Circuit board automatic processing equipment convenient to clean

Abstract

The invention relates to the field of circuit board processing, in particular to automatic circuit board processing equipment convenient to clean. According to the technical scheme, the circuit board automatic processing equipment convenient to clean comprises an electroplating pool, a power unit and the like; and a power unit is arranged above the electroplating pool. The circuit board body vibrates up and down, so that the circuit board body repeatedly passes through the liquid level of the electroplating liquid, the liquid level of the electroplating liquid washes the surface of the circuit board body and the blind holes for multiple times, the inner walls of the blind holes are fully wetted, the electroplating liquid can permeate into the blind holes, bubbles retained in the blind holes are reduced, and the service life of the circuit board is prolonged. After the circuit board body is completely immersed in the electroplating liquid, bubbles in the electroplating liquid can be further repelled through vibration, the bubbles are not prone to being retained in the blind holes, the phenomenon that the holes are blocked by the bubbles is reduced, the walls of the blind holes of the circuit board body make full contact with the electroplating liquid, the electroplating effect is good, the electroplating quality is kept consistent to a great extent, and the service life of the circuit board is prolonged. And the subsequent automatic machining process is facilitated, and the machining efficiency is fully improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and more particularly to an automated circuit board processing equipment that is easy to clean. Background Technology

[0002] In existing technologies, after blind via processing of circuit boards, the circuit boards generally need to be immersed in the plating solution to ensure full contact and improve the plating effect. However, since one end of the blind via is closed, air bubbles are easily formed at the blind via location during the immersion process. These air bubbles are difficult to remove, preventing the plating solution from fully entering the blind via and filling the via wall. This results in uneven distribution of the final plating layer within the blind via, leading to defects such as voids and depressions. Consequently, the plating effect is poor, reducing the reliability and electrical performance of the plating layer. Summary of the Invention

[0003] The technical problem of this invention is:

[0004] To overcome the shortcomings of the circuit board soaking process, where air bubbles easily form at blind holes, the electroplating solution cannot completely fill the hole walls, resulting in uneven distribution of the final electroplating layer in the blind holes, poor electroplating effect, and reduced reliability and electrical performance of the electroplating layer, this invention provides an automated circuit board processing equipment that is easy to clean.

[0005] The technical solution is as follows: An automated circuit board processing equipment that is easy to clean includes an electroplating tank, a power unit, and a top plate; the power unit is installed above the electroplating tank; the power unit is connected to the top plate; the power unit is used to drive the circuit board body to move horizontally; it also includes vertical plates, a lifting unit, electric clamps, and a vibration unit; several vertical plates are fixedly connected to the top plate; the outermost vertical plate is connected to the lifting unit; the lifting unit is used to drive the circuit board body to move vertically; the lifting unit is connected to several electric clamps; every two electric clamps cooperate to fix the circuit board body; the lifting unit is connected to the vibration unit; the vibration unit is used to drive the circuit board body to vibrate.

[0006] Furthermore, the power unit includes an electric guide rail I and an electric slider I; an electric guide rail I is installed above the electroplating tank; several electric sliders I are slidably connected to the electric guide rail I; all the electric sliders I are fixedly connected to the top plate.

[0007] Furthermore, the lifting unit includes an electric guide rail II, an electric slider II, a connecting rod, a horizontal plate, and a movable plate; two electric guide rails II are installed on the opposite sides of the two outermost vertical plates; each electric guide rail II is slidably connected to an electric slider II; every two electric sliders II are fixedly connected to a connecting rod; several horizontal plates are fixedly connected between the two connecting rods; each horizontal plate is slidably connected to a movable plate; each movable plate is detachably connected to a corresponding electric clamp; all movable plates are connected to the vibration unit; the vibration unit is connected to the horizontal plate.

[0008] Furthermore, it also includes protrusions; each clamping arm of the electric clamp is provided with a protrusion.

[0009] Furthermore, a rubber pad layer is provided on the opposite side of two adjacent protrusions.

