976nm high-power external cavity semiconductor laser based on transmission grating

Abstract

The invention relates to the technical field of semiconductor lasers, in particular to a 976nm high-power external cavity semiconductor laser based on a transmission grating, which comprises a base, a primary mounting plate is fixedly mounted on the upper side of the base, a laser component is fixedly mounted on the primary mounting plate, a secondary mounting plate is fixedly mounted on the upper side of the base, and the laser component is fixedly mounted on the secondary mounting plate. An outer cavity transmission assembly is fixedly mounted on the upper side of the second-stage mounting plate, and an electric control plate is fixedly mounted on the second-stage mounting plate; the corresponding liquid cooling plates are attached to the lower sides of the gain chips through heat conduction silicone grease, cooling liquid is injected through the liquid inlet port, the cooling liquid enters the cooling liquid pipes through the three-way pipe on the liquid inlet pipe, then the cooling liquid is injected into the liquid cooling plates through the cooling liquid pipes, and then the cooling liquid passes through the flow guide plates in the liquid cooling plates and is discharged into the liquid discharging pipes through the hot liquid pipes. The heat generated by the gain chip is led out and dissipated, so that the heat is prevented from being conducted to internal elements through the shell, the heat conduction path is simplified, and the heat conduction efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser technology, specifically a 976nm high-power external cavity semiconductor laser based on a transmission grating. Background Technology

[0002] An external cavity semiconductor laser is a type of laser that uses external optical elements (such as gratings, prisms, or mirrors) and a semiconductor laser chip to form a resonant cavity. It is widely used in fields such as precision spectroscopy, atomic physics, and optical communication.

[0003] For high-power external cavity semiconductor lasers, the working principle is as follows: an internal gain chip, in conjunction with an LD laser diode, emits laser light. The light beam's direction is adjusted by multiple prisms and mirrors, and then a lens and grating are used to form the laser beam, ultimately performing operations such as cutting materials. During operation, the internal output power is high, generating significant heat. High temperatures can drastically degrade the performance of the gain chip, leading to a drop in power. Current technology typically uses a liquid cooling plate directly attached to the external cavity semiconductor laser's casing for heat dissipation. This design has two main drawbacks: first, heat must be conducted through the casing to the internal components, resulting in a long and inefficient heat conduction path; second, a fixed-power liquid cooling system cannot be dynamically adjusted according to the laser's actual operating conditions. During low-power operation, this can lead to excessive heat dissipation, wasting energy and potentially causing condensation on the surface of optical components due to overcooling. Summary of the Invention

[0004] The purpose of this invention is to provide a 976nm high-power external cavity semiconductor laser based on a transmission grating to solve the problems mentioned in the background art.

[0005] The technical solution of the present invention is: a 976nm high-power external cavity semiconductor laser based on a transmission grating, comprising a base, a primary mounting plate fixedly mounted on the upper side of the base, a laser component fixedly mounted on the primary mounting plate, a secondary mounting plate fixedly mounted on the upper side of the base, an external cavity transmission component fixedly mounted on the upper side of the secondary mounting plate, an electronic control board fixedly mounted on the secondary mounting plate, a liquid cooling heat dissipation component fixedly mounted between the base and the primary mounting plate, and a housing fixedly mounted on the upper side of the base, with a wind cooling heat dissipation component provided on the side of the housing; The liquid cooling heat dissipation assembly includes multiple liquid cooling plates, all of which are fixedly mounted on the upper side of a base. A guide plate is fixedly mounted on the inner wall of each liquid cooling plate. A cold liquid pipe is fixedly mounted on one side of each liquid cooling plate, and a hot liquid pipe is fixedly mounted on the other side of each liquid cooling plate. A tee pipe is fixedly mounted at the other end of each cold liquid pipe and hot liquid pipe. Multiple inlet pipes are fixedly connected to the tee pipes fixedly mounted at one end of the cold liquid pipes, and multiple outlet pipes are fixedly connected to the tee pipes fixedly mounted at one end of the hot liquid pipes. A frequency converter unit is mounted on each of the cold liquid pipes and hot liquid pipes. A drain port is fixedly mounted at one end of each outlet pipe, and an inlet port is fixedly mounted at one end of each inlet pipe.

