Power converter

Abstract

The embodiment of the invention provides a power converter, relates to the technical field of heat dissipation equipment, and aims to solve the problem of low heat dissipation efficiency of a heat sink. The power converter comprises at least one multi-layer flow channel radiator and a power device. The radiator comprises a cover body, a jet flow plate and a bottom plate which are arranged in a stacked mode. The power device is arranged on the side, away from the cover body, of the bottom plate. A first liquid separation cavity is formed in the cover body. And a second liquid separation cavity is formed between the jet plate and the cover body. A heat dissipation cavity is formed between the bottom plate and the jet flow plate. A liquid separation hole is formed in the side, close to the jet plate, of the cover body, and the first liquid separation cavity communicates with the second liquid separation cavity through the liquid separation hole. A plurality of jet holes are formed in the part, located in the second liquid separation cavity, of the jet plate. And the second liquid separation cavity is communicated with the heat dissipation cavity through the jet flow hole. And vertical projections of the liquid separation holes on the surface, deviating from the bottom plate, of the jet plate fall out of the jet holes. The power converter is used for improving the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, and particularly relates to a power converter. BACKGROUND

[0002] In recent years, new energy vehicles powered by motors have developed rapidly in order to reduce global carbon emissions. The vehicle-mounted power converter is a core device for direct current to alternating current conversion of electric vehicles. The chip power consumption of the power device of the vehicle-mounted power converter evolves rapidly, and the chip heat flux density of the power device in the future can reach 1000W / cm 2 . Therefore, the heat dissipation performance of the heat dissipation structure is required to be higher and higher.

[0003] The heat sink currently used in the power converter has low heat dissipation efficiency under the conditions of limited chip heat dissipation space and high heat flux density chips. SUMMARY

[0004] The purpose of the present application is to provide a power converter for improving heat dissipation efficiency.

[0005] The present application provides a power converter with a multi-layer flow channel heat dissipation structure, comprising at least one multi-layer flow channel heat sink and a power device. The heat sink comprises a cover, a jet plate and a bottom plate arranged in layers. The power device is arranged on the side of the bottom plate away from the cover. The cover has a first liquid distribution cavity. The second liquid distribution cavity is formed between the jet plate and the cover. The heat dissipation cavity is formed between the bottom plate and the jet plate. The side of the cover close to the jet plate is provided with a liquid distribution hole, and the first liquid distribution cavity is communicated with the second liquid distribution cavity through the liquid distribution hole. The part of the jet plate located in the second liquid distribution cavity is provided with a plurality of jet holes. The second liquid distribution cavity is communicated with the heat dissipation cavity through the jet holes. The vertical projection of the liquid distribution hole on the surface of the jet plate away from the bottom plate falls outside the jet hole.

[0006] In some related technologies, the heat sink mainly uses horizontal flow of cooling medium for heat exchange, that is, the flow direction of the cooling medium is parallel to the surface of the heat sink substrate. This heat exchange form can achieve a relatively high local convective heat transfer coefficient, but this heat exchange form has low comprehensive heat dissipation efficiency under the conditions of limited power device chip heat dissipation space and high heat flux density chips, because the heat source is concentrated, the water temperature rises quickly.

[0007] In the present application, the heat generated by the power device during operation can be transferred to the bottom plate. By injecting the cooling medium into the first distribution cavity of the cover, the cooling medium flows into the second distribution cavity through the distribution hole. Then, through the multiple jet flow holes opened on the jet flow plate, multiple impact jets enter the heat dissipation cavity and impact the bottom plate, carrying away the heat on the bottom plate, thereby dissipating heat from the bottom plate and the power device. The first distribution cavity, the second distribution cavity, and the heat dissipation cavity are respectively the upper, middle, and lower three layers of cavities, and the above-mentioned three layers of cavities are sequentially stacked to form a multi-layer flow channel heat dissipation structure, realizing vertical jet flow of the cooling medium to impact the heat source area of the bottom plate for heat dissipation. Compared with horizontal flow heat exchange of the cooling medium, the cooling medium needs to absorb heat along the entire heat dissipation cavity. As the cooling medium flows, the temperature of the cooling medium gradually rises, resulting in poor uniformity of the areas where the cooling medium flows first and the areas where the cooling medium flows later. The way of multiple cooling medium vertical jet flow impacting the heat source area of the bottom plate, the cooling medium fluid directly impacts the heat source area of the power device that needs to be cooled, carrying away the heat. Thus, it can quickly dissipate heat from the area with high heat flux density, and the uniformity of different areas is good. Especially under the condition of high heat flux density of the element to be cooled and limited heat dissipation space, it can effectively reduce the thermal resistance, improve the uniformity of the power device, and improve the heat dissipation efficiency.

[0008] Moreover, the vertical projection of the distribution hole on the surface of the jet flow plate away from the bottom plate falls outside the jet flow hole. That is, after the cooling medium in the first distribution cavity flows to the second distribution cavity first towards the jet flow plate, it flows in the jet flow hole only after flowing in the direction parallel to the jet flow plate. Thus, it can improve the uniformity of the cooling medium distributed to the multiple jet flow holes. The cooling medium first flows to different areas of the second distribution cavity through the first distribution cavity and the distribution hole, and then further flows into the heat dissipation cavity through the multiple jet flow holes communicating with the second distribution cavity. Through two times of flow distribution, the single flow is small, the pressure drop during flow is low, the power loss during flow of the cooling medium is reduced, and the pump work required for pumping the cooling medium is reduced. In addition, after the cooling medium jets into the heat dissipation cavity through the jet flow hole, compared with some micro-manifold channels, the flow space of the cooling medium in the heat dissipation cavity is large, and it is not easy to be blocked.

[0009] In an alternative embodiment, the number of jet flow holes is greater than the number of distribution holes. Thus, after being distributed through a smaller number of distribution holes, it can be distributed into more flows through a larger number of jet flow holes. Thus, the single flow is small, the pressure drop during flow is low, and the power loss during flow of the cooling medium is reduced.

[0010] In an alternative embodiment, the distribution hole is a strip-shaped hole. The length and cross section of the strip-shaped hole are large, which can ensure that the liquid in the first distribution cavity can flow smoothly into the second distribution cavity, and can flow to different areas of the second distribution cavity, improve the distribution effect, and further improve the uniformity of the cooling medium distributed to the multiple jet flow holes.

[0011] In an alternative embodiment, a plurality of distribution holes are formed in the cover. The plurality of distribution holes allow the cooling medium to flow to different areas of the second distribution chamber, further improving the uniformity of the cooling medium distributed to the plurality of jet holes.

[0012] In an alternative embodiment, the cover has an inlet opening and an outlet opening. The inlet opening is in communication with the first distribution chamber. The cover also has a first flow collection chamber. The first flow collection chamber is isolated from the first distribution chamber. The first flow collection chamber is in communication with the outlet opening. The second flow collection chamber is formed between the jet plate and the cover. The second flow collection chamber is isolated from the second distribution chamber. The portion of the jet plate located in the second flow collection chamber has a return hole. The heat dissipation chamber is in communication with the second flow collection chamber through the return hole. The cover has a liquid collection hole near the jet plate. The second flow collection chamber is in communication with the first flow collection chamber through the liquid collection hole.

[0013] The cooling medium can flow into the first distribution chamber through the inlet opening. The cooling medium can also flow out of the first flow collection chamber through the outlet opening. The heat sink exchanges the cooling medium with the outside. The inlet opening and the outlet opening are both formed in the cover, which can facilitate the connection of the pipeline of the cooling system and the heat sink. In addition, the cooling medium can be injected into the first distribution chamber through the inlet opening on the cover, flow to the second distribution chamber through the distribution hole, and then enter the heat dissipation chamber through the jet hole for heat exchange. The cooling medium after absorbing heat can flow back to the second flow collection chamber through the return hole. Then, it can flow into the first flow collection chamber through the liquid collection hole, and finally flow out of the heat sink through the outlet opening, thereby completing heat dissipation. The first distribution chamber, the second distribution chamber, and the heat dissipation chamber are vertically arranged in three layers, which realize the heat exchange and circulation of the cooling medium in the heat sink. In turn, it can reduce the size of the heat sink in the direction parallel to the bottom plate.

[0014] In an alternative embodiment, the heat sink further includes a first partition. The first partition is arranged between the cover and the jet plate. The first partition is connected to the cover and the jet plate, respectively. The first partition isolates the second distribution chamber and the second flow collection chamber from each other. It avoids the direct exchange of cooling medium in the second distribution chamber and the second flow collection chamber, which affects the heat dissipation effect.

[0015] In an alternative embodiment, the heat sink further includes a second partition. The second partition is located in the cover. The second partition isolates the first distribution chamber and the first flow collection chamber from each other. It avoids the direct exchange of cooling medium in the first distribution chamber and the first flow collection chamber.

