Large-breadth silicon-based display screen and manufacturing process
By combining a large-format silicon substrate and a small-format silicon-based circuit board, and using a high-temperature, high-pressure vacuum lamination machine for bonding, the production challenges of large-format silicon-based displays have been solved, achieving high yield, low cost, seamless splicing, and flexible display effects.
Patent Information
- Application Number
- CN202411905205.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-01-23
AI Technical Summary
Existing large-format silicon-based displays suffer from high production costs, low yield rates, noticeable seams, and insufficient mechanical strength. In particular, the production yield of high-resolution displays is insufficient, and existing splicing processes are complex, making it difficult to achieve high-quality display effects.
The structure consists of a large-format silicon substrate, a PVB adhesive layer, and multiple small-format silicon-based circuit boards. It achieves seamless bonding through precise alignment and curing using a high-temperature, high-pressure vacuum lamination machine. The PVB adhesive layer fills the splicing seams, simplifying the production process and improving the yield.
It has achieved high-yield production of high-resolution, large-format silicon-based displays, with a yield rate of over 99%, which has reduced production costs, improved mechanical strength and display effect, eliminated the visual impact of splicing seams, and made the display effect flexible and varied.
Smart Images
Figure CN121398293A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of display, and relates to a large-format silicon-based display screen and a manufacturing process. BACKGROUND
[0002] High-resolution large-format (1m*1.5m and above) silicon-based display screens have important application value in modern display technology, especially in traditional LED screen use scenarios such as advertising screens, call screens and guardrail screens. These scenarios require display devices to have high resolution, large size and high-quality display effects. Currently, there are two kinds of manufacturing processes for large-format display screens, one is whole-piece manufacturing, and the other is multi-piece small-piece splicing. The first whole-piece manufacturing has complex process, high difficulty, high equipment requirement, and is prone to problems such as poor uniformity, low yield, high production cost, and the yield is generally not more than 60%. The second multi-piece small-piece splicing can reduce the production difficulty and cost, but the spliced display screen often has obvious splicing seams, which affects the display effect and mechanical strength, and additional alignment and fixing processes are required in the splicing process, increasing the process complexity and production cost.
[0003] Therefore, it is urgent to improve the manufacturing process of the existing large-format silicon-based display screen, especially the manufacturing process of the high-resolution large-format silicon-based display screen, to reduce the production difficulty and cost, and improve the yield and performance. SUMMARY
[0004] To solve the above technical problems, the application provides a large-format silicon-based display screen and a manufacturing process.
[0005] The technical scheme of the application is as follows:
[0006] A large-format silicon-based display screen comprises, from bottom to top, a large-format silicon-based base plate, a first PVB adhesive layer and a plurality of small-format silicon-based circuit boards.
[0007] Alternatively, the surface of the plurality of small-format silicon-based circuit boards further comprises a second PVB adhesive layer and a large-format silicon-based surface layer in sequence.
[0008] Preferably, the size of the large-format silicon-based base plate and the size of the large-format silicon-based surface layer are each not less than 1m*1.5m.
[0009] Preferably, the size of the small-format silicon-based circuit board is not more than 0.5m*1.5m.
[0010] Preferably, the thickness of the large-format silicon-based base plate and the thickness of the large-format silicon-based surface layer are each not less than 3mm.
[0011] Preferably, the thickness of the first PVB adhesive layer and the thickness of the second PVB adhesive layer are each not more than 1.5mm.
[0012] Preferably, the thickness of each of the plurality of small-size silicon-based circuit boards is no more than 5 mm.
[0013] Preferably, the resolution of each of the plurality of small-size silicon-based circuit boards is no more than 20 mm x 20 mm.
[0014] More preferably, the resolution is no more than 10 mm x 10 mm.
[0015] The manufacturing process of the large-size silicon-based display screen according to any one of the above embodiments comprises the following steps:
[0016] attaching: coating the first PVB adhesive layer on the clean surface of the large-size silicon-based substrate, and precisely aligning and attaching the plurality of small-size silicon-based circuit boards side by side on the surface of the first PVB adhesive layer;
[0017] Alternatively, coating the second PVB adhesive layer on the surface of the plurality of small-size silicon-based circuit boards, and then continuing to attach the clean large-size silicon-based surface layer;
[0018] The attaching step obtains a pre-attached display screen.
[0019] thermally pressing and fixing: placing the pre-attached display screen in a high-temperature and high-pressure vacuum laminator for curing, thereby obtaining the large-size silicon-based display screen.
[0020] Preferably, the curing conditions are: temperature of 150±5℃, applied pressure of 1-1.5 MPa, and negative pressure environment.
