Wafer edge cleaning equipment

Abstract

The invention provides wafer edge cleaning equipment, and belongs to the technical field of semiconductor processing, and the wafer edge cleaning equipment specifically comprises a brush cleaning assembly and a wafer positioning mechanism, and the brush cleaning assembly is used for cleaning a wafer; the brush head can be coupled with a wafer, the micro motor is connected with a pressure sensor, the pressure sensor can obtain the pressure applied to the wafer by the brush head, the micro motor can make an adjustment action according to the pressure obtained by the pressure sensor, and the rotary motor drives the brush head to vertically move through the adjustment action; according to the wafer cleaning device, the wafer is placed on the positioning seat, then the wafer is coupled with the brush cleaning assembly, then the brush head on the brush cleaning assembly rotates, the brush head cleans the wafer, and in the cleaning process, the pressure applied to the wafer is fed back through the pressure sensor, so that the wafer is cleaned. And then the brush head is controlled by the micro motor to perform vertical movement fine adjustment, so that the condition of wafer damage caused by overlarge local pressure can be avoided.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and particularly relates to a wafer edge cleaning device. BACKGROUND

[0002] Wafer cleaning is one of the most basic, most frequent and most critical process steps in semiconductor manufacturing, and its cleanliness directly determines the yield and performance of chips.

[0003] In the cleaning process, the edge position of the wafer is more difficult to clean, because the edge of the wafer is not a simple right angle, and is usually processed into a specific shape (such as a bevel), which increases the difficulty of cleaning. In the prior art, when the edge of the wafer is cleaned by a brush cleaning device, the positioning accuracy of the brush is not high, which may lead to incomplete cleaning due to too small pressure on the wafer, or damage to the wafer due to too large pressure, thereby seriously affecting the yield of chips. SUMMARY

[0004] The present application aims to provide a wafer edge cleaning device that can clean the edge of the wafer and avoid excessive wear on the surface of the wafer.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is a wafer edge cleaning device, which comprises a brush cleaning assembly and a wafer positioning mechanism, the brush cleaning assembly being used for cleaning the wafer, and the wafer positioning mechanism being used for bearing and positioning the wafer. The brush cleaning assembly comprises a brush head, a rotary motor and a micro-motion motor, the brush head being capable of being coupled with the wafer; the brush head is provided with a recessed groove, and when the brush head is coupled with the wafer, the edge of the wafer is located in the recessed groove; the rotary motor output shaft is in butt joint with the brush head, and can make the brush head rotate; the micro-motion motor is connected with a pressure sensor, the pressure sensor can acquire the pressure applied by the brush head to the wafer, and the micro-motion motor can make adjustment action according to the pressure acquired by the pressure sensor, so as to make the rotary motor drive the brush head to move vertically.

[0006] Further, the brush cleaning assembly further comprises a brush seat, a guide rail, a lifting seat and a horizontal turning arm, the brush seat is internally provided with a cavity; the guide rail is arranged in the cavity of the brush seat; the lifting seat is located in the cavity and connected with the guide rail, and the rotary motor is installed on the lifting seat.

[0007] Further, the brush cleaning assembly further comprises a horizontal turning arm and a torsion motor, the horizontal turning arm is connected with the brush holder and is used for moving the brush head to be coupled with the wafer; a torque sensor is installed at an output end of the torsion motor, and the torque sensor is in butt joint with the horizontal turning arm (30); the torque sensor can acquire the force acting on the horizontal turning arm (30), so that the torsion motor (32) makes an adjustment action according to the force acquired by the torque sensor, and the horizontal turning arm (30) swings in the horizontal plane through the adjustment action.

[0008] Further, the wafer positioning mechanism comprises a horizontal hanging arm, a positioning seat and a boss, the horizontal hanging arm is parallel to the horizontal turning arm, and both are in a horizontal state; the positioning seat is in butt joint with the horizontal hanging arm; the boss is arranged on the positioning seat and is used for positioning the wafer.

[0009] Further, the positioning seat is provided with a recess groove and a straight groove, and the two are communicated; a return assembly is arranged in the straight groove, and the position of the wafer is adjusted through the return assembly.

[0010] Further, the boss comprises a base, a connecting column and a supporting table, the base is arranged at the center of the recess groove; the connecting column is movably connected with the base; the supporting table is in butt joint with the upper end of the connecting column, and the supporting table is provided with a center hole; a negative pressure channel is arranged in the connecting column, and a suction assembly is in butt joint with the negative pressure channel.

