Heat dissipation device for power module and electronic equipment

Abstract

The application discloses a heat dissipation device for a power module and electronic equipment, relates to the technical field of heat dissipation, and comprises at least two power modules which are oppositely and spacedly arranged to form a middle heat dissipation channel, space layout is effectively utilized to enhance air circulation; two groups of flow guide grid assemblies which are symmetrically distributed are arranged on the surface of the heat dissipation shell of each power module and face the heat dissipation channel, the cooling air flow can be guided to flow through the heat dissipation surface more uniformly and orderly, and the heat exchange efficiency is improved. The air flow path is optimized, local hot spots are reduced, and the service life is prolonged. The two power modules and the heat dissipation shells thereof are cooperatively combined to form a standardized pulse-shaped micro heat dissipation channel. The heat dissipation channel can be adapted to various heat dissipation environments such as air cooling and immersion liquid cooling, and can maintain consistent heat management performance under different cooling conditions, realizes modularization and generalization of high-power-density modules, and effectively solves the problems of heat dissipation compatibility and standardized use of the modules in diversified application scenarios.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and particularly relates to a heat dissipation device for a power module and an electronic device. BACKGROUND

[0002] With the rapid development of data centers, high-performance computing and communication infrastructure, the requirements for power density, energy efficiency and reliability of server power systems are increasing. In order to meet the demand of high computing power load, power modules are continuously improved towards higher power density and smaller size. However, the increase of power density directly leads to the increase of heat generation per unit area, making heat dissipation a key factor restricting the performance and life of power modules.

[0003] Traditional air-cooled heat dissipation schemes usually rely on external fans to force air supply, and passive heat conduction is achieved by installing heat dissipation fins or heat pipes on the surface of power devices. However, in high power density scenarios, such schemes often fail to achieve uniform and effective heat distribution, and hot spots are easily formed in local areas, which may cause device overheating, efficiency decline and even failure. In addition, current heat dissipation structures are mostly fixed designs, lacking compatibility for different cooling modes, which makes the same power module difficult to be used in diversified deployment environments, increasing the system design complexity and maintenance cost. SUMMARY

[0004] The present application provides a heat dissipation device for a power module and an electronic device to at least solve the problems in the related art that in high power density scenarios, hot spots are easily formed in local areas, and current heat dissipation structures are mostly fixed designs, lacking compatibility for different cooling modes, which makes the same power module difficult to be used in diversified deployment environments, increasing the system design complexity and maintenance cost.

[0005] The present application provides a heat dissipation device for a power module, the power module comprising at least two power modules, the at least two power modules being oppositely and spacedly arranged to form a heat dissipation channel; the power module comprising a heat dissipation shell, and the heat dissipation shell comprising a heat dissipation surface facing the heat dissipation channel, the heat dissipation surface being provided with a flow guide structure; the flow guide structure comprising two groups of flow guide grating assemblies, the flow guide grating assemblies extending along the extension direction of the heat dissipation channel, and the two groups of flow guide grating assemblies being symmetrically distributed with respect to the center line of the heat dissipation surface.

[0006] The present application also provides an electronic device comprising the heat dissipation device for a power module described above.

[0007] By the present application, at least two power modules are arranged opposite and spaced to form a middle heat dissipation channel, effectively utilizing the space layout to enhance air circulation; at the same time, two groups of flow guide grid assemblies are arranged on the surface of the heat dissipation shell of each power module facing the heat dissipation channel, which can guide the cooling air flow to flow through the heat dissipation surface more uniformly and orderly, improving the heat exchange efficiency. Not only optimizes the air flow path, reduces the generation of local hot spots, but also enhances the overall heat dissipation performance, thereby improving the stability and reliability of the power module operation, and helps to prolong its service life. And the two power modules and their heat dissipation shells are cooperatively combined to form a standardized pulse-shaped micro heat dissipation channel. The micro heat dissipation channel structure can adapt to various heat dissipation environments such as air cooling and immersion liquid cooling, and can maintain consistent thermal management performance under different cooling conditions, realizing the modularization and generalization of high-power density modules, effectively solving the heat dissipation compatibility and standardized use problems in diversified application scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 The overall structure schematic diagram of a heat dissipation device for a power module provided by the embodiments of the present application;

[0010] Figure 2 The structure schematic diagram of a heat dissipation device for a power module provided by the embodiments of the present application;

[0011] Figure 3 The structure schematic diagram of a power module provided by the embodiments of the present application;

[0012] Figure 4 The structure schematic diagram of another power module provided by the embodiments of the present application;

[0013] Figure 5 The structure schematic diagram of a heat dissipation surface provided by the embodiments of the present application;

[0014] Figure 6 The structure schematic diagram of a heat dissipation module provided by the embodiments of the present application.

[0015] Among them, the above drawings include the following reference signs:

[0016] 100, power module; 110, power module; 111, heat dissipation shell; 1111, heat dissipation surface; 120, heat dissipation channel; 130, flow guide structure; 131, flow guide grid assembly; 1311, flow guide grid unit; 132, flow disturbance assembly; 1321, flow guide column; 140, limiting structure; 141, limiting column; 150, first back plate; 160, second back plate; 161, heat dissipation hole; 170, main back plate; 180, detection sensor; 190, second clamping part;

[0017] 200, heat dissipation module; 210, main heat sink; 211, flow guide assembly; 2111, first flow guide part; 2112, second flow guide part; 21121, flow guide piece; 220, heat dissipation fan; 230, liquid cooling pipe; 240, first clamping part. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0019] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, which is determined by the ordinary skilled person considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled person in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0020] In order for those skilled in the art to better understand the scheme of the present application, the present application is further described in detail below in combination with the drawings and specific embodiments.

[0021] The embodiments of the present application provide a heat dissipation device for a power module 100 and an electronic device. The device is described in detail in combination with the structure and working principle of the heat dissipation device for the power module 100 and the electronic device.

[0022] According to the embodiments of the present application, in one aspect, a heat dissipation device for a power module 100 is provided, which comprises Figure 1 and Figure 2As shown, the heat dissipation device for the power module 100 includes at least two power modules 110, and the at least two power modules 110 are oppositely and spacedly arranged to form a heat dissipation channel 120; the power module 110 includes a heat dissipation shell 111, and the heat dissipation shell 111 includes a heat dissipation surface 1111 facing the heat dissipation channel 120, and the heat dissipation surface 1111 is provided with a flow guide structure 130; the flow guide structure 130 includes two groups of flow guide grating assemblies 131, the flow guide grating assemblies 131 extend along the extension direction of the heat dissipation channel 120, and the two groups of flow guide grating assemblies 131 are symmetrically distributed relative to the center line of the heat dissipation surface 1111.