[0021] The present application has the following advantages:
[0022] (1) The present application realizes the production of large-size silicon-based display screens, the production process is simple, the product yield can reach more than 99%, greatly reducing the production cost of large-size silicon-based display screens, and the product performance and quality stability are good, and the mechanical strength is high.
[0023] (2) The large-size silicon-based display screen production process of the present application solves the problem of low production yield of existing high-resolution large-size silicon-based display screens with a resolution as low as 8 mm x 8 mm and below, which improves the production yield from less than 50% to more than 99%.
[0024] (3) The present application realizes the seamless attachment of large-size silicon-based substrates, small-size silicon-based circuit boards, large-size silicon-based surface panels, etc. through the precise alignment and curing process of the high-temperature and high-pressure vacuum laminator. Moreover, when the PVB adhesive film melts and cures under high temperature and high pressure, the hot-melt PVB adhesive film also penetrates into the splicing joint of the small-size silicon-based circuit board, further eliminating or weakening the visual display of the splicing joint, and improving the display effect.
[0025] (4) The large-area silicon-based display screen of the present application is formed by splicing multiple small-area silicon-based circuit boards, and different small-area silicon-based circuit boards with different patterns, different resolutions, different sizes, etc. can be used, so that the display effect of the display screen is more flexible. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 Structure diagram of the large-area silicon-based display screen of Example 1.
[0027] Figure 2 Structure diagram of the large-area silicon-based display screen of Example 3.
[0028] Figure 3 Close-up picture of the large-area silicon-based display screen of Example 3.
[0029] Figure 4 Picture of the large-area silicon-based display screen of Example 3 taken from a distance of about 2 meters from the display screen. DETAILED DESCRIPTION
[0030] The technical solutions of the present application are further described and explained below through specific embodiments.
[0031] In order to solve at least one of the problems of high production cost, low yield, obvious splicing seam and low mechanical strength of the existing large-area silicon-based display screen, on the one hand, the present application provides a large-area silicon-based display screen, which comprises, from bottom to top, a large-area silicon-based base plate (1), a first PVB adhesive layer (2) and multiple small-area silicon-based circuit boards (3).
[0032] Alternatively, the surface of the multiple small-area silicon-based circuit boards (3) further comprises a second PVB adhesive layer (4) and a large-area silicon-based surface layer (5) in sequence.
[0033] The present application uses a large-area silicon-based base plate (or a large-area silicon-based surface layer) as a support and protection structure, thereby improving the mechanical strength of the large-area silicon-based display screen. Multiple small-area silicon-based circuit boards are attached to the large-area silicon-based base plate through the PVB adhesive layer, so that the large-area silicon-based display screen is formed by small-area silicon-based circuit boards. Moreover, the attachment process of the small-area silicon-based circuit boards is relatively simple, and does not require complex operations and equipment, so that the production yield of the large-area display screen can be significantly improved, and the production yield can reach 99% or more. Furthermore, the splicing scheme is more flexible due to the splicing combination of multiple small-area silicon-based circuit boards, such as splicing of small-area silicon-based circuit boards with different pattern designs, different resolutions and different sizes.
[0034] In the preferred embodiment of the present application, the size of the large-area silicon substrate plate (1) and the size of the large-area silicon substrate layer (5) are each not less than 1m x 1.5m. For example, the size of the large-area silicon substrate plate (1) and the size of the large-area silicon substrate layer (5) can be 1m x 1.5m, 1.5m x 1.5m, 1.5m x 1.8m, 1.5m x 2m, 1.5m x 2.5m, 1.5m x 3m, 2m x 2.5m, 2m x 3m, 2.5m x 3m, 3m x 3m, etc., without particular limitation.
[0035] In the preferred embodiment of the present application, the size of the small-area silicon substrate circuit board (3) is not more than 0.5m x 1.5m. For example, the size of the small-area silicon substrate circuit board (3) can be 0.5m x 1.5m, 0.3m x 1.5m, 0.2m x 1.5m, 0.5m x 1.2m, 0.5m x 1m, 0.3m x 1.2m, 0.3m x 1m, 0.1m x 1m, etc., without particular limitation.
[0036] In the preferred embodiment of the present application, the thickness of the large-area silicon substrate plate (1) and the thickness of the large-area silicon substrate layer (5) are each not less than 3mm. If the thickness of the large-area silicon substrate plate (1) and the thickness of the large-area silicon substrate layer (5) are too thin, the mechanical strength is low, and the effect of the support and protection structure is poor. For example, the thickness of the large-area silicon substrate plate (1) and the thickness of the large-area silicon substrate layer (5) can be 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, etc., without particular limitation.
