Scribing device of semiconductor wafer

Abstract

The invention discloses a semiconductor wafer scribing device which comprises a machine shell, side supports are connected to the left side and the right side of the top of the machine shell, a hydraulic push rod is connected to the middle section of the top of the machine shell, a linkage block is connected to the free end of the rear side of the hydraulic push rod, and a translation seat is connected to the top of the linkage block. The top of the translation seat is rotatably connected with a steering shaft, the top of the steering shaft is connected with a machining table, a guide assembly is connected between the transverse parts of the two side supports, a transverse moving seat is slidably connected in the guide assembly, the bottom of the transverse moving seat is connected with a fixing frame, and a scribing assembly is installed in the fixing frame; the front end of the machine shell is connected with a PLC. The device is reasonable in structural design, not only can meet the high-precision requirement of semiconductor wafer scribing, but also can improve the production efficiency through continuous and automatic operation, gives consideration to the neatness of the working environment, and provides an efficient and reliable solution for the field of semiconductor wafer processing.

Description

Technical Field

[0001] This invention relates to the field of dicing apparatus technology, and more particularly to a dicing apparatus for semiconductor wafers. Background Technology

[0002] Dicing is an industrial process used to cut wafers into individual chips, and it is a crucial step in chip separation during integrated circuit manufacturing. Its core objective is to achieve efficient chip separation through precision machining while minimizing wafer damage.

[0003] When dicing semiconductor wafers, the back of the wafer is often polished and then attached to a polyester film with good adhesion, usually a blue film or a UV film. Then, a high-speed rotating saw blade completely cuts the wafer according to the customer's pre-set program. Afterward, the chip is still attached to the polyester film, which helps with the next step of chip extraction.

[0004] To reduce damage to wafers during dicing, grooving can be performed before dicing. However, in existing technologies, grooving and dicing are often performed separately, requiring different power sources and process equipment, which affects overall work efficiency. Furthermore, the silicon powder generated during grooving and dicing is difficult to handle in a timely manner, which is detrimental to ensuring product quality. Therefore, those skilled in the art have proposed a dicing device for semiconductor wafers. Summary of the Invention

[0005] The purpose of this invention is to provide a dicing apparatus for semiconductor wafers to overcome the technical problems existing in the prior art.

[0006] To achieve the above-mentioned technical objectives and effects, the present invention provides the following technical solution: A semiconductor wafer dicing device includes a housing, side supports connected to the top left and right sides of the housing, a hydraulic push rod connected to the middle section of the top of the housing, a linkage block connected to the rear free end of the hydraulic push rod, a translation seat connected to the top of the linkage block, a steering shaft rotatably connected to the top of the translation seat, a processing table connected to the top of the steering shaft, a guide assembly connected between the horizontal parts of the two side supports, a transverse seat slidably connected in the guide assembly, a fixed frame connected to the bottom of the transverse seat, a dicing assembly installed in the fixed frame, and a PLC controller connected to the front end of the housing.

[0007] Preferably, in a semiconductor wafer dicing apparatus, the dicing assembly includes a cylindrical shell, a drive motor connected to the center of the rear sidewall of the cylindrical shell, a drive shaft connected to the front output end of the drive motor, a bevel gear ring one and a bevel gear ring two connected to the outer wall of the drive shaft, two hollow tubes connected to the lower part of the outer wall of the cylindrical shell, a transmission shell connected to the lower end of the hollow tubes, an assembly shaft rotatably connected to the center of the transmission shell, a bevel gear ring three connected to the outer wall of the assembly shaft, and the front ends of the two assembly shafts respectively connected to... The diamond thick saw blade and the diamond thin saw blade are provided. The inner wall of the hollow tube is rotatably connected to the driven shaft via a bearing. One end of each of the two driven shafts extending into the transmission housing is connected to a bevel gear three. The bevel gear three meshes with a bevel gear ring three. One end of each of the two driven shafts extending into the cylindrical shell is connected to a bevel gear one and a bevel gear two, respectively. The bevel gear one meshes with a bevel gear ring one, and the bevel gear two meshes with a bevel gear ring two. A steering arm is connected to the center of the front side wall of the cylindrical shell, and a metal arc block is connected to the bottom of the rear side wall of the steering arm.

[0008] Preferably, in a semiconductor wafer dicing device, the fixing frame includes two annular seats arranged in parallel front to back. The outer wall of the cylindrical shell is rotatably connected to the annular seats at both ends via bearing rings. A fixing block is connected between the upper end of the annular seat and the transverse seat. A U-shaped guard is connected to the lower part of the outer wall of the annular seat. A rinsing pipe is connected to the lower end of the U-shaped guard. The rinsing pipe has multiple water outlet holes on the side facing the transmission shell. An arc-shaped groove is formed on the lower part of the front end face of the front annular seat. Electromagnets are embedded at the left and right ends of the arc-shaped groove. The metal arc block is slidably connected in the arc-shaped groove.

