Silicon rod sample preparation device

Abstract

The invention relates to a silicon rod sample preparation device which comprises a base, and a feeding mechanism, a sample cutting mechanism, at least one grinding mechanism, a robot assembly and a discharging mechanism which are arranged on the base. The feeding mechanism is used for conveying silicon rod sample wafers to be machined to a feeding position. The sample wafer cutting mechanism is used for cutting the central area of the silicon rod sample wafer to form a sample wafer for detection. And the grinding mechanism is used for double-sided grinding of the sample for detection. And the discharging mechanism is used for conveying the detection sample wafer subjected to double-sided grinding to a discharging position. The robot assembly is used for transferring the silicon rod sample wafer at the feeding position to the sample wafer cutting mechanism, transferring the sample wafer for detection to the double-face grinding mechanism from the sample wafer cutting mechanism and transferring the sample wafer for detection after double-face grinding to the discharging mechanism. The silicon rod sample wafer preparation device has the beneficial effects that the silicon rod sample wafer can be mechanically processed, manual work is replaced, the labor intensity is reduced, the processing efficiency and precision are improved, and harm to human health is avoided.

Description

Technical Field

[0001] This invention relates to the field of silicon rod processing technology, and more particularly to a silicon rod sample preparation apparatus. Background Technology

[0002] Silicon rod samples are silicon wafers formed by wire cutting silicon rods and are used to test the carbon and oxygen content of the silicon rods. Since the diameter of the silicon rod samples taken is approximately 300 mm or greater, and the test samples only need to be square or round wafers of approximately 50 × 50 mm from the center of the silicon rod sample, the traditional process for preparing the test samples involves: first, manually hammering the silicon rod sample with a triangular hammer or similar tool to extract the test sample from the center; then, manually acid etching and polishing or grinding and planing the test sample before testing. This process has the following problems: it is time-consuming and inefficient; it involves high labor intensity for workers; the acid etching and planing process is harmful to human health; the grinding process generates a large amount of dust that can affect worker health and pollute the light environment; and the hammering method results in low sampling accuracy, making it difficult to ensure the dimensional uniformity of the test samples. Summary of the Invention

[0003] (a) Technical problems to be solved

[0004] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a silicon rod sample preparation device, which solves the technical problems of low efficiency, high labor intensity of workers, high harm to human body caused by acid etching and polishing process, and low sampling accuracy of sample preparation for manual processing and testing.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, the main technical solutions adopted by the present invention include:

[0007] This invention provides a silicon rod sample preparation apparatus, including a base, a feeding mechanism, a sample cutting mechanism, at least one grinding mechanism, a robot assembly, and a unloading mechanism, all disposed on the base;

[0008] The feeding mechanism is used to transport the silicon rod sample to be processed to the feeding position;

[0009] The sample cutting mechanism is used to cut the central area of ​​silicon rod samples to form test samples;

[0010] The grinding mechanism is used for double-sided grinding and testing of sample pieces;

[0011] The feeding mechanism is used to transport the double-sided ground test sample to the feeding position;

[0012] The robot component is used to transfer silicon rod samples from the loading position to the sample cutting mechanism, to transfer test samples from the sample cutting mechanism to the double-sided grinding mechanism, and to transfer the double-sided ground test samples to the unloading mechanism.

[0013] According to the present invention, the feeding mechanism includes a feeding slide rail, a feeding slide block, and a feeding tray;

[0014] The feeding slide is slidably mounted on the feeding slide rail, and the feeding tray is detachably mounted on the feeding slide. A stepped slot is opened on the top of the feeding tray, and multiple slots in the stepped slot are used to accommodate silicon rod samples of different sizes.

[0015] The unloading mechanism includes an unloading slide rail, an unloading slide block, and an unloading tray;

[0016] The feeding slide is slidably mounted on the feeding slide rail, and the feeding tray is detachably mounted on the feeding slide. A slot is opened on the top of the feeding tray to accommodate the test sample.

[0017] According to the present invention, the sample cutting mechanism includes a positioning part and a cutting part;

[0018] The positioning part includes a positioning disk and a clamping head; the positioning disk is vertical in axis and is used to place silicon rod samples; the clamping head is movable above the positioning disk and is used to selectively press the top of the silicon rod samples placed on the positioning disk.

[0019] The cutting section is located on one side of the positioning section and includes a three-axis drive and a laser cutting head. The laser cutting head is mounted on the three-axis drive, which drives the laser cutting head to move along the X, Y, and Z axes to the center area of ​​the silicon rod sample to cut and form a test sample.

[0020] According to the present invention, an opening is formed in the center of the positioning disk;

[0021] A movable push rod is installed below the opening, and the top of the push rod can switch between the feeding position, the support position, and the top support position.

[0022] When the top of the push rod is in the feeding position, the top of the push rod is lower than the top of the positioning plate;

[0023] When the top of the push rod is in the support position, the top of the push rod is flush with the top of the positioning disk to support the central area of ​​the silicon rod sample on the positioning disk.

[0024] When the top of the push rod is in the top support position, the top of the push rod is higher than the top of the positioning plate, so as to push the test sample through the opening and detach it from the remaining silicon rod sample.

[0025] According to the present invention, the grinding mechanism includes a lower grinding head and an upper grinding head:

[0026] The lower grinding head includes a lower grinding disc that is vertically axially aligned;

[0027] The upper grinding head is located on one side of the lower grinding head. It includes an upper grinding disc and a driver. The upper grinding disc can rotate around a vertical axis. The driver is connected to the upper grinding disc and is used to drive the upper grinding disc to rotate around another vertical axis to the avoidance position and the working position. It can also drive the upper grinding disc to rise and fall.

[0028] When the upper grinding disc is in the avoidance position, the upper grinding disc is located on one side of the lower grinding disc;

[0029] When the upper grinding disc is in the working position, it is located above the lower grinding disc and the upper and lower grinding discs are arranged coaxially. The test sample can be clamped between the upper and lower grinding discs, and the upper and lower grinding discs can rotate to grind the test sample on both sides.

[0030] According to the present invention, the lower grinding head further includes at least one planetary gear;

[0031] The planetary gear is located on the lower grinding disc, and there are holes on it for receiving the test sample;

[0032] The planetary gear can drive the test sample it contains to revolve around the axis of the lower grinding disc; or, the planetary gear can drive the test sample to revolve around the axis of the lower grinding disc and rotate on its own axis.

[0033] According to the present invention, the driver includes an upper grinding disc support, a rotary rod, a rotary drive component, a lifting drive component, and a lifting seat;

[0034] The rotary rod is vertically oriented and rotatable on the upper grinding disc support; the main body of the rotary drive is fixed on the upper grinding disc support, and the drive end is connected to the rotary rod to drive the rotary rod to rotate; the lifting seat is lifted and lowered around the rotary rod; the main body of the lifting drive is fixedly connected to the rotary rod, and the drive end is connected to the lifting seat to drive the lifting seat to rise and fall; the upper grinding disc is rotatable and connected to the lifting seat.

