Cooling and refrigerating device for Bonding process intrinsic pressure AA area based on silicon-based OLED (Organic Light Emitting Diode) product

Abstract

The invention discloses a Bonding process intrinsic pressure AA area cooling and refrigerating device based on a silicon-based OLED product, and relates to the field of silicon-based OLEDs, and the device comprises a ballast table which is used for bearing the silicon-based OLED product; the silicon-based OLED product comprises a Si part and a CG part, and the Si part protrudes out of the ballast table; the hot pressing head directly faces the part, protruding out of the ballast table, of the Si part, and a back support is arranged below the hot pressing table; the ballast table is provided with a flip cover structure, and the flip cover structure is connected with a positioning assembly and a double-sided cooling assembly; the hot pressing head and the back support are each provided with an air cooling assembly. The flip cover structure is additionally arranged in the ballast table, and the circulating cooling liquid is additionally arranged in the ballast table and the upper cover plate for refrigeration, so that the temperature of a silicon-based OLED product close to a hot pressing head is greatly reduced, and the failure risk of an organic light-emitting material in an AA area of the product is greatly reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon-based OLED, and particularly relates to a Bonding process AA area cooling and refrigeration device based on a silicon-based OLED product. BACKGROUND

[0002] The silicon-based OLED Bonding process is to bond Si and CG together through ACF glue under high temperature and high pressure conditions, so as to realize the function of electric signal conduction. The specific process is that the silicon-based OLED product is loaded to the Bonding position (as shown in the drawing), a pressure head with a higher temperature moves downward to tightly press the product, DDIC and FPC together, and needs to keep this state for a certain time. However, in this process, because the product is a silicon-based material with high thermal conductivity, the heat of the pressure head is quickly transferred to the AA area of the product, resulting in performance failure of the organic light-emitting material of the product. Figure 1

[0003] In the prior art, Chinese patent publication No. CN107148173A discloses a device for bonding integrated circuits on a display panel. And specifically discloses the following features: a support platform arranged on the array substrate side of the display panel and used for supporting the display panel; a heating platform arranged on the array substrate side of the display panel and used for supporting and heating the bonding area of the array substrate; a lifting pressure head arranged on the side of the array substrate away from the heating platform and used for bonding the integrated circuits on the bonding area in cooperation with the heating platform; a fluid pipe arranged inside the support platform and capable of cooling the display panel, and a cooling body arranged in the fluid pipe, the device further comprising a cooling device arranged on the same side of the display panel as the lifting pressure head and internally arranged with the cooling body, the cooling device sprays the cooling body in the area between the display area and the bonding area of the display panel. After analysis, the above-mentioned prior art realizes the cooling function in the hot pressing process, but when it acts, the cooling device is single-sided cooling, and the acting position is the area between the display and the bonding area. The problem of excessively high temperature of the display panel itself is not solved, which easily leads to performance failure of the organic light-emitting material of the product. Based on this, the application designs a Bonding process AA area cooling and refrigeration device based on a silicon-based OLED product SUMMARY The purpose of the application is to solve the problems in the prior art, and a Bonding process AA area cooling and refrigeration device based on a silicon-based OLED product is proposed.

[0004] A Bonding process AA area cooling and refrigeration device based on a silicon-based OLED product, comprising: A ballast table for supporting a silicon-based OLED product; ​The silicon-based OLED product comprises: An Si part and a CG part, wherein the Si part protrudes from the ballast table; A hot pressing head opposite to the part of the Si part protruding from the ballast table, and a back support arranged below the hot pressing table; The ballast table is provided with a flip cover structure, and the flip cover structure is respectively connected with a positioning assembly and a double-sided cooling assembly; The hot pressing head and the back support are respectively provided with a set of air cooling assemblies.

[0005] In the above cooling device for the silicon-based OLED product Bonding process in the AA area, the flip cover structure comprises a rotating shaft connected to the side of the ballast table, and the other side of the rotating shaft is connected with an upper cover plate, the upper cover plate is rotatably connected with the ballast table through the rotating shaft, the positioning assembly is arranged on the upper cover plate, and the rotating shaft is connected to a servo motor.

[0006] In the above cooling device for the silicon-based OLED product Bonding process in the AA area, the positioning assembly comprises a limiting groove opened in the upper cover plate, and the side of the limiting groove is provided with a buffer area, the buffer area adopts an arc structure and extends to the limiting groove.

[0007] In the above cooling device for the silicon-based OLED product Bonding process in the AA area, the side of the rotating shaft is provided with a limiting block, the limiting block is made of an elastic material and has a height lower than that of the silicon-based OLED product.

