Wafer laser cutting device with alignment mechanism

Abstract

The invention relates to the technical field of laser cutting, in particular to a wafer laser cutting device with an alignment mechanism, which comprises a cutting table, an X-axis transmission module, a Y-axis transmission module and a Z-axis transmission module, the top end of the cutting table is provided with a placement table, the surface of the Z-axis transmission module is provided with a laser cutter, and the surface of the Z-axis transmission module is provided with an alignment mechanism. A centering mechanism is arranged on the surface of the containing table and comprises a sliding groove formed in the surface of the containing table, a sliding block is arranged in the sliding groove in a sliding mode, a transverse rod is fixed to one side of the sliding block, a shell is fixed to one end of the transverse rod, an L-shaped plate is arranged in the shell in a sliding mode, and a clamping block is fixed to one end of the L-shaped plate. The clamping range can be adjusted in a self-adaptive mode through the clamping blocks according to the size of the wafer, so that the device can be compatible with wafers of different sizes, special clamping assemblies do not need to be replaced for the wafers of different sizes, the universality and operation flexibility of the device are improved, and the overall cutting efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and more particularly to a wafer laser cutting apparatus with an alignment mechanism. Background Technology

[0002] Wafer dicing is a crucial step in chip manufacturing, and its technical precision and efficiency directly affect chip performance and cost. Compared to mechanical dicing, laser dicing involves focusing a laser beam onto the wafer surface. The laser energy is absorbed by the wafer material and converted into heat energy, causing localized areas to melt or evaporate rapidly, thus forming a dicing channel. This process is fast and precise, achieving micron-level dicing accuracy.

[0003] However, in the actual laser cutting process, a large amount of smoke and dust is generated. If this smoke and dust is not removed in a timely and effective manner, it will not only adhere to the wafer surface and cause pollution, but may also affect the transmission and focusing effect of the laser beam, further reducing the cutting accuracy and yield.

[0004] In view of this, this paper studies and improves the existing problems, and provides a wafer laser cutting device with an alignment mechanism. The aim is to solve the problems and improve the practical value through this technology. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and to propose a wafer laser cutting device with an alignment mechanism.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer laser cutting device with an alignment mechanism, comprising a cutting table and an X-axis transmission module, a Y-axis transmission module, and a Z-axis transmission module, wherein a placement platform is mounted on the top of the cutting table, and a laser cutter is mounted on the surface of the Z-axis transmission module; The surface of the placement platform is provided with a centering mechanism, which includes a groove formed on the surface of the placement platform, a slider sliding inside the groove, a crossbar fixed to one side of the slider, a housing fixed to one end of the crossbar, an L-shaped plate sliding inside the housing, a clamping block fixed to one end of the L-shaped plate, a turntable driven by a motor rotatably provided inside the placement platform, a rotating rod rotatably provided between the slider and the turntable, and a spring provided inside the housing; A jetting mechanism is provided above the placement platform. The jetting mechanism includes a circular tube installed above the placement platform. A jetting ring is installed on the inner side of the circular tube. An arc-shaped spray ring is connected to the bottom end of the jetting ring. An elastic sheet is fixed between the jetting ring and the side wall of the arc-shaped spray ring. An air inlet pipe is connected to the outer wall of the circular tube. A rotating shaft is rotatably provided inside the crossbar. A blade is sleeved on the surface of the rotating shaft. A cam is fixed to one end of the rotating shaft. The crossbar is connected to the circular tube and the jetting ring through a connecting pipe. A compression mechanism is provided on one side of the elastic sheet; Adjustment mechanisms are provided on both sides of the housing.

[0007] Preferably, one end of the spring is fixedly connected to the inner wall of the housing, and the other end of the spring is fixedly connected to the bottom end of the L-shaped plate.

[0008] Preferably, the clamping block is arc-shaped, and a rubber pad is fixed to the side wall of the clamping block.