[0009] Preferably, in a semiconductor wafer dicing device, the intersection point of the central axes of the two driven shafts coincides on the central axis of the drive shaft, the included angle of the central axes of the two driven shafts is degrees, the arc-shaped groove is coaxially arranged with the cylindrical shell, the included angle of the deflection area of ​​the steering arm is 60 degrees, and the lower ends of the diamond thick saw blade and the diamond thin saw blade are located in the same vertical plane.

[0010] Preferably, in a semiconductor wafer dicing apparatus, guide holes are provided at both the front and rear of the transverse shifter, a liquid storage tank is connected to the top of the transverse shifter, a liquid pump is provided in the liquid storage tank, a T-tube is connected to the output end of the liquid pump, a drainage pipe is connected between the T-tube and the rinsing pipe, inclined supports are connected to the bottom left and right sides of the transverse shifter, a blower is connected to the lower end of the inclined supports, an infrared signal receiver one and an infrared signal receiver two are respectively connected to the front and rear ends of the transverse shifter, and an infrared signal transmitter one and an infrared signal transmitter two are respectively connected to the top front side of the left side support and the top rear side of the right side support.

[0011] Preferably, in a semiconductor wafer dicing apparatus, the guiding assembly includes two parallel H-shaped seats. The lower end of each H-shaped seat is fixedly connected to the top wall of a side support. A horizontal guide rod is fixedly connected between the top ends of the two H-shaped seats. The horizontal guide rod movably passes through a guide hole. A bearing seat is connected to the top wall of the horizontal portion of each H-shaped seat. A transverse reciprocating lead screw is rotatably connected between the two bearing seats. A lead screw motor is connected to the left end of the transverse reciprocating lead screw. A nut seat is screwed onto the outer wall of the transverse reciprocating lead screw. The upper end of the nut seat is fixedly connected to the bottom wall of a transverse moving seat. The transverse reciprocating lead screw passes through an inclined bracket.

[0012] Preferably, in a semiconductor wafer dicing device, the bottom of the translation seat is connected to a plurality of support ball heads, the lower ends of the support ball heads abut against the upper surface of the housing, the translation seat is provided with a transmission cavity, one end of the steering shaft extending into the transmission cavity is connected to a grooved wheel, the lower end of the grooved wheel is connected to a positioning gear, the grooved wheel has four straight grooves circumferentially formed, the bottom wall of the transmission cavity is rotatably connected to a lower short shaft, the upper end of the lower short shaft is connected to a ratchet disk, the outer side wall of the ratchet disk is connected to a spur gear ring, the inner side wall of the ratchet disk has a plurality of ratchet grooves circumferentially formed, the top wall of the transmission cavity is equipped with a damping shaft, the damping shaft and the lower short shaft are coaxially arranged, the lower end of the damping shaft is connected to a ratchet seat, the ratchet seat extends into the ratchet disk.

[0013] Preferably, in a semiconductor wafer dicing device, the outer wall of the ratchet seat is provided with a ratchet groove, a ratchet block is hinged in the ratchet groove, a compression spring is connected between the middle section of the ratchet block and the inner wall of the ratchet groove, a lever is connected to the outer wall of the ratchet seat, the axis of the lever is perpendicular to the axis of the damping shaft, an actuating post is connected to the end of the lever, the actuating post extends into the straight groove, an electric push rod is connected to the inner side wall of the transmission cavity, a spur rack is connected to the free end of the electric push rod, the spur rack meshes with a spur gear ring, an L-shaped rod is connected to the end of the spur rack, and the end of the L-shaped rod near the positioning gear is arranged in a V-shape.

[0014] Preferably, in a semiconductor wafer dicing device, the housing has a receiving cavity, a storage box is inserted into the lower part of the receiving cavity, the side support has a discharge port on its horizontal part, the lower end of the discharge port is connected to a guide hopper, the lower end of the guide hopper extends into the receiving cavity and is located above the storage box, an arc plate is connected between the two discharge ports, the top front and rear ends of the arc plate are connected to baffles, a clearance groove is opened in the center of the arc plate, the steering shaft passes through the clearance groove, a reinforcing rib is connected between the bottom wall of the side support and the housing, a stop block is connected to the top rear side of the housing, a contact switch is connected to the front end of the stop block, and the contact switch is electrically connected to an electric push rod.

