Heat dissipation system and energy storage device

Abstract

The application provides a heat dissipation system and an energy storage device, and belongs to the technical field of heat dissipation. The heat dissipation system comprises: a first air duct structure comprising a first air duct paper with a first air cavity, a first air inlet and a first air outlet, and the first air cavity is used for accommodating a first heat generating component; a second air duct structure comprising a second air duct paper with a second air cavity, and a second air inlet and a second air outlet, and the first air duct paper and the second air duct paper are arranged side by side; the second air cavity is used for accommodating a second heat generating component, and the heat generation amount of the second heat generating component is less than that of the first heat generating component; an air inlet fan is arranged at the first air inlet; a reversing fan is arranged downstream of the airflow direction of the first air cavity and upstream of the airflow direction of the second air cavity; an air outlet fan is arranged at the second air inlet, and the air outlet fan is used for introducing airflow into the second air cavity and blowing out through the second air outlet. The application can improve the uniformity of heat dissipation and is conducive to improving the appearance of the corresponding product.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and energy storage device. Background Technology

[0002] Some existing heat-generating devices place the heat-generating components inside the housing. In order to effectively dissipate heat from the components inside the housing, air inlets and outlets are usually set on two opposite side walls of the housing. A fan is installed at the air inlet to draw external airflow into the housing and blow it out from the air outlet to carry away the heat from the heat-generating components.

[0003] On the one hand, setting air inlets and outlets on two different side walls of the casing will affect the aesthetics of the equipment; on the other hand, if there are areas with different heat generation within the equipment, following the aforementioned front-to-back heat dissipation path will result in uneven heat dissipation, leading to poor heat dissipation in areas with high heat generation, thus affecting the overall heat dissipation effect. Summary of the Invention

[0004] One objective of this invention is to provide a heat dissipation system that can improve the uniformity of heat dissipation and enhance the aesthetics of the corresponding product.

[0005] Another objective of this invention is to improve the balance of heat dissipation effect in multiple dimensions.

[0006] A further objective of the present invention is to enhance the heat dissipation effect in areas with high local heat generation.

[0007] Another object of the present invention is to provide an energy storage device including the above-described heat dissipation system.

[0008] In particular, according to one aspect of this application, a heat dissipation system is provided, comprising:

[0009] The first air duct structure includes a first air duct paper with a first air cavity, and a first air inlet and a first air outlet, both of which are connected to the first air cavity, and a first heating element for accommodating a portion within the first air cavity;

[0010] The second air duct structure includes a second air duct paper with a second air cavity, and a second air inlet and a second air outlet, both of which are connected to the second air cavity. The first air duct paper and the second air duct paper are arranged side by side, the second air inlet and the first air outlet face the same direction, and the second air outlet faces the same direction as the first air inlet. The second air cavity is used to accommodate a second heating element, and the heat output of the second heating element is less than that of the first heating element.

[0011] An air intake fan is installed at the first air inlet to introduce airflow into the first air cavity;

[0012] A reversing fan is disposed downstream of the airflow direction of the first air cavity and upstream of the airflow direction of the second air cavity. The reversing fan, the first air cavity, and the second air cavity are sequentially distributed in a first direction. The reversing fan is used to guide the airflow from the first air outlet to the second air inlet. The first direction intersects with the extension direction of the first air cavity.

[0013] An exhaust fan is provided at the second air inlet. The exhaust fan is used to introduce the airflow into the second air cavity and blow it out through the second air outlet.

[0014] Optionally, in the second direction, the extension length of the first air duct paper is less than the extension length of the second air duct paper, and the second direction is perpendicular to the first direction.

[0015] Optionally, the first air cavity is divided into a top chamber and a bottom chamber distributed vertically along a third direction. The top chamber and the bottom chamber are respectively used to accommodate the top heating element and the bottom heating element. The first heating element includes the top heating element and the bottom heating element, and the heat output of the top heating element is less than that of the bottom heating element.

[0016] The commutator fan includes a first air guide zone and a second air guide zone distributed vertically along a third direction. The air guide area of ​​the first air guide zone is smaller than that of the second air guide zone. The first air guide zone and the second air guide zone act on the airflow flowing out of the top chamber and the airflow flowing out of the bottom chamber, respectively.