[0009] Preferably, the inner opening of the arc-shaped spray ring is inclined, and the bottom end of the arc-shaped spray ring has multiple evenly distributed air jet holes.

[0010] Preferably, the extrusion mechanism includes a sleeve installed below the round tube, an extrusion rod sliding inside the sleeve, and a push rod that slides inside the sleeve fixed at the top of the slider.

[0011] Preferably, one end of the extrusion rod extends to one side of the elastic sheet, and the end of the extrusion rod is provided with an extrusion head that is adapted to the side of the elastic sheet.

[0012] Preferably, the adjustment mechanism includes damping cylinders installed on both sides of the housing, a piston rod that slides inside the damping cylinder is fixed to the side wall of the L-shaped plate, a cylinder is fixed to the side wall of the placement platform, an air intake pipe is connected between the damping cylinder and the cylinder, and a pull rod slides inside the cylinder.

[0013] Preferably, the regulating mechanism further includes a regulating valve installed on the outer wall of the intake pipe, a valve stem is rotatably provided on one side of the regulating valve, a rack A is fixed on the side wall of the Y-axis transmission module, a rack B is fixed at the bottom end of the pull rod, and both rack A and rack B mesh with the valve stem.

[0014] Preferably, the outer wall of the laser cutter is fitted with a protective cover, and the outer wall of the protective cover is connected to an exhaust pipe.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention uses the movement of a slider to move a housing fixed at one end of a crossbar closer to the wafer. An L-shaped plate slidably mounted inside the housing also moves closer to the wafer, causing the clamping block to contact and hold the wafer. This ensures the wafer is always in the precise position required for cutting on the placement stage, effectively avoiding cutting deviations caused by positional shifts in subsequent cutting processes, thus ensuring cutting accuracy. Furthermore, the clamping block's adaptive adjustment of the clamping range according to wafer size allows for compatibility with wafers of different sizes, eliminating the need to replace dedicated clamping components for different wafer sizes. This improves the device's versatility and operational flexibility, and enhances overall cutting efficiency.

[0016] 2. In this invention, the gas generated by the air pump is delivered to the inside of the circular tube through the air inlet pipe connected to the outer wall of the circular tube. The gas inside the circular tube then enters the inner cavity of the crossbar through the connecting pipe, and then flows into the air jet ring through the connecting pipe between the crossbar and the air jet ring. Finally, it is ejected from the arc-shaped spray ring connected to the bottom end of the air jet ring and acts on the wafer surface. The gas ejected from the arc-shaped spray ring can gather the fumes generated during laser cutting of the wafer from the periphery to the center, effectively preventing the fumes from spreading to the outside and preventing the fumes from spreading into the working environment and affecting the health of the workers. At the same time, it also prevents the diffused fumes from adhering to the device components or the wafer surface and causing pollution.

[0017] 3. This invention utilizes gas to impact blades on the rotating surface of a shaft inside a crossbar. The blades drive the shaft to rotate synchronously, and a cam fixed at one end of the shaft also rotates accordingly. When the convex part of the cam rotates to abut against the bottom of the L-shaped plate, it pushes the L-shaped plate upward, thereby driving the clamping block upward and squeezing the spring inside the housing. When the convex part of the cam rotates to no longer abut against the bottom of the L-shaped plate, the clamping block will reset under the action of the spring force, causing the wafer clamped between the clamping blocks to vibrate slightly in the vertical direction. This promotes micro-movement between the laser and the wafer during laser cutting, assists the laser beam in forming better contact with the wafer material, effectively reduces stress concentration or material accumulation problems that may occur during cutting, and results in a smoother cut surface for the cut wafer, improving the wafer cutting effect and cutting quality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic cross-sectional view of the placement platform of the present invention; Figure 3 For the present invention Figure 2 Enlarged structural diagram of section A; Figure 4 This is one of the partial structural schematic diagrams of the present invention; Figure 5 For the present invention Figure 4Enlarged structural diagram of section B; Figure 6 This is a partial structural schematic diagram of the present invention; Figure 7 This is a partial structural schematic diagram of the present invention (third one). Figure 8 For the present invention Figure 7 Enlarged diagram of section C; Figure 9 This is a schematic diagram of the bottom structure of the arc-shaped spray ring of the present invention.

