Buffer structure, preparation method thereof and photovoltaic module

Abstract

The invention provides a buffer structure and a preparation method thereof, and a photovoltaic module, so as to solve the problem that a photovoltaic module in the prior art is liable to be damaged due to impact. The buffer structure includes: a substrate; the buffer layer is arranged on one side of the substrate; the buffer layer comprises a first shape-preserving compact layer and a forming top layer which are stacked on one side of the substrate, the surface, close to the forming top layer, of the first shape-preserving compact layer is provided with a first three-dimensional structure, the forming top layer is parallel to the substrate, and a plurality of buffer cavities are defined by the first three-dimensional structure and the forming top layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic and semiconductor technology, and particularly relates to a buffer structure, a preparation method thereof and a photovoltaic module. BACKGROUND

[0002] Solar energy is a clean energy and is the main development direction of future energy. A photovoltaic module is a semiconductor device capable of converting solar energy into electric energy, and works based on the photoelectric effect, that is, when light irradiates a semiconductor material, the energy of the photons will excite the electrons to jump from the valence band to the conduction band, thereby generating auto-electrons and holes, and forming an electric current under the action of a self-generated electric field.

[0003] In the related art, in order to be able to receive the irradiation of sunlight, the existing photovoltaic module is generally arranged in an open-air environment, whether it is arranged in an open-air photovoltaic power plant or a photovoltaic module arranged on the top of a car. However, since the photovoltaic module is arranged in the open air, it will be affected by external environmental factors during the working process, such as the scouring of rainwater or the impact of stones, which will cause damage to the photovoltaic module. SUMMARY

[0004] Therefore, the embodiments of the present application are dedicated to providing a buffer structure, a preparation method thereof and a photovoltaic module to solve the problem that the photovoltaic module in the related art is easily damaged by impact.

[0005] The first aspect of the present application provides a buffer structure, comprising: a substrate; a buffer layer located on one side of the substrate; the buffer layer comprises a first shape-retaining dense layer and a shaped top layer stacked on one side of the substrate, the first shape-retaining dense layer has a first three-dimensional structure close to the surface of the shaped top layer, the shaped top layer is parallel to the substrate, and the first three-dimensional structure and the shaped top layer enclose a plurality of buffer cavities.

[0006] In combination with the first aspect, in some possible implementation manners, the first shape-retaining dense layer is located on the side of the shaped top layer close to the substrate; preferably, the plurality of buffer cavities are filled with inert gas.

[0007] In combination with the first aspect, in some possible implementation manners, the first three-dimensional structure comprises a plurality of protrusions, the protrusions abut against the shaped top layer; preferably, the protrusions comprise protruding blocks, the plurality of protruding blocks are arranged in an array, the space between adjacent two protruding blocks constitutes a buffer cavity, and the plurality of buffer cavities are interconnected; or, the protrusions comprise strip-shaped protrusions, the plurality of strip-shaped protrusions are arranged at intervals along a preset direction, the space between adjacent two strip-shaped protrusions constitutes a buffer cavity, and the plurality of buffer cavities are not interconnected.

[0008] In combination with the first aspect, in some possible implementation manners, the first three-dimensional structure comprises a plurality of grooves and a connecting portion connecting the plurality of grooves, the connecting portion abuts against the shaped top layer; preferably, the grooves constitute buffer cavities, and the plurality of buffer cavities are not interconnected.

[0009] With reference to the first aspect, in some possible implementation manners, the buffer layer further includes a buffer base layer, the buffer base layer is located on the side of the first shape-preserving dense layer away from the forming top layer and in contact with the first shape-preserving dense layer, the surface of the buffer base layer close to the first shape-preserving dense layer has a second three-dimensional structure, and the pattern of the second three-dimensional structure is consistent with that of the first three-dimensional structure; preferably, the first shape-preserving dense layer is prepared by using an atomic layer deposition technology; preferably, the material of the first shape-preserving dense layer includes any one of an oxide, a fluoride, and a nitride; preferably, the material of the buffer base layer includes any one of polyurethane, polyimide, and polymethyl methacrylate; preferably, the buffer layer is multiple, and the multiple buffer layers are stacked in sequence in the direction away from the substrate.

[0010] The second aspect of the present application provides a photovoltaic cell, including: the buffer structure provided in any of the embodiments of the present application; and a photovoltaic functional layer, the photovoltaic functional layer is located between the substrate and the buffer layer, or on the side of the substrate away from the buffer layer.

[0011] With reference to the second aspect, in some possible implementation manners, the photovoltaic functional layer is located between the substrate and the buffer layer; the buffer structure further includes a second shape-preserving dense layer, the second shape-preserving dense layer surrounds the photovoltaic functional layer, one side edge of the second shape-preserving dense layer is connected to the first shape-preserving dense layer, and the other side edge is connected to the substrate; preferably, the second shape-preserving dense layer and the first shape-preserving dense layer are prepared by using the same atomic layer deposition technology.

[0012] With reference to the second aspect, in some possible implementation manners, the photovoltaic cell further includes an encapsulation layer and a cover plate, the buffer layer is located on the side of the photovoltaic functional layer away from the substrate, the encapsulation layer is located on the side of the buffer layer away from the photovoltaic functional layer, and the cover plate is located on the side of the encapsulation layer away from the buffer layer; or, the encapsulation layer is located on the side of the photovoltaic functional layer away from the substrate, the buffer layer is located on the side of the encapsulation layer away from the photovoltaic functional layer, and the cover plate is located on the side of the buffer layer away from the encapsulation layer.

[0013] The third aspect of the present application provides a preparation method of a buffer structure, including: forming a first shape-preserving dense layer on one side of a substrate, the first shape-preserving dense layer has a first three-dimensional structure on the surface close to a forming top layer; and forming the forming top layer on the side of the first shape-preserving dense layer away from the substrate, the forming top layer is parallel to the substrate, and the first three-dimensional structure and the forming top layer enclose a plurality of buffer cavities.

