An optimization method and apparatus for a nanodiamond-copper gradient composite heat dissipation structure

Abstract

This invention relates to the field of heat dissipation technology, and more particularly to an optimization method and apparatus for a nanodiamond-copper gradient composite heat dissipation structure. The invention comprises the following steps: Step 100: Determining a three-dimensional geometric model of the nanodiamond-copper gradient composite heat dissipation structure based on its initial geometric parameters; Step 102: Assigning preset material properties to the three-dimensional geometric model to obtain a simulation model of the nanodiamond-copper gradient composite heat dissipation structure; Step 104: Determining the thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under the initial geometric parameters based on the simulation model; Step 106: Updating the initial geometric parameters and repeating steps 100-106 until the optimization objective of the objective function is greater than a first preset value, thus obtaining the optimal geometric parameters. In this way, the invention can improve the heat dissipation performance of the nanodiamond-copper gradient composite heat dissipation structure.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to an optimization method and apparatus for a nanodiamond copper gradient composite heat dissipation structure. Background Technology

[0002] As chip integration and power density increase, the demand for heat dissipation becomes increasingly stringent. Traditional aluminum-based and pure copper heat dissipation materials suffer from low thermal conductivity and a mismatch between their coefficient of thermal expansion and the chip's thermal conductivity, making them unsuitable for these requirements. Nanodiamond-reinforced copper-based composite materials combine high thermal conductivity with a low coefficient of thermal expansion, making them ideal for chip heat dissipation. However, existing technologies suffer from the following drawbacks: blind parameter design: the porosity of the diamond framework and the Ti / Cu interface layer thickness ratio rely heavily on empirical design, lacking multi-scale performance correlation analysis.

[0003] Based on this, the present invention proposes an optimization method and apparatus for a nanodiamond copper gradient composite heat dissipation structure to address the problem of how to improve the heat dissipation performance of the nanodiamond copper gradient composite heat dissipation structure. Summary of the Invention

[0004] To address the problem of improving the heat dissipation performance of nanodiamond-copper gradient composite heat dissipation structures, embodiments of the present invention provide an optimization method and apparatus for nanodiamond-copper gradient composite heat dissipation structures.

[0005] In a first aspect, embodiments of the present invention provide an optimization method for a nanodiamond-copper gradient composite heat dissipation structure, comprising:

[0006] Step 100: Determine the three-dimensional geometric model of the nanodiamond copper gradient composite heat dissipation structure based on the initial geometric parameters of the nanodiamond copper gradient composite heat dissipation structure.

[0007] Step 102: Assign the preset material properties to the three-dimensional geometric model to obtain the simulation model of the nanodiamond copper gradient composite heat dissipation structure;

[0008] Step 104: Based on the simulation model, determine the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters;

[0009] Step 106: Update the initial geometric parameters, and repeat steps 100 to 106 until the optimization objective of the objective function is greater than the first preset value, thus obtaining the optimal geometric parameters.

[0010] Secondly, embodiments of the present invention provide an optimized device for a nanodiamond-copper gradient composite heat dissipation structure, comprising:

[0011] The first data processing module is used to execute: Step 100: Determine the three-dimensional geometric model of the nano-diamond copper gradient composite heat dissipation structure based on the initial geometric parameters of the nano-diamond copper gradient composite heat dissipation structure.

[0012] The second data processing module is used to execute: Step 102: Assign the preset material properties to the three-dimensional geometric model to obtain the simulation model of the nano-diamond copper gradient composite heat dissipation structure.

[0013] The third data processing module is used to perform: Step 104: Determine the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model;

[0014] The fourth data processing module is used to perform: Step 106: Update the initial geometric parameters, and re-execute steps 100 to 106 until the optimization target of the objective function is greater than the first preset value, so as to obtain the optimal geometric parameters.

[0015] Thirdly, embodiments of the present invention also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, it implements the method described in any embodiment of the present invention.

[0016] Fourthly, embodiments of the present invention also provide a computer-readable storage medium having a computer program stored thereon, which, when executed in a computer, causes the computer to perform the methods described in any embodiment of the present invention.

