Linear cutting cooling device, linear cutting equipment and linear cutting method

Abstract

The invention provides a wire cutting cooling device, wire cutting equipment and a wire cutting method, and belongs to the technical field of silicon wafer cutting equipment.The wire cutting cooling device comprises a cutting fluid tank, a flow guide plate and an adjusting mechanism; the adjusting mechanism is connected to the cutting fluid tank and comprises a connecting base, a rotating assembly and a lifting assembly, and the connecting base is connected with the cutting fluid tank in a clamped mode; one end of the rotating component is connected with the connecting seat which is driven to rotate by the rotating driver; the lifting assembly is connected to the other end of the rotating assembly and drives the rotating assembly to move through a lifting driver. The wire cutting equipment comprises the wire cutting cooling device, a detection mechanism and a control system, and the control system controls the wire cutting cooling device to operate so as to adjust the drop point of the cooling liquid. The position and the angle of the flow guide plate can be adjusted according to the specifications and the cutting process of different single crystal silicon rods, the falling point of cooling liquid can be adjusted accordingly, it is guaranteed that the cooling liquid fully participates in the cutting process, and the cutting quality of silicon wafers is improved; the whole cutting device is simple in structure, stable in connection, convenient to use and capable of achieving continuous automatic operation.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of silicon wafer cutting equipment, in particular to a wire cutting cooling device and a wire cutting method thereof. BACKGROUND

[0002] The cooling device is an essential accessory in the process of silicon wafer cutting. The cooling liquid cools and lubricates the steel wire through the cooling device, aiming to reduce the heat generated by the friction between the steel wire and the silicon wafer, and to clean the silicon powder wrapped on the surface of the steel wire and the silicon powder between the silicon wafers, so as to improve the lubricating effect of the steel wire, ensure the cutting speed of the steel wire, and reduce the wire breakage rate. At present, the cooling is mainly carried out in a large-flow overflow mode. However, due to the fixed position of the current cooling device, the angle and distance of the sprayed cutting liquid are also unchanged. With the change of the wire bow during the cutting process, the sprayed cutting liquid often deviates from the single crystal silicon rod, resulting in insufficient lubrication and cooling of the steel wire, and thus causing wire breakage and silicon wafer surface defects, which leads to unstable quality of the cut silicon wafers and cannot guarantee the yield. In addition, the cooling device needs to be adjusted to provide operating space during the lifting and preparation stage. The existing technology usually manually lifts the spray pipe after the cutting is completed, and then lowers the spray pipe during cutting. This method cannot be adjusted during the cutting process, and the disassembly and assembly of the spray pipe are time-consuming and affect the cutting efficiency. Moreover, the frequent disassembly and assembly of the spray pipe inevitably cause its position to gradually deviate, resulting in the sprayed cutting liquid not being accurately sprayed onto the steel wire. SUMMARY

[0003] To solve the above technical problems, the present application provides a wire cutting cooling device, a wire cutting equipment and a wire cutting method, which can automatically adjust the position and angle of the cutting liquid tank and the deflector according to the cutting process, thereby adjusting the landing point of the cooling liquid, so that the diamond wire in the whole cutting process is in the best liquid state, and the cutting quality of the silicon wafer is improved.

[0004] The technical solution adopted by the present application is: a wire cutting cooling device, comprising a cutting liquid tank and a deflector arranged at the liquid outlet of the cutting liquid tank, further comprising an adjusting mechanism connected to the cutting liquid tank, comprising a rotating assembly and a lifting assembly, respectively used for adjusting the angle and position of the cutting liquid tank.

[0005] Further, the adjusting mechanism further comprises a connecting seat, the connecting seat is connected with the cutting liquid tank; the rotating assembly is connected with the connecting seat, and the connecting seat is driven to rotate by a rotating driver.

[0006] Further, the rotating assembly comprises a rotating shaft, the rotating shaft is driven to rotate by the rotating driver, and one end of the rotating shaft is connected with the connecting seat.

[0007] Further, the rotating assembly further comprises a rotating sleeve, and the rotating shaft is connected with the connecting seat through one end of the rotating sleeve.

