Wafer suction nozzle assembly with high adsorption reliability for wafer cutting
The wafer suction nozzle assembly with a flexible suction cup and guide block structure achieves high adsorption reliability without a vacuum pump, solving the energy consumption and leakage problems of continuous vacuum pump operation, and improving the reliability and yield of wafer transfer.
Patent Information
- Application Number
- CN202511226324.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-01-27
AI Technical Summary
In the current wafer dicing process, the vacuum nozzle relies on the continuous operation of the vacuum pump, which leads to high energy consumption and easy leakage of the vacuum pipeline, affecting the reliability of wafer transfer and yield.
It adopts a flexible suction cup and guide block structure, and uses a spring to drive the piston to achieve vacuuming of the sealed cavity without the need for a vacuum pump. Combined with the guide block driving the piston to move upward to maintain the suction force and prevent leakage.
It improves the reliability and adhesion of wafer transfer, saves energy, prevents wafer damage caused by vacuum leakage, and increases yield.
Smart Images
Figure CN121403576A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer dicing technology, and more specifically to a wafer dicing nozzle assembly with high adsorption reliability. Background Technology
[0002] In the semiconductor manufacturing industry, wafer transfer and cleaning after dicing are critical processes. After dicing, wafers need to be picked up using a wafer pick-and-place nozzle and transferred to a cleaning facility for cleaning to remove residual debris, impurities, and other contaminants from the dicing process, ensuring a clean wafer surface to meet the requirements of subsequent packaging, testing, and other processes.
[0003] Currently, most wafer suction nozzles widely used in the industry are based on the principle of vacuum adsorption, which uses a vacuum suction cup to adsorb the retaining ring on the outside of the wafer, achieving stable gripping and transfer of the wafer. To maintain the adsorption force of the vacuum suction cup and ensure the reliability of the wafer transfer process, these vacuum nozzles must be continuously connected to a vacuum pump, keeping the vacuum pump in an uninterrupted working state. However, this method of relying on the continuous operation of the vacuum pump has significant drawbacks: on the one hand, the continuous operation of the vacuum pump consumes a lot of energy, increasing production costs and contradicting the concepts of green manufacturing and energy-saving production; on the other hand, the entire vacuum adsorption system includes multiple components such as vacuum pipelines and connectors, which are prone to leakage due to wear and aging during long-term use. Once a leak occurs in the vacuum pipeline, the adsorption force of the vacuum suction cup will drop rapidly, causing the wafer retaining ring to detach, which in turn damages the diced wafer. Because the wafer is small and fragile, damage will directly affect the wafer yield and cause huge economic losses. Summary of the Invention
[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing a wafer suction nozzle assembly with high adsorption reliability for wafer dicing.
[0005] The objective of this invention is achieved through the following technical solution: a wafer dicing nozzle assembly with high adsorption reliability, comprising a support and a plurality of nozzle units disposed around the support;
[0006] The suction unit includes a suction base fixedly connected to a bracket and a suction component located at the bottom of the suction base; the suction component includes a flexible suction cup and a connecting barrel located at the top of the flexible suction cup; the connecting barrel has a piston chamber communicating with the flexible suction cup in a vertical direction; the piston chamber is equipped with a piston component that is sealed and movable.
[0007] The nozzle seat is provided with a guide groove in the vertical direction; a guide block is provided in the guide groove for vertical movement; a connecting rod is provided between the guide block and the top of the piston; a lower push rod is provided at the bottom of the piston; the lower push rod protrudes from the flexible suction cup.
[0008] The nozzle seat has an upper abutting slope and a lower abutting slope; the upper abutting slope is located at the top of the lower abutting slope; the top of the upper abutting slope and the bottom of the lower abutting slope are both located away from the guide block; the bottom of the upper abutting slope and the top of the lower abutting slope are both located close to the guide block; the bottom of the upper abutting slope and the top of the lower abutting slope are connected.
[0009] The guide block is provided with a retractable abutment arm on one side; the abutment arm is used to abut against the upper abutment slope and the lower abutment slope.
[0010] The present invention is further configured such that the guide groove is a shaped groove; the guide block is connected to the shaped groove in a shaped fit.
[0011] The invention is further configured such that the flexible suction cup is made of silicone.
[0012] The present invention is further configured such that an extension arm is provided on one side of the guide block; the extension arm and the abutment arm are telescopically movably configured; and a telescopic spring is provided between the extension arm and the abutment arm.