[0017] This invention provides an optimization method and apparatus for a nanodiamond-copper gradient composite heat dissipation structure. Based on initial geometric parameters (including the porosity of the nanodiamond framework, the thickness ratio of the titanium-copper gradient interface layer, and the distribution density of the copper filling layer), this invention constructs a three-layer gradient three-dimensional geometric model comprising an inner diamond framework, a middle titanium-copper gradient interface, and an outer copper filling layer, defining the spatial structure and dimensional relationships of each functional layer. Furthermore, material properties are assigned to the model, including the thermal conductivity of each layer (e.g., the diamond framework layer can reach 1500-2000 W / m). By utilizing key parameters such as K, elastic modulus, and Poisson's ratio, the geometric model is transformed into a quantifiable simulation model. Based on this simulation model, the thermal conductivity of the structure under the initial parameter combination can be calculated using finite element thermal analysis and other methods, intuitively reflecting the benchmark of heat dissipation performance. Then, by dynamically updating the geometric parameters (such as adjusting the interface layer thickness gradient and optimizing the pore distribution of the skeleton), the modeling and assignment are repeatedly executed until the optimization objective of the objective function exceeds a first preset threshold, ultimately outputting the optimal combination of geometric parameters that balances high heat dissipation performance and engineering practicality. Thus, this invention effectively replaces traditional empirical design, achieving an improvement in the heat dissipation performance of the nanodiamond copper gradient composite heat dissipation structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A flowchart illustrating an optimization method for a nanodiamond-copper gradient composite heat dissipation structure according to one embodiment is shown.

[0020] Figure 2 This is a hardware architecture diagram of an electronic device provided in an embodiment of the present invention;

[0021] Figure 3 A structural diagram of an optimized device for a nanodiamond-copper gradient composite heat dissipation structure according to one embodiment is shown. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0023] Please refer to Figure 1 This invention provides an optimization method for a nanodiamond-copper gradient composite heat dissipation structure, the method comprising:

[0024] Step 100: Determine the three-dimensional geometric model of the nanodiamond copper gradient composite heat dissipation structure based on the initial geometric parameters of the nanodiamond copper gradient composite heat dissipation structure.

[0025] Step 102: Assign the preset material properties to the three-dimensional geometric model to obtain the simulation model of the nanodiamond copper gradient composite heat dissipation structure;

[0026] Step 104: Based on the simulation model, determine the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters;

[0027] Step 106: Update the initial geometric parameters and repeat steps 100 to 106 until the optimization objective of the objective function is greater than the first preset value, thus obtaining the optimal geometric parameters.

[0028] In this embodiment, based on initial geometric parameters (including the porosity of the nanodiamond framework, the thickness ratio of the titanium-copper gradient interface layer, and the distribution density of the copper-filled layer), the present invention constructs a three-layer gradient three-dimensional geometric model comprising an inner diamond framework, a middle titanium-copper gradient interface, and an outer copper-filled layer, defining the spatial structure and dimensional relationships of each functional layer. Furthermore, material properties are assigned to the model, including the thermal conductivity of each layer (e.g., the diamond framework layer can reach 1500-2000 W / m). By utilizing key parameters such as K, elastic modulus, and Poisson's ratio, the geometric model is transformed into a quantifiable simulation model. Based on this simulation model, the thermal conductivity of the structure under the initial parameter combination can be calculated using finite element thermal analysis and other methods, intuitively reflecting the benchmark of heat dissipation performance. Then, by dynamically updating the geometric parameters (such as adjusting the interface layer thickness gradient and optimizing the pore distribution of the skeleton), the modeling and assignment are repeatedly executed until the optimization objective of the objective function exceeds a first preset threshold, ultimately outputting the optimal combination of geometric parameters that balances high heat dissipation performance and engineering practicality. Thus, this invention effectively replaces traditional empirical design, achieving an improvement in the heat dissipation performance of the nanodiamond copper gradient composite heat dissipation structure.

[0029] In one embodiment of the present invention, the three-dimensional geometric model includes a nanodiamond framework layer, a titanium-copper gradient interface layer, and a copper filling layer.

[0030] The nanodiamond framework layer is the innermost layer of the three-dimensional geometric model;

[0031] The middle layer of the 3D geometric model of the titanium-copper gradient interface layer;

[0032] The copper filler layer is the outermost layer of the three-dimensional geometric model;

[0033] The preset material properties include the performance parameters of the nanodiamond framework layer, the titanium-copper gradient interface layer, and the copper filler layer.

[0034] Performance parameters include thermal conductivity, elastic modulus, and Poisson's ratio.

