Electronic component and electronic equipment

Abstract

The invention provides an electronic assembly. The electronic assembly comprises a first heat dissipation plate, a second heat dissipation plate and a first circuit board assembly, the first heat dissipation plate is provided with a flow channel; the second heat dissipation plate is fixed to the first heat dissipation plate, a working medium cavity is defined by the second heat dissipation plate and the first heat dissipation plate, and the working medium cavity communicates with the flow channel; the first circuit board assembly comprises a first circuit board, a first device and a second device, and the first device and the second device are arranged on the same side of the first circuit board; the first circuit board and the first heat dissipation plate are stacked, the first device is connected with the first heat dissipation plate, and the second device is connected with the second heat dissipation plate. The invention further provides electronic equipment which comprises a working medium and the electronic assembly, and the working medium circulates in the flow channel and the working medium cavity of the electronic assembly. According to the scheme, efficient heat dissipation can be achieved, and the reliability and experience of a product are improved.

Description

[0001] This application is a divisional application of the original application with the application number 202210832986.3 and the original filing date of July 15, 2022, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of electronic products, in particular to an electronic assembly and an electronic device. BACKGROUND

[0003] With the development of information technology, the chip integration on the circuit board of the electronic device is getting higher and higher, and the power consumption of the chip is also continuously increasing, which puts higher requirements on the heat dissipation of the chip. However, the existing product heat dissipation scheme cannot effectively dissipate heat, affecting the reliability and experience of the product. SUMMARY

[0004] The present application provides an electronic assembly and an electronic device, which can realize efficient heat dissipation and improve the reliability and experience of the product.

[0005] In a first aspect, the present application provides an electronic assembly, comprising a first heat sink, a second heat sink and a first circuit board assembly. The first heat sink has a flow channel, and the second heat sink is fixed to the first heat sink and surrounds a working medium cavity with the first heat sink, and the working medium cavity is in communication with the flow channel. The first circuit board assembly comprises a first circuit board, a first device and a second device, and the first device and the second device are arranged on the same side of the first circuit board. The first circuit board is stacked with the first heat sink, the first device is connected with the first heat sink, and the second device is connected with the second heat sink.

[0006] In the electronic assembly provided by the present application, the entire surface of the second heat sink connected with the second device can be used for heat exchange. The first heat sink and the second heat sink respectively dissipate heat for the first device and the second device of the circuit board assembly, different heat sinks are set according to the different heat dissipation requirements of the first device and the second device, which can maximize the role and utilization of the first heat sink and the second heat sink, ensure effective heat dissipation of the electronic assembly, and thus improve the reliability and experience of the product.

[0007] In an implementation form of the first aspect, the flow channel is embedded in the internal flow channel of the first heat sink. The first heat sink of this implementation form has a simple structure, the flow channel can be obtained by drilling, has good mass productivity, and the heat dissipation module structure is reliable, which can ensure good heat dissipation effect.

[0008] In an implementation form of the first aspect, the first heat dissipation plate comprises a base plate and a cover plate, a surface of the base plate has a flow channel groove, and the cover plate is connected to the side of the base plate having the flow channel groove, the cover plate covering the base plate and covering the flow channel groove to form a flow channel. The flow channel of this implementation form is simple to process and difficult to process, and only needs to process the flow channel groove on the surface of the base plate by milling or other methods. The flow channel groove can cooperate with the cover plate to form the flow channel. The processing method of the flow channel groove can be selected from a variety of processing methods, and the shape of the flow channel groove has high freedom and flexibility. Therefore, the first heat dissipation plate of this implementation form has high adaptability and expandability, and can meet the needs of more working environments.

[0009] In an implementation form of the first aspect, the first heat dissipation plate comprises a base plate and a flow channel pipe, the base plate is provided with a receiving groove, and the flow channel pipe is fixed in the receiving groove and serves as a flow channel. The flow channel of this implementation form can be completely assembled by the flow channel pipe, so that the flow channel has high design freedom, high expandability and adaptability, and is simple and efficient to maintain.

[0010] In an implementation form of the first aspect, the first heat dissipation plate comprises a base plate and a flow channel pipe, the base plate is provided with a base plate flow channel, and the flow channel pipe is installed on the base plate and communicates with the base plate flow channel, and the flow channel pipe and the base plate flow channel jointly form a flow channel. The first heat dissipation plate of this implementation form has high shape freedom, high expandability and adaptability, because it is assembled by the base plate and a plurality of flow channel pipes. If the flow channel pipe of the first heat dissipation plate is damaged, the entire first heat dissipation plate does not need to be replaced, and only the local flow channel pipe needs to be replaced, which can greatly reduce the maintenance cost and improve the maintenance efficiency.

[0011] In an implementation form of the first aspect, the first heat dissipation plate has a mounting groove in communication with the flow channel, and the second heat dissipation plate is installed in the mounting groove and covers the opening of the mounting groove to form a working medium cavity with the first heat dissipation plate. The mounting groove is arranged on the first heat dissipation plate to accommodate at least part of the second heat dissipation plate, so that the second heat dissipation plate is fixedly connected with the first heat dissipation plate, the thickness of the assembly connection of the first heat dissipation plate and the second heat dissipation plate in the thickness direction of the first heat dissipation plate is reduced, thereby reducing the thickness of the electronic assembly, which is conducive to the thinning of the product.