[0013] The invention is further configured such that a roller is rotatably provided at the end of the abutment arm away from the extension arm; the roller is used to abut against the upper abutment slope and the lower abutment slope.
[0014] The invention is further configured such that the nozzle seat is connected to a safety seat; the safety seat has a safety groove along the horizontal direction; a safety slider is slidably mounted in the safety groove; and the safety slider is used to abut against the guide block.
[0015] The safety slider is connected to a rack; the bottom of the safety seat is rotatably equipped with a swing arm; the swing arm is provided with teeth that mesh with the rack; the swing arm is provided with a pawl.
[0016] The present invention is further configured such that a reset spring is provided between one end of the safety slider and the safety groove; a trigger pin is provided at the other end of the safety slider; and the trigger pin protrudes into the guide groove under the action of the reset spring.
[0017] The present invention is further configured such that a first inclined surface is provided on the other side of the guide block; and a second inclined surface is provided on the trigger pin to cooperate with the first inclined surface.
[0018] The present invention is further configured such that the bracket has a through hole; the top of the guide block is provided with an upper push rod; the upper push rod protrudes from the through hole; the top of the bracket is provided with a pressure plate that can be raised and lowered; the bracket is provided with a driving member; and the output end of the driving member is connected to the pressure plate.
[0019] The present invention is further configured such that a mounting platform is provided in the middle of the bracket.
[0020] The beneficial effects of this invention are as follows: This invention uses the elastic force of a telescopic spring to drive the piston upward, thereby creating a vacuum in the sealed cavity formed by the flexible suction cup and the fixed ring. This eliminates the need for a vacuum pump and vacuum pipeline, improving reliability and saving energy. At the same time, when leakage occurs in the sealed cavity, the guide block can drive the piston upward to further create a vacuum in the sealed cavity, allowing the flexible suction cup to maintain its adsorption force on the fixed ring. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of the present invention in conjunction with a wafer;
[0022] Figure 2 This is a cross-sectional view of the first state of the present invention in conjunction with a wafer;
[0023] Figure 3 yes Figure 2 A magnified view of part A in the middle;
[0024] Figure 4 This is a cross-sectional view of the second state of the present invention in conjunction with a wafer;
[0025] Figure 5 yes Figure 4 A magnified view of part B in the middle;
[0026] Figure 6 This is a schematic diagram of the structure of the present invention;
[0027] The components are as follows: 11. Sealed cavity; 12. Wafer; 13. Fixing ring; 2. Bracket; 21. Perforation; 22. Pressure plate; 23. Drive component; 3. Nozzle seat; 31. Guide groove; 32. Upper abutment slope; 33. Lower abutment slope; 41. Flexible suction cup; 42. Connecting barrel; 43. Piston cavity; 44. Piston component; 45. Lower push rod; 5. Guide block; 51. Connecting rod; 52. Extension arm; 53. First inclined surface; 54. Upper push rod; 6. Abutment arm; 61. Telescopic spring; 62. Roller; 7. Safety seat; 71. Safety groove; 72. Safety slider; 73. Return spring; 74. Trigger pin; 75. Second inclined surface; 81. Rack; 82. Swing arm; 83. Tooth; 84. Claw; 9. Mounting platform. Detailed Implementation
[0028] The present invention will be further described in conjunction with the following embodiments.
[0029] Depend on Figures 1 to 6 As can be seen, the wafer dicing nozzle assembly with high adsorption reliability described in this embodiment includes a support 2 and a plurality of nozzle units disposed around the support 2.
[0030] The suction unit includes a suction seat 3 fixedly connected to the bracket 2 and a suction component located at the bottom of the suction seat 3; the suction component includes a flexible suction cup 41 and a connecting barrel 42 located at the top of the flexible suction cup 41; the connecting barrel 42 is provided with a piston chamber 43 communicating with the flexible suction cup 41 in the vertical direction; the piston chamber 43 is provided with a piston component 44 that is sealed, lifted and lowered.
[0031] The suction nozzle seat 3 is provided with a guide groove 31 in the vertical direction; the guide groove 31 is provided with a guide block 5 that moves up and down; a connecting rod 51 is provided between the guide block 5 and the top of the piston component 44; the bottom of the piston component 44 is provided with a lower push rod 45; the lower push rod 45 protrudes from the flexible suction cup 41.
