Wiring device
By setting a heat-conducting bracket in the wiring device and connecting it to the grounding bracket assembly, a heat conduction path is constructed, which solves the problems of high cost and low heat dissipation efficiency of existing wiring devices, realizes a common housing design for products of different power ranges, reduces production and management costs, and simplifies the disassembly process.
Patent Information
- Application Number
- CN202511705330.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-20
- Publication Date
- 2026-02-10
AI Technical Summary
Existing wiring devices suffer from high costs, difficult operation, and low heat dissipation efficiency. In particular, different housings and molds are required for products with different power ranges, leading to increased management costs.
By connecting the thermally conductive bracket to the grounding bracket assembly, heat is dissipated from the housing through the heat conduction path formed by the thermally conductive pad, thermally conductive bracket, and middle layer bracket, adapting to the heat dissipation needs of products with different power ranges, and sharing a common housing design.
It meets the heat dissipation requirements of products with different power ranges, reduces production and management costs, simplifies the disassembly process, and improves heat dissipation efficiency.
Smart Images
Figure CN121507474A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of electrical equipment, in particular to a wiring device. BACKGROUND
[0002] There are three common heat dissipation methods for current in-wall wiring devices: the first is to use internal glue filling for heat dissipation, that is, to form an integral whole of the core assembly and the shell by filling glue in the base; the second is to use built-in heat dissipation insulation sheets in combination with heat-conducting silicone pads for heat dissipation, that is, to sequentially arrange heat dissipation insulation sheets and heat-conducting silicone pads between the grounding frame and the core assembly, and the heat-conducting silicone pads are attached to the surface of the circuit board of the core assembly; and the third is to use metal materials for the shell. However, the above three schemes have defects: The first scheme has high production cost due to the glue filling process, and when the product needs to be repaired and disassembled due to failure, the presence of glue greatly increases the operation difficulty and cost; The second scheme has poor built-in heat dissipation efficiency, and as the application of high-power sockets is increasingly widespread, this scheme cannot meet the demand for high-efficiency heat dissipation; The third scheme has high cost due to the use of metal materials for the shell in a large area; and as different power segments of products have different heat dissipation needs, different shells need to be used for different power segments of products, which requires multiple molds, resulting in high cost and increased management cost.
[0003] Therefore, in view of the above-mentioned technical problems, it is necessary to propose a new technical scheme. SUMMARY
[0004] The present application aims to at least solve one of the deficiencies in the prior art, and proposes a wiring device that guides heat to the outside of the product for heat dissipation by arranging a heat-conducting bracket and connecting the heat-conducting bracket with the grounding frame assembly. The specific scheme is as follows: A wiring device includes a shell and a core assembly arranged in the shell, and further includes a heat-conducting pad, a heat-conducting bracket, a middle layer bracket, and a grounding frame assembly arranged in the shell. The heat-conducting pad is arranged on one side of the core assembly, the heat-conducting bracket is arranged on the side of the heat-conducting pad away from the core assembly, the middle layer bracket is arranged on the side of the heat-conducting bracket away from the heat-conducting pad, and the grounding frame assembly is arranged on the side of the middle layer bracket away from the heat-conducting bracket. The grounding frame assembly at least partially extends out of the shell, the middle layer bracket is provided with a heat-conducting hole, and the grounding frame assembly and the heat-conducting bracket are connected through the heat-conducting hole.
[0005] The aforementioned wiring device, through a built-in heat-conducting bracket connected to the grounding bracket assembly, allows heat inside the housing to be conducted to the outside of the housing via the heat-conducting pad, the heat-conducting bracket, and the grounding bracket assembly, thus achieving heat dissipation. In practical implementation, the heat dissipation needs of products with different power ranges can be met by selecting whether to install the heat-conducting bracket or using heat-conducting brackets of different materials. This allows multiple sets of products with different power ranges to share a single housing, effectively reducing costs and management expenses.
[0006] In one embodiment, the heat-conducting bracket is provided with at least one first bend, and the grounding bracket assembly is provided with at least one second bend, the first bend and the second bend being connected via the heat-conducting hole.
[0007] In one embodiment, the first bending portion has a first contact surface, the second bending portion has a second contact surface, the first bending portion is located on one side of the second bending portion, and the first contact surface is in contact with the second contact surface.
