Method for preparing electron microscope inclusion analysis sample from thin plate below 10mm

Abstract

The invention discloses a method for preparing an electron microscope inclusion analysis sample from a thin plate below 10mm. The method specifically comprises the following steps: adhering a thin plate sample to a specific platform through a conductive adhesive special for an electron microscope, so that the thin plate and the platform form a whole, and then carrying out grinding and polishing and electron microscope scanning on an electron microscope inclusion surface, the platform is a cylinder or a cuboid; the diameter of the circular cross section of the cylindrical platform is 25mm or 35mm; the cross section of the cuboid platform is square, and the side length of the cuboid platform is 25 mm or 35 mm. And the plane of the sheet sample is consistent with the cross section of the platform in shape and size. By means of the method, hands can be prevented from being hurt in the grinding and polishing process of the thin plate with the thickness smaller than 10 mm, the sample preparation speed is increased, and the electron microscope scanning effect of the sample is not affected; and the operation is simple and practical.

Description

Technical Field

[0001] This invention relates to a method for preparing electron microscopy inclusion analysis samples from thin plates less than 10 mm thick. Background Technology

[0002] Electron microscopy inclusion samples require multiple polishing processes during preparation. Holding the sample by hand during polishing, typically at a height of around 15mm, is beneficial. However, for some rolled plates or other thin plates, usually less than 10mm thick, hand polishing is inconvenient, can easily cause hand injuries, and poses safety risks. Using resin-mounted thin plates results in non-conductive samples, making it impossible to observe inclusions under an electron microscope. Summary of the Invention

[0003] The purpose of this invention is to provide a method for preparing electron microscopy inclusion analysis samples from thin plates less than 10 mm thick, which ensures safety and improves the sample preparation speed.

[0004] To achieve the above objectives, the present invention adopts the following technical solution.

[0005] A method for preparing electron microscopy inclusion analysis samples from thin plates less than 10 mm in diameter includes: attaching the thin plate sample to a specific platform using conductive adhesive for electron microscopy, making the thin plate and the platform a whole; and then polishing and scanning the inclusion surface under an electron microscope.

[0006] Furthermore, in the method of the present invention, the height of the platform is 10mm or 15mm.

[0007] Furthermore, in the method of the present invention, the platform is a cylinder or a cuboid; the diameter of the circular cross-section of the cylindrical platform is 25mm or 35mm; the cross-section of the cuboid platform is a square with a side length of 25mm or 35mm.

[0008] Furthermore, in the method of the present invention, the circular or square cross-sections on the upper and lower sides of the platform are flat and free of debris.

[0009] Furthermore, in the method of the present invention, the platform is made of steel.

[0010] Furthermore, in the method of the present invention, the plane of the thin plate sample has the same shape and size as the cross-section of the platform.

[0011] Furthermore, in the method of the present invention, the thin plate plane on the side to which it is pasted with the platform is polished to make it conductive, flat, and ensure that the curvature does not exceed 2mm.

[0012] Furthermore, in the method of the present invention, when the thickness of the thin plate is ≤5mm, a platform with a height of 15mm is used; when 5mm < the thickness of the thin plate is ≤10mm, a platform with a height of 10mm is used.

[0013] The beneficial effects of the technical solution of this invention are as follows: This invention increases the sample height by pairing a thin plate (less than 10 mm) with a matching platform. This not only avoids hand injury during the polishing process of thin plates (less than 10 mm) and speeds up sample preparation, but also does not affect the scanning effect of sample inclusions in electron microscopy. Furthermore, it is simple and practical to operate. Detailed Implementation

[0014] The present invention will be further described in detail below with reference to specific embodiments. Example 1

[0015] In this embodiment, the thickness of the thin plate is 10 mm, and the preparation method of the sample for electron microscopy inclusion analysis is as follows: (1) Make a cylindrical steel platform with a diameter of 25mm and a height of 10mm. The circular cross-sections on the top and bottom sides of the platform are flat and free of debris. (2) The thin plate is processed into a cylinder with a diameter of 25mm and a height of 10mm, and the cross section of the side to which it is pasted with the platform is polished to make it conductive, flat, and with a curvature of no more than 2mm.