[0019] Legend: 1. Cutting table; 2. Placement table; 3. Laser cutter; 4. Centering mechanism; 41. Slide rail; 42. Slider; 43. Crossbar; 44. Housing; 45. L-shaped plate; 46. Clamping block; 47. Turntable; 48. Rotating rod; 5. Jet mechanism; 51. Round tube; 52. Jet ring; 53. Inlet pipe; 54. Elastic sheet; 55. Arc-shaped spray ring; 56. Blade; 57. Cam; 58. Rotating shaft 6. Extrusion mechanism; 61. Sleeve; 62. Extrusion rod; 63. Push rod; 7. Adjustment mechanism; 71. Damping cylinder; 72. Piston rod; 73. Cylinder body; 74. Intake pipe; 75. Adjusting valve; 76. Valve stem; 77. Rack A; 78. Rack B; 79. Pull rod; 8. X-axis transmission module; 9. Y-axis transmission module; 10. Z-axis transmission module; 11. Protective cover; 12. Exhaust pipe. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] See Figures 1 to 9 As shown, the present invention provides a wafer laser cutting device with an alignment mechanism, including a cutting stage 1 and an X-axis transmission module 8, a Y-axis transmission module 9, and a Z-axis transmission module 10. A placement stage 2 is installed on the top of the cutting stage 1, and a laser cutter 3 is installed on the surface of the Z-axis transmission module 10. The surface of the placement platform 2 is provided with a centering mechanism 4. The centering mechanism 4 includes a groove 41 opened on the surface of the placement platform 2. A slider 42 slides inside the groove 41. A crossbar 43 is fixed to one side of the slider 42. A housing 44 is fixed to one end of the crossbar 43. An L-shaped plate 45 slides inside the housing 44. A clamping block 46 is fixed to one end of the L-shaped plate 45. A turntable 47 driven by a motor is rotatably provided inside the placement platform 2. A rotating rod 48 is rotatably provided between the slider 42 and the turntable 47. A spring is provided inside the housing 44. It should be noted that when wafer dicing is required, the operator first places the wafer stably on the surface of the placement stage 2, then starts the drive motor. The power output of the motor drives the turntable 47, which is rotated inside the placement stage 2, to start rotating. Since the slider 42 and the turntable 47 are rotatably connected through the rotating rod 48, the rotational motion of the turntable 47 is converted into the pushing and pulling action of the rotating rod 48, which in turn drives the slider 42 to make a stable linear reciprocating motion along the preset groove 41 on the surface of the placement stage 2. The crossbar 43, which is fixedly connected to one side of the slider 42, will move synchronously with the movement of the slider 42, thereby driving the housing 44 fixed at one end of the crossbar 43 to move closer to the wafer. As the wafer moves, the L-shaped plate 45, which is slidably mounted inside the housing 44, also approaches the wafer. Finally, the clamping block 46, which is fixed at one end of the L-shaped plate 45, contacts and clamps the side of the wafer, thus ensuring that the wafer is always in the precise position required for cutting on the placement stage 2. This effectively avoids cutting deviations caused by positional shifts in subsequent cutting processes, ensuring cutting accuracy. At the same time, the clamping block 46 is designed to adaptively adjust the clamping range according to the wafer size, thus being compatible with wafers of different sizes and specifications. There is no need to replace special clamping components for wafers of different sizes, which improves the versatility and operational flexibility of the device and increases the overall cutting efficiency.