[0008] Further, the lifting assembly comprises a lifting block, a guide rod and a lifting driver, the lifting block is connected with the rotating assembly, the guide rod is movably connected with the lifting block, and the lifting driver drives the lifting block to move along the guide rod.

[0009] Further, the guide rod is threadedly connected with the lifting block, and the lifting driver is connected with the guide rod and drives the guide rod to rotate.

[0010] Further, the connecting seat comprises a first adjusting clamping base provided with a connecting groove, and the cutting liquid tank is provided with an ear plate at two ends, and the ear plate can be clamped into the connecting groove through the opening of the connecting groove.

[0011] Further, the connecting seat further comprises a second adjusting clamping base, and the second adjusting clamping base and the first adjusting clamping base are provided with a clamping strip and a guide groove matched with each other for clamping; and the guide groove is perpendicular to the connecting groove.

[0012] A wire cutting device provided with the wire cutting cooling device, further comprising a detection mechanism for detecting the wire bow of the diamond wire in the cutting process, and a control system receiving the signal of the detection mechanism and controlling the operation of the wire cutting cooling device to adjust the falling point of the cooling liquid.

[0013] A wire cutting method using the wire cutting device, comprising the following steps:

[0014] In the cutting preparation stage, the height and angle of the cutting liquid tank are adjusted according to the specification of the single crystal silicon rod, so that the guide plate is in the initial position and the included angle with the horizontal direction is θ1;

[0015] In the cutting preparation stage, the height and angle of the cutting liquid tank are adjusted according to the specification of the single crystal silicon rod, so that the guide plate is in the initial position and the included angle with the horizontal direction is θ1;

[0016] In the main cutting stage, when the included angle between the diamond wire and the horizontal direction is θ2, the guide plate is driven to rotate by an angle δ1, and δ1 is equal to θ2 in size;

[0017] In the main cutting stage, when the included angle between the diamond wire and the horizontal direction is θ2, the guide plate is driven to rotate by an angle δ1, and δ1 is equal to θ2 in size;

[0018] In the main cutting stage, when the included angle between the diamond wire and the horizontal direction is θ2, the guide plate is driven to rotate by an angle δ1, and δ1 is equal to θ2 in size;

[0019] In the preparation stage of the slicing process, the guide plate is driven to rise to a second position, which is higher than the initial position.

[0020] The present application has the advantages and positive effects that: due to the above technical scheme, the position and angle of the cutting liquid tank and the guide plate can be adjusted according to different specifications of the single crystal silicon rod and the slicing process, the falling point of the cooling liquid can be adjusted accordingly, the cooling liquid can fully participate in the slicing process, the diamond wire is cooled and lubricated, the diamond wire in the whole slicing process is in the best liquid state, and the slicing quality of the silicon wafer is improved; by setting the first connecting seat and the connecting groove, the cooling of the single crystal silicon rod of various specifications during slicing can be realized; by setting the adjusting mechanism, the cutting liquid tank and the guide plate are moved and rotated, and the falling point of the cooling liquid can be adjusted according to the slicing process; the cutting device has simple structure, stable connection and convenient use, and can realize continuous automatic operation. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of a specific embodiment of the present application;

[0022] Figure 2 is a structural side view of a specific embodiment of the present application;

[0023] Figure 3 is a structural schematic diagram of an adjusting mechanism of a specific embodiment of the present application;

[0024] Figure 4 is a structural schematic diagram of a connecting seat of a specific embodiment of the present application;

[0025] Figure 5 is a structural schematic diagram of a first adjusting seat of a specific embodiment of the present application;

[0026] Figure 6 is a structural schematic diagram of a first adjusting seat of a specific embodiment of the present application.

[0027] Figure 7 is a wire cutting device and its use schematic diagram of a specific embodiment of the present application.

[0028] In the drawings:

[0029] 10, cutting liquid tank 20, spray pipe 30, guide plate

[0030] 40, adjusting mechanism 41, connecting seat 411, first adjusting seat

[0031] 4111, connecting groove 4112, clamping strip 412, second adjusting seat

[0032] 4121, connecting plate 4122, connecting block 4123, guide groove

[0033] 42. Rotating assembly; 421. Rotating shaft; 422. Rotating outer sleeve.