[0006] Preferably, the frequency converter unit includes multiple electrically controlled flow valves, which are respectively fixedly installed on the cold liquid pipe and the hot liquid pipe. Multiple thermocouples are fixedly installed on the first-stage mounting plate. The thermocouples are electrically connected to the electrically controlled flow valves and to the control board.

[0007] Preferably, the air-cooled heat dissipation component includes two sets of cooling fans, and heat dissipation vents are provided on both sides of the housing. Both sets of cooling fans are fixedly installed in the heat dissipation vents, and a dustproof unit is fixedly installed in the heat dissipation vents.

[0008] Preferably, the dustproof unit includes two primary dustproof nets, which are fixedly installed in two heat dissipation vents respectively. Two secondary dustproof nets are fixedly installed on the upper side of the secondary mounting plate, and a buffer collection plate is fixedly installed on one side of each of the two secondary dustproof nets.

[0009] Preferably, the laser assembly includes multiple LD laser diodes, all of which are fixedly mounted on the upper side of a primary mounting plate. Multiple overhead brackets are fixedly mounted on the upper side of the base, and multiple gain chips are fixedly mounted on the upper side of the multiple overhead brackets. The multiple gain chips are electrically connected to the multiple LD laser diodes, and a refractive unit is fixedly mounted on the upper side of the primary mounting plate.

[0010] Preferably, the refraction unit includes multiple brackets, which are respectively fixedly installed on the upper side of the primary mounting plate and the secondary mounting plate. A refraction mirror is fixedly installed on the bracket installed on the primary mounting plate, a primary semi-transparent and semi-reflective mirror is fixedly installed on the bracket installed on the secondary mounting plate, and a secondary semi-transparent and semi-reflective mirror is fixedly installed on the bracket installed on the secondary mounting plate.

[0011] Preferably, the underside of each of the multiple gain chips is coated with chip grease and bonded to a liquid cooling plate.

[0012] Preferably, the external cavity transmission assembly includes a collimating lens and a projection grating. A lens frame is fixedly mounted on the upper side of the secondary mounting plate, and the collimating lens is fixedly mounted on the inner wall of the lens frame. A grating frame is fixedly mounted on the upper side of the secondary mounting plate, and the projection grating is fixedly mounted on the grating frame.

[0013] Preferably, a lens grease is applied between the collimating lens and the lens holder, and multiple lens heat dissipation fins are fixedly installed on the surface of the lens holder.

[0014] Preferably, a grating grease is applied between the projection grating and the grating frame, and multiple grating heat dissipation fins are fixedly installed on the surface of the grating frame.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. A corresponding liquid cooling plate is attached to the underside of multiple gain chips using thermal grease. Coolant is injected through the inlet port and enters multiple cold liquid pipes through a T-connector on the inlet pipe. The coolant is then injected into the liquid cooling plate, passes through the guide plate inside the liquid cooling plate, and is discharged through the hot liquid pipe to the drain pipe. It is then transported to the drain port through the T-connector and the drain pipe. This process dissipates the heat generated by the gain chips, preventing heat from being conducted to internal components through the outer casing, simplifying the heat conduction path, and improving heat conduction efficiency.

[0016] 2. Each gain chip is equipped with an independent thermocouple for independent temperature monitoring. When the laser generates heat inside the casing, causing the temperature of the gain chip to rise, the thermocouple sends the temperature data to the control board. The control board then sends a signal to control two electrically controlled flow valves on the corresponding liquid cooling plate. The higher the temperature of the gain chip, the greater the flow rate controlled by the two electrically controlled flow valves, and vice versa. This dynamically controls the return rate of the cooled hot liquid, reduces the amount of hot liquid the temperature controller needs to process, and reduces its power consumption. This achieves the effect of dynamically maintaining temperature stability, reducing energy consumption, and preventing condensation on the surface of optical components.

