Wafer supporting structure and wafer cleaning device

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a wafer supporting structure and a wafer cleaning device.The wafer supporting structure comprises a supporting foundation frame and a direction adjusting unit. The supporting base frame is provided with a single set of supporting pieces to jointly support a wafer by means of a plurality of mounting seats arranged according to the shape of the wafer. Each single-group supporting piece consists of a supporting main cylinder, an assembling part and a driving part, the driving part is arranged at the bottom of the supporting main cylinder, the assembling part is arranged at the top of the supporting main cylinder, a supporting frame is arranged on the assembling part, a telescopic supporting cylinder body is arranged in the supporting main cylinder, and a clamping piece group for fixing the edge of a wafer is arranged at the top of the supporting cylinder body. The direction adjusting unit is arranged on the periphery of the supporting foundation frame, and a single set of supporting pieces can be selectively separated from the mounting base. The driving part drives the supporting barrel to drive the clamping piece set to loosen the edge of the wafer, meanwhile, the direction adjusting unit enables the single-set supporting piece to be separated from the mounting base, and the fixed point area of the edge of the wafer is exposed. The wafer edge cleaning device solves the problems of mechanical shielding and cleaning blind areas existing in traditional wafer edge cleaning, and is suitable for various wafers.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, specifically a wafer support structure and a wafer cleaning apparatus. Background Technology

[0002] In precision manufacturing fields such as semiconductors and sensors, wafer edge cleaning is a critical process affecting product yield. However, with the widespread adoption of novel devices such as irregularly shaped sensors and microelectromechanical systems (MEMS), the application ratio of square, rectangular, and polygonal wafers has significantly increased. Existing technologies have revealed certain shortcomings in such scenarios.

[0003] In wafer manufacturing, edge cleaning is a critical step in ensuring surface cleanliness. Traditional support structures often use ring-shaped fixing frames, which are only suitable for round wafers and cannot meet the edge fixing requirements of square or irregular wafers. Furthermore, when performing local cleaning under overall fixing conditions, blind spots are prone to appearing. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer support structure and a wafer cleaning apparatus to solve the problems mentioned in the background art.

[0005] A wafer support structure includes a support base frame and an orientation adjustment unit; The support base frame is used to support multiple single support components through several mounting seats. The arrangement of the mounting seats is designed according to the shape of the wafer. Each mounting seat is equipped with the single support component to form a common support for the wafer. The orientation adjustment unit is located on the periphery of the support base frame and is used to selectively separate the single support member from the corresponding mounting base by means of a pushing component and a clamping component. The single support component includes a main support cylinder, an assembly part, and a drive part. The drive part is located at the bottom of the main support cylinder, and the assembly part is located at the top. A support frame is provided on the assembly part. A retractable support cylinder is installed inside the main support cylinder. The support frame is used to support the support cylinder. A clamping set is installed on the top of the support cylinder. The clamping set is used to fix the wafer edge. During the cleaning of the wafer edge, the drive unit drives the support cylinder to move, thereby causing the clamping assembly to loosen the wafer edge. At the same time, the orientation adjustment unit separates the single support assembly from the mounting base, thereby exposing the fixed point area of ​​the wafer edge for cleaning.

[0006] As a further embodiment of the present invention: the mounting base includes a base body, a back fastener disposed on the back side of the base body, and a mounting block assembly disposed on the front side of the base body; The mounting block assembly consists of two blocks, an upper block and a lower block. The upper block has an upper locking block and forms an upper mounting groove with the upper locking block. The lower block has a lower supporting block and forms a lower mounting groove with the lower supporting block. The assembly part is fitted into the slot of the upper mounting groove, and the drive part and the support main cylinder are inserted into the lower mounting groove.

[0007] As a further aspect of the present invention: the support frame includes a support frame installed in the frame of the assembly part, support side plates disposed on both sides of the support frame, and a limiting plate installed between the slot brackets. The limiting plate has a plate structure and its two ends are installed in the slot of the slot bracket by a combination of protrusions. The limiting plate is provided with a guide hole, and the cylinder of the supporting cylinder passes through the guide hole.

[0008] As a further aspect of the present invention: a support plate is provided on the upper surface of the support frame, and a buffer spring is provided between the support plate and the limiting plate.

