Silicon wafer cleaning device and cleaning method

Abstract

The invention relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device and method.The device is internally provided with a cleaning component and a lifting component, the cleaning component comprises a cleaning tank assembly, a spraying assembly and an ultrasonic assembly, and the liquid outlet end of the spraying assembly and the ultrasonic assembly are both installed in the cleaning tank assembly; the lifting component comprises a rack assembly and a conveying assembly, the rack assembly is arranged outside one side of the cleaning tank assembly, the first end of the conveying assembly is in sliding connection with the rack assembly so as to ascend or descend along the rack assembly, and the second end of the conveying assembly extends into or out of the cleaning tank assembly along with the conveying assembly; the silicon wafer unit is placed at the second end of the transportation assembly; thus, through the lifting motion of the lifting component, the silicon wafer units can be steadily immersed or moved to different working areas in the cleaning tank assembly, pollutants with weak adhesive force are cleaned through the spraying assembly, and then stubborn pollutants are cleaned through the ultrasonic assembly, so that integrated cleaning of the silicon wafer units is achieved, and the overall cleaning efficiency of silicon wafers is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device and a cleaning method. BACKGROUND

[0002] Silicon wafer is the core basic material of semiconductor manufacturing, and its production process mainly includes crystal growth, shaping, slicing, grinding, etching and polishing processes; among them, slicing is a key process in silicon wafer processing, which directly determines the thickness uniformity, surface quality and raw material utilization rate of the silicon wafer, and has a decisive influence on the subsequent processing steps and the performance of the final product. Before the slicing process, the crystal bar obtained from the crystal growth process needs to be fixed on the workpiece plate by a special adhesive to ensure stable positioning and support during the cutting process.

[0003] In the slicing process, multi-wire cutting technology is usually used, which uses extremely fine cutting wire to drive silicon carbide slurry to cut the silicon rod at high speed and precision. In this process, the slurry plays multiple roles of cooling, lubrication and grinding. Among them, silicon carbide powder serves as an abrasive to achieve cutting function, while ethylene glycol, polyethylene glycol and other base liquids are responsible for heat dissipation and chip removal. However, this cutting method allows the slurry to fully penetrate into the gap between the silicon wafers, resulting in the deposition of a large amount of silicon carbide abrasive and silicon powder mixture on the surface of the cut silicon wafers. Moreover, most semiconductor companies use slurry recycling process to reduce production costs, and this repeated use mechanism allows impurities in the cutting liquid to accumulate and be more firmly adsorbed to the surface of the silicon wafers, forming stubborn contaminants with complex composition and difficult to remove. If these contaminants are not completely removed, it will cause a series of serious subsequent process problems, such as affecting the processing precision of subsequent silicon wafer processing steps. At the same time, the silicon powder, ethylene glycol, polyethylene glycol and other substances remaining on the surface of the silicon wafers will interfere with the measurement accuracy, causing the measured silicon wafer parameters to be inconsistent with the actual values, resulting in abnormal product delivery.

[0004] To solve the above technical problems, the technical solution disclosed in Chinese patent application No. CN202111156032.7 is a kind of full-automatic silicon wafer surface high-efficiency cleaning device and operation method, including shell, the inside of shell is equipped with cavity, the middle part of cavity is provided with support mechanism for placing silicon wafer to clean, the upper and lower sides of support mechanism are all fixedly installed with water storage tank, the one side of support mechanism is provided with guide plate, the lower part of guide plate is provided with recovery mechanism, the inner wall of one side shell of recovery mechanism is provided with cooling mechanism for cooling silicon wafer, the incomplete gear is driven to rotate by the rotation of second shaft, so that the moving plate reciprocatingly limits and slides in the second sliding groove, the spray head is rotated under the action of fixed pin, and the cold air is uniformly sprayed on the dried silicon wafer through the swing of the spray head.

[0005] However, the prior art has the following technical problems: the full-automatic silicon wafer surface high-efficiency cleaning device needs to take out a piece of silicon wafer from the workpiece plate and then send it into the device for cleaning, which reduces the cleaning efficiency of the silicon wafer; specifically, the device needs to disassemble the silicon wafer group originally fixed on the workpiece plate into individual silicon wafers for cleaning, so that the subsequent cleaning operation cannot realize large-scale cleaning of the silicon wafers by using the ordered arrangement of the whole group of silicon wafers on the workpiece plate, resulting in an increase in the cleaning time of the single silicon wafer and a reduction in the overall cleaning efficiency of the silicon wafer. SUMMARY

[0006] Therefore, it is necessary to provide a silicon wafer cleaning device and a cleaning method, which can clean a silicon wafer unit, i.e., a silicon wafer group fixed on a workpiece plate, without disassembling the silicon wafer from the workpiece plate, so as to reduce the cleaning time of the single silicon wafer and improve the overall cleaning efficiency of the silicon wafer.

[0007] In a first aspect, the present application provides a silicon wafer cleaning device, which comprises a cleaning member and a lifting member. The cleaning member comprises a cleaning tank assembly, a spraying assembly and an ultrasonic assembly. The liquid outlet end of the spraying assembly and the ultrasonic assembly are both installed in the cleaning tank assembly, and the liquid outlet end of the spraying assembly is located above the ultrasonic assembly. The spraying assembly is used to flush the silicon wafer unit to remove the pollutants with weak adhesion on the surface and in the gap of the silicon wafer. The ultrasonic assembly is used to emit ultrasonic waves to the cleaning liquid in the cleaning tank assembly to generate cavitation effect and remove stubborn pollutants on the surface and in the gap of the silicon wafer. The lifting member comprises a rack assembly and a conveying assembly. The rack assembly is arranged outside one side of the cleaning tank assembly. The first end of the conveying assembly is in sliding connection with the rack assembly to ascend or descend along the rack assembly, and the second end of the conveying assembly extends into or out of the cleaning tank assembly. The silicon wafer unit is placed on the second end of the conveying assembly to drive the silicon wafer unit to make ascending and descending movements in the cleaning tank assembly by the conveying assembly, so that the silicon wafer unit passes through the spraying assembly and the ultrasonic assembly in sequence.

[0008] Preferably, the cleaning tank assembly comprises a cleaning box and a drain valve. The cleaning box is a rectangular box with an open top, and a liquid discharge port is opened at the bottom of the cleaning box to discharge the liquid inside the cleaning box. The drain valve is installed at the bottom of the cleaning box and connected with the liquid discharge port to control the opening and closing of the liquid discharge port. Guide grooves are opened at both sides of the inside of the cleaning box to guide the track of the second end of the conveying assembly ascending and descending in the cleaning box.

