Radiator for UPS (Uninterrupted Power Supply) module, power module and modularized UPS

Abstract

The invention provides a heat radiator for a UPS power module, a power module and a modularized UPS, and the heat radiator comprises a uniform temperature plate which is provided with a first plate surface and a second plate surface which are opposite to each other; the first plate face and the second plate face are each provided with a first installation part, and the first plate face is further provided with a second installation part. The second mounting part is used for fitting and mounting the power device; the relieved tooth radiator is made of a pure aluminum material through a relieved tooth process and comprises a substrate and a radiating tooth group which are integrally constructed; a heat dissipation tooth set is arranged on one side of the substrate, and the other side of the substrate is arranged on each first installation part in an attached mode. On the basis of a splicing type forming and manufacturing mode, a radiator of a T-shaped structure can be manufactured, the manufactured radiator of the T-shaped structure can adopt a substrate and a radiating tooth piece part which are higher in heat conduction performance, and meanwhile the problems that in the prior art, due to the fact that a substrate formed by a common aluminum plate is general in heat conduction performance and the radiating tooth piece part is poor in heat conduction performance are solved. And due to the limitation of the shape and the process, only an aluminum material with poor heat-conducting property can be adopted, so that the problem of poor heat dissipation performance caused by the aluminum material and the heat-conducting property is solved.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology of UPS, and more specifically, it relates to a heat sink, power module and modular UPS for UPS modules. Background Technology

[0002] With the development of technology, power modules in power electronics are gradually moving towards higher power density and higher space utilization. This trend has greatly improved the performance and efficiency of power modules, while also placing higher demands on heat dissipation capabilities.

[0003] For example, power devices in the UPS power modules of a modular UPS, such as insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), generate a large amount of heat during high-speed operation. These power devices are typically mounted on a heat sink, and the heat is transferred to the heat sink. Heat is then dissipated through natural convection, relying on airflow to carry away the heat from the heat sink, thus achieving heat dissipation for the power devices.

[0004] Referring to the UPS power module layout schemes shown in invention patents CN110519967A and CN111816630A, in a modular UPS product, it includes multiple UPS modules. Since UPS modules typically include rectifier units and inverter units according to their functions, to minimize module size and facilitate shared cooling fans, the heat sink within the UPS module is usually T-shaped. This allows both the rectifier and inverter units to use this type of heat sink, forming the power module through a mirror-symmetrical inverted arrangement and sharing a cooling fan to simultaneously dissipate heat from both units' heat sinks. This T-shaped heat sink is typically manufactured using a one-piece aluminum extrusion process. The upper half of the substrate has horizontally extending heat dissipation fins, while the lower half allows power devices to be mounted on both sides for heat dissipation through thermal conduction.

[0005] Previously, the aforementioned heat sinks were able to effectively dissipate heat from the devices. However, as the power rating of modular UPS systems increases, the demand for heat dissipation also grows. As a result, the aforementioned heat sinks are increasingly considered unable to keep up with the current wave of demand for improved power ratings and heat dissipation performance in terms of heat dissipation capacity and efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a heat sink, power module, and modular UPS for UPS modules, aiming to solve the technical problem of low heat dissipation efficiency in the T-shaped heat sinks of the prior art.

[0007] To achieve the above objectives, in a first aspect, the present invention provides a heat sink for a UPS power module, comprising: a vapor chamber having a first plate surface and a second plate surface opposite to each other; each of the first plate surface and the second plate surface is provided with a first mounting portion, and a second mounting portion is further provided on the side of the first plate surface opposite to the side where the first mounting portion is located; the second mounting portion is used to attach and mount a power device; the vapor chamber is used to conduct heat from the second mounting portion to the first mounting portion; and a toothed heat sink, which is made of pure aluminum material by a toothing process, and includes an integrally constructed substrate and a heat dissipation tooth assembly; the heat dissipation tooth assembly is provided on one side of the substrate, and the other side of the substrate is attached to each of the first mounting portions to conduct heat from the first mounting portion to the heat dissipation tooth assembly; the heat dissipation tooth assembly includes a plurality of heat dissipation fins spaced apart to form a heat dissipation airflow channel.

[0008] The beneficial effects of the heat sink provided by this invention are as follows:

[0009] The heat sink of the present invention is still based on an overall T-shaped structure in order to meet the requirements of the UPS module's inverted unit and shared fan.