[0010] Furthermore, the vibration unit includes a portal frame, a vibration machine, and elastic elements; each movable plate is fixedly connected to a portal frame; each portal frame is slidably connected to a cross plate; each portal frame is equipped with a vibration machine; each portal frame is connected to two elastic elements; each cross plate is fixedly connected to a corresponding elastic element.

[0011] Furthermore, it includes a conduit and bristles; a manifold is opened in the top plate; the manifold is connected to the conduit; each vertical plate has an air chamber; all air chambers are connected to the manifold; each vertical plate has several air holes; each air chamber is connected to the corresponding air hole; and several bristles are provided on the opposite sides of adjacent vertical plates.

[0012] Furthermore, it also includes heaters; several heaters are provided on the opposite sides of adjacent vertical plates; the heaters are located at the gaps between the bristles.

[0013] Furthermore, it also includes cleaning components; several cleaning components are fixed between the two horizontal plates; each cleaning component is matched with a corresponding bristle.

[0014] Furthermore, the cleaning component is a downward-facing conical plate, and an arc-shaped groove is provided on the upper part of the cleaning component.

[0015] The beneficial effects of this invention are as follows: 1. By driving the circuit board body to vibrate up and down, the circuit board body repeatedly passes over the surface of the electroplating solution. This helps the surface of the circuit board body and blind holes to be repeatedly washed by the surface of the electroplating solution, fully wetting the inner wall of the blind holes. This helps the electroplating solution penetrate into the blind holes after the circuit board body is immersed in the electroplating solution, reducing the number of air bubbles trapped in the blind holes. After the circuit board body is completely immersed in the electroplating solution, the vibration can further drive away the air bubbles in the electroplating solution, making them less likely to be trapped in the blind holes, thereby reducing the phenomenon of air bubble blockage. The blind hole walls of the circuit board body are in full contact with the electroplating solution, which greatly ensures the consistency of electroplating quality, facilitates subsequent automated processing, and significantly improves processing efficiency.

[0016] 2. Before electroplating the circuit board body, the circuit board body is vibrated up and down, and brush bristles are used to clean the surface of the circuit board body. The vibration of the circuit board body makes it easier to loosen the impurities attached to its surface and inside the blind holes, so that the brush bristles can quickly clean the circuit board body and then remove the dust, so as to prevent the dust from re-adhering to the surface of the circuit board body and affecting the subsequent electroplating quality.

[0017] 3. After electroplating is completed, the remaining electroplating solution on the surface of the circuit board is intercepted by a brush. The electroplating solution drips back into the electroplating tank to avoid waste. At the same time, the circuit board is pre-dried to prevent water stains from appearing on the surface of the electroplated layer. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the automated circuit board processing equipment for easy cleaning according to the present invention.

[0019] Figure 2 This is a schematic diagram of the installation position of the circuit board body of the present invention;

[0020] Figure 3 This is a side view of the vertical plate of the present invention;

[0021] Figure 4 This is a schematic diagram of the installation position of the elastic element of the present invention;

[0022] Figure 5 This is a cross-sectional view of the horizontal plate of the present invention;

[0023] Figure 6 This is a schematic diagram showing the installation positions of the brush bristles and heater of the present invention;

[0024] Figure 7 This is a schematic diagram showing the installation position of the cleaning component of the present invention;

[0025] Figure 8 This is a schematic diagram of the cleaning component and brush bristles of the present invention.

[0026] Reference numerals: 001-Circuit board body, 1-Electroplating tank, 2-Electric guide rail I, 3-Electric slider I, 4-Top plate, 5-Vertical plate, 6-Electric guide rail II, 7-Electric slider II, 8-Connecting rod, 9-Horizontal plate, 10-Moving plate, 11-Electric clamp, 101-Gantry frame, 102-Vibration machine, 103-Elastic component, 1101-Protrusion, 201-Conduit, 202-Brush bristles, 203-Heater, 4001-Manifold, 5001-Air chamber, 5002-Air hole, 301-Cleaning component. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] First embodiment

[0029] An automated circuit board processing equipment that is easy to clean, based on Figure 1-5 As shown, it includes an electroplating tank 1, a power unit, and a top plate 4; the power unit is installed above the electroplating tank 1; the power unit is connected to the top plate 4; the power unit is used to drive the circuit board body 001 to move horizontally.