[0009] Preferably, the spray assembly includes two spray pipes, at least two infusion groups, a multi-way valve, an inlet pipe, and an inlet valve. The two spray pipes are symmetrically installed inside the cleaning tank assembly. Each spray pipe has at least two nozzles evenly distributed, with the output end of each nozzle facing the inside of the cleaning tank assembly, for spraying cleaning fluid onto the silicon wafer unit. Each infusion group includes a storage tank, a water pump, and an outlet pipe. The input end of the water pump is connected to the inside of the storage tank, and the output end is connected to the first end of the outlet pipe to... The liquid stored inside the storage tank is pumped to the outlet pipe. The second end of the outlet pipe is connected to one end of the multi-way valve to send the liquid inside the outlet pipe to the multi-way valve. The other end of the multi-way valve is connected to the first end of the inlet pipe to send the liquid inside each outlet pipe to the inlet pipe. The second end of the inlet pipe extends into the cleaning tank assembly and is connected to two spray pipes to send the liquid inside the inlet pipe to the two spray pipes. The inlet valve is installed on the inlet pipe to adjust the flow rate of the liquid inside the inlet pipe.

[0010] Preferably, the ultrasonic component includes at least two ultrasonic generators, each ultrasonic generator being uniformly installed inside the side wall of the cleaning chamber, with its ultrasonic output surface facing the inside of the cleaning chamber, for emitting ultrasonic waves into the cleaning fluid inside the cleaning chamber to generate a cavitation effect and remove stubborn contaminants from the surface and gaps of the silicon wafer.

[0011] Preferably, the silicon wafer cleaning device further includes a protective component, which includes two mounting plates, two mounting brackets, and at least two protective rods. The two mounting plates are respectively installed at both ends of the top surface of the workpiece plate of the silicon wafer unit, and each mounting plate has an outwardly extending mounting protrusion for connecting with the lifting end of the lifting component. The top end of each mounting bracket is fixedly installed at the bottom of the mounting plate, and the two ends of each protective rod are respectively connected to the bottom ends of the two mounting brackets. The distance between each protective rod is less than the diameter of the silicon wafer in the silicon wafer unit to prevent the silicon wafer from loosening and falling off the workpiece plate.

[0012] Preferably, the frame assembly includes a main frame, the bottom of which is fixed to the outside of one side of the cleaning tank. Two lifting guide rails are symmetrically arranged on the side of the main frame facing the cleaning tank. The transport assembly includes two load-bearing groups, a lifting frame, and a vertical push rod. Each load-bearing group includes a lifting rod and a load-bearing rod. The first end of the lifting rod is slidably mounted on the lifting guide rail, allowing the lifting rod to move up and down along the lifting guide rail. The second end of the lifting rod extends downwards and into the guide groove, allowing the lifting rod to move up and down along the trajectory of the guide groove. The first end of the load-bearing rod is fixedly connected to the second end of the lifting rod, and the second end is used to support the bottom of the mounting protrusion to support the silicon wafer unit. The second end of the load-bearing rod is also provided with a limiting rod to restrict the lateral movement of the mounting protrusion on the load-bearing rod, preventing the silicon wafer unit from falling during lifting. The two ends of the bottom of the lifting frame are fixedly connected to the top surfaces of the lifting rods of the two load-bearing groups, respectively. The fixed end of the vertical push rod is installed on the ground, and the telescopic end is fixedly connected to the bottom surface of the lifting frame, so that the extension and retraction of the telescopic end of the vertical push rod drives the lifting frame to rise and fall, thereby driving the two load-bearing groups to rise and fall synchronously.

[0013] Preferably, the lifting component further includes a clamping assembly, which includes a clamping frame, a lead screw, a drive motor, and two clamping groups. The clamping frame is fixedly installed on the top of the main frame and has a sliding groove in its middle. The lead screw is rotatably installed in the sliding groove along its length. The fixed end of the drive motor is fixedly installed on the side of the clamping frame, and the driving end is drivenly connected to one end of the lead screw to drive the lead screw to rotate in the sliding groove. Each clamping group includes a clamping block, a clamping arm, and a sliding block. The first end of the clamping block faces the protective component. The mounting protrusion has an L-shaped clamping groove for engaging with the mounting protrusion; the second end of the clamping block is fixedly connected to the bottom of the clamping arm, and the top of the clamping arm is fixedly connected to the bottom of the sliding block; the sliding block is slidably mounted in the sliding groove and has an adjustment hole; the adjustment hole is threaded to the lead screw, and the threads of the adjustment holes of the two clamping groups are opposite, so that the sliding blocks of the two clamping groups move towards each other or in opposite directions under the drive of the lead screw, thereby driving the clamping blocks of the two clamping groups to engage or disengage with the mounting protrusion, thereby clamping or releasing the silicon wafer unit.

[0014] In a second aspect, the present invention provides a silicon wafer cleaning method based on the silicon wafer cleaning apparatus described in the first aspect, comprising the following steps: S1, Installation: Install the protective components onto the silicon wafer unit to be cleaned; S2, loading: First, transfer the silicon wafer unit with the protective component to the clamping assembly. After the carrier rod of the transport assembly receives the silicon wafer unit, the clamping assembly releases the silicon wafer unit. S3, rinsing, the silicon wafer unit is driven down by the transport component to the spray component for spray cleaning; S4, Ultrasonic Cleaning: After rinsing, the silicon wafer unit is driven down by the transport component to the ultrasonic component for ultrasonic cleaning. S5, Rinsing: After ultrasonic cleaning, the silicon wafer unit is lifted to the spray assembly by the transport assembly for rinsing. S6, unloading: After rinsing, the silicon wafer unit is moved from the transport assembly to the clamping assembly to complete the cleaning of the silicon wafer unit.

[0015] Preferably, step S3 includes: S301, the drain valve is in the open state, and the spray assembly uses pure water to spray the silicon wafer unit for a first predetermined time to wash away the weakly adhered contaminants and some impurities on the surface and gaps of the silicon wafer. S302, the drain valve is closed, and the spray assembly sprays a predetermined amount of cleaning agent into the cleaning tank; S303, the silicon wafer unit is immersed in the cleaning agent under the drive of the transport component; S304, the silicon wafer unit reciprocates vertically under the drive of the transport assembly to ensure that the silicon wafer is in full contact with the cleaning agent; S305, the drain valve is in the open position to drain the cleaning agent in the cleaning tank; S306, the silicon wafer unit reciprocates vertically under the drive of the transport component. At the same time, the spray component sprays pure water onto the silicon wafer unit for a second predetermined time to remove the cleaning agent from the surface of the silicon wafer.