[0010] Therefore, the inventors of this invention discovered during their long-term research that there are two reasons for the low heat exchange efficiency of existing radiators:

[0011] (1) The overall temperature uniformity of the heat sink is poor, and it cannot effectively utilize the airflow and heat exchange area. This has a significant impact on the overall performance, whether in the front-back direction, left-right direction, or up-down direction, especially in the up-down direction. Specifically, the dimensions in the up-down direction are relatively large, and it is difficult to attach a heat spreader with a sufficient area on the surface / end face of the heat sink substrate in the up-down direction. As a result, the temperature of the power devices located at the bottom is difficult to be conducted to the heat dissipation fins at the top, making the heat dissipation fins at the top essentially useless.

[0012] (2) The material of the heat sink is usually non-pure aluminum (usually called 6-series aluminum), that is, aluminum mixed with more other components. Its thermal conductivity is not high, usually only 180W / (m*K). This is because, after taking into account the cost and actual manufacturing possibility, the aluminum extrusion process used to manufacture the existing T-shaped heat sink usually requires the use of harder aluminum material, so only the above-mentioned non-pure aluminum material can be used. The above two factors together lead to the low heat exchange efficiency of the existing heat sink.

[0013] Based on the above research findings, this invention changes the approach of existing technologies by replacing the T-shaped radiator, which is usually a single-piece radiator, with a split, assembled radiator. It consists of two parts: one is a base plate made of a highly thermally conductive heat spreader, which is equivalent to the base plate of the existing T-shaped radiator. In other words, the heat spreader itself is the radiator base plate; the other is a heat dissipation part that exchanges heat with the airflow, which is made of a radiator of a normal shape. The function of this heat dissipation part is equivalent to the heat dissipation fins of the existing T-shaped radiator.

[0014] Based on this approach, it can simultaneously solve the problem of low heat dissipation efficiency caused by the above two factors, because:

[0015] (1) Since the heat sink with this T-shaped structure is formed by splicing, the substrate can be a vapor chamber plate instead of an ordinary aluminum plate. After using a vapor chamber plate, the thermal conductivity of the vapor chamber plate is significantly improved compared with that of an ordinary aluminum plate. For example, a graphene plate with high thermal conductivity or an aluminum plate with an internally embedded vapor chamber heat pipe can be used to solve the problem of heat being difficult to conduct from the lower part to the upper part in any direction (especially the vertical direction). Furthermore, since the substrate itself is a vapor chamber plate, there is no need to consider the difficulty of adding a vapor chamber plate due to the presence of integrally formed heat dissipation fins on the outside of the substrate. In this way, the heat of the power device can be well conducted from the lower part (second mounting part) of the substrate (vapor chamber plate) to the upper part (first mounting part) and further conducted to the heat dissipation fins, making full use of all the heat dissipation fins and their effective heat dissipation area.

[0016] (2) Since the T-shaped radiator is formed by splicing, the forming process of the radiator's heat dissipation fins and the materials that can be used are no longer restricted.

[0017] Specifically, since it is no longer necessary to integrally form heat dissipation fins extending to both sides of the same substrate, the heat dissipation fins can be formed by a tooth-shaving process, instead of having to integrally form the T-shaped heat sink using aluminum extrusion. The tooth-shaving process, due to its characteristic of using a tool to shave the fins, requires a softer aluminum material; the appropriate material is pure aluminum (commonly known as 1-series aluminum, with a thermal conductivity of approximately 220 W / (m*K)). Therefore, aluminum has a better thermal conductivity than existing technologies, resulting in better thermal conductivity for the heat sink of this invention. Furthermore, by using a tooth-shaving process to form the heat dissipation fins, the tooth height / tooth gap (H / B) ratio can be higher, meaning the fin spacing can be denser, resulting in a larger heat transfer area per unit volume. In contrast, the existing aluminum extrusion process has significant limitations in its tooth height / tooth gap (H / B) ratio due to the process itself.

[0018] In summary, the modular molding and manufacturing method allows for the production of T-shaped heat sinks, meeting the application requirements of modular UPS scenarios. Furthermore, the manufactured T-shaped heat sink can utilize a substrate and heat dissipation fins with higher thermal conductivity, simultaneously addressing the problems of poor heat dissipation performance caused by the generally low thermal conductivity of ordinary aluminum substrates in existing technologies, and the limitation of shape and manufacturing processes restricting the use of only aluminum materials with poor thermal conductivity.

[0019] Secondly, the present invention provides a power module, comprising: a housing and a printed circuit board disposed within the housing; a heat sink as described in the foregoing technical solution, disposed on the printed circuit board; wherein a power device is attached to a second mounting portion, the power device being electrically connected to the printed circuit board; and a fan assembly disposed on one side of the heat sink, the fan's airflow direction matching the extension direction of the heat dissipation duct.

[0020] The power module provided by this invention, by employing the aforementioned heat sink, achieves more efficient heat dissipation for power devices, making it particularly suitable for high power density power modules and improving the reliability and service life of the power module.