[0008] In one embodiment, the heat-conducting bracket is provided with two spaced-apart first bending portions, and the grounding bracket assembly is provided with two spaced-apart second bending portions, with the first bending portions and the second bending portions connected in a one-to-one correspondence.
[0009] In one embodiment, the thermally conductive bracket is a metal bracket, a thermally conductive silicone bracket, a thermally conductive rubber bracket, a thermally conductive plastic bracket, a graphene bracket, or a ceramic bracket. This application can meet the heat dissipation needs of products in different power ranges by selecting whether to install a thermally conductive bracket or using thermally conductive brackets made of different materials. For example, when the device power is less than 20W, the PCBA chassis generates less heat, so a thermally conductive bracket is not required. Air is used as the heat transfer medium, and the thermal pad transfers the heat from the PCBA chassis through the air and the thermal holes on the middle layer bracket to the grounding bracket assembly, which then dissipates the heat. When the device power is between 20W and 30W, the PCBA chassis generates more heat, so a thermally conductive bracket made of a material with low thermal conductivity, such as thermally conductive plastic, can be used. The thermal pad transfers the heat from the PCBA chassis to the grounding bracket assembly, which then dissipates the heat. When the socket power is greater than 30W, the PCBA chassis generates even more heat, so a thermally conductive bracket made of a material with high thermal conductivity, such as metal, can be used. The thermal pad transfers the heat from the PCBA chassis to the grounding bracket assembly, which then dissipates the heat.
[0010] In one embodiment, the metal support is a copper support or an aluminum support.
[0011] In one embodiment, the grounding frame assembly includes a grounding frame with both ends extending through the housing to the outside of the housing.
[0012] In one embodiment, it further includes a socket piece assembly, wherein the middle support is provided with a socket piece receiving groove, the socket piece assembly is disposed in the socket piece receiving groove, and the socket piece assembly is electrically connected to the movement assembly.
[0013] In one embodiment, it further includes an output interface component, wherein an output interface receiving slot is provided on the middle layer bracket, the output interface component is disposed in the output interface receiving slot, the output interface component is electrically connected to the mechanism component, the output interface component includes one or more USB interfaces, and the housing is provided with an opening corresponding to the USB interface.
[0014] In one embodiment, it further includes a safety door assembly disposed within the housing, the safety door assembly being disposed on the side of the grounding frame assembly opposite to the middle support. Attached Figure Description
[0015] Figure 1 This is an exploded structural diagram of the wiring device provided in the embodiments of this application; Figure 2 This is a cross-sectional view of the wiring device provided in an embodiment of this application; Figure 3 This is a partial internal structure diagram of the wiring device provided in the embodiments of this application; Figure 4 This is a top view of the mid-layer support structure provided in an embodiment of this application; Figure 5 A bottom view of the mid-layer support structure provided in the embodiments of this application; Figure 6 A cross-sectional view of the assembly between the heat-conducting bracket and the grounding bracket provided in the embodiment of this application; Figure 7 This is a top view of the wiring device provided in an embodiment of this application.
[0016] Among them, 1-shell, 11-top cover, 111-grounding socket, 112-socket, 113-opening, 12-base, 121-sunken groove, 2-mechanical assembly, 21-mechanical circuit board, 211-fixing hole, 3-thermal pad, 4-thermal support, 41-first bend, 42-first contact surface, 5-middle support, 51-thermal hole, 52-socket piece receiving groove, 53-output interface receiving groove, 54-threaded hole, 55-thermal support receiving groove, 6-grounding frame assembly, 61-grounding frame, 611-second bend, 612-second contact surface, 613-through hole, 62-grounding socket piece, 63-grounding wire clamping piece, 64-grounding screw, 7-socket piece assembly, 71-socket piece, 72-wiring assembly, 8-output interface assembly, 81-USB interface, 82-output circuit board, 9-safety door assembly. Detailed Implementation
[0017] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0018] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0020] This embodiment provides a wiring device, which includes a housing 1 and a mechanism assembly 2 disposed within the housing 1. The housing 1 includes a top cover 11 and a base 12, the top cover 11 and the base 12 being fixedly connected, forming an accommodating space between the top cover 11 and the base 12, such as... Figure 1 and Figure 2As shown. The movement assembly 2 includes a movement circuit board 21 and various components disposed on the movement circuit board 21. Since both the housing 1 and the movement assembly 2 can be implemented using existing technology, and their specific structures are not the focus of this application, they will not be described in detail in this application.