[0014] In some possible implementation manners, in combination with the third aspect, before the step of forming the first profiled dense layer on the one side of the substrate, the preparation method further comprises: preparing a buffer base layer on the one side of the substrate, the buffer base layer having a second three-dimensional structure on the side away from the substrate; and the step of forming the first profiled dense layer on the one side of the substrate comprises: forming the first profiled dense layer on the side of the buffer base layer away from the substrate, the pattern of the first three-dimensional structure being consistent with that of the second three-dimensional structure; preferably, the step of forming the first profiled dense layer on the side of the buffer base layer away from the substrate comprises: preparing the first profiled dense layer on the side of the buffer base layer away from the substrate by using an atomic layer deposition technology; preferably, the step of forming the profiled top layer on the side of the first profiled dense layer away from the substrate comprises: attaching the profiled top layer on the side of the first profiled dense layer away from the substrate; preferably, before the step of preparing the buffer base layer on the one side of the substrate, the preparation method further comprises: forming a photovoltaic functional layer on the one side of the substrate; and the step of preparing the buffer base layer on the one side of the substrate comprises: preparing the buffer base layer on the side of the photovoltaic functional layer away from the substrate; preferably, the preparation method further comprises: preparing an encapsulation layer on the side of the profiled top layer away from the substrate; and attaching a cover plate on the side of the encapsulation layer away from the substrate.

[0015] By using the technical solution of the present application, the buffer structure comprises a substrate and a buffer layer, the buffer layer comprises a first profiled dense layer and a profiled top layer stacked on the one side of the substrate, the first profiled dense layer has a first three-dimensional structure on the surface close to the profiled top layer, the profiled top layer is parallel to the substrate, and the first three-dimensional structure and the profiled top layer enclose a plurality of buffer cavities, the buffer cavities can release stress and resist external impact. For example, when the buffer structure is applied to a photovoltaic module, when the photovoltaic module is subjected to rainwater or stone impact, when the buffer layer is arranged on the side of the substrate away from the photovoltaic functional layer, the impact force generated by the rainwater or the stone is transmitted to the buffer layer, the plurality of buffer cavities can form a buffering effect on the rainwater or the stone to block the direct impact of the rainwater or the stone, thereby protecting the inside of the photovoltaic module. When the buffer layer is arranged between the photovoltaic functional layer and the cover plate, the impact force of the rainwater or the stone acting on the substrate can be transmitted to the photovoltaic functional layer and then to the buffer layer through the photovoltaic functional layer, and then the plurality of buffer cavities can form a buffering effect, thereby avoiding the photovoltaic functional layer from directly contacting the cover plate to protect the photovoltaic functional layer. By using the above photovoltaic module, the impact of the rainwater and the stone is slowed down by the arrangement of the buffer layer, thereby protecting the photovoltaic module and avoiding damage to the photovoltaic module. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 1 shows a cross-sectional structure schematic diagram of a buffer structure provided by a first embodiment of the present application.

[0017] Figure 2 Fig. 2 shows a cross-sectional structure schematic diagram of a buffer structure provided by a second embodiment of the present application.

[0018] Figure 3 The figure shown is a cross-sectional schematic diagram of the buffer structure provided in the third embodiment of this application.

[0019] Figure 4 The diagram shown is a top view of the buffer structure provided in the fourth embodiment of this application.

[0020] Figure 5 The diagram shown is a top view of the buffer structure provided in the fifth embodiment of this application.

[0021] Figure 6 The diagram shown is a top view of the buffer structure provided in the sixth embodiment of this application.

[0022] Figure 7 The diagram shown is a top view of the buffer structure provided in the seventh embodiment of this application.

[0023] Figure 8 The figure shown is a cross-sectional schematic diagram of the buffer structure provided in the eighth embodiment of this application.

[0024] Figure 9 The diagram shown is a cross-sectional view of the buffer structure provided in the ninth embodiment of this application.

[0025] Figure 10 The figure shown is a cross-sectional schematic diagram of the buffer structure provided in the tenth embodiment of this application.

[0026] Figure 11a The diagram shown is a structural schematic of a photovoltaic module provided in the eleventh embodiment of this application.

[0027] Figure 11b As shown Figure 11a A magnified view of a portion of point A in the middle.

[0028] Figure 12 The diagram shown is a structural schematic of a photovoltaic module provided in the twelfth embodiment of this application.

[0029] Figure 13 The diagram shown is a structural schematic of a photovoltaic module provided in the thirteenth embodiment of this application.

[0030] Figure 14 The diagram shown is a structural schematic of a photovoltaic module provided in the fourteenth embodiment of this application.

[0031] Figure 15 The diagram shown is a structural schematic of a photovoltaic module provided in the fifteenth embodiment of this application.

[0032] Figure 16 The diagram shown is a structural schematic of a photovoltaic module provided in the sixteenth embodiment of this application.

[0033] Figure 17This is a schematic flowchart illustrating the method for preparing the buffer structure provided in the seventeenth embodiment of this application.

[0034] Figures 18a-18e Execution provided for the eighteenth embodiment of this application Figure 17 A schematic diagram of the structure of the intermediate product obtained during the preparation method shown. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Figure 1 The diagram shown is a cross-sectional view of the buffer structure provided in the first embodiment of this application. Figure 1 As shown, the buffer structure includes a substrate 10 and a buffer layer 40, with the buffer layer 40 located on one side of the substrate 10. The buffer layer 40 includes a first conformal compact layer 451 and a molded top layer 43 stacked on one side of the substrate 10. The surface of the first conformal compact layer 451 near the molded top layer 43 has a first three-dimensional structure D1. The molded top layer 43 is parallel to the substrate 10, and the first three-dimensional structure D1 and the molded top layer 43 enclose a plurality of buffer cavities 41.

[0037] The first conformal dense layer 451 can be located on the side of the top molding layer 43 close to the substrate 10, or it can be located on the side of the top molding layer 43 away from the substrate 10.

[0038] The first three-dimensional structure D1 can be formed by either setting protrusions to separate the first conforming dense layer 451 and the top molded layer 43, creating a gap, or by setting grooves to separate the first conforming dense layer 451 and the top molded layer 43, creating a gap. The size of the buffer cavity 41 can be at the nanometer or micrometer level.

[0039] The first conformal dense layer 451 has a dense structure, which can maintain the conformity of the buffer cavity 41, making the buffer cavity 41 more stable and thus forming a good buffering effect. In one embodiment, the first conformal dense layer 451 is fabricated using ALD (Atomic Layer Deposition) technology. Atomic Layer Deposition is a high-precision thin film preparation process that can deposit atoms or molecules layer by layer on the surface of a substrate, achieving nanometer-level thickness control and uniform film formation. The first conformal dense layer 451 formed by ALD technology can be controlled at the nanometer level, achieving atomic-level layer-by-layer growth, thus forming a dense layered structure and achieving good conformity. In some embodiments, the first conformal dense layer 451 can be made of SnO. x It is made of materials with a transmittance of over 90%, such as SiO2, TiO2, SiO2-TiO2 antireflection membrane, Al2O3, aluminum nitride (AlN), and AlON (aluminum oxynitride).

