Automatic feeding, discharging, cleaning and spin-drying equipment for silicon wafer polishing machine

Abstract

The invention relates to the technical field of silicon wafer precision mechanical design and manufacturing, and discloses automatic feeding, discharging, cleaning and spin-drying equipment for a silicon wafer polishing machine. The automatic feeding, discharging, cleaning and spin-drying equipment for the silicon wafer polishing machine is composed of multiple sets of units, integrates a wafer loading port, a special clean robot, a visual positioning system and the like, can achieve the functions of high-precision automatic taking, placing, overturning and the like, and is high in automation degree by highly integrating the links of grinding and polishing, cleaning, spin-drying, dry-state discharging and the like into a unified rack. The silicon wafers automatically flow in the system in the whole process, a complete closed loop is formed from dry-state feeding to dry-state discharging, the process period is shortened, and transfer pollution and damage risks are eliminated. Full-automatic feeding and discharging are achieved, seamless connection with polishing equipment is achieved, the utilization rate of the polishing equipment is guaranteed to the maximum extent, and therefore the productivity is improved, and a great breakthrough is made for improving the overall productivity of silicon wafer manufacturing factories without automation planning.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer precision mechanical design and manufacturing, and specifically relates to an automatic feeding and discharging cleaning and spin-drying device for a silicon wafer polishing machine. BACKGROUND

[0002] In the field of modern precision manufacturing, a double-sided polishing machine, as an advanced device capable of simultaneously polishing the front and back surfaces of a workpiece with high precision, has become an indispensable key equipment in the semiconductor, optical, electronic, automobile and other industries. With the rapid development of 5G communication, new energy vehicles and consumer electronics, the performance and efficiency of the double-sided polishing machine directly affect the quality and production cost of downstream products.

[0003] The traditional feeding and discharging process of the double-sided polishing machine mainly relies on manual operation or simple mechanical devices, which has obvious limitations such as low efficiency of manual feeding and discharging, influence of manual operation on product quality, safety risks of manual picking and placing, dependence on experience for process parameters, and low automation level of the equipment.

[0004] During the double-sided polishing process, when the workers cannot timely feed and discharge the equipment, the polishing equipment will be waiting, which seriously affects the equipment productivity. Workers directly contact the silicon wafer and other precision workpieces with their hands, which easily causes pollution to the surface of the workpiece, affects the product quality, and the tiny pollution caused by manual contact may lead to a decrease in product quality. When workers pick and place the workpieces, there are risks such as workpiece falling. For example, during the process of picking up the silicon wafer after polishing and transferring it to the opening material frame in the water tank with a suction ball tool, there is a risk of the silicon wafer falling due to the small suction force, which may cause damage to the workpiece and economic loss. Especially for ultra-thin and fragile workpieces, the safety risk of manual operation is higher. The process parameter setting of the traditional equipment often depends on the experience of the operator, lacks scientific basis and data support, and leads to large fluctuations in the quality of different batches of products. This experience-dependent operation mode also increases the dependence of enterprises on skilled workers, limiting the improvement of production efficiency. The existing low automation level can only be applied to single requirement machining, and the polishing precision cannot be accurately controlled according to the actual situation during machining.

[0005] The application uses robots, mechanical hands, positioning platforms, vision systems, vision positioning, and other systems to realize full-process automation operation from raw materials to finished products, reduce manual intervention, and improve production efficiency and product quality. The silicon wafer dry-in dry-out grinding and polishing automation system highly integrates grinding and polishing, cleaning, spin coating and drying, and dry-state discharging, realizes a complete closed loop from dry-state feeding to dry-state discharging of the silicon wafer, saves labor, and greatly improves the production capacity of the polishing machine within a single working day.

[0006] The automatic feeding and discharging cleaning and spin-drying equipment of the silicon wafer polishing machine disassembles manual work actions, uses multiple combined robots and mechanical hands to solve work requirements, and combines design of a feeding and discharging robot unit, a positioning detection robot unit, an automatic cleaning water tank device, a transfer robot unit, a wafer discharging robot unit, a wafer cleaning unit, a wafer spin-drying unit, and the like, so as to ensure full-process automatic operation precision, use a visual positioning system, automatically detect fragments before discharging, and automatically identify broken pieces caused by the polishing machine itself, so as to realize a silicon wafer dry-in and dry-out grinding and polishing automatic system. SUMMARY

[0007] The present application aims at: in order to solve the above-mentioned problems, provide a kind of automatic feeding and discharging cleaning and spin-drying equipment for silicon wafer polishing machine.

[0008] The technical scheme adopted by the present application is as follows: an automatic feeding and discharging cleaning and spin-drying equipment for silicon wafer polishing machine mainly includes a feeding and discharging robot unit, a positioning detection robot unit, an automatic cleaning water tank device, a transfer robot unit, a positioning platform, a wafer discharging robot unit, a wafer cleaning unit, a wafer spin-drying unit, a wafer feeding and discharging bearing platform cassette and a visual positioning monitoring system, etc., the wafer feeding and discharging bearing platform cassette is used to connect wafer OHT, which is the feeding station of the entire automatic equipment, and the wafer discharging bearing platform cassette is used to connect wafer OHT, which is the feeding station of the entire automatic equipment.

