A transmission type high-precision flip-chip bonding device

Abstract

This invention relates to the field of chip packaging technology, specifically to a transmission-type high-precision flip-chip bonding device, comprising a worktable with a coating assembly on the worktable; the coating assembly includes a mounting plate, several containers disposed on the bottom surface of the mounting plate, pistons slidably connected within the containers, a discharge tube, and two sealing structures; the sealing structure includes a plug corresponding to the inlet position of the discharge tube, a rotating rod for driving the corresponding plug to move horizontally, and a toothed plate for driving the corresponding rotating rod to rotate. This technical solution improves efficiency by using multiple sets of containers simultaneously in conjunction with the piston to synchronously coat all bumps with flux, while the sealing structures adaptively adjust the coating amount for bumps with different spacings.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, specifically a transmissive high-precision flip-chip bonding device. Background Technology

[0002] In chip packaging, the chip needs to be soldered onto the substrate, a process called bonding. In order to save space, engineers have developed flip bonding, which refers to soldering the chip with its functional side facing down through bumps on the chip to bump pads on the substrate. This eliminates the need for metal leads. The substrate can be a transmissive substrate to improve the positioning accuracy when bonding the chip and the substrate.

[0003] For example, invention application CN117766414A, in the field of integrated circuit packaging technology, discloses a system-on-a-chip (SoC) structure and its C2W gradient reflow assembly method. The method includes the following steps: providing a TSV wafer, solder paste, and resistor / capacitor components; applying solder paste to the resistor / capacitor pad areas on the front side of the TSV wafer, and mounting the resistors / capacitors to the resistor / capacitor pad areas using a C2W process; selecting high-melting-point bump chips, applying flux, and mounting the high-melting-point bump chips to the corresponding pad areas on the front side of the TSV wafer using a C2W process; placing the TSV wafer in a reflow oven for reflow, cleaning the flux, and completing the underfilling of the resistors / capacitors and high-melting-point bump chips to form an underfill adhesive; then selecting higher-melting-point bump chips and applying flux.

[0004] Based on the above cases and actual situations, we have found the following problems: In the existing flip-chip bonding of chips and substrates, it is generally divided into soldering and copper soldering. In the process of manufacturing chips and substrates, copper or tin bumps are set on the corresponding bonding sides. After the chip and substrate bumps are precisely aligned, they are soldered. In soldering, flux is usually applied to the substrate bumps to assist in the soldering bonding. Considering that there are many bumps on the existing substrates, the traditional method of applying flux is to apply it one by one with a spray gun, which has low coating efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a transmission-type high-precision flip-chip bonding device, which improves efficiency by setting multiple sets of holding tanks and working with pistons to simultaneously apply flux to all bumps. At the same time, the device is equipped with a sealing structure to adaptively change the amount of flux applied to bumps with different spacings, thereby solving the above-mentioned problems of the prior art.

[0006] To achieve the above objectives, the present invention provides a transmission-type high-precision flip-chip bonding device, including a worktable, wherein the worktable is provided with a coating component for applying flux to flip-chip bonding.

[0007] The coating assembly includes a mounting plate installed on a workbench, several containers disposed on the bottom surface of the mounting plate, pistons slidably connected inside the containers, discharge pipes symmetrically disposed on the left and right sides inside the containers, and two sealing structures for sealing the inlets of the discharge pipes. The containers are regularly distributed along the outer edge of the bottom surface of the mounting plate. A stop rod is fixed to the lower half of each container. The bottom end of the stop rod is inserted into the corresponding piston and the two are slidably connected. The bottom outlet of the discharge pipe is located on the bottom surface of the containers and is inclined towards the center.

[0008] The sealing structure includes a plug corresponding to the inlet position of the discharge pipe, a rotating rod for driving the corresponding plug to move horizontally, and a toothed plate for driving the corresponding rotating rod to rotate. A threaded rod is coaxially fixedly connected to the inner end of the plug, and the threaded rod is threadedly connected to the corresponding rotating rod. Adjacent containers are connected by a first connecting rod and a second connecting rod. The first connecting rod and the second connecting rod are slidably connected. Both the first connecting rod and the second connecting rod are provided with a linkage component. A sliding plate is provided in the linkage component. The sliding plate is fixedly connected to the outer end of the toothed plate on the corresponding side.