[0016] In an alternative embodiment, the first partition rib comprises a plurality of concave-convex structures along the width direction of the heat sink. The plurality of concave-convex structures separate the second distribution chamber into a plurality of sub-distribution chambers arranged in intervals. The plurality of concave-convex structures also separate the second flow collection chamber into a plurality of sub-flow collection chambers arranged in intervals. The sub-distribution chambers and the sub-flow collection chambers are arranged alternately along the length direction of the heat sink. The portion of the jet plate located in each sub-distribution chamber is provided with at least one jet hole. The portion of the jet plate located in each sub-flow collection chamber is provided with at least one backflow hole.

[0017] The cooling medium enters the second distribution chamber through the distribution hole, and then is distributed into different sub-distribution chambers, and then flows into different areas of the heat dissipation chamber through the jet holes provided on the portion of the jet plate located in the different sub-distribution chambers, and exchanges heat. Then the cooling medium flows out of the heat dissipation chamber through the backflow holes connected to the sub-distribution chambers, improving the flowability of the cooling medium and further improving the heat dissipation efficiency of the heat dissipation chamber.

[0018] In an alternative embodiment, the distribution hole is a plurality of distribution holes arranged along the side wall of the first distribution chamber. The flow collection hole is a plurality of flow collection holes arranged along the side wall of the first flow collection chamber. After the cooling medium is distributed through the plurality of distribution holes in the first distribution chamber, a plurality of parallel flows are formed, and after further distribution in different second distribution chambers, the cooling medium is jetted into the heat dissipation chamber, and then the plurality of power devices arranged at different positions on one side of the bottom plate can be cooled. After heat exchange, the cooling medium is preliminarily collected by backflowing to different second flow collection chambers, and then further collected by flowing to the first flow collection chamber through different flow collection holes. The cooling medium is distributed twice in the heat sink, and then collected twice, so as to ensure that the single flow of the cooling medium changes smoothly and the pressure drop is low when flowing. The power loss of the cooling medium when flowing is reduced, and then the pump power required for pumping the cooling medium is reduced.

[0019] In an alternative embodiment, the power converter comprises a plurality of power devices. A plurality of first cavities are formed between the jet plate and the cover. The projection of each first cavity on the bottom plate covers at least one power device. Each first cavity is divided into a second distribution chamber and a second flow collection chamber by a first partition rib. Each second distribution chamber is connected to the first distribution chamber through at least one distribution hole. Each second flow collection chamber is connected to the first flow collection chamber through at least one flow collection hole. The distribution hole distributes the cooling medium into different second distribution chambers to form a plurality of parallel flows. The plurality of parallel cooling medium flows are jetted to the portion of the bottom plate connected to different power devices, and then the different power devices are uniformly cooled.

[0020] In an alternative embodiment, the heat sink further comprises a flow resistance tooth. The flow resistance tooth is located in the second distribution cavity. The flow resistance tooth is connected to the jet plate and protrudes in the direction of the cover plate. When the cooling medium flows into the second distribution cavity through the distribution hole, the flow resistance tooth can slow down the flow of the cooling medium, so that the cooling medium can flow into different sub-distribution cavities more uniformly. In addition, the flow resistance tooth can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into the jet hole better.

[0021] In an alternative embodiment, the flow resistance tooth is a plurality of flow resistance teeth. The flow resistance teeth and the jet holes are alternately and spacedly arranged in the width direction of the heat sink. The alternately and spacedly arranged flow resistance teeth and jet holes can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole better. By flowing into different areas of the heat sink through different jet holes, uniform heat dissipation of the power device is further achieved, and the temperature uniformity of the power device is improved.

[0022] In an alternative embodiment, the heat sink further comprises a first flow guide strip. The first flow guide strip is arranged in the first distribution cavity. The extension direction of the first flow guide strip is the direction in which the liquid inlet opening faces at least one distribution hole. The first flow guide strip is used to quickly guide the cooling medium entering the first distribution cavity through the liquid inlet opening to the distribution hole. Thus, the flow rate of the cooling medium in the heat sink is improved, which helps to further improve the heat dissipation efficiency. When there are a plurality of distribution holes, the first flow guide strip can also ensure that the cooling medium is evenly distributed to different distribution holes.

[0023] In an alternative embodiment, the heat sink further comprises a second flow guide strip. The second flow guide strip is arranged in the first flow collection cavity. The extension direction of the second flow guide strip is the direction in which at least one flow collection hole faces the liquid inlet opening. The second flow guide strip is used to quickly guide the cooling medium flowing into the first distribution cavity through the flow collection hole to the liquid outlet opening. This allows the cooling medium to quickly flow out through the liquid outlet opening, improving the circulation rate and further improving the heat dissipation efficiency.

[0024] In an alternative embodiment, the cover comprises a partition plate and a cover plate. The second distribution cavity and the second flow collection cavity are formed between the jet plate and the partition plate. The cover plate is located on the side of the partition plate away from the jet plate. The first distribution cavity and the first flow collection cavity are formed between the cover plate and the partition plate. The liquid inlet opening and the liquid outlet opening are both provided on the cover plate. The cover plate is located on the side of the partition plate away from the jet plate, and the liquid inlet opening and the liquid outlet opening are both located on the cover plate, i.e. the liquid inlet opening and the liquid outlet opening are located on the same side of the heat sink, which facilitates the connection of the heat sink and the pipeline of the cooling system, thereby reducing the installation difficulty of the heat sink.

[0025] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel and the outlet flow channel are arranged on the side of the cover plate away from the jet plate. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is in communication with the outlet opening. The end of the inlet flow channel away from the inlet opening and the end of the outlet flow channel away from the outlet opening are away from the cover plate. This facilitates the connection of the heat sink with external pipelines, thereby reducing the installation difficulty of the heat sink.

[0026] In an alternative embodiment, the at least one heat sink comprises a first heat sink and a second heat sink. The first heat sink comprises a first jet plate and a first bottom plate. The second heat sink comprises a second jet plate and a second bottom plate. The first heat sink and the second heat sink share a cover. The first bottom plate, the first jet plate, the cover, the second jet plate, and the second bottom plate are sequentially stacked in a first direction. Part of the power devices are arranged on the side of the first bottom plate away from the cover, and another part of the power devices are arranged on the side of the second bottom plate away from the cover. Along the first direction, the two side bottom walls of the cover are provided with a distribution hole and a collection hole. The side wall of the cover is provided with an inlet opening and an outlet opening. The inlet opening is in communication with the first distribution cavity, and the outlet opening is in communication with the first collection cavity.

[0027] After the cooling medium flows into the first distribution cavity through the inlet opening, it is distributed into the first heat sink and the second heat sink through different distribution holes on the upper and lower sides. Part of the cooling medium enters the second distribution cavity between the first jet plate and the cover, and flows into the heat dissipation cavity between the first jet plate and the first bottom plate through the jet holes on the first jet plate, thereby dissipating heat from the power devices arranged on the first bottom plate. Another part of the cooling medium enters the second distribution cavity between the second jet plate and the cover, and flows into the heat dissipation cavity between the second jet plate and the second bottom plate through the jet holes on the second jet plate, thereby dissipating heat from the power devices arranged on the second bottom plate. This realizes the simultaneous heat dissipation of multiple power devices on the upper and lower sides by the heat sink.

[0028] In an alternative embodiment, the at least one heat sink comprises a first heat sink and a second heat sink. The first heat sink and the second heat sink are arranged on opposite sides of the power devices, respectively. The bottom plate of the first heat sink and the bottom plate of the second heat sink are connected with the power devices, respectively. At this time, the power devices can be cooled from both sides, further improving the heat dissipation effect of the power devices.

[0029] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel is arranged on the first side of the cover in a direction parallel to the bottom plate, and the inlet opening is arranged on the first side of the cover. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is arranged on the second side of the cover in a direction parallel to the bottom plate, and the outlet opening is arranged on the second side of the cover. The outlet flow channel is in communication with the outlet opening. The port of the inlet flow channel away from the inlet opening and the port of the outlet flow channel away from the outlet opening are oriented in the same direction. The inlet opening is in communication with the external pipeline through the inlet flow channel, the outlet opening is in communication with the external pipeline through the outlet flow channel, and the ports of the inlet flow channel and the outlet flow channel are oriented in the same direction. This facilitates the connection of the heat sink with the external pipeline, thereby reducing the installation difficulty of the heat sink. The first heat sink and the second heat sink share one inlet flow channel and one outlet flow channel. This facilitates the supply and recovery of cooling medium for the first heat sink and the second heat sink.

[0030] In an alternative embodiment, the heat sink further comprises a flow resistance wall. The flow resistance wall is located in the heat dissipation cavity and connected with the bottom plate. The flow resistance wall divides the heat dissipation cavity into a plurality of heat dissipation sub-cavities. Each heat dissipation sub-cavity is in communication with at least one jet flow hole and at least one backflow hole. The flow resistance wall can absorb the heat transferred by the bottom plate, and when the cooling medium flows and impacts on the flow resistance wall, the cooling medium can exchange heat with the flow resistance wall, thereby improving the heat dissipation effect. After the cooling medium flows into the heat dissipation sub-cavity through the jet flow hole, the flow resistance wall can prevent the cooling medium flows in different heat dissipation sub-cavities from colliding with each other, so as to reduce the flow speed of the cooling medium and avoid affecting the heat dissipation efficiency.