[0017] 3. During operation, both sets of cooling fans are started simultaneously by the electronic control board. After starting, the cooling fan located on the side of the secondary semi-transparent and semi-reflective mirror draws in external cooling air and first filters it through the primary dust filter. The filtered air with initial velocity then impacts the secondary dust filter to perform secondary filtration of dust and impurities, and is collected by the buffer collection plate. The air after secondary filtration enters the housing, carrying away the heat generated by the projection grating and collimating lens. The two cooling fans near the primary semi-transparent and semi-reflective mirror exhaust the air inside the device, thus achieving air cooling and heat dissipation. This heat dissipates heat from the projection grating and collimating lens, preventing them from deforming due to heat and ensuring the stability of the laser beam. Attached Figure Description

[0018] The present invention will be further explained below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the power supply structure and related structures of the present invention; Figure 3 This is a schematic diagram of the internal structure of the present invention; Figure 4 This is a cross-sectional structural diagram of the base in this invention; Figure 5 This is a schematic diagram of the gain chip and its related structures of the present invention; Figure 6 This is a schematic diagram of the liquid cooling heat dissipation component structure in this invention; Figure 7 This is a cross-sectional structural diagram of the liquid cooling plate in this invention; Figure 8 This is a schematic diagram of the projection grating and its related structures in this invention; Figure 9 This is a schematic diagram of the collimating lens and its related structures in this invention.

[0019] Explanation of reference numerals in the attached diagram: 1. Base; 2. Laser port; 3. Primary dustproof mesh; 4. Housing; 5. Power connector; 6. Liquid inlet port; 7. LD laser diode; 8. Bracket; 9. Refracting mirror; 10. Primary mounting plate; 11. Primary semi-transparent mirror; 12. Lens heat sink; 13. Secondary mounting plate; 14. Electronic control board; 15. Projection grating; 16. Buffer collection plate; 17. Secondary dustproof mesh; 18. Cooling fan; 19. Alignment. 20. Straight lens; 21. Secondary semi-transparent mirror; 22. Thermocouple; 23. Gain chip; 24. Mounting bracket; 25. Chip grease; 26. Liquid cooling plate; 27. Drain pipe; 28. Drain port; 29. ​​Inlet pipe; 30. Cooling pipe; 31. T-connector; 32. Electrically controlled flow valve; 33. Hot liquid pipe; 34. Guide plate; 35. Grating grease; 36. Grating frame; 37. Grating heat sink; 38. Lens frame; 39. Lens grease. Detailed Implementation

[0020] The present invention will be further described below with reference to specific embodiments. However, those skilled in the art should understand that the detailed description given herein with reference to the accompanying drawings is for better explanation. The structure of the present invention necessarily exceeds the limited embodiments described herein. Some equivalent alternatives or common means will not be described in detail herein, but still fall within the protection scope of this application.

[0021] Figures 1-9 This is the preferred embodiment of the present invention, which is described below in conjunction with the accompanying drawings. Figures 1-9 The present invention will be further described below.

[0022] like Figures 1-9 As shown, a 976nm high-power external cavity semiconductor laser based on a transmission grating includes a base 1, a primary mounting plate 10 fixedly mounted on the upper side of the base 1, a laser component fixedly mounted on the primary mounting plate 10, a secondary mounting plate 13 fixedly mounted on the upper side of the base 1, an external cavity transmission component fixedly mounted on the upper side of the secondary mounting plate 13, an electronic control board 14 fixedly mounted on the secondary mounting plate 13, a liquid cooling heat dissipation component fixedly mounted between the base 1 and the primary mounting plate 10, and a housing 4 fixedly mounted on the upper side of the base 1, with an air cooling heat dissipation component provided on the side of the housing 4. The liquid cooling heat dissipation assembly includes multiple liquid cooling plates 25, all of which are fixedly installed on the upper side of the base 1. A guide plate 33 is fixedly installed on the inner wall of the liquid cooling plate 25. A cold liquid pipe 29 is fixedly installed on one side of the liquid cooling plate 25, and a hot liquid pipe 32 is fixedly installed on one side of the liquid cooling plate 25. A T-shaped pipe 30 is fixedly installed at the other end of both the cold liquid pipe 29 and the hot liquid pipe 32. Multiple liquid inlet pipes 28 are fixedly connected to the T-shaped pipe 30 fixedly installed at one end of the liquid cooling pipe, and multiple liquid drain pipes 26 are fixedly connected to the T-shaped pipe 30 fixedly installed at one end of the hot liquid pipe 32. A frequency converter unit is installed on the cold liquid pipe 29 and the hot liquid pipe 32. A liquid drain port 27 is fixedly installed at one end of the liquid drain pipe 26, and a liquid inlet port 6 is fixedly installed at one end of the liquid inlet pipe 28.