[0034] 423, Rotary drive; 43, Lifting assembly; 431, Lifting block

[0035] 432, Guide rod; 433, Lifting driver; 50, Mounting panel

[0036] 51. Limiting block; 60. Main roller; 70. Diamond wire.

[0037] 80, Material holder; 90, Single crystal silicon rod; 100, Testing agency Detailed Implementation

[0038] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0039] like Figure 1 , Figure 2 As shown, this invention proposes a wire cutting cooling device for silicon wafer wire cutting equipment, including a cutting liquid tank 10 and a guide plate 30 disposed at the outlet of the cutting liquid tank 10. A nozzle 20 is provided inside the cutting liquid tank 10. During use, coolant enters the nozzle 20 from the inlet pipe, then flows out of the nozzle 20 and into the cutting liquid tank 10, gradually rising within the tank before flowing out from the outlet and along the guide plate 30 to the monocrystalline silicon rod 90 and diamond wire 70, cooling and lubricating the diamond wire 70. The wire cutting cooling device proposed in this application can adjust the position and angle of the cutting liquid tank 10 and the guide plate 30 according to the cutting process, allowing the coolant's landing point to be adjusted according to the positions of the monocrystalline silicon rod 90 and the diamond wire 70. This ensures that the coolant fully participates in the cutting process, cooling and lubricating the diamond wire 70, keeping the diamond wire 70 in an optimal liquid-laden state throughout the entire cutting process, thus improving the cutting quality of the silicon wafer.

[0040] A wire EDM cooling device, such as Figure 1 , Figure 2 As shown, the device includes a cutting fluid tank 10, a guide plate 30, and an adjustment mechanism 40. The cutting fluid tank 10 and the guide plate 30 are existing technologies and will not be described in detail here. The adjustment mechanism 40 is connected to the cutting fluid tank 10 and includes a rotating component 42 and a lifting component 43, which are used to adjust the angle and position of the cutting fluid tank 10, so that the coolant can be sprayed onto the monocrystalline silicon rod 90 and the diamond wire 70 throughout the cutting process.

[0041] Further, the adjusting mechanism 40 further comprises a connecting seat 41 which is clamped with the cutting liquid tank 10; a rotating assembly 42 is connected with the connecting seat 41, and the rotating assembly 42 comprises a rotating driver 423 which drives the connecting seat 41 to rotate, thereby driving the cutting liquid tank 10 to rotate synchronously, so as to adjust the angle of the guide plate 30, and finally adjust the spraying angle of the cooling liquid.

[0042] Further, the rotating assembly 42 comprises a rotating shaft 421, as shown in the figure, the rotating shaft 421 is driven to rotate by the rotating driver 423, and one end of the rotating shaft 421 is connected with the connecting seat 41. Figure 3

[0043] Specifically, the rotating shaft 421 is arranged along the length direction of the cutting liquid tank 10, one end of the connecting seat 41 is connected with the output end of the rotating shaft 421, and the other end is connected with the side end surface of the cutting liquid tank 10, so that the cutting liquid tank 10 can rotate around the axis line where the rotating shaft 421 is arranged, thereby driving the guide plate 30 to rotate synchronously, and adjusting the spraying angle of the cooling liquid.

[0044] Further, the rotating assembly 42 further comprises a rotating sleeve 422, the rotating shaft 421 is arranged in the rotating sleeve 422, one end of the rotating shaft 421 penetrates through the rotating sleeve 422 and is connected with the connecting seat 41; and the rotating sleeve 422 is connected with the lifting assembly 43. The rotating sleeve 422 fixes and protects the rotating shaft 421 inside, and realizes the stable connection between the rotating assembly 42 and the connecting seat 41.

[0045] The position of the rotating driver 423 in the application is not limited, which can be arranged in the rotating sleeve 422 or outside the rotating sleeve 422.

[0046] The rotating sleeve 422 and the connecting seat 41 have a gap therebetween, and the connecting seat 41 will not rub against the rotating sleeve 422 when the connecting seat 41 is driven to rotate by the rotating shaft 421.