[0023] In the above embodiment, by means of the present application, the at least two power modules 110 are oppositely and spacedly arranged to form the intermediate heat dissipation channel 120, so that the space layout is effectively utilized to enhance the air flow; meanwhile, the two groups of flow guide grating assemblies 131 symmetrically distributed on the surface of the heat dissipation shell 111 of each power module 110 facing the heat dissipation channel 120 can guide the cooling air flow to flow through the heat dissipation surface 1111 more uniformly and orderly, so as to improve the heat exchange efficiency. Not only is the air flow path optimized to reduce the generation of local hot spots, but also the overall heat dissipation performance is enhanced, so as to improve the stability and reliability of the power module 100 in operation, and help to prolong the service life. Moreover, the two power modules 110 and the heat dissipation shells 111 thereof are cooperatively combined to jointly constitute a standardized pulse-shaped micro heat dissipation channel 120. The micro heat dissipation channel 120 structure can be adapted to various heat dissipation environments such as air cooling and immersion liquid cooling, and can maintain consistent thermal management performance under different cooling conditions, so as to realize the modularization and generalization deployment of high-power-density modules, and effectively solve the heat dissipation compatibility and standardized use problems in diversified application scenarios.

[0024] It should be noted that the power module 110 in the present application refers to an electronic module with high heat flux density and high efficient heat dissipation management, and the specific types thereof include but are not limited to high-power-density power modules, such as server power supplies, communication power supplies, industrial converters, etc., and can also include other power conversion or driving units which generate heat during operation and need to be effectively controlled by heat dissipation structures. The power module 110 is intended to cover all similar functional modules applicable to the heat dissipation device technical solutions of the present application, and is not limited to a specific application scenario or product form.

[0025] In one embodiment, as shown in Figure 3 , Figure 4 and Figure 5 , the flow guide grating assembly 131 includes a plurality of flow guide grating units 1311, and the plurality of flow guide grating units 1311 are sequentially and spacedly arranged along a direction perpendicular to the extension direction of the heat dissipation channel 120.

[0026] In the above embodiment, the flow guide grid assembly 131 is composed of a plurality of flow guide grid units 1311 arranged in sequence along the direction perpendicular to the extension direction of the heat dissipation channel 120. In combination with the symmetrical distribution design of the two groups of flow guide grid assemblies 131, the airflow in the heat dissipation channel 120 can be further refined and guided, so that the airflow forms a uniform and dense flow field when flowing through the heat dissipation surface 1111, greatly increasing the contact frequency of the airflow and the heat dissipation surface 1111 and the effective heat exchange area. In addition, the airflow is not blocked by the interval arrangement of the grid units, ensuring smooth airflow circulation, thereby enhancing the heat dissipation efficiency. At the same time, the airflow turbulence phenomenon can be further weakened, ensuring the consistency of the heat dissipation effect in each region, effectively reducing the risk of local overheating of the power module 110, and providing more reliable heat dissipation protection for the stable operation and service life extension of the power module 100.

[0027] In one embodiment, as shown in FIG. 13, the curvature radius of the flow guide grid unit 1311 gradually decreases from the center to the edge along the direction perpendicular to the extension direction of the heat dissipation channel 120. Figure 5

[0028] In the above embodiment, the curvature radius of the flow guide grid gradually decreases from the center to the edge along the direction perpendicular to the extension direction of the heat dissipation channel 120. In combination with the interval arrangement and symmetrical distribution design, the airflow in the heat dissipation channel 120 can be precisely guided and the flow rate can be controlled: the larger curvature radius in the center region can ensure smooth passage of the main airflow, and the smaller curvature radius in the edge region can accelerate the flow of edge airflow, avoiding the formation of vortex flow due to the stagnation of airflow at the edge of the channel, thereby making the airflow field distribution in the entire heat dissipation channel 120 more uniform, effectively improving the global heat exchange efficiency of the airflow and the heat dissipation surface 1111. At the same time, the gradually changing curvature structure helps to optimize the airflow distribution of the entire heat dissipation surface 1111, making up for the insufficient heat dissipation problem in the edge region due to the low flow rate, thereby achieving more uniform temperature field distribution, improving the overall heat dissipation efficiency, and enhancing the thermal stability and reliability of the power module 100 under high load working conditions.

[0029] ​Specifically, in the traditional uniform curvature structure, the cooling airflow tends to concentrate in the middle region of the channel due to inertial effect, resulting in low flow rate and low heat exchange efficiency in the edge region, and even forming local heat accumulation. In the present application, the radius of curvature of each flow guide grid unit 1311 along the direction perpendicular to the heat dissipation channel 120, i.e. from the center line of the heat dissipation surface 1111 to the edge direction, presents a gradual change rule of gradually decreasing from the center to the edge. By making the flow guide grid unit 1311 in the center region have a larger radius of curvature, i.e. a more gentle arc, the main flow can be guided smoothly into the heat dissipation channel 120; at the same time, as the position moves towards the edge, the gradually decreasing radius of curvature makes the flow guide grid unit 1311 present a more curved profile, thereby exerting a stronger guiding and accelerating effect on the airflow near the edge. This curvature gradient effectively breaks the unevenness of the natural distribution of airflow, prompting the cooling medium to more actively spread to the outer region of the heat dissipation surface 1111, improving the airflow coverage and turbulence intensity in the edge region.

[0030] Specifically, the design of the gradually changing curvature of the flow guide grid unit 1311 can also optimize the pressure distribution and velocity field uniformity of the entire heat dissipation surface 1111 without significantly increasing the overall wind resistance, avoiding flow separation or dead zones caused by sudden flow rate drop. Compared with the equal curvature or straight line type grid structure, the present application can further reduce the temperature standard deviation of the heat dissipation surface 1111. Therefore, the arrangement of the flow guide grid unit 1311 with large curvature in the center and small curvature at the edge realizes the improvement of the heat dissipation performance from overall effectiveness to global balance.

[0031] In one embodiment, along the extension direction of the flow guide grid unit 1311, the width of the middle region of the flow guide grid unit 1311 is greater than the width of the end region.

[0032] In the above embodiment, along the extension direction of the flow guide grid unit 1311, the width of the middle region is greater than the width of the end region, which cooperates with the characteristics of the symmetrical distribution and the curvature gradient of the flow guide grid: the wider structure in the middle region can strengthen the stability of the main flow guidance, enhance the guidance and support of the main flow, and improve the heat exchange efficiency in the center region; the narrower design at the end region can reduce the resistance when the airflow enters and exits, ensuring smooth airflow; at the same time, the width gradient structure can further optimize the flow field distribution in the heat dissipation channel 120, so that the airflow can maintain high efficient heat exchange state throughout the flow through the heat dissipation surface 1111, increasing the effective heat exchange area of the core heat dissipation region in the middle and avoiding airflow stagnation at the end, effectively improving the heat dissipation uniformity and overall heat exchange efficiency.