[0011] Further, the suction assembly comprises a reference shell, a plug column and a longitudinal pull rod, the reference shell is cylindrical and is fixed in the negative pressure channel; the plug column is located in the reference shell and can move along the axial direction of the reference shell; the longitudinal pull rod is in butt joint with the plug column.

[0012] Further, the lower end of the longitudinal pull rod is in butt joint with a guide seat, the guide seat is in cooperation with a guide disc, the guide disc is connected with a driving sleeve, the driving sleeve is screwed with the base, and the longitudinal pull rod can be controlled to move through the driving sleeve.

[0013] Further, the return assembly comprises a horizontal pushing arm and a clamping arm, the horizontal pushing arm can move in the straight groove; the clamping arm is connected with the horizontal pushing arm and can contact with the wafer; when the horizontal pushing arm moves horizontally, the clamping arm can move vertically.

[0014] Further, a push rod is connected between the horizontal hanging arm and the horizontal turning arm, and when the horizontal turning arm swings, the push rod drives the horizontal hanging arm to move.

[0015] Further, the push rod is connected with a first guide and a second guide, the first guide is in sliding connection with the horizontal turning arm, and the second guide is in sliding connection with the horizontal hanging arm.

[0016] Compared with the prior art, the present application has the beneficial effect that: by placing the wafer on the positioning seat, then adjusting the brush cleaning assembly, the wafer is coupled with the brush cleaning assembly, then by rotating the brush head on the brush cleaning assembly, the brush head cleans the wafer, and during the cleaning process, the pressure applied on the wafer is fed back through the pressure sensor, then the brush head is controlled to move vertically by the micro motor, so that the situation of wafer damage caused by excessive local pressure can be avoided. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present application; Figure 2 is a schematic diagram of the brush seat structure of the present application; Figure 3 is a schematic diagram of the positioning seat structure of the present application; Figure 4 is a schematic diagram of the protrusion cross-sectional structure of the present application; Figure 5 is a schematic diagram of the return assembly structure of the present application; Figure 6 is a schematic diagram of the connection between the driving gear and the driven gear of the present application; Figure 7 is a schematic diagram of the first guide structure of the present application; Figure 8 is a schematic diagram of the second guide structure of the present application; Figure 9 is a schematic diagram of the internal structure of the brush seat of the present application; Wherein, 1-lifting mechanism, 2-positioning seat, 3-horizontal suspension arm, 4-base, 5-support, 6-cylindrical groove, 7-connection column, 8-negative pressure channel, 9-reference housing, 10-plug column, 11-longitudinal pull rod, 12-guide seat, 13-guide disc, 14-vertical opening, 15-sliding arm, 16-sleeve ring, 17-drive sleeve, 18-side baffle, 19-straight groove, 20-flat push arm, 21-clamping arm, 22-guide short pipe, 23-conducting gear, 24-driving gear, 25-driven gear, 26-small gear, 27-rack, 28-homing groove, 29-micro electric push rod, 30-flat turning arm, 31-brush seat, 32-torsion motor, 33-intrusion groove, 34-central base, 35-pull rod, 36-sliding sleeve, 37-laterally extending disc, 38-guide sleeve, 39-extending plate, 40-transverse sleeve, 41-moving pull rod, 42-brush head, 43-rotary motor, 44-guide rail, 45-lifting seat, 46-micro motor. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0019] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense and for example, can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, and can be internal communication of two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] Referring to Figure 1 As shown in the figure, a wafer edge cleaning device includes a lifting mechanism 1, a wafer positioning mechanism and a brush cleaning assembly, the wafer positioning mechanism and the brush cleaning assembly are connected with the lifting mechanism 1, the horizontal height of the wafer positioning mechanism and the brush cleaning assembly can be controlled through the lifting mechanism 1, the wafer is placed on the wafer positioning mechanism, then the wafer is contacted with the brush cleaning assembly through the adjustment of the wafer positioning mechanism, and then the wafer is rotated through the wafer positioning mechanism to realize the surface cleaning of the wafer.