[0023] With the above structure, a T-shaped primary mounting plate 10 is suspended on the upper side of the base 1. A laser assembly is mounted on the primary mounting plate 10. The secondary mounting plate 13 is mounted at the same height as the primary mounting plate 10. An external cavity transmission assembly mounted on the secondary mounting plate 13 amplifies and stabilizes the wavelength of the laser emitted by the laser assembly. A liquid-cooled heat dissipation assembly is installed in its suspended area to dissipate heat from the laser assembly. An air-cooled heat dissipation assembly is installed in the area of ​​the external cavity transmission assembly to provide air cooling for the cavity transmission assembly area. Liquid cooling... Multiple liquid cooling plates 25 are symmetrically arranged in the assembly. Each liquid cooling plate 25 has two guide plates 33 installed inside. The guide plates 33 guide the liquid inflow into the liquid cooling plate 25 to ensure normal coolant exchange. The cold liquid pipe 29 and the hot liquid pipe 32 are connected to the inlet pipe 28 and the outlet pipe 26 respectively through a tee pipe 30. The diameter of the inlet pipe 28 and the outlet pipe 26 is larger than that of the cold liquid pipe 29 and the hot liquid pipe 32 to ensure normal coolant circulation. Two inlet pipes and two outlet pipes 26 are installed. Two symmetrical sets of liquid-cooled plates 25 are used for coolant supply and discharge. Two drain pipes 26 are installed as a group with drain ports 27, and two inlet pipes 28 are installed as a group with inlet ports 6. The outer shell 4 installed on the upper side of the base 1 is used to protect the laser assembly, the external cavity transmission assembly, the liquid-cooled heat dissipation assembly, and the air-cooled heat dissipation assembly. When the liquid-cooled heat dissipation assembly is in use, a temperature controller needs to be connected to maintain the constant temperature of the coolant. The constant-temperature water is delivered to the two inlet pipes 28 through the inlet ports 6. The constant-temperature coolant is delivered to multiple liquid cooling pipes through multiple T-connectors 30 on the inlet pipe 28. After entering the liquid cooling plate 25, the constant-temperature coolant exchanges heat with the heat dissipation components. The resulting hot liquid then flows into the drain pipe 26 through the hot liquid pipe 32 and the T-connector 30, and is then returned to the temperature controller through the drain port 27 for cooling and reuse, thus achieving heat dissipation and cooling. By placing the liquid cooling plate 25 directly inside the device and in direct contact with the laser components, the heat conduction path is reduced, the introduction efficiency is improved, and the cooling response is faster.

[0024] Furthermore, the frequency converter includes multiple electrically controlled flow valves 31, which are fixedly installed on the cold liquid pipe 29 and the hot liquid pipe 32 respectively. Multiple thermocouples 21 are fixedly installed on the first-stage mounting plate 10. The thermocouples 21 are electrically connected to the electrically controlled flow valves 31 and to the electrical control board 14.