[0030] It also includes vertical plates 5, lifting units, electric clamps 11, and vibration units; several vertical plates 5 are fixed to the top plate 4; the outermost vertical plate 5 is connected to the lifting unit; the lifting unit is used to drive the circuit board body 001 to move vertically; several electric clamps 11 are connected to the lifting unit; every two electric clamps 11 cooperate to fix the circuit board body 001; the lifting unit is connected to the vibration unit; the vibration unit is used to drive the circuit board body 001 to vibrate.

[0031] The power unit includes an electric guide rail I2 and an electric slider I3; an electric guide rail I2 is installed above the electroplating tank 1; the electric guide rail I2 is slidably connected to two electric sliders I3 distributed on the left and right; all the electric sliders I3 are fixedly connected to the top plate 4.

[0032] The lifting unit includes electric guide rails II6, electric sliders II7, connecting rods 8, horizontal plates 9, and movable plates 10; two left-right distributed electric guide rails II6 are installed on the opposite sides of the two outermost vertical plates 5; each electric guide rail II6 is slidably connected to an electric slider II7; every two electric sliders II7 are fixedly connected to a connecting rod 8; two left-right distributed horizontal plates 9 are fixedly connected between the two connecting rods 8; each horizontal plate 9 is slidably connected to a movable plate 10; each movable plate 10 is detachably connected to a corresponding electric clamp 11; all movable plates 10 are connected to a vibration unit; the vibration unit is connected to the horizontal plates 9.

[0033] It also includes a protrusion 1101; each clamping arm of the electric clamp 11 is provided with a protrusion 1101.

[0034] A rubber pad layer is provided on the opposite side of two adjacent protrusions 1101.

[0035] The vibration unit includes a portal frame 101, a vibrator 102, and elastic elements 103; each movable plate 10 is welded with a portal frame 101; each portal frame 101 is slidably connected to a horizontal plate 9; each portal frame 101 is equipped with a vibrator 102 on its upper part; each portal frame 101 is connected to two elastic elements 103 distributed front and rear; the elastic elements 103 are springs; each horizontal plate 9 is fixedly connected to the corresponding elastic element 103.

[0036] The working steps of the above embodiments are as follows:

[0037] First, fix the electric guide rail I2 to the mounting bracket above the electroplating tank 1 with bolts for use.

[0038] In use, initially, the top plate 4 is located to the left of the electroplating tank 1. First, the corresponding circuit board body 001 is clamped. The protrusions 1101 on the clamping arms of the electric clamp 11 are inserted into the pre-reserved fixing holes of the circuit board body 001. At this time, the rubber pad between two adjacent protrusions 1101 begins to deform and abut against the inner wall of the pre-reserved fixing holes of the circuit board body 001, thus fully fixing the circuit board body 001 in conjunction with the clamping arms of the electric clamp 11. Then, all the electric sliders II 7 are controlled to move upward, so that the circuit board body 001 moves towards the top plate 4 until the circuit board body 001 is stored between the vertical plates 5. Then, the electric slider I 3 is controlled to move to the right, simultaneously transferring the corresponding circuit board body 001 to the right. After reaching the electroplating tank 1 pre-filled with electroplating solution, all electric sliders II 7 are controlled to move downwards, synchronously driving the circuit board body 001 downwards, immersing the circuit board body 001 in the electroplating solution, thus electroplating the circuit board body 001. After electroplating is completed, the circuit board body 001 is lifted upwards until no more electroplating solution drips from it. Then, the circuit board body 001 is moved to the right, and the electric clamp 11 releases its fixation on the circuit board body 001, facilitating further processing of the circuit board body 001. This allows for easy coordination with various production lines in the workshop, improving the efficiency of processing the circuit board body 001. It features a high degree of automation, convenient and quick operation, and significantly improved efficiency.