[0009] By adopting the above technical scheme, by Figures 1-10The shown eleven institutions constitute, the specific work flow is divided into the upper piece flow, the loading positioning detection flow, the unloading flow, the cleaning spin-drying and the lower piece flow. The upper piece flow: the upper and lower loading robot unit uses the clamp to take out the silicon wafer from the silicon wafer upper piece carrying platform cassette and places it on the positioning platform; when three pieces are full, the transfer robot unit starts to act, uses three sets of clamps to place the three pieces on the positioning platform into the storage area of the positioning platform, and after five times of such reciprocation, the storage area of the positioning platform is full. The loading positioning detection flow: the upper and lower loading robot unit uses the vacuum chuck clamp to suck three pieces from the positioning platform and places them into the polishing machine gear slot, the polishing machine starts to rotate once, the positioning detection robot unit uses the inductive pen and fixed pressing pin to press the silicon wafer, the visual positioning detection system takes a photo of the polishing machine gear slot to position and give the robot positioning in the upper and lower loading robot unit and the positioning detection robot unit; after three pieces are sucked away, the transfer robot clamps three pieces from the storage area of the positioning platform and places them into the silicon wafer waiting area of the positioning platform, and after five times of such reciprocation, the polishing machine gear slot is full of fifteen pieces. The unloading flow: after the polishing is completed, the upper cover is rotated to open, the upper and lower loading robot unit uses the vacuum chuck clamp to suck three pieces from the polishing machine gear slot and places them into the automatic cleaning sink device, and after five times of such reciprocation, the silicon wafer of the polishing machine is taken out by the upper and lower loading robot unit and placed into the automatic cleaning sink device. The cleaning spin-drying and the lower piece flow: the positioning detection robot unit uses the clamp to take one piece from the automatic cleaning sink device and places it into the silicon wafer cleaning unit, after cleaning, the positioning detection robot unit uses the clamp to take it out from the silicon wafer cleaning unit and places it into the silicon wafer spin-drying unit, and after spin-drying, the lower piece robot unit uses the clamp jaw to take the silicon wafer from the silicon wafer spin-drying unit and places it into the silicon wafer lower piece carrying platform cassette.

[0010] In a preferred embodiment, the positioning platform comprises a platform bottom plate, vertical plates are fixedly installed on the upper two side surfaces of the platform bottom plate, a platform base plate is arranged on the upper surface of the vertical plate, a partition plate is installed in the middle of the platform base plate and the platform bottom plate, a sandwich layer plate is arranged on the inner surfaces of the vertical plate and the partition plate, and a stand column and a regular cylinder are fixedly installed on the upper surface of the platform base plate.

[0011] By adopting the above technical scheme, the positioning platform is arranged, and the main function is to store and wait for the silicon wafer, and to regularize the silicon wafer in the waiting area. The vertical plate and the partition plate are installed in the middle of the platform base plate and the platform bottom plate through fasteners, the sandwich layer plate is sequentially assembled on the vertical plate and the partition plate, and the stand column and the regular cylinder are fastened on the platform base plate.

[0012] In a preferred embodiment, the transfer robot unit comprises a two-axis robot, the two-axis robot is installed on the equipment base, a clamp fixing seat is fixedly installed on the upper flange surface of the two-axis robot, a lower clamp jaw is installed on the connection hole position surface of the clamp fixing seat, a clamp cylinder is arranged on the butt joint surface of the lower clamp jaw, and an upper clamp jaw is installed on the upper surface of the clamp cylinder.

[0013] By adopting the technical scheme, the transfer robot unit is mainly used for placing the silicon wafer in the storage area from the positioning platform and placing the silicon wafer in the storage area into the taking area. The two-axis robot is installed on the equipment base, the clamp fixing seat is installed on the fixing flange of the two-axis robot, the lower clamp jaw is installed on the connecting hole of the clamp fixing seat, and the clamp cylinder is installed on the connecting surface of the lower clamp jaw. The upper clamp jaw is installed on the clamp cylinder.

[0014] In a preferred embodiment, the feeding and discharging robot unit comprises a feeding and discharging six-axis robot, which is installed on an equipment base. A cylindrical connecting seat is installed on the T-axis flange of the right end surface of the feeding and discharging six-axis robot. A four-jaw connecting plate is fixedly connected to the left end surface of the cylindrical connecting seat. A three-jaw clamping plate is installed on the upper surface of the four-jaw connecting plate. A first lower clamp jaw is installed on the upper surface of the fourth jaw of the four-jaw connecting plate. A vacuum chuck is fixedly installed in the reserved mounting hole of the three-jaw clamping plate. A first clamp cylinder is arranged on the connecting surface of the first lower clamp jaw. A first upper clamp jaw is installed on the upper surface of the first clamp cylinder.

[0015] By adopting the technical scheme, the silicon wafer in the silicon wafer feeding and carrying table cassette is taken out and placed on the positioning platform. The silicon wafer in the taking area of the positioning platform before polishing is placed into the gear groove of the polishing machine, and the silicon wafer in the gear groove after polishing is taken out and placed into the automatic cleaning water tank device. The feeding and discharging six-axis robot is installed on the equipment base. The left end surface of the cylindrical connecting seat is installed on the T-axis flange of the feeding and discharging six-axis robot, and the right end surface is fixedly connected to the four-jaw connecting plate. Three three-jaw clamping plates are installed on the three jaws of the four-jaw connecting plate. A first lower clamp jaw is installed on the fourth jaw of the four-jaw connecting plate. A vacuum chuck is fixedly installed in the reserved mounting hole of the three-jaw clamping plate. A first clamp cylinder is installed on the connecting surface of the first lower clamp jaw. A first upper clamp jaw is installed on the first clamp cylinder.

[0016] In a preferred embodiment, the automatic cleaning water tank device comprises a box horizontal plate and a box vertical plate, which are fixedly installed to form the automatic cleaning water tank device. A box interlayer plate is arranged on the inner surface of the box horizontal plate and the box vertical plate.

[0017] By adopting the technical scheme, the automatic cleaning water tank device is mainly used for soaking and cleaning the polished silicon wafer to avoid impurity pollution. The box of the automatic cleaning water tank device is assembled by the box horizontal plate and the box vertical plate. The box interlayer plate is assembled in the box.

[0018] In a preferred embodiment, the positioning monitoring robot unit comprises a positioning monitoring six-axis robot, which is installed on the equipment base, a cylindrical connector is installed on the circular end face of the T-axis flange of the positioning monitoring six-axis robot, a three-jaw adapter seat is connected to the right side end face of the cylindrical connector, a second lower clamp jaw is connected to the left side end face of the cylindrical connector, an inductive pen and a fixed pressing pin are respectively installed on the upper surface of the three-jaw adapter seat, a second clamp cylinder is installed on the abutting surface of the second lower clamp jaw, and a second upper clamp jaw is arranged on the upper surface of the second clamp cylinder.

