Control method and control system for wafer feeding and discharging equipment

Abstract

The invention discloses a control method and a control system for wafer loading and unloading equipment, and relates to the technical field of semiconductor preparation. The control method comprises the steps that when feeding and discharging are conducted on a target area of the furnace tube boat, a material conveying mechanism is controlled to place simulation wafers in all first unit areas of the target area, each first unit area comprises at least one wafer groove, and second unit areas are arranged between the adjacent first unit areas; the second unit area comprises an upper empty groove area, a product area and a lower empty groove area which are arranged in sequence, the product area comprises a wafer groove used for placing a product wafer, after all the simulation wafers and all the product wafers are placed, the furnace tube process step is executed, and then the material conveying mechanism is controlled to take out all the simulation wafers. According to the control method of the wafer feeding and discharging equipment, the full boat operation of the furnace tube boat of the product wafer with the thickness larger than or equal to 1 mm or of an irregular structure can be achieved, the wafer placing efficiency is improved, and the product yield of the product wafer can also be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a control method and a control system of wafer loading and unloading equipment. BACKGROUND

[0002] In the furnace tube product operation, the furnace tube boat can be full of 170 wafers for operation. When the product quantity is not enough, a simulation wafer is needed to supplement the empty position of the furnace tube boat to achieve the purpose of full operation, because the process temperature and process gas flow of the product wafer operation can be more stable when the furnace tube is full. However, under the condition of not full, the process parameters such as film thickness and particles will deviate from the full condition, resulting in uncontrollable process parameters. On the other hand, based on the limitation of the furnace tube boat and other hardware parameters, it is generally required that the thickness of the product wafer entering the furnace tube operation is within the range of 0.5mm-1mm. Special product wafers exceeding the above thickness range, excessive warping or edge angle, etc. are prone to scratches, fragments and other problems in automatic operation, so they can only be operated manually, that is, the engineer manually puts the product wafer into the wafer slot of the furnace tube boat.

[0003] However, when the product wafer with special structure is manually operated, the product wafer is generally placed directly on the boat slot without placing a simulation wafer, which cannot meet the purpose of full operation. At the same time, without the barrier of the simulation wafer, once a product wafer is broken, it is easy to cause the broken fragments to fall and break the lower product wafers or the broken slag to contaminate other product wafers. However, to meet the purpose of full operation, 170 product wafers and simulation wafers need to be manually placed, which not only takes time and effort, but also greatly increases the risk of human operation. SUMMARY

[0004] One object of the first aspect of the present application is to provide a control method of wafer loading and unloading equipment, which solves the technical problem that the operation steps of the product wafer with large thickness or special structure are complicated when the furnace tube process is performed, resulting in low efficiency and inability to full operation.

[0005] Another object of the first aspect of the present application is to further improve the controllability and orderliness of the placement of the simulation wafer.

[0006] The object of the second aspect of the present application is to provide a control system of wafer loading and unloading equipment for executing the above control method.

[0007] According to the object of the first aspect of the present application, the present application provides a control method of wafer loading and unloading equipment, a material conveying mechanism of the wafer loading and unloading equipment is used for the loading and unloading operation of simulation wafers on a furnace tube boat, the furnace tube boat includes a plurality of wafer slots distributed along the vertical direction and having a hollow ring structure, and the control method includes the following steps: When loading and unloading the target area of the boat, the transfer mechanism is controlled to place the simulation wafers in each first unit area of the target area, the first unit area includes at least one wafer slot, and a second unit area is arranged between adjacent first unit areas, the second unit area includes an upper empty slot area, a product area and a lower empty slot area arranged in sequence, the upper empty slot area and the lower empty slot area each include at least one wafer slot, and the product area includes a wafer slot for placing the product wafer, the thickness of the product wafer is ≥1mm or is an irregular structure. After all the simulation wafers and all the product wafers are placed, a boat process step is performed. After the boat process step is completed, the transfer mechanism is controlled to take out all the simulation wafers.

[0008] Optionally, the transfer mechanism is a single-fork structure or a multi-fork structure.