[0021] Referring to Figure 1 , Figure 3 As shown in the figure, the above-mentioned wafer positioning mechanism includes a positioning seat 2 and a flat suspension arm 3, the positioning seat 2 is connected to the free end of the flat suspension arm 3, the positioning seat 2 is used for supporting and positioning the wafer, and the flat suspension arm 3 can swing, after the wafer is placed on the positioning seat 2, the positioning seat 2 is located below the brush cleaning assembly, then the brush cleaning assembly is contacted with the wafer through the control of the brush cleaning assembly, and the wafer is cleaned.

[0022] Referring to Figures 3 to 4 As shown in the figure, the above-mentioned positioning seat 2 is in the shape of a circular truncated cone, a recess groove is arranged on the positioning seat 2, a boss is arranged at the center of the recess groove, a center hole 49 is arranged on the boss, a negative pressure passage 8 is arranged in the boss, the negative pressure passage 8 is connected with the center hole 49, after the wafer is placed on the boss, the wafer covers the center hole 49 on the boss, the negative pressure passage 8 is connected with an air extraction assembly, through the working of the air extraction assembly, negative pressure can be formed in the negative pressure passage 8, at this time, the wafer on the boss is adsorbed and positioned, it should be noted that the diameter of the boss is smaller than the diameter of the wafer, so that the edge of the wafer is in an unshielded state, so that the brush cleaning assembly can be contacted with the edge of the wafer.

[0023] One kind of implementation structure of the boss in the technical solution includes two parts, one part is base 4, the other part is support 5, support 5 is connected with base 4, and support 5 is connected at the top end of base 4, both can rotate relative, specifically, base 4 is fixedly connected with positioning seat 2, support 5 can rotate, when support 5 rotates, wafer can be rotated, in order to make support 5 be able to rotate, drive motor can be set on positioning seat 2, drive motor is connected with support 5 through transmission structure when drive motor works, support 5 can be rotated, in turn, wafer is rotated, transmission structure includes: transmission chain, transmission belt and transmission gear etc.; Referring to Figure 4 As shown, base 4 is cylindrical and is provided with cylindrical groove 6, cylindrical groove 6 extends downward from the top end of base 4, and support 5 is provided with connecting column 7, connecting column 7 can be inserted into cylindrical groove 6, negative pressure channel 8 and air extraction assembly are arranged inside connecting column 7, negative pressure channel 8 penetrates connecting column 7 axially, central hole 49 penetrates support 5 axially, at this time, central hole 49 is in communication with negative pressure channel 8, rubber gasket is arranged on the upper surface of support 5, air extraction assembly is installed on connecting column 7 and blocks the lower end of negative pressure channel 8, after wafer blocks the upper end of central hole 49, vacuumizing treatment can be carried out in negative pressure channel 8 through the working of air extraction assembly, so as to realize the adsorption positioning of wafer; Air extraction assembly can adopt the following structure, including reference shell 9, reference shell 9 is cylindrical, reference shell 9 is located in negative pressure channel 8 and is fixedly connected with connecting column 7, plug column 10 is arranged in reference shell 9, longitudinal pull rod 11 is fixedly connected to the lower end of plug column 10, longitudinal pull rod 11 can make plug column 10 move downward along the axial direction of reference shell 9 under the action of downward force, plug column 10 is in close contact with reference shell 9, in the process of downward movement of plug column 10, vacuumizing treatment can be carried out on negative pressure channel 8, so as to adsorb and position wafer.

[0024] When controlling the downward axial movement of plug column 10, guide seat 12 is fixedly connected to the lower end of longitudinal pull rod 11, guide seat 12 is relatively short and cylindrical, limit groove is arranged on the circumferential surface of guide seat 12, limit groove extends along the circumferential direction of guide seat 12 and finally forms a closed loop, guide disc 13 is connected with guide seat 12, guide disc 13 is located in cylindrical groove 6 on base 4, circular opening is arranged at the center position of guide disc 13, guide seat 12 is located in the circular opening, and at this time, the edge of guide disc 13 is located in the limit groove, when guide disc 13 moves vertically, guide seat 12 can be moved synchronously, so that plug column 10 can be moved, and vacuumizing operation is realized.