[0019] By adopting the above technical scheme, the positioning detection robot unit is provided, which mainly functions to press and detect the silicon wafer that has been placed in the gear groove of the polishing machine, so as to ensure that the silicon wafer is accurately placed in the groove. The positioning detection six-axis robot is installed on the equipment base. The circular end face of the cylindrical connector is installed on the T-axis flange of the positioning detection six-axis robot, the right side end face is connected to the three-jaw adapter seat, and the left side end face is connected to the second lower clamp jaw. The fixed pressing pin and the inductive pen are respectively installed on the three-jaw adapter seat. The second clamp cylinder is installed on the abutting surface of the second lower clamp jaw, and the second upper clamp jaw is installed on the second clamp cylinder.

[0020] In a preferred embodiment, the silicon wafer cleaning unit comprises a cleaning unit base, which is installed on the equipment base, a horizontal movement servo motor is installed on the upper surface of the cleaning unit base, a brush moving seat is movably connected to the inner surface of the horizontal movement servo motor, a brush is arranged in the mounting hole of the brush moving seat, water pipes are installed on the two end connecting holes of the brush, a cleaning rotary servo motor is arranged on the side surface of the brush moving seat, a cylinder mounting seat is installed on the upper surface of the cleaning unit base, a vertical movement cylinder is arranged on the upper surface of the cylinder mounting seat, a horizontal movement cylinder is arranged on the upper slide table surface of the vertical movement cylinder, an upper pressing roller is installed on the end face of the horizontal movement cylinder, and a bamboo joint pipe is arranged on the surface of the shell of the silicon wafer cleaning unit.

[0021] By adopting the technical scheme, the silicon wafer cleaning unit is provided, and the main function is to clean the polished silicon wafer by a brush, and the brush is in controllable contact with the surface of the silicon wafer, and the chemical auxiliary and flushing effect of the cleaning liquid are combined to realize efficient removal of pollutants. The cleaning unit base is installed on the equipment base, the horizontal moving servo motor is installed on the cleaning unit base, the water pipe is assembled on the two end connecting holes of the brush, the brush is installed in the mounting hole of the brush moving seat, the brush moving seat moves back and forth under the driving of the horizontal moving servo motor, the silicon wafer is pressed from the end face, the cleaning rotating servo motor is installed on the side surface of the brush moving seat, the brush is rotated to clean the silicon wafer; the cylinder mounting seat is installed on the cleaning unit base, the vertical moving cylinder is installed on the cylinder mounting seat, the horizontal moving cylinder is installed on the slide table of the numerical moving cylinder, the upper pressing roller is installed on the end surface of the horizontal moving cylinder, and the silicon wafer is pressed from the upper surface during cleaning to ensure the stability of the silicon wafer during rotation; the bamboo joint pipe is installed on the shell of the silicon wafer cleaning unit to flush the silicon wafer during cleaning.

[0022] In a preferred embodiment, the silicon wafer drying unit includes a drying unit base, the drying unit base is installed on the equipment base, the upper surface of the drying unit base is provided with a slide rail, the upper surface of the slide rail is installed with an L-shaped moving base, the upper surface of the drying unit base is installed with an L-shaped fixed base, a guide bearing is arranged in the mounting hole of the L-shaped fixed base, a guide rod is connected to the rear surface of the L-shaped moving base, the disc is fixedly connected with the guide rod through the L-shaped moving base, a push cylinder is connected to the front rod end floating joint surface of the L-shaped moving base, a rotating disc is installed on the rear surface of the disc, small clamping jaws are arranged on the edge surface of the rotating disc, a drying rotating servo motor is arranged on the upper surface of the L-shaped fixed base, and a shaft coupling is connected to the rear surface of the drying rotating servo motor.

[0023] By adopting the technical scheme, the silicon wafer drying unit is provided, and the main function is to dry the silicon wafer after brush cleaning, and the centrifugal acceleration generated by rotation is used to overcome the adhesion force between the liquid and the surface of the silicon wafer, so that the liquid is quickly stripped and removed. The drying unit base is installed on the equipment base, the L-shaped moving base is installed on the slide rail, the slide rail is installed on the drying unit reference, the L-shaped fixed base is installed on the drying unit reference, the guide bearing is installed in the mounting hole of the L-shaped fixed base, the disc is fixedly connected with the L-shaped moving base through the guide rod, and the push cylinder moves the L-shaped moving base back and forth through the rod end floating joint, so that the disc moves back and forth. The opening and closing of the small clamping jaws on the rotating disc are driven by the back and forth movement of the disc, so that the silicon wafer is clamped and released. The small clamping jaws are installed on the edge of the rotating disc; the drying rotating servo motor is installed on the L-shaped fixed base, the rotating shaft of the rotating disc is installed on the bearing of the L-shaped fixed base, and the drying rotating servo motor is connected with the rotating shaft of the rotating disc through the shaft coupling, so that the rotating disc rotates.

[0024] In a preferred embodiment, the wafer unloading robot unit comprises a wafer unloading six-axis robot, which is mounted on the equipment base, and a cylindrical coupling is mounted on the surface of the left end face T-axis flange of the wafer unloading six-axis robot, a third lower clamp jaw is connected to the left end face of the cylindrical coupling, a third clamp cylinder is arranged on the butt joint surface of the third lower clamp jaw, and a third upper clamp jaw is mounted on the upper surface of the third lower clamp jaw.

[0025] By adopting the above technical scheme, the wafer unloading robot unit is provided, and the main function is to take out the dried silicon wafer and place it into the silicon wafer unloading carrier cassette. The wafer unloading six-axis robot is mounted on the equipment base. The left end face of the cylindrical coupling is mounted on the T-axis flange of the wafer unloading six-axis robot, the right end face is fixedly connected with the third lower clamp jaw, the third clamp cylinder is mounted on the butt joint surface of the third lower clamp jaw, and the third upper clamp jaw is mounted on the third lower clamp jaw.

[0026] In a preferred embodiment, the visual positioning monitoring system comprises a first camera, an intermediate camera, a cylindrical light source, a second camera and a third camera, which are sequentially mounted on the designated position of the upper beam of the equipment.