[0009] Optionally, the transfer mechanism is a multi-fork structure, the transfer mechanism can carry a target number of simulation wafers at a time, and the number of wafer slots in the first unit area is an integer multiple of the target number.

[0010] Optionally, the target number of simulation wafers transferred by the transfer mechanism at a time is 5, and the number of wafer slots in the first unit area is an integer multiple of 5.

[0011] Optionally, the step of controlling the transfer mechanism to place the simulation wafers in each first unit area of the target area includes: controlling the transfer mechanism to place the target number of simulation wafers in each first unit area in sequence.

[0012] Optionally, before the step of controlling the transfer mechanism to perform the loading operation of the simulation wafers, the following step is further included: originally calibrating the transfer mechanism to ensure that the loading position is aligned with the center of the slot of the boat.

[0013] Optionally, the transfer mechanism is configured to pick up the simulation wafers using a vacuum suction end and release them by gas blowing in the wafer slot.

[0014] Optionally, during the loading and unloading of the simulation wafers, the following steps are further included: real-time monitoring of the inclination angle of the simulation wafers, and triggering an alarm and pausing the transfer operation when the inclination angle exceeds a set threshold.

[0015] According to the second aspect of the present application, the present application further provides a control system of the wafer loading and unloading device, comprising a memory and a processor, the memory stores a control program, and the control program is used to implement the control method of the wafer loading and unloading device according to any one of the above aspects when executed by the processor.

[0016] The present application can improve the loading and unloading efficiency of the special product wafer, so that the special product wafer can quickly reach the condition for full boat operation in the furnace boat, and the film thickness parameter control in the same way as the full boat operation can be realized, and the yield of the special product wafer is further improved. Moreover, by arranging the empty slot area between the adjacent areas, that is, arranging at least one simulation wafer between the two adjacent product wafers, the situation that the product wafer is broken in the furnace process step and the fragments fall and break the lower product wafer or the broken slag pollutes other product wafers is prevented, and the placing safety of the product wafer is further improved.

[0017] Further, the present application can realize accurate partition arrangement of the simulation wafers by controlling the material conveying mechanism to place the target number of simulation wafers in each first unit area in sequence, so as to ensure that the slot interval between each simulation wafer group meets the preset requirement, thereby avoiding interference with the wafer slot of the product wafer, and making the loading sequence more controllable and orderly.

[0018] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and the content of the specification can be implemented. The following will be described in detail with reference to the preferred embodiments of the present application and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] Some specific embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference signs in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 is a schematic layout design diagram of a furnace boat according to an embodiment of the present application; Figure 2 is a schematic flow chart of a control method of a wafer loading and unloading device according to an embodiment of the present application; Figure 3 is a schematic partial structure diagram of a furnace boat according to an embodiment of the present application; Figure 4 is a schematic structure diagram of a material conveying mechanism of a wafer loading and unloading device according to an embodiment of the present application; Figure 5 is a schematic structural diagram of a transfer mechanism of a wafer loading and unloading equipment according to another embodiment of the present application.

[0020] Reference signs: 10 - transfer mechanism, 20 - boat, 21 - wafer slot, 22 - first unit area, 23 - second unit area, 231 - upper empty slot area, 232 - product area, 233 - lower empty slot area. DETAILED DESCRIPTION

[0021] The specific embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but are not intended to limit the scope of the present application.

[0022] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in conjunction with the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the drawings, but not all the structures. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0023] The terms "comprising" and "having" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0024] In this document, the term "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive or alternative to other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0025] Figure 1 is a schematic layout diagram of a boat according to an embodiment of the present application, Figure 2 is a schematic flow chart of a control method of a wafer loading and unloading equipment according to an embodiment of the present application, Figure 3 is a schematic partial structural diagram of a boat according to an embodiment of the present application, Figure 4 is a schematic structural diagram of a transfer mechanism of a wafer loading and unloading equipment according to an embodiment of the present application, Figure 5is a schematic structural view of a material conveying mechanism of a wafer loading and unloading equipment according to another embodiment of the present application.