[0035] According to the present invention, the lower grinding head further includes an upper grinding disc drive shaft; the upper grinding disc drive shaft and the lower grinding disc are coaxial and can rotate through the lower grinding disc; a mating hole is opened in the center of the upper grinding disc, and the mating hole is detachably sleeved on the upper grinding disc drive shaft; when the upper grinding disc is in the working position, the mating hole is sleeved on the upper grinding disc drive shaft, and the upper grinding disc drive shaft can drive the upper grinding disc to rotate.

[0036] A vertically oriented elastic probe is installed inside the lifting seat, and the elastic probe is located above the mating hole. When the upper grinding disc is in the working position, the lifting drive can drive the lifting seat and the upper grinding disc to descend. The elastic probe is used to detect the positioning information when it presses against the top of the upper grinding disc drive shaft, the pressure information of the upper grinding disc pressing against the test sample, and the grinding thickness information of the test sample.

[0037] The lifting drive component is a cylinder. The air circuit system of the lifting drive component is equipped with an electromagnetic proportional valve. The electromagnetic proportional valve is used to adjust the extension speed of the drive end of the lifting drive component according to the positioning information, adjust the output pressure of the drive end of the lifting drive component according to the pressure information, and adjust the extension amount of the drive end of the lifting drive component according to the grinding thickness information.

[0038] According to the present invention, the robot assembly includes a four-axis robotic arm and a gripper disposed on the four-axis robotic arm;

[0039] The material gripper includes a first gripper arm arranged in a ring and extending radially outward from the center, and multiple second gripper arms. The length of the first gripper arm is greater than the length of the second gripper arm, and a vacuum suction cup is provided at the far end of the first gripper arm and the multiple second gripper arms.

[0040] Vacuum chucks on the first clamping arm and multiple second clamping arms are used to adsorb silicon rod samples, and the vacuum chucks on the first clamping arm are used to adsorb samples for testing.

[0041] According to the present invention, it further includes:

[0042] A support frame fixed to the top of the base;

[0043] A vision camera, fixed on a support frame, is used to identify the position of silicon rod samples and inspection samples, as well as to identify the working status of the feeding mechanism, sample cutting mechanism, grinding mechanism, robot components and unloading mechanism;

[0044] The dust collection component, fixed to the support frame, is used to collect dust generated during the sample cutting and grinding processes.

[0045] The sample recycling mechanism, fixed on the base and located between the loading and unloading mechanisms, is used to receive the silicon rod samples remaining after cutting during the transfer of robot components.

[0046] (III) Beneficial Effects

[0047] The beneficial effects of this invention are as follows: The silicon rod sample preparation apparatus of this invention includes a feeding mechanism for feeding silicon rod samples to be processed, a sample cutting mechanism for cutting the central region of the silicon rod sample to form a test sample, at least one grinding mechanism for double-sided grinding of the test sample and capable of multi-station simultaneous operation to improve grinding efficiency, and an unloading mechanism for unloading the double-sided ground test sample. A robotic component transports the silicon rod sample and the test sample between the various mechanisms. Therefore, this silicon rod sample preparation apparatus can mechanize the processing of silicon rod samples, replacing manual labor, reducing labor intensity, improving processing efficiency and accuracy, and avoiding harm to human health. Attached Figure Description

[0048] Figure 1 This is an overall schematic diagram of the silicon rod sample preparation apparatus of the present invention;

[0049] Figure 2 for Figure 1 The protective shield and protective net are not shown in the schematic diagram.

[0050] Figure 3 for Figure 2 A schematic diagram of the supporting frame is not shown.

[0051] Figure 4 This is a schematic diagram of the feeding slide rail;

[0052] Figure 5 for Figure 4 The main view;

[0053] Figure 6 for Figure 5 A partial schematic diagram;

[0054] Figure 7 This is the front view of the sample cutting mechanism;

[0055] Figure 8 for Figure 7 A partial schematic diagram;

[0056] Figure 9 A 3D view of the sample cutting mechanism;

[0057] Figure 10 This is a schematic diagram of the grinding mechanism (the upper grinding disc is located in a clearance position).

[0058] Figure 11 This is a schematic diagram of the grinding mechanism (the upper grinding disc is in the working position).

[0059] Figure 12 This is a cross-sectional view of the upper grinding head;

[0060] Figure 13 This is an assembly drawing of the upper grinding disc, the upper grinding disc base, and the upper grinding disc rotating sleeve.

[0061] Figure 14 for Figure 13 A bottom view;

[0062] Figure 15 for Figure 13 A sectional view;

[0063] Figure 16 This is a top view of the lower grinding head;

[0064] Figure 17 This is a bottom view of the lower grinding head;

[0065] Figure 18 This is a cross-sectional view of the lower grinding head;

[0066] Figure 19A schematic diagram of robot components;

[0067] Figure 20 This is a schematic diagram of the material gripper.

[0068] [Explanation of Labels in the Attached Image]

[0069] 11: Base; 12: Support frame;

[0070] 2: Feeding mechanism; 21: Feeding slide rail; 22: Feeding slide block; 23: Feeding tray; 231: Stepped slot; 24: Feeding support frame; 25: Bellows protective component; 26: Calibration component;

[0071] 3: Sample cutting mechanism; 31: Positioning part; 311: Positioning plate; 3111: Opening; 312: Clamping head; 313: Pushing component; 314: Pushing cylinder; 315: Baffle plate; 316: Receiving box; 317: Clamping cylinder; 318: Light source; 32: Cutting part; 321: Three-axis drive component; 3211: Column; 3212: Y-axis linear module; 3213: X-axis linear module; 3214: Sliding column; 3215: Slide rail; 3216: Z-axis linear module; 3217: Slide table; 322: Laser cutting head;

[0072] 4: Grinding mechanism; 41: Lower grinding head; 411: Lower grinding disc; 4111: Lower grinding disc seat; 412: Planetary gear; 413: Upper grinding disc drive shaft; 414: Internal gear ring; 4141: Internal gear ring seat; 415: External gear ring; 4151: External gear ring seat; 416: Lower grinding disc support; 4161: Inner ring; 4162: Outer ring; 4171: First drive motor; 4172: Second drive motor; 4173: Third drive motor; 4174: Fourth drive motor; 42: Upper grinding head; 421 4211: Upper grinding disc; 4212: Mating hole; 422: Upper grinding disc seat; 422: Driver; 4221: Upper grinding disc support; 4222: Rotary rod; 42221: Gear; 42222: Sliding sleeve; 42223: Guide rod; 4223: Rotary drive component; 42231: Rack; 4224: Lifting drive component; 4225: Elastic probe; 4226: Lifting seat; 4227: Sliding bushing; 4228: Self-aligning roller bearing; 4229: Upper grinding disc rotating sleeve; A: Media channel;

[0073] 5: Robot components; 51: Four-axis robotic arm; 52: Material gripper; 521: First gripper arm; 522: Second gripper arm; 523: Vacuum suction cup; 524: Air blower head;

[0074] 6: Feeding mechanism; 61: Feeding slide rail; 62: Feeding slide block; 63: Feeding tray; 631: Slot; 64: Feeding support frame;

[0075] 7: Visual camera; 8: Dust collection assembly; 9: Sample recycling mechanism;

[0076] 101: Protective net; 102: Protective cover. Detailed Implementation

[0077] To better explain and facilitate understanding of the present invention, a detailed description of the invention is provided below with reference to the accompanying drawings and specific embodiments. In this document, directional terms such as "upper" and "lower" are used interchangeably with other directional terms. Figure 2 The orientation is used as a reference.