[0022] A jet mechanism 5 is provided above the placement platform 2. The jet mechanism 5 includes a circular tube 51 installed above the placement platform 2. A jet ring 52 is installed on the inner side of the circular tube 51. An arc-shaped spray ring 55 is connected to the bottom end of the jet ring 52. An elastic sheet 54 is fixed between the side wall of the jet ring 52 and the arc-shaped spray ring 55. An air inlet pipe 53 is connected to the outer wall of the circular tube 51. A rotating shaft 58 is rotatably provided inside the crossbar 43. A blade 56 is sleeved on the surface of the rotating shaft 58. A cam 57 is fixed at one end of the rotating shaft 58. The crossbar 43 is connected to the circular tube 51 and the jet ring 52 through a connecting pipe. It should be noted that after the wafer is positioned by the centering mechanism 4, the external air pump is started. The gas generated by the air pump is delivered to the inside of the round tube 51 through the air inlet pipe 53 connected to the outer wall of the round tube 51. Since the crossbar 43 is connected to the round tube 51 and the jet ring 52 through the connecting pipe, the gas in the round tube 51 will enter the inner cavity of the crossbar 43 through the connecting pipe, and then flow into the jet ring 52 through the connecting pipe between the crossbar 43 and the jet ring 52. Finally, it is ejected from the arc-shaped spray ring 55 connected to the bottom end of the jet ring 52 and acts on the surface of the wafer. The gas ejected from the arc-shaped spray ring 55 can gather the fumes generated during laser cutting of the wafer from the periphery to the center, effectively preventing the fumes from spreading to the outside and preventing the fumes from spreading into the working environment and affecting the health of the workers. It also prevents the diffused fumes from adhering to the device components or the surface of the wafer and causing pollution. Simultaneously, as the gas enters the inner cavity of the crossbar 43, it impacts the blades 56 mounted on the surface of the rotating shaft 58 inside the crossbar 43, causing the blades 56 to rotate. The blades 56, in turn, drive the rotating shaft 58 to rotate synchronously. The cam 57 fixed at one end of the rotating shaft 58 also rotates accordingly. When the protruding part of the cam 57 rotates to abut against the bottom of the L-shaped plate 45, it pushes the L-shaped plate 45 upward, thereby driving the clamping block 46 upward and squeezing the spring inside the housing 44. When the protruding part of the cam 57 rotates to no longer abut against the bottom of the L-shaped plate 45, the clamping block 46 will reset under the action of the spring force. This cycle causes the wafer clamped between the clamping blocks 46 to vibrate slightly in the vertical direction, thereby promoting the micro-movement of the laser and the wafer during laser cutting, assisting the laser beam to form better contact with the wafer material, effectively reducing stress concentration or material accumulation problems that may occur during cutting, resulting in a smoother cut surface and improving the wafer cutting effect and cutting quality.

[0023] A compression mechanism 6 is provided on one side of the elastic sheet 54; Adjustment mechanisms 7 are provided on both sides of the housing 44.

[0024] See Figures 4 to 5 As shown, one end of the spring is fixedly connected to the inner wall of the housing 44, and the other end of the spring is fixedly connected to the bottom end of the L-shaped plate 45.

[0025] See Figures 4 to 5 As shown, the clamping block 46 is arranged in an arc shape, and a rubber pad is fixed to the side wall of the clamping block 46.

[0026] See Figure 9 As shown, the inner opening of the arc-shaped spray ring 55 is inclined, and the bottom end of the arc-shaped spray ring 55 has multiple evenly distributed air jet holes.

[0027] See Figure 6As shown, the extrusion mechanism 6 includes a sleeve 61 installed below the round tube 51, an extrusion rod 62 sliding inside the sleeve 61, and a push rod 63 that slides inside the sleeve 61 fixed at the top of the slider 42.

[0028] See Figure 6 As shown, one end of the extrusion rod 62 extends to one side of the elastic sheet 54, and the end of the extrusion rod 62 is provided with an extrusion head that is adapted to the side of the elastic sheet 54.