[0026] As shown in Figure 1 , the present application provides a control method of a wafer loading and unloading equipment, a material conveying mechanism 10 of the wafer loading and unloading equipment is used to perform a simulated wafer loading and unloading operation on a boat 20, the boat 20 includes a plurality of wafer slots 21 distributed in a vertical direction and having a hollow ring structure. Here, the number of wafer slots 21 of the boat 20 is 170.

[0027] As shown in Figure 2 , in this embodiment, the control method includes the following steps: Step S100: when loading and unloading a target area of the boat 20, control the material conveying mechanism 10 to place simulated wafers in each first unit area 22 of the target area, the first unit area 22 includes at least one wafer slot 21, and a second unit area 23 is provided between adjacent first unit areas 22, the second unit area 23 includes an upper empty slot area 231, a product area 232 and a lower empty slot area 233 arranged in sequence (see Figure 3 ), the upper empty slot area 231 and the lower empty slot area 233 each include at least one wafer slot 21, the product area 232 includes a wafer slot 21 for placing a product wafer, and the thickness of the product wafer is ≥1mm or is an irregular structure; Step S200: after all simulated wafers and all product wafers are placed, perform a boat process step; Step S300: after the boat process step is completed, control the material conveying mechanism 10 to remove all simulated wafers.

[0028] In this embodiment, when loading and unloading simulated wafers and product wafers in the plurality of wafer slots 21 in the boat 20, first, control the material conveying mechanism 10 to place simulated wafers in each first unit area 22 (see Figure 1 ) of the target area, that is, first use the material conveying mechanism 10 to place simulated wafers in the first unit area 22 of the target area, and reserve a second unit area 23 including the upper empty slot area 231, the product area 232 and the lower empty slot area 233 between adjacent first unit areas 22, and manually place product wafers in the wafer slots 21 of the product area 232, and after all simulated wafers and all product wafers are placed, perform a boat process step, and finally, after the boat process step is completed, control the material conveying mechanism 10 to remove all simulated wafers and manually remove the product wafers after coating. Here, the number of wafer slots 21 of the first unit area 22 can be one, two, five, ten or more, and the number of wafer slots 21 of the upper empty slot area and the lower empty slot area 233 can be one or two.

[0029] In the embodiment, the simulation wafers and the product wafers are arranged in zones, so that the feeding and discharging of the simulation wafers is performed by the feeding mechanism 10 and the feeding and discharging of the product wafers is performed manually. This can improve the feeding and discharging efficiency of the special product wafers, so that the special product wafers can quickly reach the condition for full-boat operation in the boat 20, and the film thickness parameter control in the same way as the full-boat operation is realized, and the yield of the special product wafers is further improved. In addition, at least one simulation wafer is arranged between the adjacent zones, that is, at least one simulation wafer is arranged between the adjacent two product wafers in the wafer slots 21. This can prevent the product wafers from being broken in the furnace tube process step, so that the broken pieces do not fall and break the lower product wafers or the broken slag does not contaminate other product wafers, and the feeding mechanism 10 does not directly contact the product wafers when the simulation wafers are placed, and the safety of the product wafers is further improved.

[0030] In the embodiment, the above-mentioned zonal arrangement also allows the product wafers and the simulation wafers to maintain a reasonable interval, which can effectively prevent thermal field interference and mechanical interference, improve film layer uniformity and feeding and discharging stability, facilitate automatic identification and flexible layout, and significantly improve process consistency and equipment versatility.

[0031] In a preferred embodiment, the number of the upper empty slot area 231 and the lower empty slot area 233 in the second unit area 23 is one, that is, the number of the upper empty slot area 231 and the lower empty slot area 233 in the second unit area 23 is set to one. This allows the product wafers and the adjacent simulation wafers to maintain a reasonable interval, which can ensure the operation space of the feeding mechanism 10 and the process thermal stability, and maximize the loading efficiency of the boat 20, so that the wafer feeding and discharging control is realized in a high-efficiency, safe and repeatable manner without affecting the film layer uniformity.