[0015] Preferably, in a semiconductor wafer dicing apparatus, a circular boss is connected to the top center of the processing table, a fixing ring is sleeved on the outside of the circular boss, an annular slide is formed on the outer side wall of the fixing ring, a screw cap is rotatably connected in the annular slide, an internal thread is provided on the inner wall of the screw cap, and an external thread that mates with the internal thread is provided on the outer side wall of the processing table.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. The present invention has a reasonable structural design and adopts dual-station integrated processing to realize the automatic switching between diamond thick saw blade grooving and thin saw blade dicing, reducing damage to the wafer. The two sets of saw blades are driven synchronously, without the need for an additional power source. The arc-shaped slide and electromagnet, together with the metal arc block, achieve precise deflection. Combined with infrared signal control, continuous cyclic processing can be completed. 2. This invention can effectively ensure processing accuracy. Through the cooperation structure of the processing table, the round boss, the fixed pressure ring and the screw cap, the blue film on the outer side of the semiconductor wafer can be effectively pressed and fixed, which facilitates the scribing processing with the semiconductor wafer. While the straight rack and the straight gear ring are meshing and driving, the ratchet disk and the ratchet seat cooperate with each other to achieve a precise 90-degree deflection and locking of the steering shaft, so that the scribing trajectory is orthogonal when the translation seat moves back and forth, ensuring processing quality. 3. This invention can ensure a good working environment. It uses a combination of a liquid storage tank, a liquid pump and a flushing pipe to cool the processing position in real time. The blower can blow the waste liquid and waste chips onto the arc plate, and then collect them into the collection box through the discharge port and the guide hopper. This avoids the pollution of the working environment by waste chips and waste liquid, and also reduces the burden of manual cleaning. In summary, this device not only meets the high-precision requirements of semiconductor wafer dicing, but also improves production efficiency through continuous and automated operation, while maintaining a clean working environment, providing an efficient and reliable solution for the semiconductor wafer processing field. Attached Figure Description

[0017] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the internal structure of the casing in this invention; Figure 4 This is a schematic diagram of the linkage block in this invention; Figure 5 This is a schematic diagram of the guide component in the present invention; Figure 6 This is a schematic diagram of the installation of the fixing ring in this invention; Figure 7 This is a schematic diagram of the transverse sliding seat in this invention; Figure 8 This is a top view of the T-shaped tube in this invention; Figure 9 This is a schematic diagram of the fixing frame in this invention; Figure 10 This is a schematic diagram of the external structure of the dicing assembly in this invention. Figure 1 ; Figure 11 This is a schematic diagram of the external structure of the dicing assembly in this invention. Figure 2 ; Figure 12 This is a top view of the drive shaft structure in this invention; Figure 13 This is a schematic diagram of the internal structure of the hollow tube in this invention; Figure 14 This is a top view of the transmission cavity in this invention. Figure 15 This is a top view of the ratchet disc in this invention. Figure 16 This is a top view of the ratchet seat in this invention. Figure 17 This is a schematic diagram of the assembly structure of the ratchet disc and ratchet seat in this invention.

[0019] In the diagram: 1. Housing; 2. Side support; 3. Hydraulic push rod; 4. Linkage block; 5. Translation seat; 6. Steering shaft; 7. Machining table; 8. Guide assembly; 9. Transverse seat; 10. Fixing frame; 11. Sliding assembly; 12. PLC controller; 101. Receiving cavity; 102. Storage box; 103. Stop; 104. Contact switch; 201. Discharge port; 202. Guide hopper; 203. Arc plate; 204. Stop bar; 205. Clearance groove; 206. Reinforcing rib; 211. Infrared signal transmitter one; 212. Infrared signal transmitter two 501. Support ball head; 502. Transmission cavity; 503. Positioning gear; 504. Grooved wheel; 505. Straight groove; 506. Lower short shaft; 507. Racket disc; 508. Spur gear ring; 509. Racket groove; 510. Damping shaft; 511. Ratchet seat; 512. Ratchet groove; 513. Ratchet; 514. Compression spring; 515. L-shaped lever; 516. Actuating post; 517. Electric actuator; 518. Spur rack; 519. L-shaped lever; 701. Round boss; 702. Fixing ring; 703. Annular slide; 704. Screw cap; 801. H-type seat; 802. Horizontal guide rod; 803. Bearing seat; 804. Transverse reciprocating lead screw; 805. Lead screw motor; 806. Nut seat; 901. Guide hole; 902. Liquid storage tank; 903. Liquid pump; 904. T-tube; 905. Drainage tube; 906. Inclined support; 907. Blower; 908. Infrared signal receiver one; 909. Infrared signal receiver two; 1001, Annular seat; 1002, Bearing ring; 1003, Fixing block; 1004, U-shaped guard; 1005, Flushing pipe; 1006, Water outlet; 1007, Arc-shaped slide groove; 1008, Electromagnet; 1101. Cylindrical shell; 1102. Drive motor; 1103. Drive shaft; 1104. Bevel gear ring one; 1105. Bevel gear ring two; 1106. Hollow tube; 1107. Transmission shell; 1108. Assembly shaft; 1109. Bevel gear ring three; 1110. Diamond thick saw blade; 1111. Diamond thin saw blade; 1112. Driven shaft; 1113. Bevel gear three; 1114. Bevel gear one; 1115. Bevel gear two; 1116. Steering arm; 1117. Metal arc block. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0021] Please see Figure 1-17As shown, this embodiment is a semiconductor wafer dicing device, including a housing 1. Side supports 2 are connected to the top left and right sides of the housing 1. A hydraulic push rod 3 is connected to the top middle section of the housing 1. A linkage block 4 is connected to the rear free end of the hydraulic push rod 3. A translation seat 5 is connected to the top of the linkage block 4. A steering shaft 6 is rotatably connected to the top of the translation seat 5. A processing table 7 is connected to the top of the steering shaft 6. A guide assembly 8 is connected between the horizontal parts of the two side supports 2. A transverse seat 9 is slidably connected in the guide assembly 8. A fixing frame 10 is connected to the bottom of the transverse seat 9. A dicing assembly 11 is installed in the fixing frame 10. A PLC controller 12 is connected to the front end of the housing 1.