[0021] Thirdly, the present invention provides a UPS, including a cabinet and a plurality of power modules disposed within the cabinet as described in the foregoing technical solutions.

[0022] The UPS provided by this invention has the same beneficial effects as the power module because it uses the aforementioned power module, and will not be described in detail here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a heat sink provided in one embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the structure of a heat sink provided in another embodiment of the present invention;

[0026] Figure 3 for Figure 2 A structural schematic diagram of the radiator from another angle;

[0027] Figure 4 for Figure 3The diagram shows the structure of the power module corresponding to the heat sink.

[0028] In the picture:

[0029] 1. Heat spreader; 11. First mounting part; 12. Second mounting part; 13. First plate surface; 14. Second plate surface; 15. First end face; 16. Second end face; 17. Third end face;

[0030] 2. Shovel-tooth heat sink; 21. Base plate; 22. Heat sink fins;

[0031] 3. Power devices;

[0032] 4. Printed circuit boards;

[0033] 5. Fan assembly. Detailed Implementation

[0034] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0035] Since the technical problem addressed by this invention is closely related to the forming and manufacturing process of T-shaped heat sinks, the commonly used processes in this field will be introduced before introducing this invention.

[0036] As is well known, a heat sink includes a substrate and multiple spaced-apart fins disposed on the substrate. In the prior art, heat sinks generally employ the following three existing molding and manufacturing processes:

[0037] 1. Pin-fitting process: The substrate and heat dissipation fins are manufactured separately, with the heat dissipation fins being inserted into mounting slots on the substrate using a pin-fitting method. Due to the fine gap between the heat dissipation fins and the insertion slots, the heat transfer efficiency from the substrate to the heat dissipation fins is low. For the T-shaped heat sink to be manufactured according to this invention, its essence lies in the fact that both sides of the heat sink substrate have heat dissipation fins and at least one side has a heat source. Therefore, if a pin-fitting process is used, not only is there a gap itself, but the labor cost of pin-fitting is also high. Another problem is that pin-fitting slots need to be opened on both sides of the substrate, so the thickness of the part of the substrate corresponding to the heat dissipation fins is greatly reduced, which greatly affects the strength of the heat sink.

[0038] II. Aluminum Extrusion Process: Radiators are formed using a one-piece extrusion process. Specifically, aluminum ingots are heated to approximately 480-520°C, softening them into a solid state. The heated aluminum billet is placed into the barrel of an extruder, and a powerful hydraulic pressure forces the aluminum material through a die with a specific opening shape, continuously extruding it. After cooling, the extruded strip is stretched and straightened to correct any bending. The profile is then cut into individual radiator blanks according to the required length. Its advantage is that it can form radiators of any shape. However, its disadvantage is that, limited by die strength and metal flowability, extrusion molding requires the use of aluminum materials with high hardness / strength, such as the aforementioned 6-series aluminum.

[0039] III. Tooth Shaping Process: The heat sink is formed using tooth shaping. Specifically, a relatively thick aluminum or copper substrate is first prepared. Using a specialized tooth shaping machine, the cutter cuts at high speed and with precision, "shaving" away the metal material layer by layer without cutting it off, thus forming upright heat dissipation fins. After each tooth is shaved, the worktable moves precisely by one tooth pitch to begin shaving the next tooth.

[0040] Heat sinks using the tooth-cutting process can utilize industrial pure aluminum, specifically the aforementioned 1-series aluminum. While possessing high thermal conductivity, allowing for rapid heat transfer from the heat source to the entire heat sink fin, its inherent strength is relatively poor, making it unsuitable for forming large-volume heat sinks. Furthermore, its substrate is unsuitable for applications requiring support. Moreover, existing tooth-cutting equipment typically uses a flat machine base, necessitating a flat surface on the workpiece. This means that for a heat sink, the aluminum block must possess a flat surface. Consequently, after machining one side to form the heat sink fins, the lack of a support surface makes it difficult to machine the heat sink fins on the other side. Therefore, unless custom-made tooth-cutting equipment is commissioned from a supplier, it is difficult to manufacture T-shaped heat sinks suitable for modular UPS applications, which obviously translates to very high costs.

[0041] To resolve the above issues, please refer to the following: Figures 1 to 4 The radiator provided by the present invention will now be described. The radiator includes a heat spreader 1 and two toothed radiators 2.

[0042] The heat spreader 1 has a first plate surface 13 and a second plate surface 14 that are opposite to each other. A first mounting part 11 is provided on the upper part of both the first plate surface 13 and the second plate surface 14. A second mounting part 12 is also provided on the lower part of the first plate surface 13 (i.e., the side opposite to the side where the first mounting part 11 is located). The second mounting part 12 is used to attach and mount the power device 3.