[0032] In a further embodiment, the feeding mechanism 10 is a single-fork structure (see Figure 4 ) or a multi-fork structure (see Figure 5 ). In the embodiment, the single-fork structure means that the feeding mechanism 10 is provided with only one set of mechanical fork arms, which can grab and convey one wafer at a time. This is suitable for the case where the simulation wafer group contains only one simulation wafer, or when high-precision positioning and special thickness wafer handling are required. The multi-fork structure means that the feeding mechanism 10 is provided with multiple sets of parallel mechanical fork arms, which can grab and convey multiple wafers at the same time. This can improve the feeding and discharging efficiency while ensuring stable grabbing, and reduce the number of round trips. That is, by designing the feeding mechanism 10 as a single-fork structure or a multi-fork structure, the equipment can flexibly adapt to different wafer layout requirements.

[0033] In a further embodiment, the material conveying mechanism 10 is a multi-prong structure, and the material conveying mechanism 10 can carry a target number of simulation wafers at a time. The number of wafer slots 21 in the first unit area 22 is an integer multiple of the target number. In this embodiment, the material conveying mechanism 10 is a multi-prong structure, and the material conveying mechanism 10 can carry a target number of simulation wafers at a time. The number of wafer slots 21 in the first unit area 22 is set to be an integer multiple of the target number, so that the number of simulation wafers conveyed each time is completely matched with the target layout area, avoiding cross-zone operation, improving the consistency of the loading rhythm and the space utilization, at the same time, reducing the number of wafer picking and placing, improving the loading and unloading rate of simulation wafers, and also reducing the risk of fragments and equipment wear, further ensuring the distribution regularity of simulation wafers and product wafers in the furnace boat 20, thereby improving the film layer uniformity and overall process stability. Here, the target number can be 5.

[0034] In a further embodiment, the target number of simulation wafers conveyed by the material conveying mechanism at a time is 5, and the number of wafer slots in the first unit area is an integer multiple of 5, that is, the target number of simulation wafers conveyed by the material conveying mechanism 10 at a time is 5, and the number of wafer slots 21 in the first unit area 22 can be 5, 10, 15, 20 or other integer multiples of 5, to further improve the conveying efficiency of simulation wafers and shorten the wafer placement time of the furnace boat 20 to reach full boat operation.

[0035] In a further embodiment, the step of controlling the material conveying mechanism 10 to place simulation wafers in each first unit area 22 in the target area includes: controlling the material conveying mechanism 10 to place a target number of simulation wafers in each first unit area 22 in turn.

[0036] In this embodiment, by controlling the material conveying mechanism 10 to place a target number of simulation wafers in each first unit area 22 in turn, precise partitioning of simulation wafers can be achieved, ensuring that the slot spacing between each simulation wafer group meets the preset requirements, thereby avoiding interference with the wafer slots 21 of the product wafers, and at the same time making the loading sequence more controllable and orderly.

[0037] In a further embodiment, before the step of controlling the material conveying mechanism 10 to perform the loading operation of the simulation wafers, the following steps are further included: originally calibrating the material conveying mechanism 10 to ensure that the loading position is aligned with the center of the slot of the furnace boat 20.

[0038] In this embodiment, by performing origin calibration on the material conveying mechanism 10 before the loading operation, the positioning accuracy of the material conveying mechanism 10 can be ensured, so that the pick-and-place position of the material conveying mechanism 10 is accurately aligned with the center of the wafer groove 21 of the furnace tube boat 20, thereby avoiding the risk of wafer deviation, slot jamming or breakage during loading, and improving the stability and reliability of the loading process. At the same time, this calibration step can also be used to compensate for mechanical errors or thermal drift errors generated during equipment operation, ensuring the consistency and repeatability of subsequent multiple loading operations, thereby improving the automation level of the overall process and the product yield.