[0012] In an implementation form of the first aspect, the flow channel comprises a first main flow channel, a second main flow channel and a plurality of branch flow channels, the first main flow channel is arranged in parallel with the second main flow channel at intervals, each branch flow channel is in communication with the first main flow channel and the second main flow channel, the plurality of branch flow channels are spaced apart and connected in parallel. After the flow channel is divided into the main flow channel and the branch flow channel, the branch flow channel shares the heat dissipation pressure of the main flow channel, the contact area of the working medium in the flow channel is increased, the first heat dissipation plate can quickly dissipate heat, and the heat dissipation efficiency of the first heat dissipation plate is improved. After the plurality of branch flow channels are connected in parallel, the branch flow channels do not interfere with each other, if the branch flow channel is damaged, only the heat dissipation performance of the current branch flow channel range is affected, and the heat dissipation performance of other branch flow channels is not affected, and the reliability of the heat dissipation system can be greatly improved.

[0013] In an implementation form of the first aspect, the electronic assembly comprises a plurality of second heat dissipation plates, and at least one branch flow channel is connected in series with at least two second heat dissipation plates. Each branch flow channel shares a part of the heat load of the second heat dissipation plate, so that the working of the electronic device is not affected by excessive heat concentration of the system, and the heat dissipation efficiency of the system is improved. After the plurality of branch flow channels are connected in parallel, the branch flow channels do not interfere with each other, if the branch flow channel is damaged, only the heat dissipation performance of the second heat dissipation plate on the current branch flow channel is affected, and the heat dissipation performance of the second heat dissipation plate of other branch flow channels is not affected, and the reliability of the heat dissipation system and the electronic assembly can be greatly improved.

[0014] In an implementation form of the first aspect, the opposite sides of the first heat dissipation plate are respectively provided with the circuit board assembly and the second heat dissipation plate; in the circuit board assembly on the same side of the first heat dissipation plate, the first device is connected with the first heat dissipation plate, and the second device is connected with the second heat dissipation plate on the same side. The plurality of circuit board assemblies on the two sides of the first heat dissipation plate dissipate heat by using the first heat dissipation plate together, the layering of the circuit board assemblies is realized, and then the high-density layout of the devices is ensured to meet the functional requirements of the product. The design makes the structure of the electronic assembly relatively simple, the total thickness of the electronic assembly is relatively small, and the thinness of the electronic device is facilitated. In addition, since the second heat dissipation plates on the two sides of the first heat dissipation plate are in communication with the first heat dissipation plate, the layout of the working medium flow channel of the heat dissipation module is relatively simple, the product is improved in mass production and reliability, and the cost is reduced.

[0015] In an implementation form of the first aspect, the electronic assembly further comprises a fixing member and an elastic member, the fixing member connects the first circuit board and the first heat dissipation plate, and the elastic member is located between the fixing member and the first circuit board, and the elastic member elastically abuts against the fixing member and the circuit board. The floating connection of the circuit board assembly and the first heat dissipation plate gives a certain installation tolerance between the circuit board assembly and the heat dissipation module. The floating connection can adaptively maintain the installation pressure between the two within a certain range, which can greatly avoid damage to the electronic elements during installation, effectively improve the yield of the product, and save the production cost.

[0016] In one implementation of the first aspect, a portion of the first heat sink is hollowed out, and the second heat sink is fixed to the non-hollowed-out area of ​​the first heat sink. The substrate has a hollowed-out plate-like structure, which can reduce material consumption, decrease weight, and save costs.

[0017] Secondly, this application provides an electronic device, including a working fluid and the aforementioned electronic components, wherein the working fluid flows within a flow channel and a working fluid cavity. In the electronic device provided by this application, the working fluid can carry away the heat of the electronic components, maintaining the efficient operation of the electronic components.

[0018] Thirdly, this application provides a heat dissipation module, including a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate has a flow channel, and the second heat dissipation plate is fixed to the first heat dissipation plate and forms a working fluid cavity with the first heat dissipation plate. The working fluid cavity is connected to the flow channel.

[0019] In the heat dissipation module provided in this application, a first heat sink and a second heat sink can be set according to the different heat dissipation requirements of electronic devices, which can maximize the role of the heat dissipation module and improve the heat dissipation efficiency of the heat dissipation module.

[0020] In one implementation of the third aspect, a second heat sink is provided on both sides of the first heat sink, and the second heat sink on both sides forms a working fluid cavity with the first heat sink, and each working fluid cavity is connected to the flow channel of the first heat sink.

