Sound production device

Abstract

The embodiment of the invention provides a sound production device which comprises a shell, a first support, a mainboard, a sliding sensor and a pressure sensing assembly, an inner containing cavity is defined by the shell, the mainboard is arranged in the inner containing cavity, the first support is fixed to the mainboard, and the sliding sensor is arranged on the first support and directly attached to the inner wall of the shell. The pressure sensing assembly is connected to the side, away from the inner wall, of the sliding sensor and supported on the main board, and the pressure sensing assembly and the pressure sensing assembly are electrically connected with the main board. According to the sound production device provided by the embodiment of the invention, the sliding sensor and the main board are arranged on the first bracket, the pressure-sensitive component is arranged on one side, far away from the inner wall, of the sliding sensor, all the components are stacked to form an integral structure, and the sliding sensor can be attached to the inner wall without being fixed to the inner wall through an adhesive. In the assembling process, the sliding sensor, the mainboard, the pressure sensing assembly and the first support can be integrally installed, the assembling process is convenient and rapid, and the method can be applied to a shell of an integrated structure and a shell of a split structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of consumer electronics, in particular to a sound generating device. BACKGROUND

[0002] With the development of technology, earphones, sound devices and the like sound generating devices are becoming more and more popular. In order to control the sound generating device, in the related art, the sound generating device is usually controlled by sliding control, pressing control and the like, such as volume adjustment, switching and the like. In the related art, the sound generating device realizes sliding control and pressing control by integrating a sliding sensor and a pressure sensor in the shell. In the current sound generating device, the sliding sensor and the pressure sensor are integrally fixed on the shell of the sound generating device by adhesion. For the integrated structure of the shell, it is difficult to integrally adhere the sliding sensor and the pressure sensor to the inner wall of the shell during assembly. Such structure can only be applied to the split type shell, and the application range is limited. SUMMARY

[0003] The present application aims to provide a sound generating device to at least partially solve the above technical problems.

[0004] The present application provides a sound generating device, which comprises a shell, a first support, a main board, a sliding sensor and a pressure sensing assembly. The shell encloses an inner cavity. The main board is arranged in the inner cavity. The first support is arranged in the inner cavity and fixed to the main board. The sliding sensor is arranged on the first support and directly attached to the inner wall of the shell. The pressure sensing assembly is connected to the side of the sliding sensor away from the inner wall and supported on the main board. The pressure sensing assembly and the main board are electrically connected.

[0005] The sound generating device provided by the present application has the advantages that the sliding sensor and the main board are arranged on the first support, the pressure sensing assembly is arranged on the side of the sliding sensor away from the inner wall and supported on the main board, and the various components are stacked to form an integrated structure. Therefore, the sliding sensor can be kept in the attached state with the inner wall without the need for adhesion. During assembly, the sliding sensor, the main board, the pressure sensing assembly and the first support can be integrally assembled, which is convenient and fast. The sound generating device can be conveniently assembled for the integrated structure of the shell and the split type structure of the shell, and has a wider application range.

[0006] These and other aspects of the present application will become more apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0008] Figure 1 is a structural schematic diagram of an earphone and an earphone box according to an embodiment of the present application.

[0009] Figure 2 is a structural schematic diagram of an earphone according to an embodiment of the present application.

[0010] Figure 3 is a partial sectional structural schematic diagram of an earphone according to an embodiment of the present application.

[0011] Figure 4 is a partial sectional structural schematic diagram of a shell of an earphone according to an embodiment of the present application.

[0012] Figure 5 is a partial sectional structural schematic diagram of another shell of an earphone according to an embodiment of the present application.

[0013] Figure 6 is Figure 3 is an enlarged view of A in FIG. 4.

[0014] Figure 7 is a structural schematic diagram of a sliding sensor in an earphone according to an embodiment of the present application.

[0015] Figure 8 is a schematic diagram of an assembly structure of a sliding sensor and a pressure sensing component in an earphone according to an embodiment of the present application.