[0022] A circular boss 701 is connected to the top center of the processing table 7. A fixing ring 702 is sleeved on the outside of the circular boss 701. An annular slide 703 is opened on the outer side wall of the fixing ring 702. A screw cap 704 is rotatably connected in the annular slide 703. The inner wall of the screw cap 704 is provided with an internal thread. The outer side wall of the processing table 7 is provided with an external thread that matches the internal thread, which facilitates machining.

[0023] The guide assembly 8 includes two parallel H-shaped seats 801. The lower end of the H-shaped seat 801 is fixed to the top wall of the side support 2. A horizontal guide rod 802 is fixedly connected between the top ends of the two H-shaped seats 801. The horizontal guide rod 802 movably passes through the guide hole 901. A bearing seat 803 is connected to the top wall of the horizontal part of the H-shaped seat 801. A transverse reciprocating screw 804 is rotatably connected between the two bearing seats 803. A screw motor 805 is connected to the left end of the transverse reciprocating screw 804. A nut seat 806 is screwed to the outer wall of the transverse reciprocating screw 804. The upper end of the nut seat 806 is fixed to the bottom wall of the transverse sliding seat 9. The transverse reciprocating screw 804 passes through the inclined bracket 906.

[0024] The specific implementation method of this embodiment is as follows: When using this device, an external power supply is connected, the housing 1 is placed on a flat surface, a blue film is adhered to the back of the semiconductor wafer to be diced, the blue film is placed on the circular boss 701 of the processing table 7, a fixing ring 702 is fitted on the outside of the circular boss 701, the screw cap 704 is rotated to make the internal thread and the external thread engage and assemble, thereby causing the fixing ring 702 to descend close to the surface of the processing table 7, which can press and fix the blue film on the outside of the wafer, making it convenient to dicing the wafer; The longitudinal position of the linkage block 4 is adjusted by the hydraulic push rod 3, and the translation seat 5 moves synchronously with the linkage block 4, which can adjust the longitudinal relative position with the dicing assembly 11. The lead screw motor 805 drives the transverse reciprocating lead screw 804 to rotate, and the horizontal guide rod 802 cooperates with the guide hole 901 to guide and limit. The nut seat 806 can drive the transverse translation seat 9 to move laterally reciprocally, and the fixing frame 10 moves laterally reciprocally accordingly. The dicing assembly 11 can perform dicing processing on the wafer. Example 2

[0025] Based on Embodiment 1, the dicing assembly 11 includes a cylindrical shell 1101. A drive motor 1102 is connected to the center of the rear side wall of the cylindrical shell 1101. A drive shaft 1103 is connected to the front output end of the drive motor 1102. A bevel gear ring 1104 and a bevel gear ring 1105 are connected to the outer wall of the drive shaft 1103. Two hollow tubes 1106 are connected to the lower part of the outer wall of the cylindrical shell 1101. A transmission shell 1107 is connected to the lower end of the hollow tubes 1106. An assembly shaft 1108 is rotatably connected to the center of the transmission shell 1107. A bevel gear ring 1109 is connected to the outer wall of the assembly shaft 1108. Diamond thick saw blades 1110 and... are respectively connected to the front ends of the left and right assembly shafts 1108. The diamond thin saw blade 1111 has a driven shaft 1112 rotatably connected to the inner wall of the hollow tube 1106 via a bearing. Both driven shafts 1112 are connected to a bevel gear 1113 at one end of their extension into the transmission housing 1107. The bevel gear 1113 meshes with a bevel gear ring 1109. The two driven shafts 1112 are connected to a bevel gear 1114 and a bevel gear 1115 at one end of their extension into the cylindrical housing 1101, respectively. The bevel gear 1114 meshes with a bevel gear ring 1104, and the bevel gear 1115 meshes with a bevel gear ring 1105. A steering arm 1116 is connected to the center of the front side wall of the cylindrical housing 1101, and a metal arc block 1117 is connected to the bottom of the rear side wall of the steering arm 1116.