[0008] In the above cooling device for the silicon-based OLED product Bonding process in the AA area, the double-sided cooling assembly comprises two sets of cooling parts opened in the ballast table and the upper cover plate, each set of the cooling parts comprises a sealing pipe, and two sets of the sealing pipes are respectively embedded in the interior of the ballast table and the upper cover plate, the two ends of the sealing pipe are respectively connected with an inlet and an outlet, and the inlet and the outlet are respectively connected to the two side end faces of the ballast table and the upper cover plate.

[0009] In the above cooling device for the silicon-based OLED product Bonding process in the AA area, the sealing pipe adopts a zigzag "S" shape structure, and the sealing pipe is arranged as a cooling area along the rectangular part of the outline of the arrangement area.

[0010] In the above-mentioned pressure AA area cooling and refrigeration device based on the silicon-based OLED product Bonding process, the number of each group of the sealed pipes is at least two, and at least one is close to the silicon-based OLED product and one is away from the silicon-based OLED product, wherein the cooling area of the sealed pipe close to the silicon-based OLED product is smaller than that away from the silicon-based OLED product, and the liquid inlets of the two cooling areas of the sealed pipes are located on different sides, respectively.

[0011] In the above-mentioned pressure AA area cooling and refrigeration device based on the silicon-based OLED product Bonding process, the air-cooled assembly comprises two refrigeration gas pipes, and each of the two refrigeration gas pipes is provided with a plurality of gas outlets, the directions of the air outlets are inclined and away from one side of the ballast table, and the gas output by the refrigeration gas pipe can be selected from compressed air or N2, and the temperature is set to 25℃ or below.

[0012] The beneficial effects of the present application are: the present application increases the flip cover structure in the ballast table, and increases the circulating cooling liquid refrigeration in the ballast table and the upper cover plate, and sets two groups of cooling areas, through the design of the liquid inlet and the liquid outlet, the cooling speed is gradually reduced along the AA area outward to the greatest extent, which is effectively matched with the heat radiation direction, so as to ensure that the cooling speed of the product meets the requirements, thereby greatly reducing the temperature of the silicon-based OLED product near the hot head, and greatly reducing the failure risk of the organic light-emitting material in the AA area of the product. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a schematic diagram of the silicon-based OLED product Bonding process.

[0014] Figure 2 It is a structure schematic diagram of a pressure AA area cooling and refrigeration device based on the silicon-based OLED product Bonding process provided by the present application Figure 3 It is a side view of a pressure AA area cooling and refrigeration device based on the silicon-based OLED product Bonding process provided by the present application.

[0015] Figure 4 It is a structure schematic diagram of a double-sided cooling assembly in a pressure AA area cooling and refrigeration device based on the silicon-based OLED product Bonding process provided by the present application.

[0016] Figure 5 It is a comparison diagram of the present application and the prior art.

[0017] In the figure: 1 silicon-based OLED product, 101 Si part, 102 CG part, 2 ballast table, 3 hot press head, 4 back support, 5 flip cover structure, 51 rotating shaft, 52 upper cover plate, 53 limit block, 6 positioning assembly, 61 limit groove, 62 buffer zone, 7 double-sided cooling assembly, 71 sealing pipeline, 72 liquid inlet, 73 liquid outlet DETAILED DESCRIPTION In order to facilitate the understanding of the present application, in order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below. In the following description, a lot of specific details are set forth in order to facilitate a full understanding of the present application, and the preferred embodiments of the present application are given in the accompanying drawings. However, the present application can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. The present application can be implemented in many different ways from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, therefore the present application is not limited to the specific embodiments disclosed below. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited. In the description of the present application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise specifically limited. It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only embodiments. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art to which the present application belongs. The terms used herein are only for the description of the specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0018] REFERENCE Figures 1-5 A silicon-based OLED product Bonding process-based cooling device for reducing AA area, comprising a ballast table 2, the ballast table 1 is used to support the silicon-based OLED product 1, wherein the silicon-based OLED product 1 comprises a Si part 101 and a CG part 102, respectively, the Si part 101 protrudes from the ballast table 2; The hot pressing head 3 protrudes from the part of the ballast table 2 opposite the Si part 101 and performs hot pressing on the Si part 101, and the Si part 101 is supported by the back support 4; The ballast table 2 is further provided with a flip structure 5, which includes a rotating shaft 51 connected to the side of the ballast table 2, and the other side of the rotating shaft 51 is connected with an upper cover plate 52, which is rotatably connected with the ballast table 2 through the rotating shaft 51, and a positioning assembly 6 is arranged on the upper cover plate 52, the rotating shaft 51 is connected to a servo motor, and the side of the rotating shaft 51 is provided with a limiting block 53 made of elastic material and having a height lower than that of the silicon-based OLED product, and the flip structure 5 is connected with the positioning assembly 6 and the double-sided cooling assembly 7 respectively; The positioning assembly 6 includes a limiting groove 61 opened on the upper cover plate 52, and the side of the limiting groove 61 is provided with a buffer area 62, which has an arc structure and extends to the limiting groove 61, and is used for assisting the limiting groove 61 to position the product and providing a buffer area.