[0040] In related technologies, PVD (Physical Vapor Deposition) is a technique that vaporizes solid or liquid materials into gas atoms, molecules, or ions under vacuum conditions using physical methods, and then deposits them onto a substrate surface to form a thin film. However, compared to atomic layer deposition (ALD), PVD is faster and struggles to cover complex geometries. In complex structures, PVD cannot cover all surfaces or deposit material in the depth direction. Atomic layer deposition (ALD), on the other hand, can form atomic-level deposition in the depth direction on complex geometric surfaces. The resulting first conformal-preserving dense layer 451 is denser and offers superior conformal preservation. Furthermore, the dense structure of the first conformal-preserving dense layer 451 effectively enhances water and oxygen barrier properties, achieving a sealing effect.

[0041] The top layer 43 is parallel to the substrate 10. In this case, when the top layer 43 is bonded to the first three-dimensional structure D1, it is easy to align. Only edge alignment is needed to ensure the formation of the gap, without having to consider the alignment accuracy of the internal detailed structure, which is easy to implement in industry.

[0042] The top layer 43 should be made of a material with a certain strength so that it can cover the first conformal dense layer 451 and be parallel to the substrate 10, thereby forming partial contact with the first three-dimensional structure D1 and partially separating it with a certain space (i.e., a gap), thus forming a buffer cavity 41. Multiple buffer cavities 41 can be arranged in a connected manner, or they can be arranged without being connected to each other.

[0043] In some embodiments, the top layer 43 can be made of polyolefin film, corrosion-resistant dry film, or pore-masking dry film, such as PET (polyester film layer) or PE (polyethylene film layer).

[0044] For example, the strength of the molded top layer 43 is higher than that of the first conforming dense layer 451. That is, the cavity of the buffer cavity 41 is disposed on the one with lower strength between the molded top layer 43 and the first conforming dense layer 451, and is covered by the other with higher strength, so that the buffer cavity 41 can be formed between the molded top layer 43 and the first conforming dense layer 451.

[0045] It should be noted that the buffer cavity 41 can have various shapes. In the same embodiment, it is not limited to all buffer cavities 41 having the same shape. The shapes of the buffer cavities 41 in the same embodiment can be different.

[0046] In one embodiment, the multiple buffer chambers 41 are all filled with inert gas. In this case, when the buffer structure is used in a photovoltaic module, by filling it with inert gas, the chemical inertness of the inert gas can be utilized to form a protective barrier inside the photovoltaic module, preventing the gas in the buffer chambers 41 from entering the photovoltaic module and causing damage to it.

[0047] In one embodiment, the buffer cavity 41 is a vacuum environment, without any filling material, which increases light transmittance. The buffer cavity 41 also allows the buffer layer 40 to have good bending performance and stress dispersion, resulting in a good buffering effect and mitigating the impact of rainwater and stones. Furthermore, the buffer layer 40 with the above structure has controllable advantages in light transmittance, sealing, and bending, making it applicable to various scenarios, such as flexible electronic products and other fields.

[0048] Figure 2 The diagram shown is a cross-sectional view of the buffer structure provided in the second embodiment of this application. Figure 3 The diagram shown is a cross-sectional view of the buffer structure provided in the third embodiment of this application. (In conjunction with...) Figure 1 , Figure 2 and Figure 3 As shown, the first three-dimensional structure D1 includes multiple protrusions 44, which abut against the top layer 43. Using protrusions 44 to form the first three-dimensional structure D1 has the advantages of simple structure and ease of processing.

[0049] The shape of the protrusion 44 includes, but is not limited to, protrusion 441, strip protrusion 442, or a combination of protrusion 441 and strip protrusion 442. The arrangement of multiple protrusions 44 can be in an array, arranged in a certain direction, or set arbitrarily without needing to follow a certain pattern.

[0050] The shapes of the protrusions 441 and 442 are not limited; their cross-sections can be triangular, quadrilateral, or other polygons, or irregular polygonal structures. The 442 can extend in a straight line or a curve, as long as it forms a buffer cavity 41 with a cushioning effect.

[0051] In some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the cross-sectional shapes of the protrusion 441 and the strip protrusion 442 can be triangular, trapezoidal, or curved surfaces. In the same embodiment, the cross-sectional shapes of the protrusion 441 and the strip protrusion 442 can be one or a combination of triangular, trapezoidal, and curved surfaces.

[0052] Figure 4 The diagram shown is a top view of the buffer structure provided in the fourth embodiment of this application. Figure 5 The diagram shown is a top view of the buffer structure provided in the fifth embodiment of this application. Figure 6 The image shown is a top view of the buffer structure provided in the sixth embodiment of this application. (In conjunction with...) Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment, the protrusion 44 includes a bump 441. The top view shape of the bump 441 can be rectangular, circular, or elliptical. In the same buffer structure, the top view shapes of different bumps 441 can be independently selected from one of the rectangular, circular, or elliptical structures. The top view shapes of different bumps 441 can be the same or different.

[0053] In one embodiment, combined Figure 4 , Figure 5 and Figure 6 As shown, the protrusion 44 includes protrusions 441, and multiple protrusions 441 are arranged in an array. The space between two adjacent protrusions 441 forms a buffer cavity 41, and the multiple buffer cavities 41 are interconnected. With the above structure, the multiple spaced protrusions 441 can form interconnected buffer cavities 41, so that the buffer layer 40 has excellent elastic deformation ability and obtains a better buffering effect.

[0054] In other embodiments, some buffer cavities 41 may be connected while the remaining buffer cavities 41 are not connected.

[0055] Figure 7 The diagram shown is a top view of the buffer structure provided in the seventh embodiment of this application. Figure 7As shown, in this embodiment, the protrusion 44 includes strip-shaped protrusions 442. Multiple strip-shaped protrusions 442 are arranged at intervals along a predetermined direction. The space between two adjacent strip-shaped protrusions 442 forms a buffer cavity 41, and the multiple buffer cavities 41 are not interconnected. Using multiple spaced strip-shaped protrusions 442 increases the contact area between the buffer base layer 42 and the molded top layer 43, resulting in higher structural strength for the buffer layer 40 and resistance to stronger impact forces.