[0031] In an alternative embodiment, the heat sink further comprises a heat dissipation fin. The heat dissipation fin is located in the heat dissipation cavity. The heat dissipation fin is connected with the bottom plate. The heat dissipation fin can increase the contact area with the cooling medium, slow down the flow speed of the cooling medium, thereby achieving sufficient heat exchange and improving the heat dissipation effect. The vertical projection of the jet flow hole on the bottom plate does not overlap with the vertical projection of the heat dissipation fin on the bottom plate. The cooling medium flowing into the heat dissipation cavity from the jet flow hole can directly impact on the bottom plate, and then flow to the surrounding heat dissipation fin structure, thereby ensuring that the cooling medium can fully contact with the bottom plate and the heat dissipation fin, and improving the heat dissipation effect.

[0032] In an alternative embodiment, the opening of the jet flow hole towards the bottom plate is cross-shaped. When the cooling medium flows into the heat dissipation cavity through the cross-shaped opening, it is beneficial for the cooling medium to spread outward in a direction parallel to the surface of the bottom plate, thereby taking away the heat on the bottom plate and improving the heat dissipation efficiency.

[0033] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is in communication with the outlet opening. The port of the inlet flow channel and the port of the outlet flow channel are both away from the heat sink along the stacking direction of the heat sink and the power device. The power converter further comprises a capacitor. The capacitor, the port of the inlet flow channel and the port of the outlet flow channel are located on the same side of the heat sink along the stacking direction of the heat sink and the power device. The size of the capacitor, the port of the inlet flow channel and the port of the outlet flow channel overlap. The width of the power converter can be reduced. After the cooling medium pipeline is connected with the port of the inlet flow channel and the port of the outlet flow channel, the size of the cooling medium pipeline and the capacitor overlap. The width of the power converter is further reduced, which is conducive to the miniaturization of the power converter. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A structural schematic diagram of a vehicle provided by an embodiment of the present application;

[0035] Figure 2A A structural schematic diagram of a power converter provided by an embodiment of the present application;

[0036] Figure 2B A structural schematic diagram of another power converter provided by an embodiment of the present application;

[0037] Figure 3 An exploded view of a heat sink shown in Figure 2A

[0038] A sectional view of the heat sink shown in Figure 4 Figure 3 A sectional view of the heat sink shown in

[0039] Figure 5A Figure 3 A sectional view of the heat sink shown in

[0040] Figure 5B An enlarged view at A; Figure 5A

[0041] Figure 6 A sectional view of a power converter provided by an embodiment of the present application;

[0042] Figure 7 A structural schematic diagram of a cover provided by an embodiment of the present application;

[0043] Figure 8 A structural schematic diagram of another cover provided by an embodiment of the present application;

[0044] Figure 9 An exploded view of another heat sink shown in Figure 2A ​​​​

[0045] Figure 10 This is a schematic diagram of the structure of a jet plate provided in an embodiment of this application;

[0046] Figure 11 An exploded view of the cover and jet plate of a radiator provided in an embodiment of this application;

[0047] Figure 12 This is a schematic diagram of another type of cover provided in an embodiment of this application;

[0048] Figure 13 A front view of a heat sink provided in an embodiment of this application;

[0049] Figure 14 A partial cross-sectional view of a heat sink provided in an embodiment of this application;

[0050] Figure 15A A cross-sectional view of another power converter provided in an embodiment of this application;

[0051] Figure 15B This is a schematic diagram of another power converter provided in an embodiment of this application;

[0052] Figure 16 for Figure 15A The power converter shown is a cross-sectional view along the Q1-Q2 direction;

[0053] Figure 17A A cross-sectional view of another power converter provided in the embodiments of this application;

[0054] Figure 17B This is a schematic diagram of another power converter provided in an embodiment of this application;

[0055] Figure 18 A partial exploded view of the jet plate and base plate of a radiator provided in an embodiment of this application;

[0056] Figure 19 A partial exploded view of the jet plate and base plate of another heat sink provided in an embodiment of this application;

[0057] Figure 20 A partial schematic diagram of another jet plate provided in an embodiment of this application;

[0058] Figure 21 This is a partial schematic diagram of another jet plate provided in an embodiment of this application.

[0059] Figure label:

[0060] 100-vehicle; 01-battery; 02-power converter; 03-motor; 04-wheel; 10-power device; 11-power chip; 20-radiator; 40-capacitor; 50-liquid inlet pipe; 60-liquid outlet pipe; 21-cover; 211- partition; 211A-first partition; 211B-second partition; 212-cover plate; 213-second partition rib; 214-first partition plate; 2101-first distribution cavity; 2102-distribution hole; 2103-liquid inlet opening; 2104-liquid outlet opening; 2105-first flow cavity; 2106-flow hole; 2100-second cavity; 22-jet plate; 2201-jet hole; 2202-backflow hole; 22A-first jet plate; 22B-second jet plate; 23-bottom plate; 23A-first bottom plate; 23B-second bottom plate; 24-first partition rib; 241-convex-concave structure; 34-resistance tooth; 25-first resistance tooth; 26-second resistance tooth; 27-first flow guide strip; 28-second flow guide strip; 29-liquid inlet flow channel; 30-liquid outlet flow channel; 31-second partition plate; 32-resistance wall; 33-radiation tooth; 201-second distribution cavity; 2011-sub-distribution cavity; 202-radiation cavity; 2021-radiation sub-cavity; 203-second flow cavity; 2031-sub-flow cavity; 200-first cavity; 2001-first side wall; 2002-second side wall. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0062] Hereinafter, the terms "first", "second", "third", "fourth" and the like are only used for description convenience and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified and limited, the meaning of "a plurality of" is two or more.

[0063] In the present application, unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed mechanical connection, or detachable mechanical connection, or integral; or "connection" can be direct connection, or indirect connection through intermediate medium.

[0064] In this application, the words "exemplarily" and "for example" are used to indicate that something is being described as an example, illustration, or illustration. Any embodiment or design that is described as "exemplarily" or "for example" in this application should not be construed as being better or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" and "for example" is intended to present the relevant concepts in a specific manner.

[0065] In the accompanying drawings of the embodiments of this application, components are represented by straight guide lines with arrows; parts are represented by only straight guide lines; and hollow structures such as cavities and openings are represented by curved guide lines.

[0066] This application implements, for example Figure 1 As shown, a vehicle 100 is provided. The vehicle 100 may include a battery 01, a power converter 02, a motor 03, and wheels 04. The power converter 02 receives direct current (DC) power from the battery 01 and outputs alternating current (AC) power to the motor 03. The motor 03 receives power from the power converter 02 and drives the wheels 04. The battery 01 may be a power battery.

[0067] For example, vehicle 100 may include an electric vehicle or a hybrid vehicle. This application does not impose specific limitations on the embodiments described.

[0068] like Figure 2A As shown, the power converter 02 provided in this embodiment may include power devices 10. Each power device 10 includes one or more power chips 11. These power chips 11 constitute the bridge arm circuit of a DC-to-AC converter circuit. For example, the power device 10 may be a power module.

[0069] For example, the power chip 11 may include at least one of an insulated-gate bipolar transistor (IGBT), a gallium nitride (GaN) power transistor, and a silicon carbide (SiC) power transistor.

[0070] And, for example, continue as follows Figure 2A As shown, the power converter 02 may include three power devices 10, each of which includes two power chips 11. The two power chips 11 in each power device 10 form a bridge arm circuit, and the three power devices 10 are combined to form a three-phase inverter circuit. The three-phase inverter circuit is used to convert the DC power output from the battery 01 into three-phase AC power.

[0071] Of course, in other embodiments of this application, the number of power devices 10 can also be other numbers. For example... Figure 2B As shown, the power converter 02 may include four power devices 10. This application does not impose specific limitations on the embodiments.

[0072] like Figure 2A As shown, the power converter 02 also includes a capacitor 40. The capacitor 40 is electrically connected to the power chip 11 and is used to perform voltage regulation and filtering, energy storage and release, improve the power factor, and protect the inverter when the current power changes.

