Board-level electroplating clamp and electroplating device

Abstract

The invention provides a board-level electroplating clamp and an electroplating device, and relates to the technical field of board-level electroplating, the board-level electroplating clamp comprises a sealing assembly and a plurality of conductive contact pieces, the side, facing a product, of the sealing assembly is provided with a protruding structure, the protruding structure is matched with photoresist arranged on one side of the product, so that a sealing area is formed in a clamping area, and the conductive contact pieces are arranged in the sealing area; the problem that a non-electroplating area is plated with metal due to the invasion of electroplating liquid is effectively prevented; the plurality of conductive contact elements are uniformly distributed along the extension direction of the sealing area, gaps are formed between the conductive contact elements and the convex structures, orthographic projections of the conductive contact elements on the product are located in the sealing area, and the conductive contact elements are in contact with a seed layer of the product and are used for providing current for the product in the electroplating process; and meanwhile, the plurality of conductive contact pieces are in contact with the seed layer, so that uniform introduction of current can be ensured, and the electroplating uniformity is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of plate-level electroplating, in particular to a plate-level electroplating clamp and an electroplating device. BACKGROUND

[0002] In the electroplating process, the product to be processed needs to be fixed on the electroplating equipment through the electroplating clamp. The conductive contact on the plate-level electroplating clamp needs to be in contact with the seed layer of the product to conduct current. At the same time, the sealing assembly on the plate-level electroplating clamp needs to be closely attached to the surface of the product to prevent the electroplating solution from seeping into the non-working area of the product.

[0003] However, in the prior art, the width of the sealing assembly on the plate-level electroplating clamp is less than the opening width of the photoresist, so that the sealing assembly cannot completely cover the opening area of the photoresist; and the sealing assembly of the existing plate-level electroplating clamp has no stepped design, so that even if the photoresist opening is reduced, when corresponding to photoresists of different thicknesses, the conductive contact of the clamp cannot be in complete contact with the seed layer, forming a virtual connection, causing the clamp to burn out and unable to electroplate. SUMMARY

[0004] In order to at least overcome the above deficiencies in the prior art, the purpose of the present application is to provide a plate-level electroplating clamp and an electroplating device.

[0005] In a first aspect, the embodiments of the present application provide a plate-level electroplating clamp, which comprises: a sealing assembly, a side of the sealing assembly facing the product is provided with a protruding structure, the protruding structure cooperates with the photoresist provided on the side of the product to form a sealed area in the clamping area of the product; a plurality of conductive contacts, the plurality of conductive contacts are uniformly distributed along the extension direction of the sealing area, the conductive contacts and the protruding structure have a gap, the orthographic projection of the conductive contacts on the product is located in the sealing area, the conductive contacts are in contact with the seed layer of the product, and are used to provide current to the product during the electroplating process.

[0006] In a possible implementation manner, the protruding structure comprises a first protruding part and a second protruding part provided in sequence in a direction close to the conductive contact, and in a direction perpendicular to the product, the height of the second protruding part is greater than the height of the first protruding part. The height difference between the second protruding part and the first protruding part includes 130 microns to 150 microns.

[0007] In a possible implementation manner, the shape of the first protruding part towards the surface of the side of the product includes a sawtooth shape.

[0008] In one possible implementation, the orthographic projections of the first protrusion and the second protrusion on the product at least partially overlap with the orthographic projection of the photoresist on the product.

[0009] In one possible implementation, the orthographic projection of the first protrusion on the product at least partially coincides with the orthographic projection of the photoresist on the product; the orthographic projection of the second protrusion on the product does not coincide with the orthographic projection of the photoresist on the product.

[0010] In one possible implementation, the height difference between the conductive contact and the second protrusion in a direction perpendicular to the product ranges from 150 micrometers to 170 micrometers.

[0011] In one possible implementation, the spacing between the conductive contact and the protrusion structure ranges from 2 mm to 4 mm.