[0027] By adopting the above technical scheme, the visual positioning monitoring system is provided, and the main function is to ensure that the silicon wafer accurately corresponds to the positioning platform and the gear groove of the polishing machine, so as to facilitate the accurate grabbing and placing of the silicon wafer by the robot, including photographing the gear groove of the polishing machine to satisfy the positioning guidance of the wafer loading and unloading six-axis robot, photographing the gear groove of the polishing machine to satisfy the positioning guidance of the positioning detection six-axis robot, and satisfying the wafer unloading six-axis robot before unloading. The first camera, the intermediate camera, the cylindrical light source, the second camera and the third camera are sequentially mounted on the designated position of the upper beam of the equipment.

[0028] As described above, due to the adoption of the above technical scheme, the beneficial effects of the present application are:

[0029] 1. The equipment can realize full-automatic loading and unloading, seamlessly connects with the polishing equipment, maximally guarantees the utilization rate of the polishing and grinding equipment, and thus improves the production capacity.

[0030] 2. The equipment is fully operated without human, avoids the pollution caused by manual contact with the workpiece, reduces the pollution source, and helps to improve the product quality.

[0031] 3. The equipment avoids the loss caused by the wrong direction of the workpiece placed by manual loading and the workpiece falling during the manual taking and placing process, improves the safety and stability of the production process.

[0032] 4. The device realizes accurate identification of the loading and unloading position, accurate identification of the positioning detection position through a visual positioning system, and realizes automatic unloading of the fragment identification through a visual fragment inspection.

[0033] 5. The device realizes the dry-in and dry-out function of the silicon wafer in the polishing process, highly integrates the grinding and polishing, cleaning, spin-drying, dry-state feeding and discharging and other links, and realizes the complete closed loop of the process from the dry-state feeding to the dry-state discharging of the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 It is a schematic diagram of the overall structure of the application.

[0035] Figure 2 It is a schematic diagram of the positioning platform structure in the application.

[0036] Figure 3 It is a schematic diagram of the transfer robot unit structure in the application.

[0037] Figure 4 It is a schematic diagram of the loading and unloading robot unit structure in the application.

[0038] Figure 5 It is a schematic diagram of the automatic cleaning water tank device structure in the application.

[0039] Figure 6 It is a schematic diagram of the positioning detection robot unit structure in the application.

[0040] Figure 7 It is a schematic diagram of the silicon wafer cleaning unit structure in the application.

[0041] Figure 8 It is a schematic diagram of the silicon wafer spin-drying unit structure in the application.

[0042] Figure 9 It is a schematic diagram of the wafer unloading robot unit structure in the application.

[0043] Figure 10 It is a schematic diagram of the visual positioning detection system structure in the application.

[0044] In the figure, a mark: 1, positioning platform; 2, transfer robot unit; 3, loading and unloading robot unit; 4, automatic cleaning water tank device; 5, positioning detection robot unit; 6, silicon wafer cleaning unit; 7, silicon wafer spin-drying unit; 8, wafer unloading robot unit; 9, visual positioning detection system; 10, silicon wafer loading bearing table cassette; 11, silicon wafer unloading bearing table cassette; 12, silicon wafer polishing machine.

[0045] Figure 2 The middle mark: 11, platform base plate; 12, vertical plate; 13, platform bottom plate; 14, stand column; 15, sandwich layer plate; 16, regular cylinder; 17, partition plate.

[0046] Figure 3 Marked in the middle: 21, two-axis robot; 22, clamp fixed seat; 23, lower clamp jaw; 24, upper clamp jaw; 25, clamp cylinder.

[0047] Figure 4 Marked in the middle: 31, feeding and discharging six-axis robot; 32, cylindrical connecting seat; 33, three-jaw clamping plate; 34, vacuum chuck; 35, first lower clamp jaw; 36, first clamp cylinder; 37, first upper clamp jaw; 38, four-jaw connecting plate.

[0048] Figure 5 Marked in the middle: 41, box transverse plate; 42, box vertical plate; 43, box interlayer plate.

[0049] Figure 6 Marked in the middle: 51, positioning detection six-axis robot; 52, cylindrical connecting piece; 53, three-jaw connecting seat; 54, induction pen; 55, fixed pressing pin; 56, second lower clamp jaw; 57, second clamp cylinder; 58, second upper clamp jaw.

[0050] Figure 7 Marked in the middle: 61, cleaning unit base; 62, horizontal movement servo motor; 63, brush moving seat; 64, brush; 65, water pipe; 66, bamboo joint pipe; 67, horizontal movement cylinder; 68, cylinder mounting seat; 69, upper pressing roller; 610, cleaning rotary servo motor; 611, vertical movement cylinder.

[0051] Figure 8 Marked in the middle: 71, spin-drying unit base; 72, pushing cylinder; 73, spin-drying rotary servo motor; 74, L-shaped moving base; 75, guide rod; 76, L-shaped fixed base; 77, rotating disc; 78, small clamp jaw; 79, disc; 710, guide bearing; 711, slide rail; 712, shaft coupling.

[0052] Figure 9 Marked in the middle: 81, lower piece six-axis robot; 82, cylindrical shaft coupling; 83, third lower clamp jaw; 84, third clamp cylinder; 85, third upper clamp jaw.

[0053] Figure 10 Marked in the middle: 91, first camera; 92, intermediate camera; 93, cylindrical light source; 94, second camera; 95, third camera. DETAILED DESCRIPTION

[0054] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0055] Embodiment

[0056] Referring to Figures 1-10 An automatic feeding and discharging cleaning and spin-drying device for a silicon wafer polishing machine mainly comprises an up-and-down feeding robot unit 3, a positioning and monitoring robot unit 5, an automatic cleaning water tank device 4, a transfer robot unit 2, a positioning platform 1, a wafer discharging robot unit 8, a silicon wafer cleaning unit 6, a silicon wafer spin-drying unit 7, a silicon wafer feeding bearing table cassette 10, a silicon wafer discharging bearing table cassette 11 and a visual positioning and monitoring system 9, etc. The silicon wafer feeding bearing table cassette 10 is used for docking the wafer OHT and is the feeding station of the entire automatic device, and the silicon wafer discharging bearing table cassette 11 is used for docking the wafer OHT and is the feeding station of the entire automatic device. The device is composed of a total of 11 mechanisms as shown in the figure, and the specific working process is divided into a wafer feeding process, a feeding positioning and detection process, a discharging process, a cleaning and spin-drying wafer discharging process. Figures 1-10

[0057] Wafer feeding process: The up-and-down feeding robot unit 3 uses a clamp to take out the silicon wafers from the silicon wafer feeding bearing table cassette and places them on the positioning platform 1; when three wafers are placed, the transfer robot unit 2 starts to act, and uses three sets of clamps to place the three wafers on the positioning platform 1 into the storage area of the positioning platform 1; after five times of reciprocation, the storage area of the positioning platform 1 is full.

