Insert module for test processor and test tray including the same

Abstract

The present invention discloses a plug-in module for testing a tray, the plug-in module comprising: a pitch adjuster configured to position an electronic device thereon and comprising a first side electrically connected to a connection pin of the electronic device and a second side provided with an electrical contact means, the second spacing of the electrical contact means is wider than the first spacing of the connection pins; and a holder configured to hold the disposed electronic device. According to the present disclosure, the insert module for a test tray and the test tray including the same can perform accurate contact corresponding to a fine pitch of electronic devices, and maintain accurate contact during a test, thereby improving accuracy of the test.

Description

Technical Field

[0001] This disclosure relates to an insertion module for a test tray and a test tray including the insertion module, and more specifically, to an insertion module capable of testing electronic devices with fine pitch and a test tray including the insertion module. Background Technology

[0002] As one of the major modern technologies, high-bandwidth memory (HBM) stems from the increased memory bandwidth required for high-performance applications of computers and graphics processing units.

[0003] Existing Double Data Rate (GDDR) memory technology is widely used in high-performance graphics cards and systems, but it has reached its limits due to the increasing demand for bandwidth. Therefore, memory manufacturers need new technologies that offer higher bandwidth and more efficient data processing.

[0004] To meet this demand, HBM employs an innovative design that forms a stack of memory chips. HBM uses vertically stacked memory chips to achieve high bandwidth and offers the advantages of reduced power consumption and a smaller footprint. Due to these characteristics, HBM has gained attention as memory bandwidth and power efficiency become increasingly important in high-performance computing and graphics processing systems.

[0005] HBMs require testing in their die state before packaging. Compared to existing memory, HBM dies have more contacts, and many of these contacts are set with fine pitch within a limited area. However, a problem with conventional test handlers is that it is difficult to test HBMs through these fine-pitch contacts.

[0006] Existing technical documents

[0007] (Patent Document 1) Korean Patent Publication No. 10-2021-0148743 Summary of the Invention

[0008] One aspect of this disclosure provides an insertion module for a test tray and a test tray including the insertion module, which can quickly and accurately test conventional semiconductors with fine pitch.

[0009] According to this disclosure, an insertion module is provided for testing a tray. The insertion module includes: a spacing adjuster configured to mount at least one electronic device thereon, and including a first side electrically connected to connection pins of the electronic device and a second side provided with electrical contact devices, the second spacing of the electrical contact devices being wider than the first spacing of the connection pins; and a retainer configured to retain the mounted electronic device.

[0010] Here, the electronic device can be a high-bandwidth memory.

[0011] Additionally, the pitch adjuster can be configured to be electrically connected to the connection pins at multiple locations.

[0012] In addition, the first spacing can be less than 0.5mm.

[0013] In addition, the second spacing can be 2 to 10 times the first spacing.

[0014] In addition, the pitch adjuster may include: a plurality of first pins arranged at a first pitch; and a plurality of second pins arranged at a second pitch.

[0015] In addition, the width of the first pin can be less than 0.2mm.

[0016] In addition, the diameter of the second pin can be from 0.3mm to 3mm.

[0017] Additionally, the spacing adjuster may include a spacing adjustment block disposed between the first pin and the second pin, and the spacing adjustment block may include a plurality of connectors electrically connected to the first pin and the second pin respectively.

[0018] In addition, at least a portion of the conductor can be positioned at a certain angle.

[0019] Additionally, the retainer may include: an upper block having a hole formed in its center to allow electronic devices to pass through; and a lower block having a spacing adjuster disposed in its center.

[0020] Additionally, the retainer may include a latching connector having a first side rotatably connected to the upper block and a second side rotatably connected to the lower block.

[0021] Additionally, the latching connector can be configured to pivot upwards as the upper block moves closer to the lower block.

[0022] In addition, the latch connector may also include a latch unit, and the latch unit may have a first side rotatably connected to the upper block and a second side including a push block configured to press the upper part of the electronics.

[0023] In addition, the insertion module may also include at least one elastic element disposed between the upper block and the lower block and providing a restoring force to return the upper block to its initial position.