[0043] Regarding whether the second panel 14 is provided with a second mounting part 12. Figure 1 In the embodiment shown, the entire second plate 14 is used to form the first mounting portion. Figure 2In the illustrated embodiment, the second panel 14 is identical to the first panel, both having a first mounting portion 11 at the top and a second mounting portion 12 at the bottom. This is understandable. Figure 1 This is suitable for situations where the number of power devices to be installed is not large. Figure 2 This allows for the installation of more power devices, resulting in higher utilization.

[0044] exist Figure 1 In the first plate 13, a first mounting portion 11 is provided at the upper end and a second mounting portion 12 is provided at the lower end; the first mounting portion 11 and the second mounting portion 12 together occupy the first plate 13. The first mounting portion 11 on the second plate 14 occupies the second plate 14; the substrate of the toothed heat sink 2 corresponding to the first mounting portion 11 on the second plate 14 also occupies the second plate.

[0045] exist Figure 2 In the first plate 13, a first mounting part 11 is provided at the upper end and a second mounting part 12 is provided at the lower end; the first mounting part 11 and the second mounting part 12 together occupy the first plate 13. A first mounting part 11 is provided at the upper end of the second plate 14, and a second mounting part 12 is also provided at the lower end; the first mounting part 11 and the second mounting part 12 of the second plate 13 also together occupy the second plate 14. The first mounting part 11 on the first plate 13 and the first mounting part 11 on the second plate 14 are symmetrically arranged; the second mounting part 12 on the first plate 13 and the second mounting part 12 on the second plate 14 are also symmetrically arranged. On the first plate (13) and the second plate (14), the first mounting part (11) occupies 40%-60% of the area.

[0046] Specifically, to save space and simplify the manufacturing process, the heat spreader 1 is preferably a hexahedral structure. As mentioned earlier, the first mounting part 11 and the second mounting part 12 can be entirely distributed on the same surface of the heat spreader 1, or partially distributed on the same side surface. That is, the same surface of the heat spreader 1 simultaneously has the first mounting part 11 and the second mounting part 12. The heat spreader 1 is used to conduct heat from the second mounting part 12 to the first mounting part 11. It can be made of a solid material with high thermal conductivity, such as a high thermal conductivity graphite sheet / graphene sheet or a metal matrix composite material; it can also be an aluminum plate with heat pipes embedded inside, which rapidly transfers heat through the evaporation-condensation cycle of the internal working fluid. The heat pipe heat spreader generally includes a shell with a cavity and an internal working fluid filled in the cavity. The shell needs to have good thermal conductivity, airtightness, and compatibility with the working fluid. The internal working fluid can be water, methanol, acetone, etc.

[0047] The toothed radiator 2 is made of pure aluminum (i.e., 1-series aluminum) using a toothing process. The thermal conductivity of pure aluminum ranges from 210 W / (m*k) to 230 W / (m*k). The toothed radiator 2 is attached to each of the first mounting portions 11; the number of toothed radiators 2 corresponds to the number of first mounting portions 11. The toothed radiator 2 includes an integrally constructed base plate 21 and a heat dissipation tooth assembly. The heat dissipation tooth assembly is located on one side of the base plate 21, and the other side of the base plate 21 is attached to the first mounting portion 11 using a highly thermally conductive adhesive or welding method, thereby conducting heat from the first mounting portion 11 to the heat dissipation tooth assembly. The heat dissipation tooth assembly includes multiple heat dissipation fins 22 spaced apart to form heat dissipation channels. The multiple heat dissipation fins 22 are parallel and spaced apart, with the root of each heat dissipation fin 22 close to the second mounting portion 12 and the tip of the fin extending away from the second mounting portion 12. A heat dissipation channel is formed between every two heat dissipation fins 22. The direction in which the heat dissipation duct extends defines the airflow direction of the entire radiator.

[0048] The power devices 3 are insulated-gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), etc., and are arranged according to circuit topology to form the rectifier and inverter units within the UPS module. Specifically, multiple power devices 3 are spaced apart and attached to the second mounting part 12. The heat generated during their operation is transferred to the toothed heat sink 2 through the heat spreader 1. Cool air passes through multiple heat dissipation channels to carry away the heat from the toothed heat sink 2, thereby cooling the power devices 3.

[0049] Because the heat spreader 1 and the toothed radiator 2 are separate components, the toothed radiator 2 can be formed using the existing toothed process, and its material is pure aluminum with a high thermal conductivity. The power device 3 is attached to the heat spreader 1, which provides stable support for it.