[0033] Specifically, during the operation of the high-power-density power module, when the cooling airflow flows along the heat dissipation channel 120, due to the inlet effect and the development of the boundary layer, the middle part of the channel usually undertakes the main heat exchange task, the heat load is concentrated, and the airflow speed is relatively high; while the end part regions close to the inlet and outlet of the channel are easily affected by external disturbances, backflow or insufficient flow development, and the heat exchange efficiency is relatively low. If the flow guide grid unit 1311 is designed with equal width, it is not only difficult to match the non-uniform heat flow distribution, but also may hinder the airflow in and out due to the excessively wide end part structure, thereby increasing the local resistance. In the present application, the middle part of the flow guide grid unit 1311 is widened, which on the one hand can enhance the structural strength and heat conduction area of the high heat flow region in the middle part, and on the other hand can effectively guide and support the main airflow through the wider windward surface, thereby improving the heat exchange efficiency of the central region; at the same time, the end part region is appropriately narrowed, which helps to reduce the flow resistance when the airflow enters and exits the channel, reduce vortex and separation phenomenon, and make the airflow more smoothly enter and exit the heat dissipation region.

[0034] Specifically, the width gradient design of the flow guide grid unit 1311 can also synergize with the curvature change of the flow guide grid unit 1311, that is, the curvature radius decreases from the center to the edge. The middle wide area provides a stable main flow channel, and the end narrow area realizes flexible transition, thereby forming a more uniform velocity field and temperature field distribution on the entire heat dissipation surface 1111.

[0035] In one embodiment, as shown in FIGS. 1A and 1B, the flow guide structure 130 further comprises a flow guide grid assembly 131. Figure 3 、 Figure 4 and Figure 5 In one embodiment, as shown in FIGS. 1A and 1B, the flow guide structure 130 further comprises a flow guide grid assembly 131.

[0036] In the above embodiment, the flow disturbance assembly 132 added to the end part region of the flow guide grid assembly 131 forms a synergistic effect with the flow guide grid unit 1311: the flow disturbance assembly 132 can disturb and comb the airflow at the end part of the flow guide grid assembly 131, break the laminar boundary layer easily formed at the end part, enhance the local turbulence intensity, and at the same time guide the airflow to more fully cover the end part region of the heat dissipation surface 1111, thereby eliminating the heat dissipation blind area and improving the heat exchange efficiency of the end part region; since there is usually a problem of low airflow speed and weak heat dissipation effect at the end part of the heat dissipation channel 120, the arrangement of the flow disturbance assembly 132 can specifically improve the heat accumulation phenomenon in this region, so that the temperature distribution of the entire heat dissipation surface 1111 is more uniform. At the same time, this structure synergizes with the flow guide grid assembly 131 to optimize the main flow guidance while strengthening the local disturbance, and takes into account the low air resistance and high heat dissipation performance, thereby further improving the thermal management capability and operation reliability of the power module 100 as a whole.

[0037] In one embodiment, the flow disturbance assembly 132 comprises a plurality of flow guide columns 1321 which are spaced apart from each other.

[0038] In the above embodiment, the turbulence assembly 132 adopts a plurality of mutually spaced distribution of guide vanes 1321 structure, the spaced distribution of guide vanes 1321 can form multi-point disturbance to the airflow at the end of the guide grid assembly 131, effectively break the laminar boundary layer, make the airflow form stable turbulence, improve the heat exchange intensity of the airflow and the heat dissipation surface 1111; at the same time, the spacing of the guide vanes 1321 not only guarantees the smoothness of the airflow, avoids airflow obstruction, but also makes the airflow distribution at the end of the heat dissipation channel 120 more uniform through multi-point turbulence, eliminates the blind area of heat dissipation, and further strengthens the consistency of heat dissipation of each power module 110; in addition, the structure design is simple and has good airflow guiding and turbulence effect, which can further improve the heat dissipation efficiency of the entire power module 100 without increasing the airflow resistance too much, effectively suppresses the risk of local overheating, improves the heat dissipation performance while considering the flow efficiency, which helps to realize the uniformization of the overall temperature field of the power module 100, and enhances the thermal stability and reliability of the power module 100 under high power working conditions.

[0039] In a specific embodiment, since the guide grid assembly 131 is arranged along the extension direction of the heat dissipation channel 120, and the two groups of guide grid assemblies 131 are symmetrically distributed relative to the center line of the heat dissipation surface 1111; each group of guide grid assemblies 131 is composed of a plurality of guide grid units 1311, which are arranged in sequence and spaced apart along the direction perpendicular to the extension direction of the heat dissipation channel 120; at the same time, in the direction perpendicular to the extension direction of the heat dissipation channel 120, the curvature radius of the plurality of guide grid units 1311 decreases from the center to the edge, and along the extension direction of the guide grid unit 1311, the width of the middle region of the guide grid unit 1311 is greater than that of the end region; the above multi-dimensional geometric characteristics jointly constitute a three-dimensional guide structure 130 in the shape of an onion section.

[0040] Specifically, in the absence of the flow guide column 1321, when the cooling airflow flows through the flow guide grid unit 1311 with an onion-section-like structure, the airflow is easily offset or dispersed along the transverse direction perpendicular to the main flow direction, i.e., the left and right sides of the flow guide grid unit 1311, due to the geometric characteristics of the gradually decreasing curvature radius from the center to the edge, the wide middle part and narrow end, etc. It is difficult for the airflow to flow in a concentrated and orderly manner along the heat dissipation surface 1111. Such flow splitting phenomenon can lead to uneven airflow distribution, especially in the edge area, which can result in insufficient flow or even flow dead zones, thereby weakening the local heat exchange effect and reducing the overall heat dissipation efficiency. In order to suppress such adverse flow and maintain effective airflow organization, it is necessary to highly rely on the geometric accuracy and guiding performance of the two sides of the flow guide grid unit 1311. Once there is a manufacturing deviation, the airflow path is easily deviated from the design expectation, thereby affecting the heat dissipation performance. After the introduction of the flow guide column 1321, not only can the heat dissipation area of the edge area be effectively increased to improve the local heat exchange capacity, but also the thermal boundary layer can be destroyed and the turbulence intensity can be enhanced through the flow disturbance effect of the flow guide column 1321, thereby improving the problem of weak edge heat dissipation. In addition, in combination with the actual heat load distribution and heat dissipation demand, the arrangement position and distribution density of the flow guide column 1321 in the onion-section-like heat dissipation space can be flexibly adjusted, so as to actively regulate the path, speed and uniformity of the airflow, while reducing the reliance on the processing accuracy of the structure, a more efficient and more balanced heat management effect is achieved.

[0041] In one embodiment, as shown in Figure 3 , Figure 4 and Figure 5 , the heat dissipation shell 111 is further provided with a limiting structure 140, the limiting structure 140 is protrudingly arranged on the heat dissipation surface 1111, and the height of the limiting structure 140 protruding from the heat dissipation surface 1111 is greater than the height of the flow guide structure 130 protruding from the heat dissipation surface 1111.

[0042] In the above embodiment, the heat dissipation surface 1111 of the heat dissipation shell 111 is provided with the limiting structure 140, and the protruding height thereof is greater than the protruding height of the flow guide structure 130, which can serve as a mounting and positioning reference to ensure that the power module 110 maintains a predetermined distance during assembly, maintains the heat dissipation channel 120, and guarantees the stability of the airflow path and the reliability of the heat dissipation performance. At the same time, the limiting structure 140 can also play a mechanical limiting role during the assembly or use of the power module 110, avoiding direct collision or extrusion between external components and the flow guide structure 130, effectively protecting the integrity of the core heat dissipation structure such as the flow guide grid unit 1311 and the flow guide column 1321, and preventing deformation or damage thereof from causing a decrease in heat dissipation performance.