[0078] See Figure 1-18 The present invention provides a silicon rod sample preparation device, including a base 11, a feeding mechanism 2, a sample cutting mechanism 3, at least one grinding mechanism 4, a robot component 5, and a unloading mechanism 6, all disposed on the base 11.

[0079] The feeding mechanism 2 transports the silicon ingot sample to be processed to the feeding position for loading. The sample cutting mechanism 3 cuts the central area of ​​the silicon ingot sample to form a test sample. At least one grinding mechanism 4 is used for double-sided grinding of the test sample and can work at multiple stations simultaneously to improve grinding efficiency. The unloading mechanism 6 transports the double-sided ground test sample to the unloading position for unloading. The robot component 5 is used to transfer the silicon ingot sample from the feeding position to the sample cutting mechanism 3, transfer the test sample from the sample cutting mechanism 3 to the double-sided grinding mechanism, and transfer the double-sided ground test sample to the unloading mechanism 6, so as to transport the silicon ingot sample and the test sample between the various mechanisms.

[0080] Therefore, this silicon rod sample preparation device can mechanically process silicon rod samples into test samples, replacing manual labor, reducing labor intensity, improving processing efficiency and accuracy, and avoiding harm to human health.

[0081] See Figure 2 Furthermore, this silicon rod sample preparation device also includes a support frame 12 and a vision camera 7.

[0082] The support frame 12 is fixed to the top of the base 11. The vision camera 7 is fixed on the support frame 12 and located above the feeding mechanism 2, the sample cutting mechanism 3, at least one grinding mechanism 4, the robot assembly 5, and the unloading mechanism 6. It is used to identify the coordinate position, tilt angle, cutting and grinding status, and other specific information of the silicon rod sample and the sample for inspection, as well as to identify the working status of the feeding mechanism 2, the sample cutting mechanism 3, the grinding mechanism 4, the robot assembly 5, and the unloading mechanism 6. It can also assist the robot assembly 5 in quickly positioning, accurately identifying, and accurately grasping, so that the robot assembly 5 has a compact cycle and high utilization rate.

[0083] See Figure 3-6 Furthermore, the feeding mechanism 2 includes a feeding slide rail 21, a feeding slide block 22, and a feeding tray 23. The feeding slide block 22 is slidably mounted on the feeding slide rail 21, and the feeding tray 23 is detachably mounted on the feeding slide block 22. A stepped slot 231 is provided on the top of the feeding tray 23. Multiple slots in the stepped slot 231 are used to accommodate silicon rod samples of different sizes, and multiple layers of silicon rod samples can be placed. By positioning silicon rod samples of different specifications in the corresponding slots in the stepped slot 231, silicon rod samples of different specifications are compatible without replacing the feeding tray 23, protecting the silicon rod samples from damage during the feeding process. It is also convenient for operators to place silicon rod samples of different specifications into the stepped slot 231 by positioning them in different slots, achieving a foolproof effect, avoiding manual feeding errors, and facilitating the robot component 5 to grasp the silicon rod samples in the stepped slot 231.

[0084] The unloading mechanism 6 includes an unloading slide rail 61, an unloading slide block 62, and an unloading tray 63. The unloading slide block 62 is slidably mounted on the unloading slide rail 61, and the unloading tray 63 is detachably mounted on the unloading slide block 62. A slot 631 is formed on the top of the unloading tray 63 for accommodating the test sample. It should be noted that the shape of the slot 631 matches the shape of the test sample, and is generally set to square. The specific shape can be adjusted according to the required shape of the test sample to facilitate the placement of the test sample by the robot component 5.

[0085] In the initial state, the first end of the loading slide rail 21 closest to the sample cutting mechanism 3 is the loading position, the loading slide 22 and its loading tray 23 are located at the second end of the loading slide rail 21, and the first end of the unloading slide rail 61 furthest from the grinding mechanism 4 is the unloading position, the unloading slide 62 and its unloading tray 63 are located at the second end of the unloading slide rail 61. During loading, the silicon rod sample to be cut is placed in the stepped slot 231 of the loading tray 23. Subsequently, the loading slide 22 moves the loading tray 23 carrying the silicon rod sample to the first end of the loading slide rail 21, i.e., the loading position. Then, the robot component 5 transfers the silicon rod sample on the loading tray 23 to the sample cutting mechanism 3. During unloading, the robot component 5 transfers the double-sided ground test sample to the unloading tray 63, and the unloading slide 22 moves the unloading tray 63 carrying the test sample to the first end of the unloading slide rail 61, i.e., the unloading position.

[0086] Preferably, the feeding mechanism 2 and the unloading mechanism 6 are arranged in parallel and fixedly connected to one side of the base 11.

[0087] Preferably, the loading tray 23 and the loading slide 22 are quickly connected, and the unloading tray 63 and the unloading slide 62 are also quickly connected, to facilitate the replacement of loading and unloading trays of different specifications. The top of the loading slide 22 and the unloading slide 62 are provided with elastic plungers, and the bottom of the loading tray 23 and the unloading tray 63 are provided with positioning holes. The ball head of the elastic plunger can be inserted into the positioning hole to achieve a quick-release connection between the tray and the slide through spring force.

[0088] Preferably, to facilitate the debugging of robot component 5, reserved holes are provided on loading tray 23 and unloading tray 63, and calibration component 26 is inserted into the reserved holes during equipment debugging to facilitate debugging whether robot component 5 can move to calibration component 26.

[0089] It should be noted that, in actual operation, calibration parts 26 are not installed in the reserved holes of the loading pallet 23 and the unloading pallet 63.

[0090] Preferably, both ends of the feeding slide rail 21 and the unloading slide rail 61 are provided with a bellows protective member 25 to limit the movement of the feeding slide 22 and the unloading slide 62 and protect the feeding slide 22 and the unloading slide 62 from collision damage.

[0091] Preferably, a detection switch is provided below both the loading slide rail 21 and the unloading slide rail 61 to detect and identify whether the loading tray 23 and the unloading tray 63 are carrying silicon rod samples and test samples.