[0025] With the above structure, the electrically controlled flow valve 31 can control the flow rate of the coolant pipe 29 and the hot liquid pipe 32 through the electronic control board 14, thereby controlling the flow rate of the coolant. During control, it is necessary to ensure the synchronization of the flow rate of the electrically controlled flow valve 31 to ensure that the inflow and outflow flow rates are consistent. The first-stage mounting plate 10 has multiple mounting holes, and each mounting hole is equipped with a thermocouple 21. The monitoring end of each thermocouple 21 passes through and extends to the area below the first-stage mounting plate 10 to monitor the temperature of the surface of the gain chip 22 in the laser assembly and transmit the monitoring data to the electronic control board 14. The electronic control board 14 then uses this temperature data to dynamically adjust each group of electrically controlled flow valves 31. When the temperature data is higher, the flow opening value of the electrically controlled flow valve 31 is higher, the fluid exchange efficiency is higher, and the heat dissipation efficiency is higher, thereby reducing the coolant circulation speed in some lower temperature areas, reducing the processing power of the temperature controller for the coolant, and achieving the effect of energy saving.

[0026] Furthermore, the air-cooled heat dissipation component includes two sets of cooling fans 18, and heat dissipation vents are provided on both sides of the outer casing 4. Both sets of cooling fans 18 are fixedly installed inside the heat dissipation vents, and dustproof units are fixedly installed inside the heat dissipation vents.

[0027] With the above structure, heat dissipation vents are symmetrically opened on both sides of the outer casing 4. The two heat dissipation vents are the same size, and each heat dissipation vent is equipped with two cooling fans 18, which are paired up. The cooling fans 18 include a motor and cooling fan blades. When the device is powered on, it is directly started through the electronic control board 14. One set of cooling fans 18 draws in external heat dissipation gas, and the other set of cooling fans 18 exhausts the gas inside the device, forming a stable air duct to perform air cooling heat dissipation inside the device.

[0028] Furthermore, the dustproof unit includes two primary dustproof nets 3, which are fixedly installed in the two heat dissipation vents respectively. Two secondary dustproof nets 17 are fixedly installed on the upper side of the secondary mounting plate 13, and a buffer collection plate 16 is fixedly installed on one side of each of the two secondary dustproof nets 17.

[0029] With the above structure, the two primary dust filters 3 can prevent dust from entering the heat dissipation vents and the two sets of cooling fans 18. The two secondary dust filters 17 are installed on the upper side of the secondary mounting plate 13. The secondary dust filters 17 are arc-shaped, and an arc-shaped interception buffer collection plate 16 is installed on the side away from the cooling fans 18. This plate can collect impact impurity particles in the gas. The arc-shaped dust filter at the air inlet can buffer the incoming gas and further buffer the dust in the gas. The buffer collection plate 16 at the exhaust outlet can change the air duct at the exhaust outlet, making the air duct Z-shaped, which greatly reduces the entry of gas dust particles.

[0030] Furthermore, the laser assembly includes multiple LD laser diodes 7, all of which are fixedly mounted on the upper side of the primary mounting plate 10. Multiple overhead brackets 23 are fixedly mounted on the upper side of the base 1, and multiple gain chips 22 are fixedly mounted on the upper side of the multiple overhead brackets 23. The multiple gain chips 22 are electrically connected to the multiple LD laser diodes 7. A refraction unit is fixedly mounted on the upper side of the primary mounting plate 10.

[0031] With the above structure, multiple gain chips 22 are installed on the overhead base 23. The number and arrangement of the gain chips 22 are the same as those of the cooling plate. Each gain chip 22 is temperature monitored by an independent thermocouple 21. Each gain chip 22 is equipped with an independent LD laser diode 7 to emit laser light with a wavelength of 976nm (the gain chip 22 must adopt an InGaAs / GaAs quantum well structure).

[0032] Furthermore, the refraction unit includes multiple brackets 8, which are respectively fixedly installed on the upper side of the primary mounting plate 10 and the secondary mounting plate 13. A refractor 9 is fixedly installed on the bracket 8 installed on the primary mounting plate 10, a primary semi-transparent and semi-reflective mirror 11 is fixedly installed on the bracket 8 installed on the secondary mounting plate 13, and a secondary semi-transparent and semi-reflective mirror 20 is fixedly installed on the bracket 8 installed on the secondary mounting plate 13.