[0032] The suction nozzle seat 3 is provided with an upper abutting inclined surface 32 and a lower abutting inclined surface 33; the upper abutting inclined surface 32 is located at the top of the lower abutting inclined surface 33; the top of the upper abutting inclined surface 32 and the bottom of the lower abutting inclined surface 33 are both located away from the guide block 5; the bottom of the upper abutting inclined surface 32 and the top of the lower abutting inclined surface 33 are both located close to the guide block 5; the bottom of the upper abutting inclined surface 32 and the top of the lower abutting inclined surface 33 are connected.
[0033] The guide block 5 is provided with a retractable abutment arm 6 on one side; the abutment arm 6 is used to abut against the upper abutment slope 32 and the lower abutment slope 33.
[0034] Specifically, in the wafer dicing high adsorption reliability wafer suction nozzle assembly described in this embodiment, the bracket 2 is connected to an external robotic arm. Initially, the piston 44 is located at the bottom of the piston chamber 43, the guide block 5 is located at the bottom of the guide groove 31, and the end of the abutment arm 6 abuts against the lower abutment slope 33.
[0035] When it is necessary to adsorb the fixing ring 13 outside the wafer 12, the external robot moves the bracket 2 above the wafer 12 and aligns the suction unit with the fixing ring 13 of the wafer 12. Then, the bracket 2 is driven to move downward. The flexible suction cup 41 abuts against the fixing ring 13 to form a sealed cavity 11. The bracket 2 continues to move downward, the flexible suction cup 41 deforms, and the fixing ring 13 pushes the lower push rod 45, piston 44, connecting rod 51 and guide block 5 to move upward until the end of the abutment arm 6 passes the lower abutment slope 33 and moves to the upper abutment slope 32. The volume of the bottom of the piston cavity 43 increases, and the vacuum treatment of the sealed cavity 11 is completed, so that the flexible suction cup 41 completes the vacuum adsorption of the fixing ring 13. In addition, since the end of the abutment arm 6 is located on the upper abutment slope 32, the guide block 5 has a vertically upward component force. When the sealing cavity 11 leaks, the guide block 5 will drive the piston 44 to move upward, continuously evacuating the sealing cavity 11 to maintain the current vacuum level and obtain sufficient adsorption force.
[0036] This embodiment describes a wafer dicing nozzle assembly with high adsorption reliability. The guide groove 31 is a shaped groove; the guide block 5 is connected to the shaped groove in a shaped fit. Specifically, this design prevents the guide block 5 from rotating, ensuring overall stability.
[0037] This embodiment describes a wafer dicing nozzle assembly with high adsorption reliability, wherein the flexible suction cup 41 is made of silicone. This design ensures that the flexible suction cup 41 possesses sufficient strength and flexibility.
[0038] The wafer dicing nozzle assembly with high adsorption reliability described in this embodiment includes an extension arm 52 on one side of the guide block 5; the extension arm 52 and the abutment arm 6 are telescopically movably connected; and a telescopic spring 61 is provided between the extension arm 52 and the abutment arm 6.
[0039] Specifically, when it is necessary to adsorb the retaining ring 13 outside the wafer 12, the external robotic arm moves the support 2 above the wafer 12, aligning the suction nozzle unit with the retaining ring 13 of the wafer 12. Then, the support 2 is driven downwards, and the flexible suction cup 41 abuts against the retaining ring 13 to form a sealed cavity 11. The support 2 continues to move downwards, causing the flexible suction cup 41 to deform, and the retaining ring 13 pushes the lower push rod 45, piston 44, connecting rod 51, and guide block 5 upwards until the end of the abutting arm 6 passes the lower abutting slope 33 and moves to the upper abutting slope 32. Under the action of the telescopic spring 61, the abutting arm 6 then... There is a vertically upward component force between the abutment arm 6, the extension arm 52, and the guide block 5. The abutment arm 6, the extension arm 52, and the guide block 5 will drive the piston 44 to move upward, which will increase the volume of the bottom of the piston chamber 43 until the pressure between the bottom of the piston chamber 43 and the sealing chamber 11 is canceled by the telescopic spring 61. Then the guide block 5 stops moving, completing the vacuuming process of the sealing chamber 11, so that the flexible suction cup 41 can complete the vacuum adsorption of the fixing ring 13. When the sealing chamber 11 leaks, the guide block 5 will drive the piston 44 to move upward, continuously evacuating the sealing chamber 11 to maintain the current vacuum level and obtain sufficient adsorption force.