[0092] Preferably, both the loading tray 23 and the unloading tray 63 are marked on their tops for the vision camera 7 to identify the loading and unloading positions. The image information captured by the vision camera 7 enables the robot component 5 to move precisely to the corresponding loading tray 23 and unloading tray 63, and to pick up silicon ingot samples and inspection samples.

[0093] See Figure 7-9 Furthermore, the sample cutting mechanism 3 includes a positioning part 31 and a cutting part 32.

[0094] The positioning part 31 includes a positioning disk 311 and a clamping head 312. The positioning disk 311 is vertical in axis and is used to place silicon ingot samples. The clamping head 312 is vertically mounted above the positioning disk 311 and is used to selectively press against the top of the silicon ingot sample placed on the positioning disk 311.

[0095] The cutting section 32 is located on one side of the positioning section 31, and includes a three-axis drive member 321 and a laser cutting head 322. The laser cutting head 322 is mounted on the three-axis drive member 321, which drives the laser cutting head 322 to move along the X, Y, and Z axes to the center area of ​​the silicon rod sample to cut and form a test sample.

[0096] It should be noted that before cutting, the laser cutting head 322 moves along the X, Y, and Z axes to above the central area of ​​the silicon rod sample. During the cutting process, the laser cutting head 322 selectively moves along the X, Y, and Z axes to cut the central area of ​​the silicon rod sample. After cutting, the laser cutting head 322 selectively moves along the X, Y, and Z axes to move away from the positioning part 31 to avoid the positioning part 31, so that the robot assembly 5 can unload the inspection sample and the remaining silicon rod sample.

[0097] As can be seen from the above, this sample cutting mechanism 3 can realize the mechanized cutting of silicon rod samples. The silicon rod sample to be cut is positioned and clamped by the positioning part 31, and then the movement trajectory of the laser cutting head 322 is adjusted by the three-axis drive 321. The laser cutting head 322 laser cuts the central area of ​​the positioned and clamped silicon rod sample. The cutting trajectory is uniform and smooth, which can cut complete test samples without the connecting ribs left by traditional metal cutting. This avoids the subsequent grinding process steps of the ribs, improves the efficiency and accuracy of slicing, saves manpower, ensures the success rate of slicing, and reduces the defective rate.

[0098] Preferably, there are multiple clamping heads 312, which are arranged circumferentially around the positioning disk 311 and at least one is arranged radially along the positioning disk 311 to stably press against the top of the silicon rod sample placed on the positioning disk 311.

[0099] Specifically, the laser cutting head 322 can cooperate with the three-axis drive unit 321 and the vision camera 7. Relying on the image information acquired by the vision camera 7, the trajectory of the laser cutting head 322 is adjusted by the three-axis drive unit 321, so that the entire cutting process can be dynamically adjusted in real time to ensure smooth and uniform cutting. During the cutting process, the voltage of the laser cutting head can be adjusted to change the cutting power, ensuring the success rate of slicing and greatly reducing defective slices.

[0100] Specifically, the positioning part 31 also includes a clamping cylinder 317 for driving the clamping head 312 to rise and fall.

[0101] The main body of the clamping cylinder 317 is fixed on the base 11. The drive unit is connected to the clamping arm, and a vertically oriented clamping head 312 is fixedly connected to the clamping arm. The clamping cylinder is used to drive the clamping arm to move the clamping head 312 up and down.

[0102] Specifically, to facilitate the positioning and clamping of the silicon rod sample, this embodiment further specifies:

[0103] An opening 3111 is provided in the center of the positioning plate 311. A lifting push rod 313 is provided below the opening 3111, and the top of the push rod 313 can switch between the feeding position, the support position and the top support position.

[0104] When the top of the push rod 313 is in the feeding position, the top of the push rod 313 is lower than the top of the positioning disk 311 so that the robot assembly 5 can place the silicon rod sample on the positioning disk 311.

[0105] When the top of the push rod 313 is in the support position, the top of the push rod 313 is flush with the top of the positioning disk 311 to support the central area of ​​the silicon rod sample on the positioning disk 311, so as to facilitate the subsequent cutting of the central area of ​​the silicon rod sample into a test sample.

[0106] When the top of the push rod 313 is in the top support position, the top of the push rod 313 is higher than the top of the positioning plate 311, so as to push the cut test sample through the opening 3111 and detach it from the remaining silicon rod sample.

[0107] The height of the top of the push rod 313 increases sequentially when it is in the feeding position, support position, and top support position.

[0108] The push rod 313 receives and pushes the test sample through the opening 3111 away from the remaining silicon rod sample. This serves two purposes: first, it facilitates the vision camera 7 in identifying cutting defects such as fragments and burrs, allowing for timely adjustment of the laser cutting head's movement trajectory and cutting power to ensure cutting quality; second, it prevents the test sample formed during cutting from adhering to the remaining silicon rod after cutting, thus facilitating the gripping of the robot component 5.

[0109] Specifically, the positioning part 31 also includes a push cylinder 314, the extended end of which is vertically oriented and fixedly connected to the push rod 313. The push cylinder 314 is used to drive the push rod 313 to rise and fall.

[0110] Specifically, in order to limit the upward movement of the push rod 313, a baffle 315 is fixedly installed on the extended end of the push cylinder 314. The extended end of the push cylinder 314 can extend to the bottom of the baffle 315 against the positioning plate 311, thereby limiting the support position of the push rod 313.

[0111] Specifically, the positioning part 31 also includes a receiving box 316, which is used to receive debris generated during the cutting process.

[0112] The receiving box 316 is fixed to the bottom of the positioning plate 311. The top opening of the receiving box 316 corresponds to the connecting opening 3111. The push cylinder 314, the push rod 313, and the baffle plate 15 are all located inside the receiving box 316. The main body of the push cylinder 314 is fixed to the inner wall of the receiving box 316.

[0113] Specifically, the positioning unit 31 also includes a light source 318 for illuminating the silicon rod sample placed on the positioning disk 311, so that the vision camera 7 can acquire image information of the silicon rod sample to cooperate with the laser cutting head 322 to cut the silicon rod sample.

[0114] More specifically, the light source 318 is fixed to the base 11 by a bracket.

[0115] Furthermore, the three-axis drive unit 321 includes a column 3211, a Y-axis linear module 3212, an X-axis linear module 3213, a sliding column 3214, a slide rail 3215, a Z-axis linear module 3216, and a slide table 3217.

[0116] The column 3211 is vertically oriented. The Y-axis linear module 3212 is fixed to the top of the column 3211. The first end of the X-axis linear module 3213 is slidably fitted onto the Y-axis linear module 3212. The sliding column 3214 is fixed to the bottom of the second end of the X-axis linear module 3213. The slide rail 3215 is arranged parallel to the Y-axis linear module 3212, and the bottom of the sliding column 3214 is slidably fitted onto the slide rail 3215 via a slider. The slide rail 3215 is mounted on the base 11. The Z-axis linear module 3216 is slidably fitted onto the X-axis linear module 3213. The slide table 3217 is slidably fitted onto the Z-axis linear module 3216, and a laser cutting head 322 is mounted on it.