[0035] In this embodiment, the three-dimensional geometric model of the nanodiamond-copper gradient composite heat dissipation structure adopts a layered design, including a nanodiamond framework layer, a titanium-copper gradient interface layer, and a copper filling layer. The nanodiamond framework layer is located at the innermost layer of the model; the ultra-high thermal conductivity of nanodiamond serves as a rapid heat transfer carrier. The titanium-copper gradient interface layer is located in the middle layer; through the gradient ratio of titanium and copper, it alleviates the difference in thermal expansion coefficients between the inner and outer layers, reducing interface stress. The copper filling layer, as the outermost layer, both assists in the outward diffusion of heat and provides stable support for the overall structure. The preset material properties specifically include the thermal conductivity (a core indicator determining thermal conductivity efficiency), elastic modulus (affecting the structure's resistance to thermal deformation), and Poisson's ratio (related to interface stability under thermal cycling) of each layer, ensuring that the three-dimensional geometric model can accurately reflect the thermal and mechanical properties of the structure, thereby improving the accuracy of the simulation.

[0036] In one embodiment of the present invention, the thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under initial geometric parameters is determined according to a simulation model, including:

[0037] The simulation model is meshed to obtain a meshed simulation model; wherein, the twist of the mesh in the meshed simulation model is set to be less than a second preset value and the aspect ratio of the mesh is less than a third preset value.

[0038] The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under initial geometric parameters was determined by using a simulation model after mesh generation.

[0039] In this embodiment, the completed simulation model is first meshed. Finite element method (FEM) discretization is used to decompose the model into computable mesh elements, forming the meshed simulation model. To avoid mesh quality affecting the accuracy of heat conduction calculations, key mesh parameters must be strictly controlled: mesh distortion must be set to less than a second preset value (e.g., ≤0.4) to prevent deviations in heat transfer path calculations due to mesh shape distortion; the mesh aspect ratio must be controlled to less than a third preset value (e.g., ≤5) to ensure that the heat conduction pattern along the structural gradient is captured. After meshing, heat conduction simulation is performed based on the high-quality mesh model. By calculating the heat transfer efficiency in the three-layer gradient structure, the thermal conductivity of the heat dissipation structure corresponding to the initial geometric parameters is finally determined.

[0040] In one embodiment of the present invention, before determining the thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under initial geometric parameters based on a simulation model, the method further includes:

[0041] A constant heat flux density is applied to the heat source surface of the meshed simulation model. The initial temperature is set to 25 degrees Celsius. The constant heat flux density corresponds to the heat flux density of the high-power chip.

[0042] The heat dissipation surface of the simulation model after mesh generation adopts a convective heat transfer boundary to simulate the corresponding natural cooling of air.

[0043] In this embodiment, to ensure that the calculated thermal conductivity closely matches the actual heat dissipation scenario of the high-power chip, targeted boundary condition settings must be completed before determining the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters based on the simulation model. Specifically, for the simulation model after mesh generation, a constant heat flux density is first applied to its heat source surface (corresponding to the contact interface between the chip and the heat dissipation structure). This heat flux density needs to accurately match the actual heat generation intensity of the high-power chip (e.g., a typical value of 100-200 W / cm²). At the same time, the initial temperature of the model is uniformly set to 25℃ to simulate the chip's startup working environment at room temperature. Secondly, convective heat transfer boundary conditions are adopted on the heat dissipation surface of the model (corresponding to the contact interface between the heat dissipation structure and the external environment). By setting a reasonable convective heat transfer coefficient (e.g., 5-15 W / (m²) under natural air cooling), K)) to realistically reproduce the process of heat diffusion to the outside through air flow, in order to simulate the real heat conduction process and improve the accuracy of the simulation.

[0044] In one embodiment of the present invention, the objective function is determined by the following formula:

[0045]

[0046] In the formula, To optimize the objective, The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure is... This represents the upper limit of thermal conductivity. This is the industry average cost benchmark. This refers to the unit manufacturing cost, which is determined based on the initial geometric parameters. This is the target lifespan value. For thermal cycle life, For volume utilization, The target value for volume utilization rate, The set of variables includes the thermal conductivity, unit manufacturing cost, thermal cycle life, and volume utilization of the nanodiamond-copper gradient composite heat dissipation structure. For the set of ideal values, This represents the maximum permissible deviation for each parameter. The number of evaluation parameters.