[0029] It should be noted that when the centering mechanism 4 starts to position the wafer, the motor drives the turntable 47 to rotate, which in turn drives the slider 42 to move linearly along the groove 41 on the surface of the placement stage 2 via the rotating rod 48. Since the top of the slider 42 is fixed with a push rod 63 that can slide inside the sleeve 61, the movement of the slider 42 will synchronously drive the push rod 63 to slide along the inner wall of the sleeve 61. The pressing rod 62, which is slidably set inside the sleeve 61, cooperates with the push rod 63. During the sliding process, the push rod 63 will push the pressing rod 62 to move closer to the elastic plate 54. And because one end of the pressing rod 62 extends to one end of the elastic plate 54, The side is provided with a pressing head that is adapted to the side of the elastic sheet 54. The pressing head can fit with the elastic sheet 54 and apply a pushing force to deform the elastic sheet 54. The deformation of the elastic sheet 54 will drive the arc-shaped spray ring 55 to shift towards the inside of the wafer. When the wafer size is small, the slider 42 moves a long distance, the deformation of the elastic sheet 54 decreases, the offset of the arc-shaped spray ring 55 increases, and the spray range decreases synchronously. This enables the adjustment of the spray angle and range of the arc-shaped spray ring 55, and thus can adaptively match the spray coverage area according to the size of the wafer to ensure that the spray range always accurately corresponds to the edge contour of the wafer.

[0030] See Figures 7 to 8 As shown, the adjustment mechanism 7 includes damping cylinders 71 installed on both sides of the housing 44, a piston rod 72 that slides inside the damping cylinder 71 is fixed to the side wall of the L-shaped plate 45, a cylinder 73 is fixed to the side wall of the placement platform 2, an air intake pipe 74 is connected between the damping cylinder 71 and the cylinder 73, and a pull rod 79 slides inside the cylinder 73.

[0031] See Figures 7 to 8 As shown, the regulating mechanism 7 also includes a regulating valve 75 installed on the outer wall of the intake pipe 53. A valve stem 76 is rotatably provided on one side of the regulating valve 75. A rack A77 is fixed on the side wall of the Y-axis transmission module 9. A rack B78 is fixed at the bottom end of the pull rod 79. Both rack A77 and rack B78 mesh with the valve stem 76.

[0032] It should be noted that when cutting wafers of different thicknesses, the Y-axis drive module 9 is first activated, driving the laser cutter 3 to move downwards or downwards along the Y-axis to match the cutting height of the wafer. Since the side wall of the Y-axis drive module 9 is fixed with a rack A77, the movement of the Y-axis drive module 9 will synchronously drive the rack A77 to move, causing the rack A77 to drive the valve stem 76 to rotate. The regulating valve 75 is installed on the outer wall of the air inlet pipe 53. The rotation angle of the valve stem 76 directly controls the opening degree of the regulating valve 75. If the wafer thickness is large, the Y-axis drive module 9 drives the rack A77 to move upwards, the rotation angle of the valve stem 76 is larger, the opening degree of the regulating valve 75 increases accordingly, and the air intake of the air inlet pipe 53 increases accordingly. If the wafer thickness is small, the rack A77 moves downwards, the rotation angle of the valve stem 76 is smaller, the opening degree of the regulating valve 75 decreases, and the air intake decreases synchronously. This achieves the function of adaptively adjusting the air intake of the air inlet pipe 53 according to the wafer thickness, thus achieving the effect of saving energy. Meanwhile, during the rotation of the valve stem 76, it also interacts with the rack B78 fixed at the bottom of the pull rod 79. The rotation of the valve stem 76 drives the rack B78 to move, thereby pulling the pull rod 79 to slide inside the cylinder 73 fixed to the side wall of the placement platform 2. The cylinder 73 is connected to the damping cylinders 71 installed on both sides of the housing 44 through the suction pipe 74. The negative pressure inside the cylinder 73 will draw gas from the inside of the damping cylinder 71 through the suction pipe 74, thereby changing the pressure inside the damping cylinder 71. The greater the wafer thickness, the greater the rotation angle of the valve stem 76, the longer the distance that the rack B78 drives the pull rod 79 to move downward, and the stronger the negative pressure inside the cylinder 73. The more gas is absorbed inside the damping cylinder 71, the lower its internal pressure. Since the piston rod 72, which is fixed to the side wall of the L-shaped plate 45, slides inside the damping cylinder 71, the lower the pressure inside the damping cylinder 71, the smaller the damping force experienced by the piston rod 72 when it slides. Consequently, the damping force experienced by the cam 57 when it rotates and drives the L-shaped plate 45 and the clamping block 46 to move is smaller, and the vibration frequency in the vertical direction of the wafer increases accordingly. Conversely, the smaller the wafer thickness, the greater the pressure inside the damping cylinder 71, the greater the damping force, and the lower the vibration frequency. This achieves the effect of adaptively adjusting the vibration frequency according to the wafer thickness, reducing the problem of damage to thinner wafers due to excessive vibration.