[0016] Figure 9 is a schematic diagram of another assembly structure of a sliding sensor and a pressure sensing component in an earphone according to an embodiment of the present application.

[0017] Figure 10 is a partial structural schematic diagram of a first support in an earphone according to an embodiment of the present application.

[0018] Figure 11 is a partial sectional structural schematic diagram of another earphone according to an embodiment of the present application.

[0019] Figure 12 is Figure 11 is an enlarged view of B in FIG. 5. DETAILED DESCRIPTION

[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. The embodiments, implementation manners and technical features in the present application can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0021] The sliding sensor needs to be in contact with the operation surface of the user during operation to accurately identify the operation instruction of the user. At present, the sound generating device such as earphone usually sets the sliding control and pressing control device on the earphone rod. The shell of the earphone rod has two forms. One shell is a split structure formed by two or more parts separated from each other after assembly. The sliding sensor can be installed by the method of first bonding the sliding sensor and then assembling. The other shell is a one-piece structure. This shell is usually a cylindrical structure. Since it is difficult to coat adhesive on the inner wall of the shell, the sliding sensor cannot be installed and fixed.

[0022] Based on this, the inventors of the present application propose a sound generating device that can adapt to different shell designs. The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0023] Referring to Figure 1 , the present embodiment provides a sound generating device 10, which is an earphone. The earphone can be accommodated in an earphone box 20. The earphone box 20 includes a box body 21 and a box cover 22. The box cover 22 is arranged on the box body 21 and can selectively open or close the box body 21. For example, the box cover 22 can be connected to the box body 21 by a hinged manner or can be detachably clamped to the box body 21, which is not limited herein.

[0024] Please continue to refer to Figure 1 , the sound generating device 10 can include a first earphone 11 and a second earphone 12 for the user to wear on the left ear and the right ear. The first earphone 11 and the second earphone 12 can be communicatively connected by a wireless manner or can be communicatively connected with other electronic devices (such as a mobile phone, a computer, a tablet computer, a smart wearable device, etc.). It can be understood that in some other implementation manners, the sound generating device 10 can also have only one or more, which is not limited herein.

[0025] Referring to Figure 2 , each sound generating device 10 can include an ear insertion part 13 and a connecting rod part 14. The ear insertion part 13 is connected to the connecting rod part 14. The ear insertion part 13 is configured to be suitable for being inserted into the human ear. The connecting rod part 14 is located outside the ear when worn and can be operated by the user.

[0026] In this embodiment, referring to Figure 3 , the sound production device 10 comprises a shell 40, a first support 60, a main plate 50, a sliding sensor 70 and a pressure sensing assembly 80, wherein the shell 40 encloses an inner cavity 43, and the first support 60, the main plate 50, the sliding sensor 70 and the pressure sensing assembly 80 are all arranged in the inner cavity 43 formed by the shell 40.

[0027] Specifically, in this embodiment, the shell 40 is a shell of the connecting rod part 14, and the shell 40 is a substantially cylindrical structure, and the shell 40 has an inner wall 48. In this embodiment, referring to Figure 3 and Figure 4 , the shell 40 comprises a barrel 41 and a plug 42, the longitudinal section of the barrel 41 is a substantially flat structure, the inner cavity 43 is formed in the barrel 41, and the plug 42 is arranged at one end of the barrel 41 and closes one end of the inner cavity 43. Specifically, the plug 42 is arranged at the end of the barrel 41 away from the ear-in part 13. In other embodiments, the longitudinal section of the barrel 41 can also be a circular structure or other types of structures, which are not limited in this embodiment. In this embodiment, the barrel 41 is an integral structure, i.e., the barrel 41 is a continuous structure.

[0028] In some embodiments, referring to Figure 4 , the plug 42 and the barrel 41 can be fixed by interference fit or relatively fixed by threaded connection. In this embodiment, the plug 42 and the barrel 41 are fixed by glue dispensing. The glue dispensing can completely seal the gap between the plug 42 and the barrel 41, improve the sealing performance of the inner cavity 43, and avoid the influence of external moisture and impurities on the electrical elements in the inner cavity 43.