[0024] In addition, the pusher may include a thermal pad disposed at its end for contact with electronic devices.

[0025] According to embodiments of the present disclosure, a test tray is provided for electronic devices. The test tray includes: a plate including a lower portion configured to be electrically connected to a tester; an insertion module configured to hold an electronic device loaded therein during testing; and a base frame configured to arrange a plurality of insertion modules thereon. The insertion modules include a spacing adjuster and a retainer. The spacing adjuster is configured to place an electronic device thereon and includes a first side electrically connected to connection pins of the electronic device and a second side provided with electrical contact devices. The second spacing of the electrical contact devices is wider than the first spacing of the connection pins. The spacing adjuster is configured to hold the placed electronic device.

[0026] Here, multiple sub-pallets can be arranged on the board.

[0027] In addition, the sub-pallets can be detachably configured in the plate. Attached Figure Description

[0028] Figure 1 This is a perspective view of a test tray for electronic devices according to an embodiment of the present disclosure.

[0029] Figure 2 This is an exploded perspective view of a sub-tray according to an embodiment of the present disclosure.

[0030] Figure 3 This is a perspective view of an insertion module for a test tray according to another embodiment of the present disclosure.

[0031] Figure 4 This is an exploded perspective view of an insertion module for a test tray according to another embodiment of the present disclosure.

[0032] Figure 5 This is a cross-sectional view of a spacing adjuster in an insertion module for a test tray according to another embodiment of the present disclosure.

[0033] Figure 6A yes Figure 5 An enlarged view of the "I" in the image.

[0034] Figure 6B yes Figure 5 An enlarged view of "II" in the image.

[0035] Figure 7 The spacing between the first pins and the spacing between the second pins in an insertion module for a test tray according to another embodiment of the present disclosure are shown.

[0036] Figure 8A , Figure 8B , Figure 8C , Figure 8D , Figure 8E , Figure 8F, Figure 8G and Figure 8H The usage state of the insertion module for the test tray according to an embodiment of the present disclosure is shown. Detailed Implementation

[0037] The insertion module for a test tray and a test tray including the insertion module according to embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. In the following description, the names of the components used may be referred to by other names in the art. However, in alternative embodiments, if these components are functionally similar or identical to each other, they may be considered equivalent components. Furthermore, reference numerals for components are given only for ease of description. However, the components indicated by reference numerals in the drawings are not limited to those shown in the drawings. Similarly, if components are functionally similar or identical to each other, they may be considered equivalent components even if these components are partially modified in the drawings according to alternative embodiments. Furthermore, components that are considered to be included by those skilled in the art will not be described. Additionally, descriptions of components will be omitted if inclusion is obvious to those skilled in the art.

[0038] Below, we will refer to Figure 1 and Figure 2 This describes a test tray including an insertion module for testing a processor according to embodiments of the present disclosure.

[0039] Figure 1 This is a perspective view of a test tray for electronic devices according to an embodiment of the present disclosure. Figure 2 This is an exploded perspective view of a sub-tray according to an embodiment of the present disclosure.

[0040] Reference Figure 1 and Figure 2 According to embodiments of the present disclosure, a test processor for electronic devices is configured to be transported together with a plurality of electronic devices loaded into an insertion module 100. Furthermore, the test processor is configured to perform tests while the electronic devices are loaded into the insertion module 100. The tests can be performed by a device referred to as a "processor," which tests the performance of the electronic devices under specific temperature conditions and classifies the electronic devices based on their performance.

[0041] According to embodiments of this disclosure, a test tray 1 for electronic devices may include an insertion module 100 and a plate 13.

[0042] The insertion module 100 can be configured to be disposed on the board 13. The insertion module can be attached to the board at a location given by the frame. The board is configured for electrical connection between the insertion module and an external tester head. The board may include predetermined circuitry. For example, when the test tray is transported to the test site and operated to connect with the tester, the underside of the board may make electrical contact with the interposer of the external tester head.