[0017] The first direction, the second direction, and the third direction are perpendicular to each other.

[0018] Optionally, the air intake fan includes a third air guide zone and a fourth air guide zone distributed vertically along a third direction. The air guide area of ​​the third air guide zone is smaller than that of the fourth air guide zone. The airflow from the third air guide zone and the fourth air guide zone acts on the top chamber and the bottom chamber, respectively.

[0019] Optionally, the first air duct paper includes a first side plate and a second side plate located on both sides of the top chamber, and a top plate located on the top of the top chamber, wherein the first side plate, the top plate and the second side plate are connected in sequence;

[0020] The first side plate is inclined and gradually approaches the second side plate from bottom to top. The top heating element located in the top cavity is closer to the first side plate than the second side plate. The first side plate is used to guide the airflow entering the top cavity from the first air inlet to gather toward the top heating element.

[0021] Optionally, the first air duct paper further includes a baffle plate covering the top chamber on the side away from the air intake fan. The baffle plate connects the first side plate and part of the top plate. The baffle plate and the first side plate together guide the airflow to the top heating element.

[0022] Optionally, the first air duct paper further includes a third side plate and a fourth side plate surrounding both sides of the bottom cavity; the third side plate and the first side plate are connected vertically at a third position, the fourth side plate is disposed closer to the second air duct paper than the third side plate, the fourth side plate is disposed at an angle and the distance between the fourth side plate and the third side plate gradually decreases along the airflow direction in the bottom cavity;

[0023] The second side plate extends from the bottom chamber region to the top chamber region in the third direction. The second side plate, the fourth side plate, and the third side plate divide the bottom chamber into a bottom secondary chamber and a bottom main chamber in the first direction; or the fourth side plate is connected to the second side plate, and the side of the second air duct paper facing the first air duct paper, the fourth side plate, and the third side plate divide the bottom chamber into a bottom secondary chamber and a bottom main chamber in the first direction.

[0024] The bottom heating element includes a bottom secondary heating element and a bottom main heating element with a heat output greater than that of the bottom secondary heating element. The bottom secondary heating element and the bottom main heating element are respectively disposed in the bottom secondary chamber and the bottom main chamber.

[0025] In particular, according to another aspect of this application, an energy storage device is also provided, comprising:

[0026] The outer casing contains a heat dissipation system as described above, and a perforated ventilation area is provided on the outer casing, which is directly opposite the air intake fan and the second air outlet.

[0027] The heating assembly includes a first heating element disposed in the first air cavity and a second heating element disposed in the second air cavity;

[0028] The first heat sink is located inside the first air cavity and covers the first heat sink, and is used to conduct heat away from the heat generated by the first heat sink.

[0029] The second heat sink is located in the second air cavity and covers the second heat sink, and is used to conduct heat generated by the second heat sink.

[0030] Optionally, the heating component further includes a first PCB substrate and a second PCB substrate.

[0031] The first air duct paper and the second air duct paper are mounted on the first PCB substrate. The second PCB substrate and the first PCB substrate are distributed vertically in a third direction and divide the first air cavity into a top chamber and a bottom chamber. The first PCB substrate extends beyond the first air cavity from inside the first air cavity.

[0032] The commutator fan is mounted on the first PCB substrate and is located at the end corner of the first PCB substrate that extends beyond the first air cavity.

[0033] The first heating element includes a top heating element and a bottom heating element, which are respectively housed in the top cavity and the bottom cavity, and the heat output of the bottom heating element is greater than that of the top heating element.

[0034] The first direction and the third direction are perpendicular to each other.

[0035] Optionally, the bottom chamber includes a bottom secondary chamber and a bottom main chamber distributed in the first direction, and the bottom heating element includes a bottom secondary heating element and a bottom main heating element with a heat output greater than that of the bottom secondary heating element;

[0036] Both the bottom secondary heating element and the bottom main heating element are disposed on the first PCB substrate. The first heat dissipation element includes a first heat sink, which is used to conduct heat to the bottom main heating element.