[0117] Thus, the three-axis drive unit 321 can drive the laser cutting head 322 to move along the X, Y, and Z axes.

[0118] See Figure 3 Furthermore, to facilitate the recycling of the remaining silicon rod samples after cutting, this silicon rod sample preparation device also includes a sample recycling mechanism 9.

[0119] The sample recovery mechanism 9 is located on one side of the positioning section 31 and the cutting section 32, and is used to receive the silicon rod samples remaining after cutting transferred by the robot assembly 5.

[0120] Specifically, the sample recovery mechanism 9 is preferably located between the feeding mechanism 2 and the unloading mechanism 6 to reduce the size of the equipment. The sample recovery mechanism 9 can be a container.

[0121] See Figure 10-18 Furthermore, the grinding mechanism 4 includes a lower grinding head 41 and an upper grinding head 42:

[0122] The lower grinding head 41 includes a lower grinding disc 411 capable of rotating about a vertical axis. The upper grinding head 42 is located on one side of the lower grinding head 41 and includes an upper grinding disc 421 and a driver 422. The upper grinding disc 421 is capable of rotating about a vertical axis, and the driver 422 is connected to drive the upper grinding disc 421 to rotate about another vertical axis to a clearance position and a working position, and is also capable of driving the upper grinding disc 421 to rise and fall.

[0123] When the upper grinding disc 421 is in the avoidance position, the upper grinding disc 421 is located on one side of the lower grinding disc 411.

[0124] When the upper grinding disc 421 is in the working position, it is coaxially positioned above the lower grinding disc 411. The test sample can be clamped between the upper grinding disc 421 and the lower grinding disc 411. The upper grinding disc 421 and the lower grinding disc 411 can rotate to grind the test sample on both sides.

[0125] In this grinding mechanism 4, the driver 422 can drive the upper grinding disc 421 to switch between a clearance position and a working position. When the upper grinding disc 421 is in the clearance position, it can avoid the lower grinding disc 411 to provide loading space for the lower grinding disc 411. After the lower grinding disc 411 is loaded, the upper grinding disc 421 is in the working position, coaxially positioned above the lower grinding disc 411, and the test sample to be ground is clamped between the upper grinding disc 421 and the lower grinding disc 411. The upper grinding disc 421 and the lower grinding disc 411 can rotate to grind the test sample on both sides. After the test sample is ground on both sides, the upper grinding disc 421 can switch from the working position to the clearance position to avoid the lower grinding disc 411 and provide unloading space for the lower grinding disc 411. Thus, this silicon rod sample double-sided grinding machine can realize the mechanized grinding of test samples, improve grinding efficiency and grinding accuracy, replace manual labor, reduce labor intensity, and avoid harm to the human body.

[0126] Specifically, the lower grinding head 41 also includes at least one planetary gear 412.

[0127] Planetary gear 412 is located on the top of the lower grinding disc 411, and has an insertion hole for receiving a test sample. Planetary gear 412 can drive the received test sample to revolve around the axis of the lower grinding disc 411. Alternatively, planetary gear 412 can drive the received test sample to revolve around the axis of the lower grinding disc 411 and rotate on its own axis.

[0128] Therefore, during the double-sided grinding of the test sample by this grinding mechanism 4, there are three rotational components: the upper grinding disc 421, the lower grinding plate 411, and the planetary gears 412. The relatively high speed improves the grinding effect and accuracy of the test sample. Furthermore, the multiple planetary gears 412 can accommodate multiple test samples, allowing for simultaneous grinding of multiple samples. The overall structure is compact, enhancing grinding efficiency.

[0129] Furthermore, to drive the planetary gear 412 to rotate, the lower grinding head 41 also includes an upper grinding disc drive shaft 413, an internal gear ring 414, and an external gear ring 415.

[0130] The upper grinding disc drive shaft 413 and the lower grinding disc 411 are coaxial, and the lower grinding disc 411 is rotatably mounted on it. An internal gear ring 414 is coaxially fitted around the upper grinding disc drive shaft 413 and can rotate around it. An external gear ring 415 is coaxially fitted around the internal gear ring 414 and can rotate around the upper grinding disc drive shaft 413. The peripheral walls of the planetary gear 412 mesh with the internal gear ring 414 and the external gear ring 415.

[0131] When the internal gear ring 414 and external gear ring 415 rotate, they can drive the planetary gear 412 to revolve around the axis of the lower grinding disc 411. Alternatively, they can drive the planetary gear 412 to revolve around the axis of the lower grinding disc 411 and rotate on its own axis. For example, when the internal gear ring 414 and external gear ring 415 rotate in the same direction and at the same speed, the planetary gear 412 can drive the contained test sample to revolve around the axis of the lower grinding disc 411. When the internal gear ring 414 and external gear ring 415 rotate in opposite directions, or when the internal gear ring 414 and external gear ring 415 rotate at different speeds, or when the internal gear ring 414 and external gear ring 415 rotate in opposite directions and at different speeds, the planetary gear 412 can drive the contained test sample to revolve around the axis of the lower grinding disc 411 and rotate on its own axis.

[0132] Furthermore, in order to drive the upper grinding disc 421 to rotate, a mating hole 4211 is opened in the center of the upper grinding disc 421, and the mating hole 4211 is detachably sleeved on the top of the upper grinding disc drive shaft 413.

[0133] When the upper grinding disc 421 is in the working position, the mating hole 4211 is sleeved on the upper grinding disc drive shaft 413, and the upper grinding disc drive shaft 413 can drive the upper grinding disc 421 to rotate.

[0134] Specifically, to facilitate the insertion of the top of the upper grinding disc drive shaft 413 and the mating hole 4211 of the upper grinding disc 421, the mating hole 4211 is a spline hole, and a spline is provided on the top peripheral wall of the upper grinding disc drive shaft 413, and the spline hole can be fitted outside the spline.

[0135] Furthermore, to support the rotation of the upper grinding disc drive shaft 413, the internal gear ring 414, and the external gear ring 415, the lower grinding head 41 also includes a lower grinding disc support 416, which is fixed on the base 11.