[0040] This embodiment describes a wafer dicing nozzle assembly with high adsorption reliability. The end of the abutment arm 6 furthest from the extension arm 52 is rotatably equipped with a roller 62. The roller 62 abuts against the upper abutment slope 32 and the lower abutment slope 33. With this configuration, the extension arm 52 can move stably on the upper and lower abutment slopes 32 and 33 via the roller 62.
[0041] This embodiment describes a high-adsorption-reliability wafer dicing nozzle assembly. The nozzle base 3 is connected to a safety seat 7. The safety seat 7 has a horizontally oriented safety groove 71. A safety slider 72 is slidably mounted on the safety groove 71. The safety slider 72 abuts against a guide block 5. A rack 81 is connected to the safety slider 72. A swing arm 82 is rotatably mounted on the bottom of the safety seat 7. The swing arm 82 has teeth 83 that mesh with the rack 81. A pawl 84 is also provided on the swing arm 82. In this embodiment, a return spring 73 is provided between one end of the safety slider 72 and the safety groove 71. A trigger pin 74 is provided at the other end of the safety slider 72. Under the action of the return spring 73, the trigger pin 74 protrudes into the guide groove 31. In this embodiment, a first inclined surface 53 is provided on the other side of the guide block 5. The trigger pin 74 has a second inclined surface 75 that cooperates with the first inclined surface 53.
[0042] Specifically, in the wafer dicing high adsorption reliability wafer suction nozzle assembly described in this embodiment, initially the piston 44 is located at the bottom of the piston chamber 43, the guide block 5 is located at the bottom of the guide groove 31, the end of the abutment arm 6 abuts against the lower abutment slope 33, the end of the trigger pin 74 protrudes into the guide groove 31, and at this time the trigger pin 74 does not contact the guide block 5, and the pawl 84 is in an inclined state.
[0043] When it is necessary to adsorb the retaining ring 13 outside the wafer 12, the external robotic arm moves the support 2 above the wafer 12, aligning the suction nozzle unit with the retaining ring 13 of the wafer 12. The support 2 is then driven downwards, and the flexible suction cup 41 abuts against the retaining ring 13 to form a sealed cavity 11. The support 2 continues to move downwards, causing the flexible suction cup 41 to deform, and the retaining ring 13 pushes the lower push rod 45, piston 44, connecting rod 51, and guide block 5 upwards until the end of the abutting arm 6 passes the lower abutting slope 33 and moves to the upper abutting slope 32. At this point, the extension spring 61... When the piston is pulled down, a vertical upward force is generated between the abutment arm 6, the extension arm 52, and the guide block 5. This force causes the piston 44 to move upward, increasing the volume at the bottom of the piston chamber 43. The pressure between the bottom of the piston chamber 43 and the sealing chamber 11 is then counteracted by the extension spring 61. At this point, the guide block 5 stops moving, completing the vacuuming process of the sealing chamber 11. This allows the flexible suction cup 41 to vacuum-adhere to the fixing ring 13. At this time, the trigger pin 74 is not in contact with the guide block 5, and the chuck 84 is tilted and does not contact the fixing ring 13 outside the wafer 12. Figure 2 and Figure 3 The first state is shown.
[0044] When leakage occurs in the sealing cavity 11, the guide block 5 will drive the piston 44 to move upward, continuously evacuating the sealing cavity 11 to maintain the current vacuum level and obtain sufficient adsorption force. Until the guide block 5 moves to the position of the trigger pin 74, under the action of the first inclined surface 53 and the second inclined surface 75, the guide block 5 pushes the trigger pin 74 back into the safety groove 71. During the horizontal sliding of the safety slider 72, through the action of the rack 81 and teeth 83, the swing arm 82 rotates, causing the pawl 84 to move to the bottom of the fixing ring 13 and support it, thereby preventing the fixing ring 13 from falling off. Figure 4 and Figure 5 The second state is shown.
[0045] This embodiment describes a wafer dicing nozzle assembly with high adsorption reliability. The bracket 2 has a through hole 21. The top of the guide block 5 is provided with an upper push rod 54. The upper push rod 54 protrudes from the through hole 21. The top of the bracket 2 is provided with a pressure plate 22 that can be raised and lowered. The bracket 2 is provided with a driving component 23. The output end of the driving component 23 is connected to the pressure plate 22. The driving component 23 can be a cylinder or a hydraulic cylinder, etc.