[0056] It should be noted that when the strip protrusion 442 extends from one side of the substrate 10 to the other, the resulting buffer cavities 41 will form a non-communicating structure. In other embodiments, the middle of the strip protrusion 442 can be broken, thereby forming interconnected buffer cavities 41. Of course, the break position of each strip protrusion 442 can be determined according to the actual situation, either at the same position or at different positions.

[0057] The multiple strip-shaped protrusions 442 are arranged at intervals along a preset direction. This preset direction refers to either the length or width direction of the buffer base layer 42. If the multiple strip-shaped protrusions 442 extend along the length direction of the buffer base layer 42, then their arrangement direction is the width direction of the buffer base layer 42. If the multiple strip-shaped protrusions 442 extend along the width direction of the buffer base layer 42, then their arrangement direction is the length direction of the buffer base layer 42.

[0058] Figure 8 The diagram shown is a cross-sectional view of the buffer structure provided in the eighth embodiment of this application. Figure 8 The buffer structure shown is similar to Figures 1-3 The difference in the buffer structure shown is that, in this embodiment, the first three-dimensional structure D1 includes multiple grooves 46 and connecting portions that connect the multiple grooves 46, with the connecting portions abutting against the molded top layer 43. Using the above structure, by setting multiple grooves 46 to form the buffer cavity 41, it has the advantages of simple structure and ease of processing.

[0059] The groove 46 is not limited to the form of an arc-shaped groove, a strip-shaped groove, or a combination of arc-shaped and strip-shaped grooves. The arrangement of the multiple grooves 46 can be an array, arranged in a certain direction, or arbitrarily arranged without needing to follow a specific pattern. In some embodiments, the multiple grooves 46 include multiple arrayed arc-shaped grooves. In other embodiments, the multiple grooves 46 include multiple strip-shaped grooves arranged at intervals in a preset direction.

[0060] The form of the arc-shaped groove is not unique; it can also be a groove with a triangular, quadrilateral, or other polygonal cross-section. Similarly, the form of the strip-shaped groove is not unique; it can also be a groove with a triangular, quadrilateral, other polygonal, or arc-shaped cross-section. Furthermore, the strip-shaped groove can extend in a straight line or a curve, as long as it forms a buffer cavity 41 with a buffering effect.

[0061] In some embodiments, the cross-sectional shape of the groove 46 can be a triangular, trapezoidal, or curved surface structure. In the same embodiment, the cross-sectional shape of the groove 46 can be one or a combination of triangular, trapezoidal, and curved surface structures.

[0062] In some embodiments, the top view shape of the groove 46 can be a rectangular, circular, or elliptical structure. In the same embodiment, the top view shape of the groove 46 can be one or a combination of rectangular, circular, or elliptical structures.

[0063] It should be noted that, compared to the protrusion 44, the groove 46 is a recessed structure, and its structure is more complex than that of the protrusion 44. Generally, atomic layer deposition technology is used to prepare a conformal dense layer 45 to form a dense structure on the surface of the groove 46.

[0064] In one embodiment, the groove 46 forms a buffer cavity 41, and the multiple buffer cavities 41 are not interconnected.

[0065] Figure 9 The diagram shown is a cross-sectional schematic of the buffer structure provided in the ninth embodiment of this application. Figure 9 The difference between the buffer structure shown and the buffer structure provided in any of the above embodiments is that, in this embodiment, the buffer layer 40 further includes a buffer base layer 42. The buffer base layer 42 is located on the side of the first conformal compact layer 451 away from the molding top layer 43 and is in contact with the first conformal compact layer 451. The surface of the buffer base layer 42 near the first conformal compact layer 451 has a second three-dimensional structure D2, and the pattern of the second three-dimensional structure D2 is consistent with that of the first three-dimensional structure D1. That is, the first conformal compact layer 451 replicates the pattern of the second three-dimensional structure D2 and forms the first three-dimensional structure D1.

[0066] In some embodiments, the buffer base layer 42 may be made of materials with good light transmittance, such as polyurethane, polyimide, and polymethyl methacrylate.

[0067] In some embodiments, the strength of the buffer base layer 42 is less than the strength of the molded top layer 43, the cavity of the buffer cavity 41 is formed on the buffer base layer 42, and the first shape-retaining dense layer 45 is covered on the buffer base layer 42 and forms a shape-retaining effect on the cavity of the buffer cavity 41 provided on the buffer base layer 42.

[0068] In one embodiment, a first conformal dense layer 451 formed by a flexible buffer base layer 42 and atomic layer deposition technology can form a dense structure that suppresses problems such as water and oxygen intrusion and ion migration, so as to improve the sealing performance and reliability of photovoltaic modules when the buffer structure is applied.

[0069] Figure 10 The diagram shown is a cross-sectional view of the buffer structure provided in the tenth embodiment of this application. Figure 10 As shown, in this embodiment, there are multiple buffer layers 40, which are stacked sequentially in the direction away from the substrate 10.

[0070] This application also provides a photovoltaic module, including the buffer structure provided in any of the above embodiments. Figure 11a The diagram shown is a structural schematic of a photovoltaic module provided in the eleventh embodiment of this application. Figure 11b As shown Figure 11a A magnified view of a portion of point A in the middle. (See image below.) Figure 11a and Figure 11b As shown, the photovoltaic module includes the buffer structure provided in any of the above embodiments, and a photovoltaic functional layer 20, which is located between the substrate 10 and the buffer layer 40.

[0071] Applying the technical solution of this application, the photovoltaic module includes a buffer structure and a photovoltaic functional layer 20. Light enters the photovoltaic module from one side of the substrate 10. The photovoltaic functional layer 20 absorbs photons of the light and excites electrons in the photovoltaic functional layer 20 to undergo energy level transitions, thereby generating an electric current. Because the photovoltaic module is provided with a buffer layer 40, which has multiple buffer cavities 41, when the photovoltaic module is subjected to rainwater or stone impact, when the buffer layer 40 is located between the photovoltaic functional layer 20 and the cover plate 30, the impact force of the rainwater or stones acting on the substrate 10 can be transmitted to the photovoltaic functional layer 20, and then through the photovoltaic functional layer 20 to the buffer layer 40. The multiple buffer cavities 41 then form a buffering effect, protecting the photovoltaic functional layer 20. Using the above-described photovoltaic module, the buffer layer 40 mitigates the impact of rainwater and stones, protecting the photovoltaic module and preventing damage.