[0009] In this setup, existing flip-chip bonding to substrates generally involves soldering and copper soldering. This involves placing copper or tin bumps on the corresponding bonding sides of the chip and substrate, then precisely aligning the bumps before soldering. Soldering typically requires applying flux to the substrate bumps to aid bonding. Considering the large number of bumps on existing substrates, traditional flux application using a spray gun is inefficient. Therefore, this technical solution uses multiple containers with pistons to simultaneously apply flux to all bumps, improving efficiency. Furthermore, a sealing structure allows for adaptive adjustments to the coating amount for bumps with different spacing.

[0010] In the technical solution of the present invention, the worktable is provided with a placement stage for placing a substrate and a chip, a negative pressure adsorption component for flip-chip adsorption is provided above the placement stage, a bidirectional micro-positioning system for high-precision positioning of the substrate and the chip is provided on the left side of the placement stage, and the coating component is located on the right side of the bidirectional micro-positioning system.

[0011] In this setup, a placement stage is used to place the substrate and chip, a negative pressure adsorption component is used to invert and adsorb the chip, and a bidirectional microscopic positioning system is used to perform high-precision positioning of the substrate and chip.

[0012] In the technical solution of the present invention, the bottom surface of the mounting plate is provided with a U-shaped mounting groove near the outer edge. Several containers are regularly arranged in four groups within the four sides of the mounting groove. A protrusion is fixed in the middle of the top surface of the container. A magnetic block is embedded in the middle of the top surface of the protrusion. A sliding rod is fixed in the four sides of the mounting groove. The sliding rod passes through the protrusion in the same side and the protrusion is slidably connected to the corresponding sliding rod. Several regularly distributed magnets are embedded in the top surface of the four sides of the mounting groove.

[0013] In this setup, protrusions and sliders are used to allow the container to slide along the sliders and change the spacing between adjacent containers. Magnetic blocks and magnets are used to fix the containers in place during use, preventing the containers from changing position after being squeezed by the protrusions on the substrate.

[0014] In the technical solution of the present invention, the inner wall size of the container is adapted to the upper half size of the piston, the bottom end of the push rod is inserted into the corresponding piston and the two are slidably connected, and a first spring is provided between the piston and the bottom end of the push rod.

[0015] In this configuration, a first spring is provided so that after the substrate bump separates from the piston, the first spring can drive the piston to return to its original position.

[0016] In the technical solution of the present invention, a fixing rod is fixed on the top surface of the container, and ratchet wheels are rotatably connected to the left and right sides of the bottom end of the fixing rod. The outer ring surface of the ratchet wheel is provided with teeth, which mesh with the corresponding toothed plate. A rotating wheel is provided inside the ratchet wheel, and the inner side of the rotating wheel is rotatably connected to the corresponding side end face of the bottom end of the fixing rod. The outer side of the rotating wheel is coaxially fixedly connected to the corresponding rotating rod.

[0017] In this setup, a fixing rod is used to install the entire sealing structure, and a ratchet is used to restrict the unidirectional transmission of the toothed plate and teeth.

[0018] In the technical solution of the present invention, a shaft is provided on the inner side of the rotating wheel near the edge, and a pawl is rotatably connected to the shaft. The pawl is bent counterclockwise from the inner side to the outer side. The ratchet is adapted to the pawl. A second spring for driving the pawl to reset is provided on the outer sleeve of the shaft. A stop bar is fixed on the inner side of the rotating wheel located on the outer convex side of the pawl to restrict the clockwise rotation of the pawl.

[0019] In this setup, by using a pawl and a ratchet, when the toothed plate moves forward, the teeth drive the ratchet to rotate counterclockwise, and the pawl will not rotate. When the toothed plate moves backward, it drives the ratchet to rotate clockwise, which in turn drives the pawl to rotate clockwise in sync.