[0026] The fixed frame 10 includes two annular seats 1001 arranged in parallel front and rear. The outer walls of the cylindrical shell 1101 are rotatably connected to the annular seats 1001 at both ends through bearing rings 1002. A fixed block 1003 is connected between the upper end of the annular seat 1001 and the transverse seat 9, enabling synchronous transverse movement. A U-shaped guard 1004 is connected to the lower part of the outer wall of the annular seat 1001. A flushing pipe 1005 is connected to the lower end of the U-shaped guard 1004. The flushing pipe 1005 has multiple water outlet holes 1006 on the side facing the transmission shell 1107. An arc-shaped groove 1007 is provided on the lower part of the front end face of the front annular seat 1001. Electromagnets 1008 are embedded at the left and right ends of the arc-shaped groove 1007. A metal arc block 1117 is slidably connected in the arc-shaped groove 1007.

[0027] The intersection of the central axes of the two driven shafts 1112 coincides on the central axis of the drive shaft 1103. The included angle between the central axes of the two driven shafts 1112 is 60 degrees. The arc-shaped slide groove 1007 is coaxial with the cylindrical shell 1101. The included angle of the deflection area of ​​the steering arm 1116 is 60 degrees. The lower ends of the diamond thick saw blade 1110 and the diamond thin saw blade 1111 are located in the same vertical plane to ensure machining accuracy.

[0028] The specific implementation method of this embodiment is as follows: In this embodiment, the electromagnets 1008 on both sides of the arc-shaped groove 1007 sequentially attract the metal arc block 1117, causing the steering arm 1116 to drive the cylindrical shell 1101 to deflect, which enables the two hollow tubes 1106 to reach the vertical state in sequence. The station switching is convenient, and it is easy to perform grooving with the diamond thick saw blade 1110 and dicing with the diamond thin saw blade 1111 in sequence, which helps to further reduce damage to the wafer. The drive motor 1102 drives the drive shaft 1103 to rotate. The bevel gear ring 1104 and bevel gear ring 2 1105 respectively mesh with the bevel gear 1114 and bevel gear 2 1115 on both sides of the transmission, which in turn causes the driven shaft 1112 to drive the bevel gear 3 1113 to rotate. The bevel gear 3 1113 meshes with the bevel gear ring 3 1109, so that the two sets of assembly shafts 1108 respectively drive the diamond thick saw blade 1110 and the diamond thin saw blade 1111 to rotate, without the need for additional drive equipment. Example 3

[0029] Based on Embodiment 2, guide holes 901 are provided at both the front and rear of the transverse shift seat 9. A liquid storage tank 902 is connected to the top of the transverse shift seat 9. A liquid pump 903 is provided in the liquid storage tank 902. A T-shaped tube 904 is connected to the output end of the liquid pump 903. A drainage tube 905 is connected between the T-shaped tube 904 and the flushing tube 1005. An inclined bracket 906 is connected to the left and right sides of the bottom of the transverse shift seat 9. A blower 907 is connected to the lower end of the inclined bracket 906. An infrared signal receiver 1 908 and an infrared signal receiver 2 909 are respectively connected to the front and rear ends of the transverse shift seat 9. An infrared signal transmitter 1 211 and an infrared signal transmitter 212 are respectively connected to the front top of the left side support 2 and the rear top of the right side support 2.

[0030] The housing 1 has a receiving cavity 101, and a storage box 102 is inserted into the lower part of the receiving cavity 101. The side support 2 has a discharge port 201 on its horizontal part. The lower end of the discharge port 201 is connected to a guide hopper 202. The lower end of the guide hopper 202 extends into the receiving cavity 101 and is located above the storage box 102. An arc plate 203 is connected between the two discharge ports 201 to facilitate the introduction of waste into the discharge port 201. The front and rear ends of the top of the arc plate 203 are connected to the baffles 204. The center of the arc plate 203 has a clearance groove 205 to not hinder the longitudinal movement of the translation seat 5. The steering shaft 6 passes through the clearance groove 205. A reinforcing rib 206 is connected between the bottom wall of the horizontal part of the side support 2 and the housing 1 to improve the structural strength. A stop block 103 is connected to the rear side of the top of the housing 1. A contact switch 104 is connected to the front end of the stop block 103. The contact switch 104 is electrically connected to the electric push rod 517.

