Special-shaped surface intelligent heat dissipation device based on piezoelectric driving and flexible vapor chamber

Abstract

The invention belongs to the technical field of heat dissipation, and relates to a special-shaped surface intelligent heat dissipation device based on piezoelectric driving and a flexible temperature-uniforming plate, and the device comprises the flexible temperature-uniforming plate of which the bottom surface is used for conformally fitting with a heat source, and guiding out the heat of the heat source; the piezoelectric synthesis jet device array is arranged on the top surface of the flexible uniform temperature plate, and the piezoelectric synthesis jet device array comprises a plurality of piezoelectric synthesis jet devices which are arranged in a matrix mode; the partition temperature sensing system comprises a plurality of temperature sensors which are embedded in the flexible vapor chamber in a distributed mode, the temperature sensors are used for obtaining the temperature of corresponding points, and the temperature sensors correspond to the piezoelectric synthesis jet devices one to one; and the intelligent control unit is electrically connected with the temperature sensor and the piezoelectric synthesis jet device and is used for controlling the working state of the corresponding piezoelectric synthesis jet device according to the temperature feedback of the temperature sensor. The heat dissipation resource utilization rate is extremely high, hot spots can be effectively restrained, the equipment performance consistency is improved, meanwhile, the structure is extremely compact, and the integration degree is high.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology, specifically relating to an intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat exchange plate. Background Technology

[0002] As electronic devices evolve towards higher power, smaller size, and irregular shapes, their heat dissipation issues are facing unprecedented challenges.

[0003] Currently, heat dissipation solutions for heat sources on irregularly shaped or complex surfaces mainly rely on the following technical approaches, but each of them has obvious limitations: Traditional forced air cooling technology uses a "fan + fin" heat dissipation module. It uses an axial fan to drive airflow through a fixed fin array to remove heat. However, due to the low thermal conductivity and specific heat capacity of air, the overall heat exchange efficiency is limited and it is difficult to cope with the continuously increasing heat flux density. At the same time, due to the inertia of the fan's start-stop and speed adjustment, it cannot respond quickly to the instantaneous heat pulses generated when working intermittently on irregular surfaces.

[0004] Liquid cooling and microchannel cooling technologies use coolant to circulate in closed pipes or microchannel cold plates, utilizing the high specific heat capacity of the liquid for heat dissipation. The heat dissipation efficiency is much higher than that of air cooling, but the system is complex, bulky, and has poor applicability.

[0005] Conventional heat pipe and vapor chamber technology utilizes the principle of phase change heat transfer and has an extremely high equivalent thermal conductivity, enabling it to quickly diffuse heat from point or line heat sources to a larger area. However, its rigid structure makes it difficult to adapt to the internal layout of non-planar or irregularly shaped surfaces with complex geometries.

[0006] Single piezoelectric fan technology uses the inverse piezoelectric effect of piezoelectric ceramics to drive flexible blades to vibrate at high frequency, disturbing the boundary layer air and thus enhancing local heat transfer. It is usually only effective in a very small area near the blade tip and belongs to the "local enhancement" technology, which is difficult to solve the problem of "overall temperature uniformity" of the entire module.

[0007] In summary, there is an urgent need for a compact heat dissipation solution that can both conform to irregular surfaces and achieve efficient heat dissipation, and actively, precisely, and dynamically control local hot spots for high-power, miniaturized, and irregularly shaped electronic devices. Summary of the Invention

[0008] In view of this, the present invention provides an intelligent heat dissipation device for irregular surfaces based on piezoelectric drive and flexible heat exchange plate, which solves the technical problems in the prior art.