[0047] In a specific embodiment, in order to avoid that the length of the adjusting mechanism 40 is too long to affect the length of the whole device, the lifting assembly 43 and the connecting seat 41 are arranged at opposite ends of the rotating sleeve 422, the rotating driver 423 is arranged outside the rotating sleeve 422 and between the lifting assembly 43 and the connecting seat 41, and is connected with the rotating shaft 421 through a steering device, which is more conducive to saving space; according to actual needs, the rotating driver can be arranged in a housing, and the housing is detachably connected with the rotating sleeve 422, which is convenient for assembling the whole device and protecting the rotating driver 423.

[0048] Further, the lifting assembly 43 comprises a lifting block 431, a guide rod 432 and a lifting driver 433, as shown in the figure. Figure 3 ​As shown, the lifting block 431 is connected with the rotating assembly 42, and the lifting assembly 43 is stably connected with the rotating assembly 42; the guide rod 432 is movably connected with the lifting block 431, and the lifting driver 433 can drive the lifting block 431 to move along the guide rod 432.

[0049] Specifically, the lifting block 431 is connected to the other end of the rotating assembly 42 opposite to the connecting seat 41, and the guide rod 432 is perpendicular to the rotating shaft 421 and passes through the lifting block 431. When the lifting block 431 moves along the guide rod 432, the rotating assembly 42, the connecting seat 41 and the cutting liquid tank 10 can be driven to move synchronously, and finally the guide plate 30 can move along the length direction of the guide rod 432. At the same time, through the rotating assembly 42, the guide plate 30 can rotate around a fixed axis perpendicular to the guide rod 432. It can be understood that the fixed axis coincides with the axis of the rotating shaft 421.

[0050] In the present application, the lifting driver 433 drives the rotating assembly 42 to move, and then drives the connecting seat 41 and the cutting liquid tank 10 to move, so as to adjust the position of the guide plate 30. Finally, through the cooperation of the rotating assembly 42 and the lifting assembly 43, the position and angle of the cutting liquid tank 10 and the guide plate 30 are adjusted, so that the cooling liquid can be sprayed on the single crystal silicon rod 90 and the diamond wire 70 during the cutting process.

[0051] The lifting block 431, the guide rod 432 and the lifting driver 433 in the present application can adopt sliding fit, thread fit or gear fit in the prior art or other setting methods, which can be selected according to actual needs, as long as the lifting block 431 can move along the guide rod 432.

[0052] Specifically, as shown in Figure 1 , Figure 2 and Figure 3 , the cutting liquid tank 10 is usually a cuboid structure, the guide plate 30 is longitudinally arranged along the length direction thereof, the connecting seat 41 is oppositely arranged outside the two side end faces of the cutting liquid tank 10 in the length direction, and the distance between the two is matched with the length of the cutting liquid tank 10, so that the cutting liquid tank 10 can be installed in the connecting seat 41 in a clamping manner, achieving convenient installation and disassembly. The rotating assembly 42 is arranged at the other end of the connecting seat 41 opposite to the cutting liquid tank 10, and the lifting assembly 43 is arranged at the other end of the rotating assembly 42 opposite to the connecting seat 41, so that the adjusting mechanism 40 can extend along the direction of the cutting liquid tank 10, the overall layout is more compact, and the space occupation is reduced.

[0053] In a preferred embodiment, the guide rod 432 is threadedly connected with the lifting block 431, the lifting driver 433 is connected with the guide rod 432 and drives the guide rod 432 to rotate, so that the lifting block 431 can move along the guide rod 432.

[0054] Specifically, the lifting driver 433 can be arranged at one end of the guide rod 432 or connected to the guide rod 432 through a steering gear; as Figure 2 shown, the mounting seat of the lifting driver 433 is arranged on the mounting plate of the wire cutting equipment; in one specific embodiment, the guide rod 432 is arranged along the height direction of the wire cutting equipment and parallel to the mounting plate, the lifting driver 433 is arranged at one end of the guide rod 432, the rotating shaft of the lifting driver 433 is connected to the guide rod 432, and the mounting plate is further provided with a limiting block 51 connected to the other end of the guide rod 432 relative to the lifting driver 433, for limiting the guide rod 432 from being deviated and limiting the lifting block 431 from moving between the lifting driver 433 and the limiting block 51.