[0037] In the preferred embodiment of the present application, the thickness of the first PVB adhesive layer (2) and the thickness of the second PVB adhesive layer (4) are each not more than 1.5mm. The PVB adhesive layer has high transparency and mainly plays a role in bonding and fixing, but too thick is not conducive, which will affect the display effect and cause the display screen to be too thick, and the cost will also increase. For example, the thickness of the first PVB adhesive layer (2) and the thickness of the second PVB adhesive layer (4) can be 1.5mm, 1.45mm, 1.4mm, 1.35mm, 1.3mm, 1.25mm, 1.2mm, 1.15mm, 1.1mm, 1.05mm, 1mm, 0.95mm, 0.9mm, 0.85mm, 0.8mm, etc., without particular limitation. The PVB adhesive layer of the present application can be precisely applied using a glue applicator or a dispensing machine, and the amount of PVB adhesive can be precisely controlled. PVB film can also be directly used for film coating.
[0038] In a preferred embodiment of the present application, the thickness of each of the plurality of small-size silicon-based circuit boards (3) is no more than 5 mm. In the present application, the thickness of the large-size silicon-based display screen (3) is not particularly limited and can be 5 mm, 4.5 mm, 4 mm, 3.5 mm, 3.3 mm, 3.2 mm, 3 mm, 2.8 mm, 2.6 mm, 2.5 mm, 2.3 mm, 2.2 mm, 2 mm, 1.8 mm, 1.6 mm, 1.5 mm, 1.3 mm, 2.2 mm, 1 mm, 0.8 mm, 0.6 mm, 0.5 mm, 0.4 mm, 0.3 mm, 0.2 mm, 0.1 mm, etc. The thickness of each of the plurality of small-size silicon-based circuit boards (3) can be the same or different, and when the thicknesses are different, the thickness difference can be compensated by the PVB adhesive layer. The design of the pattern, resolution, size, etc. of each of the plurality of small-size silicon-based circuit boards (3) is more flexible, which can make the large-size silicon-based display screen of the present application have a flexible and variable display effect.
[0039] In the present application, the manufacturing process of the small-size silicon-based circuit board can be as follows: selecting a high-resolution silicon-based material, wafer pretreatment, electrostatic dust removal, circuit coating, initial curing, circuit inspection, high-temperature sintering, circuit detection, solder paste coating, SPI detection, SMT lamp bead mounting, reflow soldering, X-Ray detection, testing, and pre-test aging. Each small-size silicon-based circuit board needs to be inspected for size, circuit pattern accuracy, conductivity, and flatness to meet the design requirements.
[0040] In a preferred embodiment of the present application, the resolution of each of the plurality of small-size silicon-based circuit boards (3) is no more than 20 mm x 20 mm. In the present application, the resolution of the small-size silicon-based circuit board (3) is not particularly limited and can be 20 mm x 20 mm, 18 mm x 18 mm, 15 mm x 15 mm, 12 mm x 12 mm, 10 mm x 10 mm, 8 mm x 8 mm, etc. More preferably, the resolution is no more than 10 mm x 10 mm, such as 10 mm x 10 mm, 9 mm x 9 mm, 8 mm x 8 mm, 7 mm x 7 mm, 6 mm x 6 mm, 5 mm x 5 mm, etc. The existing manufacturing processes of the two types of large-size silicon-based display screens are not suitable for high-resolution (such as 8 mm x 8 mm) large-size silicon-based display screens, and the product yield is very low, less than 50%. However, the yield of the large-size silicon-based display screen of the present application can reach 99% or more.
[0041] In another aspect, the present application provides a manufacturing process of the large-size silicon-based display screen according to any one of the above embodiments, which comprises the following steps:
[0042] Lamination: coat a first PVB glue layer (2) on the surface of a clean large-size silicon substrate board (1), and precisely align and abut a plurality of small-size silicon circuit boards (3) on the surface of the first PVB glue layer (2);
[0043] Alternatively, coat a second PVB glue layer (4) on the surface of the plurality of small-size silicon circuit boards (3), and then continue to laminate a clean large-size silicon surface layer (5);
[0044] The lamination step obtains a pre-laminated display screen.
[0045] Hot pressing and fixing: place the pre-laminated display screen in a high-temperature and high-pressure vacuum laminating machine for curing, and obtain a large-size silicon display screen.
[0046] The manufacturing process of the large-size silicon display screen of the present application is relatively simple and can be realized through lamination and hot pressing and fixing. The key point of the above manufacturing process is the precise alignment and abutment of the plurality of small-size silicon circuit boards (3) in parallel, which can be adjusted and aligned by the positioning device of the lamination equipment to realize precise alignment and accurate abutment in parallel.