[0009] The technical solution of this invention is: A smart heat dissipation device for irregularly shaped surfaces based on piezoelectric actuation and a flexible heat exchange plate, comprising: The flexible heat spreader has its bottom surface conformally fitted to the heat source to conduct heat away from the heat source; A piezoelectric synthesizing jet array is disposed on the top surface of the flexible heat exchange plate. The piezoelectric synthesizing jet array includes multiple piezoelectric synthesizing jets arranged in a matrix. The zoned temperature sensing system includes multiple distributed temperature sensors embedded in the flexible temperature distribution plate. The temperature sensors are used to acquire the temperature at corresponding points, and each temperature sensor corresponds to a piezoelectric synthesizer jet. The intelligent control unit is electrically connected to the temperature sensor and the piezoelectric synthesizing jet, and is used to control the working state of the corresponding piezoelectric synthesizing jet based on the temperature feedback from the temperature sensor.

[0010] Furthermore, the flexible heat spreader includes two spaced-apart first and second plastic metal sheets. The first and second plastic metal sheets are encapsulated by laser welding to form a vacuum cavity in the middle. The vacuum cavity is filled with a working fluid and has a capillary wick structure that extends in a multi-ring or grid pattern.

[0011] Furthermore, the first and second malleable metal sheets are copper foils.

[0012] Furthermore, the arrangement density of the plurality of piezoelectric synthetic jets is positively correlated with the expected heat flux density distribution in the heat source contact area.

[0013] Furthermore, a flexible support structure is provided between the piezoelectric synthesizing jet and the flexible heat spreader to provide mechanical support and promote heat conduction. The flexible support structure includes multiple support columns with one end connected to the shell of the piezoelectric synthesizing jet, and the other end of the support column is fixed to the upper surface of the flexible heat spreader through a thermally conductive interface material. The multiple support columns are distributed on the edge or corner of the shell of the piezoelectric synthesizing jet. The support column is a hollow cylinder and the material is a highly thermally conductive flexible polymer composite material.

[0014] Furthermore, the thermal interface material is a high thermal conductivity phase change material pad, which is bonded to the flexible heat spreader.

[0015] Furthermore, a high thermal conductivity adhesive layer is provided between the piezoelectric synthesizing jet generator and the flexible heat spreader, and the material of the high thermal conductivity adhesive layer is a phase change thermal conductive material.

[0016] Furthermore, the flexible heat spreader is provided with fins around its perimeter for combined active and passive heat dissipation, and the fins are located on the airflow path generated by the piezoelectric synthesizer jet.

[0017] Furthermore, the upper surface of the flexible heat spreader is a non-smooth curved surface with an uneven structure.

[0018] Furthermore, it also includes a mesh for fixing the piezoelectric synthesizer and providing electrical connection, the mesh being composed of an elastic matrix and conductive metal wires embedded therein; the elastic matrix is ​​provided with mounting holes corresponding to each piezoelectric synthesizer, and each piezoelectric synthesizer is assembled in the corresponding mounting hole; the conductive metal wire network is electrically connected to the electrodes of each piezoelectric synthesizer.

[0019] Compared with existing technologies, this invention provides an intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible vapor chamber. Applied to high-power heat-generating equipment such as lasers and computer motherboard CPU cooling, it innovatively integrates a flexible vapor chamber with a piezoelectric synthetic jet array. The flexible vapor chamber utilizes the phase change absorption of its internal working fluid (paraffin / expanded graphite composite shaped phase change material) to rapidly diffuse the extremely high heat flux density generated by local hot spots laterally, reducing its peak temperature and achieving preliminary "surface temperature uniformity." The distributed piezoelectric synthetic jets act as an active intervention method, like a "fixed-point firefighting team," providing directional and efficient jet impact cooling to residual or newly formed high-temperature areas based solely on the instructions of temperature sensor 5, achieving "point-to-point" cooling. This two-stage heat dissipation mode of "passive temperature equalization + active precision strike" achieves a qualitative leap from "global uniform heat dissipation" to "local dynamic thermal regulation." It has extremely high heat dissipation resource utilization, effectively suppresses hot spots, and improves the consistency of equipment performance. At the same time, the flexible heat dissipation plate can conform to complex surfaces, and the unique combination of support columns and phase change material pads ensures the stability of mechanical connections while perfectly solving the problem of low thermal resistance connection under bending deformation. The overall device structure is extremely compact and highly integrated, and can be directly integrated into the equipment. It is very suitable for portable or irregularly shaped devices with limited space, has strong practicality, and is worth promoting. Attached Figure Description

[0020] Figure 1 This is an exploded view of the overall structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the structure of a flexible temperature distribution plate.