[0021] The second heat sinks are positioned on both sides of the first heat sink, allowing circuit board assemblies to be arranged and cooled on both sides of the heat dissipation module. This solution enables a high-density layout of components to meet product functional requirements. Since only one first heat sink is needed, and the components on both sides of the first heat sink are cooled via the first heat sink and the second heat sinks on either side, the structure of the electronic components is simpler, and the overall thickness of the electronic components is smaller, which is beneficial for achieving thinner and lighter electronic devices. Furthermore, since the second heat sinks on both sides of the first heat sink are connected to the first heat sink, the layout of the working fluid flow channels in the heat dissipation module is simpler, improving the product's mass production feasibility and reliability, and reducing costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the electronic component according to an embodiment of this application; Figure 2 This is an exploded structural diagram of the electronic component according to an embodiment of this application; Figure 3 This is a schematic diagram of a heat dissipation module according to an embodiment of this application; Figure 4 This is a schematic diagram of a heat dissipation module according to an embodiment of this application; Figure 5 yesFigure 4 A magnified view of the structure at point A in the diagram; Figure 6 This is a partial cross-sectional view of the heat dissipation module according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a first heat dissipation module and a second heat dissipation module working together; Figure 8 This is a schematic diagram of another structure where the first heat dissipation module and the second heat dissipation module work together; Figure 9 This is a schematic diagram of a heat dissipation module according to an embodiment of this application; Figure 10 This is a schematic diagram of a heat dissipation module according to an embodiment of this application; Figure 11 A schematic diagram of the heat dissipation module according to an embodiment of this application; Figure 12 This application provides a schematic diagram of the structure of the circuit board assembly and the connector frame in conjunction with each other. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort should fall within the scope of protection of this application.

[0024] This application provides an electronic device, including but not limited to mobile phones, tablets, laptops, desktops, wearable devices (such as smartwatches, smart bracelets, smart glasses, smart helmets, etc.), electronic blood pressure monitors, in-vehicle systems, routers, mobile WiFi, servers, storage devices, switches, communication devices, etc.

[0025] The electronic device may include electronic components and a working fluid, which can flow within the channels of the electronic components to achieve liquid cooling of the electronic components.

[0026] like Figure 1 As shown, the electronic component 10 may include a circuit board assembly 1, a heat dissipation module 2, and a connector 3. The working fluid can flow within the flow channel 21a of the heat dissipation module 2 to effectively remove the heat dissipated by the heat source in the circuit board assembly 1.

[0027] like Figure 2As shown, the circuit board assembly 1 can include a circuit board 11, a first device 12 and a second device 13. The first device 12 and the second device 13 are arranged on the same side of the circuit board 11. In the embodiment of the present application, the second device 13 can be a device with a relatively large amount of heat, such as a main chip, which can be a central processing unit or other high-power device. The first device 12 can be a device with a relatively small amount of heat, such as a low-power chip or other electronic components, such as a voltage reducing stabilizing device, a memory device, and the like. It can be understood that other devices can also be arranged on the circuit board 11 as needed, and the first device 12 and the second device 13 described above are only an example. Devices can be arranged on both sides of the circuit board 11.

[0028] As shown, Figure 2 The first device 12 and the second device 13 generate heat when working, which affects the performance of the first device 12 and the second device 13 and the overall performance of the electronic device, so that the external heat dissipation module 2 is needed to dissipate heat for the first device 12 and the second device 13. The first device 12 and the second device 13 have different amounts of heat, and different parts of the heat dissipation module 2 can be used to dissipate heat for the first device 12 and the second device 13, respectively. The electronic components have different heights on the circuit board 11, and different parts of the heat dissipation module 2 can adapt to electronic components with different heights.

[0029] As shown, Figure 2 The heat dissipation module 2 can include a first heat dissipation plate 21 and a second heat dissipation plate 22, and the first heat dissipation plate 21 and the second heat dissipation plate 22 are fixedly connected. The fixed connection can be a non-detachable connection, such as welding; or the fixed connection can be a detachable connection, such as a threaded connection. The first heat dissipation plate 21 and the second heat dissipation plate 22 can have a generally plate shape, the first heat dissipation plate 21 can have a larger area, and the second heat dissipation plate 22 can have a smaller area. Illustratively, the second heat dissipation plate 22 can be located inside the first heat dissipation plate 21 (i.e. within the outer contour line of the first heat dissipation plate 21).

[0030] As shown, Figure 3 Illustratively, the first heat dissipation plate 21 can be a uniform temperature plate, and the flow channel 21a in the first heat dissipation plate 21 can be generally linear or tubular (the flow channel 21a is a linear flow channel in the embodiment of the present application). Figure 3The flow channel 21a can be connected to an external pipeline to allow the working medium to enter the flow channel 21a. Since the heat exchange area of the linear or tubular flow channel 21a is small, the first heat sink 21 can be used to dissipate heat from the first device 12. The first heat sink 21 is provided with a mounting groove (to be described below), which is in communication with the flow channel 21a on the first heat sink 21. In the present embodiment, the area of the first heat sink 21 where the mounting groove is formed can be integrated with other areas of the first heat sink 21, or the area of the first heat sink 21 where the mounting groove is formed can be connected to other areas of the first heat sink 21 by assembly, which can be a detachable connection or a non-detachable connection.