[0009] As a further aspect of the present invention: the supporting cylinder includes an outer support cylinder and an inner support rod, wherein the inner support rod passes through the centerline of the outer support cylinder; The outer support cylinder has a hollow structure and a support section is provided at the top of the outer support cylinder; The clamping plate assembly includes a support base plate and a pressing plate. The support base plate has a through hole in the midpoint area. The support base plate is sleeved around the support section through the through hole, and the bottom of the support base plate is supported and installed on the cylinder of the outer support tube by a support spring. The pressing plate is fixed to the top of the inner support rod. A clamping area is formed between the pressing sheet and the support substrate to hold the edge of the wafer.

[0010] As a further aspect of the present invention: an internal thread drive cylinder is provided at the bottom of the outer support cylinder, the bottom of the internal thread drive cylinder is located inside the drive part, and a first driver is provided inside the drive part to pull the internal thread drive cylinder up and down. The bottom end of the inner support rod extends from the inside of the internal thread drive cylinder and is equipped with a pusher bolt. The drive unit is provided with a second driver to push it up and down.

[0011] As a further aspect of the present invention: the orientation adjustment unit includes an adjustment base and a guide rail frame mounted on the adjustment base; The pushing assembly includes a pushing seat and a sliding seat mounted on the pushing seat. The sliding seat is slidably mounted on the guide rail of the guide rail frame via a slider. The push base is provided with a mounting bracket, the mounting bracket is provided with a push rod and a pusher, the clamping assembly is installed on the rod end of the push rod, and the pushing end of the pusher is connected to the clamping assembly.

[0012] As a further embodiment of the present invention: the clamping assembly includes a clamping seat, a support arm mounted on the clamping seat, and a jaw assembly mounted on the support arm, wherein the jaws of the jaw assembly are arranged vertically. One of the grippers is equipped with a trigger probe, and the housing of the main support cylinder is equipped with a trigger interface that is connected to the trigger probe. The trigger interface is equipped with a signal trigger, and the signal trigger is electrically connected to the control terminal inside the drive unit.

[0013] The present invention also discloses a wafer cleaning apparatus, including a cleaning chamber and the aforementioned wafer support structure; A cleaning platform is provided at the bottom of the cleaning chamber, and the support base frame and the orientation adjustment unit are both mounted on the cleaning chamber. The cleaning chamber is also equipped with a hoisting cleaning frame, on which a lifting adjustment frame is installed. A direction adjustment frame and a fixed-point cleaning spray gun are hoisted on the lifting adjustment frame.

[0014] Compared with the prior art, the beneficial effects of the present invention are: I. Design of a detachable modular support architecture. This structure uses a base frame as its core and houses multiple independent support units. Each unit includes a clamping assembly, a support cylinder, and a drive unit. The clamping assembly physically grips the wafer, simultaneously triggering electronic signal contacts to drive the release of the wafer edge fixing points. The entire support unit is then temporarily moved away from the base frame, fully exposing the previously obscured wafer edge area. This design achieves dynamic exposure of local fixing points while maintaining the stability of the main wafer body. It is suitable not only for standard circular wafers but also for rectangular, polygonal, and even wafers with specific irregular contours.

[0015] 2. The support cylinder adopts a composite structure with an outer cylinder and an inner rod nested coaxially, equipped with independent threaded drive mechanism and direct push drive mechanism: the threaded drive controls the lifting and lowering of the outer cylinder, and the direct push drive drives the inner rod to move in the opposite direction. The two work together to cause the upper pressure plate and lower support plate of the clamping plate assembly to produce reverse displacement, forming a smooth opening and closing action. Combined with the elastic deformation absorption mechanism of the buffer spring, the wafer stress impact during clamping and release is completely eliminated.

[0016] III. Constructing a spatial collaborative cleaning system, the cleaning device integrates a dynamic support system and a multi-degree-of-freedom spraying unit: the top hoisting frame is equipped with a lifting and universal adjustment mechanism to drive the cleaning spray gun to track the exposed wafer area in real time. Overall, it solves the problems of mechanical obstruction and cleaning blind spots in traditional wafer edge cleaning.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments.