[0072] In related technologies, the impact force generated by rainwater or pebbles acts directly on the substrate 10 and is transmitted to the interior of the module through the substrate 10, thereby causing damage to the photovoltaic functional layer 20. Using the photovoltaic module provided in this application, the buffer cavity 41 formed by the buffer layer 40 can play a buffering and supporting role. Through the slight elastic deformation of the buffer layer 40, the impact force of rainwater or pebbles is offset, thereby absorbing and buffering the impact force of rainwater or pebbles and preventing damage to the photovoltaic module.

[0073] The photovoltaic functional layer 20 includes a bottom electrode, an electron transport layer 24, a light absorption layer 23, a hole transport layer 22, and a metal electrode 21 sequentially disposed on the substrate 10. Each layer constituting the photovoltaic functional layer 20 is encapsulated by an encapsulation layer 50. Of course, the order in which the photovoltaic functional layers 20 are arranged may differ for different types of photovoltaic modules.

[0074] The bottom electrode is a crucial component of photovoltaic modules, formed on the substrate 10 through a patterned process. It typically employs materials with high light transmittance and good conductivity, such as fluorine-doped tin oxide (FTO) or indium-doped tin oxide (ITO). These materials effectively guide light into the light-absorbing layer 23 and collect the generated current. Alternatively, the bottom electrode can be a flexible electrode, such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN). These materials are commonly used as flexible substrates for fabricating transparent conductive electrodes or other functional thin-film electrodes. In flexible transparent conductive electrodes, the flexible substrate can be combined with a metal mesh or conductive material to form a high-performance electrode structure.

[0075] The electron transport layer 24 is located between the substrate 10 and the light-absorbing layer 23, and its main function is to transport electrons. Commonly used materials for the electron transport layer 24 include titanium dioxide (TiO2), aluminum oxide (Al2O3), and zinc oxide (ZnO). These materials have good electron mobility and stability, and can transport electrons generated in the light-absorbing layer 23 to the bottom electrode. Generally, the electron transport layer is prepared by vapor deposition, but atomic layer deposition (ALD) technology can also be used.

[0076] The light-absorbing layer 23 is a core component of photovoltaic modules, capable of absorbing sunlight and generating photogenerated carriers (including electrons and holes). Its structure and material properties directly affect the photoelectric conversion efficiency and stability of the battery. Based on the different types of light-absorbing layers 23, they can be divided into the following categories: First, silicon-based absorption layers, including monocrystalline silicon, polycrystalline silicon, and amorphous silicon. The production processes of these silicon-based materials are mature and the cost is relatively low. Monocrystalline silicon, in particular, has high purity and a good crystal structure, making it the most mainstream material for the light-absorbing layer 23. The efficiency of polycrystalline silicon and amorphous silicon is lower than that of monocrystalline silicon. Second, perovskite absorption layers. The crystal structure of perovskite layers is usually of the ABX3 type, where the A-site is usually an organic cation, such as methylamine ions (CH3NH3). + ) or cesium ions (Cs + The B site is usually a metal cation, such as lead (Pb). 2+ ) or tin (Sn 2+ The X-position is usually occupied by a halide anion, such as iodine (I). - ), bromine (Br - ) or chlorine (Cl - In the crystal structure described above, the boron ion is located at the center of the cubic unit cell and is surrounded by six x ions to form an octahedral coordination. The atom is located at the corner of the unit cell and is surrounded by twelve x ions. The commonly used materials for the perovskite layer are CH3NH3PbI3 (MAPbI3) or CsPbI3, which are responsible for absorbing photons and generating electron-hole pairs.

[0077] Of course, the A-site, B-site, and X-site of perovskite materials can be iteratively replaced, and the family of materials that synthesize this crystal structure are collectively referred to as perovskite materials.

[0078] In this process, the surface of the light-absorbing layer 23 made of perovskite is generally provided with a passivation layer, which can fill defects on the surface and at the grain boundaries of the perovskite material, reduce the recombination of electrons and holes, and thus improve the open-circuit voltage of the photovoltaic module. The passivation layer is usually made of organic halide salts (OAl, PRA1, etc.), lead oxide salts, etc.

[0079] The hole transport layer 22 can efficiently transport holes generated in the light absorption layer 23 to the metal electrode 21 and block the reverse transport of electrons, reducing electron-hole recombination and improving the photoelectric conversion efficiency of the photovoltaic module. Commonly used materials for the hole transport layer 22 include organic small molecule materials such as Spiro-OMeTAD, polymer materials such as PTAA, and p-type inorganic oxides.

[0080] The metal electrode 21 is the last layer of the photovoltaic functional layer 20, and its main function is to collect current. Commonly used materials for the metal electrode 21 include gold (Au), silver (Ag), and copper (Cu). These materials have good conductivity and stability, and can effectively collect and discharge the current generated by the photovoltaic module.

[0081] Depending on the type of substrate 10, photovoltaic modules can be divided into single-glass modules and double-glass modules. In single-glass modules, the substrate 10 is made of a polymer organic backsheet printed with aluminum paste, typically made of materials such as polyethylene terephthalate (PET), polyvinylidene fluoride (PVF), polyvinylidene fluoride (PVDF), and polyethylene (PE). Sunlight can only enter the interior of the single-glass module through the cover plate 30 side; therefore, the power generation efficiency of single-glass modules is relatively low. In double-glass modules, both the substrate 10 and the cover plate 30 are generally made of tempered glass, allowing sunlight to enter the interior of the module from both sides, resulting in a higher power generation efficiency compared to single-glass modules.

[0082] In one embodiment, such as Figure 11a and Figure 11b As shown, the photovoltaic module also includes an encapsulation layer 50 and a cover plate 30. The encapsulation layer 50 is located on the side of the buffer layer 40 away from the photovoltaic functional layer 20, and the cover plate 30 is located on the side of the encapsulation layer 50 away from the buffer layer 40. With this structure, the buffer layer 40 can directly contact the photovoltaic functional layer 20, thus directly buffering and protecting it. Simultaneously, the encapsulation layer 50 encapsulates the photovoltaic functional layer 20, achieving a good encapsulation effect, giving the photovoltaic module excellent buffering and encapsulation performance.