[0047] In this embodiment, the objective function is adapted to general high-power chip scenarios, incorporating volume utilization to achieve four-dimensional balance: "Volume utilization" (an indicator reflecting material density) is listed alongside thermal conductivity, cost, and lifespan, each with a 25% weight. This addresses the problem of traditional methods neglecting the "increased thermal resistance due to internal material porosity," ensuring the composite material is sufficiently dense (volume utilization ≥ 90%) and avoiding situations where "thermal conductivity meets simulation standards but fails in actual use." An objective distance correction term is added: An innovative addition... This is used to limit the deviation of a single indicator from the ideal value. If a certain indicator (such as cost) deviates significantly from the ideal value, this target distance correction term will greatly reduce the final score. For example, when the cost deviates from the ideal value by 15 yuan / kg, the score may drop from 0.95 to 0.6. This effectively prevents the selection of a solution with "single indicator imbalance", solves the problem of "insensitivity to parameter deviation" of traditional linear formulas, and achieves balanced optimization with all four indicators performing well.

[0048] In one embodiment of the present invention, the objective function is determined by the following formula:

[0049]

[0050] In the formula, To optimize the objective, The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure is... This represents the upper limit of thermal conductivity. This is the industry average cost benchmark. This refers to the unit manufacturing cost, which is determined based on the initial geometric parameters. This is the target lifespan value. For thermal cycle life, The first preset weighting coefficient, This is the second preset weighting coefficient. The third preset weighting coefficient, The penalty coefficient is... This is a penalty item.

[0051] In this embodiment, the objective function is adapted to military and automotive electronics scenarios, replacing the traditional reliability index: "thermal cycle life" (i.e., the number of cycles a material undergoes before its first failure) is used as the reliability index, replacing the traditional delamination rate. This directly aligns with the military and automotive electronics requirement of "1500 cycles between -55℃ and 125℃ without failure," resolving the contradiction of traditional methods where "delamination rate meets the standard but lifespan is insufficient." A tiered penalty rule is designed: an innovative "differentiated penalty" mechanism is proposed, giving different penalties based on the degree of violation of different indicators. If the lifespan is less than 1000 cycles, a significant deduction is made, resulting in elimination; if only the thermal conductivity is slightly lower or the cost is slightly higher, only a small number of points are deducted, allowing for subsequent fine-tuning. This ensures the core lifespan requirement without mistakenly eliminating some excellent solutions with only minor non-compliance, as in existing technologies. A lifespan upper limit is set to avoid waste: when the lifespan exceeds 1500 cycles, no additional points are added. This is to prevent excessively increasing the thickness of the titanium layer in pursuit of "2000 or even higher lifespans". An excessively thick titanium layer would increase the cost by more than 10%. This design can find a balance between "long lifespan" and "controllable cost", avoiding the loss of cost control due to blindly pursuing ultra-high lifespan.

[0052] like Figure 2 , Figure 3 As shown, this invention provides an optimized device for a nanodiamond-copper gradient composite heat dissipation structure. The device can be implemented via software, hardware, or a combination of both. From a hardware perspective, as... Figure 2 The diagram shown is a hardware architecture diagram of an electronic device containing an optimized device for a nanodiamond-copper gradient composite heat dissipation structure according to an embodiment of the present invention. (Except for...) Figure 2 In addition to the processor, memory, network interface, and non-volatile memory shown, the electronic device in the embodiment may also include other hardware, such as a forwarding chip responsible for processing packets. Taking software implementation as an example, such as... Figure 3 As shown, a device in a logical sense is formed by the CPU of the electronic device in which it is located reading the corresponding computer program from the non-volatile memory into the memory for execution.

[0053] like Figure 3 As shown, this embodiment provides an optimized device for a nanodiamond copper gradient composite heat dissipation structure, comprising:

[0054] The first data processing module 300 is used to execute: Step 100: Determine the three-dimensional geometric model of the nano-diamond copper gradient composite heat dissipation structure based on the initial geometric parameters of the nano-diamond copper gradient composite heat dissipation structure.

[0055] The second data processing module 302 is used to execute: Step 102: Assign the preset material properties to the three-dimensional geometric model to obtain the simulation model of the nano-diamond copper gradient composite heat dissipation structure.

[0056] The third data processing module 304 is used to perform: Step 104: Determine the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model;

[0057] The fourth data processing module 306 is used to perform: Step 106: Update the initial geometric parameters, and re-execute steps 100 to 106 until the optimization objective of the objective function is greater than the first preset value, so as to obtain the optimal geometric parameters.

