A vertical wire arc forming method and forming device for a full-automatic wire bonding machine

Abstract

The present application relates to a kind of semiconductor packaging method, especially a vertical wire arc forming method and forming device of full-automatic wire bonding machine.The method includes the following steps: wire tail is placed to form wire tail, fixed laser is used to form ablation gap on wire, and wire is collected to form burn ball wire tail;Burn ball is used to form metal solder ball;Solder ball planting is used to make metal solder ball welded and fixed on substrate pad;Vertical wire arc is pulled to pull out the vertical wire arc of specified height on substrate;New wire tail is left.The wire gap obtained by the method is not generated by the pressure of the wire by the splitting knife porcelain nozzle and the welding position, but the high-energy laser beam generated by the laser is directly ablated on the wire, so the quality and use of the porcelain nozzle head will not affect the formation of the wire gap;The overall vertical degree of wire is high, and the neck of wire arc will not be bent and inclined, and the quality of vertical wire arc is good;It does not need to be welded secondly, and the efficiency of arc welding is high.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor packaging method, in particular to a vertical wire arc forming method and forming device of a full-automatic wire bonder. BACKGROUND

[0002] The gold ball wire bonder first completes the pre-preparation, loads the wire and calibrates the porcelain nozzle, positions the chip substrate through the visual system, sets the parameters such as the temperature of the heating table and the ultrasonic power. The wire end extends out of the porcelain nozzle, the electrode of the ball melting device discharges to generate an electric arc, which is melted into a metal solder ball; the porcelain nozzle moves downward to drive the metal solder ball to adhere to the substrate and apply pressure, under the combined action of heating, ultrasonic wave and pressure, the wire and the pad metal atomically diffuse to form a welding point, after the pressure stops to solidify the welding point, the wire arc welding is completed. This welding method is commonly used for ordinary wire arc welding.

[0003] However, the packaging technology develops towards the stacked packaging direction, which puts forward new requirements for the wire arc form; the ordinary wire arc can only meet the two-dimensional planar welding packaging requirements, so the vertical wire arc with a certain height in the three-dimensional space is in urgent need for the stacked packaging.

[0004] At present, a vertical wire arc welding method is to use a similar conventional welding method to directly complete the first welding point on the wafer welding point, but the second welding point is not welded, only the porcelain nozzle is used to press the wire out of the gap, then the vertical wire arc is pulled out and the wire is pulled off at the gap to form a new wire tail.

[0005] Another vertical wire arc welding method is to set an additional pressing position outside the wafer pad, the height of which is between the wire tail end and the set bending height; a long wire tail is left, then the additional pressing position is moved, the long wire tail is bent by using the height difference between the wire tail end and the pressing position, and the porcelain nozzle is used to press the bent wire at the additional pressing position, the wire at the bending height is pressed out of the gap, then the wire is collected, the ball is melted, one welding is completed, the vertical wire arc is pulled out upward and the wire is pulled off at the gap to form a new wire tail.

[0006] The current vertical wire arc forming method has the following disadvantages:

[0007] The first welding method uses a similar conventional wire bonding method, which will pull the arc after one welding, which will cause the neck of the wire arc to bend; when using this method to weld the vertical wire arc, it is easy to bend and tilt; in addition, due to the existence of the action similar to two weldings, a certain space is needed to execute, which may be limited by the size of the wafer, there may be no gap pressing position, and the vertical wire arc cannot be welded.

[0008] Another welding method avoids the wafer size limitation of wire pressing gap, there is no similar two-welding action, and the wire arc neck bending problem can be improved, but the wire gap is generated by the bending and pressing of the porcelain nozzle, and the process has high requirements for the quality of the porcelain nozzle. If the bending and pressing of the wire by the porcelain nozzle is insufficient, the new wire tail will retract into the porcelain nozzle when the wire tail is broken, the wire tail length will be shortened, and the wire tail length will be unstable; if the bending and pressing of the wire by the porcelain nozzle is too large, the wire is pressed too much, the size of the wire at the gap position is larger than the specified deformation degree, and the wire collection is not smooth; if the bending and pressing of the wire by the porcelain nozzle is too large, the wire is pressed too much, and even the size of the wire at the gap position is larger than the diameter of the porcelain nozzle, which blocks the porcelain nozzle during the wire collection process.