[0039] When immersing the circuit board body 001 in the electroplating solution, the surface of the circuit board body 001 has many blind holes. If the circuit board body 001 is directly immersed in the electroplating solution, one end of the blind hole is closed. During the filling process of the electroplating solution, air bubbles are easily formed and difficult to remove. However, by slowly placing the circuit board body 001 into the electroplating solution, the electroplating solution has enough time to enter the blind holes of the circuit board body 001 at the liquid surface, reducing the generation of air bubbles in the blind holes. This ensures the processing quality of the circuit board body 001 and prevents air bubbles from occupying the space in the blind holes, which would prevent the electroplating solution from completely filling the hole walls and thus affecting the electroplating effect.

[0040] The above-mentioned work to reduce air bubbles in the blind holes of the circuit board body 001 requires a significant amount of time, which limits the processing efficiency of the circuit board body 001. To address this, a vibration unit can be added to the movable plate 10. The vibration unit 102 is activated, causing the gantry frame 101 to vibrate slightly up and down. The damping effect of the elastic element 103 prevents the horizontal plate 9 and connecting rod 8 from vibrating up and down, thus avoiding additional workload on the electric slider II7. This exacerbates the wear and tear on the electric guide rail II6 and electric slider II7. The vibration unit 102 causes the circuit board body 001 to vibrate up and down repeatedly, resulting in the circuit board body 001 repeatedly passing through... The surface of the electroplating solution helps to repeatedly flush the surface of the circuit board body 001 and the blind holes, fully wetting the inner walls of the blind holes. This facilitates the penetration of the electroplating solution into the blind holes after the circuit board body 001 is immersed in the solution, reducing the number of air bubbles trapped inside. After the circuit board body 001 is fully submerged in the electroplating solution, vibration can further drive away air bubbles in the solution, making them less likely to remain in the blind holes, thus reducing the phenomenon of air bubble blockage. The blind hole walls of the circuit board body 001 are in full contact with the electroplating solution, which greatly ensures the consistency of electroplating quality, facilitates subsequent automated processing, and significantly improves processing efficiency.

[0041] Second embodiment

[0042] Based on the first embodiment, according to Figure 1-3 and Figure 6-8 As shown, it includes a conduit 201 and bristles 202; a manifold 4001 is opened in the top plate 4; the manifold 4001 is connected to the conduit 201; each vertical plate 5 has an air chamber 5001; all air chambers 5001 are connected to the manifold 4001; each vertical plate 5 has several air holes 5002; each air chamber 5001 is connected to the corresponding air hole 5002; several bristles 202 are provided on the opposite sides of adjacent vertical plates 5; the bristles 202 are used to clean the surface and blind holes of the circuit board body 001.

[0043] It also includes a heater 203; several heaters 203 are provided on each of the opposite sides of the adjacent vertical plates 5; the heaters 203 are located at the gaps between the bristles 202.

[0044] It also includes a cleaning component 301; a number of cleaning components 301 are fixed between the two horizontal plates 9; each cleaning component 301 is located in the gap between two adjacent vertical plates 5; each cleaning component 301 cooperates with the corresponding bristles 202 to clean the bristles 202.

[0045] The cleaning component 301 is a downward-facing conical plate, and an arc-shaped groove is provided on the upper part of the cleaning component 301.

[0046] The working steps of the above embodiments are as follows:

[0047] Based on the above embodiments, during the process of storing the circuit board body 001 between the vertical plates 5, the circuit board body 001 is also vibrated up and down by controlling the vibration unit. The circuit board body 001 enters the gap between the adjacent vertical plates 5 during the vibration. Then, bristles 202 are set between the adjacent vertical plates 5. As a result, when the circuit board body 001 enters between the vertical plates 5, both sides of the circuit board body 001 come into contact with the bristles 202. The up and down vibration applied to the circuit board body 001 is equivalent to the bristles 202 cleaning both sides of the circuit board body 001, effectively brushing out the dust and impurities on both sides of the circuit board body 001.