[0136] The top of the lower grinding disc support 416 is coaxially arranged with an inner ring 4161 and an outer ring 4162 from the inside to the outside. The bottom of the lower grinding disc 411 is fixedly connected to the lower grinding disc seat 4111. An annular slot is opened at the bottom of the lower grinding disc seat 4111, and the inner ring 4161 is inserted into the annular slot. The lower grinding disc seat 4111 is rotatably connected to the inner ring 4161 through a bearing. The lower grinding disc seat 4111 can drive the lower grinding disc 411 to rotate around the upper grinding disc drive shaft 413. The upper grinding disc drive shaft 413 is inserted into the inner ring 4161, and the top of the upper grinding disc drive shaft 413 extends out of the inner ring 4161. The bottom of the internal gear ring 414 is fixedly connected to the internal gear ring seat 4141. Both the internal gear ring 414 and the internal gear ring seat 4141 are sleeved on the outside of the upper grinding disc drive shaft 413. The inner circumference of the internal gear ring seat 4141 is rotatably connected to the upper grinding disc drive shaft 413 through a bearing, and the outer circumference of the internal gear ring seat 4141 is rotatably connected to the lower grinding disc seat 4111 through a bearing. The internal gear ring seat 4141 can drive the internal gear ring 414 to rotate around the upper grinding disc drive shaft 413. The bottom of the external gear ring 415 is fixedly connected to the external gear ring seat 4151. The external gear ring seat 4151 is inserted into the outer ring 4162 and rotatably connected to the inner wall of the outer ring 4162 through a bearing. The external gear ring seat 4151 can drive the external gear ring 415 to rotate around the upper grinding disc drive shaft 413.

[0137] Furthermore, in order to drive the upper grinding disc 421, the lower grinding disc 411, the internal gear ring 414, the external gear ring 415 and the upper grinding disc drive shaft 413 to rotate, the lower grinding head 41 also includes a first drive motor 4171, a second drive motor 4172, a third drive motor 4173 and a fourth drive motor 4174.

[0138] The main bodies of the first drive motor 4171, the second drive motor 4172, the third drive motor 4173, and the fourth drive motor 4174 are all fixed on the lower grinding disc support 416, and their drive ends are all vertically oriented. The drive end of the first drive motor 4171 is connected to the lower peripheral wall of the upper grinding disc drive shaft 413 via a gear set, and is used to drive the upper grinding disc drive shaft 413 to rotate. The drive end of the second drive motor 4172 is connected to the lower peripheral wall of the internal gear ring seat 4141 via a gear set, and is used to drive the internal gear ring seat 4141 to drive the internal gear ring 414 to rotate around the upper grinding disc drive shaft 413. The drive end of the third drive motor 4173 is connected to the lower grinding disc seat 4111 via a gear set, and is used to drive it to rotate around the upper grinding disc drive shaft 413. The drive end of the fourth drive motor 4174 is connected to the external gear ring seat 4151 via a gear set, and is used to drive the external gear ring 415 to rotate around the upper grinding disc drive shaft 413.

[0139] The drive system, composed of four motors, allows for stepless adjustment of the relative speed of the test sample held by the upper and lower grinding discs and planetary gears. The four motors drive the rotation of the upper and lower grinding discs and planetary gears via gear sets, ensuring smooth and unimpeded rotation. This results in a stable and vibration-free grinding process, preventing uneven grinding and improving both grinding efficiency and precision. Furthermore, the direct drive of the upper and lower grinding discs and planetary gears by the motors via gear sets results in a shorter transmission chain and a simpler structure.

[0140] Furthermore, the drive unit 422 includes an upper grinding disc support 4221, a rotary rod 4222, a rotary drive unit 4223, a lifting drive unit 4224, and a lifting seat 4226.

[0141] The rotary rod 4222 is vertically oriented and rotatable on the upper grinding disc support 4221. The main body of the rotary drive component 4223 is fixed on the upper grinding disc support 4221, and its drive end is connected to the rotary rod 4222 for driving the rotary rod 4222 to rotate. The lifting seat 4226 is rotatably sleeved on the rotary rod 4222. The main body of the lifting drive component 4224 is fixedly connected to the rotary rod 4222, and its drive end is connected to the lifting seat 4226 for driving the lifting seat 4226 to rise and fall. The upper grinding disc 421 is rotatably connected to the lifting seat 4226.

[0142] In the initial state, the rotary drive 4223 drives the rotary rod 4222, which in turn drives the lifting drive 4224, the lifting seat 4226, and the upper grinding disc 421 to rotate synchronously until the upper grinding disc 421 is in a clearance position. After the lower grinding disc 411 is loaded, the rotary drive 4223 drives the rotary rod 4222, which in turn drives the lifting drive 4224, the lifting seat 4226, and the upper grinding disc 421 to rotate synchronously until the upper grinding disc 421 is in the working position, with the upper grinding disc 421 coaxially positioned above the lower grinding disc 411. Subsequently, the lifting drive 4224 drives the lifting seat 4226 to lower the upper grinding disc 421. The mating hole 4211 of the upper grinding disc 421 is fitted onto the top of the upper grinding disc drive shaft 413, and the test sample to be ground is clamped between the upper grinding disc 421 and the lower grinding disc 411 for double-sided grinding of the test sample. After the sample to be tested is ground on both sides, the lifting drive 4224 drives the upper grinding disc 421 to rise and disengage from the upper grinding disc drive shaft 413. Then, the rotary drive 4223 drives the upper grinding disc 421 to rotate to a clearance position so that the robot component 5 can unload the sample to be tested after the double-sided grinding.

[0143] Specifically, the rotary drive component 4223 is a cylinder. The drive end of the rotary drive component 4223 is fixedly connected to a horizontally oriented rack 42231. The rack 42231 is slidably mounted on a rack guide rail fixed to the upper grinding disc support 4221 via a slider, thereby limiting the horizontal movement of the rack 42231. A gear 42221 is arranged on the outer periphery of the rotary rod 4222. When the drive end of the rotary drive component 4223 extends, it can drive the rotary rod 4222 to rotate through the meshing of the rack 42231 and the gear 42221.

[0144] Specifically, the rotary rod 4222 is rotatably connected to the upper grinding disc support 4221 via a bearing. The lifting seat 4226 is slidably sleeved on the outside of the rotary rod 4222 via a sliding bushing 4227.

[0145] More specifically, a vertically oriented sliding sleeve 42222 is fixedly mounted on the rotary rod 4222, and a guide rod 42223 is slidably mounted inside the sliding sleeve 42222. The guide rod 42223 is fixedly connected to the lifting seat 4226. When the lifting drive component 4224 drives the lifting seat 4226 to rise or fall, the lifting seat 4227 can drive the guide rod 42223 to rise or fall along the sliding sleeve 42222, thereby improving the lifting accuracy of the lifting seat 4226.

[0146] Specifically, the upper grinding head 42 also includes an upper grinding disc rotating sleeve 4229, which is fixedly connected to the lifting seat 4226. The top of the upper grinding disc 421 is fixedly connected to the upper grinding disc seat 4212, which is inserted into and rotatably connected to the upper grinding disc rotating sleeve 4229. When the top of the upper grinding disc drive shaft 413 is inserted into the mating hole 4211 of the upper grinding disc 421, the upper grinding disc drive shaft 413 can drive the upper grinding disc 421 and the upper grinding disc seat 4212 to rotate relative to the upper grinding disc rotating sleeve 4229.