[0021] The wiring device also includes a thermally conductive pad 3, a thermally conductive bracket 4, a middle layer bracket 5, and a grounding bracket assembly 6. The thermally conductive pad 3, the thermally conductive bracket 4, and the middle layer bracket 5 are all disposed within the housing 1. The thermally conductive pad 3 can be a thermally conductive silicone pad or made of thermally conductive adhesive. The thermally conductive pad 3 is disposed on one side of the movement assembly 2, specifically tightly attached to the surface of the movement circuit board 21 of the movement assembly 2, filling the gaps on the surface of the movement circuit board 21, thereby conducting heat from the movement assembly 2. Figure 2 As shown.
[0022] The thermally conductive bracket 4 is disposed on the side of the thermally conductive pad 3 opposite to the core assembly 2. The middle layer bracket 5 is disposed on the side of the thermally conductive bracket 4 opposite to the thermally conductive pad 3. The grounding bracket assembly 6 is disposed inside the housing 1 and partially passes through the housing 1 to the outside of the housing 1. The grounding bracket assembly 6 is located on the side of the middle layer bracket 5 opposite to the thermally conductive bracket 4. The middle layer bracket 5 is provided with a thermally conductive hole 51, and the grounding bracket assembly 6 is connected to the thermally conductive bracket 4 through the thermally conductive hole 51. For example... Figure 2 and Figure 3 In the schematically illustrated embodiment, the base 12 has a recessed groove 121 near the opening, and the middle layer support 5 is embedded in the recessed groove 121. The middle layer support 5 has two heat-conducting holes 51 that penetrate vertically through the middle layer support 5. Figure 4 and Figure 5 As shown. The thermally conductive support 4 is sheet-shaped and is tightly attached to the surface of the thermally conductive pad 3, as shown. Figure 1 and Figure 2 As shown, the heat-conducting bracket 4 is provided with two spaced-apart first bending portions 41, which extend in a direction away from the heat-conducting pad 3 to the heat-conducting hole 51. The outer sidewalls of the two first bending portions 41 are planar structures, forming a first contact surface 42.
[0023] The grounding frame assembly 6 includes a grounding frame 61 and grounding socket piece 62, grounding wire clamp piece 63, and grounding screw 64 disposed on the grounding frame 61. The upper cover 11 is provided with a grounding socket hole 111 corresponding to the grounding socket piece 62, such as... Figure 1 and Figure 7As shown. Both ends of the grounding bracket 61 extend through the housing 1 to the outside of the housing 1. Since the grounding bracket assembly 6 is a conventional structure, and the main improvement in this application is the provision of a second bend 611 on the grounding bracket 61 that can connect with the first bend 41, the installation method and other structures of the grounding bracket assembly 6 will not be described in detail in this application. Figure 1 and Figure 2 As shown in the figure, an embodiment is schematically illustrated. The grounding bracket 61 has two spaced-apart second bends 611 extending towards the heat-conducting hole 51 near the heat-conducting pad 3. Each of the two second bends 611 corresponds to one of the two first bends 41, and the inner walls of the two second bends 611 are planar structures, forming a second contact surface 612. The dimensions of the heat-conducting hole 51 and each bend are designed so that after the first bend 41 and the second bend 611 are inserted into the corresponding heat-conducting hole 51, the first contact surface 42 and the second contact surface 612 can fit tightly together. Figure 2 and Figure 6 As shown.
[0024] Of course, the above is only one embodiment. In other embodiments, the number of the first bending portion 41 and the second bending portion 611 is not limited to two; it can also be one, three, four, or more. Their specific number and placement can be adjusted according to design requirements. The contact surface between the first bending portion 41 and the second bending portion 611 is also not limited to the one described above; it can also be flexibly adjusted according to design requirements. For example, the inner wall of the first bending portion 41 can be tightly fitted with the outer wall of the second bending portion 611. Furthermore, to ensure smooth insertion between the first bending portion 41 and the second bending portion 611, the end corners of the first bending portion 41 or the second bending portion 611 can be chamfered.