[0048] This method involves vibrating the circuit board body 001, while using stationary bristles 202 to clean the surface of the circuit board body 001 and blind holes. The vibration of the circuit board body 001 makes it easier to loosen impurities attached to its surface and inside the blind holes. In particular, the vibration force can be evenly applied to the inside of the blind holes, loosening the impurities on the inner wall of the blind holes, making it easier for the bristles 202 to quickly clean the circuit board body 001. Compared with the prior art, where the bristles 202 constantly rub against the surface of the circuit board body 001 and the inner wall of the blind holes, the wear of the bristles 202 is accelerated, and the service life of the bristles 202 is reduced.

[0049] Then, the external air pump is activated. The air pump draws air out of the manifold 4001 through the conduit 201. The manifold 4001 then draws air out of the air chamber 5001. The air chamber 5001 draws air from the outside through the vent 5002. At this time, the brush 202 cleans the circuit board body 001 from the outside, and dust will be raised. The dust enters the air chamber 5001 through the vent 5002 along with the air. Then, the dust is drawn away through the manifold 4001 and the conduit 201. This prevents the dust from re-adhering to the surface of the circuit board body 001 after cleaning, which would affect the electroplating quality.

[0050] After cleaning the circuit board body 001, the circuit board body 001 is then immersed in the electroplating solution with vibration. After the electroplating of the circuit board body 001 is completed, the circuit board body 001 is lifted out of the electroplating solution. At this time, the circuit board body 001 moves upward and comes into contact with the brush bristles 202. The brush bristles 202 intercept the residual electroplating solution on the circuit board body 001, and the electroplating solution drips back into the electroplating tank 1, thus realizing the recycling of the electroplating solution. In existing technologies, after the circuit board body 001 is removed from the electroplating tank 1, methods such as natural air drying, oven drying, hot air drying, and conveyor belt drying are generally used to dry the residual electroplating solution on the surface of the circuit board body 001. At this time, after the circuit board body 001 is placed between the vertical plates 5, each heater 203 is activated sequentially from bottom to top. The heaters 203 heat and pre-dry the circuit board body 001, causing the electroplated layer on the surface of the circuit board body 001 to initially solidify and preventing watermarks from forming on the surface of the electroplated layer. Since the space between the circuit board body 001 and the vertical plates 5 is limited, an external air pump is used to further separate the circuit board body 001 from the vertical plates 5. Air is extracted between the plates 5 to remove moisture evaporated from the surface of the circuit board body 001, preventing water vapor from condensing on the top plate 4 and dripping onto the circuit board body 001, which would affect the drying efficiency of the circuit board body 001. By adding several sets of corresponding structures for clamping the circuit board body 001 on the electric guide rail I2, after one set of circuit board bodies 001 completes electroplating, the circuit board body 001 leaves the position of the electroplating tank 1 and immediately clamps the next set of circuit board bodies 001 to the position of the electroplating tank 1 for electroplating. This enables the electroplating of the circuit board body 001 to be carried out continuously, effectively avoiding the electroplating tank 1 from being in an empty state for a long time and wasting a lot of electrical energy.

[0051] Based on the above work, before electroplating the circuit board body 001, a vibration unit is used to clean the circuit board body 001. Therefore, dust and impurities may remain on the brush bristles 202. After the circuit board body 001 is cleaned, the cleaning component 301 between the two horizontal plates 9 moves downward and is immersed in the electroplating solution. The cleaning component 301 also moves downward. The lower part of the cleaning component 301 is conical. The cleaning component 301 only bends the brush bristles 202. The cleaning component 301 then passes over the brush bristles 202, and the brush bristles 202 return to their original shape. After the circuit board body 001 is electroplated, the circuit board body 001 is lifted upward. The two sides of the cleaning component 301 scrape over the brush bristles 202 on both sides to remove the dust and impurities remaining on the brush bristles 202. The scraped dust and impurities are collected in the arc-shaped groove at the top of the cleaning component 301 to prevent dust and impurities from falling onto the still undried circuit board body 001 and affecting the surface cleanliness of the circuit board body 001.