[0050] The first mounting part 11 and the second mounting part 12 are integrated on the same surface of the heat spreader 1. Preferably, the first mounting part 11 and the second mounting part 12 fill the same surface after being combined. After the heat is transferred from the power device 3, it is directly diffused laterally through the heat spreader 1 and immediately conducted to the root of the adjacent toothed heat sink 2, forming a lateral diffusion and a highly efficient path for nearby conduction.

[0051] In addition, integrating the power device 3 and the toothed heat sink 2 on the same side of the heat spreader 1 not only improves space utilization but also facilitates the overall structural layout of the power module.

[0052] The shovel-tooth radiator 2 has multiple heat dissipation air ducts extending along the airflow direction, which increases the heat dissipation surface area and allows cool air to flow more evenly through each air duct, reducing hot air accumulation and improving heat dissipation efficiency.

[0053] In some embodiments, the distribution of the power devices 3 described above can be as follows: Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4 The second mounting part 12 can fit and mount multiple power devices 3, and the multiple power devices 3 are spaced apart along the airflow direction.

[0054] Multiple power devices 3 are installed on the second mounting section 12, which meets the design requirements of high power density of the power module. Moreover, the multiple power devices 3 are distributed at intervals along the airflow direction. In terms of layout, it is only necessary to extend the length of the heat exchange plate 1 along the airflow direction, without increasing the height of the heat exchange plate 1. Consequently, the height occupied by the power module will not be increased.

[0055] Since multiple power devices 3 are distributed at intervals along the airflow direction, multiple independent, high-intensity hot spots will be formed in the airflow direction. Without the heat spreader 1, the power devices 3 at the rear end will always be in the hot air heated by the power devices 3 at the front end, causing the temperature to rise step by step and forming a vicious cycle.

[0056] For a layout where multiple power devices 3 are spaced apart along the airflow direction, the heat spreader 1 acts as a heat distribution balancer, quickly dispersing the heat generated by the multiple spaced power devices 3 within its own plane. It integrates concentrated heat from different points into a relatively uniformly distributed thermal field, which is then transferred to the entire toothed radiator 2. In this way, the heat carried away by the airflow over any section of the toothed radiator 2 comes from the entire heat spreader 1, rather than just the single power device 3 directly below it, thus smoothing the temperature gradient of the toothed radiator 2 in the airflow direction.

[0057] Even if a power device 3 is located downstream in the airflow direction, the temperature of the corresponding portion of the shovel-shaped heat sink 2 is the overall temperature after being balanced by the heat spreader 1, rather than a localized high temperature caused by the upstream device. Simultaneously, although the downstream airflow experiences a temperature increase, the temperature rise is controllable due to the uniform temperature across all airflow channels. This reduces the maximum temperature difference between power devices 3 at different locations in the system, ensuring that all power devices 3 can operate within a closer and more optimal temperature range.

[0058] Furthermore, in certain application scenarios, several upstream power devices 3 are not operating, while several downstream power devices 3 are operating. In such scenarios, without a heat spreader 1, the airflow path for the downstream power devices 3 is short, resulting in insufficient heat dissipation. Additionally, the power devices 3 corresponding to the upstream toothed radiator 2 are not operating, leading to low temperatures and low utilization of that section of the radiator 2. However, with the heat spreader 1 installed, the heat from the downstream power devices 3 can be quickly diffused throughout the heat spreader 1 and then transferred to the entire toothed radiator 2, thereby increasing the airflow path for the downstream power devices 3 and improving heat dissipation.

[0059] exist Figure 2 In this embodiment, the toothed radiator 2 occupies both a portion of the first plate 13 and the entire second plate 14, thereby increasing the effective heat dissipation surface area (i.e., the area in contact with air) by at least double compared to a single-sided arrangement. A larger heat dissipation surface area means that, under the same wind speed and environment, more medium can exchange heat with the air per unit time, thus removing more heat and enabling the entire radiator to handle higher power outputs.

[0060] The vapor chamber 1 is sandwiched between two sets of toothed heat sinks 2, or rather, the toothed heat sinks 2 wrap around the vapor chamber 1 from both sides, creating a multi-directional heat flow path. Heat is transferred from the first mounting part 11 on the first plate surface 13 and directly enters the portion of the toothed heat sink 2 located on the first plate surface 13. The vapor chamber 1 utilizes its superior lateral thermal conductivity to instantly spread heat across the entire plate surface, and simultaneously conducts heat through the plate thickness direction to the toothed heat sink 2 that fills the second plate surface 14. Heat dissipates from the center of the vapor chamber 1 to both sides, with the shortest path and least resistance, greatly reducing the total thermal resistance from the heat source to the final heat dissipation medium (air), which allows the operating temperature of the power device 3 to be maintained at a lower level.

[0061] Even though the power device 3 is only mounted on the first plate 13, the temperature field of the entire heat spreader 1 becomes more uniform due to the rapid redistribution of heat by the heat spreader 1 and the synchronous cooling of the double-sided heat dissipation teeth.