[0019] Figure 1 This is a schematic diagram of the overall structure of the wafer support structure provided in an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the layout of the wafer support structure and wafer cleaning device provided in an embodiment of the present invention.

[0021] Figure 3 A schematic diagram of the structure of the mounting base provided in the embodiment of the present invention. Figure 1 .

[0022] Figure 4 A schematic diagram of the structure of the mounting base provided in the embodiment of the present invention. Figure 2 .

[0023] Figure 5 This is a structural schematic diagram of a single support member provided in an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the structure of the support cylinder provided in an embodiment of the present invention.

[0025] Figure 7 This is a schematic diagram of the clip assembly provided in an embodiment of the present invention.

[0026] Figure 8 This is a schematic diagram of the structure of the pushing component provided in an embodiment of the present invention.

[0027] Figure 9 For the present invention Figure 8 Enlarged view of the structure of region A in the middle.

[0028] In the diagram: 1. Support base frame; 2. Single support component; 3. Support frame; 4. Support cylinder; 5. Clamping plate assembly; 6. Orientation adjustment unit; 7. Pushing assembly; 8. Clamping assembly; 9. Cleaning chamber; 11. Mounting base; 13. Base body; 14. Back fastener; 15. Mounting block assembly; 16. Upper clamping block; 17. Lower support block; 18. Upper mounting slot; 19. Lower mounting slot; 21. Support main cylinder; 22. Assembly unit; 23. Drive unit; 31. Support frame; 32. Slot bracket; 33. Support side plate; 34. Limiting plate; 35. Guide hole; 36. Support plate; 37. Buffer spring; 41. Outer support cylinder; 42. 43. Support section; 44. Inner support rod; 45. Support spring; 46. Internal threaded drive cylinder; 47. Extension bottom section; 58. Push bolt; 59. Support base plate; 50. Pressing plate; 51. Through hole; 62. Adjusting base; 73. Guide rail frame; 74. Push seat; 75. Sliding seat; 76. Slider; 77. Mounting bracket; 88. Pusher; 89. Push rod; 80. Clamping seat; 81. Support arm; 82. Clamping jaw assembly; 83. Trigger probe; 84. Trigger interface; 85. Signal trigger; 96. Cleaning platform; 97. Hoisting cleaning frame; 98. Lifting adjustment frame; 99. Direction adjustment frame; 90. Fixed-point cleaning spray gun. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, examples of which are illustrated in the drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or identical elements.

[0030] Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0032] Example 1, please refer to Figure 1 , Figure 2 and Figure 5 A wafer support structure is provided, including a support base frame 1, an orientation adjustment unit 6, and multiple single support components 2 disposed on the support base frame 1. The support base frame 1 serves as the load-bearing foundation of the overall structure, and is provided with several mounting seats 11. Crucially, the arrangement of the mounting seats 11 is not fixed, but is specifically designed according to the shape of the supported wafer (such as conventional circular, square, or other irregular shapes), thereby achieving adaptation to wafers with different profiles.

[0033] Each mounting base 11 is independently equipped with a single support unit 2. All single support units 2 work together to form an effective and stable support for the wafer. The single support unit 2 includes a support main cylinder 21, an assembly part 22, and a drive part 23. The support main cylinder 21 constitutes the core frame of the assembly. The drive part 23 is fixedly installed at its bottom, and the assembly part 22 is installed at its top. A support frame 3 is connected to the assembly part 22. A telescopic support cylinder 4 is installed inside the support main cylinder 21. The support cylinder 4 is guided by a mechanism inside the support main cylinder 21 and can move up and down axially. The support frame 3 not only provides support but also restricts the movement trajectory of the support cylinder 4 to ensure its stable extension and retraction. Finally, a clamping plate assembly 5 is installed at the top of the support cylinder 4. The clamping plate assembly 5 is an actuator that directly contacts and fixes the edge of the wafer. Its design can reliably clamp the wafer and minimize contact stress to avoid damaging the wafer.