[0016] Preferably, step S4 includes: S401, After the wastewater generated during the silicon wafer spraying process in step S306 is discharged from the drain port, the spraying assembly continues to spray pure water to clean the cleaning tank. S402, the silicon wafer unit is lowered to the predetermined position by the transport components; S403, with the drain valve closed, the spray assembly continuously sprays pure water until the pure water in the cleaning tank completely submerges the silicon wafer unit; S404, the ultrasonic component is activated to emit ultrasonic waves into the pure water in the cleaning chamber to generate a cavitation effect, removing stubborn contaminants from the surface and gaps of the silicon wafer. This process continues for the third predetermined time.

[0017] The aforementioned silicon wafer cleaning device includes a cleaning component and a lifting component. The cleaning component comprises a cleaning tank assembly, a spray assembly, and an ultrasonic assembly. The liquid outlet of the spray assembly and the ultrasonic assembly are both installed inside the cleaning tank assembly, with the liquid outlet of the spray assembly located above the ultrasonic assembly. The lifting component comprises a frame assembly and a transport assembly. The frame assembly is located outside one side of the cleaning tank assembly. The first end of the transport assembly is slidably connected to the frame assembly to rise or fall along the frame assembly, and the second end of the transport assembly extends into or out of the cleaning tank assembly accordingly. The silicon wafer unit is placed at the second end of the transport assembly, so that the transport assembly drives the silicon wafer unit to move up and down within the cleaning tank assembly, allowing the silicon wafer unit to pass sequentially through the spray assembly and the ultrasonic assembly. Thus, through the lifting and lowering movement of the lifting component... The device can smoothly immerse or move silicon wafer units into different working areas within the cleaning tank assembly. First, it brings the wafer unit into the spray range of the spray assembly, where it is cleaned by spraying cleaning fluid to remove weakly adhering contaminants, especially slurry and silicon powder, from the surface and gaps of the silicon wafer, preventing these two contaminants from affecting subsequent ultrasonic cleaning. Then, the lifting component controls the silicon wafer unit to descend to the area where the ultrasonic assembly is located, and it is completely immersed in the cleaning fluid. The ultrasonic waves generated by the ultrasonic assembly create a cavitation effect in the cleaning fluid, peeling off stubborn contaminants from the surface and gaps of the silicon wafer, thus achieving integrated cleaning of the silicon wafer unit. This eliminates the need to remove the silicon wafer from the workpiece board, reducing the cleaning time of a single silicon wafer and improving the overall cleaning efficiency of the silicon wafer. Attached Figure Description

[0018] Figure 1 This is a perspective view of the silicon wafer cleaning apparatus of this application.

[0019] Figure 2 This is a perspective view of the cleaning tank assembly of this application.

[0020] Figure 3 This is a cross-sectional view of the cleaning tank assembly of this application.

[0021] Figure 4 This is a perspective view of the cleaning component of this application.

[0022] Figure 5 This is a perspective view of the protective component of this application.

[0023] Figure 6 This is a perspective view of the lifting component of this application.

[0024] Figure 7 This is a perspective view of the transport component of this application.

[0025] Figure 8 This is a perspective view of the clamping component of this application.

[0026] Figure 9 This is a flowchart of the silicon wafer cleaning method of this application.

[0027] In the diagram: Silicon wafer cleaning device 10, cleaning component 20, cleaning tank assembly 21, cleaning box 211, drain valve 212, drain outlet 213, guide trough 214, spray assembly 22, spray pipe 221, infusion group 222, storage tank 2221, water pump 2222, outlet pipe 2223, multi-way valve 223, inlet pipe 224, inlet valve 225, nozzle 226, ultrasonic assembly 23, ultrasonic generator 231, lifting component 30, frame assembly 31, main frame 311, lifting guide rail 3 12. Transport component 32, bearing assembly 321, lifting rod 3211, bearing rod 3212, limiting rod 3213, lifting frame 322, vertical push rod 323, clamping assembly 33, clamping frame 331, lead screw 332, drive motor 333, clamping assembly 334, clamping block 3341, clamping groove 3342, clamping arm 3343, sliding block 3344, sliding groove 335, protective component 40, mounting plate 41, mounting frame 42, protective rod 43, mounting protrusion 44, silicon wafer unit 50. Detailed Implementation

[0028] The technical solutions and effects of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0029] Please refer to Figure 1 and Figure 3In a first aspect, the present invention provides a silicon wafer cleaning apparatus 10, including a cleaning component 20 and a lifting component 30. The cleaning component 20 includes a cleaning tank assembly 21, a spray assembly 22, and an ultrasonic component 23. The liquid outlet end of the spray assembly 22 and the ultrasonic component 23 are both installed inside the cleaning tank assembly 21, and the liquid outlet end of the spray assembly 22 is located above the ultrasonic component 23. The spray assembly 22 is used to rinse the silicon wafer unit 50 to remove weakly adhering contaminants from the surface and gaps of the silicon wafer. The ultrasonic component 23 is used to emit ultrasonic waves into the cleaning liquid in the cleaning tank assembly 21 to generate a cavitation effect and remove stubborn contaminants from the surface and gaps of the silicon wafer. The lifting component 30 includes a frame assembly 31 and a transport assembly 32. The frame assembly 31 is disposed outside one side of the cleaning tank assembly 21. The first end of the transport assembly 32 is slidably connected to the frame assembly 31 to rise or fall along the frame assembly 31, and the second end of the transport assembly 32 extends into or out of the cleaning tank assembly 21 accordingly. The silicon wafer unit 50 is placed in the transport assembly 32. Secondly, the silicon wafer unit 50 is moved up and down within the cleaning tank assembly 21 by the transport component 32, allowing the silicon wafer unit 50 to pass sequentially through the spray assembly 22 and the ultrasonic component 23. Thus, the lifting component 30 smoothly immerses or moves the silicon wafer unit 50 to different working areas within the cleaning tank assembly 21. First, it enters the spray range of the spray assembly 22, where the spray cleaning fluid cleans the weakly adhering contaminants, especially slurry and silicon powder, from the surface and gaps of the silicon wafer, preventing these contaminants from affecting subsequent ultrasonic cleaning. Then, the lifting component 30 controls the silicon wafer unit 50 to descend to the area of ​​the ultrasonic component 23, completely immersing it in the cleaning fluid. The ultrasonic waves generated by the ultrasonic component 23 create a cavitation effect in the cleaning fluid, peeling away stubborn contaminants from the surface and gaps of the silicon wafer, achieving integrated cleaning of the silicon wafer unit 50. This eliminates the need to remove the silicon wafer from the workpiece board, reducing the cleaning time for a single silicon wafer and thus improving the overall cleaning efficiency of the silicon wafer.