[0031] As shown in Figure 2 , Figure 4 and Figure 5 , Figure 5 is a partial enlarged view of A of Figure 4 . The second heat sink 22 can be a cold plate, and the second heat sink 22 has heat dissipation fins 221. The second heat sink 22 can cooperate with the mounting groove 21b of the first heat sink 21, and the second heat sink 22 covers the opening of the mounting groove 21b to form a working medium cavity, which is in communication with the flow channel 21a of the first heat sink 21. The heat dissipation fins 221 are accommodated in the working medium cavity, which can increase the contact area between the second heat sink 22 and the working medium and improve the heat dissipation performance. Therefore, the second heat sink 22 can be used to dissipate heat from the second device 13.

[0032] In one embodiment, only one side of the first heat sink 21 can be provided with one or at least two second heat sinks 22. In another embodiment, both sides of the first heat sink 21 can be provided with second heat sinks 22. Several connection structures of the first heat sink 21 and the second heat sink 22 will be described in detail below.

[0033] As shown in Figure 6 and Figure 7 , wherein Figure 7 is a partial enlarged view of B in Figure 6 , two second heat sinks 22 are respectively located on both sides of the first heat sink 21, and the two second heat sinks 22 are fixedly installed with the first heat sink 21. In one embodiment, the first heat sink 21 is provided with a mounting groove 21b on both sides, and the mounting grooves 21b on both sides are independent of each other and are not in communication. The two second heat sinks 22 cover the openings of the two mounting grooves 21b to form two independent working medium cavities; and two flow channels 21a are respectively in communication with the two working medium cavities to supply working medium. Based on Figure 7As shown, in other embodiments, the upper and lower flow channels 21a can also be combined into a single flow channel, which forms two outlets on each side of the two second heat dissipation plates 22, so that the working medium can flow into or out of the two second heat dissipation plates 22 from the two outlets, respectively.

[0034] In another embodiment, as shown, Figure 8 The two second heat dissipation plates 22 are in common communication with a mounting groove 21b. The mounting groove 21b penetrates the first heat dissipation plate 21 and forms openings (the mounting groove 21b is equivalent to a through hole) on both sides of the first heat dissipation plate 21. The two second heat dissipation plates 22 are respectively located on both sides of the first heat dissipation plate 21 and cover one opening of the mounting groove 21b. Thus, the two second heat dissipation plates 22 and the mounting groove 21b of the first heat dissipation plate 21 together enclose the working medium cavity. The first heat dissipation plate 21 has only one flow channel 21a in communication with the working medium cavity to jointly remove the heat of the two second heat dissipation plates 22.

[0035] As shown, Figure 2 The heat dissipation module 2 can also include a heat-conducting medium 23, which can be arranged between the first heat dissipation plate 21 and the first device 12 and also arranged between the second heat dissipation plate 22 and the second device 13. The heat-conducting medium 23 has excellent heat-conducting performance and can effectively increase the heat exchange area with the heat dissipation plates and the devices, thereby helping to improve the heat-conducting efficiency to achieve efficient heat dissipation. Illustratively, the heat-conducting medium 23 between the first heat dissipation plate 21 and the first device 12 can be a heat-conducting pad, and the heat-conducting medium 23 between the second heat dissipation plate 22 and the second device 13 can be a thermal interface material.

[0036] As shown, Figure 1 , Figure 2 and Figure 9 In this embodiment, the circuit board assembly 1 can be carried on the heat dissipation module 2. The circuit board 11 can be arranged in a stack with the first heat dissipation plate 21, and the first device 12 can be connected to the first heat dissipation plate 21 through the heat-conducting medium 23. The second heat dissipation plate 22 and the circuit board 11 can be located on the same side of the first heat dissipation plate 21, and the second device 13 can be connected to the second heat dissipation plate 22 through the heat-conducting medium 23. Thus, the first device 12 with a lower heat generation can be connected to the first heat dissipation plate 21 for heat dissipation, and the second device 13 with a higher heat generation can be connected to the second heat dissipation plate 22 and the first heat dissipation plate 21 for heat dissipation, which can be targeted at the heat generation characteristics of different devices and perform corresponding heat dissipation for different devices to ensure the heat dissipation performance of the entire circuit board assembly 1. Therefore, the scheme of this embodiment can effectively dissipate heat for the circuit board assembly 1 and ensure the reliability and experience of the product.

[0037] ​In this embodiment, one or at least two circuit board assemblies 1 can be carried on the heat dissipation module 2 according to product needs, and each circuit board assembly 1 can achieve heat dissipation through the heat dissipation design described above. It can be understood that if only the first device 12 or the second device 13 is arranged on the circuit board of a certain circuit board assembly 1, the first device 12 achieves heat dissipation through the first heat dissipation plate 21, or the second device 13 achieves heat dissipation through the second heat dissipation plate 22 and the first heat dissipation plate 21.

[0038] As shown in FIG. 1, in an embodiment, the first heat dissipation plate 21 is provided with one or at least two circuit board assemblies 1 on one side. Figure 9 Correspondingly, the second heat dissipation plate 22 can also be provided on the side of the first heat dissipation plate 21 provided with the circuit board assembly 1.