[0034] The single support unit 2 and the mounting base 11 adopt a modular installation structure, which can be quickly separated when needed. An orientation adjustment unit 6 is installed around the periphery of the support base frame 1. The orientation adjustment unit 6 typically includes a moving track, a rotating platform, or a robotic arm, enabling it and the components mounted on it to be precisely positioned around the support base frame 1. A pushing component 7 is installed on the orientation adjustment unit 6, and a clamping component 8 is provided at the drive end of the pushing component 7. The function of the orientation adjustment unit 6 is to move to the position of the target single support unit 2 in three-dimensional space. Then, the pushing component 7 drives the clamping component 8 to move towards the designated single support unit 2, and the clamping component 8 performs a clamping action, firmly grasping the single support unit 2, thus achieving separation from the corresponding mounting base 11.

[0035] In the initial fixed state, all individual support components 2 are securely assembled and installed with their corresponding mounting bases 11 through the structure at their bottom. The drive unit 23 is in the initial position, driving the support cylinder 4 to rise to the highest point or working position. The clamping plate group 5 is driven by the top of the support cylinder 4 to firmly clamp the edge area of ​​the wafer, forming several fixed support points.

[0036] According to the cleaning requirements (e.g., sequentially cleaning area by area), the system controls the orientation adjustment unit 6 to start. The orientation adjustment unit 6, according to instructions, drives its pushing component 7 and clamping component 8 to precisely move to the vicinity of the single support 2 corresponding to the target cleaning position. The pushing component 7 drives the clamping component 8 to move towards the target single support 2, and the clamping component 8 clamps the single support 2. Subsequently, the pushing component 7 continues to apply force, successfully separating the single support 2 from its mounting base 11 below. At this point, the single support 2 at that point is removed from its original support position. Simultaneously with (or slightly before) the removal or at least the movement of the single support 2 from its supported state, its built-in drive unit 23 is activated. The drive unit 23 drives the support cylinder 4 to retract inward relative to the main support cylinder 21. The downward movement of the support cylinder 4 causes the clamping tabs 5 at its top to move downward synchronously. The clamping tabs of the clamping tabs 5, which originally clamped the wafer edge, are no longer attached and fixed to the edge area of ​​the wafer at that point. This completely exposes the wafer edge area that was originally blocked by the clip assembly 5. The cleaning device can then perform a comprehensive and unobstructed cleaning process on the exposed wafer edge area (i.e., the fixing point area) to thoroughly remove the deposits.

[0037] After the area is cleaned, the drive unit 23 restarts, driving the support cylinder 4 to rise to the working position, so that the clamping assembly 5 reaches the height where it can clamp the wafer edge again. The orientation adjustment unit 6, through the cooperation of the pushing component 7 and the clamping component 8, precisely places the removed single support assemblies 2 back and reassembles them onto their corresponding mounting bases 11. During the resetting process, the clamping assembly 5 re-clamps the wafer edge at that point. The above steps are repeated, causing the orientation adjustment unit 6 to move sequentially to the position of the single support assemblies 2 at the next target fixing point, repeating the separation, clamping point release, cleaning of exposed areas, and resetting processes until all fixing point areas are cleaned.

[0038] This embodiment decomposes the wafer support into several discrete points. During cleaning, only the support point corresponding to the target cleaning area needs to be actively released, while the support points in other areas remain fixed. This ensures both the maintenance of the overall wafer stability and the complete exposure of the local areas to be cleaned. This allows all the clamping assemblies 5 of the individual support members 2 to ultimately surround the wafer's edge at various key points or evenly distributed points, ensuring reasonable support and full coverage of the cleaning points. This method is not only applicable to standard circular wafers but also to rectangular, polygonal, and even wafers with specific irregular contours.

[0039] It enables precise and automated execution of actions such as fixed-point positioning, clamping, separation, removal, and resetting, reducing manual intervention, lowering operational difficulty, and improving cleaning efficiency.

[0040] Example 2, please refer to Figure 1 , Figure 3 and Figure 4 This embodiment further optimizes the configuration of the mounting base 11 and the support frame 3 based on the first embodiment.