[0073] When power device 10 is operating, power chip 11 generates heat. If this heat cannot be dissipated in time, power device 10 is prone to damage due to overheating. To dissipate heat from power device 10, the following steps are taken... Figure 2A As shown, the power converter 02 may further include a heat sink 20. The heat sink 20 is used to dissipate heat from the power device 10. The power converter 02 may also include an inlet pipe 50 and an outlet pipe 60. The inlet pipe 50 is used to transfer the cooling medium into the heat sink 20, and the outlet pipe 60 is used to transfer the cooling medium from the heat sink 20 out of the heat sink 20. Along the stacking direction of the heat sink 20 and the power device 10, the capacitor 40, the inlet pipe 50, and the outlet pipe 60 are all disposed on the same side of the heat sink 20. At this time, along the direction in the XY plane, the dimensions of the capacitor 40, the inlet pipe 50, and the outlet pipe 60 overlap. This can reduce the width and length of the power converter 02, which is beneficial for the miniaturization of the power converter 02.

[0074] As the power consumption of automotive power devices (10 chips) evolves rapidly, their heat flux density is also increasing. Therefore, the requirements for the heat dissipation performance of heat dissipation structures are becoming increasingly stringent. Currently, the heat sinks (20) used in power devices primarily employ horizontal flow heat transfer of the cooling medium, meaning the flow direction of the cooling medium is parallel to the substrate surface of the heat sink (20). This heat transfer method can achieve a high local convective heat transfer coefficient; however, under limited chip heat dissipation space and high heat flux density chip conditions, due to the concentrated heat source and rapid water temperature rise, the overall heat dissipation efficiency is relatively low.

[0075] To solve the above problems, such as Figure 3 ( Figure 2A As shown in the exploded view of the heat sink 20 in the embodiment of this application, the power converter 02 provided in this application may further include a multi-layered heat sink 20. The heat sink 20 may include a cover 21, a jet plate 22, and a base plate 23 stacked together. The power device 10 is disposed on the side of the base plate 23 facing away from the cover 21. The base plate 23 may be attached to the power device 10 (e.g., Figure 2A (As shown). Alternatively, the base plate 23 can also be the substrate of the power device 10, with the power chip 11 disposed on the side of the base plate 23 away from the jet plate 22. The heat emitted by the power device 10 can be transferred to the base plate 23. The cover 21 and the jet plate 22 are both located on the side of the base plate 23 away from the power device 10.

[0076] For ease of explanation, Figure 3An XYZ coordinate system is established, wherein the XY plane can be parallel to the bottom plate 23. In the case where the bottom plate 23 of the heat sink 20 has a rectangular profile shape, the direction of the X axis can coincide with the direction of the short side in the profile shape of the bottom plate 23, and the direction of the Y axis can coincide with the direction of the long side in the profile shape of the bottom plate 23. The Z axis is perpendicular to the above-mentioned XY plane, and the Z axis can be the stacking direction of the cover body 21, the fluid ejection plate 22 and the bottom plate 23, i.e. the thickness direction of the heat sink 20.

[0077] The cover body 21 can have a first distribution cavity 2101 therein. A second distribution cavity 201 can be formed between the fluid ejection plate 22 and the cover body 21. A heat dissipation cavity 202 can be formed between the bottom plate 23 and the fluid ejection plate 22. The cover body 21 can further have a distribution hole 2102 formed therein, and the first distribution cavity 2101 communicates with the second distribution cavity 201 through the distribution hole 2102. The fluid ejection plate 22 can have a plurality of fluid ejection holes 2201 formed in the portion of the fluid ejection plate 22 located in the second distribution cavity 201. The second distribution cavity 201 communicates with the heat dissipation cavity 202 through the fluid ejection holes 2201.

[0078] By injecting the cooling medium into the first distribution cavity 2101 of the cover body 21, the cooling medium flows into the second distribution cavity 201 through the distribution hole 2102. Then, the cooling medium is divided into a plurality of impact jets through the plurality of fluid ejection holes 2201 formed in the fluid ejection plate 22, and enters the heat dissipation cavity 202, and impacts the bottom plate 23 to take away the heat transferred by the power device 10 to the floor. In turn, the power device 10 is cooled. As shown in Figure 4 Figure 3 As shown in the cross-sectional view of the heat sink combination along the direction O1-O2), the first distribution cavity 2101, the second distribution cavity 201 and the heat dissipation cavity 202 are respectively arranged in the upper, middle and lower layers, and the three layers are sequentially stacked along the Z axis direction perpendicular to the bottom plate, and the heat sink 20 is a multi-layer flow channel heat dissipation structure. The cooling medium is vertically jetted to impact the bottom plate 23 to cool the power device 10 (as shown in Figure 2A Compared with the horizontal flow heat exchange of the cooling medium, the cooling medium absorbs heat along the whole heat dissipation cavity 202, and the temperature of the cooling medium gradually increases as the cooling medium flows, resulting in poor uniformity of the areas where the cooling medium flows first and the areas where the cooling medium flows later. The way of vertically jetting a plurality of cooling media to impact the heat source area can directly impact the heat source area to be cooled by the cooling medium, and the heat carried by the cooling medium is taken away. In turn, the high heat flux area can be quickly cooled, and the uniformity of different areas is good. Especially under the condition of high heat flux to be cooled elements and limited heat dissipation space, the thermal resistance can be effectively reduced, and the elements to be cooled (such as Figure 2A ​The power chip 11 shown is uniform in temperature, improving heat dissipation efficiency. In addition, after the cooling medium is jetted into the heat dissipation cavity 202 through the jet hole 2201, the flow space of the cooling medium in the heat dissipation cavity 202 is relatively large relative to some micro-manifold channels, and is not prone to blockage.

[0079] As shown in Figure 5A ( Figure 3 The cross-sectional view of the rear edge P1-P2 direction of the heat sink combination) shown, the vertical projection of the distribution hole 2102 on the surface of the jet plate 22 away from the bottom plate 23 falls into the jet hole 2201. The cooling medium in the first distribution cavity 2101 first flows towards the jet plate 22 to the second distribution cavity 201, and then, as shown by the arrow in Figure 5A , first flows in a direction parallel to the jet plate 22, and then flows into the jet hole 2201. In turn, it can improve the uniformity of the cooling medium distributed to the plurality of jet holes 2201. The cooling medium first flows through the first distribution cavity 2101 to different areas of the second distribution cavity 201, and then further flows into the heat dissipation cavity 202 through the plurality of jet holes 2201 in communication with the second distribution cavity 201. And the number of jet holes 2201 is greater than the number of distribution holes 2102. In turn, after being distributed through the distribution hole 2102, it can be distributed by a larger number of jet holes 2201 into more flow. Through two distributions, the single flow is smaller, the pressure drop is lower when flowing, the power loss when the cooling medium flows is reduced, and the pump power required to pump the cooling medium is reduced.

[0080] In order to increase the flow rate of the cooling medium flowing out of the jet hole 2201, as shown in Figure 5B ( Figure 5A The enlarged view at A) shown, the opening area of the jet hole 2201 towards the bottom plate 23 is smaller than the opening area of the jet hole 2201 away from the bottom plate 23. For example, when the jet hole 2201 is a circular hole, the diameter of the jet hole 2201 towards the bottom plate 23 is smaller than the diameter of the jet hole 2201 away from the bottom plate 23. When the cooling medium is jetted into the heat dissipation cavity 202 through the jet hole 2201, the opening area of the jet hole 2201 towards the bottom plate 23 is smaller, and in turn, the flow rate of the cooling medium entering the heat dissipation cavity 202 can be increased, to improve heat exchange efficiency.

[0081] Of course, in other embodiments of the present application, the opening area of the jet hole 2201 towards the bottom plate 23 can also be equal to the opening area of the jet hole 2201 away from the bottom plate 23. For example, the jet hole 2201 is a cylindrical hole with a certain diameter, or the jet hole 2201 is a prismatic hole, etc. The present application is not specifically limited.

[0082] As shown in Figure 6As shown, the power device 10 described above may include multiple power chips 11. The projection of each power chip 11 onto the jet plate 22 covers at least a portion of a jet hole 2201. When the heat dissipated by the power chip 11 during operation diffuses onto the base plate 23, the cooling medium flowing out of the jet hole 2201 impacts the areas with concentrated heat, thereby effectively dissipating heat from these areas and improving the heat dissipation efficiency of the heat sink 20.

[0083] To further improve the uniformity of cooling medium distribution, such as Figure 7 As shown, the dispensing orifice 2102 can be a strip-shaped orifice. For example, the strip-shaped orifice can extend along the Y-axis direction, making its dimension along the Y-axis direction larger than its dimension along the X-axis direction. With a fixed dimension along the X-axis direction, the length of the strip-shaped orifice along the Y-axis direction is larger than that of a circular orifice, and the opening of the strip-shaped orifice is also larger. This ensures that the liquid in the first dispensing chamber 2101 can smoothly flow into the second dispensing chamber 201 (e.g., ...). Figure 3 As shown, the medium can flow into different areas of the second dispensing chamber 201, thereby improving the dispensing effect and further enhancing the uniformity of the cooling medium distributed to the multiple jet holes 2201.

[0084] The above implementation examples Figure 7 The illustration shows an example where the dispensing orifice 2102 is a strip-shaped orifice. In other embodiments of this application, the dispensing orifice 2102 may also be circular, serpentine, cross-shaped, etc. This application does not impose specific limitations.