[0039] It can be understood that in this embodiment, one or at least two circuit board assemblies 1 can be provided on one side of the first heat dissipation plate 21. When at least two circuit board assemblies 1 are provided, the adjacent circuit board assemblies 1 can be spaced apart. Correspondingly, one or at least two second heat dissipation plates 22 can be provided on one side of the first heat dissipation plate 21. When at least two second heat dissipation plates 22 are provided, the adjacent second heat dissipation plates 22 can be spaced apart, each second heat dissipation plate 22 can be connected to one circuit board assembly 1, and one circuit board assembly 1 can be connected to one or at least two second heat dissipation plates 22.

[0040] As shown in FIG. 2, in another embodiment, one or at least two circuit board assemblies 1 are provided on both sides of the first heat dissipation plate 21, and the second heat dissipation plate 22 is provided on both sides of the first heat dissipation plate 21 to correspond to the circuit board assemblies 1 on both sides. Figure 10 Correspondingly, when at least two second heat dissipation plates 22 are provided, the adjacent second heat dissipation plates 22 can be spaced apart, each second heat dissipation plate 22 can be connected to one circuit board assembly 1, and one circuit board assembly 1 can be connected to one or at least two second heat dissipation plates 22.

[0041] In the above embodiment in which the circuit board assemblies 1 are provided on both sides of the first heat dissipation plate 21, the second heat dissipation plates 22 on both sides of the first heat dissipation plate 21 can be symmetrically distributed on the first heat dissipation plate 21, and each two symmetric working fluid cavities are in communication with the same flow channel 21a, that is, when the working fluid flows in the flow channel 21a between the two second heat dissipation plates 22, the heat of the two second heat dissipation plates 22 is simultaneously taken away. The structure design of the heat dissipation assembly and the layout of the flow channel 21a in this design are relatively simple, the reuse rate of the flow channel 21a is high, the area of the first heat dissipation plate 21 can be effectively saved, and the utilization rate of the first heat dissipation plate 21 is improved.

[0042] In this embodiment, the structure of the first heat dissipation plate 21 and the second heat dissipation plate 22 can be designed flexibly to adapt to the height of the first device 12 and the second device 13, and to ensure reliable connection between the heat dissipation plates and the devices.

[0043] The structure of the heat dissipation module 2 and the connection structure between the heat dissipation module 2 and the circuit board assembly 1 will be described below.

[0044] As shown in Figure 3 , in an embodiment, the flow channel 21a in the first heat dissipation plate 21 can be embedded, i.e. the flow channel 21a is embedded in the interior of the first heat dissipation plate 21, which is hidden below the surface of the first heat dissipation plate 21 and not exposed externally. The two ends of the flow channel 21a can form interfaces to facilitate external pipe connection for input of the working medium into the flow channel 21a. Illustratively, the flow channel 21a can be manufactured by drilling or the like.

[0045] In this embodiment, the distribution of the flow channel 21a can be designed as needed. For example, the flow channel 21a can substantially cover the entire area of the first heat dissipation plate 21. The flow channel 21a can be composed of several sub-flow channels 21a in series, in parallel, or in series + parallel.

[0046] As shown in Figure 3 , the flow channel 21a can include a first main flow channel 211a, a second main flow channel 212a, and a plurality of branch flow channels 213a. The first main flow channel 211a and the second main flow channel 212a are flow channels on both sides of the substrate, and the branch flow channels 213a are flow channels in the middle of the substrate. Figure 3 As shown in the direction , the first main flow channel 211a and the second main flow channel 212a are transversely flowing flow channels, and the first main flow channel 211a and the second main flow channel 212a each have an input and output port for connection with the working medium. The branch flow channels 213a are vertically flowing flow channels, and the plurality of branch flow channels 213a have intervals therebetween, and the two ends of each branch flow channel 213a are in communication with the first main flow channel 211a and the second main flow channel 212a, respectively, so that the plurality of branch flow channels 213a are connected in parallel.

[0047] As shown in Figure 4 and Figure 5 , the first heat dissipation plate 21 can be provided with mounting grooves 21b, the shape and number of which can be designed as needed, and the mounting grooves 21b are in communication with the flow channel 21a, and the flow channel 21a can penetrate the groove wall of the mounting groove 21b. The second heat dissipation plate 22 can be fixed to the mounting groove 21b, and the second heat dissipation plate 22 covers the opening of the mounting groove 21b to form a sealed working medium cavity. Part of the second heat dissipation plate 22 can be exposed to the mounting groove to facilitate connection with the second device 13.

[0048] The first heat dissipation plate 21 of the embodiment has simple structure and good mass productivity. The heat dissipation module 2 of the embodiment has reliable structure and can ensure good heat dissipation effect.

[0049] Different from the above embodiment, in another embodiment, the flow channel 21a in the first heat dissipation plate 21 can be semi-embedded. Specifically, the first heat dissipation plate 21 can include a base plate and a cover plate, both of which are approximately plate-shaped structures. The surface of the base plate is provided with a flow channel groove, and the flow channel groove forms an opening on the surface. The cover plate covers the base plate and covers the opening of the flow channel groove, and the cover plate and the flow channel groove together form the flow channel 21a of the first heat dissipation plate 21. The two ends of the flow channel 21a can form interfaces to facilitate the connection of external pipelines for the input of working medium into the flow channel 21a. Illustratively, the flow channel 21a can be manufactured by milling or other methods.