[0022] Figure 3 This is a schematic diagram of the internal structure of a flexible temperature distribution plate.

[0023] Figure 4 This is a schematic diagram of the grid structure.

[0024] Figure 5 Schematic diagram of a piezoelectric synthesizer jet with supporting columns Figure 1 .

[0025] Figure 6 Schematic diagram of a piezoelectric synthesizer jet with supporting columns Figure 2 .

[0026] Figure 7 This is an overall structural diagram of the present invention.

[0027] Figure label: 1-Flexible heat spreader, 101-First malleable metal sheet, 102-Second malleable metal sheet, 103-Capillary core structure, 104-Vacuum cavity, 2-Piezoelectric synthesis jet array, 201-Piezoelectric diaphragm, 202-Jet cavity, 203-Nozzle, 3-Flexible support structure, 4-Grid, 5-Temperature sensor, 6-Fin. Detailed Implementation

[0028] This invention provides an intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat spreader to solve the above-mentioned problems. In order to enable those skilled in the art to better understand the technical solution of this invention and implement it, the technical solution of this invention will be clearly and thoroughly described below with reference to the accompanying drawings.

[0029] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] Furthermore, it should be further explained that in the description of the embodiments of the present invention, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present invention, "multiple" means two or more.

[0031] The terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0035] Example 1 A smart heat dissipation device for irregularly shaped surfaces based on piezoelectric actuation and a flexible heat spreader, the structure of which is as follows: Figure 1 and Figure 7 As shown, the system includes a flexible heat exchanger plate 1, a piezoelectric jet generator array 2, a zoned temperature sensing system, and an intelligent control unit. The bottom surface of the flexible heat exchanger plate 1 is conformally bonded to the heat source (such as a curved circuit board) using thermal paste to dissipate heat from the heat source. Multiple temperature sensors 5 are installed inside the flexible heat exchanger plate 1 to detect the temperature of corresponding points on the flexible heat exchanger plate 1 in zones. The multiple temperature sensors 5 constitute the zoned temperature sensing system. The piezoelectric jet generator array 2 is located on the top surface of the flexible heat exchanger plate 1 and includes multiple piezoelectric jet generators arranged in a matrix. The temperature sensors 5 and the piezoelectric jet generators are electrically connected to the intelligent control unit, which independently controls the working state of the corresponding piezoelectric jet generator based on the temperature feedback from the temperature sensors 5, thereby enhancing heat transfer.

[0036] Specifically, the temperature sensor 5 can be a miniature NTC thermistor, whose position corresponds one-to-one with the piezoelectric synthesizing jet to form a zoned temperature sensing system, and is arranged in a dot matrix within the flexible heat spreader 1.

[0037] Specifically, such as Figure 2 and Figure 3 As shown, the flexible heat spreader 1 can be bent or fitted according to the surface shape of the heat source. The structure includes two spaced-apart first plastic metal sheets 101 and second plastic metal sheets 102. The first plastic metal sheets 101 and second plastic metal sheets 102 are encapsulated by laser welding to form a cavity structure in the middle. The cavity structure is evacuated to form a vacuum chamber 104. The vacuum chamber 104 is filled with an appropriate amount of circulating working fluid for heat dissipation. The vacuum chamber 104 has a capillary structure 103, which is evenly distributed in the sealed vacuum chamber 104.

[0038] It should be noted that the capillary wick structure inside the vacuum chamber 104 is a multi-ring loop or grid-like extended structure, and the capillary wick structure 103 is sintered from copper powder.

[0039] When a heat source generates a hot spot, the working fluid at that point evaporates. Under the action of pressure difference, the working fluid diffuses to the low-temperature zone and condenses. The heat flows back through the capillary wick structure 103, thereby achieving efficient surface temperature uniformity.