[0020] In the technical solution of the present invention, the inner wall of the container is symmetrically fixed with limiting rods at the corresponding position of the discharge pipe inlet, the inner end of the plug is symmetrically fixed with flanges, the inner end of the limiting rod passes through the flange corresponding to the plug and the two are slidably connected, and the rod wall portion of the limiting rod between the flange and the inner wall of the container is sleeved with a third spring.

[0021] In this setup, when the pawl rotates clockwise, it drives the rotating wheel and the rotating rod to rotate clockwise synchronously. Due to the limit rod, the clockwise rotating rod pushes the threaded rod and the plug forward, blocking the inlet of the discharge pipe and ending the coating process.

[0022] In the technical solution of the present invention, the linkage consists of two rings and several crossbars fixedly disposed between the two rings, the slide plate is disposed between the two rings of the linkage, and the crossbars pass through the corresponding slide plate and the two are slidably connected.

[0023] In the technical solution of the present invention, the right end of the first connecting rod is disposed inside the second connecting rod, the right end of the first connecting rod is fixedly connected to the left end of the linkage member inside the second connecting rod, and a connecting rod is coaxially fixed inside the second connecting rod, the left end of the connecting rod being fixedly connected to the right end of the linkage member inside the first connecting rod.

[0024] In this configuration, when the spacing between the containers is reduced, the first link moves to the right, pushing the linkage in the second link to move to the right, thus reducing the distance between the linkage in the second link and the right end of the second link. At this time, after the substrate bumps contact the piston, the piston squeezes the flux above and contacts the slide plate. This process is shortened, thereby speeding up the process of the plug blocking the inlet of the discharge pipe, achieving the purpose of reducing the amount of flux sprayed out, and avoiding excessive flux coating due to the small bump spacing, which would affect the welding.

[0025] In the technical solution of the present invention, the size of the sliding plate in the first connecting rod is adapted to the size of the inner wall of the first connecting rod, and the size of the sliding plate in the second connecting rod is adapted to the size of the inner wall of the second connecting rod.

[0026] In this configuration, when the substrate bump contacts the piston, it will squeeze the piston upward and squeeze the flux in the container. At the same time, the flux will enter the first and second connecting rods and push the slide plate inward. The slide plate can then drive the toothed plate to move backward and drive the ratchet to rotate clockwise, which in turn drives the pawl to rotate clockwise in sync. It should be noted that the outermost first and second connecting rods are fixed to the mounting groove wall by detachable threads, which facilitates the subsequent addition or reduction of the container.

[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0028] 1. In this invention, by setting up multiple sets of holding tanks to work with pistons simultaneously, when the substrate bumps contact the pistons, they will squeeze the pistons upwards, forcing the flux in the holding tanks to enter from the inlet of the discharge pipe and then spray out from the outlet of the discharge pipe to coat the substrate bumps. At the same time, since the substrate bumps are of the same height, the space for the piston to rise and compress is the same, thereby ensuring that the flux coated on each bump is also the same, improving the uniformity of flux coating. Simultaneously, multiple bumps are coated at the same time, which greatly improves the coating efficiency.

[0029] 2. In this invention, by setting a sealing structure, when the protrusion spacing is small, the spacing of the holding tank is reduced. The first connecting rod moves to the right, pushing the linkage in the second connecting rod to move to the right, thereby reducing the distance from the linkage in the second connecting rod to the right end of the second connecting rod. This shortens the time for the piston to squeeze the flux above and contact the slide plate, thereby accelerating the speed at which the plug blocks the inlet of the discharge pipe, achieving the purpose of reducing the amount of flux sprayed, and avoiding excessive flux coating due to the small protrusion spacing, which would affect the welding. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the coating assembly of the present invention;

[0032] Figure 3 This is a cross-sectional view of the mounting plate in this invention;

[0033] Figure 4 This is a schematic diagram of the container in this invention;

[0034] Figure 5 This is a schematic diagram of the interior of the container in this invention;

[0035] Figure 6 This is a cross-sectional view of the container in this invention;

[0036] Figure 7 This is a schematic diagram of the sealing structure in this invention;

[0037] Figure 8 This is an exploded view of the sealing structure in this invention;

[0038] Figure 9 This is an exploded view of the rotor in this invention;