[0147] Preferably, the upper grinding disc seat 4212 is rotatably connected to the upper grinding disc rotating sleeve 4229 via a self-aligning roller bearing 4228, so as to allow a certain amount of floating when the upper grinding disc 421 rotates, thereby keeping it parallel to the lower grinding disc 411.

[0148] Preferably, to improve grinding quality and facilitate separation of the upper grinding disc from the ground test sample, a communicating medium channel A is provided on the upper grinding disc base 4212 and the upper grinding disc, extending to the bottom of the upper grinding disc. Medium channel A is used to introduce cutting fluid into the test sample during the grinding process. Alternatively, it is used to blow air onto the test sample after grinding to prevent the test sample from sticking to the upper grinding disc, thus facilitating separation of the upper grinding disc from the test sample.

[0149] Specifically, the upper grinding disc seat 4212 has a cutting fluid medium channel A for introducing cutting fluid and a ventilation medium channel A for ventilation.

[0150] Specifically, the upper grinding disc seat 4212 and the medium channel A on the upper grinding disc are connected by a pipeline.

[0151] Furthermore, to improve the accuracy of double-sided grinding of the test sample, this embodiment further specifies:

[0152] A vertically oriented elastic probe 4225 is provided inside the upper grinding disc seat 4212, and the elastic probe 4225 is located above the mating hole 4211. When the upper grinding disc 421 is in the working position, the lifting drive 4224 can drive the upper grinding disc seat 4212 and the upper grinding disc 421 to descend. The elastic probe 4225 is used to detect the positioning information when it presses against the top of the upper grinding disc drive shaft 413, the pressure information of the upper grinding disc 421 pressing against the test sample, and the grinding thickness information of the test sample.

[0153] Specifically, the lifting drive component 4224 is a cylinder. An electromagnetic proportional valve is configured in the pneumatic system of the lifting drive component 4224.

[0154] The electromagnetic proportional valve is used to adjust the extension speed of the drive end of the lifting drive component 4224 according to the positioning information, thereby adjusting the descent speed of the upper grinding disc 421 and preventing damage from excessive speed impact. The electromagnetic proportional valve is also used to adjust the output pressure and speed of the drive end of the lifting drive component 4224 according to the pressure information, so that the mating hole 4211 of the upper grinding disc 421 can be properly engaged with the upper grinding disc drive shaft 413, and to adjust the pressure of the upper grinding disc 421 against the test sample to prevent damage to the test sample. The electromagnetic proportional valve is also used to adjust the extension amount of the drive end of the lifting drive component 4224 according to the grinding thickness information, thereby improving the accuracy of the grinding thickness of the test sample.

[0155] Specifically, the upper grinding head 41 also includes a controller, and the elastic probe 4225 and the electromagnetic proportional valve are all connected to the controller via wires.

[0156] When the elastic probe 4225 presses against the top of the upper grinding disc drive shaft 413, it can transmit readings to the controller. The controller obtains positioning information, pressure information and grinding thickness information based on the readings, and sends a control signal to the electromagnetic proportional valve. The electromagnetic proportional valve adjusts the extension amount, output pressure and speed of the lifting drive 4224 drive end.

[0157] See Figure 19 and 20 Furthermore, the robot component 5 includes a four-axis robotic arm 51 and a gripper 52 disposed on the four-axis robotic arm 51.

[0158] The material gripper 52 includes a first gripper 521 arranged in a ring and extending radially outward from the center, and a plurality of second grippers 522. The length of the first gripper 521 is greater than the length of the second grippers 522. Vacuum suction cups 523 are provided at the distal ends of the first gripper 521 and the plurality of second grippers 522.

[0159] The silicon rod sample is circular. Vacuum chucks 523 on the first clamping arm 521 and multiple second clamping arms 522 simultaneously adsorb the end face of the silicon rod sample to be cut, which increases the adsorption area, ensures gripping stability, and can be moved to the sample cutting mechanism 3 by the four-axis robotic arm 51. The cut test sample is located at the center of the silicon rod sample and is adsorbed by the vacuum chucks 523 on the first clamping arm 521, which can avoid the remaining silicon rod sample after cutting and the various components in the positioning part 31.

[0160] Preferably, the robot assembly 5 further includes an air blowing head 224 disposed on the four-axis robotic arm 51, the air blowing head 224 being connected to an air passage. The air blowing head 524 is used to blow air onto the silicon rod sample and the test sample before adsorbing them to clean them, so as to avoid interference from dust and debris.

[0161] Furthermore, this silicon rod sample preparation device also includes a dust collection component 8.

[0162] The dust collection component 8 is fixed on the support frame 12 and is used to collect the dust generated during the processing of the sample cutting mechanism 3 and the grinding mechanism 4.

[0163] Furthermore, the silicon rod sample preparation apparatus also includes a protective cover 102 and a protective net 101. The protective cover 102 is disposed around the base 11, the sample cutting mechanism 3, at least one grinding mechanism 4 and the robot assembly 5, and the protective net 101 is disposed around the loading mechanism 2 and the unloading mechanism 6.

[0164] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A silicon rod sample preparation apparatus, characterized in that, It includes a base (11), a feeding mechanism (2), a sample cutting mechanism (3), at least one grinding mechanism (4), a robot assembly (5), and a unloading mechanism (6), all of which are mounted on the base (11). The feeding mechanism (2) is used to transport the silicon rod sample to be processed to the feeding position; The sample cutting mechanism (3) is used to cut the central region of the silicon rod sample to form a test sample; The grinding mechanism (4) is used for double-sided grinding of the test sample; The feeding mechanism (6) is used to transport the double-sided ground test sample to the feeding position; The robot component (5) is used to transfer the silicon rod sample at the loading position to the sample cutting mechanism (3), transfer the test sample from the sample cutting mechanism (3) to the double-sided grinding mechanism, and transfer the double-sided ground test sample to the unloading mechanism (6).

2. The silicon rod sample preparation apparatus as described in claim 1, characterized in that, The feeding mechanism (2) includes a feeding slide rail (21), a feeding slide block (22), and a feeding tray (23); The loading slide (22) is slidably mounted on the loading slide rail (21), and the loading tray (23) is detachably mounted on the loading slide (22). A stepped slot (231) is opened on the top of the loading tray (23), and multiple slots in the stepped slot (231) are used to accommodate silicon rod samples of different sizes. The feeding mechanism (6) includes a feeding slide rail (61), a feeding slide block (62), and a feeding tray (63). The feeding slide (62) is slidably disposed on the feeding slide rail (61), and the feeding tray (63) is detachably disposed on the feeding slide (62). A slot (631) is opened on the top of the feeding tray (63), and the slot (631) is used to accommodate the test sample.