[0009] The wire gap of the above two methods is generated by the pressing of the wire by the porcelain nozzle and the welding position, therefore the quality and use of the porcelain nozzle head will affect the shape of the wire gap, finally leading to unstable wire arc height, and even the gap is too shallow, the first welding point is peeled off from the welding pad during the wire tail breaking stage, and the vertical wire arc welding fails. SUMMARY

[0010] To solve the above problems, the present application provides a vertical wire arc forming method of a full-automatic wire bonding machine, and the specific technical scheme is as follows:

[0011] A vertical wire arc forming method of a full-automatic wire bonding machine, comprising the following steps: wire tail releasing: extending a wire from the chopper ceramic nozzle to form a wire tail; fixed laser gap forming: starting the laser, irradiating the wire at the focal point, making the irradiated part of the wire melt, ablate and evaporate, finally forming an ablation gap on the wire, and reducing the mechanical strength of the position; wire collection: collecting the wire tail including a part of the wire weakened by laser ablation into the chopper ceramic nozzle to form a ball burn wire tail; ball burning: starting the discharge ball burning device to generate a high-temperature arc to rapidly melt the ball burn wire tail into a metal solder ball; solder ball implanting: the chopper ceramic nozzle carries the metal solder ball to press and fit the substrate and apply pressure, and under the combined action of heating, ultrasonic wave and pressure, the metal solder ball is welded and fixed on the substrate welding point; vertical wire arc drawing: the chopper ceramic nozzle moves vertically upward by a certain height to draw a vertical wire arc of a specified height on the substrate; new wire tail leaving: starting the clamping device to break the wire arc, leaving the metal solder ball and the vertical wire arc on the substrate, and leaving a new wire tail at the chopper ceramic nozzle to prepare for the next welding point.

[0012] Preferably, when the wire tail is released, the upper clamping device is opened, the lower clamping device clamps the wire and drives the wire to pass through the transducer and the tip of the chopper ceramic nozzle, and the wire tail is formed by the wire extending out of the chopper ceramic nozzle by a certain length.

[0013] Preferably, when the fixed laser gap is formed, the lower clamping device clamps and moves the wire tail to the focal point of the laser, and then starts the laser to form an ablation gap on the wire by laser ablation.

[0014] Preferably, when the wire is collected, the laser stops working, the upper clamping device clamps the wire, the lower clamping device releases the wire, and the lower clamping device, the transducer and the ceramic nozzle of the cleaver are all moved downward to the set position.

[0015] Then the upper clamping device releases the wire, the lower clamping device clamps the wire and drives the wire to rise, so that the length of the wire tail formed at the tip of the ceramic nozzle of the cleaver is shortened to become a solder ball tail, and the end of the solder ball tail is consistent with the height of the discharge solder ball device.

[0016] Preferably, when the solder ball is burned, the discharge solder ball device is started, the air between the discharge solder ball device and the wire is broken by high voltage, and a high-temperature arc is generated to rapidly melt the metal of the solder ball tail and form a metal solder ball after cooling.

[0017] Preferably, when the solder ball is welded, the upper clamping device, the lower clamping device, the transducer and the ceramic nozzle of the cleaver are moved above the substrate, the upper clamping device and the lower clamping device release the wire, the ceramic nozzle of the cleaver drives the metal solder ball to move downward to the substrate and press the metal solder ball on the substrate, and then the transducer starts to weld the metal solder ball on the substrate.

[0018] Preferably, when the vertical wire arc is drawn, the lower clamping device, the ceramic nozzle of the cleaver and the transducer are all moved upward, so that a long wire tail of a set length is left at the tip of the ceramic nozzle of the cleaver, and a vertical wire arc is formed between the ablation notch on the long wire tail and the metal solder ball.

[0019] Preferably, when the new wire tail is left, the upper clamping device releases the wire, the lower clamping device clamps the wire, the lower clamping device, the transducer and the ceramic nozzle of the cleaver are all moved upward, the long wire tail is pulled upward, and the long wire tail is broken from the ablation notch after being stressed, so that the metal solder ball and the vertical wire arc are erected and fixed on the substrate, and the broken long wire tail forms a new wire tail.

[0020] A vertical wire arc forming device of a full-automatic wire welding machine, comprising, from top to bottom, an upper clamping device, a lower clamping device, a transducer, a ceramic nozzle of a cleaver, a substrate, and further comprising discharge solder ball devices located on both sides of the ceramic nozzle of the cleaver and a laser.

[0021] Compared with the prior art, the present application has the following beneficial effects:

[0022] 1. The wire arc notch obtained by the method is not generated by the ceramic nozzle of the cleaver and the soldering position pressing the wire, but is directly ablated on the wire by the high-energy laser beam generated by the laser, so that the quality and use of the ceramic nozzle head do not affect the formation of the wire notch.