[0043] In one embodiment, the limiting structure 140 includes at least two limiting columns 141, and the at least two limiting columns 141 are distributed in a spaced manner along the extension direction of the heat dissipation channel 120.

[0044] In the above embodiment, the limiting structure 140 adopts at least two limiting columns 141 distributed at intervals along the extension direction of the heat dissipation channel 120, which can not only effectively support and limit the relative position between adjacent power modules 110, but also ensure that the heat dissipation channel 120 maintains a uniform spacing in the entire length direction, avoids the narrowing or even closure of the channel due to local deformation or assembly deviation, and thus guarantees the smooth flow of cooling air. At the same time, the multiple-point interval arrangement of the limiting columns 141 can also disperse the contact stress, improve the structural stability and anti-vibration performance, and better protect the flow guide structure 130 from being squeezed or damaged during transportation, installation and operation. The positioning accuracy, structural strength and heat dissipation reliability are taken into account, and the overall thermal management efficiency and mechanical durability of the power module 100 are further improved.

[0045] In one embodiment, the height of the limiting column 141 protruding from the heat dissipation surface 1111 is greater than the height of the flow guide column 1321 protruding from the heat dissipation surface 1111.

[0046] In the above embodiment, the height of the limiting column 141 protruding from the heat dissipation surface 1111 is greater than the height of the flow guide column 1321, which can ensure that the limiting column 141 contacts the adjacent component first during the assembly or stacking of the power module 100, thereby effectively preventing the deformation or damage of the flow guide column 1321 and other fine heat dissipation structures due to direct pressure. The setting of this height difference not only plays a role in preferential buffering and positioning, but also ensures the integrity and functionality of the flow guide column 1321 during use, maintaining its effect of flow disturbance and heat exchange enhancement. At the same time, this structure helps to maintain the geometric stability of the heat dissipation channel 120, preventing the narrowing or blocking of the air flow channel due to component squeezing, thereby ensuring the long-term reliability of the heat dissipation performance and the safety of the power module 100 operation.

[0047] In a specific embodiment, the main function of the limiting column 141 is to accurately limit the gap of the pulse-shaped micro heat dissipation channel 120 formed between the upper and lower adjacent power modules 110, ensuring that the heat dissipation maintains the required spacing during assembly, avoiding the narrowing or even closure of the channel due to squeezing or deformation, and thus guaranteeing the smooth flow of cooling air and the stability of heat dissipation performance. Therefore, the height of the limiting column 141 should be slightly higher than that of the main heat dissipation structures such as the flow guide grid and the flow guide column 1321; to ensure that the limiting column 141 contacts and bears the load first when the power module 100 is pressed or stacked, effectively protecting the finer flow guide grid and flow guide column 1321 below from mechanical damage, while maintaining the consistency and reliability of the geometric shape of the heat dissipation channel 120.

[0048] Specifically, the height of the limiting column 141 protruding from the heat dissipation surface 1111 is 2-5 mm greater than the height of the flow guide column 1321 protruding from the heat dissipation surface 1111.

[0049] In one embodiment, the cross-sectional area of the limiting column 141 is larger than that of the flow guide column 1321.

[0050] In the above embodiment, the cross-sectional area of the limiting column 141 is larger than that of the flow guide column 1321, which has higher structural strength and carrying capacity, can effectively withstand external pressure or impact load during the assembly, transportation or operation of the power module 100, and prevent the shell from deforming or the heat dissipation structure from being damaged due to local stress concentration. At the same time, the larger cross-sectional area helps to improve the rigidity and stability of the limiting column 141, ensuring that it can reliably maintain the spacing accuracy of the heat dissipation channel 120 in long-term use; while the flow guide column 1321 can be kept smaller in size to optimize the airflow disturbance effect, balancing the heat dissipation performance and mechanical protection. This differentiated design realizes functional division, in which the limiting column 141 focuses on structural support and protection, and the flow guide column 1321 focuses on heat exchange enhancement, thereby improving the reliability, durability and heat dissipation efficiency of the power module 100 as a whole.

[0051] In one embodiment, the power module 100 further comprises a second back plate 160, a third back plate and at least two first back plates 150, the power module 110 corresponds to the first back plate 150 one by one, and the side of the power module 110 away from the heat dissipation channel 120 is connected with the corresponding first back plate 150; the second back plate 160 is arranged at one end of the heat dissipation channel 120 where the air outlet is located, and the end part of the at least two first back plates 150 close to the air outlet of the heat dissipation channel 120 is connected with the second back plate 160; the third back plate is connected with the second back plate 160.

[0052] In the above embodiment, the composite back plate frame composed of the first back plate 150, the second back plate 160 and the third back plate connects each other to tightly integrate the originally independent power modules 110 into a whole mechanical structure. Not only does it provide reliable support and installation foundation for each power module 110, but also enhances the structural rigidity and anti-deformation ability of the whole power module 100, which can effectively resist vibration, impact and thermal stress, thereby improving the mechanical reliability and service life of the product.

[0053] In a specific embodiment, the two power modules 110 adopt a symmetrical layout and work cooperatively through parallel connection to realize the maximum output power capability of the system while ensuring balanced distribution of current. Each power module 110 internally integrates a complete power supply functional unit, including a high-voltage input port, a low-voltage high-current output port, and a control signal and feedback signal interface for monitoring, protection, and communication. To realize high-reliability electrical interconnection, all the above interfaces are firmly connected to the respective corresponding first backboard 150 through high-density module connectors in a welding manner, ensuring signal integrity and long-term connection stability. On this basis, the two first backboards 150 are further connected through plugging and welding and are respectively mounted on the second backboard 160. The second backboard 160 serves as an intermediate adapter layer and undertakes the functions of electrical convergence and signal integration, on the one hand, combining the input and output power lines from the two power modules 110 to improve the current-carrying capacity, and on the other hand, collecting, isolating, or level-shifting the control and feedback signals to provide standardized interfaces for the upper-layer system. The second backboard 160 then uniformly transfers the integrated power and signals to the third backboard, which serves as the main backboard 170 and is responsible for interaction with the external power supply network, control unit, and heat dissipation management module.

[0054] Specifically, through the three-level backboard architecture of the first backboard 150, the second backboard 160, and the third backboard, not only is the layered decoupling of electrical functions realized, but also the maintainability and scalability of the modules are greatly improved: a single power module 110 and its first backboard 150 can be replaced independently without the need to disassemble the entire system; at the same time, the second backboard 160 can be flexibly configured with wiring and protection circuits according to different power levels, enhancing the platform versatility. The overall structure takes into account the electrical performance, thermal management compatibility, and engineering practicability under high power density.