[0016] (3) The thin plate sample is attached to the platform with conductive adhesive for electron microscope, so that the platform and the thin plate form a cylinder with a diameter of 25 mm and a height of 20 mm.

[0017] (4) The thin plate and platform integrated sample can be ground, polished and subjected to electron microscopy scanning of inclusions. Example 2

[0018] In this embodiment, the thickness of the thin plate is 10 mm, and the preparation method of the sample for electron microscopy inclusion analysis is as follows: (1) Make a cylindrical steel platform with a diameter of 35mm and a height of 10mm. The circular cross-sections on the top and bottom sides of the platform are flat and free of debris. (2) The thin plate is processed into a cylinder with a diameter of 35mm and a height of 10mm, and the cross section of the side to which it is pasted with the platform is polished to make it conductive, flat, and with a curvature of no more than 2mm.

[0019] (3) The thin plate sample is attached to the platform with conductive adhesive for electron microscope, so that the platform and the thin plate form a cylinder with a diameter of 35 mm and a height of 20 mm.

[0020] (4) The thin plate and platform integrated sample can be ground, polished and subjected to electron microscopy scanning of inclusions. Example 3

[0021] In this embodiment, the thickness of the thin plate is 5 mm, and the preparation method of the sample for electron microscopy inclusion analysis is as follows: (1) Make a rectangular steel platform with a cross-section of 35mm x 35mm and a height of 15mm. The square cross-sections on the top and bottom sides of the platform are flat and free of debris. (2) The thin plate is processed into a cuboid with a side length of 35mm x 35mm and a height of 5mm, and the cross-section of the side to which it is pasted with the platform is polished to make it conductive, flat, and with a curvature of no more than 2mm.

[0022] (3) The thin plate sample is attached to the platform with conductive adhesive for electron microscope, so that the platform and the thin plate form a cuboid with a cross-section of 35mm x 35mm and a height of 20mm.

[0023] (4) The thin plate and platform integrated sample can be ground, polished and subjected to electron microscopy scanning of inclusions.

Claims

1. A method for preparing a sample for electron microscope inclusion analysis of a thin sheet of 10 mm or less, characterized by, The thin plate sample is pasted on the special platform by the conductive glue for electron microscope, so that the thin plate and the platform become a whole, then the electron microscope inclusion surface is polished and scanned.

2. The method for preparing an inclusion analysis sample for an electron microscope thin plate of 10 mm or less according to claim 1, characterized in that, The height of the platform is 10mm or 15mm.

3. The method for preparing an inclusion analysis sample for an electron microscope thin foil according to claim 1, wherein The platform is a cylinder or a cuboid; the diameter of the circular cross section of the cylinder platform is 25mm or 35mm; the cross section of the cuboid platform is a square with a side length of 25mm or 35mm.

4. The method for preparing an inclusion analysis sample for an electron microscope thin foil according to claim 1, wherein The circular or square cross section of the platform is flat and has no impurities on the upper and lower sides.

5. The method of claim 1, wherein the sample is a 10 mm or less thin plate specimen for inclusion analysis by electron microscopy. The platform is made of steel.

6. The method of claim 1, wherein the sample is a 10 mm or less thin plate specimen for inclusion analysis by electron microscopy. The plane of the thin plate sample is consistent with the shape and size of the cross section of the platform.

7. The method of claim 1, wherein the sample is a 10 mm or less thin plate specimen for inclusion analysis by electron microscopy. The plane of the thin plate sample pasted on the platform is polished to be conductive and flat, and the bending degree is not more than 2mm.

8. The method of claim 1, wherein the sample is a 10 mm or less thin plate specimen for inclusion analysis by electron microscopy. When the thickness of the thin plate is less than or equal to 5mm, the platform with a height of 15mm is used; when the thickness of the thin plate is greater than 5mm and less than or equal to 10mm, the platform with a height of 10mm is used.