[0012] In one possible implementation, the distance between the orthographic projection edge of the conductive contact on the product and the orthographic projection edge of the photoresist on the product ranges from 5 mm to 15 mm in the extending direction of the plate-level electroplating fixture.

[0013] In one possible implementation, the material of the protrusion structure includes fluororubber.

[0014] Secondly, embodiments of this application also provide an electroplating apparatus, the electroplating apparatus including the plate-level electroplating fixture described in any of the above aspects.

[0015] Based on any of the above aspects, the plate-level electroplating fixture and electroplating apparatus provided in the embodiments of this application form a sealed area in the clamping area of ​​the product by providing a protruding structure on the side of the sealing component facing the product and cooperating with the photoresist provided on the side of the product. This can completely seal the seed layer in the area, effectively preventing the electroplating solution from intruding and causing metal to be plated on the non-electroplating area. At the same time, by having multiple evenly distributed conductive contacts in contact with the seed layer, it can ensure uniform current introduction, improve the thickness consistency and surface quality of the electroplated layer, and thus improve the uniformity of electroplating. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1aFig. 1 is a schematic view of a structure of a board-level electroplating fixture in the prior art; Figure 1b Fig. 2 is another schematic view of a structure of a board-level electroplating fixture in the prior art; Figure 2 Fig. 3 is a schematic view of a structure of a board-level electroplating fixture provided in the present embodiment; Figure 3 Fig. 4 is another schematic view of a structure of a board-level electroplating fixture provided in the present embodiment; Figure 4 Fig. 5 is a schematic view of a structure of a board-level electroplating fixture provided in the present embodiment; Figure 5 Fig. 6 is another schematic view of a structure of a board-level electroplating fixture provided in the present embodiment; Figure 6 Fig. 7 is a schematic view of a structure of a board-level electroplating fixture provided in the present embodiment.

[0018] Fig. 8 is a schematic view of a structure of a board-level electroplating fixture provided in the present embodiment. DETAILED DESCRIPTION

[0019] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0021] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0022] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] In addition, the terms "horizontal", "vertical", "overhanging", and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0024] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.

[0026] The inventor has found that, at present, referring to Figure 1a and Figure 1b , the width L1' of the sealing assembly on the board-level electroplating clamp 100' is usually 4.29 mm, and the opening width L2' of the photoresist 210' is usually 5.2 mm. The width of the sealing assembly on the board-level electroplating clamp 100' is less than the opening width of the photoresist 210', which can cause the sealing assembly to not completely cover the opening area of the photoresist 210', so that the seed layer 220' located on both sides of the sealing assembly is exposed to the electroplating solution, forming additional metal deposition, which can affect the flatness of the circuit and cause defects such as short circuit or open circuit, thereby reducing the yield of the chip.

[0027] In addition, the sealing assembly and the conductive contact of the board-level electroplating clamp 100' are designed in an integrated structure. If there is an uneven area of the seed layer 220' of the product, the conductive contact can not be in good contact with the seed layer 220', or the seed layer 220' can be damaged.

[0028] Therefore, the embodiment provides a solution to solve the above problems. The solution provided by the embodiment is described in detail as follows.

[0029] Please refer to Figure 2 , Figure 2 A structure diagram of the board-level electroplating clamp 100 provided by the example embodiment is shown in FIG. 1. The board-level electroplating clamp 100 can include a sealing assembly 110 and a plurality of conductive contact pieces 120. The sealing assembly 110 can be used to seal the opening area of the photoresist 210 at the edge of the product. The plurality of conductive contact pieces 120 can be used to contact the seed layer 220 at the edge of the product to achieve current conduction.

[0030] The board-level electroplating clamp 100 can further include a clamp body 140 made of conductive material. The clamp body 140 is electrically connected to the plurality of conductive contact pieces 120, so that the current is conducted to the conductive contact pieces 120 through the clamp body 140, and then transmitted to the seed layer 220, achieving stable power supply. In addition, the clamp body 140 and the plurality of conductive contact pieces 120 can be an integral structure.