[0055] The two power modules 110 adopt a symmetrical layout and work in parallel to realize the maximum output power. Each power module 110 integrates input and output ports and related control and feedback signal interfaces, and these electrical connections are welded to the corresponding first backboard 150 through module connectors. Subsequently, the two first backboards 150 are respectively plugged and welded to the second backboard 160, which then uniformly transfers the signals and power to the third backboard, forming a complete power module 100 assembly.

[0056] In one embodiment, the second backboard 160 is provided with a heat dissipation hole 161 corresponding to the position of the air outlet of the heat dissipation channel 120.

[0057] In the above embodiment, the second back plate 160 is provided with heat dissipation holes 161 corresponding to the positions of the air outlet of the heat dissipation channel 120, which can effectively guide the smooth discharge of the cooling air flow, avoid the accumulation or back pressure of the air flow at the air outlet, avoid the air flow stagnation or backflow caused by the blocking of the second back plate 160 to the hot air flow discharge, improve the air circulation efficiency, and ensure the smoothness of the air flow circulation in the heat dissipation channel 120. It helps to maintain stable air flow velocity and pressure distribution in the heat dissipation channel 120, strengthens the convective heat transfer effect, prevents heat accumulation in the module, and thus improves the overall temperature uniformity.

[0058] In one embodiment, the power module 100 further comprises a detection sensor 180 mounted on the heat dissipation surface 1111 for detecting whether the power module 100 is immersed in the cooling liquid.

[0059] In the above embodiment, the detection sensor 180 for detecting whether the power module 100 is immersed in the cooling liquid is arranged on the heat dissipation surface 1111, which can monitor the running state of the cooling system in real time and ensure the current cooling environment of the power module 100. When liquid cooling is used, the detection sensor 180 can determine whether the cooling area is effectively covered by the cooling liquid in time, avoiding the failure of heat dissipation caused by insufficient liquid level, leakage or circulation failure, thereby preventing the damage of power devices due to overheating. In addition, this detection information can also be used as a basis for system safety protection and intelligent control, improving the reliability, safety and intelligent level of the power module 100 operation, especially suitable for high-power density application scenarios with strict heat management requirements.

[0060] In one embodiment, as shown in Figure 1 and Figure 6 , it further comprises a heat dissipation module 200, which is detachably connected with the power module 100 and is in heat conduction cooperation with the power module 100.

[0061] In the above embodiment, the heat dissipation module 200 which is detachably connected and in heat conduction cooperation with the power module 100 not only facilitates the installation, maintenance and replacement of the power module 100, but also can flexibly adapt to different heat dissipation requirements or upgrade the heat dissipation scheme without damaging the overall structure. Through reliable heat conduction cooperation, the heat management performance is improved; at the same time, the detachable structure is conducive to rapid troubleshooting, individual maintenance or recycling of components, reducing operation and maintenance costs and downtime. In addition, the two can be separated during transportation or storage, reducing the volume and risk, improving the modularity, flexibility and long-term reliability of the system.

[0062] In one embodiment, the heat dissipation module 200 comprises a main heat sink 210, which is arranged at one end of the air inlet of the heat dissipation channel 120, and the air outlet of the main heat sink 210 is in communication with the air inlet of the heat dissipation channel 120.

[0063] In the above embodiment, the main heat sink 210 is arranged at the air inlet end of the heat dissipation channel 120, and the air outlet of the main heat sink 210 is in communication with the air inlet of the heat dissipation channel 120. The main heat sink 210 can directly deliver cooling air flow to the heat dissipation channel 120 to provide an initial cooling source for the air flow in the channel, greatly reduce the temperature of the air flow entering the heat dissipation channel 120, increase the heat exchange temperature difference with the heat dissipation surface 1111 of the power module 110, and strengthen the core heat dissipation effect. At the same time, the integrated design of the main heat sink 210 and the power module 100 optimizes the space utilization and enhances the consistency and controllability of system heat dissipation.

[0064] In a specific embodiment, the main heat sink 210 is structurally fixed to the corresponding chassis part at the rear end of the power module 100 output gold finger, and the overall height is above the gold finger connector, and the installation method can be flexibly selected according to the chassis layout: it can be hung to the upper structure of the power module 100 output area chassis, or it can be extended downward and locked to the bottom chassis. Since the main heat sink 210 usually has heat dissipation fins or even built-in liquid cooling pipes 230, it has a certain weight and volume. If only the connection with the power module 110 is relied on to bear the weight, mechanical stress will be applied to the power module 110 body and the gold finger electrical interface during transportation, plugging or equipment running vibration, affecting the connection reliability. By providing independent support through the chassis, not only can the load be effectively isolated, but also the stable contact pressure and alignment accuracy between the main heat sink 210 and the power module 110 can be ensured for a long time.

[0065] In one embodiment, the heat dissipation module 200 further comprises a heat dissipation fan 220, which is installed on the side of the main heat sink 210 away from the power module 100, and the air outlet direction of the heat dissipation fan 220 is towards the main heat sink 210.

[0066] In the above embodiment, the heat dissipation fan 220 is installed on the side of the main heat sink 210 away from the power module 100, and the air outlet direction thereof is towards the main heat sink 210, which can actively drive external cold air to pass through the heat dissipation fins of the main heat sink 210, strengthen the heat exchange capacity thereof, and stably send the cooled air flow into the heat dissipation channel 120. The problem of air flow disorder or local impact caused by the fan directly blowing to the power module 100 is avoided, and the main heat sink 210 is fully utilized as an air flow rectifying and pre-cooling unit to improve the uniformity and cooling effect of the air flow entering the heat dissipation channel 120. In addition, the fan and the main heat sink 210 are integrated on the air inlet side, which is compact in structure, short in air path, and helps to reduce system air resistance, improve energy efficiency, and facilitate overall maintenance and replacement, thereby enhancing the heat dissipation performance and operation reliability of the power module 100.

[0067] In a specific embodiment, the heat dissipation fan 220 is firmly locked on the main heat sink 210 by four screws at the four corners, and the installation position is arranged at the air inlet edge area on the side of the main heat sink 210 away from the power module 100. The fan air outlet is directly opposite the heat dissipation fin array of the main heat sink 210, so that the air flow can directly enter the fin gap with the shortest path and the smallest turning, forming an efficient and low-resistance air inlet channel. Through the design of short and straight air supply, the energy loss and turbulent disturbance of the air flow in the transmission process are reduced, effectively improving the flushing efficiency of the cooling air to the heat dissipation fins, thereby maximizing the air cooling heat dissipation performance, and being suitable for stable temperature control requirements under high heat flux density conditions. In addition, the four-point symmetrical screw fixing method not only realizes reliable positioning of the fan in the horizontal and vertical directions, but also greatly enhances the mechanical rigidity of the overall structure. Under complex working conditions such as long-time operation, high-frequency vibration or transportation impact, this fixing structure can effectively suppress the risk of shaking, deviation or even loosening of the heat dissipation fan 220, avoid problems such as air flow deviation, noise increase or interference with the heat sink caused by displacement. At the same time, the stable installation posture ensures that the relative positional relationship between the heat dissipation fan 220 and the main heat sink 210 always meets the design requirements, ensuring the consistency of the air field distribution and the repeatability of the heat dissipation performance.