[0039] Figure 10 This is an exploded view of the plug in this invention;

[0040] Figure 11 This is a cross-sectional view of the first and second connecting rods in this invention;

[0041] Figure 12 For the present invention Figure 11 Exploded view;

[0042] 100. Workbench;

[0043] 200. Placement platform;

[0044] 300. Negative pressure adsorption component;

[0045] 400. Two-way microscopic positioning system;

[0046] 500. Coating component; 501. Mounting plate; 5011. Mounting groove; 5012. Slide rod; 502. Container; 5021. Protrusion; 5022. Magnetic block; 503. Piston; 504. Push rod; 505. Discharge pipe; 506. First spring; 510. Sealing structure; 511. First connecting rod; 512. Second connecting rod; 5121. Connecting rod; 513. Fixing rod; 514. Toothed plate; 515. Rotating rod; 5151. Plug; 5152. Threaded rod; 516. Ratchet; 5161. Tooth; 517. Rotating wheel; 5171. Pawl; 5172. Shaft; 5173. Second spring; 5174. Stop bar; 518. Limiting rod; 5181. Third spring; 519. Linkage component; 5191. Slide plate. Detailed Implementation

[0047] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0048] Unless otherwise expressly stated, throughout this specification, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0049] Reference Figures 1-12 As shown, this embodiment provides a technical solution:

[0050] The transmission-type high-precision flip bonding device of the present invention includes a worktable 100, on which a coating component 500 for applying flux to flip bonding of chips is provided.

[0051] The coating assembly 500 includes a mounting plate 501 mounted on a workbench 100, several containers 502 disposed on the bottom surface of the mounting plate 501, pistons 503 slidably connected within the containers 502, discharge pipes 505 symmetrically disposed within the containers 502, and two sealing structures 510 for sealing the inlets of the discharge pipes 505. The containers 502 are regularly distributed along the outer edge of the bottom surface of the mounting plate 501. A stop rod 504 is fixed to the lower half of the containers 502, and the bottom end of the stop rod 504 is inserted into the corresponding piston 503 and the two are slidably connected. The bottom outlet of the discharge pipe 505 is located on the bottom surface of the container 502 and is inclined towards the center. In existing flip-chip bonding of chips and substrates, it is generally divided into solder bonding and copper bonding, that is, copper bonding is applied to the corresponding bonding sides of the chip and substrate during chip production. The chip and substrate are precisely aligned before soldering. In soldering, flux is usually applied to the substrate bumps to assist in the bonding. Considering that there are many bumps on the existing substrate, the traditional method of applying flux one by one by spray gun is inefficient. Therefore, this application sets up multiple sets of holding tanks 502 and pistons 503. When the substrate bumps come into contact with the pistons 503, they will squeeze the pistons 503 upwards, forcing the flux in the holding tanks 502 to enter from the inlet of the discharge pipe 505 and then spray out from the outlet of the discharge pipe 505 to coat the substrate bumps. At the same time, since the substrate bumps are of the same height, the pistons 503 have the same space for compression, thus ensuring that the flux coating on each bump is the same and improving the uniformity of flux coating.

[0052] The sealing structure 510 includes a plug 5151 corresponding to the inlet position of the discharge pipe 505, a rotating rod 515 for driving the corresponding plug 5151 to move horizontally, and a toothed plate 514 for driving the corresponding rotating rod 515 to rotate. A threaded rod 5152 is coaxially fixedly connected to the inner end of the plug 5151. The threaded rod 5152 is threadedly connected to the corresponding rotating rod 515. Adjacent containers 502 are connected by a first connecting rod 511 and a second connecting rod 512. The first connecting rod 511 and the second connecting rod 512 are slidably connected. Both the first connecting rod 511 and the second connecting rod 512 are provided with a linkage 519. The linkage 519 is provided with a sliding plate 5191. The sliding plate 5191 is fixedly connected to the outer end of the corresponding side toothed plate 514. Next, by setting the sealing structure 510, considering that the bump spacing is different when different chips are flip-chip bonded, when the bump spacing is small, the spacing of the container 502 is reduced. The first link 511 moves to the right, pushing the linkage 519 in the second link 512 to move to the right, thereby reducing the distance between the linkage 519 in the second link 512 and the right end of the second link 512. At this time, after the substrate bumps contact the piston 503, the piston 503 squeezes the flux above and contacts the slide plate 5191. The time of this process is shortened, thereby speeding up the speed at which the plug 5151 blocks the inlet of the discharge pipe 505, achieving the purpose of reducing the amount of flux sprayed, and avoiding the small bump spacing and excessive flux coating, which would affect the welding.