[0031] The sealing assembly 110 covers the clamp body 140, which is used to prevent the clamp body 140 from being damaged and to isolate the electroplating solution from corroding the clamp body 140, ensuring the stability and reliability of current conduction. The side of the sealing assembly 110 facing the product is provided with a protruding structure 130. The protruding structure 130 can cooperate with the photoresist 210 provided on one side of the product to form a sealed area at the edge of the product. The shape of the sealed area can be rectangular, and the protruding structure 130 can be in contact with the four sides of the sealed area.

[0032] Before electroplating, the photoresist 210 can be coated on the surface of the product, and the target pattern area to be electroplated and the opening area at the edge of the product can be formed on the surface of the product by a photolithography process. The opening area can be used to cooperate with the board-level electroplating clamp 100 to achieve electrical contact and sealing of the seed layer 220 at the edge of the product.

[0033] In the embodiment, the side of the sealing assembly 110 facing the product is provided with two protruding structures 130. The two protruding structures 130 have a gap corresponding to the opening area of the photoresist 210 at the edge of the product. The two protruding structures 130 can cooperate with the photoresist 210 on both sides of the opening area, respectively, so as to completely cover and seal the opening area of the photoresist 210, preventing the electroplating solution from seeping into the seed layer 220 in the area to cause metal deposition.

[0034] The plurality of conductive contacts 120 are evenly distributed along the extension direction of the sealing area, and gaps are formed between the conductive contacts 120 and the protruding structures 130. The orthographic projection of the conductive contacts 120 on the product is located in the clamping area of the product, and the conductive contacts 120 are in contact with the seed layer 220 of the product, for providing current to the product during electroplating. The clamping area can be located at the edge of the product.

[0035] In the embodiment, the plurality of conductive contacts 120 can be located in the gaps between the two protruding structures 130, and are evenly arranged along the extension direction of the sealing area. The distance between the plurality of conductive contacts 120 and the two protruding structures 130 is equal. The plurality of conductive contacts 120 can be in contact with the seed layer 220 exposed by the photoresist 210, so as to ensure uniform current conduction to the seed layer 220. The plurality of conductive contacts 120 can have the same shape and size.

[0036] In some examples, the conductive contacts 120 can be conductive pins, and the material of the conductive contacts 120 can be a metal material, for example, copper.

[0037] Based on the above design, in the board-level electroplating clamp 100 provided in the embodiment, by arranging the protruding structures 130 on the side of the sealing assembly 110 facing the product, and making the protruding structures 130 cooperate with the photoresist 210 arranged on one side of the product, a sealing area is formed in the clamping area of the product. The seed layer 220 in this area can be completely sealed, effectively preventing the problem of metal deposition in the non-electroplating area caused by the invasion of the electroplating solution. Meanwhile, by making the plurality of evenly distributed conductive contacts 120 in contact with the seed layer 220, uniform current conduction can be ensured, and the thickness consistency and surface quality of the electroplating layer can be improved, so as to improve the uniformity of electroplating.

[0038] In a possible implementation, referring again to Figure 2 , the protruding structure 130 can include a first protruding part and a second protruding part arranged in sequence in the direction close to the conductive contact 120. In the direction perpendicular to the product, the height of the second protruding part can be greater than the height of the first protruding part. The height difference L3 between the second protruding part and the first protruding part can be 130 microns to 150 microns.

[0039] In the embodiment, the protruding structure 130 on both sides of the conductive contact 120 can include a first protruding part and a second protruding part arranged in sequence towards the conductive contact 120, and the first protruding part and the second protruding part can form a stepped sealing structure, and the protruding height of the second protruding part can be greater than the protruding height of the first protruding part. For different photoresist 210 opening areas, the first protruding part 131 or the second protruding part 132 can be selected according to the width to cooperate with the photoresist 210, so that the seed layer 220 can be prevented from being damaged due to excessive pressure when the conductive contact 120 contacts the seed layer 220, and the conductive contact 120 can also be prevented from being in poor contact with the seed layer 220.