[0040] Specifically, the first malleable metal sheet 101 and the second malleable metal sheet 102 are copper foils with a thickness of 0.4mm-0.6mm, preferably 0.5mm. Because copper foils are soft, they can be bent to fit the surface shape of the heat source.

[0041] Furthermore, the working fluid is a composite shaped phase change material made of paraffin or expanded graphite.

[0042] A piezoelectric jet generator array 2 is attached to the top surface of the flexible heat spreader 1 via a thermally conductive adhesive layer. The array 2 contains multiple piezoelectric jet generators arranged in an M×N matrix. The arrangement density of these jet generators is positively correlated with the expected heat flux density distribution in the heat source contact area; that is, a denser arrangement of piezoelectric jet generators is placed in areas with expected high heat flux density. Each piezoelectric jet generator is associated with a temperature sensor 5.

[0043] Piezoelectric synthesizers are mature functional devices that can be purchased through selection. They "draw in" and "jet out" fluid into a fixed-volume cavity through periodic vibration, thus generating a jet with net momentum output without net mass input. The basic structure consists of a cavity with an outlet orifice, a vibrating diaphragm that periodically changes the cavity volume, and a drive circuit. Its essence lies in converting mechanical vibration energy into fluid kinetic energy through periodic reciprocating motion, and using the fluid dynamics characteristics (the self-sustaining motion of the vortex ring) to generate net thrust or flow effect. Its simplicity, lack of moving parts (compared to traditional fans), and low power consumption make it highly attractive in the field of microflow control.

[0044] Specifically, such as Figure 5 and Figure 6 As shown, the piezoelectric synthetic jet generator includes a housing, a jet cavity 202 located inside the housing, a piezoelectric diaphragm 201 disposed in the jet cavity 202, and a nozzle 203 disposed on one side of the housing and connected to the jet cavity 202. When an alternating voltage is applied to the piezoelectric diaphragm 201, the piezoelectric diaphragm 201 vibrates rapidly up and down due to the inverse piezoelectric effect (similar to a miniature piston). The vibration of the piezoelectric diaphragm 201 causes the volume inside the jet cavity 202 to change periodically—when the internal pressure of the cavity increases, the fluid is squeezed; when the internal pressure decreases, the fluid flows back to replenish, realizing fluid pulsation in the cavity. This periodically squeezes and draws in air inside the jet cavity 202. Under the action of the pressure difference in the jet cavity 202, the fluid forms a directional, high-speed pulsed synthetic jet through the nozzle 203, directly impacting the surface of the flexible heat exchanger 1 or driving the surrounding fluid to flow, thereby achieving enhanced heat transfer.

[0045] Preferably, the piezoelectric diaphragm 201 is a bimorph structure composed of a circular piezoelectric ceramic sheet and a metal substrate, and its resonant frequency is in the range of 100Hz to 2000Hz.

[0046] The key is that the piezoelectric synthesizing jet injector is mounted on the flexible heat spreader plate 1 via a flexible support structure 3. The flexible support structure 3 includes multiple support columns connected to the bottom of the piezoelectric synthesizing jet injector housing. The other end of each support column is fixed to the upper surface of the flexible heat spreader plate 1 via a thermally conductive interface material, with three points defining a plane to ensure installation stability. The support columns should be distributed at the edges or corners of the housing, avoiding the central micro-nozzle 203 recirculation area.

[0047] Furthermore, the number of support columns is preferably four, and the four support columns are evenly distributed at the bottom of the piezoelectric synthesizing jet housing.

[0048] The support column is a hollow cylinder. The hollow structure can provide a certain amount of flexible deformation space and reduce weight. The support column is slightly higher than the expected gap between the bottom of the piezoelectric synthesis jet and the heat spreader plate at maximum bending. It should be as thin as possible while ensuring structural strength, preferably 0.5mm-1mm, to facilitate radial deformation.

[0049] The support column is made of a highly thermally conductive flexible polymer composite material, which gives it both good elasticity to adapt to bending and an axial thermal conductivity of 3W / (m·K) to 10W / (m·K).