[0043] For example, the insertion module can be disposed in multiple sub-trays 10, which are disposed on the test tray 1. The multiple sub-trays 10 can be detachably disposed in the tray.

[0044] In this configuration, the sub-trays can be detachably mounted on the upper side of the board. In other words, more than one sub-tray 10 can be tested while attached to the board, as needed. Furthermore, the test tray 1 can remain in a separate position, and only the sub-trays 10 can be moved to the location for loading or unloading electronic components. The sub-tray 10 can be attached to the board after loading the electronic components to be tested, or it can be detached from the board and transported separately to unload the tested electronic components. In this case, well-known optional fastening elements can be used to attach and detach the sub-tray 10 from the board.

[0045] The sub-tray 10 may include a first base frame 11 and a second base frame 12, which form spaces with a predetermined pattern. The first base frame 11 and the second base frame 12 are vertically coupled and configured to engage with a predetermined number of insertion modules. Each insertion module 100 may hold electronic devices. The loaded electronic devices may make electrical contact with the insertion module 100. Each insertion module 100 may be electrically connected to a board 13. Ultimately, the electronic devices can be electrically connected to the tester via the insertion modules 100 and the board 13.

[0046] However, the aforementioned configuration of the sub-tray can be applied optionally. For example, the sub-tray can be omitted, and the shapes of the first base frame and the second base frame can be changed so that multiple insertion modules can directly contact the plate.

[0047] In addition, the sub-pallet itself can be reshaped to be used as a test pallet.

[0048] In this case, the fastening elements used to connect and disconnect the sub-tray 10 from the plate can also be omitted. In other words, the test tray may include an insertion module, a frame, and a plate.

[0049] The insertion module 100 is configured to reliably secure the electronic components during transport or testing of the test tray 1. In this configuration, when the electronic components are secured to the insertion module 100, their contact terminals can be connected to the electrical contact devices of the insertion module 100.

[0050] Furthermore, the contact terminals of the "electronic device" according to this disclosure can be precisely arranged, i.e., arranged with "fine pitch". According to this disclosure, the electronic device can be a memory semiconductor. In particular, the electronic device according to this disclosure can be a high-bandwidth memory whose contact terminals have fine pitch.

[0051] Below, we will refer to Figures 3 to 8H The insertion module 100 and its operation according to an alternative embodiment of the present disclosure are described below.

[0052] Figure 3 This is a perspective view of an insertion module 100 for an electronic device 100 according to an alternative embodiment of the present disclosure. Figure 4 This is an exploded perspective view of an insertion module 100 for an electronic device according to an alternative embodiment of the present disclosure.

[0053] Reference Figure 3 and Figure 4 According to an alternative embodiment of the present disclosure, the insertion module 100 for electronic devices can be configured to load and selectively hold electronic devices therein.

[0054] When in contact with the tester, the finely arranged contact terminals of the electronic components can place an unnecessary burden on alignment. Furthermore, the processor simultaneously tests the effective operation of the electronic components. In this situation, precisely aligning multiple electronic components and simultaneously connecting them to the tester would be time-consuming and increase the complexity of the equipment.

[0055] According to this disclosure, the insertion module 100 may include contact devices whose spacing is expanded to be greater than the spacing of the contact terminals of the mounted electronic device. According to this disclosure, the insertion module 100 is arranged to be wider than the electronic device fixed thereto and includes strong contact devices to facilitate connection to a tester.

[0056] According to this disclosure, the insertion module 100 may include a retainer 300 and a spacing adjuster 200.

[0057] The retainer 300 and the pitch adjuster 200 are configured to engage with each other in the vertical direction. The retainer 300 and the pitch adjuster 200 can engage with each other to form a slot. The slot can hold an electronic device. The retainer 300 may include a hole formed at its center in the vertical direction, through which the electronic device can be loaded or unloaded. Furthermore, the pitch adjuster 200 may be positioned below the hole.

[0058] The retainer 300 may include an upper block 310, a lower block 320, a latching connector 330, and an elastic unit 340. The upper block 310 and the lower block 320 may be combined to reciprocate a predetermined length in the vertical direction.