[0033] See Figure 1 As shown, a protective cover 11 is fitted on the outer wall of the laser cutter 3. An exhaust pipe 12 is connected to the outer wall of the protective cover 11. The gas ejected from the four sets of arc-shaped spray rings 55 converges with the gas in the middle of the wafer to form convection. It will then converge upwards towards the center of the wafer and into the protective cover 11 fitted on the outer wall of the laser cutter 3. At this time, the external air pump is started, and the fumes can be drawn out to the outside of the protective cover 11 through the exhaust pipe 12 connected to the outer wall of the protective cover 11 for unified collection and treatment. This achieves efficient recovery of fumes, further optimizes the working environment, and provides a clear field of vision and environment for laser cutting, reducing the interference of fumes on the propagation of the laser beam.

[0034] Working principle: When wafers need to be diced, the operator first places the wafer stably on the surface of the placement stage 2, and then starts the drive motor. The power output of the motor drives the turntable 47 inside the placement stage 2 to start rotating. Since the slider 42 and the turntable 47 are connected by the rotating rod 48, the rotation of the turntable 47 is converted into the pushing and pulling action of the rotating rod 48, which in turn drives the slider 42 to make a stable linear reciprocating motion along the preset groove 41 on the surface of the placement stage 2. The crossbar 43 fixedly connected to one side of the slider 42 will move synchronously with the movement of the slider 42, thereby driving the housing 44 fixed at one end of the crossbar 43 to move closer to the wafer. The L-shaped plate 45 slidably assembled inside the housing 44 also moves closer to the wafer. Finally, the clamping block 46 fixed at one end of the L-shaped plate 45 contacts the side of the wafer and clamps it. After the wafer is positioned by the centering mechanism 4, the external air pump is started. The gas generated by the air pump is delivered to the inside of the round tube 51 through the air inlet pipe 53 connected to the outer wall of the round tube 51. Since the crossbar 43 is connected to the round tube 51 and the jet ring 52 through the connecting pipe, the gas in the round tube 51 will enter the inner cavity of the crossbar 43 through the connecting pipe, and then flow into the jet ring 52 through the connecting pipe between the crossbar 43 and the jet ring 52. Finally, it will be ejected from the arc-shaped spray ring 55 connected to the bottom end of the jet ring 52 and act on the surface of the wafer. The gas ejected from the arc-shaped spray ring 55 can gather the fumes generated during laser cutting of the wafer from the periphery to the center. Meanwhile, as the gas enters the inner cavity of the crossbar 43, it impacts the blades 56 mounted on the surface of the rotating shaft 58 inside the crossbar 43, causing the blades 56 to rotate. The blades 56 then drive the rotating shaft 58 to rotate synchronously, and the cam 57 fixed at one end of the rotating shaft 58 also rotates. When the protruding part of the cam 57 rotates to abut against the bottom of the L-shaped plate 45, it pushes the L-shaped plate 45 upward, thereby driving the clamping block 46 upward and squeezing the spring inside the housing 44. When the protruding part of the cam 57 rotates to no longer abut against the bottom of the L-shaped plate 45, the clamping block 46 will reset under the action of the spring force. This cycle repeats, causing the wafer clamped between the clamping blocks 46 to vibrate slightly in the vertical direction. When the alignment mechanism 4 starts to position the wafer, the motor drives the turntable 47 to rotate, which in turn drives the slider 42 to move linearly along the groove 41 on the surface of the placement stage 2 via the rotating rod 48. Since the top of the slider 42 is fixed with a push rod 63 that can slide inside the sleeve 61, the movement of the slider 42 will synchronously drive the push rod 63 to slide along the inner wall of the sleeve 61. The extrusion rod 62, which is slidably set inside the sleeve 61, cooperates with the push rod 63. During the sliding process, the push rod 63 will push the extrusion rod 62 closer to the elastic... As one side of the sheet 54 moves, one end of the extrusion rod 62 extends to one side of the elastic sheet 54, and its end is provided with an extrusion head that is adapted to the side of the elastic sheet 54. The extrusion head can fit with the elastic sheet 54 and apply a pushing force, causing the elastic sheet 54 to deform. The deformation of the elastic sheet 54 will drive the arc-shaped spray ring 55 to shift