[0040] In some examples, the height difference L3 between the second protruding part and the first protruding part can be 130 microns, 132 microns, 135 microns, 138 microns, 140 microns, 143 microns, 144 microns, 145 microns, 146 microns, and 150 microns, etc. Preferably, the height difference L3 between the second protruding part and the first protruding part is 140 microns.

[0041] In the above design, by setting the protruding structure 130 to include the first protruding part and the second protruding part to form a stepped structure, different widths of the photoresist 210 opening area can be effectively adapted, the compatibility of the board-level electroplating clamp 100 is improved, the seed layer 220 is prevented from being damaged or in poor contact, and stable and reliable electrical connection between the conductive contact 120 and the seed layer 220 is ensured.

[0042] In a possible implementation, please refer to Figure 3 The shape of the surface of the first protruding part 131 towards the product side can include a sawtooth shape, that is, the surface of the first protruding part 131 towards the product side can be composed of a plurality of continuously distributed arc surfaces, and the curvature radius of each arc surface is consistent.

[0043] In the embodiment, the shape of the surface of the second protruding part 132 towards the product side can be arc-shaped, and the shape of the surface of the first protruding part 131 towards the product side can be sawtooth-shaped, with the tips of the sawteeth towards the product surface, which has better toughness when clamping the product and can enhance the sealing effect of the fitting with the edge of the photoresist 210.

[0044] In other examples, please refer again to Figure 2 The shape of the surface of the second protruding part 132 towards the product side can be arc-shaped, and the surface of the first protruding part 131 towards the product side can also be planar, which can be designed according to actual needs and is not specifically limited here.

[0045] In a possible implementation, please refer to Figure 4The first protruding part 131 and the second protruding part 132 are in at least partial overlap with the photoresist 210 on the product.

[0046] In some examples, for a thinner photoresist 210, the width of the photoresist 210 opening area is smaller, which can be 3.5 microns. In this case, the second protruding part 132 can be selected to be in contact with the edge of the photoresist 210, while the first protruding part 131 has a gap with the photoresist 210. The second protruding part 132 and the first protruding part 131 are both in the projection of the photoresist 210 on the product. Through the cooperation of the second protruding part 132 and the photoresist 210, the sealing and contact stability can be ensured.

[0047] In a possible implementation, please refer to Figure 5 The first protruding part 131 is in at least partial overlap with the photoresist 210 on the product. The second protruding part 132 is not in overlap with the photoresist 210 on the product.

[0048] In some examples, for a thicker photoresist 210, the width of the photoresist 210 opening area is larger, which can be 8.5 microns. In this case, the first protruding part 131 can be selected to be in contact with the edge of the photoresist 210. The first protruding part 131 is in at least partial overlap with the photoresist 210 on the product. The second protruding part 132 is not in overlap with the photoresist 210 on the product. The second protruding part 132 is in the projection of the photoresist 210 opening area on the product. The second protruding part 132 has a gap with the seed layer 220 exposed by the photoresist 210. Through the cooperation of the first protruding part 121 and the photoresist 210, the sealing and contact stability can be ensured.

[0049] In the above structure, by setting the first protruding part 131 or the second protruding part 132 in contact with the edge of the photoresist 210, the contact mode can be flexibly adjusted according to the thickness of the photoresist 210, thereby effectively improving the sealing adaptation ability of the product edge under different process conditions and ensuring the stable conduction between the conductive contact 120 and the seed layer 220. At the same time, it can also avoid poor contact between the conductive contact 120 and the seed layer 220, or damage to the seed layer 220.

[0050] In a possible implementation, please refer again to Figure 2 In the direction perpendicular to the product, the height difference L4 between the conductive contact 120 and the second protruding part can include 150 microns to 170 microns.

[0051] In some examples, the height difference L4 between the conductive contact 120 and the second protrusion can be 150 micrometers, 151 micrometers, 152 micrometers, 155 micrometers, 156 micrometers, 160 micrometers, 162 micrometers, 165 micrometers, 168 micrometers, and 170 micrometers, etc. Preferably, the height difference L4 between the conductive contact 120 and the second protrusion can be 160 micrometers.