[0050] When the first heat dissipation plate 21 is provided with the circuit board assembly 1 on only one side, the base plate is provided with the flow channel groove on only one side. When the first heat dissipation plate 21 is provided with the circuit board assembly 1 on both sides, the base plate is provided with the flow channel groove on both sides.

[0051] In the embodiment, the distribution of the flow channel 21a can be similar to that of the flow channel 21a of the previous embodiment, and will not be described in detail here.

[0052] The embodiment has the advantage that the processing method of the flow channel 21a of the embodiment is simpler and the processing difficulty is greatly reduced. Only the flow channel groove needs to be processed on the surface of the base plate by milling or other methods, and the flow channel 21a can be formed by the cooperation of the flow channel groove and the cover plate. There are many processing methods that can be selected for processing the flow channel groove, and the flow channel groove has high freedom and flexibility in shape. Therefore, the first heat dissipation plate 21 of the embodiment has high adaptability and expandability, and can meet the needs of more working environments.

[0053] As shown in Figure 11 In one embodiment, the first heat dissipation plate 21 can include a base plate 211 and a flow channel pipe 212. The base plate 211 can be a partially hollow structure, and the base plate flow channel 211b is embedded in the non-hollow area of the base plate 211 and hidden below the surface of the base plate 211, without being exposed. The base plate flow channels 211b can be directly connected to each other inside the base plate 211, or the flow channel pipe 212 can be arranged between two isolated base plate flow channels 211b to connect the base plate flow channels 211b, and the connected base plate flow channels 211b and the flow channel pipe 212 together constitute the flow channel 21a. The flow channel pipe 212 can be a metal pipe or a non-metal hose, and the specific type can be designed as needed. The base plate 211 is also provided with a mounting groove 21f, and the second heat dissipation plate 22 is fixedly connected with the mounting groove 21f of the base plate 211 to fix and install the second heat dissipation plate 22 with the base plate 211.

[0054] It should be noted that in this embodiment, as shown in Figure 11 the flow channel 21a can include a first main flow channel 21c, a second main flow channel 21d and a plurality of branch flow channels 21e. The first main flow channel 21c and the second main flow channel 21d are flow channels on both sides of the substrate 211, and the branch flow channel 21e is a flow channel 21a in the middle of the substrate 211. In Figure 11 the direction shown, the first main flow channel 21c and the second main flow channel 21d are vertically flowing flow channels, mainly composed of the substrate flow channel 211b inside the substrate 211, and each has an input and output port for connecting with the working medium. The branch flow channel 21e is a horizontally flowing flow channel 21a, which can be composed of a plurality of substrate flow channels 211b inside the substrate 211 and a plurality of flow channel pipes 212. Each branch flow channel 21e is connected in series with at least two second heat dissipation plates 22, and the branch flow channel 21e is in communication with the working medium cavity, so that the flow channel 21a is in communication with the working medium cavity and forms a closed flow chamber. The plurality of branch flow channels 21e are spaced apart, and the two ends of each branch flow channel 21e are in communication with the first main flow channel 21c and the second main flow channel 21d respectively, so that the plurality of branch flow channels 21e are connected in parallel.

[0055] The first heat dissipation plate 21 of the above-mentioned embodiment is a split structure, which has the following advantages: first, the substrate 211 is a hollow plate structure, which can reduce weight and save cost. Second, because the substrate 211 has a plurality of substrate flow channels 211b, the hollow structure can facilitate the processing of substrate flow channels 211b at different positions, which helps to improve the expandability of the shape of the substrate flow channel 211b and reduce the processing difficulty, thereby improving the yield of the substrate 211. Moreover, the first heat dissipation plate 21 is assembled by splicing the substrate 211 and a plurality of flow channel pipes 212, which has high shape freedom, strong expandability and adaptability. Finally, if the flow channel pipe 212 of the first heat dissipation plate 21 is damaged, it is not necessary to replace the entire first heat dissipation plate 21, but only the local flow channel pipe 212 needs to be replaced, which can greatly reduce the maintenance cost and improve the maintenance efficiency.

[0056] In one embodiment, the first heat dissipation plate 21 can include a substrate and a flow channel pipe. The shape and material of the substrate and the flow channel pipe of this embodiment can be similar to those of the previous embodiment, except that the substrate does not have a substrate flow channel, but has a receiving groove opened on the outer surface of the substrate, and the flow channel pipe can be embedded in the receiving groove for fixation. A plurality of flow channel pipes are connected to form a flow channel 21a. The substrate also has a mounting groove, and the two sides of the second heat dissipation plate 22 are fixedly connected with the mounting groove of the substrate. The second heat dissipation plate 22 is fixedly connected with the flow channel pipe, so that the flow channel 21a is in communication with the working medium cavity and forms a closed flow chamber. The flow channel 21a of the embodiment is similar to the flow channel 21a of the previous embodiment in composition, and can also include a first main flow channel, a second main flow channel, and a plurality of branch flow channels, and will not be described in detail here.