[0068] In one embodiment, the main heat sink 210 is provided with a mounting channel; the heat dissipation module 200 further comprises a liquid cooling pipe 230; and the liquid cooling pipe 230 is installed in the mounting channel.

[0069] In the above embodiment, an installation channel is provided inside the main heat sink 210, and the liquid cooling pipe 230 is integrated therein, realizing efficient synergistic heat dissipation of air cooling and liquid cooling. The liquid cooling pipe 230, through its efficient liquid phase heat transfer characteristics, quickly removes the heat absorbed by the main heat sink 210, improving the overall heat conduction and heat dissipation capacity of the main heat sink 210. The main heat sink 210, acting as an intermediate heat transfer medium, evenly transfers the heat generated by the power module 100 to the liquid cooling pipe 230, while still cooperating with the fan for forced air cooling, forming a composite heat dissipation mechanism. This not only improves heat dissipation efficiency and heat load capacity but also fully utilizes the internal space of the main heat sink 210, making the liquid cooling pipe 230 compact, safe, and reliable, avoiding mechanical damage or leakage risks caused by exposure. While ensuring structural protection and active airflow efficiency, it achieves improved heat dissipation capacity, effectively adapting to the heat dissipation requirements under ultra-high power and high load conditions.

[0070] Preferably, such as Figure 6 As shown, the main heat sink 210 is provided with a flow guiding assembly 211. The flow guiding assembly 211 includes a first flow guiding section 2111 and two sets of second flow guiding sections 2112. The first flow guiding section 2111 has a U-shaped structure and its opening faces the micro heat dissipation channel 120. The width of the opening of the U-shaped structure is greater than or equal to the width of the heat dissipation channel 120. The cooling fan 220 is located on the side of the first flow guiding section 2111 away from the opening. The two sets of second flow guiding sections 2112 are respectively located on both sides of the first flow guiding section 2111. The second flow guiding section 2112 includes a plurality of parallel and spaced-apart flow guiding elements 21121. The flow guiding elements 21121 extend along the extension direction parallel to the heat dissipation channel 120 and gradually increase in length in the direction away from the first flow guiding section 2111. This structural design can effectively guide the concentrated airflow blown in by the fan through the U-shaped cavity and evenly distribute it to the second guide sections 2112 on both sides. The airflow is further expanded in an orderly manner and guided to the full width of the micro heat dissipation channel 120 by the guide members 21121 with gradually increasing length, thereby achieving a more uniform and efficient cooling effect.

[0071] Specifically, by the cooperation of the first flow guide part 2111 and the second flow guide part 2112, the uniformity of distribution and the guiding efficiency of the cooling airflow in the main heat sink 210 are improved. The opening of the U-shaped first flow guide part 2111 faces the micro heat dissipation channel 120, and the opening width is not less than the width of the heat dissipation channel 120, so that the airflow blown in from the back side can be completely captured and effectively distributed to the left and right sides. The second flow guide part 2112 on the left and right sides is composed of a plurality of flow guide pieces 21121 arranged in parallel and spaced apart along the extension direction of the heat dissipation channel 120, and the length of the flow guide piece 21121 gradually increases away from the first flow guide part 2111. This gradual change structure can guide the airflow to gradually expand and cover the outer edge area of the heat dissipation channel 120. Thus, the airflow originally concentrated in the center is reasonably dispersed and uniformly introduced into the entire width range of the micro heat dissipation channel 120, effectively avoiding the problem of insufficient airflow or forming a flow dead zone in the edge area, and greatly improving the heat exchange uniformity and overall heat dissipation efficiency of the heat dissipation surface 1111. This structure optimizes the wind field distribution without increasing the air resistance too much, and is particularly suitable for the harsh demand of high-power density modules for high-efficiency and balanced cooling.

[0072] In a specific embodiment, during system operation, the detection sensor 180 is used to determine whether the power module 100 is in a submerged liquid cooling environment: when it is identified that the power module 100 has been submerged in the cooling liquid, the system will automatically report that the submerged liquid cooling heat dissipation mode is currently adopted, and the monitoring logic for the heat dissipation fan 220 will be closed accordingly; in the non-submerged liquid cooling scenario, the system does not actively report the cooling mode, but relies on the heat dissipation fan 220 for heat dissipation, and if the heat dissipation fan 220 is not detected in place, an alarm should be triggered. After the heat dissipation fan 220 is installed, its in-place information can be identified and reported through the communication between the power supply control system and the server baseboard management controller (BMC). Whether to configure the heat dissipation fan 220 should be based on the comprehensive judgment of the thermal design verification and test results in the project research and development stage; it should be noted that the power supply itself is not responsible for monitoring the operating state of the heat dissipation fan 220, such as speed, failure, etc., and only over-temperature alarm is performed according to its own temperature information, while the operation monitoring of the heat dissipation fan 220 belongs to the management scope of the server baseboard management controller.

[0073] In a specific embodiment, the present application realizes an integrated heat dissipation design compatible with multiple heat dissipation modes such as submerged liquid cooling, air cooling and cold plate liquid cooling. By integrating the detection sensor 180 in the power module 110, it can automatically identify the current heat dissipation condition whether it is submerged in the cooling liquid, and actively execute the corresponding power consumption management strategy accordingly, which simplifies the selection process of the power module 100 in different application scenarios, and improves the overall reliability, deployment flexibility and thermal management intelligence level of the system.

[0074] Specifically, in the design of the server high-power-density power module 100, the overall thermal management scheme mainly includes the heat dissipation structure design of the power module 100 itself, the design of the optional independent heat dissipation module 200, and the compatibility and adaptation capability of the power module 100 to various heat dissipation environments. In view of the trend of continuously increasing power density, the key power module 100 in the present application is designed with a standardized and modular heat dissipation shell 111. The heat dissipation shell 111 is specially optimized in structure to design an internal airflow path, so that a through pulse-shaped micro heat dissipation channel 120 is naturally formed between the two symmetrically arranged power modules 110, thereby realizing efficient and self-contained heat conduction and convection dissipation capability inside the module. On this basis, to cope with higher heat load or specific cooling scenarios such as cold plate liquid cooling or insufficient system air volume, an independent heat dissipation module 200 can be additionally configured. The independent heat dissipation module 200 can flexibly integrate elements such as a main heat sink 210, a liquid cooling pipe 230, and a heat dissipation fan 220 according to the actual power level and heat dissipation requirements, to provide enhanced cooling capability. However, in the application scenarios of pure air cooling where the server system can provide sufficient and uniform air volume, or immersion liquid cooling where the power module 100 is directly immersed in the cooling liquid, since the overall heat dissipation architecture itself can already meet the thermal management requirements, there is no need to separately equip the power module 100 with such an independent heat dissipation module 200, thereby simplifying the structure, reducing the cost, and improving the deployment flexibility. In summary, the design scheme realizes good compatibility and performance scalability in air cooling, cold plate liquid cooling, immersion liquid cooling, and other heat dissipation modes through the layered strategy of embedding an efficient micro heat dissipation channel 120 and externally mounting a heat dissipation module as needed, and balances high power density, high reliability, and engineering practicability.