[0055] In another embodiment of the present application, when the mounting seat of the lifting driver 433 is arranged on the mounting plate of the wire cutting equipment, the rotating shaft thereof is perpendicular to the mounting plate and the guide rod 432, and is threadedly connected to the guide rod 432 through a steering gear to drive the guide rod 432 to rotate.

[0056] As shown in the drawings, Figure 4 the connecting seat 41 in the present application includes a first adjusting clamping seat 411 provided with a connecting groove 4111; the cutting liquid tank 10 is provided with an ear plate at both ends, which can be clamped into the connecting groove 4111 through the opening of the connecting groove 4111.

[0057] Specifically, the ear plate is arranged at the side end plate of the cutting liquid tank 10 and protrudes outward; the ear plate is arranged along the height direction of the cutting liquid tank 10, and the connecting groove 4111 is a U-shaped groove with the same width as the thickness of the ear plate, so that the ear plate can enter the bottom of the connecting groove 4111 from the opening of the connecting groove 4111, and the operator can conveniently fix the cutting liquid tank 10 to the first adjusting clamping seat 411; in order to ensure that the cutting liquid tank 10 will not fall out of the connecting groove 4111 during movement and rotation, the ear plate and the connecting groove 4111 are further provided with matching through holes and are fixed by bolts.

[0058] Further, as shown in the drawings, Figure 4 the above connecting groove 4111 is provided with multiple connecting grooves 4111 with different depths. Specifically, the first adjusting clamping seat 411 is provided with multiple connecting grooves 4111, the depths of the connecting grooves 4111 are arranged along the height direction of the cutting liquid tank 10, and the multiple connecting grooves 4111 are distributed along the width direction of the cutting liquid tank 10; in use, the cutting liquid tank 10 is clamped into different connecting grooves 4111, which can adjust the position of the cutting liquid tank 10 in the height direction and the width direction, and further adjust the position of the flow guide plate 30, so as to realize the adjustment of the spraying position of the cutting liquid.

[0059] In a specific embodiment, the connection groove 4111 is arranged to match different specifications of the single crystal silicon rod 90. When cutting the single crystal silicon rod 90 of different specifications using the wire cutting device, the cutting liquid tank 10 is clamped into the corresponding connection groove 4111, so that the cutting liquid tank 10 can realize the position change along the length direction of the guide rod 432, the position change along the width direction of the cutting liquid tank 10, and the rotation around a fixed shaft along the length direction of the cutting liquid tank 10. Through the cooperation of the connection groove 4111, the rotating assembly 42 and the driving assembly, the cutting liquid can be accurately sprayed on the single crystal silicon rod 90 and the diamond wire 70 in the cutting process of the single crystal silicon rod 90 of different specifications.

[0060] Further, the connecting seat 41 further comprises a second adjusting clamping seat 412. The second adjusting clamping seat 412 and the first adjusting clamping seat 411 are provided with a clamping strip 4112 and a guide groove 4123 matched with each other. The guide groove 4123 is arranged perpendicularly to the connection groove 4111. The other side of the second adjusting clamping seat 412 is connected with the rotating assembly 42.

[0061] Specifically, as shown in Figure 5 , Figure 6 The one side of the first adjusting clamping seat 411 is provided with the connection groove 4111 and connected with the cutting liquid tank 10. The opposite side is connected with the second adjusting clamping seat 412. The two are respectively provided with the clamping strip 4112 and the guide groove 4123. The clamping strip 4112 is clamped in the guide groove 4123 and can move along the guide groove 4123. The direction of the guide groove 4123 is perpendicular to the connection groove 4111, that is, the guide groove 4123 is arranged along the width direction of the cutting liquid tank 10. In use, the relative position of the clamping strip 4112 and the guide groove 4123 can be adjusted as needed, so that the adjusting mechanism 40 can better adjust the position of the cutting liquid tank 10 to adapt to the single crystal silicon rod 90 of different specifications.