[0041] The mounting base 11 includes a base body 13, a back fastener 14 fixed to the back of the base body 13, and a mounting block assembly 15 disposed on the front of the base body 13. The mounting block assembly 15 is divided into two independent components, upper and lower. The upper block has an upper locking block 16 that cooperates with the base body 13 to form an upper mounting groove 18, and the lower block has a lower support block 17 that cooperates with the base body 13 to form a lower mounting groove 19. The assembly part 22 of the single support member 2 is embedded in the groove of the upper mounting groove 18 to achieve lateral positioning, while the drive part 23 and the support main cylinder 21 are inserted into the lower mounting groove 19 to obtain vertical support. The support frame 3 consists of a support frame 31, support side plates 33, a limiting plate 34, and a support plate 36. The support frame 31 is installed in the frame of the assembly part 22. The support side plates 33 are respectively located on both sides of the support frame 31. The slot bracket 32 ​​is fixed to the support side plates 33. The limiting plate 34 is fitted into the slot of the slot bracket 32 ​​through the protrusions at both ends. The limiting plate 34 has a guide hole 35 in the center for the cylinder of the support cylinder 4 to pass through. The support plate 36 is provided on the top of the support frame 31. A buffer spring 37 is installed between the support plate 36 and the limiting plate 34 to absorb the impact of movement.

[0042] When performing wafer edge cleaning, the orientation adjustment unit 6 drives the push component 7 to move to the target single support 2 position. After the clamping component 8 clamps the support main cylinder 21, the push component 7 pulls the single support 2, causing the assembly part 22 to disengage from the upper mounting slot 18 and the drive part 23 to disengage from the lower mounting slot 19, thus separating it from the mounting base 11. At the same time, the drive part 23 drives the support cylinder 4 to retract downward along the guide hole 35 of the limiting plate 34, causing the clamping plate group 5 to loosen the wafer edge, exposing the original fixed point area for the cleaning device to work on. After cleaning, the drive part 23 drives the support cylinder 4 to rise to the working position, causing the clamping plate group 5 to re-clamp the wafer edge. The orientation adjustment unit 6 then pushes the single support 2 back to its original position, so that the assembly part 22 and the drive part 23 are re-embedded into the upper mounting slot 18 and the lower mounting slot 19 respectively to complete the reset. The above separation-cleaning-reset operation is repeated for each single support 2 in sequence until the entire wafer edge cleaning is completed.

[0043] This structure achieves bidirectional constraint on a single support member 2 through the layered slot design of the mounting block assembly 15: the upper mounting slot 18 restricts horizontal freedom through a locking block structure, while the lower mounting slot 19 bears vertical load through a supporting block structure, ensuring both installation stability and smooth disassembly and assembly; the guide hole 35 of the limiting plate 34 provides a precise axial movement trajectory for the support cylinder 4, and the elastic deformation of the buffer spring 37 absorbs the impact of expansion and contraction, preventing the wafer from being subjected to instantaneous stress; the modular limiting mechanism formed by the support side plate 33 and the slot bracket 32 ​​allows the limiting plate 34 to be quickly disassembled and maintained; the back fastener 14 achieves a rigid connection between the mounting base 11 and the support base frame 1, while the split mounting block assembly 15 design allows a single support member 2 to be positioned through pure mechanical interlocking, meeting the high-efficiency disassembly and assembly requirements of automated production lines.

[0044] Example 3, please refer to Figure 1 , Figure 6 and Figure 7 In this embodiment, the structure of the support cylinder 4 and the clamping plate group 5 is optimized based on the above.

[0045] The support cylinder 4 includes a coaxially nested outer support cylinder 41 and an inner support rod 43. The outer support cylinder 41 has a hollow structure with a support section 42 extending from its top and an internally threaded drive cylinder 45 fixed to its bottom. The inner support rod 43 passes through the center of the outer support cylinder 41, with a pressing plate 52 fixed at its top and a pusher 47 extending from its bottom and connecting to the extended bottom section 46. The clamping plate assembly 5 consists of a support bottom plate 51 and a pressing plate 52. The support bottom plate 51 has a through hole 53 in its center and is fitted around the support section 42. Its bottom is elastically supported at the top of the outer support cylinder 41 by a support spring 44. The pressing plate 52 is fixed to the top of the inner support rod 43, forming a clamping area for clamping the edge of the wafer with the support bottom plate 51. The drive unit 23 is equipped with independent dual drives: the first drive drives the internally threaded drive cylinder 45 to move up and down through threaded engagement, thereby driving the outer support cylinder 41 to move; the second drive directly pushes the extended bottom section 46 to move the inner support rod 43 up and down.