[0058] In one embodiment of the present invention, the three-dimensional geometric model includes a nanodiamond framework layer, a titanium-copper gradient interface layer, and a copper filling layer;

[0059] The nanodiamond framework layer is the innermost layer of the three-dimensional geometric model;

[0060] The titanium-copper gradient interface layer is the middle layer of the three-dimensional geometric model;

[0061] The copper filler layer is the outermost layer of the three-dimensional geometric model;

[0062] The preset material properties include the performance parameters of the nanodiamond framework layer, the titanium-copper gradient interface layer, and the copper filling layer;

[0063] The performance parameters include thermal conductivity, elastic modulus, and Poisson's ratio.

[0064] In one embodiment of the present invention, the third data processing module 304 is configured to perform the following operations:

[0065] The step of determining the thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under the initial geometric parameters based on the simulation model includes:

[0066] The simulation model is meshed to obtain a meshed simulation model; wherein, the twist of the mesh in the meshed simulation model is set to be less than a second preset value and the aspect ratio of the mesh is less than a third preset value.

[0067] The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure under the initial geometric parameters was determined by using the simulation model after mesh partitioning.

[0068] In one embodiment of the present invention, the device further includes a fifth data processing module, which is configured to perform the following operations:

[0069] A constant heat flux density is applied to the heat source surface of the simulation model after meshing, with the initial temperature set to 25 degrees Celsius. The constant heat flux density corresponds to the heat flux density of the high-power chip.

[0070] The heat dissipation surface of the simulation model after meshing adopts a convective heat transfer boundary to simulate the corresponding natural cooling of air.

[0071] In one embodiment of the present invention, the objective function is determined by the following formula:

[0072]

[0073] In the formula, For the optimization objective, The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure is given by [reference to thermal conductivity]. This represents the upper limit of thermal conductivity. This is the industry average cost benchmark. The unit manufacturing cost is determined based on the initial geometric parameters. This is the target lifespan value. For thermal cycle life, For volume utilization, The target value for volume utilization rate, The set of variables includes the thermal conductivity, unit manufacturing cost, thermal cycle life, and volume utilization rate of the nanodiamond copper gradient composite heat dissipation structure. For the set of ideal values, This represents the maximum permissible deviation for each parameter. The number of evaluation parameters.

[0074] In one embodiment of the present invention, the objective function is determined by the following formula:

[0075]

[0076] In the formula, For the optimization objective, The thermal conductivity of the nanodiamond-copper gradient composite heat dissipation structure is given by [reference to thermal conductivity]. This represents the upper limit of thermal conductivity. This is the industry average cost benchmark. The unit manufacturing cost is determined based on the initial geometric parameters. This is the target lifespan value. For thermal cycle life, The first preset weighting coefficient, This is the second preset weighting coefficient. The third preset weighting coefficient, The penalty coefficient is... This is a penalty item.

[0077] It is understood that the structures illustrated in the embodiments of the present invention do not constitute a specific limitation on the optimization device for a nanodiamond copper gradient composite heat dissipation structure. In other embodiments of the present invention, an optimization device for a nanodiamond copper gradient composite heat dissipation structure may include more or fewer components than illustrated, or combine some components, or split some components, or arrange different components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0078] The information interaction and execution process between the modules in the above-mentioned device are based on the same concept as the method embodiment of the present invention, and the specific details can be found in the description of the method embodiment of the present invention, and will not be repeated here.

[0079] This invention also provides an electronic device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements an optimization method for a nanodiamond copper gradient composite heat dissipation structure according to any embodiment of this invention.

[0080] This invention also provides a computer-readable storage medium storing a computer program. When executed by a processor, the computer program causes the processor to perform an optimization method for a nanodiamond copper gradient composite heat dissipation structure according to any embodiment of this invention.

[0081] Specifically, a system or apparatus equipped with a storage medium may be provided, on which software program code implementing the functions of any of the embodiments described above is stored, and the computer (or CPU or MPU) of the system or apparatus may read and execute the program code stored in the storage medium.

[0082] In this case, the program code read from the storage medium can itself implement the function of any of the above embodiments, and therefore the program code and the storage medium storing the program code constitute part of the present invention.

[0083] Storage media embodiments for providing program code include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), magnetic tapes, non-volatile memory cards, and ROMs. Alternatively, program code can be downloaded from a server computer via a communication network.

[0084] Furthermore, it should be clear that not only can the program code read by the computer be executed, but also the operating system or other components operating on the computer can be instructed based on the program code to perform some or all of the actual operations, thereby realizing the function of any of the embodiments described above.