[0029] In another embodiment, referring to Figure 5 , the shell 40 comprises a first shell 45 and a second shell 46, the longitudinal sections of the first shell 45 and the second shell 46 are both substantially semicircular, and the first shell 45 and the second shell 46 match with each other and can be detachably assembled to form a cylindrical structure. When the first shell 45 and the second shell 46 are assembled together, the inner cavity 43 is enclosed, and the end of the inner cavity 43 is closed. In other embodiments, the shell 40 can also be assembled by multiple parts, which are not limited in this embodiment.

[0030] Please refer to Figure 3The mainboard 50 is disposed in the inner cavity 43, and the mainboard 50 can be integrated with a processor, a memory and the like, the memory can store operation instructions, and the processor can call the operation instructions stored in the memory and control the sound production device 10 to perform predetermined operations. The mainboard 50 is generally plate-shaped, and the mainboard 50 can be fixed in the inner cavity 43 in various ways, for example, directly or indirectly with the shell 40. For example, the mainboard 50 can be fixed to the plug 42 or the barrel 41. In this embodiment, the surface of the plug 42 facing the inner cavity 43 is provided with a limiting groove 44, and the structure of the limiting groove 44 can be matched with the structure of the mainboard 50. The mainboard 50 is at least partially embedded in the limiting groove 44 to form a fixed structure. In some embodiments, the mainboard 50 can be fixed in the limiting groove 44 by interference fit, and in other embodiments, the mainboard 50 can also be fixed in the limiting groove 44 by point gluing. Of course, in other embodiments, the mainboard 50 can also be fixed to the plug 42 by clamping and the like.

[0031] Please refer to Figure 3 and Figure 6 The first support 60 is disposed in the inner cavity 43, and the first support 60 is fixed to the mainboard 50. The first support 60 is generally located between the inner wall 48 and the mainboard 50, and the first support 60 can be used to support the sliding sensor 70. This embodiment does not limit the structure of the first support 60, and the first support 60 can be configured in any configuration. The surface of the first support 60 away from the mainboard 50 can be configured as a flat structure to accommodate the sliding sensor 70.

[0032] The sliding sensor 70 is disposed on the first support 60 and directly abuts the inner wall 48 of the shell 40. Specifically, in this embodiment, the sliding sensor 70 is disposed on the surface of the first support 60 away from the mainboard 50, and the surface of the sliding sensor 70 away from the first support 60 abuts the inner wall 48. That is, the first support 60 supports the sliding sensor 70, so that the sliding sensor 70 is directly abutted on the inner wall 48 and always abuts the inner wall 48. In this way, there is no need to set adhesive between the sliding sensor 70 and the inner wall 48, and the sliding sensor 70 and the inner wall 48 can always be kept in abutting state. That is, the sliding sensor 70 is clamped between the first support 60 and the inner wall 48, so that the sliding sensor 70 always keeps in abutting state with the inner wall 48.

[0033] The sliding sensor 70 can be directly laid on the surface of the first support 60, or a back adhesive can be arranged on the surface of the first support 60 away from the main board 50, so that the sliding sensor 70 is adhered and fixed with the first support 60. In other embodiments, the sliding sensor 70 can also be fixed with the first support 60 by other means, such as fastening together by screws or the like, or by arranging buckles on the first support. The present embodiment does not limit this. In some other embodiments, a groove can be formed on the first support 60, so that the sliding sensor 70 is at least partially embedded in the groove when arranged, which can reduce the space occupied by the sliding sensor 70 when arranged.

[0034] In the present embodiment, referring to Figure 7 The sliding sensor 70 includes at least two sensing elements 72 and a flexible circuit board 71, and the at least two sensing elements 72 are arranged side by side on the flexible circuit board 71, and the flexible circuit board 71 is supported on the first support 60. When the user performs a sliding operation, different sensing elements 72 detect the touch signal of the user in turn, that is, the sliding direction of the user can be determined according to the position and the order of the touch signal. Figure 7 In the illustrated embodiment, the sliding sensor 70 includes three sensing elements 72, and the three sensing elements 72 are arranged side by side in the same direction. It can be understood that in some other embodiments, the number of sensing elements 72 can also be other values, and the present embodiment does not limit this. In some other embodiments, the at least two sensing elements 72 can also be arranged side by side in multiple directions, so that the sliding sensor 70 can detect the sliding operation of the user in multiple directions and execute different control instructions correspondingly.