[0058] Feeding positioning and detection process: The up-and-down feeding robot unit 3 uses a vacuum suction disc clamp to take out three wafers from the positioning platform 1 and places them into the gear groove of the polishing machine 12; the polishing machine 12 starts to rotate once; the positioning and detection robot unit 5 uses the inductive pen 54 and the fixed pressing pin 55 to press the wafers; the visual positioning and monitoring system 9 takes a photo of the gear groove in the polishing machine 12 to position and detect the robot in the up-and-down feeding robot unit 3 and the positioning and detection robot unit 5; after the three wafers are taken out, the transfer robot 2 clamps three wafers from the storage area of the positioning platform 1 and places them into the silicon wafer waiting area of the positioning platform 1; after five times of reciprocation, the gear groove of the polishing machine 12 is full of fifteen wafers.

[0059] Discharging process: After the polishing machine 12 finishes polishing, the up-and-down feeding robot unit 3 uses a vacuum suction disc clamp to take out three wafers from the gear groove of the polishing machine 12 and places them into the automatic cleaning water tank device; after five times of reciprocation, the wafers in the polishing machine 12 are taken out by the up-and-down feeding robot unit 3 and placed into the automatic cleaning water tank device 4. ​

[0060] The cleaning and drying wafer flow process: the positioning detection robot unit 5 takes a wafer from the automatic cleaning water tank device 4 with a clamp and puts it into the wafer cleaning unit 6, after cleaning, the positioning detection robot unit 5 takes it out of the wafer cleaning unit 6 with a clamp and puts it into the wafer drying unit 7, after drying, the wafer robot unit 8 takes the wafer out of the wafer drying unit 7 with a clamp jaw and puts it into the wafer wafer loading platform cassette.

[0061] Referring to Figure 2 , the positioning platform 1 comprises a platform bottom plate 13, the upper side surfaces of the platform bottom plate 13 are fixedly provided with vertical plates 12, the upper surfaces of the vertical plates 12 are provided with platform base plates 11, the inner middle parts of the platform base plates 11 and the platform bottom plate 13 are provided with partition plates 17, the inner surfaces of the vertical plates 12 and the partition plates 17 are provided with sandwiched layer plates 15, and the upper surfaces of the platform base plates 11 are fixedly provided with vertical columns 14 and regular cylinders 16. The positioning platform 1 is mainly used for storing and taking wafers, and regularizing the wafers in the taking area. The vertical plates 12 and the partition plates 17 are installed in the middle of the platform base plates 11 and the platform bottom plate 13 through fasteners, the sandwiched layer plates 15 are sequentially assembled in the vertical plates 12 and the partition plates 17, and the vertical columns 14 and the regular cylinders 16 are fastened to the platform base plates 11.

[0062] Referring to Figure 3 , the transfer robot unit 2 comprises a two-axis robot 21, which is installed on a device base, a clamp fixing seat 22 is fixedly installed on the upper flange surface of the two-axis robot 21, a lower clamp jaw 23 is installed on the connection hole surface of the clamp fixing seat 22, a clamp cylinder 25 is arranged on the butt joint surface of the lower clamp jaw 23, and an upper clamp jaw 24 is installed on the upper surface of the clamp cylinder 25. The main function of the transfer robot unit 2 is to put the wafers in the taking area of the positioning platform 1 into the storage area, and to put the wafers in the storage area into the taking area. The two-axis robot 21 is installed on the device base, the clamp fixing seat 22 is installed on the fixed flange of the two-axis robot 21, the lower clamp jaw 23 is installed on the connection hole of the clamp fixing seat 22, the clamp cylinder 25 is installed on the butt joint surface of the lower clamp jaw 23, and the upper clamp jaw 24 is installed on the clamp cylinder 25.

[0063] Referring to Figure 4The up-and-down feeding robot unit 3 comprises an up-and-down feeding six-axis robot 31, the up-and-down feeding six-axis robot 31 is installed on the equipment base, a cylindrical connecting seat 32 is installed on the T-axis flange of the right end surface of the up-and-down feeding six-axis robot 31, a four-jaw connecting plate 38 is fixedly connected to the left end surface of the cylindrical connecting seat 32, a three-jaw clamping plate 33 is installed on the upper surface of the four-jaw connecting plate 38, a first lower clamping jaw 35 is installed on the upper surface of the fourth jaw of the four-jaw connecting plate 38, a vacuum chuck 34 is fixedly installed in the mounting hole reserved in the three-jaw clamping plate, a first clamping cylinder 36 is arranged on the abutting surface of the first lower clamping jaw 35, and a first upper clamping jaw 37 is installed on the upper surface of the first clamping cylinder 36. The silicon wafer in the silicon wafer upper piece carrying table card box 10 is taken out and placed on the positioning platform 1. The silicon wafer in the positioning platform 1 to be taken in the polishing machine 12 is placed in the gear groove, and the silicon wafer in the gear groove after polishing is taken out and placed in the automatic cleaning sink device 4. The up-and-down feeding six-axis robot 31 is installed on the equipment base; the left end surface of the cylindrical connecting seat 32 is installed on the T-axis flange of the up-and-down feeding six-axis robot 31, and the right end surface is fixedly connected with the four-jaw connecting plate 38; three three-jaw clamping plates 33 are installed on three jaws of the four-jaw connecting plate 38, a first lower clamping jaw 35 is installed on the fourth jaw of the four-jaw connecting plate 38, a vacuum chuck 34 is fixedly installed in the mounting hole reserved in the three-jaw clamping plate, a first clamping cylinder 36 is installed on the abutting surface of the first lower clamping jaw 35, and a first upper clamping jaw 37 is installed on the first clamping cylinder 36.