[0085] like Figure 8 As shown, the cover 21 can have multiple openings that are the same as the second liquid distribution chamber 201 (e.g., Figure 3 The distributing holes 2102 are interconnected. Multiple distributing holes 2102 will allow the cooling medium to flow to the second distributing chamber 201 (as shown). Figure 3 Different regions (as shown) further improve the uniformity of the cooling medium distributed to multiple jet holes 2201.

[0086] like Figure 9 ( Figure 2AAs shown in the exploded view of the radiator 20, the cover 21 may have an inlet opening 2103 and an outlet opening 2104. The inlet opening 2103 communicates with the first distributing chamber 2101. The cover 21 may also have a first confluence chamber 2105. The first confluence chamber 2105 is isolated from the first distributing chamber 2101. The first confluence chamber 2105 communicates with the outlet opening 2104. A second confluence chamber 203 may also be formed between the jet plate 22 and the cover 21. The second confluence chamber 203 is isolated from the second distributing chamber 201. The portion of the jet plate 22 located in the second confluence chamber 203 may also have a return hole 2202. The radiator 202 communicates with the second confluence chamber 203 through the return hole 2202. The cover 21 may also have a collection hole 2106. The second confluence chamber 203 communicates with the first confluence chamber 2105 through the collection hole 2106.

[0087] along Figure 9 As indicated by the arrows, the cooling medium can flow into the first distribution chamber 2101 through the inlet opening 2103. The cooling medium can also flow out of the first confluence chamber 2105 through the outlet opening 2104, thus enabling the radiator 20 to exchange cooling media with the external environment. Both the inlet opening 2103 and the outlet opening 2104 are located on the cover 21, facilitating the inlet pipe 50 (e.g., ...). Figure 2A (as shown) and outlet pipe 60 (as shown) Figure 2A (As shown) the connection with the radiator 20. Additionally, the cooling medium can be injected into the first distribution chamber 2101 through the inlet opening 2103 on the cover 21, flow to the second distribution chamber 201 through the distribution hole 2102, and then enter the heat dissipation chamber 202 through the jet hole 2201 for heat exchange. The cooling medium, after absorbing heat, can flow back to the second confluence chamber 203 through the return hole 2202. It then flows into the first confluence chamber 2105 through the collection hole 2106, and finally flows out of the radiator 20 through the outlet opening 2104, thus completing heat dissipation. The three vertically arranged chambers—the first distribution chamber 2101, the second distribution chamber 201, and the heat dissipation chamber 202—achieve heat exchange circulation of the cooling medium within the radiator 20. This reduces the size of the radiator 20 in the direction parallel to the base plate 23.

[0088] Alternatively, in other embodiments of this application, the liquid outlet 2104 may also be formed on the side wall of the heat dissipation cavity 202. After the cooling medium flows from the jet hole 2201 to the heat dissipation cavity 202, it is discharged from the heat dissipation cavity 202 through the liquid outlet 2104 on the side wall of the heat dissipation cavity 202.

[0089] like Figure 10 As shown, the jet plate 22 and the cover 21 (as shown) Figure 9A first cavity 200 can be formed between the cover 21 and the jet plate 22. The radiator 20 may also include a first baffle 24. The first baffle 24 is disposed in the first cavity 200 and is located between the cover 21 and the jet plate 22. The first baffle 24 is connected to the cover 21 and the jet plate 22 respectively. The first baffle 24 divides the first cavity 200 into a second liquid distribution chamber 201 and a second confluence chamber 203. This separates the second liquid distribution chamber 201 and the second confluence chamber 203, preventing direct exchange of cooling media in the second liquid distribution chamber 201 and the second confluence chamber 203, which would affect the heat dissipation effect.

[0090] Continue as Figure 10 As shown, the first partition 24 includes multiple concave-convex structures 241 along the width direction (i.e., the X-axis direction) of the radiator 20. These multiple concave-convex structures 241 divide the second liquid distribution chamber 201 into multiple spaced sub-liquid distribution chambers 2011. The multiple concave-convex structures 241 also divide the second manifold 203 into multiple spaced sub-manifold cavities 2031. The sub-liquid distribution chambers 2011 and sub-manifold cavities 2031 are arranged alternately along the length direction (i.e., the Y-axis direction) of the radiator 20. The portion of the jet plate 22 located within each sub-liquid distribution chamber 2011 has at least one jet hole 2201. The portion of the jet plate 22 located within each sub-manifold cavities 2031 has at least one return hole 2202.

[0091] The cooling medium enters the second distribution chamber 201 through the distribution hole 2102, and then is split into different sub-distribution chambers 2011. It is then injected into different areas of the heat dissipation chamber 202 through jet holes 2201 located within the different sub-distribution chambers 2011 via the jet plate 22, where heat exchange occurs. The cooling medium then flows out of the heat dissipation chamber 202 through the return hole 2202, which connects to the sub-merging chamber 2031 adjacent to the sub-distribution chamber 2011, improving the fluidity of the cooling medium and further enhancing the heat dissipation efficiency of the heat dissipation chamber 202.

[0092] For example, continue as follows Figure 10 As shown, the first cavity 200 may have a first sidewall 2001 and a second sidewall 2002. A first partition 24 is located between the first sidewall 2001 and the second sidewall 2002. The first partition 24 separates the first sidewall 2001 to form a second liquid distribution cavity 201. The first partition 24 separates the second sidewall 2002 to form a second manifold 203.

[0093] For example, the first partition 24 can be a zigzag or a wavy line. The zigzag or wavy first partition 24 can separate multiple sub-dispensing chambers 2011 and multiple sub-manifolds 2031, and a sub-manifold 2031 is provided on one side of each sub-dispensing chamber 2011.

[0094] To ensure that the cooling medium flows evenly into the different jet holes 2201, continue as followsFigure 10 As shown, the heat sink 20 can further include flow resistance teeth 34. The flow resistance teeth 34 are located in the second distribution cavity 201. The flow resistance teeth 34 are connected with the jet plate 22 and protrude in the direction of the cover 21 (as shown) along the jet plate 22. Figure 9 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 9 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10.

[0095] Further, as shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 10 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 9 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 6 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10.

[0096] As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 9 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10.

[0097] As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 11 As shown, the flow resistance teeth 34 can be multiple. The flow resistance teeth 34 and the jet holes 2201 are alternately and spacedly arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The alternately and spacedly arranged flow resistance teeth 34 and the jet holes 2201 can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole 2201 better. Through the different jet holes 2201, the cooling liquid is jetted into different areas of the heat dissipation cavity 202 (as shown) to further uniformly cool the power device 10 (as shown) and improve the temperature uniformity of the power device 10. Figure 9The cooling medium is distributed into different second distribution cavities 201 through the distribution holes 2102, and then is distributed into different second converging cavities 203 through the converging holes 2106. The cooling medium is further distributed into the first converging cavity 2105, and then is distributed into the first distribution cavity 2101. The cooling medium is distributed twice in the radiator 20, and then is converged twice. The single flow of the cooling medium can be changed smoothly, and the pressure drop is low. The power loss of the cooling medium is reduced, and the pump power required for pumping the cooling medium is reduced.

[0098] As shown in FIG. 2, the first distribution cavity 2101 and the first converging cavity 2105 can be formed between the cover 21 and the bottom plate 23. Figure 11 As shown in FIG. 2, a plurality of first cavities 200 can be formed between the jet plate 22 and the cover 21. Each first cavity 200 is divided into a second distribution cavity 201 and a second converging cavity 203 by the first partition rib 24. Each second distribution cavity 201 is in communication with the first distribution cavity 2101 through at least one distribution hole 2102. Each second converging cavity 203 is in communication with the first converging cavity 2105 through at least one converging hole 2106. The distribution hole 2102 distributes the cooling medium into different second distribution cavities 201, and forms a plurality of parallel flows. The parallel flows of the cooling medium are jetted to the part of the different power devices 10 (as shown in FIG. 1) connected to the bottom plate 23 (as shown in FIG. 2), and then are jetted to the part of the different power devices 10 (as shown in FIG. 1) connected to the cover 21 (as shown in FIG. 2). The different power devices 10 are uniformly cooled. Figure 6 Figure 6 As shown in FIG. 2, the first distribution cavity 2101 and the first converging cavity 2105 can be formed between the cover 21 and the bottom plate 23.