[0046] With the wafer fixed in place, the support plate 51 and the clamping plate 52 close to clamp the wafer edge. When cleaning the target area: First, the first driver of the drive unit 23 starts, driving the internal thread drive cylinder 45 to lower the outer support cylinder 41 as a whole, causing the support plate 51 to move downwards synchronously; simultaneously, the second driver pushes the extended bottom section 46 upwards, causing the inner support rod 43 and the clamping plate 52 to move upwards, achieving separation of the clamping plate 52 from the support plate 51 and releasing the clamping of the wafer edge; at this time, the orientation adjustment unit 6 operates the clamping assembly 8 to move the single support member 2 away from the mounting base 11, completely exposing the fixed point area for cleaning. After cleaning, the second driver resets, causing the inner support rod 43 to lower and the clamping plate 52 to move downwards, while the first driver resets, causing the outer support cylinder 41 to rise and push the support plate 51 upwards, the two closing to re-clamp the wafer; finally, the orientation adjustment unit 6 precisely resets the single support member 2 back to the mounting base 11.

[0047] This embodiment significantly improves the accuracy and synchronization of clamping actions, ensuring uniform stress on the wafer edge; bidirectional independent drive eliminates motion interference and reduces mechanism wear; the support spring 44 buffer design effectively absorbs clamping impact and avoids damage to the brittle wafer edge; there is no risk of lateral displacement of the wafer during the separation of the clamping pieces, ensuring positioning accuracy; the modular split structure of the support cylinder 4 also facilitates maintenance and replacement of key components.

[0048] Example 4, please refer to Figure 1 , Figure 8 and Figure 9 This embodiment describes the pushing component 7 and the clamping component 8 in detail based on the above embodiment.

[0049] The orientation adjustment unit 6 includes an adjustment base 61 fixed to the periphery of the support base frame 1 and a guide rail frame 62 vertically mounted thereon. The structure of the orientation adjustment unit 6 shown in the figure is only schematic. The pushing assembly 7 consists of a pushing seat 71, a sliding seat 72, and a mounting frame 74: the sliding seat 72 is slidably connected to the guide rail of the guide rail frame 62 via a slider 73, and the pushing seat 71 is fixed to the top of the sliding seat 72; the mounting frame 74 is located at the front end of the pushing seat 71, and a push rod 76 and a pusher 75 (such as a cylinder) are mounted on it. The clamping assembly 8 is fixed to the rod end of the push rod 76, and the pushing end of the pusher 75 directly drives the clamping assembly 8 to move horizontally. The clamping assembly 8 includes a clamping seat 81, a support arm 82 fixed on the clamping seat 81, and a jaw assembly 83 mounted on the end of the support arm 82; the jaw assembly 83 adopts a double-jaw structure with the upper and lower jaws facing each other, and a trigger probe 84 is embedded in the inner side of one of the jaws. The outer surface of the housing supporting the main cylinder 21 is provided with a trigger interface 85 that matches the trigger probe 84. A signal trigger 86 is embedded inside the trigger interface 85. The signal trigger 86 establishes an electrical signal connection with the internal control terminal of the drive unit 23 through a wire.

[0050] During operation, the pusher 71 moves along the guide rail 62 to the target single support member 2 position. The pusher 75 drives the clamping assembly 8 to move towards the main support cylinder 21, and the upper and lower gripper assemblies 83 clamp the housing of the main support cylinder 21. When the gripper assemblies 83 contact the housing, the trigger probe 84 is inserted into the trigger interface 85 and activates the signal trigger 86. The signal trigger 86 sends a trigger signal to the drive unit 23, and the drive unit 23 immediately activates the internal drive mechanism to control the movement of the support cylinder 4 (such as the dual-drive coordinated extension and retraction in Embodiment 3), preparing for the subsequent release of the clamping point. At the same time, the pusher 75 continues to apply force, pulling the clamping assembly 8 through the push rod 76 to separate the single support member 2 as a whole from the mounting base 11. After separation, the exposed area of ​​the wafer edge is cleaned. After cleaning is completed, the pusher 75 pushes the clamping assembly 8 to reset the single support member 2 to the mounting base 11. When the gripper assemblies 83 disengage from the main support cylinder 21, the trigger probe 84 separates from the trigger interface 85, the signal is interrupted, and the drive unit 23 resets the clamping plate assembly 5. The entire process involves sequentially cleaning all fixed points in a loop.