[0030] Specifically, the ultrasonic waves generated by the ultrasonic component 23 are high-frequency mechanical vibrations. When these vibrations are transmitted into the cleaning fluid, they form alternating pressure waves, creating a cavitation effect within the fluid. The numerous microbubbles generated by this cavitation effect rapidly expand and collapse under the influence of sound pressure, releasing extremely high temperatures and pressures in a localized space, generating strong shock waves and high-speed microjets. This physical action can penetrate the narrow gaps between silicon wafers without leaving any blind spots, peeling away stubborn contaminants, such as silicon carbide abrasives, adhering to the surface and gaps of the silicon wafers. If hard particles, such as slurry and silicon powder, are present in the cleaning fluid, on the one hand, these particles will interfere with and weaken the propagation energy of the ultrasonic waves, leading to a weakened cavitation effect and reduced cleaning efficiency; on the other hand, these hard particles will impact the silicon wafer surface at high speed under the action of ultrasonic waves, easily damaging the silicon wafer surface. Therefore, removing these loose but destructive contaminants through the spray end of the spray component 22 before ultrasonic cleaning ensures thorough cleaning while preventing damage to the silicon wafer surface.

[0031] Please refer to Figures 2-3 Furthermore, the cleaning tank assembly 21 includes a cleaning tank 211 and a drain valve 212. The cleaning tank 211 is a rectangular box with an open top and a drain port 213 at the bottom for draining the liquid inside the cleaning tank 211. The drain valve 212 is installed at the bottom of the cleaning tank 211 and connected to the drain port 213 to control the opening and closing of the drain port 213. Guide grooves 214 are provided on both sides inside the cleaning tank 211 to guide the trajectory of the second end of the transport assembly 32 as it moves up and down inside the cleaning tank 211. Specifically, the two guide grooves 214 provide precise guidance for the lifting movement of the lifting end of the lifting assembly, so that the silicon wafer unit 50 remains stable during the lifting process and avoids collision damage to the silicon wafer caused by the shaking of the silicon wafer unit 50.

[0032] In this embodiment, the bottom surface of the cleaning tank 211 adopts a sloping structure that slopes towards the drain port 213 on all sides, so that the liquid gathers to the drain port 213, and the waste liquid generated during the cleaning process quickly gathers and is discharged from the drain port 213, so as to avoid the deposition of pollutants at the bottom of the cleaning tank 211, facilitate the cleaning and maintenance of the cleaning tank 211, and improve the drainage efficiency.

[0033] Please refer to Figure 4Furthermore, the spray assembly 22 includes two spray pipes 221, at least two infusion groups 222, a multi-way valve 223, an inlet pipe 224, and an inlet valve 225. The two spray pipes 221 are symmetrically installed inside the cleaning tank 211. Each spray pipe 221 is evenly provided with at least two nozzles 226, and the output end of each nozzle 226 faces the inside of the cleaning tank 211 for spraying cleaning fluid onto the silicon wafer unit 50. Each infusion group 222 includes a storage tank. 2221, water pump 2222, and outlet pipe 2223. The input end of water pump 2222 is connected to the inside of liquid storage tank 2221, and the output end is connected to the first end of outlet pipe 2223 to pump the liquid stored inside liquid storage tank 2221 to outlet pipe 2223. The second end of outlet pipe 2223 is connected to one end of multi-way valve 223 to send the liquid inside outlet pipe 2223 to multi-way valve 223. The other end of multi-way valve 223 is connected to inlet pipe. The first end of the 224 is connected to send the liquid inside each outlet pipe 2223 to the inlet pipe 224; the second end of the inlet pipe 224 extends into the cleaning tank 211 and is connected to two spray pipes 221 to send the liquid inside the inlet pipe 224 to the two spray pipes 221; the inlet valve 225 is installed on the inlet pipe 224 to adjust the flow rate of the liquid in the inlet pipe 224; specifically, the cooperation of multiple sets of inlet groups 222 and multi-way valves 223 can realize the flexible supply and rapid switching of different cleaning solutions (e.g., pure water, cleaning agent); the water pump 2222 is used to provide the conveying power, and the inlet valve 225 adjusts the flow rate and velocity of the cleaning solution to adapt to the cleaning solution requirements of different rinsing stages; the symmetrically arranged spray pipes 221 and the evenly distributed nozzles 226 can evenly spray the silicon wafer unit 50 in all directions, ensuring that there are no dead corners in the cleaning process, effectively providing cleaning consistency and efficiency.

[0034] In this embodiment, the distance between adjacent nozzles 226 is 3cm, so that the cleaning fluid sprayed from each nozzle 226 can cover the entire silicon wafer unit 50.

[0035] In this embodiment, there are two infusion groups 222, which are used to store pure water and cleaning agent respectively. The cleaning agent is composed of surfactant, chelating agent, corrosion inhibitor and pure water in a predetermined ratio. The multi-way valve 223 is an electric three-way ball valve to switch the connection state between the two infusion groups 222 and the inlet pipe 224, so that different cleaning solutions enter the spray pipe 221. The multi-way valve 223 can be controlled by an electrical signal to switch the pipeline, which is convenient for integration into the automation system.

[0036] Please refer to Figure 3Furthermore, the ultrasonic component 23 includes at least two ultrasonic generators 231, each ultrasonic generator 231 being uniformly installed inside the side wall of the cleaning chamber 211 with its ultrasonic output surface facing the interior of the cleaning chamber 211. These generators emit ultrasonic waves into the cleaning fluid inside the cleaning chamber 211 to generate a cavitation effect, removing stubborn contaminants from the silicon wafer surface and gaps. Specifically, the ultrasonic generators 231 (e.g., piezoelectric ceramic transducers arranged inside the side wall of the cleaning chamber 211) generate high-frequency mechanical vibrations in the cleaning fluid and transmit these vibrations to the cleaning fluid, forming alternating pressure waves, thereby generating a cavitation effect within the cleaning fluid. The numerous microbubbles generated by the cavitation effect instantly collapse, releasing strong shock waves and microjets that can effectively penetrate the gaps in the silicon wafer, thoroughly removing stubborn contaminants such as silicon carbide abrasive and organic residues adhering to the silicon wafer surface and gaps. The uniformly arranged ultrasonic generators 231 ensure the uniform distribution of the ultrasonic field within the cleaning chamber 211, avoiding uneven cleaning and thus improving the cleaning effect of ultrasonic cleaning.