[0099] The above embodiment is taken as an example of three first cavities 200 as shown in FIG. 2. The three first cavities 200 correspond to three power devices 10 (as shown in FIG. 1) respectively. The cooling medium in the second distribution cavity 201 of each first cavity 200 is jetted to the position where the bottom plate 23 and one power device 10 are attached through the jet hole 2201 in communication with the second distribution cavity 201, and then is jetted to the position where the cover 21 and one power device 10 are attached. The power device 10 is cooled. In other embodiments of the present application, the number of the first cavities 200 and the power devices 10 can also be other numbers. The present application is not limited in this respect. Figure 11 Figure 6 In addition, the above embodiment is taken as an example of three distribution holes 2102 and three converging holes 2106 opened in the cover 21 as shown in FIG. 2. Each second distribution cavity 201 is in communication with the first distribution cavity 2101 through one distribution hole 2102. Each second converging cavity 203 is in communication with the first converging cavity 2105 through one converging hole 2106. In other embodiments of the present application, the number of the distribution holes 2102 and the converging holes 2106 can also be other numbers. The present application is not limited in this respect.

[0100] As shown in FIG. 2, the first distribution cavity 2101 and the first converging cavity 2105 can be formed between the cover 21 and the bottom plate 23. Figure 11 As shown in FIG. 2, the first distribution cavity 2101 and the first converging cavity 2105 can be formed between the cover 21 and the bottom plate 23.

[0101] Figure 12 ​​​As shown, the radiator 20 may further include a first guide strip 27. The first guide strip 27 is disposed within the first liquid distribution chamber 2101. The extension direction of the first guide strip 27 is towards at least one liquid distribution hole 2102 from the liquid inlet opening 2103 (e.g., direction M in the figure). The first guide strip 27 is used to quickly guide the cooling medium entering the first liquid distribution chamber 2101 from the liquid inlet opening 2103 to the liquid distribution hole 2102. This increases the flow rate of the cooling medium within the radiator 20, helping to further improve heat dissipation efficiency. When there are multiple liquid distribution holes 2102, the first guide strip 27 can also ensure that the cooling medium is evenly distributed into different liquid distribution holes 2102.

[0102] Continue as Figure 12 As shown, the radiator 20 may further include a second guide bar 28. The second guide bar 28 is disposed within the first manifold 2105. The extension direction of the second guide bar 28 is towards the liquid inlet opening 2103 from at least one liquid collection hole 2106 (e.g., direction N in the figure). The second guide bar 28 is used to quickly guide the cooling medium flowing into the first liquid distribution chamber 2101 from the liquid collection hole 2106 to the liquid outlet opening 2104. This allows the cooling medium to flow out quickly through the liquid outlet opening 2104, increasing the circulation rate and further improving heat dissipation efficiency.

[0103] In addition, continue as Figure 12 As shown, the radiator 20 also includes a second baffle 213, which is located inside the cover 21. The second baffle 213 isolates the first liquid distribution chamber 2101 and the first confluence chamber 2105 from each other, preventing direct exchange of cooling media between the two chambers.

[0104] Furthermore, continue as Figure 12 As shown, the cover 21 may include a partition 211 and a cover plate 212. The partition 211 and the jet plate 22 (as shown) Figure 11 A second liquid distribution chamber 201 is formed between (as shown) Figure 11 (as shown) and the second manifold 203 (as shown) Figure 11 (As shown). The cover plate 212 is located on the side of the partition plate 211 away from the jet plate 22. The liquid inlet opening 2103 and the liquid outlet opening 2104 are both opened on the cover body 21. A first liquid distribution chamber 2101 and a first confluence chamber 2105 are formed between the cover plate 212 and the partition plate 211. The cover plate 212 is located on the side of the partition plate 211 away from the jet plate 22, and the liquid inlet opening 2103 and the liquid outlet opening 2104 are both located on the cover plate 212, that is, the liquid inlet opening 2103 and the liquid outlet opening 2104 are located on the same side of the radiator 20, which facilitates the connection of the radiator 20 with the liquid inlet pipe 50 located on the same side of the radiator 20 (e.g., as shown). Figure 2A (as shown) and outlet pipe 60 (as shown) Figure 2A Connecting the heatsink 20 as shown in the diagram can reduce the difficulty of installing the heatsink 20.

[0105] Exemplarily, the second cavity 2100 is formed between the cover plate 212 and the partition plate 211. The second partition rib 213 is located in the second cavity 2100. The second partition rib 213 divides the second cavity 2100 into the first distribution cavity 2101 and the first flow collection cavity 2105. The second partition rib 213 separates the second distribution cavity 201 and the second flow collection cavity 203, avoiding direct exchange of the cooling medium in the second distribution cavity 201 and the second flow collection cavity 203.

[0106] Further, as shown in Figure 12 , the axis of the liquid inlet opening 2103 and the axis of the liquid outlet opening 2104 can be perpendicular to the partition plate 211. When the pipeline (such as the liquid inlet pipe 50 and the liquid outlet pipe 60 shown in Figure 2A ) of the cooling system is connected with the heat sink 20, the liquid inlet pipe 50 and the liquid outlet pipe 60 are both directed towards the partition plate 211, further improving the installation convenience of the heat sink 20 and the liquid inlet pipe 50 and the liquid outlet pipe 60.

[0107] As shown in Figure 12 , the length direction of the second partition rib 213 is inclined relative to the length direction of the second cavity 2100. That is, along the direction (for example, the direction M in the figure) of the liquid inlet opening 2103 towards the distribution hole 2102, the width of the first distribution cavity 2101 gradually decreases. Further, it is ensured that when the cooling medium flows to the distribution hole 2102 away from the liquid inlet opening 2103, the flow rate of the cooling medium can still be close to the flow rate of the cooling medium flowing in the distribution hole 2102 close to the liquid inlet opening 2103. It is ensured that the flow rates in the plurality of distribution holes 2102 remain balanced, so as to improve the uniformity of heat dissipation of the power device 10.

[0108] On this basis, as shown in Figure 13 , the heat sink 20 further includes a liquid inlet flow channel 29 and a liquid outlet flow channel 30. The liquid inlet flow channel 29 is in communication with the liquid inlet opening 2103 (as shown in Figure 12 ). The liquid outlet flow channel 30 is in communication with the liquid outlet opening 2104 (as shown in Figure 12 ). Along the stacking direction (i.e., the Z-axis direction) of the heat sink 20 and the power device 10 (as shown in Figure 2A ), the port of the liquid inlet flow channel 29 and the port of the liquid outlet flow channel 30 are both away from the heat sink 20. In the X-axis direction, the size of the capacitor 40 (as shown in Figure 2A ), the liquid inlet flow channel 29 and the liquid outlet flow channel 30 overlap. Further, the width size of the power converter 02 can be reduced. In addition, the structure that the port of the liquid inlet flow channel 29 and the port of the liquid outlet flow channel 30 are both away from the heat sink 20 can also facilitate the connection with the cooling medium pipeline (such as the liquid inlet pipe 50 and the liquid outlet pipe 60 shown in Figure 2A ). As shown in Figure 2AAs shown, the inlet pipe 50 is connected to the inlet opening 2103 via the inlet channel 29. The outlet pipe 60 is connected to the outlet opening 2104 via the outlet channel 30. This arrangement ensures that the inlet pipe 50, outlet pipe 60, and capacitor 40 are all located on the same side of the heat sink, thereby reducing the width of the power converter 02.

[0109] like Figure 14 As shown, the cover 21 may further include a first surrounding plate 214. The first surrounding plate 214 is fixedly disposed around the partition 211 or the cover plate 212, and the first surrounding plate 214, the partition 211, and the cover plate 212 together enclose the second cavity 2100. The second partition 213 is also connected to the first surrounding plate 214. Exemplarily, the first surrounding plate 214 and the partition 211 may be an integral structural component. Alternatively, the first surrounding plate 214 may also be an integral structural component with the cover plate 212. Or, the first surrounding plate 214 may be fixed to the partition 211 and the cover plate 212 by welding or by screws (not shown in the figure). The embodiments of this application are not specifically limited.

[0110] Continue as Figure 14 As shown, the radiator 20 may further include a second enclosure 31. The second enclosure 31 is fixedly disposed around the partition 211 or the jet plate 22, and the second enclosure 31, partition 211, and jet plate 22 together enclose the first cavity 200. The first rib 24 is also connected to the second enclosure 31. Exemplarily, the second enclosure 31 and the jet plate 22 may be an integral structural component. Alternatively, the second enclosure 31 may also be an integral structural component with the partition 211. Or, the second enclosure 31, the jet plate 22, and the partition 211 may be an integral structural component manufactured by laser printing. Alternatively, the second enclosure 31 may be fixed to the partition 211 and the jet plate 22 by welding or by screws (not shown in the figure). The embodiments of this application are not specifically limited.

[0111] Furthermore, continuing as Figure 14 As shown, along the direction from the jet plate 22 to the base plate 23, the second enclosure plate 31 protrudes from the jet plate 22. The portion of the second enclosure plate 31 protruding from the jet plate 22, together with the jet plate 22 and the base plate 23, forms the heat dissipation cavity 202.

[0112] Of course, in other embodiments of this application, the edge region of the base plate 23 may also protrude toward the jet plate 22, and the jet plate 22 is connected to the protruding portion. Thus, a heat dissipation cavity 202 is formed between the base plate 23 and the jet plate 22.