[0037] According to one aspect of the present invention, a heat dissipation system is provided, wherein the external airflow first enters the heat dissipation system through a first air inlet, and the external airflow eventually exits through a second air outlet. The first air inlet and the second air outlet face the same direction; that is, when the heat dissipation system is applied to a device, the first air inlet and the second air outlet can be located on the same side of the device's casing. Thus, compared to the prior art, the heat dissipation system can improve, and consequently enhance, the aesthetics of the product.

[0038] Furthermore, by placing the intake fan at the first heat-generating component with high heat output and the exhaust fan at the second heat-generating component with relatively low heat output, the intake fan directs airflow to the first air inlet of the first air duct structure, through the first air chamber of the first air duct structure, and out through the first air outlet, continuing to flow along the extension direction of the first air duct structure at the portion of the first heat-generating component exposed within the first air duct structure. Under the action of the reversing fan, the airflow flows from the rear of the first heat-generating component to the air inlet side of the exhaust fan, and then, under the action of the exhaust fan, the airflow is further blown from the second air inlet of the second air duct structure to the second air outlet. Thus, the heat dissipation channel of the cooling system forms a U-shaped airflow direction. In this way, compared to the single front-to-back heat dissipation path in the prior art, the heat dissipation channel of this application can achieve balanced heat dissipation even when different heat dissipation areas exist.

[0039] Furthermore, the inclined first side plate concentrates airflow towards the top heating element. Combined with the baffle plate, this further guides the airflow to the top heating element, improving its heat dissipation and compensating for the smaller airflow area of ​​the intake fan corresponding to the top heating element, resulting in weaker heat dissipation compared to the bottom heating element. The inclined fourth side plate further concentrates airflow towards the bottom main heating element in the bottom main chamber. Therefore, this heat dissipation system not only evens out the heat dissipation effect in areas with different heat outputs but also provides targeted enhancements to the heat dissipation intensity of high-heat components, thereby improving overall heat dissipation capabilities. Attached Figure Description

[0040] Figure 1 This is a top view of a heat dissipation system according to an embodiment of the present invention;

[0041] Figure 2 According to Figure 1 A schematic diagram of the first and second air duct structures of the heat dissipation system in the embodiment;

[0042] Figure 3 This is a schematic diagram of the assembly structure of a heat dissipation system and a component to be cooled according to an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the airflow direction of a heat dissipation system according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of the structure of a heat dissipation system and the rear side of the component to be cooled, according to an embodiment of the present invention.

[0045] Figure 6 This is a schematic diagram of the structure of an energy storage device according to an embodiment of the present invention;

[0046] Figure 7 This is a schematic diagram of the arrangement of a heat dissipation system in an energy storage device according to an embodiment of the present invention;

[0047] Figure 8 This is an exploded view of an energy storage device according to an embodiment of the present invention;

[0048] Figure 9 This is an exploded view of the internal structure of an energy storage device according to an embodiment of the present invention;

[0049] Figure label:

[0050] 100-Heat dissipation system, 10-First air duct structure, 110-First air duct paper, 101-First air inlet, 102-First air outlet, 103-First air cavity, 104-Top chamber, 105-Bottom chamber, 106-Bottom main chamber, 107-Bottom secondary chamber, 11-First side plate, 12-Second side plate, 13-Top plate, 14-Stop plate, 15-Third side plate, 16-Fourth side plate, 161-Side plate notch, 20-Second air duct structure, 21-Second air duct paper, 211-Fifth side plate, 201-Second 202-Second air outlet, 203-Second air cavity, 30-Intake fan, 40-Reversing fan, 50-Outlet fan, 210-First heating element, 212-Top heating element, 220-Second heating element, 60-Heating assembly, 61-First PCB substrate, 62-Second PCB substrate, 63-First heat sink, 64-Second heat sink, 65-Third heat sink, 70-Outer shell, 701-Side shell, 702-Ventilation area, 71-Upper shell, 72-Lower shell, 73-Front shell, 74-Rear shell. Detailed Implementation

[0051] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0052] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0053] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.

[0054] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0055] In this application's embodiments, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this application's embodiments are merely illustrative and for distinguishing the described objects; they have no order and do not indicate a specific limitation on the number in this application's embodiments, nor do they constitute any limitation on the embodiments of this application.