[0062] In a specific embodiment, the clamping strip 4112 is arranged on the first adjusting clamping seat 411. The second adjusting clamping seat 412 is provided with the guide groove 4123. To realize the stable connection of the first adjusting clamping seat 411 and the second adjusting clamping seat 412, the two are provided with matched holes and can be fixed by bolts. Or the first adjusting clamping seat 411, the second adjusting clamping seat 412 and the cutting liquid tank 10 are all provided with matched holes and can be connected together by bolts. The overall structure is more stable and is convenient for assembly, maintenance and replacement.

[0063] In the embodiment, the number of the clamping strip 4112 and the guide groove 4123 can be arranged as needed.

[0064] In a preferred embodiment, as shown in Figure 6As shown, the second adjusting bracket 412 includes a connecting plate 4121 and connecting blocks 4122 respectively disposed at opposite ends of the connecting plate 4121. The two connecting blocks 4122 are disposed on the same side of the second adjusting bracket 412 and are spaced apart. A guide groove 4123 is constructed on the connecting block 4122 and can cooperate with the locking strip 4112 of the first adjusting bracket 411. The connecting plate 4121 is provided with a mounting hole that cooperates with the rotating shaft 421. The rotating shaft 421 is connected to the connecting plate 4121 through the mounting hole. The space between the two connecting blocks 4122 is sufficient to accommodate the rotating shaft 421 passing through the connecting hole.

[0065] This application also proposes a wire cutting device, such as... Figure 7 As shown, the device is used to cut a single crystal silicon rod 90. It is equipped with the wire cutting cooling device proposed in this application, and also includes a detection mechanism 100 and a control system (not shown). The detection mechanism 100 is used to detect the bowing of the diamond wire 70 during the cutting process. The control system receives the signal from the detection mechanism 100 and controls the operation of the wire cutting cooling device to move and rotate the guide plate 30 to adjust the drop point of the coolant.

[0066] In this application, the wire cutting cooling device is located above the main roller 60, and one or two can be set as needed. When two are set, the two wire cutting cooling devices are respectively set on opposite sides of the monocrystalline silicon rod 90, and can work together to spray coolant onto the monocrystalline silicon rod 90 and diamond wire 70. During use, the position and angle of the cutting fluid tank 10 can be adjusted by the adjusting mechanism 40, so that the guide plate 30 can move up and down, left and right, or rotate relative to the main roller 60. This allows for the spraying of coolant onto monocrystalline silicon rods 90 of different specifications during cutting. Furthermore, during the cutting process, the spraying point of the coolant is adjusted according to the position of the diamond wire 70 detected by the detection mechanism 100, so that the coolant can be completely sprayed onto the monocrystalline silicon rod 90 and diamond wire 70, ensuring the cutting quality of the silicon wafer.

[0067] When used for cutting monocrystalline silicon rods 90 of different specifications, before cutting begins, the cutting fluid tank 10 can be inserted into different connecting slots 4111 of the first connecting seat 41 as needed. For example, for smaller monocrystalline silicon rods 90, the cutting fluid tank 10 is inserted into the connecting slot 4111 closer to the monocrystalline silicon rod 90; when for larger monocrystalline silicon rods 90, the cutting fluid tank 10 is inserted into the connecting slot 4111 further away from the monocrystalline silicon rod 90, which can better ensure the spraying of coolant during cutting.

[0068] In the cutting process, the posture of the diamond wire 70 gradually changes, and after the detection mechanism 100 detects the change, a signal is transmitted to the control system, and the control system operates the adjusting mechanism 40 to move and rotate the position of the flow guide plate 30, for example, when the contact position of the diamond wire 70 with the single crystal silicon rod 90 moves downward, the control system controls the flow guide plate 30 to move downward and rotate in the direction in which the diamond wire 70 is inclined, so that the cooling liquid can be completely sprayed to the single crystal silicon rod 90 and the diamond wire 70, and the diamond wire 70 in the whole cutting process is in the best liquid-carrying state.