[0113] like Figure 15AAs shown, at least one heat sink 20 includes a first heat sink 20A and a second heat sink 20B. The first heat sink 20A includes a first jet plate 22A and a first base plate 23A. The second heat sink 20B includes a second jet plate 22B and a second base plate 23B. The first heat sink 20A and the second heat sink 20B share a cover 21. The base plate 23 may include a first base plate 23A and a second base plate 23B. The jet plate 22 may include a first jet plate 22A and a second jet plate 22B. The first base plate 23A, the first jet plate 22A, the cover 21, the second jet plate 22B, and the second base plate 23B are stacked sequentially along the first direction Z. Some power devices 10 are disposed on the side of the first base plate 23A away from the cover 21, and other power devices 10 are disposed on the side of the second base plate 23B away from the cover 21. Figure 16 ( Figure 15A As shown in the cross-sectional view along the direction of Q1-Q2, along the first direction Z, liquid distribution holes 2102 and liquid collection holes 2106 can be opened on both sides of the bottom wall of the cover 21. Continuing as... Figure 15A As shown, a liquid inlet 2103 and a liquid outlet 2104 can be provided on the side wall of the cover 21. The liquid inlet 2103 is connected to the first liquid distribution chamber 2101, and the liquid outlet 2104 is connected to the first confluence chamber 2105.

[0114] After the cooling medium flows into the first distribution chamber 2101 through the inlet opening 2103, it passes through different distribution holes 2102 on the upper and lower sides (such as...). Figure 16 (As shown) The cooling medium is diverted into the first radiator 20A and the second radiator 20B. A portion of the cooling medium enters the second distribution chamber 201 between the first jet plate 22A and the cover 21, and flows through the jet holes 2201 on the first jet plate 22A into the heat dissipation chamber 202 between the first jet plate 22A and the first base plate 23A, thereby dissipating heat from the power devices 10 on the first base plate 23A. The cooling medium that has completed heat exchange flows back into the second confluence chamber 203 between the first jet plate 22A and the cover 21 through the return holes 2202 on the first jet plate 22A, and then through the confluence holes 2106 on the cover 21 (as shown). Figure 16The cooling medium (as shown) flows to the first confluence chamber 2105 and finally flows out through the liquid collection hole 2106. Another portion of the cooling medium enters the second distribution chamber 201 between the second jet plate 22B and the cover 21, and is injected through the jet holes 2201 on the second jet plate 22B into the heat dissipation chamber 202 between the second jet plate 22B and the second base plate 23B, thereby dissipating heat from the power devices 10 on the second base plate 23B. Similarly, the cooling medium that has completed heat exchange flows through the return hole 2202 on the second jet plate 22B, the second confluence chamber 203 between the second jet plate 22B and the cover 21, the liquid collection hole 2106, and the first confluence chamber 2105, finally flowing out through the liquid collection hole 2106. This allows the radiator 20 to simultaneously dissipate heat from multiple power devices 10 on both the upper and lower sides.

[0115] Continue as Figure 15A As shown, the cover 21 may include a first partition 211A and a second partition 211B. The first partition 211A is located between the first jet plate 22A and the second partition 211B. The cooling medium can pass through the distribution hole 2102 on the first partition 211A (e.g., Figure 16 (As shown) the cooling medium enters the second distribution chamber 201 between the first jet plate 22A and the first baffle 211A. The cooling medium can also enter through the distribution holes 2102 on the second baffle 211B (as shown). Figure 16 (As shown) it enters the second liquid distribution chamber 201 between the second jet plate 22B and the second partition plate 211B.

[0116] On this basis, continue as Figure 15A As shown, the radiator 20 may further include an inlet channel 29 and an outlet channel 30. Along a direction parallel to the first base plate 23A, the inlet channel 29 is located on the first side c of the cover 21, and an inlet opening 2103 is formed on the first side c of the cover 21. The inlet channel 29 communicates with the inlet opening 2103. Along a direction parallel to the first base plate 23A, the outlet channel 30 is located on the second side d of the cover 21, and an outlet opening 2104 is formed on the second side d of the cover 21. The outlet channel 30 communicates with the outlet opening 2104. The first radiator 20A and the second radiator 20B share the cover 21, the inlet channel 29, and the outlet channel 30. This facilitates the supply and recovery of the cooling medium to the first radiator 20A and the second radiator 20B.

[0117] like Figure 15B As shown, the inlet pipe 50 connects to the inlet opening 2103 via the inlet flow channel 29 (e.g., ...). Figure 15A (As shown) is connected. The outlet pipe 60 is connected to the outlet opening 2104 (as shown) through the outlet flow channel 30. Figure 15A (As shown) connected. And continuing as... Figure 15AAs shown, the port a of the inlet channel 29 facing away from the inlet opening 2103 and the port b of the outlet channel 30 facing away from the outlet opening 2104 have the same orientation. In the X-axis direction, the capacitor 40 (as shown) Figure 2A As shown), the dimensions of port a of the inlet channel 29 and port b of the outlet channel 30 overlap. This allows for a reduction in the width of the power converter 02. Furthermore, the structure where both the ports of the inlet channel 29 and the outlet channel 30 are positioned away from the radiator 20 facilitates connection with cooling medium piping (such as...). Figure 15B The inlet pipe 50 and outlet pipe 60 shown are connected. This reduces the assembly difficulty of the power converter 02.

[0118] For example Figure 15B As shown, along the Z-axis direction, there are inlet pipe 50, outlet pipe 60, and capacitor 40 (e.g.) Figure 2A (As shown) are all located on the same side of the heat sink 20. This is beneficial for the width dimension along the X-axis and the length dimension along the Y-axis of the power converter 02. It is also beneficial for the miniaturization of the power converter 02.

[0119] like Figure 17A As shown, at least one heat sink 20 includes a first heat sink 20A and a second heat sink 20B. The first heat sink 20A and the second heat sink 20B are respectively disposed on opposite sides of the power device 10. The first heat sink 20A includes a first cover 21A, a first jet plate 22A, and a first base plate 23A. The second heat sink 20B includes a second cover 21B, a second jet plate 22B, and a second base plate 23B. The first base plate 23A and the second base plate 23B are respectively connected to the power device 10. In this way, the power device 10 can be cooled from both sides, further improving the heat dissipation effect of the power device 10.

[0120] On this basis, continue as Figure 17A As shown, the radiator 20 may further include an inlet channel 29 and an outlet channel 30. Along a direction parallel to the first base plate 23A, the inlet channel 29 and the outlet channel 30 are disposed on both sides of the second cover 21B. The inlet openings 2103 of the first cover 21A and the second cover 21B can connect to the inlet pipe 50 (e.g., through the same inlet channel 29) via the same inlet channel 29. Figure 2A (As shown) are connected. The liquid outlet openings 2104 of the first cover 21A and the second cover 21B can be connected to the liquid outlet pipe 60 through the same liquid outlet channel 30 (as shown). Figure 2A (As shown) are connected. That is, the first radiator 20A and the second radiator 20B share the inlet channel 29 and the outlet channel 30. This facilitates the supply and recovery of the cooling medium to the first radiator 20A and the second radiator 20B. The port of the inlet channel 29 and the port of the outlet channel 30 face the same direction. In the X-axis direction, the capacitor 40 (as shown) Figure 2AAs shown), the dimensions of port a of the inlet channel 29 and port b of the outlet channel 30 overlap. This allows for a reduction in the width of the power converter 02. Furthermore, the structure where both the ports of the inlet channel 29 and the outlet channel 30 are positioned away from the radiator 20 facilitates connection with cooling medium piping (such as...). Figure 2A The inlet pipe 50 and outlet pipe 60 shown are connected. This reduces the assembly difficulty of the power converter 02.

[0121] In addition, such as Figure 17B As shown, along the Z-axis, the inlet pipe 50, outlet pipe 60, and capacitor 40 are all located on the same side of the heat sink 20. This is beneficial for the width dimension along the X-axis and the length dimension along the Y-axis of the power converter 02. It also facilitates the miniaturization of the power converter 02.

[0122] like Figure 18 As shown, the radiator 20 may further include a flow-blocking wall 32. The flow-blocking wall 32 is located within the heat dissipation cavity 202 and is connected to the base plate 23. The flow-blocking wall 32 divides the heat dissipation cavity 202 into multiple heat dissipation sub-cavities 2021. Each heat dissipation sub-cavity 2021 communicates with at least one jet hole 2201 and at least one return hole 2202. The flow-blocking wall 32 can absorb the heat transferred from the base plate 23. When the cooling medium flows and impacts the flow-blocking wall 32, it can exchange heat with the flow-blocking wall 32, improving the heat dissipation effect. After the cooling medium flows into the heat dissipation sub-cavities 2021 through the jet holes 2201, the flow-blocking wall 32 can prevent the cooling medium flows in different heat dissipation sub-cavities 2021 from colliding with each other, thus reducing the flow rate loss of the cooling medium and avoiding affecting the heat dissipation efficiency.