[0056] Figure 1 This is a top view of a heat dissipation system 100 according to an embodiment of the present invention. Figure 2 According to Figure 1 A schematic diagram of the first air duct structure 10 and the second air duct structure 20 of the heat dissipation system 100 in the embodiment. Figure 3 This is a schematic diagram of the assembly structure of a heat dissipation system 100 and a component to be cooled, according to an embodiment of the present invention. Figure 3 The intake fan 30 is now hidden. Figure 4 This is a schematic diagram of the airflow direction of a heat dissipation system 100 according to an embodiment of the present invention. Figure 4 The hollow arrow in the image indicates the direction of the airflow.

[0057] like Figures 1 to 4 As shown, in one embodiment, the heat dissipation system 100 includes a first air duct structure 10, a second air duct structure 20, an intake fan 30, a reversing fan 40, and an exhaust fan 50. The first air duct structure 10 includes a first air duct paper 110 having a first air cavity 103, and a first air inlet 101 and a first air outlet 102 both communicating with the first air cavity 103. A first heat-generating element 210 is housed within the first air cavity 103. The second air duct structure 20 includes a second air duct paper 21 having a second air cavity 203, and a second air inlet 201 and a second air outlet 202 both communicating with the second air cavity 203. The second air duct structure 20 and the first air duct structure 10 are arranged side-by-side, with the second air inlet 201 and the first air outlet 102 facing the same direction, and the second air outlet 202 facing the same direction as the first air inlet 101. The second air cavity 203 is used to house the second heating element 220, whose heat output is less than that of the first heating element 210. An intake fan 30 is located at the first air inlet 101 to introduce airflow into the first air cavity 103. A reversing fan 40 is located downstream of the airflow direction in the first air cavity 103 and upstream of the airflow direction in the second air cavity 203. In the first direction a, the reversing fan 40, the first air cavity 103, and the second air cavity 203 are sequentially distributed. The reversing fan 40 guides the airflow from the first air outlet 102 to the second air inlet 201. The first direction a intersects with the extension direction of the first air cavity 103. An exhaust fan 50 is located at the second air inlet 201 and introduces airflow into the second air cavity 203, which is then blown out through the second air outlet 202. The number of each type of fan can be one or more, adaptable to the size of the corresponding area. Figure 1In the illustrated embodiment, the first heating element 210 is relatively wide, therefore two intake fans 30 are provided. Optionally, the commutator fan 40 is substantially directly opposite the first heating element 210 in the first direction, thereby more effectively removing heat from the first heating element 210.

[0058] In the heat dissipation system 100 of this embodiment, as described above, the first air inlet into the external airflow is the first air inlet 101, and the external airflow eventually exits from the second air outlet 202 of the heat dissipation system 100. Furthermore, the first air inlet 101 and the second air outlet 202 face the same direction; that is, when the heat dissipation system 100 is applied to a device, the first air inlet 101 and the second air outlet 202 can be located on the same side of the device's casing. Thus, compared to the prior art, the heat dissipation system 100 can improve, and consequently enhance, the aesthetics of the product.

[0059] Furthermore, such as Figures 1 to 4 As shown, in the heat dissipation system 100 of this embodiment, the intake fan 30 is located at the first heat-generating element 210 with high heat generation, and the exhaust fan 50 is located at the second heat-generating element 220 with relatively low heat generation. The intake fan 30 directs airflow to the first air inlet 101 of the first air duct structure 10, passes through the first air chamber 103 of the first air duct structure 10, and exits from the first air outlet 102. It continues to flow along the extension direction of the first air duct structure 10 at the portion of the first heat-generating element 210 exposed within the first air duct structure 10. Under the action of the reversing fan 40, the airflow flows from the tail of the first heat-generating element 210 to the intake side of the exhaust fan 50 (i.e., the side of the exhaust fan 50 away from the second air duct structure 20). Then, under the action of the exhaust fan 50, the airflow further blows from the second air inlet 201 of the second air duct structure 20 to the second air outlet 202. Thus, the heat dissipation channel of the heat dissipation system 100 forms a U-shaped airflow direction. Thus, compared to the single heat dissipation path from front to back in the prior art, the heat dissipation channel in this application embodiment can achieve balanced heat dissipation when there are different heat dissipation areas.