[0069] The application also provides a method for wire cutting by using the wire cutting device, as shown in the figure, comprising the following steps: Figure 7

[0070] The cutting process of the single crystal silicon rod 90 includes a cutting preparation stage, an entering stage, a main cutting stage, a collecting stage and a lifting stage;

[0071] (1) The cutting preparation stage, the height and angle of the cutting liquid tank 10 are adjusted according to the specification of the single crystal silicon rod 90, so that the flow guide plate 30 is in the initial position, and the diamond wire 70 is in the horizontal state, and the angle between the flow guide plate 30 and the horizontal direction is θ1;

[0072] In this embodiment, the cutting preparation stage also includes installing the cutting liquid tank 10 on the adjusting mechanism 40 according to the specification of the single crystal silicon rod 90.

[0073] (2) The entering stage, the detection mechanism 100 detects that the diamond wire 70 is in the horizontal state, transmits a signal to the control system, and the control system controls the adjusting mechanism 40 to keep the flow guide plate 30 in the initial position;

[0074] (3) The main cutting stage, when the angle between the diamond wire 70 and the horizontal direction is θ2, the flow guide plate 30 is rotated by an angle δ1, and δ1 is the same as θ2.

[0075] Specifically, in this stage, the diamond wire 70 is deflected, and when the detection mechanism 100 detects that the angle between the diamond wire 70 and the horizontal direction is θ2, a signal is transmitted to the control system, and the control system controls the rotating drive 423 of the adjusting mechanism 40 to operate, so that the flow guide plate 30 is rotated by an angle δ1, and δ1 is the same as θ2, and the rotating direction is the same as the deflection direction of the diamond wire 70;

[0076] (4) The collecting stage, the diamond wire 70 continues to deflect, and when the detection mechanism 100 detects that the angle between the diamond wire 70 and the horizontal direction is θ3, a signal is transmitted to the control system, and the control system controls the rotating drive 423 and the lifting drive 433 of the adjusting mechanism 40 to operate, so that the flow guide plate 30 is rotated by an angle δ2 and lowered to the first position; preferably, δ2 is greater than θ3;

[0077] ​(5) The guide plate 70 is driven to rotate reversely to an angle θ1 with the horizontal direction, and the guide plate 70 is driven to rise to the initial position.

[0078] Specifically, in order to facilitate the removal of the material seat 80 and the silicon wafer, the control system controls the rotary driver 423 to operate in the lifting stage, so that the guide plate 30 is reversely rotated to an angle θ1 with the horizontal direction, and the lifting driver 433 is operated, so that the guide plate 30 rises to the initial position, so that the wire cutting cooling device is away from the single crystal silicon rod 90, and the cutting liquid is prevented from being blocked by the material seat 80.

[0079] (6) Before the start of the next cutting process, the guide plate 30 is driven to rise to the second position, which is higher than the initial position.

[0080] Specifically, the control system controls the lifting driver 433 to operate, so that the guide plate 30 continues to rise to the second position, providing sufficient operation space for the installation of the next single crystal silicon rod 90 to be cut, and the second position is higher than the initial position.

[0081] In a specific embodiment, the above method is used for cutting the single crystal silicon rod 90, the angles θ2 and θ3 of the diamond wire 70 with the horizontal direction, and the angles θ1 of the guide plate 30 with the horizontal direction, the rotation angles δ1 and δ2 of the guide plate 30, and the distances of the guide plate 30 descending and rising are all cutting process parameters and are set in the control system in advance. The entire cutting process is automatically controlled by the control system, which can realize continuous operation and improve the cutting efficiency.

[0082] In a specific embodiment, in the knife collection stage, the rotation angle δ2 of the guide plate 30 is the angle θ3 of the diamond wire 70 with the horizontal direction plus 2°, and at the same time, the guide plate 30 descends by 5mm to reach the first position; before the start of the next cutting process, the guide plate 30 is raised to the second position, which is 150mm above the initial position.