[0064] With reference to Figure 5 The automatic cleaning sink device 4 comprises a box body horizontal plate 41 and a box body vertical plate 42, the box body horizontal plate 41 and the box body vertical plate 42 are fixedly installed to form the automatic cleaning sink device 4, and a box body interlayer plate 43 is arranged on the inner surface of the box body horizontal plate 41 and the box body vertical plate 42. The main function of the automatic cleaning sink device is to soak and clean the polished silicon wafer, so as to avoid impurity pollution. The box body of the automatic cleaning sink device 4 is assembled by the box body horizontal plate 41 and the box body vertical plate 42, and the box body interlayer plate 43 is assembled in the box body.

[0065] With reference to Figure 6The positioning monitoring robot unit 5 comprises a positioning monitoring six-axis robot 51, which is installed on the equipment base. A circular end face on a T-axis flange of the positioning monitoring six-axis robot 51 is provided with a cylindrical connecting piece 52. A right side end face of the cylindrical connecting piece 52 is connected with a three-jaw adapter seat 53. A left side end face of the cylindrical connecting piece 52 is connected with a second lower clamp jaw 56. An upper surface of the three-jaw adapter seat 53 is respectively provided with an inductive pen 54 and a fixed pressing pin 55. An abutting surface of the second lower clamp jaw 56 is provided with a second clamp cylinder 57. An upper surface of the second clamp cylinder 57 is provided with a second upper clamp jaw 58. The positioning monitoring robot unit 5 is mainly used for pressing detection of a silicon wafer that has been placed in a gear groove of the polishing machine 12, so as to ensure that the silicon wafer is accurately placed in the groove. The positioning monitoring six-axis robot 51 is installed on the equipment base. The circular end face of the cylindrical connecting piece 52 is installed on the T-axis flange of the positioning monitoring six-axis robot 51. The right side end face is connected with the three-jaw adapter seat 53. The left side end face is connected with the second lower clamp jaw 56. The fixed pressing pin 55 and the inductive pen 54 are respectively installed on the three-jaw adapter seat 53. The second clamp cylinder 57 is installed on the abutting surface of the second lower clamp jaw 56. The second upper clamp jaw 58 is installed on the second clamp cylinder 57.

[0066] With reference to Figure 7The silicon wafer cleaning unit 6 comprises a cleaning unit base 61 mounted on the equipment base, a horizontal movement servo motor 62 mounted on the upper surface of the cleaning unit base 61, a brush moving seat 63 movably connected to the inner surface of the horizontal movement servo motor 62, a brush 64 arranged in the mounting hole of the brush moving seat 63, a water pipe 65 mounted on the two end connecting holes of the brush 64, a cleaning rotary servo motor 610 arranged on the side surface of the brush moving seat 63, a cylinder mounting seat 68 mounted on the upper surface of the cleaning unit base 61, a vertical movement cylinder 611 arranged on the upper surface of the cylinder mounting seat 68, a horizontal movement cylinder 67 arranged on the upper slide surface of the vertical movement cylinder 611, an upper pressing roller 69 mounted on the end surface of the horizontal movement cylinder 67, and a bamboo joint pipe 66 arranged on the shell surface of the silicon wafer cleaning unit 6. The silicon wafer cleaning unit 6 is mainly used for brush cleaning of the polished silicon wafer, realizes efficient removal of pollutants through controllable contact between the brush and the surface of the silicon wafer, and combines chemical auxiliary and flushing effects of the cleaning liquid. The cleaning unit base 61 is mounted on the equipment base, the horizontal movement servo motor 62 is mounted on the cleaning unit base 61, the water pipe 65 is assembled on the two end connecting holes of the brush 64, the brush 64 is mounted in the mounting hole of the brush moving seat 63, the brush moving seat 63 moves back and forth under the driving of the horizontal movement servo motor 62, the silicon wafer is pressed from the end surface, the cleaning rotary servo motor 610 is mounted on the side surface of the brush moving seat 63, the brush is rotated, and the silicon wafer is brush cleaned; the cylinder mounting seat 68 is mounted on the cleaning unit base 61, the vertical movement cylinder 611 is mounted on the cylinder mounting seat 68, the horizontal movement cylinder 67 is mounted on the slide table of the vertical movement cylinder 611, the upper pressing roller 69 is mounted on the end surface of the horizontal movement cylinder 67, the silicon wafer is pressed from the upper surface during cleaning, and the stability of the silicon wafer during rotation is ensured; and the bamboo joint pipe 66 is mounted on the shell of the silicon wafer cleaning unit 6, and the silicon wafer is flushed during cleaning.

[0067] Referring to Figure 8, the silicon wafer spin-drying unit 7 comprises a spin-drying unit base 71 mounted on the equipment base, the upper surface of the spin-drying unit base 71 is provided with a sliding rail 711, the upper surface of the sliding rail 711 is mounted with an L-shaped moving base 74, the upper surface of the spin-drying unit base 71 is mounted with an L-shaped fixed base 76, a guide bearing 710 is arranged in the mounting hole of the L-shaped fixed base 76, the rear surface of the L-shaped moving base 74 is connected with a guide rod 75, a disc 79 is fixedly connected with the guide rod 75 through the L-shaped moving base 74, the front rod end floating joint surface of the L-shaped moving base 74 is connected with a push air cylinder 72, the rear surface of the disc 79 is mounted with a rotating disc 77, a small jaw 78 is arranged on the edge surface of the rotating disc 77, the upper surface of the L-shaped fixed base 76 is provided with a spin-drying rotating servo motor 73, the rear surface of the spin-drying rotating servo motor 73 is connected with a shaft coupling 712. Through the silicon wafer spin-drying unit 7 arranged, the main function is to spin-dry the silicon wafer after brush cleaning, using the centrifugal acceleration generated by rotation, overcoming the adhesion of liquid and the surface of the silicon wafer, realizing the rapid peeling and removal of liquid. The spin-drying unit base 71 is mounted on the equipment base, the L-shaped moving base is mounted on the sliding rail 711, the sliding rail 711 is mounted on the spin-drying unit reference, the L-shaped fixed base 76 is mounted on the spin-drying unit reference 71, the guide bearing 710 is mounted in the mounting hole of the L-shaped fixed base 76, the disc 79 is fixedly connected with the L-shaped moving base 74 through the guide rod 75, the push air cylinder 72 moves the L-shaped moving base 74 back and forth through the rod end floating joint, so as to realize the front and rear movement of the disc 79. The front and rear movement of the disc 79 drives the opening and closing of the small jaw 78 on the rotating disc 77, realizing the clamping and loosening of the silicon wafer. The small jaw 78 is installed on the edge of the rotating disc 77; the spin-drying rotating servo motor 73 is mounted on the L-shaped fixed base 76, the rotating shaft of the rotating disc 77 is mounted on the bearing of the L-shaped fixed base 76, the spin-drying rotating servo motor 73 is connected with the rotating shaft of the rotating disc 77 through the shaft coupling 712, so as to realize the rotation of the rotating disc 77.