[0123] To further improve the heat dissipation effect of radiator 20, such as Figure 19 As shown, the radiator 20 may also include heat dissipation teeth 33. The heat dissipation teeth 33 are located within the heat dissipation cavity 202. The heat dissipation teeth 33 are connected to the base plate 23. The heat dissipation teeth 33 can increase the contact area with the cooling medium, slow down the flow rate of the cooling medium, thereby achieving sufficient heat exchange and improving the heat dissipation effect. The vertical projection of the jet hole 2201 on the base plate 23 does not overlap with the vertical projection of the heat dissipation teeth 33 on the base plate 23. The cooling medium flowing into the heat dissipation cavity 202 from the jet hole 2201 can directly impact the base plate 23, and then flow to the surrounding heat dissipation teeth 33 structure, thereby ensuring that the cooling medium can fully contact the base plate 23 and the heat dissipation teeth 33, improving the heat dissipation effect.

[0124] like Figure 20 As shown, the opening of the jet hole 2201 facing the base plate 23 can be cross-shaped. When the cooling medium flows into the heat dissipation cavity 202 through the cross-shaped opening, it is beneficial for the cooling medium to diffuse outward in a direction parallel to the surface of the base plate 23, thereby carrying away the heat on the base plate 23 and improving the heat dissipation efficiency.

[0125] Continue asFigure 20 As shown, the cross-shaped jet hole 2201 is provided with a plurality of second flow resistance teeth 26 around the side. The cooling medium can flow into the jet hole 2201 more.

[0126] Of course, in the embodiment of the present application, the jet hole 2201 can also be a circular hole as shown. Figure 21 Alternatively, the jet hole 2201 can also be a square hole, an oval hole, etc., which is not limited in the present application.

[0127] Similarly, in the embodiment of the present application, the backflow hole 2202 can be a circular hole as shown. Figure 20 Alternatively, the backflow hole 2202 can also be a strip-shaped hole as shown. Figure 21 Alternatively, the backflow hole 2202 can also be a square hole, an oval hole, etc., which is not limited in the present application.

[0128] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power converter having a multi-layered flow channel heat sink structure, characterized by, A heat sink comprising at least one multilayer flow channel, the heat sink comprising a cover, a jet plate and a bottom plate arranged in layers, and a power device arranged on a side of the bottom plate away from the cover; The cover has a first distribution cavity; a second distribution cavity is formed between the jet plate and the cover, and a heat dissipation cavity is formed between the bottom plate and the jet plate; A distribution hole is formed on a side of the cover close to the jet plate, and the first distribution cavity communicates with the second distribution cavity through the distribution hole; A plurality of jet holes are formed on a portion of the jet plate located in the second distribution cavity, and the second distribution cavity communicates with the heat dissipation cavity through the jet holes; the vertical projection of the distribution hole on the surface of the jet plate away from the bottom plate falls outside the jet holes.

2. The power converter of claim 1, wherein, The number of the jet holes is greater than the number of the distribution holes.

3. A power converter as claimed in claim 1 or 2, characterised in that, An inlet opening and an outlet opening are formed on the cover, the inlet opening communicates with the first distribution cavity; the cover also has a first confluence cavity, which is isolated from the first distribution cavity, and the first confluence cavity communicates with the outlet opening; A second confluence cavity is also formed between the jet plate and the cover, which is isolated from the second distribution cavity, and a backflow hole is also formed on a portion of the jet plate located in the second confluence cavity, and the heat dissipation cavity communicates with the second confluence cavity through the backflow hole; A confluence hole is formed on a side of the cover close to the jet plate, and the second confluence cavity communicates with the first confluence cavity through the confluence hole.

4. The power converter of claim 3, wherein, The heat sink also comprises a first partition rib, which is arranged between the cover and the jet plate and connected with the cover and the jet plate respectively, and the first partition rib isolates the second distribution cavity and the second confluence cavity from each other; The heat sink also comprises a second partition rib, which is located in the cover and isolates the first distribution cavity and the first confluence cavity from each other.

5. The power converter of claim 4, wherein, The first partition rib comprises a plurality of concave-convex structures along the width direction of the heat sink, the plurality of concave-convex structures separate the second distribution cavity into a plurality of sub-distribution cavities arranged at intervals and separate the second confluence cavity into a plurality of sub-confluence cavities arranged at intervals, and the sub-distribution cavities and the sub-confluence cavities are arranged alternately along the length direction of the heat sink; At least one jet hole is formed on a portion of the jet plate located in each of the sub-distribution cavities, and at least one backflow hole is formed on a portion of the jet plate located in each of the sub-confluence cavities.

6. A power converter according to any of claims 3-5, characterized in that, The distribution hole is a plurality of distribution holes, and the plurality of distribution holes are arranged along the side wall of the first distribution cavity; the confluence hole is a plurality of confluence holes, and the plurality of confluence holes are arranged along the side wall of the first confluence cavity.

7. A power converter according to any of claims 3-6, characterized in that, The heat sink also comprises a flow resistance tooth, which is located in the second distribution cavity, connected with the jet plate and protrudes in the direction of the jet plate facing the cover.

8. A power converter as claimed in any of claims 3 to 7, characterised in that, The heat sink also comprises a first flow guide strip, which is arranged in the first distribution cavity, and the extension direction of the first flow guide strip is the direction of the inlet opening towards at least one distribution hole.

9. A power converter according to any of claims 3-8, characterized in that The cover comprises a partition plate and a cover plate, the second distribution cavity and the second flow cavity are formed between the partition plate and the jet plate, the cover plate is located on the side of the partition plate away from the jet plate, and the first distribution cavity and the first flow cavity are formed between the cover plate and the partition plate. The liquid inlet opening and the liquid outlet opening are both arranged on the cover plate.

10. A power converter as claimed in any of claims 3 to 9, characterised in that, The at least one heat sink comprises a first heat sink and a second heat sink, the first heat sink comprises a first jet plate and a first bottom plate, the second heat sink comprises a second jet plate and a second bottom plate, and the first heat sink and the second heat sink share the cover. The first bottom plate, the first jet plate, the cover, the second jet plate and the second bottom plate are sequentially stacked in a first direction, part of the power devices are arranged on the side of the first bottom plate away from the cover, and the other part of the power devices are arranged on the side of the second bottom plate away from the cover. In the first direction, the distribution hole and the flow hole are arranged on both sides of the cover, the liquid inlet opening and the liquid outlet opening are arranged on the side wall of the cover, the liquid inlet opening is communicated with the first distribution cavity, and the liquid outlet opening is communicated with the first flow cavity.

11. A power converter as claimed in any of claims 3 to 9, characterised in that, The at least one heat sink comprises a first heat sink and a second heat sink, the first heat sink and the second heat sink are arranged on opposite sides of the power device respectively, and the bottom plate of the first heat sink and the bottom plate of the second heat sink are connected with the power device respectively.

12. The power converter of claim 10 or 11, wherein, The heat sink further comprises: The liquid inlet flow channel is arranged on the first side of the cover in a direction parallel to the bottom plate, the liquid inlet opening is arranged on the first side of the cover, and the liquid inlet flow channel is communicated with the liquid inlet opening; The liquid outlet flow channel is arranged on the second side of the cover in a direction parallel to the bottom plate, the liquid outlet opening is arranged on the second side of the cover, and the liquid outlet flow channel is communicated with the liquid outlet opening; The port of the liquid inlet flow channel away from the liquid inlet opening and the port of the liquid outlet flow channel away from the liquid outlet opening are in the same direction, and the first heat sink and the second heat sink share the liquid inlet flow channel and the liquid outlet flow channel.

13. The power converter of any of claims 3-12, wherein, The heat sink further comprises a flow resistance wall, the flow resistance wall is located in the heat dissipation cavity and connected with the bottom plate, and the flow resistance wall divides the heat dissipation cavity into a plurality of heat dissipation sub-cavities, each heat dissipation sub-cavity is communicated with at least one jet hole and at least one backflow hole.

14. The power converter of any of claims 1-13, wherein, The heat sink further comprises a heat dissipation tooth, the heat dissipation tooth is located in the heat dissipation cavity and connected with the bottom plate; The vertical projection of the jet hole on the bottom plate and the vertical projection of the heat dissipation tooth on the bottom plate do not overlap.

15. The power converter of any of claims 3-14, wherein, The heat sink further comprises a liquid inlet flow channel and a liquid outlet flow channel, the liquid inlet flow channel is communicated with the liquid inlet opening, the liquid outlet flow channel is communicated with the liquid outlet opening, and the ports of the liquid inlet flow channel and the liquid outlet flow channel are both away from the heat sink in the stacking direction of the heat sink and the power device. The power converter further comprises a capacitor, along the stacking direction of the heat sink and the power device, the capacitor, the inlet liquid flow channel port and the outlet liquid flow channel port are located on the same side of the heat sink.

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