[0050] Specifically, the matrix of the high thermal conductivity flexible polymer composite material is silicone or thermoplastic polyurethane, which have good elasticity and bendability. The filler is selected by filling the polymer matrix with a high proportion of thermally conductive fillers, such as boron nitride, alumina or graphene. The goal is to make the thermal conductivity of the composite material reach 3W / (m·K) to 10W / (m·K) while maintaining excellent flexibility.

[0051] Furthermore, in order to improve thermal conductivity, a high thermal conductivity phase change material pad is placed at the lower end of the support column, and the high thermal conductivity phase change material pad is bonded to the flexible heat spreader 1.

[0052] Specifically, the material of the high thermal conductivity phase change material pad is a high thermal conductivity paraffin-based composite phase change material. High thermal conductivity paraffin-based composite phase change material is a commonly used interfacial phase change material. During preparation, it needs to be combined with tackifiers such as terpene resin and rosin. At room temperature, the high thermal conductivity paraffin-based composite phase change material is solid. After reaching the phase change point, it softens into a gel state, which can fill the gap between the support column and the heat spreader. The phase change temperature of the high thermal conductivity paraffin-based composite phase change material is 70℃ to 80℃, and the thermal conductivity is 0.8W / (m·K) to 2.5W / (m·K), which meets the "high thermal conductivity" requirement and is suitable for the bending scenario of the flexible heat spreader 1 without restricting its deformation.

[0053] At room temperature, the high thermal conductivity phase change material pad is solid, providing sufficient adhesion. When the temperature rises to its phase change point, such as 75°C, the material softens or becomes gel-like, perfectly filling all the microscopic gaps between the support pillars and the surface of the heat spreader, which is no longer completely flat due to bending, forming an interface with extremely low thermal resistance, while not restricting the bending of the heat spreader.

[0054] Furthermore, the control strategy of the intelligent control unit is as follows: when the temperature of a certain zone exceeds the first set threshold, the piezoelectric synthesizing jet generator at the corresponding position is turned on to enhance heat dissipation; when the temperature exceeds the higher second set threshold, the driving voltage or frequency of the piezoelectric synthesizing jet generator is increased to enhance the jet intensity.

[0055] The intelligent control unit is electrically connected to all temperature sensors 5 and piezoelectric diaphragm 201. The control strategy of the intelligent control unit is as follows: A first temperature threshold T1 and a second temperature threshold T2 are preset, and T2>T1; when the temperature T≥T1 of a certain zone, the intelligent control unit outputs a rated voltage to the piezoelectric synthesizing jet at the corresponding position to start it working; when T≥T2, the intelligent control unit increases the driving voltage of the piezoelectric synthesizing jet or adjusts the driving frequency to near its resonant point to maximize its jet velocity and heat dissipation intensity.

[0056] Furthermore, the piezoelectric synthesizing jet generator and the surface of the flexible heat spreader 1 are bonded together with a high thermal conductivity adhesive to form a high thermal conductivity adhesive layer. The high thermal conductivity adhesive layer is a phase change thermal conductive material to ensure that the interfacial thermal resistance between the piezoelectric synthesizing jet generator shell and the flexible heat spreader 1 is sufficiently low.

[0057] Furthermore, to optimize heat dissipation, the device also adds a fin 6 for combined active and passive heat dissipation. The fin is located on the airflow path generated by the piezoelectric synthesizing jet and is installed around the low heat flux density area of ​​the flexible heat exchanger 1, i.e., around the flexible heat exchanger 1. After the airflow generated by the piezoelectric synthesizing jet cools the central area, it can continue to scour the fin 6 and carry away its heat.