[0033] With the above structure, a bracket 8 is installed at the ray position of each LD laser diode 7, and a refractor 9 is installed on each bracket 8 to change the laser direction so that it is in the same direction. The first-stage semi-transparent mirror 11, which is away from the collimating lens 19, changes the direction of the laser again so that it is directed towards the position of the second-stage semi-transparent mirror 20. The second-stage semi-transparent mirror 20 then changes the direction of the laser and finally keeps the ray of the LD laser diode 7 that is directly directed towards the first-stage semi-transparent mirror 11 in the same ray direction.

[0034] Furthermore, the lower sides of the multiple gain chips 22 are coated with chip grease 24 and are attached to the upper side of the liquid cooling plate 25.

[0035] With the above structure, the thermal conductivity of the gain chip 22 can be improved by using the chip grease 24, which facilitates heat exchange and cooling between the chip and the liquid cooling plate 25.

[0036] Furthermore, the external cavity transmission assembly includes a collimating lens 19 and a projection grating 15. A lens holder 37 is fixedly installed on the upper side of the secondary mounting plate 13. The collimating lens 19 is fixedly installed on the inner wall of the lens holder 37. A grating holder 35 is fixedly installed on the upper side of the secondary mounting plate 13. The projection grating 15 is fixedly installed on the grating holder 35.

[0037] With the above structure, the rays emitted by multiple LD laser diodes 7 reach the collimating lens 19 and are collimated and amplified a second time to improve the laser effect. Then, the laser wavelength is measured by the projection grating 15 and emitted through the laser port 2 for operation. The lens frame 37 is composed of a cylinder and a ring. The lower part of the collimating lens 19 is connected to the inner wall of the ring. A certain space is left between the side of the collimating lens 19 and the inner wall of the ring to prevent the collimating lens 19 from deforming and being squeezed due to heat. The grating frame 35 is rectangular. The lower part of the projection grating 15 is fixedly connected to the inner wall of the grating frame 35, and a certain space is also left between it and the interior to prevent deformation.

[0038] Furthermore, lens grease 38 is applied between the collimating lens 19 and the lens holder 37, and multiple lens heat dissipation fins 12 are fixedly installed on the surface of the lens holder 37.

[0039] With the above structure, the lens grease 38 can improve the heat transfer efficiency of the collimating lens 19, enabling it to quickly transfer heat to the annularly arranged lens heat dissipation fins 12 for heat dissipation.

[0040] Furthermore, a grating grease 34 is applied between the projection grating 15 and the grating frame 35, and multiple grating heat dissipation fins 36 are fixedly installed on the surface of the grating frame 35.

[0041] With the above structure, the grating grease 34 can improve the heat transfer efficiency of the collimating lens 19, enabling it to quickly transfer heat to the annularly arranged grating heat dissipation fins 36 for heat dissipation.