[0039] In a further embodiment, the material conveying mechanism 10 is configured to pick up the dummy wafer using a vacuum suction end and release it by gas blowing in the wafer groove 21. In this embodiment, by using a vacuum suction end to pick up the dummy wafer and releasing it by gas blowing in the wafer groove 21, stable picking up and flexible releasing of the wafer can be achieved, avoiding wafer surface scratches, edge collapse or particle contamination caused by traditional mechanical clamping or direct contact releasing methods. At the same time, using gas blowing to release can reduce the adhesion between the wafer and the suction end, achieving a fast and smooth placement process, effectively improving the loading and unloading efficiency and repeatability of the material conveying mechanism 10, and ensuring the structural integrity and cleanliness of the dummy wafer and the product wafer.

[0040] In a further embodiment, during the loading and unloading conveying process of the dummy wafer, the following steps are further included: Real-time monitoring of the inclination angle of the dummy wafer, and triggering an alarm and pausing the conveying operation when the inclination angle exceeds a set threshold.

[0041] In this embodiment, by real-time monitoring of the inclination angle of the dummy wafer during the loading and unloading conveying process, and triggering an alarm and pausing the conveying operation when the inclination angle exceeds a set threshold, abnormal situations such as wafer deviation, slot jamming or falling during handling can be prevented in real time, avoiding wafer breakage, debris contamination or equipment collision caused by attitude deviation. At the same time, this monitoring and protection mechanism can improve the safety and reliability of the conveying process, ensure that the dummy wafer can be stably and accurately placed in the target slot, thereby improving the automation accuracy and operation stability of the entire loading and unloading system.

[0042] The present application also provides a control system for a wafer loading and unloading device, which includes a memory and a processor, and the memory stores a control program. When the control program is executed by the processor, it is used to implement the control method of any of the above wafer loading and unloading devices. Here, the control method of the wafer loading and unloading device will not be repeated here.

[0043] In one specific embodiment, the memory stores a computing program which, when executed by the processor, implements the control method described above. The processor can be a central processing unit (CPU), or a digital processing unit, etc. The processor transmits and receives data through the communication interface. The memory is used to store the program executed by the processor. The memory is any medium capable of carrying or storing desired program code in the form of instructions or data structures and capable of being accessed by a computer, and can also be a combination of multiple memories. The above computing program can be downloaded to the corresponding computing / processing device from the computer readable storage medium, or downloaded to the computer or external storage device via a network (such as the Internet, a local area network, a wide area network, and / or a wireless network).

[0044] For the description of the present embodiment, the "computer readable medium" can be any device that can contain, store, communicate, propagate or transport programs for use by or in connection with an instruction execution system, apparatus or device. More specific examples (non-exhaustive list) of computer readable medium include the following: electrical connections having one or more wires (electronic devices), portable computer disk boxes (magnetic devices), random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memories), fiber optic devices, and portable compact disc read-only memories (CD ROMs). In addition, the computer readable medium can even be paper or other suitable medium on which the program can be printed, because the program can be electronically obtained, for example, by optical scanning of the paper or other medium, followed by editing, interpreting or processing, if necessary, in other suitable ways, and then stored in the computer memory.

[0045] The technical solutions of the present application will be further described below in conjunction with specific embodiments.

[0046] Embodiment 1 When the simulated wafers and product wafers in the plurality of wafer slots 21 in the boat 20 are simulated wafer and product wafer loading and unloading, first, the transfer mechanism 10 is controlled to place 5 simulated wafers in the target area in the first unit area 22, that is, the simulated wafers are placed in the first unit area 22 of the target area by the transfer mechanism 10, 5 second unit areas 23 including the upper empty slot area 231, the product area 232 and the lower empty slot area 233 are reserved between adjacent first unit areas 22, and after the 155 simulated wafers are transferred, each product wafer is manually placed in the wafer slot 21 in the product area 232. After all simulated wafers and all product wafers are placed, the furnace tube process step is performed, and finally, after the furnace tube process step is completed, the transfer mechanism 10 is controlled to take out all the simulated wafers and manually take out the product wafers after coating. Here, the number of product wafers is 5, the number of upper empty slot areas 231 and lower empty slot areas 233 is 5, and the transfer mechanism 10 transfers 5 simulated wafers to the wafer slot 21 at a time.