[0053] Please see Figure 1 As shown, the worktable 100 is equipped with a placement stage 200 for placing the substrate and the chip. Above the placement stage 200 is a negative pressure adsorption assembly 300 for flip-chip adsorption. On the left side of the placement stage 200 is a bidirectional micro-positioning system 400 for high-precision positioning of the substrate and the chip. The coating assembly 500 is located to the right of the bidirectional micro-positioning system 400. During bonding, the chip is first placed on the placement stage 200, and then the bidirectional micro-positioning system 400 is activated, moving between the placement stage 200 and the negative pressure adsorption assembly 300. The bidirectional micro-positioning system 400 positions the chip and the negative pressure adsorption assembly 300 accordingly. The chip is positioned using the adsorption hole of component 300, and then the chip is adsorbed by the negative pressure adsorption component 300. It should be noted that the functional area of ​​the chip is inverted with one side facing down. Then the substrate is placed on the placement stage 200, and the coating component 500 is activated to apply flux to the bumps. Then the bidirectional micro positioning system 400 is moved between the placement stage 200 and the negative pressure adsorption component 300 to accurately position the chip and the substrate. Then the negative pressure adsorption component 300 drives the chip to press down on the substrate, and the heating device built into the placement stage 200 is used for heating, thus completing the flip bonding. The above positioning, heating and other processes are existing technologies and will not be described in detail here.

[0054] It should be noted that the placement stage 200, negative pressure adsorption component 300, coating component 500 and bidirectional microscopic positioning system 400 are all driven by three-way drive devices along the X, Y and Z axes. This is existing technology and will not be described in detail here.

[0055] Please see Figures 2-4 As shown, the bottom surface of the mounting plate 501 has a U-shaped mounting groove 5011 near its outer edge. Several containers 502 are regularly arranged in four groups within the four sides of the mounting groove 5011. A protrusion 5021 is fixed in the center of the top surface of each container 502, and a magnetic block 5022 is embedded in the center of the top surface of the protrusion 5021. Sliding rods 5012 are fixed within the four sides of the mounting groove 5011. It should be noted that gaps are left at the rear end of the horizontal sliding rod 5012 and the left end of the vertical sliding rod 5012 for adding or reducing containers 502. The sliding rods 5012 pass through the protrusions 5021 on the same side, and the protrusions... 5021 is slidably connected to the corresponding slide bar 5012. Several regularly distributed magnets are embedded in the top surface of the four sides of the mounting groove 5011. By setting the protrusion 5021 and the slide bar 5012, the container 502 can slide along the slide bar 5012 to change the spacing between adjacent container 502. By setting the magnetic block 5022 and the magnet, the container 502 is fixed when in use to prevent the container 502 from changing position after being squeezed by the substrate protrusion. It should be noted that when reducing or increasing the spacing between container 502, it is necessary to add or remove container 502, which will not be elaborated here.

[0056] Please see Figures 5-6 As shown, the inner wall size of the container 502 is adapted to the upper half size of the piston 503 to prevent flux from escaping from the container 502. The bottom end of the push rod 504 is inserted into the corresponding piston 503 and the two are slidably connected. A first spring 506 is provided between the piston 503 and the bottom end of the push rod 504. By providing the first spring 506, after the substrate protrusion separates from the piston 503, the first spring 506 can drive the piston 503 to reset.