towards the inside of the wafer. When the wafer size is small, the slider 42 moves a long distance, the deformation of the elastic sheet 54 decreases, the offset of the arc-shaped spray ring 55 increases, and the spray range decreases synchronously. When wafers of different thicknesses need to be cut, the Y-axis drive module 9 is first activated, driving the laser cutter 3 to move downwards or downwards along the Y-axis to match the cutting height of the wafer. Since the side wall of the Y-axis drive module 9 is fixed with a rack A77, the movement of the Y-axis drive module 9 will synchronously drive the rack A77 to move, causing the rack A77 to drive the valve stem 76 to rotate. The regulating valve 75 is installed on the outer wall of the air inlet pipe 53. The rotation angle of the valve stem 76 directly controls the opening degree of the regulating valve 75. If the wafer thickness is large, the Y-axis drive module 9 drives the rack A77 to move upwards, the rotation angle of the valve stem 76 is larger, the opening degree of the regulating valve 75 increases accordingly, and the air intake of the air inlet pipe 53 increases accordingly. If the wafer thickness is small, the rack A77 moves downwards, the rotation angle of the valve stem 76 is smaller, the opening degree of the regulating valve 75 decreases, and the air intake decreases accordingly. Meanwhile, during rotation, the valve stem 76 interacts with the rack B78 fixed at the bottom of the pull rod 79. The rotation of the valve stem 76 drives the rack B78 to move, thereby pulling the pull rod 79 to slide inside the cylinder 73 fixed to the side wall of the placement platform 2. The cylinder 73 is connected to the damping cylinders 71 installed on both sides of the housing 44 through the suction pipe 74. The negative pressure inside the cylinder 73 will draw gas from the inside of the damping cylinder 71 through the suction pipe 74, thereby changing the pressure inside the damping cylinder 71. The larger the wafer thickness, the more the valve stem 76... 6. The larger the rotation angle, the longer the rack B78 drives the pull rod 79 to move downward, the stronger the negative pressure inside the cylinder 73, the more gas is absorbed inside the damping cylinder 71, and the lower its internal pressure. Since the piston rod 72 fixed to the side wall of the L-shaped plate 45 slides inside the damping cylinder 71, the lower the pressure inside the damping cylinder 71, the smaller the damping force when the piston rod 72 slides, and thus the smaller the damping force when the cam 57 rotates to drive the L-shaped plate 45 and the clamping block 46 to move, the higher the vibration frequency of the wafer in the vertical direction.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer laser cutting device with an alignment mechanism, comprising a cutting stage (1) and an X-axis drive module (8), a Y-axis drive module (9), and a Z-axis drive module (10), characterized in that: The top of the cutting table (1) is equipped with a placement platform (2), and the surface of the Z-axis transmission module (10) is equipped with a laser cutter (3). The surface of the placement platform (2) is provided with a centering mechanism (4). The centering mechanism (4) includes a groove (41) opened on the surface of the placement platform (2). A slider (42) slides inside the groove (41). A crossbar (43) is fixed on one side of the slider (42). A housing (44) is fixed at one end of the crossbar (43). An L-shaped plate (45) slides inside the housing (44). A clamping block (46) is fixed at one end of the L-shaped plate (45). A turntable (47) driven by a motor is rotatably provided inside the placement platform (2). A rotating rod (48) is rotatably provided between the slider (42) and the turntable (47). A spring is provided inside the housing (44). A jet mechanism (5) is provided above the placement platform (2). The jet mechanism (5) includes a round tube (51) installed above the placement platform (2). A jet ring (52) is installed on the inner side of the round tube (51). An arc-shaped spray ring (55) is connected to the bottom end of the jet ring (52). An elastic plate (54) is fixed between the side wall of the jet ring (52) and the arc-shaped spray ring (55). An air inlet pipe (53) is connected to the outer wall of the round tube (51). A rotating shaft (58) is provided inside the crossbar (43). A blade (56) is sleeved on the surface of the rotating shaft (58). A cam (57) is fixed at one end of the rotating shaft (58). The crossbar (43) is connected to the round tube (51) and the jet ring (52) through a connecting pipe. A compression mechanism (6) is provided on one side of the elastic sheet (54). Adjustment mechanisms (7) are provided on both sides of the housing (44).

