simultaneously penetrates the gap between the outer ring 10 of the four-path conductive slip ring and the retaining sleeve 1 and the threading hole 8.3. The two pairs of outer ring connection terminals of the four-path conductive slip ring are upward, the first pair of outer ring connection terminals are electrically connected with a pair of connection terminals of the low-frequency ultrasonic generator through a pair of wires located outside the retaining sleeve 1, and the second pair of outer ring connection terminals are electrically connected with a pair of connection terminals of the high-frequency ultrasonic generator through another pair of wires located outside the retaining sleeve 1. The number of fastening screw holes 1.1, the number of hollow holes 1.3, the number of support beams 13, and the number of fastening bolts 15 are all four, and the four fastening screw holes 1.1, the four hollow holes 1.3, the four support beams 13, and the four fastening bolts 15 are equidistantly arranged in the circumferential direction. The number of drainage notches A1.2, the number of assembly holes A4.1, the number of connecting seats 5, the number of assembly holes B5.1, the number of threading holes 8.3, the number of drainage notches B8.4, the number of assembly bolts 16, and the number of assembly nuts 17 are all eight, and the eight drainage notches A1.2, the eight assembly holes A4.1, the eight connecting seats 5, the eight assembly holes B5.1, the eight threading holes 8.3, the eight drainage notches B8.4, the eight assembly bolts 16, and the eight assembly nuts 17 are equidistantly arranged in the circumferential direction. The number of high-frequency piezoelectric ceramic sheets 9 is twelve, and the twelve high-frequency piezoelectric ceramic sheets 9 are equidistantly arranged in the circumferential direction.

[0049] Although the specific embodiments of the present application are described above, those skilled in the art should understand that these are only illustrative, and the protection scope of the present application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present application, and these changes and modifications all fall within the protection scope of the present application.

Claims

1. A nested dual-frequency ultrasonic composite oscillator for chemical mechanical polishing, characterized in that: It includes a retaining sleeve (1) in a cylindrical structure; a low-frequency ultrasonic vibrator (2) with vibration surface downward is coaxially installed in the retaining sleeve (1); a load plate (3) is installed on the vibration surface of the low-frequency ultrasonic vibrator (2); A flange plate (4) is fixedly assembled on the outer side of the retaining sleeve (1); a connecting seat (5) is installed on the lower surface of the flange plate (4); a connecting plate (6) in an annular structure is fixed on the lower surface of the connecting seat (5), and the connecting plate (6) coaxially surrounds the retaining sleeve (1); an end cover (7) in an annular structure is coaxially fixed on the lower surface of the connecting plate (6); a convex ring A (7.1) and a convex ring B (7.2) are coaxially arranged on the lower surface of the end cover (7), and the convex ring B (7.2) is located outside the convex ring A (7.1); A high-frequency ultrasonic vibration plate (8) in an annular structure is arranged below the end cover (7); a convex ring C (8.1) and a convex ring D (8.2) are coaxially arranged on the upper surface of the high-frequency ultrasonic vibration plate (8), and the convex ring D (8.2) is located outside the convex ring C (8.1); a threading hole (8.3) is arranged between the inner side and the outer side of the convex ring C (8.1); the upper surface of the convex ring C (8.1) and the lower surface of the convex ring A (7.1) are in abutment with each other; the outer side of the convex ring D (8.2) and the inner side of the convex ring B (7.2) are in cooperation with each other; a high-frequency piezoelectric ceramic sheet (9) is fixed on the upper surface of the high-frequency ultrasonic vibration plate (8), and the high-frequency piezoelectric ceramic sheet (9) is located between the convex ring C (8.1) and the convex ring D (8.2).

2. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: A four-way conductive slip ring is coaxially arranged in the retaining sleeve (1); a gap is left between the outer ring (10) of the four-way conductive slip ring and the inner side of the retaining sleeve (1); a transmission shaft (12) is fixedly assembled in the inner ring (11) of the four-way conductive slip ring; a support beam (13) arranged in the radial direction is fixed between the side lower end of the transmission shaft (12) and the inner side of the retaining sleeve (1), and the support beam (13) is located above the low-frequency ultrasonic vibrator (2); a pair of inner ring connecting terminals of the four-way conductive slip ring are electrically connected with a pair of connecting terminals of the low-frequency ultrasonic vibrator (2); a pair of inner ring connecting terminals of the four-way conductive slip ring are electrically connected with a pair of connecting terminals of the high-frequency piezoelectric ceramic sheet (9).

3. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The outer side of the convex ring B (7.2) is fixedly provided with a temperature monitor (14).

4. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: A fastening screw hole (1.1) is arranged through the side wall of the retaining sleeve (1); a fastening bolt (15) is arranged through the fastening screw hole (1.1), and the tail end of the fastening bolt (15) is tightly pressed against the side surface of the low-frequency ultrasonic vibrator (2); the inner side of the retaining sleeve (1) is a stepped surface with a narrow upper part and a wide lower part, and the upper surface of the low-frequency ultrasonic vibrator (2) is in contact with the transition section of the stepped surface.

5. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: A blind hole (2.1) is arranged on the vibration surface of the low-frequency ultrasonic vibrator (2); the load plate (3) is fixedly embedded in the blind hole (2.1).

6. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The surface of the flange plate (4) is provided with an assembly hole A (4.1); the connecting seat (5) is provided with an assembly hole B (5.1); the assembly hole A (4.1) and the assembly hole B (5.1) are provided with an assembly bolt (16) penetrating through; the head of the assembly bolt (16) is tightly pressed against the flange plate (4); the assembly bolt (16) is screwed with an assembly nut (17), and the assembly nut (17) is tightly pressed against the connecting seat (5).

7. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The connecting seat (5) and the end cover (7) are made of iron; the connecting plate (6) is made of magnetic material; the connecting plate (6) is adsorbed and fixed to the lower surface of the connecting seat (5); the end cover (7) is adsorbed and fixed to the lower surface of the connecting plate (6).

8. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The inner side of the convex ring B (7.2) is provided with an internal thread; the outer side of the convex ring D (8.2) is provided with an external thread; the outer side of the convex ring D (8.2) and the inner side of the convex ring B (7.2) are screwed with each other.

9. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The lower surface of the retaining sleeve (1) is provided with a radial drainage groove A (1.2); the lower surface of the high-frequency ultrasonic wave plate (8) is provided with a radial drainage groove B (8.4), and the drainage groove B (8.4) and the drainage groove A (1.2) are communicated with each other.

10. The nested dual-frequency ultrasonic compound transducer for chemical mechanical polishing according to claim 1, characterized in that: The sidewall of the retaining sleeve (1) is provided with a hollow hole (1.3).

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