[0057] Please see Figure 5 , Figure 7 as well as Figure 8 As shown, a fixing rod 513 is fixed to the top surface of the container 502. Ratchets 516 are rotatably connected to the left and right sides of the bottom end of the fixing rod 513. The outer ring surface of the ratchet 516 is provided with teeth 5161, which mesh with the corresponding toothed plate 514. A rotating wheel 517 is provided inside the ratchet 516. The inner side of the rotating wheel 517 is rotatably connected to the corresponding side end face of the bottom end of the fixing rod 513. The outer side of the rotating wheel 517 is coaxially fixedly connected to the corresponding rotating rod 515. The entire sealing structure 510 is installed by setting the fixing rod 513, and the ratchet 516 is used to restrict the toothed plate 514 and the teeth 5161 to perform unidirectional transmission.

[0058] Please see Figure 9As shown, a shaft 5172 is provided on the inner side of the rotating wheel 517 near the edge. A pawl 5171 is rotatably connected to the shaft 5172. The pawl 5171 is bent counterclockwise from the inside to the outside. The ratchet 516 is adapted to the pawl 5171. A second spring 5173 is sleeved on the shaft 5172 to drive the pawl 5171 to reset. A stop bar 5174 is fixed on the inner side of the rotating wheel 517 on the outer convex side of the pawl 5171 to restrict the clockwise rotation of the pawl 5171. By setting the pawl 5171 to cooperate with the ratchet 516, when the toothed plate 514 moves forward, the teeth 5161 drive the ratchet 516 to rotate counterclockwise. At this time, the pawl 5171 will not rotate. When the toothed plate 514 moves backward, it drives the ratchet 516 to rotate clockwise, which will drive the pawl 5171 to rotate clockwise synchronously.

[0059] Please see Figure 10 As shown, limit rods 518 are symmetrically fixed at the inner wall of the container 502 at the corresponding position of the inlet of the discharge pipe 505. Flanges are symmetrically fixed at the inner end of the plug 5151. The inner end of the limit rod 518 passes through the flange on the corresponding plug 5151 and the two are slidably connected. A third spring 5181 is sleeved on the rod wall part of the limit rod 518 between the flange and the inner wall of the container 502. When the pawl 5171 rotates clockwise, it will drive the rotating wheel 517 and the rotating rod 515 to rotate clockwise synchronously. Due to the restriction of the limit rod 518, the clockwise rotating rod 515 will push the threaded rod 5152 and the plug 5151 forward to block the inlet of the discharge pipe 505 and end the coating process.

[0060] Please see Figures 11-12 As shown, the linkage 519 consists of two rings and several crossbars fixedly disposed between the two rings. A sliding plate 5191 is disposed between the two rings of the linkage 519. The crossbars pass through the corresponding sliding plates 5191 and are slidably connected. The right end of the first connecting rod 511 is disposed within the second connecting rod 512. The right end of the first connecting rod 511 is fixedly connected to the left end of the linkage 519 within the second connecting rod 512. A connecting rod 5121 is coaxially fixed inside the second connecting rod 512. The left end of the connecting rod 5121 is fixedly connected to the right end of the linkage 519 within the first connecting rod 511. When the linkage is retracted... When the small container 502 is spaced, the first connecting rod 511 moves to the right, pushing the linkage 519 in the second connecting rod 512 to move to the right, thereby reducing the distance between the linkage 519 in the second connecting rod 512 and the right end of the second connecting rod 512. At this time, after the substrate bumps contact the piston 503, the piston 503 squeezes the flux above and contacts the slide plate 5191. The time of this process is shortened, thereby accelerating the speed at which the plug 5151 blocks the inlet of the discharge pipe 505, achieving the purpose of reducing the amount of flux sprayed out, and avoiding excessive flux coating due to the small bump spacing, which would affect the welding.

[0061] Specifically, the size of the slide plate 5191 in the first link 511 is adapted to the inner wall size of the first link 511, and the size of the slide plate 5191 in the second link 512 is adapted to the inner wall size of the second link 512. When the substrate protrusion contacts the piston 503, it will squeeze the piston 503 upward and squeeze the flux in the container 502. At this time, the flux will enter the first link 511 and the second link 512 and push the slide plate 5191 inward. At this time, the slide plate 5191 can drive the toothed plate 514 to move to the rear side and drive the ratchet 516 to rotate clockwise, which in turn drives the pawl 5171 to rotate clockwise. It should be noted that the outermost first link 511 and the second link 512 are fixed to the groove wall of the mounting groove 5011 by detachable threads, which facilitates the subsequent addition or reduction of the container 502.