[0025] In order to facilitate the control of the guide disc 13 to move, a vertical opening 14 is arranged on the base 4, the vertical opening 14 extends along the axial direction of the base 4, a sliding arm 15 is fixed on the guide disc 13, the sliding arm 15 passes through the vertical opening 14, a sleeve ring 4 216 is arranged on the base 4, the sleeve ring 4 216 is connected with the free end of the sliding shaft, when the sleeve ring 4 216 moves along the axial direction of the base 4, the guide disc 13 can be moved downward, a threaded groove is arranged on the outer surface of the base 4, the base 4 is screwed with a drive sleeve 17, the drive sleeve 17 can move axially when it rotates, the drive sleeve 17 is in sliding connection with the sleeve ring 4 216, when the drive sleeve rotates, the sleeve ring 4 216 cannot rotate, for example, a plurality of short rods are fixed on the sleeve ring 4 216, the upper end of each short rod is connected with an anti-coming-off shaft, and an anti-coming-off groove is arranged on the outer surface of the drive sleeve, so that the inner end of the anti-coming-off shaft is located in the anti-coming-off groove, at this time, the connection between the sleeve ring 4 216 and the drive sleeve 17 is formed, by rotating the drive sleeve 17, the sleeve ring 4 216 can be moved, and then the guide disc 13 moves vertically in the cylindrical groove 6, so that the plug column 10 moves to form a vacuumizing process on the negative pressure channel 8.

[0026] Referring to Figures 5 to 6 As shown in the drawings, the positioning seat 2 is provided with a return assembly, the return assembly can adjust the wafer, so that the wafer and the support table 5 are in the coaxial state, and the edge of the wafer can be in the unshielded state, so that the brush cleaning assembly can comprehensively clean the edge of the wafer; Specifically, the return assembly comprises a side baffle 18 arranged on the positioning seat 2, the side baffle 18 is located on the side of the recessed groove, a straight groove 19 is arranged on the positioning seat 2, the straight groove 19 is located on the diameter extension line of the recessed groove and is in communication with the recessed groove, the lower part of the side baffle 18 is located in the straight groove 19, a flat pushing arm 20 is connected to the side baffle 18, the flat pushing arm 20 can move along the length direction of the straight groove 19, a clamping arm 21 is arranged on the flat pushing arm 20, the clamping arm 21 is movably connected with the flat pushing arm 20 and is perpendicular to the flat pushing arm 20, the flat pushing arm 20 is in a horizontal state, and the clamping arm 21 is in a vertical state, when the flat pushing arm 20 translates, the clamping arm 21 can move vertically, when the clamping arm 21 reaches a certain height, if the flat pushing arm 20 continues to translate, the clamping arm 21 will not continue to rise upward, and it will be in contact with the wafer, so as to exert a pushing force on the wafer, so that the wafer moves, and finally the wafer and the support table 5 are in the coaxial state; In order to move the flat push arm 20 and the clamping arm 21 simultaneously, a longitudinal opening is arranged at the inner end of the flat push arm 20, a guide short tube 22 is arranged in the longitudinal opening, the clamping arm 21 passes through the guide short tube 22, an opening is arranged on the guide short tube 22, a transmission gear 23 is hinged on the guide short tube 22, a part of the transmission gear 23 passes through the opening and can engage with the clamping arm 21, when the transmission gear 23 rotates, the clamping arm 21 can be driven to move vertically, it should be noted that a convex tooth is arranged at the single side edge of the clamping arm 21, the convex tooth extends along the length direction of the clamping arm 21, the transmission gear 23 engages with the convex tooth, meanwhile, a driving gear 24 and a driven gear 25 are arranged on the flat push arm 20, the vertical planes where the two gears are located are parallel to each other, the driven gear 25 and the transmission gear 23 are both located below the flat push arm 20, the driving gear 24 is located aside the flat push arm 20, the two gears are connected through a bending piece, a pinion 26 is further fixed on the driven gear 25, the pinion 26 engages with the driving gear 24, the driven gear 25 is located between the driving gear 24 and the transmission gear 23, the driven gear 25 engages with the transmission gear 23, the diameter of the driving gear 24 is larger than the diameter of the driven gear 25, meanwhile, a rack 27 is arranged at the bottom of the straight groove 19, the driving gear 24 engages with the rack 27, when the flat push arm 20 translates in the straight groove 19, the driving gear 24 is driven to move, at this time, the driving gear 24 moves relative to the rack 27, so that the driving gear 24 rotates, then the driven gear 25 rotates, so that the clamping arm 21 moves vertically, when the flat push arm 20 moves towards the supporting table 5, the clamping arm 21 moves upwards, on the contrary, when the flat push arm 20 moves away from the supporting table 5, the clamping arm 21 moves downwards and resets; A reset groove 28 is arranged in the straight groove 19, the reset groove 28 extends downwards from the bottom, initially, the lower half of the clamping arm 21 is located in the reset groove 28, when the flat push arm 20 moves towards the supporting table 5, the clamping arm 21 moves upwards, finally, the clamping arm 21 is completely moved out of the reset groove 28, when the driving gear 24 is separated from the rack 27, the lower end of the clamping arm 21 has been completely moved out of the reset groove 28, at this time, the clamping arm 21 needs to be kept at the same horizontal height, so at this time, the transmission gear and the driven gear 25 cannot rotate, a pressing pad can be coupled on the driven gear 25, the pressing pad is connected with a spring, the spring is always in a compressed state, at this time, the pressing pad is always in close contact with the driven gear 25, but since the driving gear 24 engages with the pinion 26 on the driven gear 25, when the driving gear 24 rotates, even if the pressing pad is in close contact with the driven gear 25, the driven gear 25 cannot be locked, when the driving gear 24 is separated from the rack 27, the driven gear 25 cannot rotate without external force, so that the clamping arm 21 is kept at the same horizontal height; The above-mentioned reset assembly is at least three groups, and the three groups of reset assemblies are arrayed around the base 4, each reset assembly is connected with a micro electric push rod 29, the output end of the micro electric push rod 29 is butted with the outer end of the flat push arm 20, the reset assembly can be controlled to work through the micro electric push rod 29, it should be noted that the flat push arm 20 in the reset assembly has a telescopic structure and is built-in with an inner supporting spring, the flat push arm 20 is kept in the longest state through the inner supporting spring, when the clamping arm 21 contacts with the wafer, if the micro electric push rod 29 continues to apply force to the flat push arm 20, the inner supporting spring can be compressed, at this time the length of the flat push arm 20 becomes smaller, thereby avoiding excessive pushing of the wafer.