[0083] Due to the above technical solutions, the positions and angles of the cutting liquid tank and the guide plate can be adjusted according to different specifications of the single crystal silicon rod and the cutting process, so that the falling point of the cooling liquid can be adjusted accordingly, ensuring that the cooling liquid fully participates in the cutting process, cools and lubricates the diamond wire, and makes the diamond wire in the entire cutting process be in the best liquid state, improving the cutting quality of the silicon wafer; by setting the first connecting seat and the connecting groove, the cooling of the single crystal silicon rod of various specifications can be realized; by setting the adjusting mechanism, the cooling liquid tank and the guide plate are moved and rotated, so that the falling point of the cooling liquid can be adjusted according to the cutting process; the cutting device has simple structure, stable connection and convenient use, and can realize continuous automatic operation.

[0084] The above detailed description of the embodiments of the present application is only preferred embodiments of the present application, and should not be considered as limiting the scope of the present application. Any equivalent changes and improvements made according to the scope of the present application should still belong to the patent coverage of the present application.

Claims

1. A linear cutting cooling device, comprising a cutting liquid tank and a flow guide plate arranged at the liquid outlet of the cutting liquid tank, characterized in that: It also includes an adjustment mechanism connected to the cutting fluid tank, which includes a rotating component and a lifting component, used to adjust the angle and position of the cutting fluid tank, respectively.

2. The wire saw cooling device of claim 1, wherein: The adjustment mechanism also includes a connecting seat, which is engaged with the cutting fluid tank; the rotating component is connected to the connecting seat and drives the connecting seat to rotate via a rotary driver.

3. The wire saw cooling device of claim 2, wherein: The rotating assembly includes a rotating shaft that is driven to rotate by the rotating driver, and one end of the rotating shaft is connected to the connecting seat.

4. The wire saw cooling device of claim 3, wherein: The rotating assembly also includes a rotating sleeve, and the rotating shaft passes through one end of the rotating sleeve and is connected to the connecting seat.

5. The wire saw cooling device according to any one of claims 1-4, characterized in that: The lifting assembly includes a lifting block, a guide rod, and a lifting driver. The lifting block is connected to the rotating assembly. The guide rod is movably connected to the lifting block, and the lifting driver drives the lifting block to move along the guide rod.

6. The wire saw cooling device of claim 5, wherein: The guide rod is threadedly connected to the lifting block, and the lifting driver is connected to the guide rod and drives the guide rod to rotate.

7. A wire saw cooling device according to any of claims 2-4 and 6, characterized in that: The connecting seat includes a first adjusting bracket, which has a connecting groove; the cutting fluid tank has ear plates at both ends, which can be engaged with the connecting groove through the opening of the connecting groove.

8. The wire saw cooling device of claim 7, wherein: The connecting seat further includes a second adjusting bracket, which and the first adjusting bracket are provided with matching locking strips and guide grooves for engagement; the guide groove is perpendicular to the connecting groove.

9. A wire saw apparatus, characterized by: The device is equipped with a wire cutting cooling device as described in any one of claims 1-8, and further includes a detection mechanism and a control system. The detection mechanism is used to detect the wire bowing of the diamond wire during the cutting process, and the control system receives the signal from the detection mechanism and controls the operation of the wire cutting cooling device to adjust the drop point of the coolant.

10. A method of wire cutting using the wire cutting apparatus of claim 9, characterized in that, Includes the following steps: During the cutting preparation stage, the height and angle of the cutting liquid tank are adjusted according to the specifications of the single crystal silicon rod so that the guide plate is in the initial position with an angle of θ1 with the horizontal direction. During the cutting phase, the guide plate is kept in the initial position; During the main cutting stage, when the angle between the diamond wire and the horizontal direction is θ2, the guide plate is driven to rotate by an angle δ1, where δ1 and θ2 are the same size. During the retraction phase, when the angle between the diamond wire and the horizontal direction is θ3, the guide plate is driven to rotate by an angle δ2 and descend to the first position; δ2 is greater than θ2. During the material feeding stage, the guide plate is driven to rotate in the opposite direction to an angle of θ1 with the horizontal direction; and the guide plate is driven to rise to the initial position. In the next cutting process preparation stage, the guide plate is driven to rise to a second position, which is higher than the initial position.

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