[0052] In one possible implementation, please refer again. Figure 2 The distance L5 between the conductive contact 120 and the raised structure 130 can range from 2 mm to 4 mm.

[0053] In this embodiment, the spacing L6 between the protrusions 130 on both sides of the conductive contact 120 can be 4 mm to 8 mm. Preferably, the spacing L6 between the protrusions 130 on both sides of the conductive contact 120 can be 6 mm.

[0054] In some examples, the distance L5 between the conductive contact 120 and the protrusion 130 can be 2 mm, 2.3 mm, 2.5 mm, 2.7 mm, 3 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, and 4 mm, etc. Preferably, the distance L5 between the conductive contact 120 and the protrusion 130 is 3 mm.

[0055] In one possible implementation, please refer to Figure 6 In the extending direction of the plate-level electroplating fixture 100, the distance L7 between the orthographic projection edge of the conductive contact 120 on the product and the orthographic projection edge of the photoresist 210 on the product ranges from 5 mm to 15 mm. That is, in the extending direction of the plate-level electroplating fixture 100, the width of the photoresist 210 retention area on both sides of the conductive contact 120 is from 5 mm to 15 mm.

[0056] In some examples, the product is rectangular in shape, which may include a first side 101 and a second side 102 arranged opposite each other, and a third side 103 and a fourth side 104 for connecting the first side 101 and the second side 102. The lengths of the first side 101 and the second side 102 may be 510 mm, and the lengths of the third side 103 and the fourth side 104 may be 515 mm. A plate-level electroplating fixture 100 may be located on both sides near the third side 103 and the fourth side 104 of the product for effective sealing and conductive contact at the edge regions of the third side 103 and the fourth side 104. The extending direction of the plate-level electroplating fixture 100 may be parallel to the extending direction of the third side 103 and the fourth side 104. The width L8 of the plate-level electroplating fixture 100 may be from 7 mm to 19 mm.

[0057] In the extension direction of the board-level electroplating clamp 100, the distance L7 between the edge of the front projection of the conductive contact 120 on the product and the edge of the front projection of the photoresist 210 on the product can be 8.5 mm, 9 mm, 9.5 mm, 10 mm, 10.5 mm, 11 mm, 11.5 mm, 12 mm, 13 mm, and 13.5 mm, etc. The distance between the edge of the front projection of the conductive contact 120 on the product and the first edge 101 or the second edge 102 of the product can be 14 mm.

[0058] In the above design, by setting the distance between the edge of the front projection of the conductive contact 120 on the product and the edge of the front projection of the photoresist 210 on the product to be in the range of 5 mm to 15 mm, it can be ensured that the conductive contact 120 only contacts the seed layer 220 exposed by the photoresist 210, thereby effectively preventing short circuit or current leakage problems caused by contacting the photoresist 210 during electroplating, and improving electroplating uniformity and yield.

[0059] In a possible implementation, the material of the protruding structure 130 can include fluororubber, which has a certain elasticity and can be deformed to achieve a sealing effect under pressure.

[0060] It should be noted that the material of the protruding structure 130 is not limited to fluororubber, and high-molecular materials such as silicone and ethylene-propylene-diene rubber having good chemical resistance and elasticity can also be selected to meet the sealing requirements in different process environments, which are not limited here.

[0061] In addition, the material of the sealing assembly 110 used to cover the clamp body 140 can be the same as that of the protruding structure 130, i.e., fluororubber, and the sealing assembly 110 used to cover the clamp body 140 and the protruding structure 130 can be an integrally formed structure.

[0062] The embodiment of the present application also provides an electroplating device, which can include the board-level electroplating clamp 100 provided by the embodiment of the present application.