[0027] Referring to Figure 1 , Figure 2 and Figure 9 , after the wafer is positioned by the positioning seat 2, the wafer needs to be cleaned by the brush cleaning assembly, the brush cleaning assembly includes a flat turning arm 30, the free end of the flat turning arm 30 is butted with a brush seat 31, the brush seat 31 has a cavity inside, and a rotating motor 43 is arranged in the cavity, the output shaft of the rotating motor 43 is stretched out from the bottom of the brush seat 31, then a brush head 42 is installed on the output shaft of the rotating motor 43, through the work of the rotating motor 43, the brush head 42 can rotate, when the wafer is cleaned, the brush head 42 contacts with the wafer, the wafer and the brush head 42 rotate at the same time, finally the cleaning of the wafer is realized; A guide rail 44 is arranged on the inner vertical surface of the brush seat 31, and a lifting seat 45 is connected through the guide rail 44, the rotating motor 43 is installed on the lifting seat 45, a micro motor 46 is also arranged in the brush seat 31, the output end of the micro motor 46 is connected with the lifting seat 45, the lifting seat 45 is vertically micro-moved in the cavity through the work of the micro motor 46, thereby driving the rotating motor 43 and the brush head 42 to vertically micro-move, the edge of the wafer is cleaned through the brush head 42; The circumferential surface of the brush head 42 is provided with a recessed groove 33, the recessed groove 33 extends along the circumferential direction of the brush head 42 and is connected at the head and tail to form a closed loop, the cross section of the recessed groove 33 is "V" shape, when the edge of the wafer is cleaned, the edge of the wafer needs to be located in the recessed groove 33, in addition, a pressure sensor is arranged on the above-mentioned micro motor 46, when the brush head 42 is vertically micro-moved, the pressure of the brush head 42 acting on the wafer can be fed back in real time; The torsion motor 32 is connected to the horizontal turning arm 30, and when the torsion motor 32 works, the horizontal turning arm 30 can be controlled to swing, and in this process, the brush holder 31 moves in an arc trajectory, and the main purpose is to make the brush head 42 contact and cooperate with the wafer. The torque sensor is connected to the torsion motor 32, and the torque sensor is connected to the output end of the torsion motor 32, and the torque sensor is connected to the horizontal turning arm. During the rotation of the wafer and the brush head 42, the brush head 42 will transmit the reaction force to the horizontal turning arm. When the brush head 42 changes the reaction force, the torque sensor can obtain the force acting on the horizontal turning arm, so that the torsion motor 32 adjusts the action according to the force obtained by the torque sensor. The adjusting action makes the horizontal turning arm 30 swing in the opposite direction in the horizontal plane, so that the brush head 42 moves slightly away from the wafer, and the reaction force of the wafer on the brush is always fed back.