[0062] In some embodiments, the heat spreader 1 described above can also be as follows: Figure 3 and Figure 4 The structure shown is described in the following document. Figure 3 and Figure 4 The heat spreader 1 has a first plate surface 13 and a second plate surface 14 facing each other. A portion of the first mounting portion 11 is located on the first plate surface 13 and a portion on the second plate surface 14; a portion of the second mounting portion 12 is located on the first plate surface 13 and a portion on the second plate surface 14. In this embodiment, both the first plate surface 13 and the second plate surface 14 are provided with power devices 3 and toothed heat sinks 2. Under the premise of the same length, the number of power devices 3 in this method is doubled compared to the number of power devices 3 in the first and second embodiments described above, thereby improving power density and space utilization.

[0063] Furthermore, symmetrically mounting the power devices 3 on both surfaces of the vapor chamber 1 means that the vapor chamber 1 is no longer a single-sided heating system, but a double-sided symmetrical heating system. All power devices 3, whether mounted on the first surface 13 or the second surface 14, are under identical heat dissipation conditions. Their junction temperatures will be highly consistent, completely eliminating performance and lifespan differences caused by different mounting positions. Simultaneously, for the heat pipe type vapor chamber 1, double-sided heating maximizes the internal heat flow efficiency, doubling the heat treatment capacity per unit area.

[0064] In the above three embodiments, the first mounting portion 11 and the second mounting portion 12 on the first plate surface 13 together occupy the first plate surface 13, and the occupancy ratio of the first mounting portion 11 is 40%-60%, and correspondingly, the occupancy ratio of the second mounting portion 12 is 40%-60%.

[0065] The first mounting section 11 and the second mounting section 12 together occupy the entire first plate surface 13, meaning that no area is wasted. The power device 3 and the heat dissipation base structure are closely adjacent, forming a compact layout. At the same time, the large-area integral welding or connection increases the structural strength between the heat spreader 1 and the toothed heat sink 2, enabling it to better withstand vibration and thermal stress.

[0066] The aforementioned occupancy ratio ensures that the areas of the heat-generating and heat-dissipating regions are within the optimal matching range. If the proportion of the second mounting portion 12 is too small (<40%), it means that the mounting area of ​​the power devices 3 is insufficient, which may not be able to support the layout of the power devices 3, or the contact area of ​​a single power device 3 is too small, causing the heat flow to encounter a bottleneck at the inlet, and the advantages of the heat spreader 1 cannot be fully utilized. If the proportion of the second mounting portion 12 is too large (>60%), it means that the area left for the base of the toothed heat sink 2 is insufficient. Although the heat can be quickly transferred by the heat spreader 1, the heat dissipation area is too small, and the heat will accumulate on the contact surface between the heat spreader 1 and the toothed heat sink 2, forming a new thermal bottleneck.

[0067] By adopting the above occupancy ratio, the entire process of heat from injection to exhaust is smooth and unobstructed, balancing the heat input impedance and heat output impedance, allowing the high thermal conductivity of the heat spreader 1 to be seamlessly transferred to the toothed heat sink 2, thereby maximizing the heat dissipation efficiency of the entire system.

[0068] In some embodiments, the heat exchange plate 1 and the toothed radiator 2 can be connected by, for example, Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4The heat spreader 1 has a hexahedral structure and also has a first end face 15, a second end face 16 and a third end face 17. The first end face 15 and the second end face 16 are arranged at intervals along the airflow direction. The third end face 17 is connected between the first end face 15 and the second end face 16 and is close to the second mounting part 12. The first end face 15, the second end face 16 and the third end face 17 are respectively aligned with the three outer surfaces of the toothed radiator 2.

[0069] The first end face 15 and the second end face 16 are aligned with the two side surfaces of the shovel-tooth radiator 2, forming a flat, non-abrupt air inlet and outlet surface. This avoids the airflow from generating eddies and turbulence at the inlet due to the impact of the protruding structure, achieving a smooth, streamlined entry and exit. Therefore, it reduces the resistance to airflow, improves the efficiency of cooling air passage, and enhances the effect of forced convection cooling.

[0070] Furthermore, the three end faces of the heat spreader 1 are aligned with the three outer surfaces of the toothed heatsink 2, eliminating any unnecessary structural redundancy and wasted space. The volume of the heat spreader 1 is precisely defined as the minimum space required to support the toothed heatsink 2 and install the power devices 3. On the other hand, this makes the connection between the heat spreader 1 and the toothed heatsink 2 easier, and the entire heat dissipation module is easier to fix and install in the whole machine, and the interface design with other components such as air ducts and housings is also simpler.