[0059] The latch connector 330 can be configured to have a pivot angle that is adjustable according to the distance between the upper block 310 and the lower block 320. The latch connector 330 is configured to be bilaterally symmetrical and includes an end that presses against the top of an electronic device loaded into a slot.

[0060] The latching connector 330 may include a latching unit 331 and a connector 335. The latching unit 331 may include a connecting portion 332 and a pusher block 333. The connecting portion 332 is configured to engage with the upper block 310 on a first side of the latching connector 330 via a first connecting pin 336. The pusher block 333 is configured to press the top of the electronic device on a second side of the latching connector 330. The pusher block 333 may include a thermally conductive pad 334 to minimize the impact of heat when the upper end of the electronic device is pressed. In this case, when the electronic device is tested, for example, thermal conditions from -100 degrees Celsius to 200 degrees Celsius may be applied. However, in some cases, tests may be performed under other temperature conditions, not limited to the aforementioned temperature range.

[0061] The first side of the connector 335 can be engaged to the lower block 320 via a connecting pin. The second side of the connector 335 can be rotatably engaged to the middle part of the latch connector 330 via a second connecting pin 337.

[0062] Additionally, the operation of the latch connector 330 can be predetermined geometrically. According to this disclosure, the pusher block 333 of the latch unit 331 is configured to pivot more than 90 degrees in the upward direction when the upper block 310 moves downward to the position closest to the lower block 320.

[0063] On the other hand, when the external force is removed and the upper block 310 returns to a position away from the lower block 320, the latch connector 330 adjusts to an angle of 90 degrees in the direction opposite to the upward direction and presses the top of the electronic device.

[0064] Additionally, the push blocks 333 provided in the pair of latch connectors 330 can be formed with recessed structures facing each other in the closed position. The recessed structure of the push blocks 333 is to avoid interfering with the PNP device when the slot is closed, in a state where the PNP device has precisely aligned the electronic components in the slot. The dimensions of the recessed structure can be determined so that it does not contact the PNP device even when the latch unit 331 pivots.

[0065] The elastic element 340 can be configured to provide a restoring force to the latching connection. The elastic element 340 is disposed at multiple points between the upper block 310 and the lower block 320, and provides an upward restoring force to the upper block 310.

[0066] The pitch adjuster 200 is configured to expand the electrical contact position while the electronics are fixed.

[0067] The pitch adjuster 200 may include a first pin 210, a pitch adjusting block, and a second pin fixing block 230. The pitch widening block may include a conductor 221, and the second pin fixing block 230 may include a second pin 231. The first pin 210, conductor 221, and second pin 231 may be electrically connected. When the second pin 231 is electrically connected to an external tester, the electronic device loaded into the slot may also be electrically connected to the tester. Furthermore, the configuration of the first pin 210, conductor 221, and second pin 231 of the pitch adjuster 200 may be changed when the position and arrangement of the contact terminals of the electronic device are changed.

[0068] The first pin 210 can be arranged to have a contact profile area with a fine pitch suitable for electronic devices. For example, the first pin 210 can be formed into a plate shape. However, this is only an example, and the shape of the first pin 210 can be changed to have various configurations suitable for fine pitch.

[0069] Although the foregoing example shows the pitch adjuster configured as a block, the pitch adjuster can be implemented with a thin structure in which the minimum spacing between electrical contacts that come into contact with the tester is increased. For example, the pitch adjuster can be configured with a thin structure, such as multilayer circuitry and a glass substrate. The thinness of the pitch adjuster means that the length of the electrical connection between the HBM memory and the tester can be physically shortened. When the length of the electrical connection is physically shortened, the actual response time can be shortened. This trend is likely to increase as operating frequencies become higher.

[0070] Figure 5 This is a cross-sectional view of a pitch adjuster 200 in an insertion module 100 for an electronic device according to an alternative embodiment of the present disclosure. Figure 6A yes Figure 5 Enlarged image of the "I" in the image. Figure 6B yes Figure 5 An enlarged view of "II" in the image.