[0085] Furthermore, it is understood that the program code read from the storage medium is written to the memory set in the expansion board inserted into the computer or to the memory set in the expansion module connected to the computer. Then, based on the instructions of the program code, the CPU or other components installed on the expansion board or expansion module execute some and all of the actual operations, thereby realizing the functions of any of the embodiments described above.

[0086] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0087] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as ROM, RAM, magnetic disk, or optical disk.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for optimizing a nano-diamond copper gradient composite heat dissipation structure, characterized in that, The method comprises the steps of: Step 100: determining a three-dimensional geometric model of a nanodiamond copper gradient composite heat dissipation structure according to initial geometric parameters of the nanodiamond copper gradient composite heat dissipation structure; Step 102: assigning preset material properties to the three-dimensional geometric model to obtain a simulation model of the nanodiamond copper gradient composite heat dissipation structure; Step 104: determining the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model; Step 106: updating the initial geometric parameters, and re-executing steps 100-106 until the optimization target of the target function is greater than a first preset value to obtain optimal geometric parameters; the three-dimensional geometric model comprises a nanodiamond skeleton layer, a titanium copper gradient interface layer, and a copper filling layer; The nanodiamond skeleton layer is the innermost layer of the three-dimensional geometric model; The titanium copper gradient interface layer is the middle layer of the three-dimensional geometric model; The copper filling layer is the outermost layer of the three-dimensional geometric model; The preset material properties include performance parameters of the nanodiamond skeleton layer, the titanium copper gradient interface layer, and the copper filling layer; The performance parameters include thermal conductivity, elastic modulus, and Poisson's ratio; The target function is determined by the following formula: In the formula, is the optimization target, is the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure, is the upper limit of the thermal conductivity, is the industry average cost benchmark value, is the unit manufacturing cost, which is determined according to the initial geometric parameters, is the life target value, is the thermal cycle life, is the volume utilization rate, is the volume utilization rate target value, is a variable set, which includes the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure, the unit manufacturing cost, the thermal cycle life and the volume utilization rate, is an ideal value set, is the maximum allowable deviation of each parameter, is the number of evaluation parameters; Or, the target function is determined by the following formula: In the formula, is the optimization target, is the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure, is the upper limit of the thermal conductivity, is the industry average cost benchmark value, is the unit manufacturing cost, which is determined according to the initial geometric parameters, is the life target value, is the thermal cycle life, is the first preset weight coefficient, is the second preset weight coefficient, is the third preset weight coefficient, is the penalty coefficient, is the penalty term.

2. The method of claim 1, wherein, The determination of the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model comprises: performing mesh division on the simulation model to obtain a mesh-divided simulation model; wherein the twist degree of the mesh in the mesh-divided simulation model is set to be less than a second preset value, and the width-length ratio of the mesh is set to be less than a third preset value; performing simulation simulation on the mesh-divided simulation model to determine the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters.

3. The method of claim 2, wherein, Before the determination of the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model, the method further comprises: applying a constant heat flux density to the heat source surface of the mesh-divided simulation model, and setting the initial temperature to 25 degrees Celsius, wherein the constant heat flux density corresponds to the heat flux density of a high-power chip; using a convective heat exchange boundary on the heat dissipation surface of the mesh-divided simulation model to simulate corresponding air natural cooling.

4. An optimization device of a nanodiamond copper gradient composite heat dissipation structure, characterized in that, The method comprises the steps of: a first data processing module for performing step 100: determining a three-dimensional geometric model of a nanodiamond copper gradient composite heat dissipation structure according to initial geometric parameters of the nanodiamond copper gradient composite heat dissipation structure; a second data processing module for performing step 102: assigning preset material properties to the three-dimensional geometric model to obtain a simulation model of the nanodiamond copper gradient composite heat dissipation structure; a third data processing module for performing step 104: determining the thermal conductivity of the nanodiamond copper gradient composite heat dissipation structure under the initial geometric parameters according to the simulation model; A fourth data processing module, configured to perform: step 106: updating the initial geometric parameters, and re-executing steps 100-106 until the optimization target of the target function is greater than a first preset value, to obtain optimal geometric parameters.

5. An electronic device, comprising: A computer program product, comprising a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the method according to any one of claims 1-3.

6. A computer readable storage medium characterized by, A computer program product, comprising a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the method according to any one of claims 1-3.

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