[0083] The photovoltaic module also includes a frame encapsulating layer, which surrounds the outer periphery of the photovoltaic functional layer 20. Generally, photovoltaic modules are encapsulated using a lamination process. During encapsulation, the height of the encapsulation layer 50 is lower than the height of the frame encapsulating layer; that is, the cover plate 30 is supported on the frame encapsulating layer, and there is a gap between the encapsulation layer 50 and the cover plate 30. During lamination, the encapsulation layer 50 connects the cover plate 30 and the buffer layer 40, and the frame encapsulating layer connects the substrate 10 and the cover plate 30, thus forming a sealed structure for the photovoltaic module to prevent water and oxygen intrusion.

[0084] The frame encapsulating adhesive layer effectively seals the edges of the photovoltaic module, preventing moisture and dust from entering the module and extending its lifespan. Furthermore, the frame encapsulating adhesive layer possesses excellent electrical insulation properties, preventing internal electrical short circuits. In some embodiments, the frame encapsulating adhesive layer can be made of materials such as silicone or modified silicone. For example, butyl rubber is a one-component adhesive made from IIR (butyl rubber) as a base material, modified with substances such as PIB (polyisobutylene).

[0085] Figure 12 The diagram shown is a structural schematic of a photovoltaic module provided in the twelfth embodiment of this application. Figure 12 The photovoltaic modules shown are Figure 11a The difference in the photovoltaic module shown is that, in this embodiment, the photovoltaic functional layer 20 is located between the substrate 10 and the buffer layer 40. The buffer structure also includes a second conformal compact layer 452, which surrounds the photovoltaic functional layer 20. One edge of the second conformal compact layer 452 is connected to the first conformal compact layer 451, and the other edge is connected to the substrate 10. Exemplarily, the second conformal compact layer 452 and the first conformal compact layer 451 are prepared using the same atomic layer deposition technique.

[0086] like Figure 12 As shown, the second conformal compact layer 452 and the first conformal compact layer 451 together constitute the conformal compact layer 45. The first conformal compact layer 451 covers the first three-dimensional structure D1, and the second conformal compact layer 452 surrounds the first conformal compact layer 451 and connects to its outer edge. The second conformal compact layer 452 extends from the edge of the first conformal compact layer 451 towards the substrate 10 and contacts the substrate 10. In this configuration, the buffer cavity 41 is more stable, resulting in a good buffering effect. The dense structure formed by the second conformal compact layer 452 and the first conformal compact layer 451 can encapsulate the photovoltaic functional layer 20, preventing water and oxygen intrusion and improving the sealing performance of the photovoltaic module.

[0087] Figure 13 The diagram shown is a structural schematic of a photovoltaic module provided in the thirteenth embodiment of this application. Figure 13 The photovoltaic modules shown are Figure 12 The difference in the photovoltaic module shown is that, in this embodiment, the encapsulation layer 50 is located on the side of the photovoltaic functional layer 20 away from the substrate 10, the buffer layer 40 is located on the side of the encapsulation layer 50 away from the photovoltaic functional layer 20, and the cover plate 30 is located on the side of the buffer layer 40 away from the encapsulation layer 50. Using this structure, by providing the buffer layer 40 outside the encapsulation layer 50, the buffer layer 40 and the photovoltaic functional layer 20 are isolated. This achieves a double-layer encapsulation effect and also prevents the gas in the buffer cavity 41 from directly contacting the photovoltaic functional layer 20.

[0088] The encapsulation layer 50 can be made of materials such as EVA film (ethylene-vinyl acetate copolymer), POE film (polyolefin elastomer), and EPE film (EVA / POE composite material). EVA film is the most commonly used encapsulation film, offering good adhesion, light transmittance, and cost advantages. POE film provides better weather resistance, UV resistance, and low water absorption, with a light transmittance of approximately 95%.

[0089] Figure 14 The diagram shown is a structural schematic of a photovoltaic module provided in the fourteenth embodiment of this application. Figure 14 The difference between the photovoltaic module shown and the photovoltaic module provided in any of the above embodiments is that, in this embodiment, the buffer layer 40 is disposed on the side of the substrate 10 away from the photovoltaic functional layer 20. With this structure, the impact force generated by rainwater or pebbles will directly act on the buffer layer 40. On the one hand, it isolates the rainwater or pebbles from the cover plate 30 or the substrate 10, preventing the impact force of rainwater or pebbles from directly acting on the cover plate 30 or the substrate 10. On the other hand, the multiple buffer cavities 41 can buffer the rainwater or pebbles, blocking the direct impact of rainwater or pebbles and protecting the interior of the photovoltaic module.

[0090] In related technologies, the impact force generated by rainwater or stones will directly act on the substrate 10 or the cover plate 30. On the one hand, it is easy to damage the substrate 10 or the cover plate 30. On the other hand, the impact force will also be transmitted to the inside of the module through the substrate 10 or the cover plate 30, thereby causing damage to the photovoltaic functional layer 20.

[0091] The photovoltaic module provided in this embodiment uses the buffer cavity 41 formed by the buffer layer 40 to absorb and buffer the impact of rainwater or stones. When the buffer layer 40 is disposed on the side of the substrate 10 away from the photovoltaic functional layer 20, the buffer layer 40 can isolate rainwater or stones from the cover plate 30 or the substrate 10. On the one hand, it prevents rainwater or stones from directly impacting the substrate 10 or the cover plate 30. On the other hand, the buffering effect of the buffer cavity 41 forms protection for the inside of the photovoltaic module.

[0092] In this embodiment, since the buffer layer 40 is located on the side of the substrate 10 away from the photovoltaic functional layer 20, i.e., on the outside of the module, the buffer cavity 41 can be filled with air. In this case, the air will not enter the module due to the isolation provided by the substrate 10, so there is no need to worry about the photovoltaic functional layer 20 being affected by water and oxygen corrosion. Of course, the gas filled in the buffer cavity 41 is determined by its location.

[0093] In this embodiment, the buffer layer 40 can be configured as a single layer or multiple layers.

[0094] In this embodiment, the conformal dense layer 45 covers the surface of the buffer base layer 42, including the top and side surfaces of the buffer base layer 42.

[0095] Figure 15 The diagram shown is a structural schematic of a photovoltaic module provided in the fifteenth embodiment of this application. Figure 15 As shown, the difference between the photovoltaic module provided in this embodiment and the photovoltaic module provided in any of the above embodiments is that, with Figure 12Taking the photovoltaic module shown as an example, in this embodiment, there are multiple buffer layers 40, which are stacked sequentially in the direction away from the substrate 10.