[0035] The sliding sensor 70 is electrically connected with the main board 50, specifically, the flexible circuit board 71 is electrically connected with the main board 50 after wiring. When the user performs a sliding operation on the shell 40, the sliding sensor 70 detects the sliding signal and sends the sliding signal to the processor on the main board 50, and the processor can call the control instruction corresponding to the sliding signal stored in the memory, and then can execute the corresponding operation instruction according to the user's pressing operation.

[0036] It should be further pointed out that, in order to facilitate user operation, the sliding sensor 70 can be arranged below the part of the shell 40 which does not contact the user's body surface in the wearing state. Of course, according to different use requirements, it is also feasible to arrange the sliding sensor 70 at other positions of the shell 40, and the present embodiment does not limit this.

[0037] Please continue to refer to Figure 3 and Figure 6The pressure sensing assembly 80 is connected to the side of the sliding sensor 70 away from the inner wall 48 and supported on the main plate 50. Meanwhile, the pressure sensing assembly 80 is electrically connected with the main plate 50. In this way, when the user performs the pressing operation in the detection area of the sliding sensor 70, the pressure sensing assembly 80 can collect the pressing signal and send the pressing signal to the processor on the main plate 50, the processor can call the control instruction corresponding to the pressing signal stored in the memory, and then the corresponding operation instruction can be executed according to the pressing operation of the user.

[0038] In the embodiment, the pressure sensing assembly 80 is supported on the main plate 50, and the main plate 50 can provide support for the pressure sensing assembly 80. When the user presses the detection area of the sliding sensor 70, the pressure sensing assembly 80 deforms. Since the main plate 50 can provide support for the pressure sensing assembly 80, the deformation amount of the pressure sensing assembly 80 itself can be larger, and the detection accuracy is higher.

[0039] In order to facilitate the setting of the pressure sensing assembly 80, in the embodiment, the first support 60 is also provided with a receiving portion 61 penetrating the first support 60. The receiving portion 61 can be a through hole formed in the first support 60, or can be a notch, a groove or the like formed in the edge of the first support 60, which is not limited in the embodiment.

[0040] The pressure sensing assembly 80 is located in the receiving portion 61 and supported on the main plate 50. In this way, the first support 60 can form an avoidance for the pressure sensing assembly 80, so that the sliding sensor 70 can be completely supported on the first support 60 when being set, without affecting the setting of the pressure sensing assembly 80. The contact area between the sliding sensor 70 and the inner wall 48 can be increased, the detection area can be expanded, and the detection accuracy can be improved. In other embodiments, the receiving portion 61 can not be provided, and the pressure sensing assembly 80 can be arranged along the edge of the first support 60.

[0041] In the embodiment, please refer to Figure 6 and Figure 8 The pressure sensing assembly 80 includes a sensor 81, a circuit board 82, a buffer 84 and a reinforcing member 83. The reinforcing member 83 is used to improve the structural rigidity of the entire pressure sensing assembly 80, so that the deformation of the pressure sensing assembly 80 during the pressing operation of the user is only transmitted within a limited range, avoiding the deformation from being transmitted to the main plate 50 and causing damage to the main plate 50. The reinforcing member 83 can be made of metal or other materials with high structural rigidity. In the embodiment, the reinforcing member 83 is a steel sheet.