2. The wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: One end of the spring is fixedly connected to the inner wall of the housing (44), and the other end of the spring is fixedly connected to the bottom end of the L-shaped plate (45).

3. The wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: The clamping block (46) is arranged in an arc shape, and a rubber pad is fixed to the side wall of the clamping block (46).

4. A wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: The inner opening of the arc-shaped spray ring (55) is inclined, and the bottom end of the arc-shaped spray ring (55) is provided with a plurality of evenly distributed air jet holes.

5. A wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: The extrusion mechanism (6) includes a sleeve (61) installed below the round tube (51), an extrusion rod (62) sliding inside the sleeve (61), and a push rod (63) that slides inside the sleeve (61) fixed at the top of the slider (42).

6. A wafer laser cutting apparatus with an alignment mechanism according to claim 5, characterized in that: One end of the extrusion rod (62) extends to one side of the elastic sheet (54), and the end of the extrusion rod (62) is provided with an extrusion head that is adapted to the side of the elastic sheet (54).

7. A wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: The adjustment mechanism (7) includes damping cylinders (71) installed on both sides of the housing (44), a piston rod (72) that slides inside the damping cylinder (71) is fixed to the side wall of the L-shaped plate (45), a cylinder (73) is fixed to the side wall of the placement platform (2), an air intake pipe (74) is connected between the damping cylinder (71) and the cylinder (73), and a pull rod (79) slides inside the cylinder (73).

8. A wafer laser cutting apparatus with an alignment mechanism according to claim 7, characterized in that: The regulating mechanism (7) also includes a regulating valve (75) installed on the outer wall of the intake pipe (53). A valve stem (76) is rotatably provided on one side of the regulating valve (75). A rack A (77) is fixed on the side wall of the Y-axis transmission module (9). A rack B (78) is fixed at the bottom end of the pull rod (79). Both the rack A (77) and the rack B (78) mesh with the valve stem (76).

9. A wafer laser cutting apparatus with an alignment mechanism according to claim 1, characterized in that: The outer wall of the laser cutter (3) is fitted with a protective cover (11), and the outer wall of the protective cover (11) is connected to an exhaust pipe (12).

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