[0052] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. All equivalent substitutions made within the principles of the present invention should be included within the scope of protection of the present invention. Contents not described in detail in this invention are existing technologies known to those skilled in the art.

Claims

1. A circuit board automatic processing equipment convenient to clean, comprising an electroplating tank (1), a power unit and a top plate (4); the power unit is arranged above the electroplating tank (1); the power unit is connected with the top plate (4); the power unit is used to drive the horizontal transmission of a circuit board body (001); characterized in that, Further comprising vertical plates (5), lifting units, electric clamps (11) and vibration units; the top plate (4) is fixedly connected with a plurality of vertical plates (5); the outermost vertical plate (5) is connected with a lifting unit; the lifting unit is used to drive the circuit board body (001) to move vertically; the lifting unit is connected with a plurality of electric clamps (11); every two electric clamps (11) are matched to fix the circuit board body (001); the lifting unit is connected with a vibration unit; the vibration unit is used to drive the circuit board body (001) to vibrate.

2. The automated circuit board processing apparatus of claim 1, wherein The power unit comprises electric guide rails I (2) and electric sliding blocks I (3); the electroplating tank (1) is provided with electric guide rails I (2) above; the electric guide rails I (2) are slidably connected with a plurality of electric sliding blocks I (3); All the electric sliding blocks I (3) are fixedly connected with the top plate (4).

3. The automated circuit board processing apparatus of claim 1, wherein The lifting unit comprises electric guide rails II (6), electric sliding blocks II (7), connecting rods (8), cross plates (9) and movable plates (10); the opposite sides of the outermost two vertical plates (5) are each provided with two electric guide rails II (6); each electric guide rail II (6) is slidably connected with an electric sliding block II (7); every two electric sliding blocks II (7) are fixedly connected with a connecting rod (8); a plurality of cross plates (9) are fixedly connected between the two connecting rods (8); each cross plate (9) is slidably connected with a movable plate (10); each movable plate (10) is detachably connected with a corresponding electric clamp (11); all the movable plates (10) are connected with the vibration unit; the vibration unit is connected with the cross plate (9).

4. The automated circuit board processing apparatus of claim 1, wherein Further comprising protrusions (1101); each electric clamp (11) is provided with a protrusion (1101).

5. The automated circuit board processing apparatus of claim 4, wherein The opposite sides of the adjacent two protrusions (1101) are provided with rubber pads.

6. The automated circuit board processing apparatus of claim 3, wherein The vibration unit comprises door-shaped frames (101), vibration machines (102) and elastic members (103); each movable plate (10) is fixedly connected with a door-shaped frame (101); each door-shaped frame (101) is slidably connected with a cross plate (9); each door-shaped frame (101) is provided with a vibration machine (102); each door-shaped frame (101) is connected with two elastic members (103); each cross plate (9) is fixedly connected with a corresponding elastic member (103).

7. The automated circuit board processing apparatus of any of claims 1-6, wherein, Comprising a guide pipe (201) and bristles (202); the top plate (4) is provided with a converging cavity (4001) therein; The converging cavity (4001) is communicated with the guide pipe (201); each vertical plate (5) is provided with an air chamber (5001) therein; all the air chambers (5001) are communicated with the converging cavity (4001); each vertical plate (5) is provided with a plurality of air holes (5002); each air chamber (5001) is communicated with a corresponding air hole (5002); the opposite sides of the adjacent vertical plates (5) are each provided with a plurality of bristles (202).

8. The automatic circuit board processing equipment according to claim 7, wherein Further comprising heaters (203); the opposite sides of the adjacent vertical plates (5) are each provided with a plurality of heaters (203); The heaters (203) are located at the gap positions of the bristles (202).

9. The automated circuit board processing equipment for easy cleaning according to claim 8, characterized in that, It also includes a cleaning component (301); several cleaning components (301) are fixedly connected between the two horizontal plates (9); Each cleaning component (301) is paired with a corresponding bristle (202).

10. The automated circuit board processing apparatus of claim 9, wherein, The cleaning component (301) is a downward-facing conical plate, and an arc-shaped groove is provided on the upper part of the cleaning component (301).

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