[0062] The working principle of the transmission-type high-precision flip-chip bonding device in this invention is as follows:

[0063] When flip bonding the chip and the substrate, the chip is placed on the placement stage 200, and then the bidirectional micro positioning system 400 is activated to move between the placement stage 200 and the negative pressure adsorption component 300. The bidirectional micro positioning system 400 positions the chip and the adsorption hole of the negative pressure adsorption component 300, and then the chip is adsorbed by the negative pressure adsorption component 300.

[0064] The substrate is then placed on the placement stage 200. After adjusting the coating assembly 500, the coating assembly 500 is moved downward. When the substrate bumps contact the piston 503, the piston 503 is squeezed upward, and the flux in the container 502 is squeezed out from the inlet of the discharge pipe 505 and sprayed out from the outlet of the discharge pipe 505 to coat the substrate bumps. At the same time, the flux enters the first connecting rod 511 and the second connecting rod 512 and pushes the slide plate 5191 inward. At this time, the slide plate 5191 can drive the toothed plate 514 to move backward, which drives the ratchet 516 to rotate clockwise, thereby driving the pawl 5171 and the rotating rod 515 to rotate clockwise in sync, pushing the threaded rod 5152 and the plug 5151 forward to block the inlet of the discharge pipe 505, thus ending the coating process.

[0065] When it is necessary to reduce the spacing between the containers 502, the first link 511 moves to the right, pushing the linkage 519 in the second link 512 to move to the right, thereby reducing the distance between the linkage 519 in the second link 512 and the right end of the second link 512. At this time, after the substrate bumps contact the piston 503, the piston 503 squeezes the flux above and contacts the slide plate 5191. The time of this process is shortened, thereby accelerating the speed at which the plug 5151 blocks the inlet of the discharge pipe 505, achieving the purpose of reducing the amount of flux sprayed out, and avoiding the small bump spacing and excessive flux coating, which would affect the welding.

[0066] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the specification and its equivalents.

Claims

1. A transmission-type high-precision flip-chip bonding device, comprising a worktable (100), characterized in that: The worktable (100) is provided with a coating assembly (500) for applying flux to flip-chip bonding. The coating assembly (500) includes a mounting plate (501) mounted on a workbench (100), a plurality of containers (502) disposed on the bottom surface of the mounting plate (501), pistons (503) slidably connected in the containers (502), discharge pipes (505) symmetrically disposed in the containers (502), and two sealing structures (510) for sealing the inlet of the discharge pipes (505). The containers (502) are regularly distributed along the outer edge of the bottom surface of the mounting plate (501). A stop rod (504) is fixed to the lower half of the containers (502). The bottom end of the stop rod (504) is inserted into the corresponding piston (503) and the two are slidably connected. The bottom outlet of the discharge pipe (505) is located on the bottom surface of the containers (502) and is inclined toward the center. The sealing structure (510) includes a plug (5151) corresponding to the inlet position of the discharge pipe (505), a rotating rod (515) for driving the corresponding plug (5151) to move horizontally, and a toothed plate (514) for driving the corresponding rotating rod (515) to rotate. The inner end of the plug (5151) is coaxially fixedly connected to a threaded rod (5152). The threaded rod (5152) is threadedly connected to the corresponding rotating rod (515). Adjacent containers (502) are connected by a first connecting rod (511) and a second connecting rod (512). The first connecting rod (511) and the second connecting rod (512) are slidably connected. Both the first connecting rod (511) and the second connecting rod (512) are provided with a linkage (519). The linkage (519) is provided with a sliding plate (5191). The sliding plate (5191) is fixedly connected to the outer end of the toothed plate (514) on the corresponding side.

2. The transmission-type high-precision flip-chip bonding device as described in claim 1, characterized in that: The worktable (100) is provided with a placement stage (200) for placing substrates and chips. Above the placement stage (200) is a negative pressure adsorption component (300) for flip-chip adsorption. On the left side of the placement stage (200) is a bidirectional micro-positioning system (400) for high-precision positioning of substrates and chips. The coating component (500) is located to the right of the bidirectional micro-positioning system (400).