[0047] In addition, during the hot pressing and fixing process, the first PVB glue layer and / or the second PVB glue layer will flow and penetrate into the joint seams between adjacent small-size silicon circuit boards (3), which can further eliminate or weaken the visual display of the joint seams and improve the display effect.
[0048] In the preferred embodiment of the present application, the curing conditions are as follows: temperature is 150±5℃, applied pressure is 1-1.5MPa, and negative pressure environment. By synchronously applying pressure and negative pressure environment, good lamination and tight curing effect can be ensured, and there are no impurities and bubbles. The large-size silicon substrate board and the small-size silicon circuit board, or the large-size silicon surface layer, are firmly and stably laminated. The small-size silicon circuit board will not displace or deviate during use, and the overall display effect is good. The high-temperature and high-pressure vacuum laminating machine can be a commercially available glass vacuum heat sealing laminating machine.
[0049] The technical solutions of the present application are further described and explained according to the embodiments as follows.
[0050] Example 1
[0051] The structure of the large-size silicon display screen of the present application is shown in the accompanying drawings, and the manufacturing process is as follows: Figure 1
[0052] Substrate preparation: select a large-size silicon substrate board 1 with a size of 1.5m×3m×5mm, and clean the surface.
[0053] PVB glue layer preparation: lay a 1.14mm-thick PVB glue layer 2 on the large-format silicon substrate plate.
[0054] Lamination: take 6 high-resolution (resolution 8mm x 8mm) silicon-based circuit boards 3 with a size of 0.5m x 1.5m x 3mm, accurately align and abut and laminate on the above-mentioned PVB glue layer 2 to obtain a pre-laminated display screen. The silicon-based circuit board 3 is laminated by an ultrathin silicon substrate, a circuit layer and a lamp bead layer.
[0055] Hot pressing: place the pre-laminated display screen into a high-temperature and high-pressure vacuum laminating machine, control the temperature at 150±5℃, the pressure at 1.2±0.05MPa, the vacuum degree at-0.05±0.005MPa, and the hot pressing time at 40-45 minutes.
[0056] The large-format silicon-based display screen obtained by the above hot pressing can also be inspected and tested: the alignment accuracy, conductivity and surface flatness of the silicon-based display screen are inspected by a microscope and the like to ensure that there is no bubble and impurity, and the product quality is qualified.
[0057] Example 2
[0058] The difference between this embodiment and Example 1 is that in Example 1, the 6 high-resolution (resolution 8mm x 8mm) silicon-based circuit boards 3 with a size of 0.5m x 1.5m x 3mm are adjusted to 12 high-resolution (resolution 8mm x 8mm) silicon-based circuit boards 3 with a size of 0.5m x 0.75m x 1mm. The remaining steps remain unchanged.
[0059] Example 3
[0060] The structure of the large-format silicon-based display screen of the present application is shown in the accompanying drawings, and the manufacturing process is as follows: Figure 2
[0061] Substrate preparation: select a large-format silicon substrate plate 1 with a size of 1m x 1.5m x 5mm and perform surface cleaning.
[0062] First PVB glue layer preparation: lay a 1.14mm-thick PVB glue layer 2 on the large-format silicon substrate plate.
[0063] Lamination: take 2 high-resolution (resolution 8mm x 8mm) silicon-based circuit boards 3 with a size of 0.5m x 1.5m x 3mm, accurately align and laminate on the above-mentioned PVB glue layer 2. The silicon-based circuit board 3 is laminated by an ultrathin silicon substrate, a circuit layer and a lamp bead layer.
[0064] Second PVB glue layer preparation: lay a 1.14mm-thick PVB glue layer 4 on the silicon-based circuit board 3.
[0065] Covering layer: A clean, large-format silicon-based surface layer 5 with dimensions of 1.5m × 3m × 5mm is bonded onto the PVB adhesive layer 4 to obtain a pre-bonded display screen.
[0066] Hot pressing fixation: Place the pre-bonded display screen into a high-temperature and high-pressure vacuum laminating machine. The temperature is controlled at 150±5℃, the pressure is controlled at 1.1±0.05MPa, the vacuum degree is controlled at -0.05±0.005MPa, and the hot pressing time is controlled at 40-45 minutes.
[0067] The large-format silicon-based display screen obtained by the above hot pressing can also be inspected and tested: the alignment accuracy, conductivity and surface flatness of the silicon-based display screen can be inspected by microscopes and other equipment to ensure that there are no bubbles and impurities and that the product quality is qualified.