[0023] 2. The wire gap forming process does not have a wire bending action, requires small space for forming wire gap, is suitable for various specifications of wafer pads, and has high verticality of the whole wire, without bending and tilting of the wire neck, and has good vertical wire arc quality;

[0024] 3. The method does not need secondary welding, and can directly form a vertical wire arc after primary welding, with high arc welding efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a flowchart of the method of the present application;

[0026] Figure 2 is a structural schematic diagram of the device of the present application;

[0027] Figure 3 is a schematic diagram of a wire tail;

[0028] Figure 4 is a schematic diagram of a fixed laser gap forming preparation process;

[0029] Figure 5 is a schematic diagram of a fixed laser gap forming state;

[0030] Figure 6 is a schematic diagram of forming an ablation gap;

[0031] Figure 7 is a schematic diagram of wire collection;

[0032] Figure 8 is a schematic diagram of forming a ball burning wire tail;

[0033] Figure 9 is a schematic diagram of a ball burning;

[0034] Figure 10 is a schematic diagram of welding a ball;

[0035] Figure 11 is a schematic diagram of pulling a vertical wire arc;

[0036] Figure 12 is a schematic diagram of leaving a new wire tail.

[0037] In the figure: 1, wire; 101, wire tail; 102, ablation gap; 103, metal soldering ball; 104, ball burning wire tail; 105, long wire tail; 106, vertical wire arc; 2, upper clamping device; 3, lower clamping device; 4, transducer; 5, discharge ball burning device; 6, cleaver ceramic nozzle; 7, laser; 8, substrate. DETAILED DESCRIPTION

[0038] The present application will be further described with reference to the accompanying drawings.

[0039] After leaving the height of the long tail of the vertical line arc welding required, the wire is driven to the position of the laser focal point by the split knife porcelain nozzle, and the laser is started to emit a high-energy-density laser beam to irradiate the material surface at the height of the vertical line arc required in the wire, which makes the temperature of the material surface at the height of the vertical line arc required in the wire rise, and phenomena such as melting, ablation, and evaporation occur, finally forming a notch on the wire tail, weakening the mechanical strength of the wire at the height of the vertical line arc required. Then the wire is collected, the height of the wire tail is shortened to the height of the soldering ball, the soldering ball device is started to quickly melt the soldering ball wire tail into a metal soldering ball; the split knife porcelain nozzle carries the metal ball to press and fit the substrate and applies pressure, and under the combined action of heating, ultrasonic wave and pressure, the soldering ball is welded and fixed on the substrate welding point to complete one welding; after the split knife porcelain nozzle returns to the position above the substrate, the lead wire is clamped and pulled out to leave a long tail for the next welding point.

[0040] As shown in Figures 1 to 12 A vertical line arc forming method of a full-automatic wire welding machine, comprising the following steps:

[0041] Wire tail leaving: a section of wire 1 is extended from the split knife porcelain nozzle 6 to form a wire tail 101;

[0042] Laser notch making: the laser 7 is started to irradiate the wire 1 at the focal point, so that the irradiated part of the wire 1 melts, ablates and evaporates, finally forming an ablation notch 102 on the wire 1, reducing the mechanical strength of the position;

[0043] Wire collecting: part of the wire 1 including the weakened part ablated by the laser in the wire tail 101 is retracted into the split knife porcelain nozzle 6 to form a soldering ball wire tail 104;

[0044] Soldering ball making: the discharge soldering ball device 5 is started to generate a high-temperature arc to quickly melt the soldering ball wire tail 104 into a metal soldering ball 103;

[0045] Soldering ball welding: the split knife porcelain nozzle 6 carries the metal soldering ball 103 to press and fit the substrate 8 and applies pressure, and under the combined action of heating, ultrasonic wave and pressure, the metal soldering ball 103 is welded and fixed on the substrate 8 welding point;

[0046] Vertical line arc 106 drawing: the split knife porcelain nozzle 6 moves vertically upward by a certain height to draw a vertical line arc 106 of a specified height on the substrate 8;

[0047] New wire tail 101 leaving: the clamping device is started to break the wire arc, leaving the metal soldering ball and the vertical line arc 106 on the substrate 8, and leaving a new wire tail 101 at the split knife porcelain nozzle 6 for the next welding point welding.

[0048] As shown in Figure 2As shown in the figure, a vertical line arc forming device of a full-automatic wire welding machine includes an upper clamping device 2, a lower clamping device 3, a transducer 4, a cleaver porcelain nozzle 6 arranged in sequence from top to bottom, and a laser 7 fixed at the right side of the cleaver porcelain nozzle 6. The wire 1 passes through the upper clamping device 2, the lower clamping device 3, the transducer 4, and the cleaver porcelain nozzle 6, and can move up and down freely when the upper clamping device 2 and the lower clamping device 3 are both open. The upper clamping device 2 is fixedly installed and the height is constant. The lower clamping device 3, the transducer 4, and the cleaver porcelain nozzle 6 are driven by a bonding head device (not shown) to move up and down. The laser 7 is fixed and far away from the right side of the cleaver porcelain nozzle 6.