[0042] Working principle: When using the device, first take out the thermostat and install the inlet and outlet of the thermostat on the outlet port and inlet port 6 respectively. Then connect the power supply and power connector 5. Next, send a signal to the control board 14 through the external control to control multiple electronically controlled flow valves 31 to open and turn on the thermostat, injecting coolant through the inlet port 6. The coolant enters multiple cold liquid pipes 29 through the three-way pipe 30 on the inlet pipe 28, and is injected into the liquid cooling plate 25 through the cold liquid pipes 29. Then, it passes through the guide plate 33 in the liquid cooling plate 25 and is discharged from the hot liquid pipe 32 into the drain pipe 26. It is then transported to the drain port 27 through the three-way pipe 30 and the drain pipe 26, and flows back to the inlet of the thermostat to complete the injection of coolant. Then, close the multiple electronically controlled flow valves 31 to cut off the flow of coolant, and start the device through the control board 14 to work. The control board 14 controls multiple LD laser diodes 7 to generate 976nm wavelength laser under the action of the corresponding gain chip 22. The laser first passes through the corresponding refracting mirror 9 installed on the first-stage mounting plate 10 to change its beam direction so that it is on the same horizontal line. After the final direction adjustment of the first-stage semi-transparent and semi-reflective mirror 11 and the second-stage semi-transparent and semi-reflective mirror 20, it is shot towards the collimating lens 19. After being strengthened by the collimating lens 19, it is shot into the projection grating 15 to stabilize the 976nm wavelength, and then it is emitted through the laser port 2 to work. During operation, each gain chip 22 is independently monitored for temperature via its own thermocouple 21. When the laser generates heat inside the housing 4, causing the temperature of the gain chip 22 to rise, the dissipated heat is conducted through the chip's thermal grease 24 to the liquid cooling plate 25, where it cools the gain chip 22. Simultaneously, the thermocouple 21 sends temperature data to the control board 14, which then sends signals to control the two electrically controlled flow valves 31 on the corresponding liquid cooling plate 25. As the temperature of the gain chip 22 increases... The larger the flow rate controlled by the two electrically controlled flow valves 31, the smaller the flow rate. For gain chips 22 with excessively high temperatures, the flow rate of hot liquid pipe 32 and cold liquid pipe 29 is increased through the two electrically controlled flow valves 31, thereby increasing the flow rate of coolant in liquid cooling plate 25 and improving cooling efficiency. Gain chips 22 with lower temperature increases maintain a certain flow rate, keeping the coolant at a low flow rate and reducing the flow rate of coolant returning to the temperature controller, thereby reducing the amount of hot liquid the temperature controller needs to process, reducing its power, and thus achieving the effect of dynamically maintaining stable temperature and reducing energy consumption. As the continuous projection of the laser causes the collimating lens 19 and the projection grating 15 to generate temperature, the heat generated by the collimating lens 19 is discharged through the lens grease 38 and the heat is discharged through the lens heat dissipation fins 12 on the lens holder 37. The heat of the projection grating 15 is discharged to the grating holder 35 through the grating grease 34 and discharged through the grating heat dissipation fins 36. This achieves the goal of preventing the collimating lens 19 and the projection grating 15 from deforming due to heat, which would affect the stability of the laser wavelength. When the device is started, the two sets of cooling fans 18 are started simultaneously by the control board 14. After starting, the cooling fan 18 located on the side of the secondary semi-transparent mirror 20 draws in the external cooling gas and first filters it through the primary dust filter 3. The filtered gas with initial velocity impacts the secondary dust filter 17 to filter the dust and impurities for a second time, and is collected by the buffer collection plate 16. The gas after secondary filtration enters the interior of the outer shell 4, carrying away the heat generated by the projection grating 15 and the collimating lens 19, and exhausts the air inside the device through the two cooling fans 18 on the side close to the primary semi-transparent mirror 11, thereby performing air cooling and completing the heat dissipation work. When not in use, the coolant inside the device is drained. When the device is idle, the two heat dissipation vents of the outer casing 4 can be filtered by the two secondary dust filters 17. The incoming dust is filtered and collected by the corresponding buffer collection plate 16 to prevent dust from entering the device and thus maintain the cleanliness of the device.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A 976nm high-power external cavity semiconductor laser based on a transmission grating, comprising a base (1), characterized in that: A primary mounting plate (10) is fixedly installed on the upper side of the base (1), and a laser component is fixedly installed on the primary mounting plate (10). A secondary mounting plate (13) is fixedly installed on the upper side of the base (1), and an external cavity transmission component is fixedly installed on the upper side of the secondary mounting plate (13). An electronic control board (14) is fixedly installed on the secondary mounting plate (13). A liquid cooling heat dissipation component is fixedly installed between the base (1) and the primary mounting plate (10). A housing (4) is fixedly installed on the upper side of the base (1), and a wind-cooled heat dissipation component is provided on the side of the housing (4). The liquid cooling heat dissipation assembly includes multiple liquid cooling plates (25), all of which are fixedly installed on the upper side of the base (1). A guide plate (33) is fixedly installed on the inner wall of each liquid cooling plate (25). A cold liquid pipe (29) is fixedly installed on one side of each liquid cooling plate (25), and a hot liquid pipe (32) is fixedly installed on one side of each liquid cooling plate (25). A three-way pipe (30) is fixedly installed at the other end of both the cold liquid pipe (29) and the hot liquid pipe (32). Multiple inlet pipes (28) are fixedly connected to a tee pipe (30) fixedly installed at one end of the cold liquid pipe, and multiple drain pipes (26) are fixedly connected to a tee pipe (30) fixedly installed at one end of the hot liquid pipe (32). A frequency conversion unit is installed on the cold liquid pipe (29) and the hot liquid pipe (32). A drain port (27) is fixedly installed at one end of the drain pipe (26), and a drain port (6) is fixedly installed at one end of the inlet pipe (28).