[0042] Circuit board 82 is attached to one side of the reinforcing member 83 and can be electrically connected to the main board 50 via wiring. Sensor 81 is disposed on the surface of circuit board 82 away from the reinforcing member 83. A pad 88 can also be provided between sensor 81 and circuit board 82, with sensor 81 mounted on the pad 88 for easy placement. Buffer 84 is disposed on the surface of sensor 81 away from circuit board 82. Buffer 84 provides sufficient deformation space. When the user presses the detection area of ​​sliding sensor 70, the pressure is transmitted to pressure-sensitive assembly 80. Sensor 81 detects the change in pressure signal and sends the pressing signal to the processor. During this process, buffer 84 deforms. When the pressing pressure disappears, buffer 84 returns to its original deformation, causing the entire pressure-sensitive assembly 80 to reset to its initial position.

[0043] The buffer 84 is made of a material with strong deformation properties, such as silicone, foam, etc., and this embodiment does not limit it.

[0044] In this embodiment, please continue to refer to Figure 6 and Figure 8 The surface of the reinforcing member 83 furthest from the circuit board 82 is bonded to the surface of the sliding sensor 70 furthest from the inner wall 48 via an adhesive backing layer 73. Specifically, the surface of the reinforcing member 83 furthest from the circuit board 82 is bonded to the flexible circuit board 82 of the sliding sensor 70 via an adhesive backing layer 73. The buffer member 84 is supported on the main board 50. Specifically, the buffer member 84 is bonded to the main board via an adhesive backing layer 85 and is supported on the main board 50. The advantage of this arrangement is that the rigid reinforcing member 83 is closer to the outer shell 40, the rigidity of the entire pressure-sensitive assembly 80 is stronger, and it is more conducive to protecting the pressure-sensitive assembly 80 and other components within the inner cavity 43.

[0045] In another implementation, see Figure 9 The surface of the reinforcing member 83, away from the circuit board 82, is supported on the main board 50. The buffer member 84 is bonded to the surface of the sliding sensor 70, away from the inner wall 48. That is, one end of the buffer member 84, away from the sensor 81, is bonded to the flexible circuit board 82 of the sliding sensor 70 through the adhesive layer 73. At this time, the reinforcing member 83 can be directly bonded to the surface of the main board 50. The advantage of this implementation is that the buffer member 84 is closer to the outer shell 40. Therefore, when the user performs a pressing operation, a slight force can cause the buffer member 84 to deform, and the sensor 81 can detect the change in pressure signal. Therefore, the detection is more sensitive and the user's operation is simpler.

[0046] In other embodiments, the pressure-sensitive component 80 may also be other forms of pressure-sensitive components, such as capacitive pressure-sensitive components, etc., and this embodiment does not limit it.

[0047] In this embodiment, see Figure 10, the sound production device 10 further comprises an antenna 65, which is arranged on the first support 60 and electrically connected with the main plate 50, that is, the antenna 65 and the sliding sensor 70 share the first support 60, and the sliding sensor 70 is arranged by borrowing the first support 60 for arranging the antenna 65, which can reduce the space occupation in the content cavity 43, and does not need to additionally increase components, thereby reducing the cost. In other embodiments, the antenna 65 can also be arranged by a separate support, which is not limited in the present embodiment. In terms of the form of the antenna, the antenna 65 can be various types of antennas, such as FPC antenna, LDS antenna, etc., which are not limited in the present embodiment. In terms of the function of the antenna, the antenna 65 can be a Bluetooth antenna and / or a WiFi antenna, etc., which are not limited in the present embodiment.

[0048] In some embodiments, please refer to Figure 11 and Figure 12 , in order to leave enough deformation space for the pressure sensing assembly 80, the thickness of the buffer 84 can be set to be larger, for example, the thickness of the buffer 84 can be greater than or equal to 1 mm. At this time, the space of the accommodation portion 61 can not be enough to completely accommodate the pressure sensing assembly 80, therefore, in the present embodiment, the main plate 50 can be provided with a fixing groove 51 corresponding to the accommodation portion 61, and the pressure sensing assembly 80 can be at least partially located in the fixing groove 51. Specifically, one end of the pressure sensing assembly 80 away from the sliding sensor 70 partially extends into the fixing groove 51 and is supported on the main plate 50. After being arranged in this way, the fixing groove 51 and the accommodation portion 61 simultaneously accommodate the pressure sensing assembly 80, leaving more setting space for the pressure sensing assembly 80.