[0031] The specific implementation method of this embodiment is as follows: In this embodiment, the transverse shifter 9 is initially located on the left side of the guide assembly 8. After the device is powered on, the infrared signal receiver 908 first receives the signal emitted by the infrared signal transmitter 211 and transmits it to the PLC controller 12, which then starts the right electromagnet 1008 and the left blower 907. As the transverse shifter 9 moves to the right, the diamond thick saw blade 1110 performs grooving work until the infrared signal receiver 908 receives the signal emitted by the infrared signal transmitter 212. The PLC controller 12 then cuts off the power to the right electromagnet 1008 and the left blower 907 and starts the left electromagnet 1008 and the right blower 907. After the transverse shifter 9 moves to the left, it performs the dicing operation. This cycle repeats, and continuous grooving and dicing can be achieved by switching work positions. The airflow generated by the working blower 907 blows directly to the processing position and is not blocked by the non-working hollow tube 1106. During the grooving and dicing operations, the coolant in the storage tank 902 is drawn by the pump 903. The coolant enters the diversion pipe 905 along the end of the T-shaped pipe 904 and is then sprayed out from the water outlet 1006 of the flushing pipe 1005, which can cool the processing position. The processing position is blown by the blower 907, which can blow the waste liquid and waste chips into the arc plates 203 on both sides, and then into the guide hopper 202 through the discharge port 201. The waste is then collected and processed by the collection box 102 to maintain a good working environment. Example 4

[0032] Based on Embodiment 3, the bottom of the translation seat 5 is connected to multiple support ball heads 501. The lower ends of the support ball heads 501 abut against the upper surface of the housing 1 to ensure smooth longitudinal movement of the translation seat 5. The translation seat 5 is provided with a transmission cavity 502. One end of the steering shaft 6 extending into the transmission cavity 502 is connected to a grooved wheel 504. The lower end of the grooved wheel 504 is connected to a positioning gear 503. The grooved wheel 504 has four straight grooves 505 circumferentially formed. The bottom wall of the transmission cavity 502 rotates. A lower short shaft 506 is connected, and a ratchet disc 507 is connected to the upper end of the lower short shaft 506. A spur gear ring 508 is connected to the outer side wall of the ratchet disc 507. Multiple ratchet grooves 509 are circumferentially opened on the inner side wall of the ratchet disc 507. A damping shaft 510 is installed on the top wall of the transmission cavity 502. The damping shaft 510 is coaxial with the lower short shaft 506. The lower end of the damping shaft 510 is connected to a ratchet seat 511, which extends into the ratchet disc 507.

[0033] The outer wall of the ratchet seat 511 is provided with a ratchet groove 512, and a ratchet block 513 is hinged in the ratchet groove 512. A compression spring 514 is connected between the middle section of the ratchet block 513 and the inner wall of the ratchet groove 512. A lever 515 is connected to the outer wall of the ratchet seat 511. The axis of the lever 515 is perpendicular to the axis of the damping shaft 510. A toggle post 516 is connected to the end of the lever 515. The toggle post 516 extends into the straight groove 505. An electric push rod 517 is connected to the inner wall of the transmission cavity 502. A spur rack 518 is connected to the free end of the electric push rod 517. The spur rack 518 meshes with a spur gear ring 508. An L-shaped rod 519 is connected to the end of the spur rack 518. The end of the L-shaped rod 519 near the positioning gear 503 is set in a V-shape.

[0034] The specific implementation method of this embodiment is as follows: In this embodiment, as the hydraulic push rod 3 drives the linkage rod 4 to move backward, the translation seat 5 moves closer to the stop block 103. When the translation seat 5 abuts against the contact switch 104, the entire wafer is located behind the saw blade. At this time, the electric push rod 517 drives the rack 518 to perform one reciprocating motion. When the electric push rod 517 extends, the tip of the L-shaped rod 519 disengages from the positioning gear 503, and the steering shaft 6 can deflect. The rack 518 meshes with the transmission spur gear 508, causing the ratchet disc 507 to rotate one revolution. At this time, the ratchet groove 509 on the inner wall of the ratchet disc 507 locks the end of the ratchet block 513, thereby causing the ratchet seat 511 to rotate one revolution synchronously with the ratchet disc 507. The actuating post 516 at the end of the lever 515 slides in the straight groove 505, thereby causing the grooved wheel 504 to deflect 90 degrees. When the electric actuator 517 drives the rack 518 to retract, the ratchet disc 507 rotates in the opposite direction for one revolution. The inner wall of the ratchet groove 509 presses the ratchet block 513 into the ratchet block groove 512, and the length of the compression spring 514 is shortened. At this time, the ratchet seat 511 and the damping shaft 510 remain stationary. Finally, the tip of the L-shaped rod 519 extends into the tooth groove of the positioning gear 503 to complete the limit, ensuring that the machining table 7 is fixed after deflecting 90 degrees with the steering shaft 6, so that the scribing trajectory of the translation seat 5 when it moves forward is perpendicular to the trajectory when it moves backward.