[0075] In a specific embodiment, during the development stage of the power module 110, the heat dissipation requirements of the power module 110 under different environmental temperatures are comprehensively evaluated through testing, including the required air volume in air cooling mode and the cooling liquid flow rate requirement in immersion liquid cooling mode. If the system adopts the immersion liquid cooling scheme, there is no need to additionally configure the heat dissipation module 200; and if the air cooling scheme is adopted, when the environmental temperature at the air inlet of the power module 110 is lower than 40°C and the actual air volume is greater than 10 CFM, the heat dissipation requirement can be met, and in this case, there is no need to install the liquid cooling pipe 230. If the actual air volume of the system is insufficient or the environmental temperature is relatively high, the heat management requirements of the power module 110 cannot be met, and the liquid cooling pipe 230 needs to be installed in the main heat sink 210 to enhance the heat dissipation capability. The entire power module 110 adopts a standardized structure design such as a unified clamping groove at the rear, and whether to assemble the heat dissipation module 200, the liquid cooling pipe 230, and other specific configurations will be determined according to the actual heat dissipation verification results of the project, and will be determined together with the overall system configuration in the production stage.

[0076] In a specific embodiment, different heat dissipation modules 200 can be selected according to the internal temperature environment of the system and the heat dissipation requirement of the power module 100 to ensure the best heat management effect. When the heat dissipation environment is good and the heat dissipation requirement of the power module 100 is low, only the main heat sink 210 needs to be installed, and the high-efficiency heat conduction performance of the main heat sink 210 can assist in heat dissipation to meet the requirements. If the internal temperature of the system is moderate but still within the maximum working temperature range of the power module 100, the combination of the main heat sink 210 and the heat dissipation fan 220 can be selected, and the forced air cooling provided by the heat dissipation fan 220 can be used to cooperate with the main heat sink 210 to effectively dissipate and conduct heat, so as to ensure that the power module 100 operates at a safe temperature. However, when the internal temperature of the system is high and exceeds the maximum working temperature requirement of the power supply, the cooling capacity needs to be further enhanced, and the liquid cooling pipe 230 and the heat dissipation fan 220 should be installed at this time. In this configuration, the hot air passes through the air guide channel of the main heat sink 210 and is additionally cooled by the liquid cooling pipe 230, thereby providing cold air at a lower temperature and maintaining the main heat sink 210 at a lower temperature level, thereby providing stronger heat dissipation support for the power module 100. Not only does it ensure efficient heat dissipation under different working conditions, but it also optimizes the overall energy consumption and reliability of the system, ensuring that the power module 100 can operate stably under various operating conditions.

[0077] In one embodiment, the heat dissipation module 200 is provided with a first clamping portion 240, and the power module 100 is provided with a second clamping portion 190, and the first clamping portion 240 and the second clamping portion 190 are clamped.

[0078] In the above embodiment, the first clamping portion 240 is arranged on the heat dissipation module 200, and the second clamping portion 190 is arranged on the power module 100 in correspondence, and the two are clamped to achieve quick and stable connection, which not only simplifies the assembly and disassembly process and improves the maintenance efficiency, but also ensures that the heat dissipation module 200 and the power module 100 maintain good heat conduction contact and relative position accuracy. The clamping structure can realize reliable mechanical fixation without additional fasteners, effectively reducing the installation complexity and cost; at the same time, while ensuring the tightness of the heat conduction cooperation, the problem of local stress concentration or poor heat dissipation interface contact caused by uneven bolt compression is avoided.

[0079] In a specific embodiment, the first clamping portion 240 and the second clamping portion 190 are used to achieve quick, detachable mechanical connection between the heat dissipation module 200 and the power module 100, and the structural form includes but is not limited to a matching tooth and groove structure, such as a convex tooth and a concave groove; or a buckle and a card hole, a guide rail and a sliding groove, an elastic lock tongue and a limiting groove, and other matching structures with contact clamping function, as long as the heat dissipation module 200 and the power module 100 can be reliably positioned, stably connected during assembly, and easily separated when needed, and the specific form can be flexibly designed according to the actual space layout, assembly process and mechanical reliability requirements.

[0080] In one embodiment, a heat conduction layer is provided at the contact interface of the heat dissipation module 200 and the power module 100.

[0081] In the above embodiment, the heat conduction layer is provided at the contact interface of the heat dissipation module 200 and the power module 100, which can effectively fill the microscopic gaps and surface irregularities between the two, reduce the contact thermal resistance, improve the efficiency of heat transfer from the power module 100 to the heat dissipation module 200, and enhance the overall heat conduction performance, ensuring that the heat generated by the power module 100 is quickly dissipated.

[0082] Specifically, the heat conduction layer is used to fill the microscopic gaps between the contact interface of the heat dissipation module 200 and the power module 100, to reduce the contact thermal resistance and improve the heat conduction efficiency, and the material form includes but is not limited to heat-conducting silicone grease, and can also use heat-conducting gaskets, phase-change heat-conducting materials, heat-conducting gels, metal-based heat-conducting interface materials, etc., and the specific selection can be determined comprehensively according to assembly process, thermal performance requirements, reliability requirements, and maintenance convenience, etc.

[0083] In a specific embodiment, the first clamping portion 240 and the second clamping portion 190 preferably adopt a matching tooth and groove structure to achieve quick, reliable and detachable mechanical connection between the power module 100 and the heat dissipation module 200. Among them, the power module 110 is integrated and fixed inside the power module 100, and the heat dissipation module 200 is pre-assembled in the server case; during power hot plug, the tooth and groove structure at the rear end of the power module 100 is automatically clamped and matched with the corresponding tooth and groove of the heat dissipation module 200, and the contact surface is pre-coated with heat-conducting silicone grease, so as to realize high-efficiency heat conduction through direct contact and heat-conducting interface material. On this basis, when the heat dissipation environment is relatively severe, the heat dissipation module 200 can also integrate a heat dissipation fan 220 to provide auxiliary air flow to further enhance the cooling effect. Specifically, the heat dissipation module 200 can be flexibly replaced with different configurations according to the actual application environment of air cooling, liquid cooling, etc., to improve the system adaptability.

[0084] In a specific embodiment, the power module 100 itself adopts a high power density design, and two symmetrically arranged power modules 110 inside the power module 100 not only share an electrical parallel architecture to improve output capacity, but also form a through, pulse-like micro-scale heat dissipation channel 120 between them by specially optimizing the heat dissipation shell 111. The heat dissipation channel 120 can effectively guide the flow of cooling medium such as airflow or cooling liquid through the heating area under different heat dissipation modes such as air cooling or immersion liquid cooling, thereby improving the overall heat dissipation efficiency.