[0046] Specifically, when it is necessary to separate the flexible chuck 41 from the fixing ring 13 outside the wafer 12, the drive component 23 is activated. The drive component 23 drives the pressure plate 22 to move downward. The pressure plate 22 pushes the upper push rod 54 to move downward, thereby causing the guide block 5, connecting rod 51 and piston component 44 to move downward. The volume at the bottom of the piston chamber 43 decreases, and the pressure in the sealing chamber 11 gradually increases until the end of the abutment arm 6 passes the upper abutment slope 32 and moves to the lower abutment slope 33. At this point, the pressure in the sealing chamber 11 is the same as the atmospheric pressure, which means that the flexible chuck 41 can be separated from the wafer 12.
[0047] This embodiment describes a wafer dicing nozzle assembly with high adsorption reliability, wherein the support 2 has a mounting platform 9 in the middle. This arrangement facilitates installation with an external robotic arm.
[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing, characterized in that: Includes a support (2) and multiple suction nozzle units disposed around the support (2); The suction unit includes a suction seat (3) fixedly connected to the bracket (2) and a suction component located at the bottom of the suction seat (3); the suction component includes a flexible suction cup (41) and a connecting barrel (42) located at the top of the flexible suction cup (41); the connecting barrel (42) is provided with a piston chamber (43) communicating with the flexible suction cup (41) in the vertical direction; the piston chamber (43) is equipped with a piston component (44) that is sealed, lifted and moved. The suction nozzle seat (3) is provided with a guide groove (31) in the vertical direction; the guide groove (31) is provided with a guide block (5) that moves up and down; a connecting rod (51) is provided between the guide block (5) and the top of the piston (44); a lower push rod (45) is provided at the bottom of the piston (44); the lower push rod (45) protrudes from the flexible suction cup (41); The nozzle seat (3) is provided with an upper abutting inclined surface (32) and a lower abutting inclined surface (33); the upper abutting inclined surface (32) is located at the top of the lower abutting inclined surface (33); the top of the upper abutting inclined surface (32) and the bottom of the lower abutting inclined surface (33) are both located away from the guide block (5); the bottom of the upper abutting inclined surface (32) and the top of the lower abutting inclined surface (33) are both located close to the guide block (5); the bottom of the upper abutting inclined surface (32) and the top of the lower abutting inclined surface (33) are connected. The guide block (5) has a retractable abutment arm (6) on one side; the abutment arm (6) is used to abut against the upper abutment slope (32) and the lower abutment slope (33).
2. The wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: The guide groove (31) is a shaped groove; the guide block (5) is connected to the shaped groove in a shaped fit.
3. The wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: The flexible suction cup (41) is made of silicone.
4. The wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: An extension arm (52) is provided on one side of the guide block (5); the extension arm (52) and the abutment arm (6) are telescopically movably arranged; a telescopic spring (61) is provided between the extension arm (52) and the abutment arm (6).
5. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 4, characterized in that: The abutment arm (6) is rotatably equipped with a roller (62) at one end away from the extension arm (52); the roller (62) is used to abut against the upper abutment slope (32) and the lower abutment slope (33).
6. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: The nozzle seat (3) is connected to a safety seat (7); the safety seat (7) is provided with a safety groove (71) in the horizontal direction; the safety groove (71) is slidably provided with a safety slider (72); the safety slider (72) is used to abut against the guide block (5); The safety slider (72) is connected to a rack (81); the bottom of the safety seat (7) is provided with a swing arm (82); the swing arm (82) is provided with teeth (83) that mesh with the rack (81); the swing arm (82) is provided with a pawl (84).
7. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 6, characterized in that: A reset spring (73) is provided between one end of the safety slider (72) and the safety groove (71); a trigger pin (74) is provided at the other end of the safety slider (72); under the action of the reset spring (73), the trigger pin (74) protrudes into the guide groove (31).
8. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 7, characterized in that: The other side of the guide block (5) is provided with a first inclined surface (53); the trigger pin (74) is provided with a second inclined surface (75) that cooperates with the first inclined surface (53).
9. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: The bracket (2) has a through hole (21); the top of the guide block (5) is provided with an upper push rod (54); the upper push rod (54) protrudes out of the through hole (21); the top of the bracket (2) is provided with a pressure plate (22) that can be raised and lowered; the bracket (2) is provided with a driving member (23); the output end of the driving member (23) is connected to the pressure plate (22).
10. A wafer pick-up nozzle assembly with high adsorption reliability for wafer dicing according to claim 1, characterized in that: The bracket (2) has a mounting platform (9) in the middle.