[0071] In some embodiments, the aforementioned toothed radiator 2 may employ, as shown in the following... Figure 1 and Figure 4 The structure shown is described in the following document. Figure 1 and Figure 4 The toothed heat sink 2 includes a substrate 21 and a plurality of heat dissipation fins 22. The substrate 21 is attached to the first mounting part 11; the plurality of heat dissipation fins 22 are spaced apart on the substrate 21; the root of the tooth of the heat dissipation fin 22 is connected to the substrate 21, and the tip of the tooth of the heat dissipation fin 22 extends in a direction perpendicular to the substrate 21 and away from the substrate 21; a set of heat dissipation air channels is formed between each pair of adjacent heat dissipation fins 22.

[0072] The substrate 21 serves as a transition structure connecting the heat spreader 1 and the heat dissipation fins 22. The substrate 21 is tightly attached to the second mounting portion 12 of the heat spreader 1, and its primary function is to receive the highly homogenized heat transferred from the heat spreader 1 through its ultra-high thermal conductivity. The substrate 21 also provides a flat and robust base for mounting multiple independent heat dissipation fins 22.

[0073] Although the vapor chamber 1 has already made the base temperature uniform, the substrate 21, as an additional, highly thermally conductive metal layer (usually aluminum or copper), can further smooth out any minor temperature fluctuations, ensuring that an absolutely uniform temperature reference surface is provided to all the heat dissipation fins 22 on it. This further guarantees the temperature consistency of all heat dissipation airflow starting points.

[0074] The substrate 21 connects the roots of multiple independent heat dissipation fins 22 into a whole, which greatly enhances the mechanical strength of the finned heat sink 2 and can effectively prevent the heat dissipation fins 22 from bending or being damaged due to transportation, vibration or accidental collision, thereby improving the reliability and durability of the entire heat sink.

[0075] The heat dissipation fins 22 are the core components that ultimately exchange heat with the cooling medium (air). By extending a large number of finned structures, the surface area in contact with the air is greatly increased within a limited projected area.

[0076] Preferably, the toothed radiator 2 is made of 1-series pure aluminum material, with an aluminum content of 99.00% or higher. The toothed radiator can be manufactured using a toothed process.

[0077] The thermal conductivity of aluminum is approximately 237 W / (m·K). When the purity of aluminum reaches 99.00% or higher, the impurity content is extremely low. Impurity atoms severely interfere with the propagation of lattice vibrations (i.e., heat conduction). Therefore, the thermal conductivity of high-purity aluminum is close to its theoretical maximum, ensuring that heat can be rapidly and losslessly transferred from the substrate 21 in contact with the heat spreader 1 to the tip of each heat dissipation fin, making the temperature field of the entire toothed heat sink 2 more uniform and maximizing heat dissipation efficiency.

[0078] Although pure aluminum itself has low mechanical strength and is relatively soft, in this application of the toothed radiator 2, the toothed radiator 2 is fixed on the heat spreader 1, and the heat spreader 1 provides rigid support. The deformation of the toothed radiator 2 no longer depends solely on the strength of the pure aluminum itself, but is determined by the strength of the composite structure of pure aluminum + heat spreader 1, which is much higher than the former.

[0079] Moreover, the rigidity of the heat spreader 1 greatly enhances the bending stiffness of the entire radiator. When subjected to external vibration or impact, the heat spreader 1, as the core frame, suppresses the overall shaking, thereby protecting the fine aluminum fins on it from fatigue fracture or permanent bending due to resonance or inertial force.

[0080] In addition, the entire heat sink is secured to the equipment (such as the chassis or printed circuit board 4) by screws and other fasteners through the mounting holes on the heat spreader 1. All installation stress and vibration load are directly borne by the high-strength heat spreader 1. The pure aluminum toothed heat sink 2 itself does not directly bear the main installation force, which avoids direct compression, tearing or deformation of the soft aluminum when tightening the screws.

[0081] Please see Figure 4 Based on the same inventive concept, this application also provides a power module, including a housing and a printed circuit board 4 located inside the housing, as well as the aforementioned heat sink and fan assembly 5. The heat sink is disposed on the printed circuit board 4; wherein, a power device 3 is attached to the second mounting portion 12, and the power device 3 is electrically connected to the printed circuit board 4; the fan assembly 5 is disposed on the air inlet side of the heat sink and located on the periphery of the printed circuit board 4, and its air delivery direction matches the extension direction of the heat dissipation air duct of the toothed heat sink.

[0082] The power module provided by this invention, by employing the aforementioned heat sink, can solve the problems of large temperature difference and low efficiency of the heat sink, and achieve more efficient and uniform thermal management. It is particularly suitable for high power density power modules, and improves the reliability and service life of the power module.