[0051] This embodiment establishes a closed-loop control mechanism for electromechanical linkage: the trigger probe 84 and the trigger interface 85 form a physical-electrical dual-contact system. When the gripper assembly 83 clamps the main support cylinder 21, the trigger probe 84 inserts into the trigger interface 85, forcibly establishing a physical connection and triggering signal transmission. The signal trigger 86 converts this contact event into an electrical signal and sends it to the drive unit 23, automatically activating the extension and retraction action of the support cylinder 4, achieving zero-delay synchronization between the mechanical clamping action and the internal drive response. The precision guidance of the guide rail frame 62 and the sliding seat 72 ensures that the clamping positioning error is less than 0.1mm, and the direct push mode of the pusher 75 provides a stable separation force. The bidirectional constraint of the upper and lower gripper assemblies 83 prevents the main support cylinder 21 from tilting, ensuring a smooth separation process.

[0052] Please see Figure 2 The present invention also discloses a wafer cleaning apparatus, including a cleaning chamber 9 and a wafer support structure disposed therein. A cleaning platform 91 is fixedly installed at the bottom of the cleaning chamber 9, and a support base frame 1 is anchored to the central area of ​​the cleaning platform 91 by bolts. The adjustment base 61 of the orientation adjustment unit 6 is mounted on the edge of the cleaning platform 91. A hoisting cleaning frame 92 is provided at the top of the cleaning chamber 9, which spans across the cleaning platform 91. A lifting adjustment frame 93 (such as a servo cylinder) is installed on the hoisting cleaning frame 92, and a direction adjustment frame 94 (such as a universal joint mechanism) is hoisted at the vertical movement end of the lifting adjustment frame 93. A fixed-point cleaning spray gun 95 is installed at the end of the direction adjustment frame 94. The fixed-point cleaning spray gun 95 is connected to an external cleaning fluid supply system through a hose, and its nozzle angle and position are controlled by the direction adjustment frame 94 to achieve multi-degree-of-freedom precise positioning. The wafer support structure adopts any of the above embodiments one to four, including a detachable single support component 2 and a matching orientation adjustment unit 6, and the mounting seats 11 on the support base frame 1 are arranged to adapt to the shape of the target wafer.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer support structure, comprising a support base frame (1) and an azimuth adjustment mechanism (6); the support base frame (1) is used to support a plurality of single sets of support members (2) through a plurality of mounting seats (11), the mounting seats (11) are arranged according to the shape of the wafer, and each mounting seat (11) is provided with the single set of support members (2) to form common support for the wafer; the azimuth adjustment mechanism (6) is arranged at the periphery of the support base frame (1) and is used to selectively separate the single set of support members (2) from the corresponding mounting seat (11) through a pushing assembly (7) and a clamping assembly (8); characterized in that wherein the single set of support members (2) comprises a support main cylinder (21), an assembly part (22) and a driving part (23), the bottom of the support main cylinder (21) is provided with the driving part (23), the top is provided with the assembly part (22), the assembly part (22) is provided with a support frame (3), a telescopic support cylinder body (4) is arranged in the support main cylinder (21), the support frame (3) is used to support the support cylinder body (4), and the top of the support cylinder body (4) is provided with a clamping piece group (5) for fixing the wafer edge; when cleaning the wafer edge, the support cylinder body (4) is driven to move by the driving part (23) to drive the clamping piece group (5) to loosen the wafer edge, and the single set of support members (2) is separated from the mounting seat (11) by the azimuth adjustment mechanism (6) to expose the fixed point area of the wafer edge for cleaning.

2. The wafer support structure of claim 1, wherein, the mounting seat (11) comprises a seat body (13), a back fixing bolt (14) arranged at the back of the seat body (13) and a mounting block group (15) arranged at the front of the seat body (13); the mounting block group (15) is provided with an upper block and a lower block, the upper block is provided with an upper clamping block (16) and forms an upper mounting groove (18) with the upper clamping block (16), and the lower block is provided with a lower supporting block (17) and forms a lower mounting groove (19) with the lower supporting block (17); the assembly part (22) is embeddedly mounted in the slot of the upper mounting groove (18), and the driving part (23) and the support main cylinder (21) are insertedly mounted in the lower mounting groove (19).