[0068] Appendix Figure 3 and attached Figure 4 These are close-up images of the large-format silicon-based display screen in this embodiment, and images taken from approximately 2 meters away from the screen. It can be seen that the seam is not visually noticeable, especially based on the attached... Figure 4 As can be seen from a distance, the seams of the display screen are virtually invisible.
[0069] Example 4
[0070] The difference between this embodiment and embodiment 3 is that in embodiment 3, the size of the silicon-based circuit board 3 is adjusted from 0.5m×1.5m×3mm to 0.5m×1.5m×1mm (resolution 6mm×6mm). The remaining steps remain unchanged.
[0071] Example 5
[0072] Substrate preparation: Select a large-format silicon substrate 1 with dimensions of 3m×3m×3mm and perform surface cleaning.
[0073] Preparation of the first PVB adhesive layer: A 1.1 mm thick PVB adhesive layer 2 is laid on a large-format silicon substrate.
[0074] Bonding: Take 18 high-resolution (8mm×8mm resolution) silicon-based circuit boards 3 with dimensions of 0.5m×1m×1.5mm, precisely align them, and bond them onto the aforementioned PVB adhesive layer 2. The silicon-based circuit board 3 is composed of an ultra-thin silicon substrate, a circuit layer, and an LED bead layer bonded together.
[0075] Preparation of the second PVB adhesive layer: A 1.1 mm thick PVB adhesive layer 4 is laid on the silicon-based circuit board 3.
[0076] Covering layer: A clean, large-format silicon-based surface layer 5 with dimensions of 3m×3m×3mm is bonded onto the PVB adhesive layer 4 to obtain a pre-bonded display screen.
[0077] Hot pressing: the pre-assembled display screen is placed into a high temperature and high pressure vacuum laminating machine, the temperature is controlled at 150±5℃, the pressure is controlled at 1.1±0.05MPa, the vacuum degree is controlled at -0.05±0.005MPa, and the hot pressing time is controlled at 40-45 minutes.
[0078] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples are only the preferred embodiments of the present application, and cannot limit the scope of the present application. Equivalent changes and modifications made in accordance with the scope and content of the present patent are still within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A large-format silicon-based display screen, characterized in that, From bottom to top, it includes a large-format silicon substrate (1), a first PVB adhesive layer (2), and multiple small-format silicon-based circuit boards (3). Alternatively, the surfaces of the multiple small-format silicon-based circuit boards (3) may also include a second PVB adhesive layer (4) and a large-format silicon-based surface layer (5).
2. The large-format silicon-based display screen according to claim 1, characterized in that, The dimensions of the large-format silicon substrate (1) and the large-format silicon substrate layer (5) are each not less than 1m × 1.5m.
3. The large-format silicon-based display screen according to claim 1, characterized in that, The size of the small-format silicon-based circuit board (3) does not exceed 0.5m × 1.5m.
4. The large-format silicon-based display screen according to any one of claims 1-3, characterized in that, The thickness of the large-format silicon substrate (1) and the thickness of the large-format silicon substrate layer (5) are each not less than 3 mm.
5. The large-format silicon-based display screen according to any one of claims 1-3, characterized in that, The thickness of the first PVB adhesive layer (2) and the thickness of the second PVB adhesive layer (4) do not exceed 1.5 mm on each.
6. The large-format silicon-based display screen according to claims 1-3, characterized in that, The thickness of each of the multiple small-format silicon-based circuit boards (3) does not exceed 5 mm.
7. The large-format silicon-based display screen according to any one of claims 1-3, characterized in that, The resolution of each of the multiple small-format silicon-based circuit boards (3) is no more than 20mm × 20mm.
8. The large-format silicon-based display screen according to claim 7, characterized in that, The resolution is no more than 10mm × 10mm.
9. The manufacturing process of the large-format silicon-based display screen according to any one of claims 1-8, characterized in that, Includes the following steps: Adhesion: The first PVB adhesive layer (2) is coated on the clean surface of the large-format silicon substrate (1), and multiple small-format silicon-based circuit boards (3) are precisely aligned and bonded side by side to the surface of the first PVB adhesive layer (2). Alternatively, the second PVB adhesive layer (4) can be coated on the surface of the plurality of small-format silicon-based circuit boards (3), and then the clean large-format silicon-based surface layer (5) can be bonded together. The bonding step yields a pre-bonded display screen; Hot pressing fixation: The pre-bonded display screen is placed in a high-temperature and high-pressure vacuum laminating machine for curing, thus obtaining the large-format silicon-based display screen.
10. The manufacturing process of a large-format silicon-based display screen according to claim 9, characterized in that, The curing conditions are: temperature 150±5℃, applied pressure 1-1.5MPa, negative pressure environment.