[0071] Reference Figure 5 , Figure 6A and Figure 6BThe first pins 210 can be arranged on a plane to contact the contact terminals of the electronic device. In this case, the number of first pins 210 can correspond to the number of contact terminals of the electronic device. Furthermore, the first pins 210 can be arranged in the same manner as the contact terminals arranged in the electronic device. That is, the spacing of the first pins 210 can be the same as the spacing of the electronic device. In other words, the upper ends of the contact terminals of the electronic device and the first pins can be formed with the same pattern. Although the arrangement of the first pins 210 with a first spacing P1 has been described, this description is merely an example. When the contact terminals of the electronic device are connected with various spacings, the first pins 210 can be arranged with various spacings corresponding to the contact terminals.

[0072] Furthermore, according to this disclosure, the first pitch P1 between the first pins 210 can be 0.5 mm or less. In some cases, the first pitch can be 0.2 mm or less. Additionally, the thickness of the first pins 210 can be 0.2 mm or less. Furthermore, the width of the electrical contact portion of the first pins can be 0.05 mm or less. For example, the first pitch between the first pins can be selected in the range of 0.09 mm to 0.165 mm, corresponding to the pitch of mass-produced HBM dies.

[0073] The second pin retaining block 230 may include a plurality of second pins 231. The plurality of second pins 231 may be arranged with a second spacing P2 wider than the first spacing P1. The second pins 231 are configured to be electrically connected to electrical contacts on the board. The second pins 231 may be configured to penetrate the second pin retaining block 230 in the vertical direction. The second pins 231 may be configured to minimize damage and ensure reliable electrical contact even during repeated contact with an external board. Furthermore, the second spacing P2 may be in the range of 0.3 mm to 3 mm. In this case, the thickness of the second pins 231 may be from 0.1 mm to 3 mm.

[0074] Furthermore, the second spacing P2 can be increased further compared to the first spacing P1. For example, the second spacing can be increased from 1.1 times to 20 times the first spacing.

[0075] For example, the second pin 231 can be configured as a pogo pin. The pogo pin can be configured with a pair of hollow pins, open on one side and joined together in the longitudinal direction. The pogo pin can contain an elastomer, and its length decreases when pressed vertically. In other words, the length of the pogo pin changes according to the external force, and the electrical connection is maintained even with this length change. Therefore, even when the insertion module 100 is in general contact with the board, the pogo pin minimizes impact and maintains stable contact. Furthermore, even with repeated use, the pogo pin is protected against wear and tear, thus providing optimal performance over a long period.

[0076] A pitch adjustment block 220 is disposed between the first pin 210 and the second pin fixing block 230 and configured to adjust the pitch. The pitch adjustment block 220 may include a plurality of conductors 221. At least a portion of the conductors 221 may be arranged along an inclined path within the pitch adjustment block 220. Each conductor 221 may have an upper end exposed at the top of the pitch adjustment block 220 and a lower end exposed at the bottom of the pitch adjustment block 220. The upper end of the conductor 221 may be in electrical contact with the first pin 210. Furthermore, the lower end of the conductor 221 may be in electrical contact with the second pin 231 of the second pin fixing block 230.

[0077] Conductor 221 can be arranged in three dimensions within spacing adjustment block 220. Typically, conductor 221 can be arranged downwards with a wider spacing within spacing adjustment block 220.

[0078] Furthermore, although the foregoing embodiments illustrate an example of first pins arranged with a first pitch, the minimum spacing between adjacent first pins can also be the first pitch. Moreover, the first pins can be arranged with various spacings wider than the first pitch as needed. In this case, the minimum spacing between adjacent second pins can be the second pitch, and even in this case, the second pitch can be wider than the first pitch.

[0079] Figure 7 The spacing of the first pin 210 and the spacing of the second pin 231 in an insertion module 100 for an electronic device according to an alternative embodiment of the present disclosure are shown.

[0080] Reference Figure 7 The second pin 231 can be arranged with a wider spacing than the first pin 210. Therefore, high-precision electrical contacts are not required after the electronics are accurately loaded into the insertion module 100. This configuration increases the margin of error for alignment of the insertion module 100 on the base frame, thereby enabling a faster bonding process.