[0058] Using automated dispensing equipment, high thermal conductivity adhesive is first applied evenly to the bonding surface of the flexible heat exchange plate 1 using specific patterns such as "X" shape, grid 4 shape, or single point in the center. Then, the fins 6 are fixed using high thermal conductivity adhesive. Before fixing the fins 6, the bonding surfaces of the flexible heat exchange plate 1 and the shell of the fins 6 need to be cleaned and roughened. Cleaning can be done with alcohol or acetone to remove oil stains, and roughening can be done by lightly sanding with fine sandpaper to increase the bonding area and bonding strength.

[0059] Furthermore, in order to increase the surface area of ​​the flexible heat exchanger 1 and optimize its heat dissipation performance, the surface of the flexible heat exchanger 1 is set as a non-smooth curved surface structure with densely arranged concave and convex features, thereby increasing the surface area of ​​the flexible heat exchanger 1.

[0060] For ease of installation and wiring, a stretchable, fixed mesh 4 can be used to cover the piezoelectric synthesizer array 2. For example... Figure 4 As shown, grid 4 is used to fix the piezoelectric synthesizing jets and provide electrical connections. The structure includes an elastic matrix and conductive metal wires embedded within it. The elastic matrix has multiple mounting holes corresponding to the piezoelectric synthesizing jets. These mounting holes are interference-fitted with the outer shell of the piezoelectric synthesizing jets for fixation. The conductive metal wires are embedded in the outer elastic matrix, enabling repeated stretching without breakage. The conductive metal wires improve the rigidity of grid 4 and also serve as conductors to power each piezoelectric synthesizing jet.

[0061] Specifically, the elastic matrix material is polydimethylsiloxane, and the metal wire is copper wire.

[0062] The working principle of this invention is as follows: When the heat source is working, the flexible heat spreader 1 quickly dissipates heat and suppresses hot spot peaks. At the same time, the temperature sensor 5 monitors the temperature in real time. When the temperature rises in a certain area due to uneven power consumption, the intelligent control unit immediately starts or enhances the piezoelectric synthesis jet in the corresponding position to perform precise jet cooling until the temperature drops back to a safe range. The entire system achieves efficient, quiet, and adaptive intelligent heat dissipation.

[0063] Compared with existing technologies, the intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and flexible heat exchange plate provided by the present invention has the following advantages: (1) Through innovative technology integration and localized precise thermal management, the "flexible heat spreader plate" and the "piezoelectric synthetic jet array" are deeply coupled for the first time. The flexible heat spreader plate utilizes the phase change heat absorption of the internal working fluid to rapidly diffuse the extremely high heat flux density generated by local hot spots laterally, reducing its peak temperature and achieving preliminary "area uniform temperature". The distributed piezoelectric synthetic jets act as an active intervention method, like a "fixed-point fire extinguishing team", and perform directional and efficient jet impact cooling on the remaining or newly formed high-temperature areas only according to the instructions of the temperature sensor. This two-stage heat dissipation mode of "passive heat spreader plate + active precise strike" realizes a qualitative change from "global uniform heat dissipation" to "local dynamic thermal control", with extremely high heat dissipation resource utilization, which can effectively suppress hot spots and improve the consistency of equipment performance.

[0064] (2) True all-solid-state active heat dissipation and high reliability: The piezoelectric synthesizing jet generator itself has no macroscopic moving parts. It drives the diaphragm to vibrate only through the inverse piezoelectric effect of the piezoelectric ceramic, and synthesizes a high-speed jet by utilizing the cavity effect. The entire system does not require a mechanical pump or external fluid circulation pipeline, which fundamentally eliminates the risk of failure such as fluid leakage, pipeline blockage, and pump wear. The system operates quietly with minimal vibration and is very friendly to stability.

[0065] (3) Adaptive intelligent control and high energy efficiency: Through distributed temperature sensing and embedded intelligent control algorithms, the system can perceive the dynamic and non-uniform changes of the thermal field in real time and automatically and accurately adjust the cooling strategy. It realizes "cooling on demand", avoiding the energy waste caused by the continuous full-load operation of traditional heat dissipation systems, and is more energy-efficient while ensuring heat dissipation effect.