[0085] Specifically, the main heat sink 210 in the present application refers to a metal heat dissipation structure with heat dissipation fins, which is pre-designed with a mounting channel for embedding a liquid cooling pipe 230; in the case of low ambient temperature or light system thermal load, the liquid cooling pipe 230 can be optionally not installed, and only air cooling by the heat dissipation fan 220 can meet the heat dissipation requirement. The main heat sink 210 is tightly thermally coupled with the power module 110 through the heat conduction layer on the side close to the power module 110, which functions similarly to an external high-performance heat sink externally connected to the power module 110 to efficiently dissipate heat. The heat dissipation fan 220 is arranged on the side of the main heat sink 210 away from the power module 110, and is mainly used to drive airflow through the heat dissipation fins to provide forced air cooling for the main heat sink 210. It should be noted that even in the case of installing the liquid cooling pipe 230 and using liquid cooling assisted heat dissipation, a certain intensity of low-speed airflow still needs to be retained, which can not only enhance the overall heat exchange efficiency of the main heat sink 210, but also ensure that the airflow can continue to flow into the pulse-like micro heat dissipation channel 120 formed between the power modules 110 for supplementary cooling, thereby realizing efficient, reliable and flexible thermal management of the liquid cooling and air cooling working in cooperation.

[0086] According to an embodiment of the present application, in another aspect, an electronic device is also provided, which includes the heat dissipation device for the power module 100 described above.

[0087] It should be noted that the electronic device in the present application refers to various high-power and high-heat-density electronic systems using the above-mentioned power module 100 and heat dissipation device, and the specific application scenarios include but are not limited to servers, data center devices, and can also cover communication base stations, industrial control devices, energy storage systems, electric vehicle control units, high-performance computing devices, and other power electronic or information processing devices with high requirements for heat dissipation performance and operation reliability.

[0088] The heat dissipation device for the power module 100 and the electronic equipment provided by the application are described in detail above. The principles and implementation manners of the application are described by applying specific examples in this paper, and the above description of the examples is only used to help understand the method of the application and its core idea. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A heat sink for a power module, the power module (100) comprising at least two power modules (110), characterized in that, At least two power modules (110) are oppositely and spacedly arranged to form a heat dissipation channel (120); the power module (110) comprises a heat dissipation shell (111), and the heat dissipation shell (111) comprises a heat dissipation surface (1111) facing the heat dissipation channel (120), and the heat dissipation surface (1111) is provided with a flow guide structure (130); The flow guide structure (130) comprises two groups of flow guide grid assemblies (131), the flow guide grid assemblies (131) extend along the extension direction of the heat dissipation channel (120), and the two groups of flow guide grid assemblies (131) are symmetrically distributed with respect to the center line of the heat dissipation surface (1111); The flow guide grid assembly (131) comprises a plurality of flow guide grid units (1311), and the plurality of flow guide grid units (1311) are sequentially and spacedly arranged along a direction perpendicular to the extension direction of the heat dissipation channel (120); Along the extension direction of the heat dissipation channel (120), the curvature radii of the plurality of flow guide grid units (1311) sequentially decrease from the center to the edge.

2. The heat dissipating device for a power module according to claim 1, characterized by, Along the extension direction of the flow guide grid unit (1311), the width of the middle region of the flow guide grid unit (1311) is greater than the width of the end region.

3. The heat dissipating device for a power module according to claim 1 or 2, characterized by, The flow guide structure (130) further comprises a flow disturbance assembly (132), and the flow disturbance assembly (132) is arranged at the end region of the flow guide grid assembly (131).

4. The heat dissipating device for a power module according to claim 3, characterized by, The flow disturbance assembly (132) comprises a plurality of flow guide columns (1321), and the plurality of flow guide columns (1321) are spacedly arranged.

5. The heat dissipating device for a power module according to claim 4, characterized by, The heat dissipation shell (111) is further provided with a limiting structure (140), the limiting structure (140) is protrudingly arranged on the heat dissipation surface (1111), and the height of the limiting structure (140) protruding from the heat dissipation surface (1111) is greater than the height of the flow guide structure (130) protruding from the heat dissipation surface (1111).

6. The heat dissipating device for a power module according to claim 5, characterized by, The limiting structure (140) comprises at least two limiting columns (141), and the at least two limiting columns (141) are spacedly arranged along the extension direction of the heat dissipation channel (120).

7. The heat dissipating device for a power module according to claim 6, characterized by, The height of the limiting column (141) protruding from the heat dissipation surface (1111) is greater than the height of the flow guide column (1321) protruding from the heat dissipation surface (1111).

8. The heat dissipating device for a power module according to claim 6, characterized by, The cross-sectional area of the limiting column (141) is greater than the cross-sectional area of the flow guide column (1321).

9. The heat dissipating device for a power module according to any one of claims 1 or 2 or 4 to 8, characterized by, The power module (100) further comprises: At least two first back plates (150), the power module (110) corresponds to the first back plate (150) one by one, and the side of the power module (110) away from the heat dissipation channel (120) is connected with the corresponding first back plate (150); A second back plate (160) is arranged at one end of the air outlet of the heat dissipation channel (120), and the end portions of the at least two first back plates (150) close to the air outlet of the heat dissipation channel (120) are connected with the second back plate (160); A third back plate is connected with the second back plate (160).

10. The heat dissipating device for a power module according to claim 9, characterized by, The second back plate (160) is provided with a heat dissipation hole (161) corresponding to the position of the air outlet of the heat dissipation channel (120).

11. The heat dissipating device for a power module according to any one of claims 1 or 2 or 4 to 8, characterized by, The power module (100) further comprises a detection sensor (180) installed on the heat dissipation surface (1111) for detecting whether the power module (100) is immersed in the cooling liquid.

12. The heat dissipating device for a power module according to any one of claims 1 or 2 or 4 to 8, characterized by, Further comprising a heat dissipation module (200) detachably connected with the power module (100) and in thermal contact with the power module (100).

13. The heat dissipating device for a power module according to claim 12, characterized by, The heat dissipation module (200) comprises: A main heat sink (210) arranged at one end of the air inlet of the heat dissipation channel (120), and the air outlet of the main heat sink (210) is in communication with the air inlet of the heat dissipation channel (120).

14. The heat dissipating device for a power module according to claim 13, characterized by, The heat dissipation module (200) further comprises: A heat dissipation fan (220) installed on the side of the main heat sink (210) away from the power module (100), and the air outlet direction of the heat dissipation fan (220) is towards the main heat sink (210).

15. The heat sink for a power module according to claim 13 or 14, characterized in that, The main heat sink (210) is provided with an installation channel; the heat dissipation module (200) further comprises: A liquid cooling pipe (230) installed in the installation channel.

16. The heat dissipating device for a power module according to claim 12, characterized by, The heat dissipation module (200) is provided with a first clamping part (240); the power module (100) is provided with a second clamping part (190), and the first clamping part (240) and the second clamping part (190) are clamped.

17. The heat dissipating device for a power module according to claim 12, characterized by, The heat dissipation module (200) is provided with a heat conduction layer at the contact interface with the power module (100).

18. An electronic device, comprising: A heat dissipation device for a power module (100) according to any one of claims 1 to 17 is provided.

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