[0028] Referring to Figure 1 、 Figure 7 and Figure 8 In the technical solution, a central base 34 is also provided, the horizontal turning arm 30 is hinged to the central base 34, the horizontal hanging arm 3 is also hinged to the central base 34, the torsion motor 32 is installed on the central base 34, and the output end of the lifting mechanism 1 is connected to the central base 34. The lifting mechanism 1 can control the vertical movement of the central base 34. The lifting mechanism 1 selects a linear module. Through the work of the lifting mechanism 1, the horizontal turning arm 30 and the horizontal hanging arm 3 can be lifted at the same time. A push rod 35 is arranged on the horizontal turning arm 30, and the push rod 35 can move vertically. For example, a sliding sleeve 36 is sleeved on the horizontal turning arm 30, the sliding sleeve 36 can slide on the horizontal turning arm 30, but the sliding sleeve 36 cannot rotate (for example, a concave-convex structure is arranged between the sliding sleeve 36 and the horizontal turning arm 30). A lateral extension disc 37 is arranged on the sliding sleeve 36, and a circular hole is arranged on the lateral extension disc 37. At this time, the sliding sleeve 36 and the lateral extension disc 37 form a first guide. The push rod 35 is inserted into the circular hole of the lateral extension disc 37, and the push rod 35 can contact the horizontal hanging arm 3. When the torsion motor 32 works, the horizontal turning arm 30 swings, and at this time, the horizontal turning arm 30 applies a force to the horizontal hanging arm 3 through the push rod 35, so that the horizontal hanging arm 3 swings at the same time. In the process of swinging, the position of the wafer can be adjusted, so that the wafer cooperates with the brush head.

[0029] In the technical solution, the horizontal suspension arm 3 can make the positioning seat 2 and the brush seat 31 move relatively when swinging, specifically, the horizontal suspension arm 3 is hinged with the central base 34, and the horizontal suspension arm 3 is parallel with the horizontal turning arm 30, the second guide is arranged on the horizontal suspension arm 3, the second guide comprises a guide sleeve 38 sleeved on the horizontal suspension arm 3, the guide sleeve 38 can slide on the horizontal suspension arm 3, a transverse pull rod is arranged on the guide sleeve 38, the transverse pull rod is fixed with an extension plate 39 at the end, the extension plate 39 is provided with a through hole, the lower end of the push rod 35 passes through the through hole of the extension plate 39, and then the lower end of the push rod 35 is screwed with a anti-off cap, the transverse pull rod has an extendable structure, which has a minimum length and a maximum length, when the transverse pull rod has the minimum length, the horizontal suspension arm 3 and the horizontal turning arm 30 are parallel with each other in the horizontal plane, initially, the brush seat 31 corresponds to the positioning seat 2, when the horizontal turning arm 30 swings and the push rod 35 applies a pushing force to the horizontal suspension arm 3, the horizontal suspension arm 3 also swings, in this process, the positioning seat 2 and the brush seat 31 move relatively to form a misalignment, the wafer can be placed on the supporting table 5 on the positioning seat 2, then the horizontal turning arm 30 is reset and swung, in the process of resetting and swinging, the horizontal turning arm 30 can drive the horizontal suspension arm 3 to reset through the transverse pull rod. But at this time, the supporting table 5 is provided with a wafer, after the wafer cooperates with the brush head 42, the distance between the positioning seat 2 and the brush seat 31 can change, in order to make the wafer and the brush head 42 contact more stably, the above-mentioned transverse pull rod comprises a transverse sleeve 40 and a moving pull rod 41, the transverse sleeve 40 is fixedly connected with the guide sleeve 38, the inner end of the moving pull rod 41 is located in the transverse sleeve 40, the outer end of the moving pull rod 41 is butted with the extension plate 39, a pull spring is further arranged in the transverse sleeve 40, the two ends of the pull spring are respectively butted with the guide sleeve 38 and the moving pull rod 41, so that the transverse pull rod has an extendable structure, and the overall length of the transverse pull rod is adjustable, when cleaning wafers with different diameters, the transverse pull rod can be applied, and after the position of the horizontal turning arm 30 is locked, the wafer and the brush head 42 can contact more closely under the action of the restoring force of the transverse pull rod.