[0019] The double-sided cooling assembly 7 includes two groups of cooling parts opened on the ballast table 2 and the upper cover plate 52, each group of cooling parts includes a sealing pipe 71, and the two groups of sealing pipes 71 are embedded in the interiors of the ballast table 2 and the upper cover plate 52 respectively, the two ends of the sealing pipe 71 are connected with a liquid inlet 72 and a liquid outlet 73 respectively, the liquid inlet 72 and the liquid outlet 73 are connected to the two side end faces of the ballast table 2 and the upper cover plate 52 respectively, the sealing pipe 71 has a zigzag "S" shape structure, the cooling area of the sealing pipe 71 is arranged along the rectangular part of the contour of the area where it is arranged, the number of each group of sealing pipes 71 is at least two, and at least one is close to the silicon-based OLED product 1 and one is away from the silicon-based OLED product 1, the cooling area of the sealing pipe 71 close to the silicon-based OLED product 1 is smaller than that away from the silicon-based OLED product 1, and the liquid inlets 72 of the two cooling areas of the sealing pipe 71 are located on different sides, which has the advantage that the temperatures of the two liquid inlets 72 are lower than that of the liquid outlet 72, and the temperature of each side depends on the superposition of the two cooling areas, and the setting of one side with one liquid inlet 72 and one liquid outlet 72 can maximize the temperature of the two sides, and at the same time, the length of the sealing pipe 71 in the cooling area close to the AA area is lower, which has the characteristics of smaller cooling range and faster cooling speed, and the length of the sealing pipe 71 in the cooling area away from the AA area is higher, which has the characteristics of larger cooling range and slower cooling speed, so that when the two cooling areas are superposed, the cooling speed can be gradually reduced along the AA area to the outside to the greatest extent, which effectively matches the direction of heat radiation, thereby ensuring that the cooling speed of the product meets the requirements.

[0020] The hot press head 3 and the back support 4 are each equipped with a set of air-cooling components 8. The air-cooling components 8 include two cooling air pipes 81. Each of the two cooling air pipes 81 has multiple air outlets. The air outlets are tilted and located away from the ballast platform 2. The gas output from the cooling air pipes 81 can be compressed air or N2, and the temperature is set below 25°C.

[0021] The main difference between this invention and the prior art is that: 1. Add a refrigerant pipe 81, and simultaneously fabricate equally spaced cooling air outlets on one side of the refrigerant pipe 81, such as... Figure 3 As shown, the cooling gas type can be compressed air or N2, which are harmless to the environment or human body. The cooling air temperature should be below 25℃ for the best cooling effect. The cooling air pipe 81 is installed at two positions above and below the product bonding position, with the air outlet away from the silicon-based OLED product 1. After adding this device, the heat radiated from the high-temperature hot pressure head 3 and Back Up towards the product can be driven away in the opposite direction, thereby preventing the temperature of the product AA area from being too high. 2. This ballast platform 2 is equipped with a flip-top structure, and circulating cooling systems are installed on both the flip-top structure 5 and the ballast platform 2. A sealed pipe 71 is machined inside the ballast platform 2, and circulating coolant is circulated inside the sealed pipe 71. Figure 4 As shown, the coolant temperature can be controlled between 0 and 25°C. The shorter total stroke of the sealed pipe 71 near the hot press head 3 ensures high-efficiency coolant circulation. Filter valves are installed at the inlet 72 and outlet 73 to prevent blockage of the sealed pipe 71, which would cause the cooling effect to fail. A flip-top structure 5 is added, and a coolant circulation design is also added to the upper cover plate 52. The upper cover plate 52 is grooved for different product sizes, forming a limiting groove 61. The limiting groove 61 and the limiting block 53 together restrict the rotation of the upper cover plate 52. After the upper cover plate 52 rotates to a horizontal position, it mates with the ballast platform 2, which is exactly the same thickness as the product. In this way, the upper cover plate 52 contacts the CG surface of the product, and the product is sandwiched between the upper cover plate 52 and the ballast platform 2. The lower temperature of the upper cover plate 52 and the ballast platform 2 absorbs the heat conducted by the hot press head 3, preventing the temperature of the product's AA area from becoming too high.