[0057] The embodiment has the advantages that, first, the substrate is a hollow plate structure, which can reduce weight and save costs. Second, the flow channel 21a of the embodiment is entirely assembled by a plurality of flow channel pipes, and has higher shape freedom, stronger scalability and adaptability, and simpler and more efficient maintenance than the flow channel 21a of the previous embodiment.

[0058] In the assembly connection described above, the circuit board assembly 1 is distributed on the outside of the heat dissipation module 2, and the two can be fixedly connected by the connecting piece 3. Next, the structure and function of the connecting piece 3 will be described.

[0059] As shown in Figure 1 , Figure 2 and Figure 12 , the connecting piece 3 can include a fixing piece 31 and an elastic piece 32. The fixing piece 31 fixedly connects the circuit board 11 and the first heat dissipation plate 21, and can include a screw or other fastener, etc. Illustratively, a portion of the fixing piece 31 can protrude from the surface of the circuit board 11 facing away from the first heat dissipation plate 21, and this portion of the fixing piece 31 can form a larger area end cap (for example, the head of a screw). The elastic piece 32 is installed between the fixing piece 31 and the circuit board. Illustratively, one end of the elastic piece 32 can elastically abut against the end cap of the fixing piece 31, and the other end of the elastic piece 32 can elastically abut against the circuit board 11. The elastic piece 32 can allow the connection between the circuit board 11 and the first heat dissipation plate 21 to be a floating connection, which can allow the spacing between the circuit board 11 and the first heat dissipation plate 21 (or the end cap of the fixing piece 31) to have a slight change (which will be described below). The elastic piece 32 can be a spring or a spring sheet.

[0060] As shown in Figure 2 , Figure 9 and Figure 12 , in an embodiment, the fixing piece 31 is a screw, and the elastic piece 32 is a spring sheet. Illustratively, the elastic piece 32 can be a bent sheet structure, both ends of the elastic piece 32 and the middle section of the elastic piece 32 can be flat structures, and the extension directions of the two ends of the elastic piece 32 are approximately the same as the extension direction of the middle section of the elastic piece 32, and the two ends of the elastic piece 32 are raised relative to the middle section of the elastic piece 32, so that the two ends of the elastic piece 32 and the middle section of the elastic piece 32 are not in the same plane. If the two ends of the elastic piece 32 are subjected to pressure, the bent structure of the elastic piece 32 can provide a restoring force to itself to recover the elastic deformation. As Figure 2As shown, the periphery of the circuit board 11 is provided with the fixing members 31, and each two fixing members 31 are connected with an elastic member 32. The screw portion of the fixing member 31 is threadedly connected with the circuit board 11 and the first heat dissipation plate 21, and the head of the fixing member 31 (i.e. the head of the screw) is spaced apart from the circuit board 11. The elastic member 32 is sleeved on the outer periphery of the screw between the head of the fixing member 31 and the circuit board 11, and abuts against the head of the fixing member 31. The middle section of the elastic member 32 can abut against the circuit board 11, so that the circuit board 11 is connected with the first heat dissipation plate 21 in a floating manner.

[0061] In another embodiment, the fixing member 31 in the connecting member 3 is a screw, the elastic member 32 is a spring, the periphery of the circuit board 11 is provided with the fixing members 31, each fixing member 31 has a corresponding spring, the screw portion of the fixing member 31 is threadedly connected with the circuit board 11 and the first heat dissipation plate 21, the head of the fixing member 31 is spaced apart from the circuit board 11, the spring is sleeved on the screw between the head of the fixing member 31 and the circuit board 11, one end of the spring elastically abuts against the head of the fixing member 31, and the other end of the spring elastically abuts against the circuit board 11, so that the circuit board 11 is connected with the first heat dissipation plate 21 in a floating manner.

[0062] Due to manufacturing errors, the height of devices of the same specification will have a certain range of dimensional tolerance, which leads to the fact that even in the same batch of circuit board assemblies, the height of devices of the same specification on the circuit board will also be different. In the process of mass production of electronic assemblies, a unified assembly process parameter (for example, the number of rotation of the screw when locking the screw) is usually used to assemble the circuit board assembly 1 to the first heat dissipation plate 21. If the circuit board assembly 1 is connected with the first heat dissipation plate 21 in a manner that the spacing is not adjustable, it may cause a larger extrusion between a device with a larger height and the first heat dissipation plate 21 or the second heat dissipation plate 22 (the device is pressed against the first heat dissipation plate 21 or the second heat dissipation plate 22), which may cause damage to the device or the entire circuit board assembly 1, and reduce the assembly yield.