[0037] Please refer to Figure 5 Furthermore, the silicon wafer cleaning device 10 also includes a protective component 40, which includes two mounting plates 41, two mounting brackets 42, and at least two protective rods 43. The two mounting plates 41 are respectively installed at both ends of the top surface of the workpiece plate of the silicon wafer unit 50, and each mounting plate 41 has an outwardly extending mounting protrusion 44 for connecting with the lifting end of the lifting component 30. The top end of each mounting bracket 42 is fixedly installed at the bottom of the mounting plate 41, and the two ends of each protective rod 43 are respectively connected to the bottom ends of the two mounting brackets 42. The distance between each protective rod 43 is less than the diameter of the silicon wafer in the silicon wafer unit 50 to prevent the silicon wafer from loosening and falling off the workpiece plate.

[0038] In this embodiment, the mounting bracket 42 and the mounting plate 41 can be fixedly connected by welding.

[0039] Please refer to Figure 6 and Figure 7Furthermore, the frame assembly 31 includes a main frame 311, the bottom end of which is fixed to the outside of one side of the cleaning tank 211. Two lifting guide rails 312 are symmetrically arranged on the side of the main frame 311 facing the cleaning tank 211. The transport assembly 32 includes two load-bearing groups 321, a lifting frame 322, and a vertical push rod 323. Each load-bearing group 321 includes a lifting rod 3211 and a load-bearing rod 3212. The first end of the lifting rod 3211 is slidably mounted on the lifting guide rail 312, allowing the lifting rod 3211 to rise and fall along the lifting guide rail 312. The second end of the lifting rod 3211 extends downwards and into the guide groove 214, allowing the lifting rod 3211 to rise and fall along the trajectory of the guide groove 214. The first end of the support rod 3212 is fixedly connected to the second end of the lifting rod 3211. The second end is used to support the bottom of the mounting protrusion 44 to support the silicon wafer unit 50. The second end of the support rod 3212 is also provided with a limiting rod 3213 to limit the lateral movement of the mounting protrusion 44 on the support rod 3212 and prevent the silicon wafer unit 50 from falling during the lifting process. The two ends of the bottom of the lifting frame 322 are fixedly connected to the top surface of the lifting rod 3211 of the two support groups 321 respectively. The fixed end of the vertical push rod 323 is installed on the ground, and the telescopic end is fixedly connected to the bottom surface of the lifting frame 322 so that the lifting frame 322 is driven to rise and fall by the telescopic end of the vertical push rod 323, thereby driving the two support groups 321 to rise and fall synchronously.

[0040] Please refer to Figure 6 and Figure 8Furthermore, the lifting component 30 also includes a clamping assembly 33, which includes a clamping frame 331, a lead screw 332, a drive motor 333, and two clamping groups 334. The clamping frame 331 is fixedly installed on the top of the main frame 311, and has a sliding groove 335 in its middle. The lead screw 332 is rotatably installed in the sliding groove 335 along its length. The fixed end of the drive motor 333 is fixedly installed on the side of the clamping frame 331, and the drive end is connected to one end of the lead screw 332. The drive connection allows the lead screw 332 to rotate in the slide groove 335 via the drive motor 333; both clamping assemblies 334 include a clamping block 3341, a clamping arm 3343, and a sliding block 3344. The first end of the clamping block 3341 faces the mounting protrusion 44 of the protective member 40 and has an L-shaped clamping groove 3342 for engaging with the mounting protrusion 44; the second end of the clamping block 3341 is fixedly connected to the bottom of the clamping arm 3343, and the top of the clamping arm 3343 is connected to the sliding block 3344. The bottom of the 4 is fixedly connected; the sliding block 3344 is slidably installed in the slide groove 335 and the sliding block 3344 is provided with an adjustment hole; the adjustment hole is threadedly connected to the lead screw 332, and the thread directions of the adjustment holes of the two clamping groups 334 are opposite, so that the sliding blocks 3344 of the two clamping groups 334 move towards each other or in opposite directions under the drive of the lead screw 332, thereby driving the clamping blocks 3341 of the two clamping groups 334 to engage or disengage from the mounting protrusion 44, thereby clamping or releasing the silicon wafer unit. 50; Specifically, the sliding blocks 3344 of the two clamping groups 334 move synchronously under the drive of the lead screw 332, and the thread directions of the adjustment holes of the two clamping groups 334 are opposite, so that the sliding blocks 3344 of the two clamping groups 334 move synchronously towards each other or in opposite directions under the drive of the lead screw 332, thereby making the clamping grooves 3342 of the two clamping groups 334 synchronously engage with the mounting protrusion 44 or synchronously separate from the mounting protrusion 44, thereby realizing the clamping or releasing of the silicon wafer unit 50.

[0041] In this embodiment, two adjustment grooves are symmetrically provided inside the slide groove 335 along the length direction of the slide groove 335. Adjustment protrusions are provided on both sides of the sliding block 3344. The two adjustment protrusions extend into the two adjustment grooves respectively to realize the sliding connection between the sliding block 3344 and the slide groove 335.

[0042] In this embodiment, the clamping arm 3343 and the sliding block 3344 can be connected by welding.

[0043] In this embodiment, after the clamping block 3341 is engaged with the mounting protrusion 44 through the clamping groove 3342, a gap is left between the clamping block 3341 and the mounting plate 41 so that the second end of the bearing rod 3212 can enter through the gap and contact the bottom of the mounting protrusion 44, so as to achieve stable bearing of the silicon wafer unit 50 by the bearing rod 3212.

[0044] In this embodiment, the vertical push rod 323 can be an electric push rod. Using an electric push rod as a drive source, the extension stroke, speed and position of the vertical push rod 323 can be precisely controlled by electrical signals, thereby ensuring the smoothness and repeatability of the lifting action. This control method is easy to integrate into an automation system, realize the precise operation of the silicon wafer cleaning process, and improve the reliability of the cleaning process.