[0035] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A dicing apparatus of a semiconductor wafer, comprising a housing (1), characterized in that: The top of the shell (1) is connected with side support (2), the top of the shell (1) is connected with hydraulic push rod (3), the rear side of hydraulic push rod (3) is connected with linkage block (4), the top of linkage block (4) is connected with translation seat (5), the top of translation seat (5) is rotatably connected with steering shaft (6), the top of steering shaft (6) is connected with processing table (7), the transverse part of two side support (2) is connected with guide assembly (8), the sliding connection of guide assembly (8) is connected with horizontal moving seat (9), the bottom of horizontal moving seat (9) is connected with fixed frame (10), the fixed frame (10) is installed with slice assembly (11), the front end of shell (1) is connected with PLC controller (12).

2. The apparatus of claim 1, wherein: The slice assembly (11) includes cylindrical shell (1101), the rear side wall center of cylindrical shell (1101) is connected with driving motor (1102), the front side output end of driving motor (1102) is connected with driving shaft (1103), the outer wall of driving shaft (1103) is connected with bevel gear one (1104) and bevel gear two (1105), the outer wall lower part of cylindrical shell (1101) is connected with two hollow tubes (1106), the lower end of hollow tube (1106) is connected with transmission shell (1107), the center of transmission shell (1107) is rotatably connected with assembly shaft (1108), the outer wall of assembly shaft (1108) is connected with bevel gear three (1109), the front end of left and right two assembly shaft (1108) is connected with diamond thick saw blade (1110) and diamond thin saw blade (1111) respectively, the inner wall of hollow tube (1106) is rotatably connected with driven shaft (1112) through bearing, the end of two driven shaft (1112) extending into transmission shell (1107) is connected with bevel gear three (1113), bevel gear three (1113) is connected with bevel gear three (1109) in meshing, the end of two driven shaft (1112) extending into cylindrical shell (1101) is connected with bevel gear one (1114) and bevel gear two (1115) respectively, bevel gear one (1114) is connected with bevel gear one (1104) in meshing, bevel gear two (1115) is connected with bevel gear two (1105) in meshing, the front side wall center of cylindrical shell (1101) is connected with steering arm (1116), the rear side wall bottom of steering arm (1116) is connected with metal arc block (1117).

3. The apparatus of claim 2, wherein: The fixed frame (10) comprises two annular seats (1001) arranged in parallel front and back, the outer wall of the cylindrical shell (1101) is rotationally connected with the annular seat (1001) through a bearing ring (1002) front and back, a fixed block (1003) is connected between the upper end of the annular seat (1001) and the transverse seat (9), a U-shaped guard frame (1004) is connected to the lower part of the outer wall of the annular seat (1001), a flushing pipe (1005) is connected to the lower end of the U-shaped guard frame (1004), a plurality of water outlets (1006) are formed in the side of the flushing pipe (1005) facing the transmission shell (1107), an arc-shaped sliding groove (1007) is formed in the lower part of the front end face of the front annular seat (1001), electromagnets (1008) are embedded in the left and right ends of the arc-shaped sliding groove (1007), and the metal arc block (1117) is slidingly connected in the arc-shaped sliding groove (1007).

4. The apparatus of claim 3, wherein: The intersection points of the central axes of the two driven shafts (1112) coincide on the central axis of the driving shaft (1103), the central axes of the two driven shafts (1112) form an angle of 60 degrees, the arc-shaped sliding groove (1007) is coaxially arranged with the cylindrical shell (1101), the deflection region of the steering arm (1116) forms an angle of 60 degrees, and the lower ends of the diamond thick saw blade (1110) and the diamond thin saw blade (1111) are located in the same vertical plane.

5. The apparatus of claim 3, wherein: The front and back of the transverse seat (9) is provided with a guide hole (901), the top of the transverse seat (9) is connected with a liquid storage tank (902), the liquid storage tank (902) is provided with a liquid pump (903), the output end of the liquid pump (903) is connected with a T-shaped pipe (904), the T-shaped pipe (904) and the flushing pipe (1005) are communicated through a drainage pipe (905), the bottom of the transverse seat (9) is connected with an inclined support (906) on the left and right sides, the lower end of the inclined support (906) is connected with a blower (907), the front and back ends of the transverse seat (9) are respectively connected with an infrared signal receiver one (908) and an infrared signal receiver two (909), and the top front side of the left side support (2) and the top rear side of the right side support (2) are respectively connected with an infrared signal emitter one (211) and an infrared signal emitter two (212).