[0025] In practical implementation, the choice between installing the heat-conducting bracket 4 and selecting one made of a material with different thermal conductivity can be made based on the device's heat dissipation requirements. The heat-conducting bracket 4 can be a metal bracket, such as a copper or aluminum bracket. Alternatively, it can be a non-metallic heat-conducting material bracket, such as a thermally conductive silicone bracket, a thermally conductive rubber bracket, a thermally conductive plastic bracket, a graphene bracket, or a ceramic bracket. This design can meet the heat dissipation needs of products with different power ranges. For example, when the device power is less than 20W, the heat generated by the core component 2 is relatively small, so the heat-conducting bracket 4 is not required. Air is used as the heat-conducting medium, and the heat-conducting pad 3 transfers the heat from the core component 2 through the heat-conducting holes 51 on the middle layer bracket 5 to the grounding bracket 6, where the heat is dissipated. When the device power is between 20W and 30W, the heat generated by the core component 2 increases, so the heat-conducting bracket 4 can be made of a material with low thermal conductivity, such as thermally conductive plastic. The heat-conducting pad 3 transfers the heat from the core component 2 through the heat-conducting bracket 4 to the grounding bracket 6, where the heat is dissipated. When the socket power is greater than 30W, the heat generated by the core component 2 is relatively large, so the heat-conducting bracket 4 can be made of a material with high thermal conductivity, such as metal. The heat-conducting pad 3 transfers the heat from the core component 2 through the heat-conducting bracket 4 to the grounding bracket 6, where the heat is dissipated.
[0026] The aforementioned wiring device, through the built-in heat-conducting bracket 4 and its connection to the grounding bracket assembly 6, allows heat within the housing 1 to be conducted to the outside of the housing 1 via the heat-conducting pad 3, the heat-conducting bracket 4, and the grounding bracket assembly 6, thus achieving heat dissipation. In practical implementation, the heat dissipation needs of products with different power ranges can be met by selecting whether to install the heat-conducting bracket 4 or using heat-conducting brackets 4 made of different materials. This allows multiple sets of products with different power ranges to share a single housing 1, effectively reducing costs and management expenses.
[0027] In a further embodiment, the movement assembly 2 is fixedly connected to the middle layer support 5. For example, the movement circuit board 21 of the movement assembly 2 can be fixedly connected to the middle layer support 5 using fasteners such as screws. Specifically, fixing holes 211 can be formed on the movement circuit board 21, such as... Figure 1 As shown, a threaded hole 54 is provided at the bottom end of the middle layer bracket 5, such as... Figure 5 As shown, screws are then threaded through the fixing hole 211 and threaded into the threaded hole 54 on the middle layer bracket 5 to secure the product. This design makes disassembly and assembly convenient when the product malfunctions and needs to be reworked.
[0028] In one embodiment, a heat-conducting bracket receiving groove 55 may also be provided at the bottom of the middle layer bracket 5, and the heat-conducting hole 51 is disposed in the heat-conducting bracket receiving groove 55 and communicates with the heat-conducting bracket receiving groove 55, such as... Figure 5 As shown. The shape of the heat-conducting bracket receiving groove 55 matches the shape of the heat-conducting bracket 4. During assembly, the heat-conducting bracket 4 is embedded in the heat-conducting bracket receiving groove 55, as shown. Figure 2 As shown. This design effectively ensures the stability of the heat-conducting bracket 4 during installation.
[0029] In one embodiment, the middle support 5 is further provided with a socket receiving groove 52, such as... Figure 3 and Figure 4 As shown. A socket piece assembly 7 is provided in the socket piece receiving slot 52. The socket piece assembly 7 is electrically connected to the mechanism assembly 2. Specifically, two socket piece receiving slots 52 are provided on the middle layer bracket 5, and each socket piece receiving slot 52 is provided with a socket piece assembly 7, one for the live wire and the other for the neutral wire, for connection to the live wire and the neutral wire respectively. The socket piece assembly 7 includes a socket piece 71 and a wiring assembly 72. The upper cover 11 is provided with a socket hole 112 corresponding to the socket piece 71. Since the socket piece assembly 7 can be implemented using existing technology, and its specific structure, fixing method and connection method with the mechanism assembly 2 are not the focus of this application, they will not be described in detail in this application.
[0030] In one embodiment, a safety door assembly 9 may also be provided within the housing 1, on the side of the grounding bracket assembly 6 opposite to the middle support 5, specifically between the upper cover 11 and the socket plate assembly 7. Figure 1 As shown. It can prevent the incorrect insertion of foreign objects or inserts, thereby further improving safety and effectively avoiding electric shock accidents. Since the safety door assembly 9 can be implemented using existing technology, and its specific structure and installation method are not the focus of this application, they will not be described in detail here.