[0049] In the process of being supported on the main plate 50, the pressure sensing assembly 80 can be directly supported on the main plate 50, for example, one end of the pressure sensing assembly 80 away from the sliding sensor 70 can be directly bonded on the main plate 50.

[0050] In the present embodiment, further, please continue to refer to Figure 11 and Figure 12 , the sound production device 10 can further comprise a second support 90, one end of the pressure sensing assembly 80 away from the sliding sensor 70 is arranged on the second support 90, and the second support 90 is supported on the main plate 50. By arranging the second support 90, on the one hand, the distance between the pressure sensing assembly 80 and the main plate 50 can be conveniently adjusted, so that the sliding sensor 70 can be just attached to the inner wall 48 of the shell 40 in the initial state; on the other hand, the structure of the second support 90 can be accurately designed to control the contact position of the second support 90 with the main plate 50, while reducing the contact area of the second support 90 with the main plate 50 when being supported on the main plate 50, which can avoid other components arranged on the main plate 50 and avoid interference with other components.

[0051] Specifically, in the present embodiment, asFigure 12 As shown, the second support 90 comprises a support portion 91 and at least one leg 92 connected to the support portion 91, the support portion 91 can be configured as a substantially flat structure, the pressure sensing assembly 80 is arranged on the side surface of the support portion 91 away from the leg 92, in order to make the connection between the pressure sensing assembly 80 and the support portion 91 tight, a back adhesive can be arranged between the pressure sensing assembly 80 and the support portion 91, and the leg 92 is supported on the main plate 50, wherein the number of the leg 92 can be one, two or more, which is not limited in the embodiment. In some embodiments, when the number of the leg 92 is greater than or equal to 2, at least one leg 92 can be arranged in a symmetrical arrangement, so that the support force received by the pressure sensing assembly 80 is more balanced. In the embodiment, as shown, the number of the leg 92 is 2. In order to stably connect the leg 92 and the main plate 50, a back adhesive can also be arranged between the leg 92 and the main plate 50 for connection. Figure 12 As shown, the number of the leg 92 is 2. In order to stably connect the leg 92 and the main plate 50, a back adhesive can also be arranged between the leg 92 and the main plate 50 for connection.

[0052] In some embodiments, the first support 60 and the second support 90 can be separated and independently arranged. In the embodiment, the first support 60 and the second support 90 are integrated, that is, the first support 60 and the second support 90 can be integrally formed during preparation, which can reduce the manufacturing cost and make the subsequent assembly process more convenient.

[0053] The sound generating device 10 provided by the embodiment can be assembled in the following manner: First, the main plate 50, the first support 60 and the second support 90 are assembled to form a whole, then the sliding sensor 70 and the pressure sensing assembly 80 are assembled to form a whole, finally the sliding sensor 70 and the pressure sensing assembly 80 are arranged in the receiving portion 61, then the back adhesive is coated on the support portion 91 of the second support 90, the sliding sensor 70 is arranged in a flat structure and laid on the surface of the first support 60 away from the main plate 50, the surface of the first support 60 away from the main plate 50 can be coated with the back adhesive to bond the sliding sensor 70, and at this time the pressure sensing assembly 80 is supported on the support portion 91 of the second support 90 and connected with the back adhesive.

[0054] After the above components are assembled, the sliding sensor 70 is aligned with the detection area on the shell 40, the plug 42 is glued, and then the plug 42 is inserted into one end of the cylinder 41, so that the limiting groove 44 is aligned with the main plate 50, the main plate 50 is embedded in the limiting groove 44 to position the main plate 50, and the displacement of the sliding sensor 70 is prevented.

[0055] For example, as shown in the embodiment, the sliding sensor 70 is arranged in a flat structure, and the first support 60 is arranged on the surface of the main plate 50 away from the sliding sensor 70. Figure 5The shell 40 shown in the structure, when assembling, the main board 50, the first support 60, the second support 90, the sliding sensor 70 and the pressure sensing assembly 80 can be assembled to form a whole, then put into the first shell 45, then the second shell 46 and the first shell 45 are assembled to form the shell 40. It should be noted that, although Figure 5 The shell 40 shown in the structure, Figure 5 The shell 40 shown in the structure can also be provided with a limiting groove to fix the main board 50, and this embodiment is not limited.