6. The apparatus of claim 5 wherein: The guiding assembly (8) includes two parallel H-shaped seats (801), the lower end of the H-shaped seat (801) is fixed to the top wall of the side support (2), the top ends of the two H-shaped seats (801) are fixedly connected with a horizontal guide rod (802), the horizontal guide rod (802) is movably arranged in the guide hole (901), the transverse top wall of the H-shaped seat (801) is connected with a bearing seat (803), the two bearing seats (803) are rotatably connected with a transverse reciprocating screw rod (804), the left end of the transverse reciprocating screw rod (804) is connected with a screw rod motor (805), the outer wall of the transverse reciprocating screw rod (804) is screwed with a nut seat (806), the upper end of the nut seat (806) is fixed to the bottom wall of the horizontal moving seat (9), and the transverse reciprocating screw rod (804) penetrates through the inclined support (906).

7. The semiconductor wafer dicing apparatus according to claim 1, characterized in that: The bottom of the translation seat (5) is connected with a plurality of support ball heads (501), the lower end of the support ball head (501) abuts against the upper surface of the machine shell (1), the translation seat (5) is provided with a transmission cavity (502), one end of the steering shaft (6) extending into the transmission cavity (502) is connected with a grooved wheel (504), the lower end of the grooved wheel (504) is connected with a positioning gear (503), the circumferential direction of the grooved wheel (504) is provided with four straight grooves (505), the bottom wall of the transmission cavity (502) is rotatably connected with a lower short shaft (506), the upper end of the lower short shaft (506) is connected with a ratchet disc (507), the outer side wall of the ratchet disc (507) is connected with a straight tooth ring (508), the inner side wall of the ratchet disc (507) is provided with a plurality of ratchet grooves (509) in the circumferential direction, the top wall of the transmission cavity (502) is provided with a damping rotating shaft (510), the damping rotating shaft (510) is coaxially arranged with the lower short shaft (506), the lower end of the damping rotating shaft (510) is connected with a ratchet wheel seat (511), and the ratchet wheel seat (511) extends into the ratchet disc (507).

8. The apparatus of claim 7, wherein: The outer wall of the ratchet wheel seat (511) is provided with a ratchet block groove (512), the ratchet block groove (512) is hingedly connected with a ratchet block (513), the middle section of the ratchet block (513) is connected with the inner wall of the ratchet block groove (512) through a compression spring (514), the outer wall of the ratchet wheel seat (511) is connected with a push rod (515), the axis of the push rod (515) is perpendicular to the axis of the damping rotating shaft (510), the end of the push rod (515) is connected with a pushing column (516), the pushing column (516) extends into the straight groove (505), the inner side wall of the transmission cavity (502) is connected with an electric push rod (517), the free end of the electric push rod (517) is connected with a straight tooth rack (518), the straight tooth rack (518) is meshingly connected with the straight tooth ring (508), and the end of the straight tooth rack (518) is connected with an L-shaped rod (519).

9. The apparatus of claim 8 wherein: The shell (1) is internally provided with a containing cavity (101), the lower part of the containing cavity (101) is inserted with a receiving box (102), the lateral support (2) is provided with a discharging port (201) in the transverse part, the lower end of the discharging port (201) is communicated with a guide hopper (202), the lower end of the guide hopper (202) extends into the containing cavity (101) and is located above the receiving box (102), the two discharging ports (201) are connected with an arc-shaped plate (203), the top of the arc-shaped plate (203) is connected with a blocking strip (204) at the front and rear ends, the center of the arc-shaped plate (203) is provided with a let-in slot (205), the turning shaft (6) penetrates through the let-in slot (205), the lateral support (2) is connected with a reinforcing rib (206) between the transverse bottom wall and the shell (1), the top of the shell (1) is connected with a blocking block (103) at the rear side, the front end of the blocking block (103) is connected with a contact switch (104), and the contact switch (104) is electrically connected with an electric push rod (517).

10. The apparatus of claim 1, wherein: The top center of the processing table (7) is connected with a circular boss (701), the outer part of the circular boss (701) is sleeved with a fixed compression ring (702), the outer side wall of the fixed compression ring (702) is provided with an annular sliding channel (703), the annular sliding channel (703) is rotatably connected with a screw cap (704), the inner wall of the screw cap (704) is provided with an internal thread, and the outer side wall of the processing table (7) is provided with an external thread matched with the internal thread.

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