[0060] In a further embodiment, in the second direction b, the extension length of the first duct paper 110 is less than the extension length of the second duct paper 21, and the second direction b is perpendicular to the first direction a. This arrangement of the lengths of the two duct papers facilitates the layout of the commutator fan 40 within a limited space and is beneficial for the airflow guidance of the commutator fan 40. If the extension length of the first duct paper 110 is greater than the extension length of the second duct paper 21, the longer first duct paper 110 may obstruct the commutator fan 40 from guiding the airflow from the first air chamber 103 into the second air inlet 201 when the commutator fan 40 is redirecting the airflow.

[0061] In one embodiment, such as Figure 3As shown, the first air cavity 103 is divided into a top chamber 104 and a bottom chamber 105 distributed vertically along the third direction c. The top chamber 104 and the bottom chamber 105 are used to accommodate the top heating element 212 and the bottom heating element, respectively. The first heating element 210 includes the top heating element 212 and the bottom heating element, and the heat generation of the top heating element 212 is less than that of the bottom heating element.

[0062] The commutator fan 40 includes a first air guide zone and a second air guide zone distributed vertically along a third direction c. The air guide area of ​​the first air guide zone is smaller than that of the second air guide zone. The first and second air guide zones act on the airflow exiting the top chamber 104 and the airflow exiting the bottom chamber 105, respectively. The intake fan 30 includes a third air guide zone and a fourth air guide zone distributed vertically along a third direction c. The air guide area of ​​the third air guide zone is smaller than that of the fourth air guide zone. The airflow exiting the third and fourth air guide zones acts on the top chamber 104 and the bottom chamber 105, respectively. The first direction a, the second direction b, and the third direction c are perpendicular to each other.

[0063] In this embodiment, the air guide areas of the intake fan 30 and the reversing fan 40 are set according to the different heat generation of the top heating element 212 and the bottom heating element, so that the larger air guide area corresponds to the heating element with greater heat generation, and more airflow is blown towards the bottom heating element with greater heat generation, thereby achieving heat dissipation balance of different heat generation areas in the height direction.

[0064] Therefore, the heat dissipation system 100 of this embodiment can not only realize the air duct setting in a limited space and improve the heat dissipation effect, but also balance the heat dissipation effect of different heat-generating areas in the horizontal direction and different heat-generating areas in the vertical direction in multiple dimensions, with better heat dissipation effect and effectively suppressing excessive local temperature.

[0065] Refer to together Figure 3 and Figure 5 In one embodiment, the first air duct paper 110 includes a first side plate 11 and a second side plate 12 located on both sides of the top chamber 104, and a top plate 13 located on top of the top chamber 104. The first side plate 11, the top plate 13, and the second side plate 12 are connected in sequence. The first side plate 11 is inclined and gradually approaches the second side plate 12 from bottom to top. The top heating element 212 located in the top chamber 104 is closer to the first side plate 11 than the second side plate 12. The first side plate 11 is used to guide the airflow entering the top chamber 104 from the first air inlet 101 towards the top heating element 212. The first air duct paper 110 also includes a baffle plate 14 covering the side of the top chamber 104 away from the air intake fan 30. The baffle plate 14 connects the first side plate 11 and part of the top plate 13. The baffle plate 14 and the first side plate 11 together guide the airflow to the top heating element 212.

[0066] In this embodiment, the inclined first side plate 11 can concentrate the airflow to the top heating element 212. Combined with the blocking effect of the baffle plate 14, the airflow can be further guided to the top heating element 212, so that the heat dissipation airflow is concentrated on the top heating element 212, thereby improving the heat dissipation effect of the top heating element 212. At the same time, it also makes up for the deficiency that the air guide area of ​​the air intake fan 30 corresponding to the top heating element 212 is small and the heat dissipation effect is weaker than that of the bottom heating element.