[0063] In summary, the embodiment provides a board-level electroplating clamp and an electroplating device. By arranging a protruding structure on the side of the sealing assembly facing the product and cooperating the protruding structure with the photoresist arranged on one side of the product, a sealing area is formed in the clamping area of the product, the seed layer in this area can be completely sealed, and the problem of metal deposition in the non-electroplating area caused by the invasion of the electroplating solution can be effectively prevented. At the same time, by contacting the seed layer through multiple uniformly distributed conductive contacts, it can be ensured that the current is uniformly introduced, the thickness consistency and surface quality of the electroplating layer are improved, and the uniformity of electroplating is improved.

[0064] It is to be noted that, as used in this specification and the appended claims, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a combination of two or more components, and the term "an element" can include comparable reference to a plurality of elements. Also, as used in this specification and the appended claims, the term "or" as used in the context of "A / B" or "A / B / C" means any of the possibilities A, B, or C, i.e. "A or B" or "A or C" or "B or C." Further, the term "comprising" as used in this specification and the appended claims, is inclusive or open and does not exclude additional, non-relevant elements or limit it to the effects specifically recited. Likewise, the term "comprising" is also inclusive of "consisting of" and "consisting essentially of." Further, the terms "primarily," "essentially," "approximately," "about" or "substantially" when used in this specification and the appended claims indicate an important point or aspect that does not occur under all circumstances. Thus, these terms, when used in the claims, specify the presence of features, integers, steps or components having the effect described, but not bringing the absence of such features, integers, steps or components under the protection of each claim. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an overly literal or restricted way unless expressly so defined herein.

[0065] The foregoing is merely illustrative of the principles of this application and various modifications can be made by those skilled in the art without departing from the scope of the application. The above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the application should, therefore, be determined not with reference to the above description, but instead with reference to the appended claims, along with their full scope of equivalents.

Claims

1. A board-level electroplating fixture, characterized by, The application relates to a board-level electroplating fixture. The fixture comprises: a sealing assembly provided with a protruding structure on the side of the product, the protruding structure being matched with photoresist provided on the side of the product to form a sealing area on the clamping area of the product; 2. The board-level electroplating rig of claim 1, wherein, a plurality of conductive contacts, the plurality of conductive contacts being uniformly distributed along the extension direction of the sealing area, the conductive contacts having a gap with the protruding structure, the orthographic projection of the conductive contacts on the product being located in the sealing area, the conductive contacts being in contact with the seed layer of the product to provide current to the product during electroplating. The protruding structure comprises a first protruding part and a second protruding part provided in sequence in the direction close to the conductive contacts, the height of the second protruding part being greater than the height of the first protruding part in the direction perpendicular to the product.

3. The board-level electroplating rig of claim 2, wherein, The height difference between the second protruding part and the first protruding part is 130-150 microns.

4. The board-level electroplating rig of claim 2, wherein, The shape of the first protruding part towards the surface of the side of the product comprises a sawtooth shape.

5. The board-level electroplating rig of claim 2, wherein, The orthographic projection of the first protruding part and the second protruding part on the product at least partially coincides with the orthographic projection of the photoresist on the product. The orthographic projection of the first protruding part on the product at least partially coincides with the orthographic projection of the photoresist on the product.

6. The board-level electroplating rig of claim 2, wherein, The orthographic projection of the second protruding part on the product does not coincide with the orthographic projection of the photoresist on the product.

7. The board-level electroplating rig of claim 1, wherein, The height difference between the conductive contacts and the second protruding part is 150-170 microns in the direction perpendicular to the product.

8. The board-level electroplating rig of claim 1, wherein, The distance between the conductive contacts and the protruding structure is 2-4 mm.

9. The board-level electroplating rig of claim 1, wherein, The distance between the edge of the orthographic projection of the conductive contacts on the product and the edge of the orthographic projection of the photoresist on the product is 5-15 mm in the extension direction of the board-level electroplating fixture.

10. An electroplating apparatus characterized by comprising: The material of the protruding structure comprises fluorine rubber. The application also relates to a board-level electroplating fixture. The fixture comprises any one of claims 1-9.

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