[0081] According to this disclosure, the insertion module 100 holds and transports the electronic device in its unpackaged, bare die state, thereby preventing damage to the electronic device during transport of the test tray 1 or during pressing for testing. Furthermore, once the spacing adjuster and the contact terminals of the electronic device are pre-connected electrically, the electrical connection is maintained until unloading. Therefore, reconnection is unnecessary, thus preventing deformation or damage to the contact terminals of the electronic device.

[0082] Below, we will refer to Figures 8A to 8H The operation of an insertion module 100 and a test tray 1 for an electronic device according to embodiments of the present disclosure is described. Figures 8A to 8H For ease of description, other components, such as the first and second base frames of the test tray and the tester, are omitted.

[0083] For ease of description, the operation of loading electronic device 1000 into insertion module 100 will be described. However, these operations are merely examples and may be reversed during unloading. Furthermore, only one cross-section of insertion module 100 is shown, but this is only an example. Alternatively, multiple electronic devices can be picked up by hand simultaneously and loaded into insertion module 100 at the same time. Similarly, multiple electronic devices can be unloaded simultaneously.

[0084] Figure 8A , Figure 8B , Figure 8C , Figure 8D , Figure 8E , Figure 8F , Figure 8G and Figure 8H The usage state of the insertion module 100 for electronic devices according to an embodiment of the present disclosure is shown.

[0085] Reference Figure 8A The test tray 1 is transported to the loading position and temporarily secured. In this case, the pickup (or hand) 2000 picks up the electronic device 1000 from the user tray (not shown) and transports the electronic device to a position above the test tray 1. The pickup 2000 may include a suction unit 2200 and a pickup pusher 2100 for the electronic device 1000. The suction unit 2200 may be configured to move up and down independently of the pickup pusher 2100.

[0086] Reference Figure 8B The pickup pusher 2100 moves downward to contact the upper block 310 of the insertion module.

[0087] Reference Figure 8C The pickup pusher 2100 moves downward and pushes the upper block 310. In this case, the force is transmitted to the latch connector 330, so the pusher block 333 pivots upward.

[0088] Reference Figure 8D The pickup pusher 2100 further pushes the upper block 310, and the latch connector 330 is fully opened. Additionally, the pickup 2000 may include a vision system. Through the vision system, the pickup 2000 can detect the relative position between the slot and the electronic device 1000, and perform precise alignment for the horizontal position of the electronic device 1000.

[0089] Reference Figure 8E When the position of the electronic device 1000 is horizontally aligned with the position of the first pin 210, the suction unit 2200 moves downward and places the electronic device 1000 on the top surface of the first pin 210.

[0090] Reference Figure 8FWith the electronic device 1000 placed on the top surface of the first pin 210, the position of the suction unit 2200 is fixed, and then the pickup pusher 2100 moves upward. As the pickup pusher 2100 moves upward, the latching connector 330 gradually closes.

[0091] Reference Figure 8G When the pickup pusher 2100 moves upward and separates from the pusher 333, the latch connector 330 closes completely, thereby pushing against the top of the electronic device 1000. In this case, even if the latch connector 330 pivots from the open position to the closed position, the latch connector 330 will not interfere with the suction unit 2200 due to its recessed structure.

[0092] Reference Figure 8H The electronic device 1000 is fixed in the slot by the latch connector 330, and the suction unit 2200 and the pickup pusher 2100 move upward to complete the loading operation of the electronic device 1000.

[0093] As described above, the electronic components loaded into the insertion module are transported to the tester with their positions aligned and their connection pins electrically connected to the test tray. Furthermore, while maintaining the electrical connection between the electronic components and the test tray, the test tray is also electrically connected to the tester.

[0094] When the test tray is electrically connected to the tester, the electrical contact device of the test tray makes electrical contact with the tester, thereby achieving contact quickly and rapidly without requiring excessive precision.