[0067] In one embodiment, refer to Figure 2 and Figure 3 The first air duct paper 110 also includes a third side plate 15 and a fourth side plate 16 surrounding both sides of the bottom chamber 105. The third side plate 15 and the first side plate 11 are connected vertically in a third direction c. The fourth side plate 16 is positioned closer to the second air duct paper 21 than the third side plate 15. The fourth side plate 16 is inclined and the distance between it and the third side plate 15 gradually decreases along the airflow direction in the bottom chamber 105. The second side plate 12 extends from the bottom chamber 105 region to the top chamber 104 region in a third direction c. The second side plate 12, the fourth side plate 16, and the third side plate 15 divide the bottom chamber 105 into a bottom secondary chamber 107 and a bottom main chamber 106 in a first direction a.

[0068] In another embodiment, the bottom secondary chamber 107 and the bottom main chamber 106 can also be formed using the second air duct paper 21. Specifically, the fourth side plate 16 is connected to the second side plate 12, and the side of the second air duct paper 21 facing the first air duct paper 110 (i.e., Figure 2 The fifth side plate 211), the fourth side plate 16 and the third side plate 15 divide the bottom chamber 105 into the bottom secondary chamber 107 and the bottom main chamber 106 in the first direction a.

[0069] The bottom heating element includes a bottom secondary heating element and a bottom main heating element with a heat output greater than that of the bottom secondary heating element. The bottom secondary heating element and the bottom main heating element are respectively disposed in the bottom secondary chamber 107 and the bottom main chamber 106.

[0070] The airflow introduced by the intake fan 30 can flow into the bottom secondary chamber 107 through the slit between the fourth side plate 16 and the second side plate 12, such as Figure 2 As shown, a side plate notch 161 can also be provided at the bottom of the fourth side plate 16 to further increase the airflow channel and ensure the airflow in the bottom secondary chamber 107.

[0071] In this embodiment, the fourth side plate 16 is inclined, and the distance between it and the third side plate 15 gradually decreases along the airflow direction within the bottom chamber 105. This ensures that the fourth side plate 16 is inclined within the first chamber, and the inclined orientation of the fourth side plate 16 guides the airflow from the intake fan 30 into the bottom chamber 105 so that most of the airflow tends towards the bottom main chamber 106, and a small portion tends towards the bottom secondary chamber 107. This allows the airflow to be concentrated more at the bottom main heat-generating component in the bottom main chamber 106. Therefore, this heat dissipation system 100 not only balances the heat dissipation effect in areas with different heat outputs but also enhances the targeted heat dissipation intensity for high-heat components, thereby improving the overall heat dissipation capability.

[0072] Figure 6 This is a schematic diagram of an energy storage device according to an embodiment of the present invention. Figure 7 This is a schematic diagram of the arrangement of a heat dissipation system 100 in an energy storage device according to an embodiment of the present invention. Figure 8 This is an exploded view of an energy storage device according to an embodiment of the present invention. Figure 9 This is an exploded view of the internal structure of an energy storage device according to an embodiment of the present invention. Figure 9 The housing 70 is not shown, and only the first PCB substrate 61 is shown for the heating component 60.

[0073] like Figures 6 to 9 As shown, this application also provides an energy storage device. In one embodiment, the energy storage device includes a heat dissipation system 100, a heating element 60, a housing 70, a first heat sink, and a second heat sink 64 as described in any of the above embodiments. The heating element 60 includes a first heating element 210 disposed in a first air cavity 103 and a second heating element 220 disposed in a second air cavity 203. The first heat sink is located in the first air cavity 103 and covers the first heating element 210, and is used to conduct heat generated by the first heating element 210. The second heat sink 64 is located in the second air cavity 203 and covers the second heating element 220, and is used to conduct heat generated by the second heating element 220. The housing 70 is provided with a cavity for accommodating the first heating element 210, the second heating element 220, and the heat dissipation system 100. The first heat sink and the second heat sink 64 may be one or more heat sinks.

[0074] In this embodiment, the outer casing 70 includes an upper casing 71, a lower casing 72, a front casing 73, and a rear casing 74. The upper casing 71 and the lower casing 72 are joined together to form a shape with openings on the front and rear sides, respectively. The front casing 73 and the rear casing 74 cover and connect to the openings on the front and rear sides. The outer casing 70 includes a side casing 701 with a perforated ventilation area 702, which faces the intake fan 30 and the second air outlet 202. The internal space of this energy storage device only has space for the fan in the rear casing 74; therefore, the aforementioned side casing 701 is the rear casing 74. In this embodiment, the intake fan 30 is attached to the inside of the rear casing 74.