[0045] Example 1: Working process of silicon wafer cleaning device 10 1. Fix the two mounting plates 41 to the top two ends of the workpiece plate of the silicon wafer unit 50 with bolts, so that the mounting protrusions 44 of the mounting plates 41 face outwards, and then install at least two protective rods 43 between the bottom ends of the two mounting brackets 42. 2. The silicon wafer unit 50 is lifted and moved between the two clamping blocks 3341 using a lifting device; 3. The lead screw 332 rotates forward under the drive of the drive motor 333, driving the two sliding blocks 3344 to move towards each other in the slide groove 335, which drives the clamping arm 3343 and the clamping block 3341 at the end to move synchronously, so that the clamping groove 3342 on the clamping block 3341 is aligned with the mounting protrusion 44 of the protective member 40 and engaged, so as to firmly clamp and fix the silicon wafer unit 50 from both sides. 4. The lifting frame 322 rises under the drive of the vertical push rod 323, which drives the two bearing groups 321 to rise synchronously, so that the bearing rods 3212 of the two bearing groups 321 rise to contact the bottom of the mounting protrusion 44, so as to stably support the entire weight of the silicon wafer unit 50. 5. After the transport component 32 is firmly supported, the lead screw 332 rotates in the opposite direction under the drive of the drive motor 333, driving the two sliding blocks 3344 to move in the opposite direction in the slide groove 335, so that the clamping groove 3342 on the clamping block 3341 is separated from the mounting protrusion 44 of the protective component 40, and the silicon wafer unit 50 is moved to the transport component 32. 6. The lifting frame 322 descends under the drive of the vertical push rod 323, which drives the two bearing groups 321 to descend synchronously, smoothly sending the silicon wafer unit 50 into the cleaning box 211 and moving it to the working area of ​​the spray assembly 22. 7. Switch the valve port of the multi-way valve 223 to connect the liquid delivery group 222 for conveying pure water and the inlet pipe 224. The corresponding water pump 2222 starts and pumps the pure water in the corresponding storage tank 2221 out through the outlet pipe 2223. The inlet valve 225 is adjusted to the predetermined opening degree to control the pure water to be delivered to the two spray pipes 221 at the set flow rate and speed. Finally, the silicon wafer unit 50 is sprayed in all directions through the evenly distributed nozzles 226 for 10-15 minutes to remove the weakly adhered contaminants and some impurities, such as silicon powder, mortar and dust, from the surface and gaps of the silicon wafer by rinsing. 8. Close the drain valve 212, switch the valve port of the multi-way valve 223 to connect the liquid delivery group 222 for conveying cleaning agent and the inlet pipe 224, start the corresponding water pump 2222, pump the cleaning agent in the corresponding storage tank 2221 out through the outlet pipe 2223 and store it in the cleaning tank 211, and control the spraying volume to 3L. 9. The lifting frame 322 descends under the drive of the vertical push rod 323, immersing the silicon wafer unit 50 in the cleaning agent; 10. The lifting frame 322 moves back and forth in the vertical direction under the drive of the vertical push rod 323, so that the silicon wafer unit 50 is repeatedly immersed in the cleaning agent, so that the silicon wafer and the cleaning agent are in full contact, thereby dissolving organic matter and some stubborn contaminants.

[0046] 11. The lifting frame 322 rises and moves to the working area of ​​the spray assembly 22 under the drive of the vertical push rod 323; at the same time, the drain valve 212 is opened to discharge the cleaning agent in the cleaning tank 211. 12. The lifting frame 322 moves back and forth in the vertical direction under the drive of the vertical push rod 323. At the same time, the spray assembly 22 switches to pure water spraying again and sprays pure water onto the silicon wafer unit 50. This process lasts for 15 minutes to ensure that the pure water fully rinses every corner of the silicon wafer unit 50 and removes the residue of the cleaning agent. 13. After the wastewater generated during the spray cleaning process is discharged, the cleaning tank 211 is cleaned by the pure water sprayed by the spray assembly 22 to remove the contaminants remaining in the cleaning tank 211. 14. The lifting frame 322 descends under the drive of the vertical push rod 323, which drives the two bearing groups 321 to descend synchronously, moving the silicon wafer unit 50 to the working area of ​​the ultrasonic component 23. 15. Close the drain valve 212 and the drain outlet 213. The spray assembly 22 continues to spray pure water until the liquid level in the cleaning tank 211 rises and completely submerges the silicon wafer unit 50. 16. Start each ultrasonic generator 231. Each ultrasonic generator 231 converts high-frequency electrical signals into high-frequency mechanical vibrations, generating a strong cavitation effect in the cleaning fluid. The shock waves and microjets generated when the cavitation bubbles collapse can completely remove stubborn contaminants in the gaps between silicon wafers. This process lasts for 20 minutes. 17. Open drain valve 212 to drain the wastewater generated during the ultrasonic cleaning process; 18. The lifting frame 322 rises under the drive of the vertical push rod 323, which drives the two bearing groups 321 to rise synchronously. The silicon wafer unit 50 moves to the working area of ​​the spray assembly 22. The spray assembly 22 sprays pure water onto the silicon wafer unit 50 to remove residual cleaning agent or contaminants. 19. The transport component 32 drives the silicon wafer unit 50 to rise to the initial position. The lead screw 332 rotates forward under the drive of the drive motor 333, driving the two sliding blocks 3344 to move towards each other in the slide groove 335, which drives the clamping arm 3343 and the clamping block 3341 at the end to move synchronously, so that the clamping groove 3342 on the clamping block 3341 is aligned with the mounting protrusion 44 of the protective component 40 and engages, so as to firmly clamp and fix the silicon wafer unit 50 from both sides. 20. The lifting frame 322 descends under the drive of the vertical push rod 323, which drives the two bearing groups 321 to descend synchronously, so that the two bearing rods 3212 are separated from the mounting protrusion 44. Then the lifting equipment takes out the silicon wafer unit 50 from between the two clamping blocks 3341.

[0047] Please refer to Figure 9 Secondly, the present invention provides a silicon wafer cleaning method based on the silicon wafer cleaning apparatus 10 of the first aspect, comprising the following steps: S1, Installation: Install the protective component 40 onto the silicon wafer unit 50 to be cleaned; specifically, the installation process is as follows: fix the two mounting plates 41 to the top ends of the workpiece plate of the silicon wafer unit 50 with bolts, so that the mounting protrusions 44 of the mounting plates 41 face outwards, and then install at least two protective rods 43 between the bottom ends of the two mounting brackets 42. S2, loading: First, transfer the silicon wafer unit 50 with the protective component 40 to the clamping assembly 33. After the transport assembly 32 receives the silicon wafer unit 50, the clamping assembly 33 releases the silicon wafer unit 50. S3, rinsing, the silicon wafer unit 50 is driven down by the transport component 32 to the spray component 22 for spray cleaning; S4, ultrasonic cleaning. After rinsing, the silicon wafer unit 50 is driven by the transport component 32 to the ultrasonic component 23 for ultrasonic cleaning. S5, Rinsing. After ultrasonic cleaning, the silicon wafer unit 50 is lifted to the spray assembly 22 by the transport assembly 32 for rinsing. Specifically, the rinsing process is as follows: the lifting frame 322 is lifted by the vertical push rod 323, which drives the two bearing groups 321 to rise synchronously. The silicon wafer unit 50 moves to the working area of ​​the spray assembly 22, and the spray assembly 22 sprays pure water onto the silicon wafer unit 50 to remove residual cleaning agent or contaminants. S6, after unloading and rinsing, the silicon wafer unit 50 is moved from the transport assembly 32 to the clamping assembly 33 to complete the cleaning of the silicon wafer unit 50.