[0049] Specifically, as shown in the figure, when the wire is unwound, the upper clamping device 2 releases the wire 1, the lower clamping device 3 clamps the wire 1 and drives the wire 1 to move downward, so that the wire 1 passes through the transducer 4 and the tip of the cleaver porcelain nozzle 6. Then the lower clamping device 3 is opened and returns to the original height, so that the wire 1 extends from the end of the cleaver porcelain nozzle 6 and leaves a wire tail 101 with a set length between the end of the cleaver porcelain nozzle 6 and the wire tail 101. Figure 3

[0050] The wire tail 101 can be obtained after the last welding.

[0051] As shown in the figure, when the laser is fixed to make a notch, the bonding head drives the wire 1, the upper clamping device 2, the lower clamping device 3, the transducer 4, the discharge ball burning device 5, and the cleaver porcelain nozzle 6 to move towards the laser 7, and to be close to the fixed laser 7, so that the wire tail 101 stops at the laser focal point position in front of the laser 7. Figure 4

[0052] As shown in the figures, the laser 7 starts to work and emits a high-energy laser beam 701 forwardly. The laser beam 701 irradiates the wire 1 at the focal point, which causes the irradiated part of the wire 1 to melt, ablate, and evaporate, and finally forms an ablation notch 102 on the wire 1, reducing the mechanical strength of the position. Figure 5 Figure 6 As shown in the figure, when the wire is wound, the laser 7 stops working; the upper clamping device 2 clamps the wire 1, the lower clamping device 3 releases the wire 1, the bonding head drives the lower clamping device 3, the transducer 4, and the cleaver porcelain nozzle 6 to move downward, and the wire 1 moves upward relative to the inside of the transducer 4 and the cleaver porcelain nozzle 6.

[0053] As shown in the figure, when the wire is wound, the laser 7 stops working; the upper clamping device 2 clamps the wire 1, the lower clamping device 3 releases the wire 1, the bonding head drives the lower clamping device 3, the transducer 4, and the cleaver porcelain nozzle 6 to move downward, and the wire 1 moves upward relative to the inside of the transducer 4 and the cleaver porcelain nozzle 6. Figure 7 As shown in the figure, when the wire is wound, the laser 7 stops working; the upper clamping device 2 clamps the wire 1, the lower clamping device 3 releases the wire 1, the bonding head drives the lower clamping device 3, the transducer 4, and the cleaver porcelain nozzle 6 to move downward, and the wire 1 moves upward relative to the inside of the transducer 4 and the cleaver porcelain nozzle 6.

[0054] Figure 8 ​​​​As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5.

[0055] As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5. Figure 9 As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5.

[0056] As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5. Figure 10 As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5.

[0057] As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5. Figure 11 The length of the long tail 105 is the length of the vertical arc 106 plus the length of the new tail 101.

[0058]

[0059] As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5. Figure 12 As shown, when the chisel ceramic nozzle 6 is lowered to a specified height, the upper clamping device 2 releases the wire 1, and the lower clamping device 3 clamps the wire 1 and returns to the original height, so that the wire 1 between the chisel ceramic nozzle 6 and the end of the chisel ceramic nozzle (the tip) is shortened to form a ball burn-off tail 104, and the end of the ball burn-off tail 104 is pulled up to the same height as the electrode of the discharge ball burning device 5.

[0060] ​The technical principles of the present application are described above in combination with specific embodiments. These descriptions are only for explaining the principles of the present application, and cannot be interpreted as limiting the protection scope of the present application in any way. Based on the explanations herein, other specific embodiments of the present application can be conceived by those skilled in the art without any creative effort, and these embodiments will all fall within the protection scope of the claims of the present application.