[0047] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the upper empty slot area 231 and the lower empty slot area 233 in the boat 20 are respectively placed with simulated wafers, and the product wafer is a conventional film thickness wafer.

[0048] Comparative Example 2 The difference between Comparative Example 2 and Example 1 is that only 5 product wafers are placed in the boat 20.

[0049] The film thickness and film thickness fluctuation range of the product wafers after the furnace tube process step in Example 1 and Comparative Examples 1-2 are detected, and the detection results are shown in Table 1.

[0050] As shown in Table 1, the film thickness and film thickness fluctuation range of Example 1 are close to those of Comparative Example 1, that is, Example 1 is close to the data of full boat operation, and can be controlled in the same way as full boat operation. The film thickness of Comparative Example 2, which only places product wafers, is significantly lower than the target film thickness, and the film thickness fluctuation range is also significantly larger than that of Comparative Example 1 and Example 1, indicating that the presence or absence of simulated wafers has a significant impact on the film thickness data of product wafers. Without simulated wafers, the film thickness is low and the film thickness fluctuation is large.

[0051] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0052] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A control method for a wafer loading and unloading device, characterized in that, The material transfer mechanism of the wafer loading and unloading equipment is used to simulate wafer loading and unloading operations on the furnace tube boat. The furnace tube boat includes multiple wafer slots distributed along the vertical direction and having a hollow annular structure. The control method includes the following steps: When loading and unloading materials into the target area of ​​the furnace tube boat, the material transfer mechanism is controlled to place the simulated wafers in each first unit area of ​​the target area. The first unit area includes at least one wafer slot, and a second unit area is provided between adjacent first unit areas. The second unit area includes an upper empty slot area, a product area and a lower empty slot area arranged in sequence. The upper empty slot area and the lower empty slot area both include at least one wafer slot. The product area includes a wafer slot for placing product wafers. The product wafers have a thickness ≥1mm or are irregular structures. After all the simulated wafers and all the product wafers have been placed, the furnace tube process steps are performed; After the furnace tube process step is completed, the material transfer mechanism is controlled to remove all the simulated wafers.

2. The control method for the wafer loading and unloading equipment according to claim 1, characterized in that, The material transfer mechanism is a single-fork structure or a multi-fork structure.

3. The control method for the wafer loading and unloading equipment according to claim 2, characterized in that, The material transfer mechanism has a multi-fork structure, and the material transfer mechanism can transport a target number of the simulated wafers at a time. The number of wafer slots in the first unit region is an integer multiple of the target number.

4. The control method for the wafer loading and unloading equipment according to claim 3, characterized in that, The material transfer mechanism transfers a target number of 5 simulated wafers at a time, and the number of wafer slots in the first unit region is an integer multiple of 5.

5. The control method for the wafer loading and unloading equipment according to claim 3, characterized in that, The step of controlling the material transfer mechanism to place the simulated wafer in each of the first unit areas of the target area includes: The material transfer mechanism is controlled to sequentially place the target number of simulated wafers into each of the first unit regions.

6. The control method for the wafer loading and unloading equipment according to claim 5, characterized in that, Before the step of controlling the material transfer mechanism to perform the simulated wafer loading operation, the following steps are also included: The material transfer mechanism is calibrated at its origin to ensure that the feeding position is aligned with the center of the slot on the furnace tube boat.

7. The control method for the wafer loading and unloading equipment according to any one of claims 1-6, characterized in that, The material transfer mechanism is configured to pick up the simulated wafer using a vacuum adsorption end and release it by blowing gas into the wafer slot.

8. The control method for the wafer loading and unloading equipment according to claim 7, characterized in that, The simulated wafer loading and unloading process also includes the following steps: The tilt angle of the simulated wafer is monitored in real time, and an alarm is triggered and the transmission operation is paused when the tilt angle exceeds a set threshold.

9. A control system for a wafer loading and unloading device, characterized in that, The device includes a memory and a processor, wherein the memory stores a control program, which, when executed by the processor, is used to implement the control method for the wafer loading and unloading equipment according to any one of claims 1-8.

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