[0075] In this embodiment, the heating component 60 further includes a first PCB substrate 61 and a second PCB substrate 62. A first air duct paper 110 and a second air duct paper 21 are mounted on the first PCB substrate 61. The second PCB substrate 62 and the first PCB substrate 61 are vertically distributed in a third direction c, dividing the first air cavity 103 into a top chamber 104 and a bottom chamber 105. The first PCB substrate 61 extends beyond the first air cavity 103. A commutating fan 40 is mounted on the first PCB substrate 61 and located at the end corner of the first PCB substrate 61 extending beyond the first air cavity 103.

[0076] The first heating element 210 includes a top heating element 212 and a bottom heating element, which are respectively housed in a top chamber 104 and a bottom chamber 105. The bottom heating element generates more heat than the top heating element 212. The bottom chamber 105 includes a bottom secondary chamber 107 and a bottom main chamber 106 distributed in the first direction a. The bottom heating element includes a bottom secondary heating element and a bottom main heating element that generates more heat than the bottom secondary heating element. In a specific embodiment, the top heating element 212 may be a transformer, and the bottom heating element may be used to form, but is not limited to, a DC circuit.

[0077] Specifically, the bottom secondary heat-generating component is a capacitor element disposed on the first PCB substrate 61, and the bottom main heat-generating component is a MOS array disposed on the first PCB substrate 61. The first heat dissipation component includes a first heat sink 63 for dissipating heat from the MOS array.

[0078] Of course, depending on the space and heat of the device, the first heat sink and the second heat sink 64 may include multiple heat sinks. For example, in this embodiment, the first heat sink may also include a third heat sink 65 for dissipating heat for other heat-generating components.

[0079] In some embodiments, the bottom of the first PCB substrate 61 is fixed to the lower housing 72 by a sheet metal fixing bracket, which allows the bottom of the first PCB substrate 61 to also have a certain heat dissipation space and to share the airflow introduced by the intake fan 30 with the second PCB substrate 62 for heat dissipation.

[0080] In one embodiment, such as Figure 3 As shown, the first air duct paper 110 is fastened to the first heating element 210 and / or the first PCB substrate 61 by a first fastener, and the second air duct paper 21 is fastened to the second heating element 220 and / or the first PCB substrate 61 by a second fastener. Since the first heating element 210 and the second heating element 220 are also fixed to the first PCB substrate 61, the first and second fasteners can be set at appropriate positions for ease of installation, connecting to the first PCB substrate 61 or components on the first PCB substrate 61, without limitation.

[0081] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A heat dissipation system, characterized in that, include: The first air duct structure includes a first air duct paper with a first air cavity, and a first air inlet and a first air outlet, both of which are connected to the first air cavity, and a first heating element for accommodating a portion within the first air cavity; The second air duct structure includes a second air duct paper with a second air cavity, and a second air inlet and a second air outlet, both of which are connected to the second air cavity. The first air duct paper and the second air duct paper are arranged side by side, the second air inlet and the first air outlet face the same direction, and the second air outlet faces the same direction as the first air inlet. The second air cavity is used to accommodate a second heating element, and the heat output of the second heating element is less than that of the first heating element. An air intake fan is installed at the first air inlet to introduce airflow into the first air cavity; A reversing fan is disposed downstream of the airflow direction of the first air cavity and upstream of the airflow direction of the second air cavity. The reversing fan, the first air cavity, and the second air cavity are sequentially distributed in a first direction. The reversing fan is used to guide the airflow from the first air outlet to the second air inlet. The first direction intersects with the extension direction of the first air cavity. An exhaust fan is provided at the second air inlet, and the exhaust fan is used to introduce the airflow into the second air cavity and blow it out through the second air outlet; The first air cavity is divided into a top chamber and a bottom chamber distributed upward and downward along a third direction. The top chamber and the bottom chamber are respectively used to accommodate the top heating element and the bottom heating element. The first heating element includes the top heating element and the bottom heating element, and the heat output of the top heating element is less than that of the bottom heating element. The commutator fan includes a first air guide zone and a second air guide zone distributed vertically upwards along a third direction. The air guide area of ​​the first air guide zone is smaller than that of the second air guide zone. The first air guide zone and the second air guide zone act on the airflow exiting the top chamber and the airflow exiting the bottom chamber, respectively. The intake fan includes a third air guide zone and a fourth air guide zone distributed vertically upwards along a third direction. The air guide area of ​​the third air guide zone is smaller than that of the fourth air guide zone. The airflow exiting the third air guide zone and the fourth air guide zone act on the top chamber and the bottom chamber, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first air duct paper includes a first side plate and a second side plate located on both sides of the top chamber, a top plate located on the top of the top chamber, and a stop plate covering the side of the top chamber away from the air intake fan; the first side plate, the top plate, and the second side plate are connected in sequence; the first side plate is inclined and gradually approaches the second side plate from bottom to top, and the top heating element located in the top chamber is closer to the first side plate than the second side plate; the first side plate is used to guide the airflow entering the top chamber from the first air inlet to gather toward the top heating element; the stop plate connects the first side plate and part of the top plate, and the stop plate and the first side plate together guide the airflow to the top heating element.