[0068] Referring to Figure 9The lower sheet robot unit 8 comprises a lower sheet six-axis robot 81, the lower sheet six-axis robot 81 is installed on the equipment base, the surface of the left side end face T-axis flange of the lower sheet six-axis robot 81 is provided with a cylindrical coupling 82, the left side end face of the cylindrical coupling 82 is connected with a third lower clamp jaw 83, the butt joint surface of the third lower clamp jaw 83 is provided with a third clamp cylinder 84, and the upper surface of the third lower clamp jaw 83 is provided with a third upper clamp jaw 85. The lower sheet robot unit 8 is mainly used for taking out the dried silicon wafer and placing it into the silicon wafer lower sheet carrying table card cassette. The lower sheet six-axis robot 81 is installed on the equipment base; the left side end face of the cylindrical coupling 82 is installed on the T-axis flange of the lower sheet six-axis robot 81, the right side end face is fixedly connected with the third lower clamp jaw 83, the third clamp cylinder 84 is installed on the butt joint surface of the third lower clamp jaw 83, and the third upper clamp jaw 85 is installed on the third lower clamp jaw 83.

[0069] With reference to Figure 10 The visual positioning monitoring system 9 comprises a first camera 91, an intermediate camera 92, a cylindrical light source 93, a second camera 94 and a third camera 95, and the first camera 91, the intermediate camera 92, the cylindrical light source 93, the second camera 94 and the third camera 95 are sequentially installed on the upper beam of the equipment. The visual positioning monitoring system 9 is mainly used for ensuring that the silicon wafer is accurately positioned on the positioning platform 1 and the gear groove of the polishing machine 12, so that the robot can accurately grasp and place the silicon wafer, including photographing the gear groove of the polishing machine 12 to meet the positioning guidance of the upper and lower feeding six-axis robot 31, photographing the gear groove of the polishing machine 12 to meet the positioning guidance of the positioning detection six-axis robot 51, and meeting the fragment inspection before the lower feeding of the upper and lower feeding six-axis robot 31. The first camera 91, the intermediate camera 92, the cylindrical light source 93, the second camera 94 and the third camera 95 are sequentially installed on the upper beam of the equipment.

[0070] The implementation principle of the automatic upper and lower feeding, cleaning and drying equipment for the silicon wafer polishing machine is as follows: Figures 1-10The shown eleven institutions constitute, the specific work flow is divided into the upper piece flow, the loading positioning detection flow, the unloading flow, the cleaning spin-drying and the lower piece flow. The upper piece flow: the upper and lower loading robot unit 3 uses the clamp to take out the silicon piece from the silicon piece upper piece bearing table cassette and put it on the positioning platform 1; when three pieces are put in, the transfer robot unit 2 starts to act, uses three sets of clamps to put the three pieces on the positioning platform 1 into the storage area of the positioning platform 1, after five times of such reciprocating, the storage area of the positioning platform 1 is full. The loading positioning detection flow: the upper and lower loading robot unit 3 uses the vacuum chuck clamp to suck three pieces from the positioning platform 1 and put them into the polishing machine gear slot, the polishing machine 12 starts to rotate once, the positioning detection robot unit 5 uses the inductive pen 54 and the fixed pressing pin 55 to press the silicon piece, the visual positioning detection system 9 takes a photo of the gear slot in the polishing machine 12 to position, and the robot in the upper and lower loading robot unit 3 and the positioning detection robot unit 5 is positioned; after three pieces are sucked away, the transfer robot 2 clamps three pieces from the storage area of the positioning platform 1 and puts them into the silicon piece waiting area of the positioning platform 1, after five times of such reciprocating, the gear slot of the polishing machine 12 is full of fifteen pieces. The unloading flow: after the polishing of the polishing machine 12 is completed, the upper cover is opened by rotating, the upper and lower loading robot unit 3 uses the vacuum chuck clamp to suck three pieces from the gear slot of the polishing machine 12 and put them into the automatic cleaning water tank device, after five times of such reciprocating, the silicon pieces of the polishing machine 12 are taken out by the upper and lower loading robot unit 3 and put into the automatic cleaning water tank device 4. The cleaning spin-drying and the lower piece flow: the positioning detection robot unit 5 uses the clamp to take one piece from the automatic cleaning water tank device 4 and put it into the silicon piece cleaning unit 6, after cleaning, the positioning detection robot unit 5 uses the clamp to take it out from the silicon piece cleaning unit 6 and put it into the silicon piece spin-drying unit 7, after spin-drying, the lower piece robot unit 8 uses the jaw to take the silicon piece from the silicon piece spin-drying unit 7 and put it into the silicon piece lower piece bearing table cassette.

[0071] The above examples are only used to illustrate the technical solutions of the present application, but not limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An automatic feeding and discharging cleaning and drying device for a silicon wafer polishing machine, mainly comprising a feeding and discharging robot unit (3), a positioning monitoring robot unit (5), an automatic cleaning tank device (4), a transfer robot unit (2), a positioning platform (1), a wafer discharging robot unit (8), a wafer cleaning unit (6), a wafer drying unit (7), a wafer feeding bearing table cassette (10), a wafer discharging bearing table cassette (11), and a visual positioning monitoring system (9), etc. The wafer feeding bearing table cassette (10) is used for docking the wafer feeding OHT and is the feeding station of the entire automatic device, and the wafer discharging bearing table cassette (11) is used for docking the wafer discharging OHT and is the feeding station of the entire automatic device.

2. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The positioning platform (1) comprises a platform bottom plate (13), vertical plates (12) are fixedly installed on the upper surfaces of both sides of the platform bottom plate (13), a platform base plate (11) is arranged on the upper surface of the vertical plate (12), a partition plate (17) is installed in the middle of the platform base plate (11) and the platform bottom plate (13), a sandwiched layer plate (15) is arranged on the inner surfaces of the vertical plate (12) and the partition plate (17), and a stand column (14) and a regular cylinder (16) are fixedly installed on the upper surface of the platform base plate (11).

3. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The transfer robot unit (2) comprises a two-axis robot (21), the two-axis robot (21) is installed on a device base, a clamp fixing seat (22) is fixedly installed on the upper flange surface of the two-axis robot (21), a lower clamping jaw (23) is installed on the connecting hole surface of the clamp fixing seat (22), a clamp cylinder (25) is arranged on the butt joint surface of the lower clamping jaw (23), and an upper clamping jaw (24) is installed on the upper surface of the clamp cylinder (25).

4. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The feeding and discharging robot unit (3) comprises a feeding and discharging six-axis robot (31), the feeding and discharging six-axis robot (31) is installed on a device base, a cylindrical connecting seat (32) is installed on the T-axis flange of the right end surface of the feeding and discharging six-axis robot (31), a four-jaw connecting plate (38) is fixedly connected to the left end surface of the cylindrical connecting seat (32), a three-jaw clamping plate (33) is installed on the upper surface of the four-jaw connecting plate (38), a first lower clamping jaw (35) is installed on the upper surface of the fourth jaw of the four-jaw connecting plate (38), a vacuum chuck (34) is fixedly installed in the mounting hole reserved in the three-jaw clamping plate, a first clamp cylinder (36) is arranged on the butt joint surface of the first lower clamping jaw (35), and a first upper clamping jaw (37) is installed on the upper surface of the first clamp cylinder (36).

5. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The automatic cleaning tank device (4) comprises a box body horizontal plate (41) and a box body vertical plate (42), the box body horizontal plate (41) and the box body vertical plate (42) are fixedly installed to form the automatic cleaning tank device (4), and a box body sandwiched layer plate (43) is arranged on the inner surfaces of the box body horizontal plate (41) and the box body vertical plate (42).

6. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The positioning monitoring robot unit (5) comprises a positioning monitoring six-axis robot (51) installed on the equipment base, a circular end face on the T-axis flange of the positioning monitoring six-axis robot (51) is provided with a cylindrical connecting piece (52), the right side end face of the cylindrical connecting piece (52) is connected with a three-jaw adapter seat (53), the left side end face of the cylindrical connecting piece (52) is connected with a second lower clamp jaw (56), the upper surface of the three-jaw adapter seat (53) is respectively provided with an induction pen (54) and a fixed pressing pin (55), the abutting surface of the second lower clamp jaw (56) is provided with a second clamp cylinder (57), and the upper surface of the second clamp cylinder (57) is provided with a second upper clamp jaw (58).

7. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The silicon wafer cleaning unit (6) comprises a cleaning unit base (61) installed on the equipment base, a horizontal movement servo motor (62) installed on the upper surface of the cleaning unit base (61), a brush moving seat (63) movably connected to the inner surface of the horizontal movement servo motor (62), a brush (64) arranged in the mounting hole of the brush moving seat (63), a water pipe (65) installed on the two end connecting holes of the brush (64), a cleaning rotary servo motor (610) arranged on the side surface of the brush moving seat (63), a cylinder mounting seat (68) installed on the upper surface of the cleaning unit base (61), a vertical movement cylinder (611) arranged on the upper surface of the cylinder mounting seat (68), a horizontal movement cylinder (67) arranged on the upper slide table surface of the vertical movement cylinder (611), an upper pressing roller (69) installed on the end surface of the horizontal movement cylinder (67), and a bamboo joint pipe (66) arranged on the surface of the shell of the silicon wafer cleaning unit (6).

8. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The silicon wafer spin-drying unit (7) comprises a spin-drying unit base (71) installed on the equipment base, a slide rail (711) arranged on the upper surface of the spin-drying unit base (71), an L-shaped moving base (74) installed on the upper surface of the slide rail (711), an L-shaped fixed base (76) installed on the upper surface of the spin-drying unit base (71), a guide bearing (710) arranged in the mounting hole of the L-shaped fixed base (76), a guide rod (75) connected to the rear surface of the L-shaped moving base (74), a circular disc (79) fixedly connected with the guide rod (75) through the L-shaped moving base (74), a pushing cylinder (72) connected to the front rod end floating joint surface of the L-shaped moving base (74), a rotating disc (77) installed on the rear surface of the circular disc (79), a small clamp jaw (78) arranged on the edge surface of the rotating disc (77), a spin-drying rotary servo motor (73) arranged on the upper surface of the L-shaped fixed base (76), and a shaft coupling (712) connected to the rear surface of the spin-drying rotary servo motor (73).

9. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The lower sheet robot unit (8) comprises a lower sheet six-axis robot (81), which is installed on the equipment base, and a cylindrical coupling (82) is installed on the surface of the left end face T-axis flange of the lower sheet six-axis robot (81), a third lower clamping jaw (83) is connected to the left side of the cylindrical coupling (82), a third clamp air cylinder (84) is arranged on the butt joint surface of the third lower clamping jaw (83), and a third upper clamping jaw (85) is installed on the upper surface of the third lower clamping jaw (83).

10. The automatic loading and unloading, cleaning and spin-drying apparatus for a silicon wafer polishing machine according to claim 1, wherein: The visual positioning monitoring system (9) comprises a first camera (91), an intermediate camera (92), a cylindrical light source (93), a second camera (94) and a third camera (95), and the first camera (91), the intermediate camera (92), the cylindrical light source (93), the second camera (94) and the third camera (95) are installed in sequence at the designated position of the upper beam of the equipment.

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