[0096] Figure 16 The diagram shown is a structural schematic of a photovoltaic module provided in the sixteenth embodiment of this application. Figure 16 As shown, the photovoltaic module provided in this embodiment differs from those provided in any of the above embodiments in that, in this embodiment, a buffer layer 40 is provided on the side of the substrate 10 away from the photovoltaic functional layer 20, and a buffer layer 40 is also provided between the photovoltaic functional layer 20 and the cover plate 30. When the buffer layer 40 is provided on the side of the substrate 10 away from the photovoltaic functional layer 20, the multiple buffer cavities 41 can buffer rainwater or stones, blocking the direct impact of rainwater or stones and protecting the interior of the photovoltaic module. When the buffer layer 40 is provided between the photovoltaic functional layer 20 and the cover plate 30, the impact force of rainwater or stones acting on the substrate 10 can be transmitted to the photovoltaic functional layer 20, and then to the buffer layer 40, thereby using the multiple buffer cavities 41 to form a buffering effect, preventing the photovoltaic functional layer 20 from directly contacting the cover plate 30, and thus protecting the photovoltaic functional layer 20.

[0097] Since the buffer layer 40 is disposed both inside and outside the module, the buffer cavity 41 should be filled with different gases depending on the location of the buffer layer 40. Similar to the photovoltaic module in Embodiment 1, when the buffer layer 40 is disposed between the photovoltaic functional layer 20 and the cover plate 30, the buffer cavity 41 should be filled with an inert gas to prevent air from entering the photovoltaic functional layer 20 and damaging it. When the buffer layer 40 is disposed on the side of the substrate 10 away from the photovoltaic functional layer 20, the buffer cavity 41 can be filled with air; due to the blocking effect of the substrate 10, there is no need to consider the impact on the photovoltaic functional layer 20. Of course, filling with an inert gas is also acceptable. Compared to filling with an inert gas, filling with air is less expensive.

[0098] In a double-glass module, the buffer layer 40 can be disposed on either the side of the substrate 10 away from the photovoltaic functional layer 20 or on the side of the cover plate 30 away from the photovoltaic functional layer 20. This ensures that the buffer layer 40, regardless of its location, can function as a buffer using the buffer cavity 41. Preferably, the buffer layer 40 is disposed at both locations in the double-glass module, allowing for buffering against rainwater or pebbles regardless of whether the buffer layer 40 is located on the substrate 10 or cover plate 30 side. Of course, to avoid affecting sunlight incidence, all layers of the buffer layer 40, including the buffer base layer 42, the conformal compact layer 45, and the molded top layer 43, should be made of transparent material.

[0099] This application also provides a method for preparing a buffer structure.Figure 17 This is a schematic flowchart illustrating the method for preparing the buffer structure provided in the seventeenth embodiment of this application. Figure 17 As shown, preparation method 1700 includes: Step S1710: A first conformal dense layer is formed on one side of the substrate, and the surface of the first conformal dense layer near the top layer of the molding layer has a first three-dimensional structure.

[0100] In step S1720, a molding top layer is formed on the side of the first conforming dense layer away from the substrate. The molding top layer is parallel to the substrate, and the first three-dimensional structure and the molding top layer enclose multiple buffer cavities.

[0101] Taking the application of buffer structures to photovoltaic modules as an example, for Figure 17 The preparation method shown in 1700 will be explained in detail. Figures 18a-18e Execution provided for the eighteenth embodiment of this application Figure 17 A schematic diagram of the structure of the intermediate product obtained during the preparation method shown.

[0102] First, refer to Figure 18a A photovoltaic functional layer 20 is fabricated on the substrate 10. The fabrication process can be referred to in related technologies, and will not be described in detail in this embodiment.

[0103] It should be noted that this step is optional. When the buffer structure is applied to other scenarios, this step is not required, or when the buffer structure is only fabricated on substrate 10, this step is also not required.

[0104] Secondly, see Figure 18b A buffer base layer 42 is prepared on the side of the photovoltaic functional layer 20 away from the substrate 10.

[0105] The buffer base layer 42 has a second three-dimensional structure D2, which can be formed by processes such as coating, laser, spraying, and lamination. For example, a buffer substrate material layer is prepared on the side of the photovoltaic functional layer 20 away from the substrate 10; then, the buffer substrate material layer is patterned to form a patterned surface, thus obtaining the buffer base layer 42.

[0106] It should be noted that this step is optional. In this embodiment, the buffer base layer 42 is used to form the second three-dimensional structure D2, so that the conformal compact layer 45 subsequently deposited on the buffer base layer 42 can directly replicate the second three-dimensional structure D2, thereby obtaining the first three-dimensional structure D1. In other embodiments, the first three-dimensional structure D1 can be formed directly on the conformal compact layer 45 without the aid of the buffer base layer 42, thus eliminating the need to prepare the buffer base layer 42.

[0107] Next, according to step S1710, refer to Figure 18cA conformal dense layer 45 is prepared on the side of the buffer base layer 42 away from the substrate 10 using atomic layer deposition technology. The conformal dense layer 45 includes a first conformal dense layer 451 covering the second three-dimensional structure D2 and a second conformal dense layer 452 surrounding the photovoltaic functional layer 20. The surface of the first conformal dense layer 451 away from the substrate 10 has a first three-dimensional structure D1, and the patterns of the first three-dimensional structure D1 and the second three-dimensional structure D2 are consistent.

[0108] Then, according to step S1720, refer to Figure 18d A molding top layer 43 is attached to the side of the conformal dense layer 45 away from the substrate 10. The molding top layer 43 is parallel to the substrate 10, and the first three-dimensional structure D1 and the molding top layer 43 enclose multiple buffer cavities 41.

[0109] Finally, see Figure 18e An encapsulation layer 50 is prepared on the side of the buffer layer 40 away from the substrate 10, and a cover plate 30 is attached to the side of the encapsulation layer 50 away from the substrate 10.

[0110] The encapsulation layer 50 includes an adhesive film. In this case, an adhesive film can be attached to the side of the buffer layer 40 away from the substrate 10 using an attachment process.