3. The transmission-type high-precision flip-chip bonding device as described in claim 1, characterized in that: The mounting plate (501) has a U-shaped mounting groove (5011) on the outer edge of its bottom surface. Several containers (502) are arranged in four groups in a regular manner within the four sides of the mounting groove (5011). A protrusion (5021) is fixed in the middle of the top surface of the container (502). A magnetic block (5022) is embedded in the middle of the top surface of the protrusion (5021). A sliding rod (5012) is fixed in the four sides of the mounting groove (5011). The sliding rod (5012) passes through the protrusion (5021) in the same side, and the protrusion (5021) is slidably connected to the corresponding sliding rod (5012). Several regularly distributed magnets are embedded in the top surface of the four sides of the mounting groove (5011).

4. The transmission-type high-precision flip-chip bonding device as described in claim 1, characterized in that: The inner wall size of the container (502) is adapted to the upper half size of the piston (503). The bottom end of the push rod (504) is inserted into the corresponding piston (503) and the two are slidably connected. A first spring (506) is provided between the piston (503) and the bottom end of the push rod (504).

5. The transmission-type high-precision flip-chip bonding device as described in claim 1, characterized in that: A fixing rod (513) is fixed on the top surface of the container (502). A ratchet (516) is rotatably connected to the left and right sides of the bottom end of the fixing rod (513). The outer ring surface of the ratchet (516) is provided with teeth (5161). The teeth (5161) mesh with the corresponding toothed plate (514). A rotating wheel (517) is provided inside the ratchet (516). The inner side of the rotating wheel (517) is rotatably connected to the corresponding side end face of the bottom end of the fixing rod (513). The outer side of the rotating wheel (517) is coaxially fixedly connected to the corresponding rotating rod (515).

6. The transmission-type high-precision flip-chip bonding device as described in claim 5, characterized in that: The inner side of the rotating wheel (517) near the edge is provided with a shaft (5172), and a pawl (5171) is rotatably connected to the shaft (5172). The pawl (5171) is bent counterclockwise from the inner side to the outer side. The ratchet (516) is adapted to the pawl (5171). The shaft (5172) is sleeved with a second spring (5173) for driving the pawl (5171) to reset. The inner side of the rotating wheel (517) located on the outer convex side of the pawl (5171) is fixed with a stop bar (5174) to restrict the clockwise rotation of the pawl (5171).

7. The transmission-type high-precision flip-chip bonding device as described in claim 6, characterized in that: The inner wall of the container (502) is symmetrically fixed with limiting rods (518) at the corresponding position of the inlet of the discharge pipe (505). The inner end of the plug (5151) is symmetrically fixed with flanges. The inner end of the limiting rod (518) passes through the flange on the corresponding plug (5151) and the two are slidably connected. The rod wall portion of the limiting rod (518) between the flange and the inner wall of the container (502) is fitted with a third spring (5181).

8. The transmission-type high-precision flip-chip bonding device as described in claim 1, characterized in that: The linkage (519) consists of two rings and several crossbars fixedly disposed between the two rings. The slide plate (5191) is disposed between the two rings of the linkage (519). The crossbars pass through the corresponding slide plate (5191) and the two are slidably connected.

9. The transmission-type high-precision flip-chip bonding device as described in claim 8, characterized in that: The right end of the first connecting rod (511) is located inside the second connecting rod (512). The right end of the first connecting rod (511) is fixedly connected to the left end of the linkage member (519) inside the second connecting rod (512). A connecting rod (5121) is coaxially fixed inside the second connecting rod (512). The left end of the connecting rod (5121) is fixedly connected to the right end of the linkage member (519) inside the first connecting rod (511).

10. The transmission-type high-precision flip-chip bonding device as described in claim 9, characterized in that: The size of the slide plate (5191) in the first link (511) is adapted to the inner wall size of the first link (511), and the size of the slide plate (5191) in the second link (512) is adapted to the inner wall size of the second link (512).

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