[0022] A comparative experiment on cooling performance was conducted between this invention and a structure without an additional top cover, as shown in the following figures. Figure 5 As shown in the figure, the two experiments tested the temperature of the product 1.5mm away from the pressure head under Bonding pressure process conditions of 130℃, 140℃, and 150℃, respectively. The test results are as follows. Figure 5 As shown, the cooling effect of adding the flip cover structure 5 and the double-sided cooling component 7 is about 8°C compared to the unadded one.

[0023] It is apparent that the application can be carried out by other embodiments that do not depart from the spirit or essential characteristics thereof. Thus, the embodiments disclosed in this specification are to be considered in all respects as illustrative and not restrictive, and all changes coming within the meaning and equivalency range of the application are intended to be embraced therein.

Claims

1. A cooling device for the AA region of the bonding process in silicon-based OLED products, characterized in that, include: Ballast stage (2), the ballast stage (1) is used to support silicon-based OLED products (1). The silicon-based OLED products (1) include: Si portion (101) and CG portion (102), wherein the Si portion (101) protrudes from the ballast stage (2). Hot press head (3), the hot press head (3) is directly opposite the part of the Si part (101) that protrudes from the ballast stage (2), and is used to bond DDIC and FPC to the Si part (101) under high temperature and high pressure conditions with ACF glue. A back support (4) is provided below the hot press stage (3). The ballast platform (2) is provided with a flip-top structure (5), which is connected to a positioning component (6) and a double-sided cooling component (7). The flip-top structure (5) acts on the CG part (102) in the OLED product (1). The hot press head (3) and the back support (4) are each provided with a set of air-cooling components (8).

2. The cooling and refrigeration device for the AA region of the bonding process in silicon-based OLED products according to claim 1, characterized in that, The flip-top structure includes a rotating shaft (51), which is connected to the side of the ballast platform (2). The other side of the rotating shaft (51) is connected to an upper cover plate (52). The upper cover plate (52) is rotatably connected to the ballast platform (2) through the rotating shaft (51). The positioning component (6) is set on the upper cover plate (52). The rotating shaft (51) is connected to a servo motor.

3. The cooling and refrigeration device for the AA region of the bonding process in silicon-based OLED products according to claim 1, characterized in that, The positioning component (6) includes a limiting groove (61) formed on the upper cover plate (52), and a buffer zone (62) is provided on the side of the limiting groove (61). The buffer zone (62) adopts an arc-shaped structure and extends to the limiting groove (61).

4. The cooling and refrigeration device for the AA region of the bonding process in silicon-based OLED products according to claim 2, characterized in that, The side of the rotating shaft (51) is provided with a limiting block (53), which is made of elastic material and is lower than the height of the silicon-based OLED product.

5. The AA-zone cooling and refrigeration device based on the bonding process of silicon-based OLED products according to claim 2, characterized in that, The double-sided cooling assembly (7) includes two sets of cooling sections opened on the ballast platform (2) and the upper cover plate (52). Each set of cooling sections includes a sealed pipe (71). The two sets of sealed pipes (71) are respectively embedded in the ballast platform (2) and the upper cover plate (52). The two ends of the sealed pipe (71) are respectively connected to the liquid inlet (72) and the liquid outlet (73). The liquid inlet (72) and the liquid outlet (73) are respectively connected to the two side end faces of the ballast platform (2) and the upper cover plate (52).

6. The cooling and refrigeration device for the AA region of the bonding process in silicon-based OLED products according to claim 5, characterized in that, The sealing pipe (71) adopts a zigzag "S" shaped structure, and the rectangular portion of the sealing pipe (71) along its setting area outline is set as a cooling area.

7. The cooling and refrigeration device for the AA region of the bonding process in silicon-based OLED products according to claim 6, characterized in that, The number of each set of sealed pipes (71) is at least two, and includes at least one near the silicon-based OLED product (1) and one away from the silicon-based OLED product (1), wherein the cooling area of ​​the sealed pipe (71) near the silicon-based OLED product (1) is smaller than that of the sealed pipe (71) away from the silicon-based OLED product (1), and the liquid inlets (72) of the two sealed pipes (71) in the cooling areas are located on different sides.

8. The AA-zone cooling and refrigeration device based on the bonding process of silicon-based OLED products according to claim 1, characterized in that, The air-cooled assembly (8) includes two cooling pipes (81), each of which has multiple air outlets. The air outlets are tilted and located away from the ballast platform (2). The gas output from the cooling pipes (81) can be compressed air or N2, and the temperature is set below 25°C.

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