3. The silicon rod sample preparation apparatus as described in claim 1, characterized in that, The sample cutting mechanism (3) includes a positioning part (31) and a cutting part (32). The positioning part (31) includes a positioning disk (311) and a clamping head (312); the positioning disk (311) is vertical in axis and is used to place the silicon rod sample; the clamping head (312) is movably positioned above the positioning disk (311) and is used to selectively press against the top of the silicon rod sample placed on the positioning disk (311); The cutting part (32) is located on one side of the positioning part (31), and includes a three-axis drive (321) and a laser cutting head (322). The laser cutting head (322) is mounted on the three-axis drive (321), and the three-axis drive (321) is used to drive the laser cutting head (322) to move along the X, Y, and Z axes to the center area of ​​the silicon rod sample to cut and form the test sample.

4. The silicon rod sample preparation apparatus as described in claim 3, characterized in that, An opening (3111) is provided in the center of the positioning disk (311). Below the opening (3111) is a movable push rod (313) that can be raised and lowered. The top of the push rod (313) can switch between a feeding position, a support position and a top support position. When the top of the push rod (313) is in the feeding position, the top of the push rod (313) is lower than the top of the positioning plate (311); When the top of the push rod (313) is in the support position, the top of the push rod (313) is flush with the top of the positioning disk (311) to support the central area of ​​the silicon rod sample on the positioning disk (311). When the top of the push rod (313) is in the top support position, the top of the push rod (313) is higher than the top of the positioning plate (311) so as to push the test sample through the opening (3111) and detach it from the remaining silicon rod sample.

5. The silicon rod sample preparation apparatus as described in claim 1, characterized in that, The grinding mechanism (4) includes a lower grinding head (41) and an upper grinding head (42): The lower grinding head (41) includes an axially vertical lower grinding disc (411). The upper grinding head (42) is located on one side of the lower grinding head (41), and includes an upper grinding disc (421) and a driver (422). The upper grinding disc (421) can rotate around a vertical axis. The driver (422) drives the upper grinding disc (421) to rotate around another vertical axis to a clearance position and a working position, and can drive the upper grinding disc (421) to rise and fall. When the upper grinding disc (421) is in the clearance position, the upper grinding disc (421) is located on one side of the lower grinding disc (411); When the upper grinding disc (421) is in the working position, the upper grinding disc (421) is located above the lower grinding disc (411) and the upper grinding disc (421) and the lower grinding disc (411) are arranged coaxially. The test sample can be sandwiched between the upper grinding disc (421) and the lower grinding disc (411). The upper grinding disc (421) and the lower grinding disc (411) can rotate to grind the test sample on both sides.

6. The silicon rod sample preparation apparatus as described in claim 5, characterized in that, The lower grinding head (41) also includes at least one planetary gear (412). The planetary gear (412) is disposed on the lower grinding disc (411), and an insertion hole is provided on it for accommodating the test sample; The planetary gear (412) can drive the test sample contained therein to revolve around the axis of the lower grinding disk (411); or, the planetary gear (412) can drive the test sample to revolve around the axis of the lower grinding disk (411) and rotate on its own axis.

7. The silicon rod sample preparation apparatus as described in claim 5 or 6, characterized in that, The driver (422) includes an upper grinding disc support (4221), a rotary rod (4222), a rotary drive (4223), a lifting drive (4224), and a lifting seat (4226). The rotating rod (4222) is vertically oriented and rotatable on the upper grinding disc support (4221); the main body of the rotating drive (4223) is fixed on the upper grinding disc support (4221), and the drive end is connected to the rotating rod (4222) to drive the rotating rod (4222) to rotate; the lifting seat (4226) is rotatably sleeved on the outside of the rotating rod (4222); the main body of the lifting drive (4224) is fixedly connected to the rotating rod (4222), and the drive end is connected to the lifting seat (4226) to drive the lifting seat (4226) to rise and fall; the upper grinding disc (421) is rotatably connected to the lifting seat (4226).

8. The silicon rod sample preparation apparatus as described in claim 7, characterized in that, The lower grinding head (41) also includes an upper grinding disc drive shaft (413); the upper grinding disc drive shaft (413) and the lower grinding disc (411) are coaxial and can rotate through the lower grinding disc (411); a mating hole (4211) is opened in the center of the upper grinding disc (4211), and the mating hole (4211) is detachably sleeved on the upper grinding disc drive shaft (413); when the upper grinding disc (421) is in the working position, the mating hole (4211) is sleeved on the upper grinding disc drive shaft (413), and the upper grinding disc drive shaft (413) can drive the upper grinding disc (421) to rotate; A vertically oriented elastic probe (4225) is provided inside the lifting seat (4226), and the elastic probe (4225) is located above the mating hole (4211). When the upper grinding disc (421) is in the working position, the lifting drive (4224) can drive the lifting seat (4226) and the upper grinding disc (421) to descend. The elastic probe (4225) is used to detect the positioning information when it presses against the top of the upper grinding disc drive shaft (413), the pressure information of the upper grinding disc (421) pressing against the test sample, and the grinding thickness information of the test sample. The lifting drive component (4224) is a cylinder. The air circuit system of the lifting drive component (4224) is equipped with an electromagnetic proportional valve. The electromagnetic proportional valve is used to adjust the extension speed of the drive end of the lifting drive component (4224) according to the positioning information, adjust the output pressure of the drive end of the lifting drive component (4224) according to the pressure information, and adjust the extension amount of the drive end of the lifting drive component (4224) according to the grinding thickness information.

9. The silicon rod sample preparation apparatus as described in claim 1, characterized in that, The robot assembly (5) includes a four-axis robotic arm (51) and a gripper (52) disposed on the four-axis robotic arm (51). The gripper (52) includes a first gripper (521) arranged in a ring and extending radially outward from the center and a plurality of second grippers (522). The length of the first gripper (521) is greater than the length of the second gripper (522). Vacuum suction cups (523) are provided at the far ends of the first gripper (521) and the plurality of second grippers (522). The vacuum chucks (523) on the first clamping arm (521) and the plurality of second clamping arms (522) are used to adsorb the silicon rod sample, and the vacuum chucks (523) on the first clamping arm (521) are used to adsorb the test sample.

10. The silicon rod sample preparation apparatus as described in claim 1, characterized in that, Also includes: A support frame (12) fixed to the top of the base (11); A vision camera (7) is fixed on the support frame (12) to identify the position of the silicon rod sample and the test sample, as well as to identify the working status of the feeding mechanism (2), the sample cutting mechanism (3), the grinding mechanism (4), the robot assembly (5) and the unloading mechanism (6); A dust collection component (8) is fixed on the support frame (12) and is used to collect the dust generated during the processing of the sample cutting mechanism (3) and the grinding mechanism (4); The sample recycling mechanism (9) is fixed on the base (11) and located between the feeding mechanism (2) and the unloading mechanism (6) for receiving the silicon rod sample remaining after cutting and transferred by the robot assembly (5).

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