[0066] (4) Extremely compact structure and high integration: The thickness of the flexible heat spreader can be controlled within 1mm-2mm, and it can be bent and fitted to fit various irregular surfaces. The piezoelectric synthesizing jet unit is small in size (usually 10mm-20mm square and 3mm-5mm high). The entire heat dissipation device is very thin and light, and can be directly integrated into the module, closely attached to the heat-generating chip, which greatly reduces thermal resistance and provides key technical support for the miniaturization and lightweighting of the equipment and its application in harsh spatial environments (such as airborne and portable devices).

[0067] (5) Ingenious connection, combining structural mechanics and thermal management: The support column acts as a "universal joint", which relieves the constraint of the heat spreader bending and constructs an efficient thermal path from the piezoelectric synthesis jet to the heat spreader, minimizing the interface thermal resistance. The entire mechanical structure is stable and can withstand certain vibrations and impacts.

[0068] The above-disclosed embodiments are merely preferred embodiments of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A smart heat dissipation device for irregularly shaped surfaces based on piezoelectric actuation and a flexible heat dissipation plate, characterized in that, include: The flexible heat spreader has its bottom surface conformally fitted to the heat source to conduct heat away from the heat source; A piezoelectric synthesizing jet array is disposed on the top surface of the flexible heat exchange plate. The piezoelectric synthesizing jet array includes multiple piezoelectric synthesizing jets arranged in a matrix. The zoned temperature sensing system includes multiple distributed temperature sensors embedded in the flexible temperature distribution plate. The temperature sensors are used to acquire the temperature at corresponding points, and each temperature sensor corresponds to a piezoelectric synthesizer jet. The intelligent control unit is electrically connected to the temperature sensor and the piezoelectric synthesizing jet, and is used to control the working state of the corresponding piezoelectric synthesizing jet based on the temperature feedback from the temperature sensor.

2. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, The flexible heat spreader includes two spaced-apart first and second plastic metal sheets. The first and second plastic metal sheets are encapsulated by laser welding to form a vacuum cavity in the middle. The vacuum cavity is filled with a working fluid and has a capillary core structure that extends in a multi-ring or grid pattern.

3. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 2, characterized in that, The first and second malleable metal sheets are copper foil.

4. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, The arrangement density of the multiple piezoelectric synthetic jets is positively correlated with the expected heat flux density distribution in the heat source contact area.

5. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, A flexible support structure is provided between the piezoelectric jet generator and the flexible heat spreader to provide mechanical support and promote heat conduction. The flexible support structure includes multiple support columns with one end connected to the shell of the piezoelectric jet generator. The other end of the support column is fixed to the upper surface of the flexible heat spreader through a thermally conductive interface material. The multiple support columns are distributed on the edge or corner of the shell of the piezoelectric jet generator. The support column is a hollow cylinder and the material is a highly thermally conductive flexible polymer composite material.

6. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 5, characterized in that, The thermal interface material is a high thermal conductivity phase change material pad, which is bonded to a flexible heat spreader.

7. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, A high thermal conductivity adhesive layer is provided between the piezoelectric synthesizing jet and the flexible heat spreader, and the material of the high thermal conductivity adhesive layer is a phase change thermal conductive material.

8. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and flexible heat dissipation plate according to claim 1, characterized in that, The flexible heat spreader is surrounded by fins for combined active and passive heat dissipation, and the fins are located on the airflow path generated by the piezoelectric synthesizer jet.

9. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, The upper surface of the flexible heat spreader is a non-smooth curved surface with an uneven structure.

10. The intelligent heat dissipation device for irregularly shaped surfaces based on piezoelectric drive and a flexible heat dissipation plate according to claim 1, characterized in that, It also includes a grid for fixing the piezoelectric synthesizer and providing electrical connection, the grid being composed of an elastic matrix and conductive metal wires embedded therein; the elastic matrix is ​​provided with mounting holes corresponding to each piezoelectric synthesizer, and each piezoelectric synthesizer is assembled in the corresponding mounting hole; the conductive metal wire network is electrically connected to the electrodes of each piezoelectric synthesizer.

Images