[0031] In one embodiment, the wiring device may also be provided with an output interface component 8. For example... Figure 4 As schematically shown, the middle support 5 has an output interface receiving slot 53 provided between the two socket receiving slots 52, and the output interface assembly 8 is disposed within the output interface receiving slot 53, as shown. Figure 3 As shown. The output interface assembly 8 is electrically connected to the mechanism assembly 2. The output interface assembly 8 includes an output circuit board 82 and a USB interface 81 disposed on the output circuit board 82, for example... Figure 1 and Figure 3The diagram shows two Type-A ports and one Type-C port, with the Type-C port positioned between the two Type-A ports. Each port is electrically connected to the output circuit board 82. A through-hole 613 is provided in the middle of the grounding bracket 61, through which the Type-C port passes. The upper cover 11 has openings 113 corresponding to each USB port 81, as shown below. Figure 1 and Figure 7 As shown. Of course, the above is only one embodiment. In other embodiments, the output interface component 8 may also be provided with one or more USB interfaces 81, and the specific type of the USB interface 81 can also be flexibly set as needed. Since the output interface component 8 can be implemented using existing technology, and its specific structure and installation method are not the focus of this application, it will not be described in detail in this application.
[0032] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0033] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A wiring device comprising a housing (1) and a mechanism assembly (2) disposed within the housing (1), characterized in that, The wiring device further includes a thermal pad (3), a thermal support (4), a middle support (5), and a grounding frame assembly (6) disposed within the housing (1). The thermal pad (3) is disposed on one side of the mechanism assembly (2). The thermal support (4) is disposed on the side of the thermal pad (3) away from the mechanism assembly (2). The middle support (5) is disposed on the side of the thermal support (4) away from the thermal pad (3). The grounding frame assembly (6) is disposed on the side of the middle support (5) away from the thermal support (4). The grounding frame assembly (6) extends at least partially out of the housing (1). The middle support (5) is provided with a thermal hole (51). The grounding frame assembly (6) is connected to the thermal support (4) through the thermal hole (51).
2. The wiring device according to claim 1, characterized in that, The heat-conducting bracket (4) is provided with at least one first bend (41), and the grounding bracket assembly (6) is provided with at least one second bend (611). The first bend (41) and the second bend (611) are connected through the heat-conducting hole (51).
3. The wiring device according to claim 2, characterized in that, The first bending portion (41) has a first contact surface (42), and the second bending portion (611) has a second contact surface (612). The first bending portion (41) is located on one side of the second bending portion (611), and the first contact surface (42) is in contact with the second contact surface (612).
4. The wiring device according to claim 2 or 3, characterized in that, The heat-conducting bracket (4) is provided with two spaced-apart first bending portions (41), and the grounding bracket assembly (6) is provided with two spaced-apart second bending portions (611). The first bending portions (41) and the second bending portions (611) are connected in a one-to-one correspondence.
5. The wiring device according to claim 1, characterized in that, The thermally conductive bracket (4) is a metal bracket, a thermally conductive silicone bracket, a thermally conductive rubber bracket, a thermally conductive plastic bracket, a graphene bracket, or a ceramic bracket.
6. The wiring device according to claim 5, characterized in that, The metal support is a copper support or an aluminum support.
7. The wiring device according to claim 1, characterized in that, The grounding frame assembly (6) includes a grounding frame (61) with both ends of the grounding frame (61) extending through the housing (1) to the outside of the housing (1).
8. The wiring device according to claim 1, characterized in that, It also includes a socket piece assembly (7), on which a socket piece receiving groove (52) is provided, and the socket piece assembly (7) is disposed in the socket piece receiving groove (52), and the socket piece assembly (7) is electrically connected to the mechanism assembly (2).
9. The wiring device according to claim 1, characterized in that, It also includes an output interface component (8), on which an output interface receiving slot (53) is provided, and the output interface component (8) is disposed in the output interface receiving slot (53). The output interface component (8) is electrically connected to the mechanism component (2). The output interface component (8) includes one or more USB interfaces (81), and the housing (1) is provided with an opening (113) corresponding to the USB interface (81).
10. The wiring device according to claim 1, characterized in that, It also includes a safety door assembly (9), which is disposed inside the housing (1) and is located on the side of the grounding frame assembly (6) away from the middle support (5).