2. The 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 1, characterized in that: The frequency converter unit includes multiple electrically controlled flow valves (31), which are fixedly installed on the cold liquid pipe (29) and the hot liquid pipe (32) respectively. Multiple thermocouples (21) are fixedly installed on the first-stage mounting plate (10). The thermocouples (21) are electrically connected to the electrically controlled flow valves (31) and to the electrical control board (14).

3. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 1, characterized in that: The air-cooled heat dissipation assembly includes two sets of cooling fans (18). The outer shell (4) has heat dissipation vents on both sides. Both sets of cooling fans (18) are fixedly installed in the heat dissipation vents. A dustproof unit is fixedly installed in the heat dissipation vents.

4. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 3, characterized in that: The dustproof unit includes two primary dustproof nets (3), which are fixedly installed in two heat dissipation vents. Two secondary dustproof nets (17) are fixedly installed on the upper side of the secondary mounting plate (13), and a buffer collection plate (16) is fixedly installed on one side of each of the two secondary dustproof nets (17).

5. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 1, characterized in that: The laser assembly includes multiple LD laser diodes (7), all of which are fixedly mounted on the upper side of a primary mounting plate (10). Multiple overhead seats (23) are fixedly mounted on the upper side of the base (1), and multiple gain chips (22) are fixedly mounted on the upper side of the multiple overhead seats (23). The multiple gain chips (22) are electrically connected to the multiple LD laser diodes (7). A refraction unit is fixedly mounted on the upper side of the primary mounting plate (10).

6. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 5, characterized in that: The refraction unit includes multiple brackets (8), which are respectively fixedly installed on the upper side of the primary mounting plate (10) and the secondary mounting plate (13). A refractor (9) is fixedly installed on the bracket (8) installed on the primary mounting plate (10), a primary semi-transparent and semi-reflective mirror (11) is fixedly installed on the bracket (8) installed on the secondary mounting plate (13), and a secondary semi-transparent and semi-reflective mirror (20) is fixedly installed on the bracket (8) installed on the secondary mounting plate (13).

7. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 5, characterized in that: The lower side of each of the gain chips (22) is coated with chip grease (24) and is attached to the upper side of the liquid cooling plate (25).

8. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 1, characterized in that: The external cavity transmission assembly includes a collimating lens (19) and a projection grating (15). A lens frame (37) is fixedly installed on the upper side of the secondary mounting plate (13). The lens frame (37) is installed on the upper side of the secondary mounting plate (13). The collimating lens (19) is fixedly installed on the inner wall of the lens frame (37). A grating frame (35) is fixedly installed on the upper side of the secondary mounting plate (13). The projection grating (15) is fixedly installed on the grating frame (35).

9. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 8, characterized in that: Lens grease (38) is applied between the collimating lens (19) and the lens holder (37), and multiple lens heat dissipation fins (12) are fixedly installed on the surface of the lens holder (37).

10. A 976nm high-power external cavity semiconductor laser based on a transmission grating according to claim 8, characterized in that: The projection grating (15) and the grating frame (35) are coated with grating grease (34), and a plurality of grating heat dissipation fins (36) are fixedly installed on the surface of the grating frame (35).

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