[0083] Based on the same inventive concept, this application also provides a UPS, including a cabinet and a plurality of the above-mentioned power modules disposed in the cabinet.

[0084] The UPS provided by this invention has the same beneficial effects as the power module because it uses the aforementioned power module, and will not be described in detail here.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat sink for a UPS power module, characterized in that, include: A heat spreader (1) has a first plate surface (13) and a second plate surface (14) that are opposite to each other; both the first plate surface (13) and the second plate surface (14) are provided with a first mounting part (11), and a second mounting part (12) is provided on the other side of the first plate surface (13) opposite to the side where the first mounting part (11) is located; the second mounting part (12) is used to attach and mount a power device (3); the heat spreader (1) is used to conduct the heat of the second mounting part (12) to the first mounting part (11). as well as The toothed radiator (2) is made of pure aluminum material by toothing process and includes an integral substrate (21) and a heat dissipation tooth assembly; the heat dissipation tooth assembly is provided on one side of the substrate (21) and the other side of the substrate (21) is attached to each of the first mounting parts (11) to conduct the heat of the first mounting part (11) to the heat dissipation tooth assembly; the heat dissipation tooth assembly includes a plurality of heat dissipation fins (22) spaced apart to form a heat dissipation air duct.

2. The radiator as described in claim 1, characterized in that: The first mounting part (11) is provided at the upper end of the first plate (13), and the second mounting part (12) is provided at the lower end; the first mounting part (11) and the second mounting part (12) of the first plate (13) together fill the first plate (13); The first mounting portion (11) on the second plate (14) fills the second plate (14); the substrate of the toothed heat sink (2) corresponding to the first mounting portion (11) on the second plate (14) also fills the second plate.

3. The radiator as described in claim 1, characterized in that: The first mounting part (11) is provided at the upper end of the first plate (13), and the second mounting part (12) is provided at the lower end; the first mounting part (11) and the second mounting part (12) of the first plate (13) together fill the first plate (13); The upper end of the second plate (14) is provided with the first mounting part (11), and the lower end is also provided with a second mounting part (12); the first mounting part (11) and the second mounting part (12) of the second plate (13) also fill the second plate (14).

4. The radiator as described in claim 3, characterized in that: The first mounting portion (11) on the first plate surface (13) and the first mounting portion (11) on the second plate surface (14) are symmetrically arranged; the second mounting portion (12) on the first plate surface (13) and the second mounting portion (12) on the second plate surface (14) are symmetrically arranged; On the first plate (13) and the second plate (14), the first mounting part (11) occupies 40%-60% of the area.

5. The radiator according to any one of claims 1-4, characterized in that, The direction of the extension of the heat dissipation duct defines the airflow direction; The heat spreader (1) is a plate-shaped structure made of aluminum, and a heat spreader is embedded therein; the heat spreader (1) also has a first end face (15), a second end face (16) and a third end face (17), the first end face (15) and the second end face (16) are arranged at intervals along the airflow direction; the third end face (17) is connected between the first end face (15) and the second end face (16) and is close to the second mounting part (12); The first end face (15), the second end face (16) and the third end face (17) are respectively aligned with the three outer surfaces of the shovel-tooth radiator (2).

6. The radiator as described in claims 1-4, characterized in that: The spade-shaped heat sink (2) is made of 1-series aluminum material, and its thermal conductivity ranges from 210W / (m*k) to 237W / (m*k). The plurality of heat dissipation fins (22) are spaced apart on the substrate (21); the root of the heat dissipation fins (22) is connected to the substrate (21), and the tip of the heat dissipation fins (22) extends in a direction perpendicular to the substrate (21) and away from the substrate (21); a set of heat dissipation channels is formed between each pair of adjacent heat dissipation fins (22).

7. The radiator as described in claim 1, characterized in that: The direction of the extension of the heat dissipation duct defines the airflow direction; The first mounting part (11) can fit and mount a plurality of power devices (3), and the plurality of power devices (3) are spaced apart along the airflow direction.

8. The radiator as described in claim 1, characterized in that: The base plate (21) of the shovel-tooth radiator (2) is attached to the first mounting part (11) by welding.

9. A power module, characterized in that, Includes the housing and the contents within the housing: Printed circuit board (4); The heat sink as described in any one of claims 1-8 is disposed on the printed circuit board (4); wherein a power device (3) is attached to the second mounting portion (11), and the power device (3) is electrically connected to the printed circuit board (4); and A fan assembly (5) is disposed on one side of the radiator, and its air supply direction matches the extension direction of the heat dissipation duct.

10. A modular UPS, characterized in that, It includes a cabinet and a plurality of power modules disposed within the cabinet as described in claim 9.

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