Claims

1. A vertical wire arc forming method of a full-automatic wire bonding machine, characterized by, The method comprises the following steps: wire tail: a section of wire (1) is extended from the chopper ceramic nozzle (6) to form a wire tail (101); laser fixing and notching: the laser (7) is started to irradiate the wire (1) at the focal point, so that the irradiated part of the wire (1) is fused, ablated and evaporated, and finally an ablation notch (102) is formed on the wire (1) to reduce the mechanical strength of the position; wire collection: the wire tail (101) including the weakened part ablated by the laser is collected into the chopper ceramic nozzle (6) to form a solder ball wire tail (104); solder ball: the discharge solder ball device (5) is started to generate a high-temperature arc to rapidly melt the solder ball wire tail (104) into a metal solder ball (103); soldering and planting the ball: the chopper ceramic nozzle (6) carries the metal solder ball (103) to press and adhere to the substrate (8) and apply pressure, so that the metal solder ball (103) is welded and fixed on the substrate (8) under the combined action of heating, ultrasonic wave and pressure; vertical line arc (106) pulling: the chopper ceramic nozzle (6) is vertically moved upward by a certain height to pull out a vertical line arc (106) of a specified height on the substrate (8); new wire tail (101) leaving: the clamping device is started to pull off the wire arc and leave the metal solder ball and the vertical line arc (106) on the substrate (8), and a new wire tail (101) is left at the chopper ceramic nozzle (6) to prepare for the next soldering.

2. The vertical wire arc forming method of claim 1, wherein, When the wire tail is released, the upper clamping device (2) is opened, the lower clamping device (3) clamps the wire (1) and drives the wire (1) downward through the transducer (4) and the tip of the chopper ceramic nozzle (6), and a certain length of the wire (1) extending out of the chopper ceramic nozzle (6) forms the wire tail (101).

3. The vertical wire arc forming method of claim 1, wherein, When the laser fixing and notching is fixed, the lower clamping device (3) clamps and moves the wire tail (101) to the focal point position of the laser (7) in cooperation with the chopper ceramic nozzle (6), and then the laser (7) is started to form the ablation notch (102) on the wire (1) by laser ablation.

4. The method of claim 1, wherein the vertical wire arc forming is performed by a full-automatic wire bonding machine. When the wire is collected, the laser (7) stops working, the upper clamping device (2) clamps the wire (1), the lower clamping device (3) releases the wire (1), and the lower clamping device (3), the transducer (4) and the chopper ceramic nozzle (6) are all moved downward to the set position; Then the upper clamping device (2) releases the wire (1), the lower clamping device (3) clamps the wire (1) and drives the wire (1) to rise, so that the length of the wire tail (101) formed at the tip of the chopper ceramic nozzle (6) is shortened to become the solder ball wire tail (104), and the end of the solder ball wire tail (104) is consistent with the height of the discharge solder ball device (5).

5. The method of claim 1, wherein the vertical wire arc forming is performed by a full-automatic wire bonding machine. When the solder ball is burned, the discharge solder ball device (5) is started, the air between the discharge solder ball device (5) and the wire (1) is broken down by high voltage to generate a high-temperature arc, so that the metal of the solder ball wire tail (104) is rapidly melted, and a metal solder ball (103) is formed after cooling.

6. The method of claim 1, wherein the vertical wire arc forming is performed by a full-automatic wire bonding machine. When welding the ball, the upper clamping device (2), the lower clamping device (3), the transducer (4) and the wedge ceramic nozzle (6) are moved above the substrate (8), the upper clamping device (2) and the lower clamping device (3) are loosened, the wedge ceramic nozzle (6) drives the metal solder ball (103) to move downward to the substrate (8), and the metal solder ball (103) is pressed on the substrate (8), and then the transducer (4) starts to weld the metal solder ball (103) on the substrate (8).

7. The method of claim 1, wherein the vertical wire arc forming is performed by a full-automatic wire bonding machine. When pulling the vertical line arc (106), the lower clamping device (3), the wedge ceramic nozzle (6) and the transducer (4) are all moved upward, so that the wire (1) leaves a long tail (105) with a set length at the tip of the wedge ceramic nozzle (6), and the ablation notch (102) on the long tail (105) forms a vertical line arc (106) with the metal solder ball (103).

8. The vertical wire arc forming method of claim 7, wherein, When leaving the new tail (101), the upper clamping device (2) loosens the wire (1), the lower clamping device (3) clamps the wire (1), the lower clamping device (3), the transducer (4) and the wedge ceramic nozzle (6) are all moved upward, the long tail (105) is pulled upward, and the long tail (105) is broken from the ablation notch (102) after being stressed, so that the metal solder ball (103) and the vertical line arc (106) are erected and fixed on the substrate (8), and the broken long tail (105) forms a new tail (101).

9. A vertical wire arc forming apparatus for a fully automatic wire bonding machine, for the vertical wire arc forming method of claim 1, characterized by, The device comprises a wire (1), an upper clamping device (2), a lower clamping device (3), a transducer (4), a wedge ceramic nozzle (6) and a substrate (8) arranged from top to bottom, and further comprises a discharge ball burning device (5) on the left side of the wedge ceramic nozzle (6) and a laser (7) fixed on the right side.

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