2. The heat dissipation system of claim 1, wherein, In the second direction, the extension length of the first air duct paper is less than the extension length of the second air duct paper, and the second direction is perpendicular to the first direction.

3. The heat dissipation system of claim 1, wherein, The first air duct paper also includes a third side plate and a fourth side plate surrounding both sides of the bottom chamber; the third side plate and the first side plate are connected vertically at a third position, the fourth side plate is positioned closer to the second air duct paper than the third side plate, the fourth side plate is inclined and the distance between the fourth side plate and the third side plate gradually decreases along the airflow direction in the bottom chamber; The second side plate extends from the bottom chamber region to the top chamber region in the third direction. The second side plate, the fourth side plate, and the third side plate divide the bottom chamber into a bottom secondary chamber and a bottom main chamber in the first direction; or the fourth side plate is connected to the second side plate, and the side of the second air duct paper facing the first air duct paper, the fourth side plate, and the third side plate divide the bottom chamber into a bottom secondary chamber and a bottom main chamber in the first direction. The bottom heating element includes a bottom secondary heating element and a bottom main heating element with a heat output greater than that of the bottom secondary heating element. The bottom secondary heating element and the bottom main heating element are respectively disposed in the bottom secondary chamber and the bottom main chamber.

4. An energy storage device, characterized by, include: The outer casing is provided with a heat dissipation system as described in any one of claims 1 to 3, and a perforated ventilation area is provided on the outer casing, the ventilation area being directly opposite the air intake fan and the second air outlet; The heating assembly includes a first heating element disposed in the first air cavity and a second heating element disposed in the second air cavity; The first heat sink is located inside the first air cavity and covers the first heat sink, and is used to conduct heat away from the heat generated by the first heat sink. The second heat sink is located in the second air cavity and covers the second heat sink, and is used to conduct heat generated by the second heat sink.

5. The energy storage device of claim 4, wherein, The heating component also includes a first PCB substrate and a second PCB substrate. The first air duct paper and the second air duct paper are mounted on the first PCB substrate. The second PCB substrate and the first PCB substrate are distributed vertically in a third direction and divide the first air cavity into a top chamber and a bottom chamber. The first PCB substrate extends beyond the first air cavity from inside the first air cavity. The commutator fan is mounted on the first PCB substrate and is located at the end corner of the first PCB substrate that extends beyond the first air cavity. The first heating element includes a top heating element and a bottom heating element, which are respectively housed in the top cavity and the bottom cavity, and the heat output of the bottom heating element is greater than that of the top heating element. The first direction and the third direction are perpendicular to each other.

6. The energy storage device of claim 5, wherein, The bottom chamber includes a bottom secondary chamber and a bottom main chamber distributed in a first direction, and the bottom heating element includes a bottom secondary heating element and a bottom main heating element with a heat output greater than that of the bottom secondary heating element; Both the bottom secondary heating element and the bottom main heating element are disposed on the first PCB substrate. The first heat dissipation element includes a first heat sink, which is used to conduct heat to the bottom main heating element.

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