[0095] As described above, the insertion module for the test tray according to this disclosure and the test tray including the insertion module enable accurate contact corresponding to the fine pitch of the electronic device, and the test is performed using pins with an expanded pitch. Therefore, damage to unpackaged electronic devices is minimized. Furthermore, because no additional alignment of the electronic device is required immediately before testing, testing is performed quickly.

[0096] According to this disclosure, the insertion module for the test tray and the test tray including the insertion module are capable of making accurate contact corresponding to the fine pitch of the electronic device and maintaining precise contact during testing, thereby improving the accuracy of the test.

[0097] In addition, it prevents unpackaged dies from being damaged during testing.

[0098] Furthermore, no additional alignment of electronic components is required immediately before testing, allowing for rapid testing and classification of electronic components.

Claims

1. An insertion module for testing a processor, the insertion module comprising: A pitch adjuster is configured to mount at least one electronic device thereon and includes a first side electrically connected to a connection pin of the electronic device and a second side provided with an electrical contact device, the second pitch of the electrical contact device being wider than the first pitch of the connection pin; as well as A retainer configured to hold the placed electronic device.

2. The insertion module according to claim 1, wherein, The electronic device includes a high-bandwidth memory.

3. The insertion module according to claim 2, wherein, The pitch adjuster is configured to be electrically connected to the connection pin at multiple locations.

4. The insertion module according to claim 3, wherein, The first spacing is less than 0.5 mm.

5. The insertion module according to claim 4, wherein, The second spacing is 2 to 10 times the first spacing.

6. The insertion module according to claim 3, wherein, The spacing adjuster includes: A plurality of first pins, the plurality of first pins being arranged at the first spacing; and Multiple second pins, the multiple second pins being arranged at the second spacing.

7. The insertion module according to claim 6, wherein, The width of the first pin is less than 0.2 mm.

8. The insertion module according to claim 6, wherein, The diameter of the second pin is 0.3 mm to 3 mm.

9. The insertion module according to claim 6, wherein, The spacing adjuster further includes a spacing adjustment block disposed between the first pin and the second pin, and The pitch adjustment block includes multiple connectors that are electrically connected to the first pin and the second pin, respectively.

10. The insertion module according to claim 9, wherein, At least a portion of the conductor is positioned at a certain angle.

11. The insertion module according to claim 6, wherein, The retainer includes: An upper block having a hole formed in its center to allow the electronic device to pass through it; and The lower block has the spacing adjuster disposed at its center.

12. The insertion module according to claim 11, wherein, The retainer also includes a latching connector having a first side rotatably connected to the upper block and a second side rotatably connected to the lower block.

13. The insertion module according to claim 12, wherein, The latching connector is configured to pivot upward as the upper block moves closer to the lower block.

14. The insertion module according to claim 13, wherein, The latching connector also includes a latching unit, and One side of the latching unit is rotatably connected to the upper block. A push block is provided on the other side of the latch unit, and the push block is configured to press the upper part of the electronic device.

15. The insertion module of claim 14, further comprising at least one elastic element disposed between the upper block and the lower block and providing a restoring force to return the upper block to its initial position.

16. The insertion module according to claim 13, wherein, The pusher also includes a thermal pad disposed at its end for contact with the electronic device.

17. A test tray for electronic devices, the test tray comprising: The plate includes a lower portion configured to be electrically connected to a tester; An insertion module configured to hold the electronic device loaded therein during testing; as well as A base frame configured to arrange a plurality of the insertion modules thereon. The insertion module includes: A pitch adjuster configured to mount the electronic device thereon, and including a first side electrically connected to the connection pins of the electronic device and a second side provided with electrical contact devices, the second pitch of the electrical contact devices being wider than the first pitch of the connection pins; as well as A retainer configured to hold the placed electronic device.

18. The test tray of claim 17, further comprising a sub-tray, the sub-tray including a lower portion configured to be electrically connected to the board and configured to have a plurality of the insertion modules disposed thereon.

19. The test tray according to claim 18, wherein, The sub-tray is detachably disposed within the plate.

20. The test tray according to claim 17, wherein, The electronic device includes a high-bandwidth memory, or HBM.

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