3. The wafer support structure of claim 1, wherein, the support frame (3) comprises a support frame (31) mounted in the frame of the assembly part (22), support side plates (33) arranged at both sides of the support frame (31) and a limiting disc (34) mounted between slot supports (32); the limiting disc (34) is a disc structure, and both ends thereof are combinedly mounted in the slots of the slot supports (32) through protruding blocks; the limiting disc (34) is provided with a guide hole (35), and the cylinder body of the support cylinder body (4) passes out of the guide hole (35).

4. The wafer support structure of claim 3, wherein, the upper plane of the support frame (31) is provided with a supporting disc (36), and a buffer spring (37) is arranged between the supporting disc (36) and the limiting disc (34).

5. The wafer support structure of claim 1, wherein, The support cylinder (4) comprises an outer support cylinder (41) and an inner support rod (43), the inner support rod (43) is internally penetrated in the middle line position of the outer support cylinder (41); The outer support cylinder (41) is a hollow structure and the top of the outer support cylinder (41) is provided with a support section (42); The clamping piece group (5) comprises a support bottom piece (51) and a pressing piece (52), the middle point area of the support bottom piece (51) is provided with a through hole (53), the support bottom piece (51) is sleeved on the periphery of the support section (42) through the through hole (53) and the bottom of the support bottom piece (51) is supported and installed on the cylinder of the outer support cylinder (41) through a support spring (44), the pressing piece (52) is fixed on the top of the inner support rod (43); The pressing piece (52) and the support bottom piece (51) form a clamping interval for clamping the edge of the wafer.

6. The wafer support structure of claim 5, wherein, The bottom of the outer support cylinder (41) is provided with an internally threaded driving cylinder (45), the bottom of the internally threaded driving cylinder (45) is located in the driving part (23), the driving part (23) is provided with a first driver for pulling the internally threaded driving cylinder (45) up and down; The bottom end of the inner support rod (43) is protruded from the inside of the internally threaded driving cylinder (45) and is installed with a pushing bolt (47), the driving part (23) is provided with a second driver for pushing it up and down.

7. The wafer support structure of claim 1, wherein The orientation adjusting unit (6) comprises an adjusting base (61) and a guide rail frame (62) installed on the adjusting base (61); The pushing assembly (7) comprises a pushing seat (71) and a sliding seat (72) installed on the pushing seat (71), the sliding seat (72) is slidingly installed on the guide rail of the guide rail frame (62) through a sliding block (73); The pushing seat (71) is provided with a mounting frame (74), the mounting frame (74) is provided with a pushing rod (76) and a pusher (75), the clamping assembly (8) is installed on the rod end of the pushing rod (76), the pushing end of the pusher (75) is connected with the clamping assembly (8).

8. The wafer support structure of claim 7, wherein, The clamping assembly (8) comprises a clamping seat (81), a support arm (82) installed on the clamping seat (81) and a clamping jaw group (83) installed on the support arm (82), the clamping jaws of the clamping jaw group (83) are arranged in an up-down direction; One of the clamping jaws is provided with a trigger probe (84), the shell of the support main cylinder (21) is provided with a trigger interface (85) opposite to the trigger probe (84), the trigger interface (85) is provided with a signal trigger (86) inside, the signal trigger (86) is electrically connected with the control end inside the driving part (23).

9. A wafer cleaning apparatus, characterized by comprising: The cleaning compartment (9) and the wafer support structure as claimed in any one of claims 1-8; The bottom of the cleaning compartment (9) is provided with a cleaning platform (91), the support base frame (1) and the orientation adjusting unit (6) are erected on the cleaning compartment (9). The compartment body of the cleaning compartment (9) is further provided with a hoisting cleaning frame (92), a lifting adjusting frame (93) is installed on the hoisting cleaning frame (92), a direction adjusting frame (94) is hoisted on the lifting adjusting frame (93), and a fixed-point cleaning spray gun (95) is installed on the direction adjusting frame (94).

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