[0111] According to the preparation method provided in this embodiment, a buffer base layer 42 is first prepared on the outer periphery of the photovoltaic functional layer 20. Multiple protrusions 44 are formed on the surface of the buffer base layer 42 by coating, laser, spraying, or lamination. Then, a conformal dense layer 45 is prepared on the surface of the buffer base layer 42 using atomic layer deposition (ALD). The conformal dense layer 45 includes a first conformal dense layer 451 and a second conformal dense layer 452. The first conformal dense layer 451 is located on the surface of the buffer base layer 42, and the second conformal dense layer 452 is located on the outer periphery of the photovoltaic functional layer 20, thus encapsulating the buffer base layer 42 and the photovoltaic functional layer 20. Next, a molded top layer 43 is applied to the surface of the first conformal dense layer 451, forming a buffer cavity 41 between the buffer base layer 42 and the molded top layer 43. An encapsulation layer 50 is then provided on the surface of the molded top layer 43, and a frame encapsulation adhesive layer is provided on the outer periphery of the second conformal dense layer 452. The dense structure formed by the second conformal dense layer 452 can itself form a good encapsulation effect. Then, through the encapsulation layer 50 and the frame encapsulation adhesive layer, a double-layer encapsulation structure is formed, which further enhances the encapsulation effect.

[0112] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0113] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0114] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," "above," etc., may be used here to describe the spatial positional relationship of a device or feature as shown in the figure with other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figure. For example, if a device in the figure is inverted, a device described as "above" or "above" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below."

[0115] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications or equivalent substitutions made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A buffer structure, characterized in that, include: substrate; A buffer layer is located on one side of the substrate; the buffer layer includes a first conformal dense layer and a top molding layer stacked on one side of the substrate, the surface of the first conformal dense layer near the top molding layer has a first three-dimensional structure, the top molding layer is parallel to the substrate, and the first three-dimensional structure and the top molding layer enclose a plurality of buffer cavities.

2. The buffer structure according to claim 1, characterized in that, The first conformal dense layer is located on the side of the molded top layer closest to the substrate; Preferably, the plurality of buffer cavities are filled with inert gas.

3. The buffer structure according to claim 2, characterized in that, The first three-dimensional structure includes multiple protrusions, which abut against the molded top layer; Preferably, the protrusion includes bumps, and a plurality of the bumps are arranged in an array, the space between two adjacent bumps forming the buffer cavity, and the plurality of buffer cavities are interconnected; or... The protrusions include strip-shaped protrusions, and multiple strip-shaped protrusions are arranged at intervals along a preset direction. The space between two adjacent strip-shaped protrusions constitutes the buffer cavity, and the multiple buffer cavities are not interconnected.

4. The buffer structure according to claim 2, characterized in that, The first three-dimensional structure includes multiple grooves and a connecting portion connecting the multiple grooves, wherein the connecting portion abuts against the molded top layer; Preferably, the grooves form the buffer cavities, and the multiple buffer cavities are not interconnected.

5. The buffer structure according to claim 1, characterized in that, The buffer layer further includes a buffer base layer, which is located on the side of the first molded dense layer away from the top molding layer and is in contact with the first molded dense layer. The surface of the buffer base layer near the first molded dense layer has a second three-dimensional structure, and the pattern of the second three-dimensional structure is consistent with that of the first three-dimensional structure. Preferably, the first conformal dense layer is prepared using atomic layer deposition technology; Preferably, the material of the first conformal dense layer includes any one of oxides, fluorides, and nitrides; Preferably, the material of the buffer base layer includes any one of polyurethane, polyimide, and polymethyl methacrylate; Preferably, there are multiple buffer layers, which are stacked sequentially in a direction away from the substrate.

6. A photovoltaic cell, characterized in that, include: The buffer structure according to any one of claims 1-5; and A photovoltaic functional layer is located between the substrate and the buffer layer, or on the side of the substrate away from the buffer layer.

7. The photovoltaic cell according to claim 6, characterized in that, The photovoltaic functional layer is located between the substrate and the buffer layer; the buffer structure further includes a second conformal compaction layer, which surrounds the photovoltaic functional layer, with one edge of the second conformal compaction layer connected to the first conformal compaction layer and the other edge connected to the substrate; Preferably, the second conformal compact layer and the first conformal compact layer are prepared using the same atomic layer deposition technique.

8. The photovoltaic cell according to claim 6, characterized in that, It also includes the encapsulation layer and cover plate. The buffer layer is located on the side of the photovoltaic functional layer away from the substrate, the encapsulation layer is located on the side of the buffer layer away from the photovoltaic functional layer, and the cover plate is located on the side of the encapsulation layer away from the buffer layer; or... The encapsulation layer is located on the side of the photovoltaic functional layer away from the substrate, the buffer layer is located on the side of the encapsulation layer away from the photovoltaic functional layer, and the cover plate is located on the side of the buffer layer away from the encapsulation layer.

9. A method for preparing a buffer structure, characterized in that, include: A first conformal dense layer is formed on one side of the substrate, and the surface of the first conformal dense layer away from the substrate has a first three-dimensional structure. A molding top layer is formed on the side of the first conformal dense layer away from the substrate. The molding top layer is parallel to the substrate, and the first three-dimensional structure and the molding top layer enclose a plurality of buffer cavities.

10. The preparation method according to claim 9, characterized in that, Before the step of forming a first conformal dense layer on one side of the substrate, the preparation method further includes: A buffer base layer is prepared on one side of the substrate, and the surface of the buffer base layer away from the substrate has a second three-dimensional structure. The step of forming a first conformal dense layer on one side of the substrate includes: The first conformal dense layer is formed on the side of the buffer base layer away from the substrate, and the patterns of the first three-dimensional structure and the second three-dimensional structure are consistent. Preferably, the step of forming the first conformal dense layer on the side of the buffer base layer away from the substrate includes: The first conformal dense layer is prepared on the side of the buffer base layer away from the substrate using atomic layer deposition technology; Preferably, forming a top layer on the side of the first conformal dense layer away from the substrate includes: The molded top layer is attached to the side of the first conforming dense layer away from the substrate; Preferably, prior to the step of preparing the buffer layer on one side of the substrate, the preparation method further includes: A photovoltaic functional layer is formed on one side of the substrate; The step of preparing a buffer base layer on one side of the substrate includes: The buffer base layer is prepared on the side of the photovoltaic functional layer away from the substrate; Preferably, the preparation method further includes: An encapsulation layer is prepared on the side of the molded top layer away from the substrate; A cover plate is attached to the side of the encapsulation layer away from the substrate.

Images