[0048] Furthermore, step S2 includes: S201, the silicon wafer unit 50 is lifted and moved between the two clamping blocks 3341 by the lifting device; S202, the lead screw 332 rotates forward under the drive of the drive motor 333, driving the two sliding blocks 3344 to move towards each other in the slide groove 335, driving the clamping arm 3343 and the clamping block 3341 at the end to move synchronously, so that the clamping groove 3342 on the clamping block 3341 is aligned with the mounting protrusion 44 of the protective member 40 and engaged, so as to firmly clamp and fix the silicon wafer unit 50 from both sides. S203, the lifting frame 322 rises under the drive of the vertical push rod 323, which drives the two bearing groups 321 to rise synchronously, so that the bearing rods 3212 of the two bearing groups 321 rise to the bottom contact of the mounting protrusion 44, so as to stably support the entire weight of the silicon wafer unit 50. S204. After the transport component 32 is firmly supported, the lead screw 332 rotates in the opposite direction under the drive of the drive motor 333, driving the two sliding blocks 3344 to move in the opposite direction in the slide groove 335, so that the clamping groove 3342 on the clamping block 3341 is separated from the mounting protrusion 44 of the protective component 40, and the silicon wafer unit 50 is moved to the transport component 32. Furthermore, step S3 includes: S301, with drain valve 212 in the open state, spray assembly 22 uses pure water to spray silicon wafer unit 50 for a first predetermined time to wash away contaminants and some impurities with weak adhesion on the surface and gaps of the silicon wafer. S302, with the drain valve 212 in the closed state, the spray assembly 22 sprays a predetermined amount of cleaning agent into the cleaning tank 211; S303, the silicon wafer unit 50 is immersed in the cleaning agent under the drive of the transport component 32; S304, the silicon wafer unit 50 reciprocates vertically under the drive of the transport component 32 so that the silicon wafer can fully contact the cleaning agent; S305, drain valve 212 is in the open state to drain the cleaning agent in cleaning tank 211; S306, the silicon wafer unit 50 reciprocates vertically under the drive of the transport component 32. At the same time, the spray component 22 sprays pure water onto the silicon wafer unit 50 for a second predetermined time to remove the cleaning agent from the surface of the silicon wafer.

[0049] Furthermore, step S4 includes: S401, after the wastewater generated during the spraying of silicon wafers in step S306 is discharged from the drain port 213, the spraying assembly 22 continues to spray pure water to clean the cleaning tank 211. S402, the silicon wafer unit 50 is lowered to a predetermined position under the drive of the transport component 32; S403, drain valve 212 is closed, spray assembly 22 continuously sprays pure water until the pure water in cleaning tank 211 completely submerges silicon wafer unit 50. S404, the ultrasonic component 23 is activated to emit ultrasonic waves into the pure water in the cleaning tank 211 to generate a cavitation effect, removing stubborn contaminants from the surface and gaps of the silicon wafer. This process continues for a third predetermined time.

[0050] Furthermore, step S6 includes: S601, the transport component 32 drives the silicon wafer unit 50 to rise to the initial position; S602, the lead screw 332 rotates under the drive of the drive motor 333, driving the two sliding blocks 3344 to move towards each other in the slide groove 335, driving the clamping arm 3343 and the clamping block 3341 at the end to move synchronously, so that the clamping groove 3342 on the clamping block 3341 is aligned with the mounting protrusion 44 of the protective member 40 and engaged, so as to firmly clamp and fix the silicon wafer unit 50 from both sides. S603, the lifting frame 322 descends under the drive of the vertical push rod 323, causing the two bearing groups 321 to descend synchronously, so that the two bearing rods 3212 are separated from the mounting protrusion 44, and then the lifting device takes out the silicon wafer unit 50 from between the two clamping blocks 3341.

[0051] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A silicon wafer cleaning apparatus, characterized in that, The device includes a cleaning component and a lifting component. The cleaning component comprises a cleaning tank assembly, a spray assembly, and an ultrasonic component. The liquid outlet of the spray assembly and the ultrasonic component are both installed inside the cleaning tank assembly, with the liquid outlet of the spray assembly located above the ultrasonic component. The spray assembly is used to rinse the silicon wafer unit to remove weakly adhering contaminants from the surface and gaps of the silicon wafer. The ultrasonic component emits ultrasonic waves into the cleaning liquid in the cleaning tank assembly to generate a cavitation effect, removing stubborn contaminants from the surface and gaps of the silicon wafer. The lifting component includes a frame assembly and a transport assembly. The frame assembly is located outside one side of the cleaning tank assembly. The first end of the transport assembly is slidably connected to the frame assembly to rise or fall along the frame assembly, and the second end of the transport assembly extends into or out of the cleaning tank assembly. The silicon wafer unit is placed at the second end of the transport assembly, so that the transport assembly drives the silicon wafer unit to move up and down within the cleaning tank assembly, allowing the silicon wafer unit to pass sequentially through the spray assembly and the ultrasonic component.

2. The silicon wafer cleaning apparatus as described in claim 1, characterized in that, The cleaning tank assembly includes a cleaning tank and a drain valve. The cleaning tank is a rectangular box with an open top and a drain port at the bottom for draining the liquid inside the cleaning tank. The drain valve is installed at the bottom of the cleaning tank and connected to the drain port to control the opening and closing of the drain port. Guide grooves are provided on both sides inside the cleaning tank to guide the second end of the transport assembly as it moves up and down inside the cleaning tank.

3. The silicon wafer cleaning apparatus as described in claim 2, characterized in that, The spray assembly includes two spray pipes, at least two infusion groups, a multi-way valve, an inlet pipe, and an inlet valve. The two spray pipes are symmetrically installed inside the cleaning tank assembly. Each spray pipe has at least two nozzles evenly distributed, with the output end of each nozzle facing inwards towards the cleaning tank assembly, for spraying cleaning fluid onto the silicon wafer units. Each infusion group includes a storage tank, a water pump, and an outlet pipe. The input end of the water pump is connected to the inside of the storage tank, and the output end is connected to the first end of the outlet pipe to dissipate the stored fluid. The liquid stored inside the tank is pumped to the outlet pipe. The second end of the outlet pipe is connected to one end of the multi-way valve to send the liquid inside the outlet pipe to the multi-way valve. The other end of the multi-way valve is connected to the first end of the inlet pipe to send the liquid inside each outlet pipe to the inlet pipe. The second end of the inlet pipe extends into the cleaning tank assembly and is connected to two spray pipes to send the liquid inside the inlet pipe to the two spray pipes. The inlet valve is installed on the inlet pipe to adjust the flow rate of the liquid inside the inlet pipe.