[0030] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed to multiple network units. Part or all of the modules can be selected to achieve the purposes of the embodiments according to actual needs. Those skilled in the art can understand and implement without creative labor. Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer edge cleaning device, characterized in that, include: Brush cleaning assembly for cleaning wafers; Wafer positioning mechanism, used for positioning and carrying wafers; The brush cleaning component includes: The brush head (42) is capable of coupling with the wafer; The brush head (42) is provided with an indentation groove (33). When the brush head (42) is coupled with the wafer, the edge of the wafer is located in the indentation groove (33). A rotary motor, whose output shaft is connected to the brush head (42), is able to rotate the brush head (42); A micro motor (46) is connected to a pressure sensor. The pressure sensor can obtain the pressure applied by the brush head (42) to the wafer. The micro motor (46) can make adjustment actions according to the pressure obtained by the pressure sensor. Through the adjustment actions, the rotary motor (43) drives the brush head (42) to move vertically.

2. The wafer edge cleaning equipment according to claim 1, characterized in that, The brush cleaning assembly also includes: The brush holder (31) has a cavity inside; The guide rail (44) is set inside the cavity of the brush holder (31); The lifting seat (45) is located inside the cavity and connected to the guide rail (44), and the rotary motor (43) is mounted on the lifting seat (45).

3. The wafer edge cleaning equipment according to claim 2, characterized in that, The brush cleaning assembly also includes: A flat-mounted arm (30) is connected to a brush holder (31) for moving the brush head (42) to couple with the wafer; A torsion motor (32) is equipped with a torque sensor at its output end, and the torque sensor is connected to the flat boom (30); The torque sensor can acquire the force on the flat boom (30), and the torsion motor (32) makes an adjustment action according to the force acquired by the torque sensor, so that the flat boom (30) swings on the horizontal plane through the adjustment action.

4. The wafer edge cleaning equipment according to claim 1, characterized in that, The wafer positioning mechanism includes: The horizontal boom (3) is parallel to the horizontal tilt boom (30), and both are in a horizontal state; The positioning seat (2) is docked on the flat boom (3); The boss is set on the positioning seat (2) and is used to position the wafer.

5. The wafer edge cleaning equipment according to claim 4, characterized in that, The positioning seat (2) is provided with a recessed groove and a straight groove (19), and the two are connected. A return component is provided in the straight groove (19), which can adjust the position of the wafer.

6. The wafer edge cleaning equipment according to claim 5, characterized in that, The boss includes: The base (4) is located at the center of the recessed groove; The connecting column (7) is movably connected to the base (4); The support platform (5) is connected to the upper end of the connecting column (7) and can rotate. The support platform (5) is provided with a central hole (49). The connecting column (7) is provided with a negative pressure channel (8), and the negative pressure channel (8) is connected to an air extraction component.

7. The wafer edge cleaning equipment according to claim 6, characterized in that, The air extraction assembly includes: The reference housing (9) is cylindrical and fixed inside the negative pressure channel (8); The plunger (10) is located inside the reference housing (9) and is capable of moving along the axial direction of the reference housing (9); The longitudinal tie rod (11) is connected to the plunger (10) and pulls the plunger (10) through the longitudinal tie rod (11).

8. The wafer edge cleaning equipment according to claim 5, characterized in that, The return component includes: The push arm (20) can move within the straight groove (19); The positioning arm (21) is connected to the flat pushing arm (20) and can contact the wafer; When the horizontal push arm (20) moves horizontally, it enables the locking arm (21) to move vertically.

9. The wafer edge cleaning equipment according to claim 4, characterized in that, A lever (35) is connected between the flat boom (3) and the flat tilting boom (30). When the flat tilting boom (30) swings, the lever (35) drives the boom to move.

10. The wafer edge cleaning equipment according to claim 9, characterized in that, The lever (35) is connected to a first guide and a second guide. The first guide is slidably connected to the flat boom (30), and the second guide is slidably connected to the flat boom (3).

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