[0056] It should be noted that, although the structure shown in the above embodiment is that the sliding sensor 70 is arranged inside the shell 40 of the connecting rod part 40, those skilled in the art can know from the content of the foregoing embodiment that the sliding sensor 70 can also be arranged inside the shell 40 of the ear-in part 13, especially in the part of the ear-in part 13 which does not enter the user's ear in the wearing state, and this embodiment is not limited.

[0057] The sound generating device 10 provided in the embodiment is that the sliding sensor 70 and the main board 50 are arranged on the first support 60, the pressure sensing assembly 80 is arranged on the side of the sliding sensor 70 away from the inner wall 48, and is supported on the main board 50, each component is stacked to form an integral structure, so that the sliding sensor 70 can be kept in contact with the inner wall 48 without being fixed by adhesive. In the assembling process, the sliding sensor 70, the main board 50, the pressure sensing assembly 80 and the first support 60 can be assembled integrally, the assembling process is convenient and fast, and the integral shell 40 and the split shell 40 can be conveniently assembled, and the application range is wider.

[0058] The sound generating device 10 in the embodiment can also be a sound box, a loudspeaker and the like, and this embodiment is not limited.

[0059] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A sound producing device, characterized by, The application relates to a sound production device. The sound production device comprises a shell, a main plate, a first support, a sliding sensor and a pressure sensing component. The shell encloses an inner cavity. The main plate is arranged in the inner cavity. The first support is arranged in the inner cavity and fixed to the main plate. The sliding sensor is arranged in the first support and directly attached to the inner wall of the shell. The pressure sensing component is connected to the side of the sliding sensor away from the inner wall and supported on the main plate.

2. The sound production device of claim 1, wherein, The pressure sensing component and the sliding sensor are electrically connected to the main plate.

3. The sound production device of claim 2, wherein, The first support is provided with a receiving portion penetrating the first support.

4. The sound production device of claim 1, wherein, The pressure sensing component is located in the receiving portion and supported on the main plate.

5. The sound production device of claim 1, wherein, The main plate is provided with a fixing groove corresponding to the receiving portion.

6. The sound production device of claim 5, wherein, The pressure sensing component is at least partially located in the fixing groove.

7. The sound production device of claim 5, wherein, The sound production device further comprises an antenna arranged on the first support.

8. Sound production device according to any of claims 1-7, characterized in that The sound production device further comprises a second support.

9. The sound production device of claim 8, wherein, One end of the pressure sensing component away from the sliding sensor is arranged on the second support.

10. The sound production device of claim 8, wherein, The second support is supported on the main plate.

11. The sound production device of any one of claims 1-7, wherein, The second support comprises a supporting portion and at least one supporting leg connected to the supporting portion.

12. The sound production device of claim 11, wherein, The pressure sensing component is arranged on the supporting portion. The supporting leg is supported on the main plate. The first support and the second support are integrally combined. The pressure sensing component comprises a sensor, a circuit board, a buffer and a reinforcing member. The circuit board is attached to the surface of the reinforcing member. The sensor is arranged on the surface of the circuit board away from the reinforcing member. The buffer is arranged on the surface of the sensor away from the circuit board. The surface of the reinforcing member away from the circuit board is bonded to the surface of the sliding sensor away from the inner wall. The buffer is supported on the main plate. The surface of the reinforcing member away from the circuit board is supported on the main plate. The buffer is bonded to the surface of the sliding sensor away from the inner wall. The shell comprises a barrel and a plug. The inner cavity is formed in the barrel. The plug is arranged at one end of the barrel and closes one end of the inner cavity. The main plate is fixed to the plug or the barrel. The surface of the plug facing the inner cavity is provided with a limiting groove. The main plate is at least partially embedded in the limiting groove.

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