4. The silicon wafer cleaning apparatus as described in claim 2, characterized in that, The ultrasonic component includes at least two ultrasonic generators, each of which is uniformly installed inside the side wall of the cleaning chamber with its ultrasonic output surface facing the inside of the cleaning chamber. It is used to emit ultrasonic waves into the cleaning fluid inside the cleaning chamber to generate a cavitation effect and remove stubborn contaminants from the surface and gaps of the silicon wafer.

5. The silicon wafer cleaning apparatus as described in claim 2, characterized in that, The silicon wafer cleaning device also includes a protective component, which includes two mounting plates, two mounting brackets, and at least two protective rods. The two mounting plates are respectively installed at both ends of the top surface of the workpiece plate of the silicon wafer unit, and each mounting plate has an outwardly extending mounting protrusion for connecting with the lifting end of the lifting component. The top end of each mounting bracket is fixedly installed at the bottom of the mounting plate, and the two ends of each protective rod are respectively connected to the bottom ends of the two mounting brackets. The distance between each protective rod is smaller than the diameter of the silicon wafer in the silicon wafer unit to prevent the silicon wafer from loosening and falling off the workpiece plate.

6. The silicon wafer cleaning apparatus as described in claim 5, characterized in that, The frame assembly includes a main frame, the bottom of which is fixed to the outside of one side of the cleaning tank. Two lifting guide rails are symmetrically arranged on the side of the main frame facing the cleaning tank. The transport assembly includes two load-bearing groups, a lifting frame, and a vertical push rod. Each load-bearing group includes a lifting rod and a load-bearing rod. The first end of the lifting rod is slidably mounted on the lifting guide rail, allowing it to move up and down along the rail. The second end of the lifting rod extends downwards and into the guide groove, allowing it to move up and down along the guide groove's trajectory. The first end of the load-bearing rod is fixedly connected to the second end of the lifting rod, and the second end is used to support the bottom of the mounting protrusion to support the silicon wafer unit. The second end of the load-bearing rod also has a limiting rod to restrict the lateral movement of the mounting protrusion on the load-bearing rod, preventing the silicon wafer unit from falling during lifting. The two ends of the bottom of the lifting frame are fixedly connected to the top surfaces of the lifting rods of the two load-bearing groups. The fixed end of the vertical push rod is mounted on the ground, and the telescopic end is fixedly connected to the bottom surface of the lifting frame, so that the extension and retraction of the telescopic end of the vertical push rod drives the lifting frame to rise and fall, thereby causing the two load-bearing groups to rise and fall synchronously.

7. The silicon wafer cleaning apparatus as described in claim 6, characterized in that, The lifting component further includes a clamping assembly, which includes a clamping frame, a lead screw, a drive motor, and two clamping groups. The clamping frame is fixedly installed on the top of the main frame and has a sliding groove in its middle. The lead screw is rotatably installed in the sliding groove along its length. The fixed end of the drive motor is fixedly installed on the side of the clamping frame, and the driving end is drivenly connected to one end of the lead screw to drive the lead screw to rotate in the sliding groove. Each clamping group includes a clamping block, a clamping arm, and a sliding block. The first end of the clamping block faces the mounting of the protective component. The mounting protrusion has an L-shaped clamping groove for engaging with the mounting protrusion; the second end of the clamping block is fixedly connected to the bottom of the clamping arm, and the top of the clamping arm is fixedly connected to the bottom of the sliding block; the sliding block is slidably mounted in the sliding groove and has an adjustment hole; the adjustment hole is threaded to a lead screw, and the threads of the adjustment holes of the two clamping groups are opposite, so that the sliding blocks of the two clamping groups move towards each other or in opposite directions under the drive of the lead screw, thereby driving the clamping blocks of the two clamping groups to engage or disengage with the mounting protrusion, thereby clamping or releasing the silicon wafer unit.

8. A silicon wafer cleaning method based on the silicon wafer cleaning apparatus according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1, Installation: Install the protective components onto the silicon wafer unit to be cleaned; S2, loading: First, transfer the silicon wafer unit with the protective component to the clamping assembly. After the carrier rod of the transport assembly receives the silicon wafer unit, the clamping assembly releases the silicon wafer unit. S3, rinsing, the silicon wafer unit is driven down by the transport component to the spray component for spray cleaning; S4, Ultrasonic Cleaning: After rinsing, the silicon wafer unit is driven down by the transport component to the ultrasonic component for ultrasonic cleaning. S5, Rinsing: After ultrasonic cleaning, the silicon wafer unit is lifted to the spray assembly by the transport assembly for rinsing. S6, unloading: After rinsing, the silicon wafer unit is moved from the transport assembly to the clamping assembly to complete the cleaning of the silicon wafer unit.

9. The silicon wafer cleaning method as described in claim 8, characterized in that, Step S3 includes: S301, the drain valve is in the open state, and the spray assembly uses pure water to spray the silicon wafer unit for a first predetermined time to wash away the weakly adhered contaminants and some impurities on the surface and gaps of the silicon wafer. S302, the drain valve is closed, and the spray assembly sprays a predetermined amount of cleaning agent into the cleaning tank; S303, the silicon wafer unit is immersed in the cleaning agent under the drive of the transport component; S304, the silicon wafer unit reciprocates vertically under the drive of the transport assembly to ensure that the silicon wafer is in full contact with the cleaning agent; S305, the drain valve is in the open position to drain the cleaning agent in the cleaning tank; S306, the silicon wafer unit reciprocates vertically under the drive of the transport component. At the same time, the spray component sprays pure water onto the silicon wafer unit for a second predetermined time to remove the cleaning agent from the surface of the silicon wafer.

10. The silicon wafer cleaning method as described in claim 9, characterized in that, Step S4 includes: S401, After the wastewater generated during the silicon wafer spraying process in step S306 is discharged from the drain port, the spraying assembly continues to spray pure water to clean the cleaning tank. S402, the silicon wafer unit is lowered to the predetermined position by the transport components; S403, with the drain valve closed, the spray assembly continuously sprays pure water until the pure water in the cleaning tank completely submerges the silicon wafer unit; S404, the ultrasonic component is activated to emit ultrasonic waves into the pure water in the cleaning chamber to generate a cavitation effect, removing stubborn contaminants from the surface and gaps of the silicon wafer. This process continues for the third predetermined time.

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