[0063] In view of this, the present embodiment sets the elastic member 32 between the fixing member 31 and the circuit board, so that the circuit board assembly 1 and the first heat sink 21 are floatingly connected, so that the spacing between the circuit board assembly 1 and the first heat sink 21 can be finely adjusted during assembly. For example, if the height of the device is too large, the circuit board 11 can be moved away from the first heat sink 21 and compress the elastic member 32; if the height of the device is too small, the elastic member 32 can press against the circuit board, causing the circuit board to move towards the first heat sink 21. Thus, after assembly is complete, the circuit board 11 can maintain a reasonable spacing from the first heat sink 21, protecting the device from being crushed. Therefore, the floating connection of the present embodiment can provide a certain installation tolerance, and can adaptively adjust the spacing between the circuit board and the first heat sink 21 during assembly to accommodate devices of different heights, thereby greatly avoiding damage to the device during installation, effectively improving product yield, and saving production manufacturing costs.

[0064] In conventional electronic devices, circuit board assemblies 1 are often designed in a stacked arrangement to increase device integration and achieve high-density device layout. However, each layer of circuit board assembly 1 is provided with a corresponding heat dissipation module 2, which results in a complex structure of the electronic assembly, a large number of and complex flow channels of the working medium, and a large overall thickness of the electronic assembly.

[0065] The scheme of the present embodiment provides circuit board assemblies 1 and second heat sinks 22 on opposite sides of the first heat sink 21 to achieve a stacked arrangement of the circuit board assemblies 1, thereby ensuring high-density device layout to meet the functional requirements of the product. Moreover, the electronic assembly of the present embodiment only needs to be provided with one layer of first heat sink 21, and the devices on both sides of the first heat sink 21 are cooled by the first heat sink 21 and the second heat sinks 22 on both sides of the first heat sink 21. This design makes the structure of the electronic assembly relatively simple and the overall thickness of the electronic assembly relatively small, which is conducive to the thinning of the electronic device. In addition, since the second heat sinks 22 on both sides of the first heat sink 21 are in communication with the first heat sink 21, the layout of the working medium flow channel 21a of the heat dissipation module 2 is relatively simple, which improves the producibility and reliability of the product and reduces the cost.

[0066] In the present embodiment, in the scenario where the circuit board assembly 1 is arranged on opposite sides of the heat dissipation module 2 and the circuit boards 11 on both sides are fixed to the first heat sink 21 in the middle, the floating of the circuit boards 11 relative to the first heat sink 21 can be adapted to this scenario.

[0067] The above merely describes specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be encompassed within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic assembly, characterized by The electronic assembly comprises: at least one circuit board assembly comprising a circuit board on which devices can be arranged; a heat dissipation module stacked with the at least one circuit board assembly, comprising a plurality of fixedly connected heat dissipation plates for dissipating heat from the devices arranged in the at least one circuit board assembly.

2. The electronic assembly of claim 1, wherein, The plurality of fixedly connected heat dissipation plates comprises a first heat dissipation plate and a plurality of second heat dissipation plates, wherein the first heat dissipation plate has a flow channel therein; the plurality of second heat dissipation plates are respectively fixed to the first heat dissipation plate and surround the first heat dissipation plate to form a working medium cavity, and the working medium cavity is in communication with the flow channel.

3. The electronic assembly of claim 2, wherein, The first heat dissipation plate comprises a base plate and a cover plate, a surface of the base plate has a flow channel groove, and the cover plate is connected to one side of the base plate having the flow channel groove, the cover plate covers the base plate and covers the flow channel groove to form the flow channel.

4. The electronic assembly of claim 2, wherein, The first heat dissipation plate comprises a base plate and a flow channel pipe, the base plate is provided with a receiving groove, and the flow channel pipe is fixed in the receiving groove, and the flow channel pipe serves as the flow channel.

5. The electronic assembly of claim 2, wherein, The first heat dissipation plate comprises a base plate and a flow channel pipe, the base plate is embedded with a base plate flow channel, and the flow channel pipe is installed on the base plate and in communication with the base plate flow channel, and the flow channel pipe and the base plate flow channel jointly form the flow channel.

6. The electronic assembly according to any one of claims 2 to 5, wherein: the first heat dissipation plate has a mounting groove in communication with the flow channel; the second heat dissipation plate is mounted in the mounting groove and covers the opening of the mounting groove to surround the first heat dissipation plate to form the working medium cavity.

7. The electronic assembly according to any one of claims 2 to 6, wherein: the flow channel comprises a first main flow channel, a second main flow channel and a plurality of branch flow channels, the first main flow channel and the second main flow channel are arranged side by side and spaced apart, each of the branch flow channels is in communication with the first main flow channel and the second main flow channel, the plurality of branch flow channels are spaced apart and connected in parallel.

8. The electronic assembly of claim 7, wherein, At least one of the branch flow channels is connected in series with at least two of the second heat dissipation plates.

9. The electronic assembly according to any one of claims 2 to 8, wherein: the first heat dissipation plate is provided with the at least one circuit board assembly and the plurality of second heat dissipation plates on opposite sides thereof; in the circuit board assembly on the same side of the first heat dissipation plate, the first devices are connected with the first heat dissipation plate, and the second devices are connected with one of the plurality of second heat dissipation plates on the same side.

10. The electronic assembly according to any one of claims 1 to 9, wherein: the electronic assembly further comprises a fixing member and an elastic member; the fixing member connects the first circuit board and the first heat dissipation plate, the elastic member is located between the fixing member and the first circuit board, and the elastic member elastically abuts against the fixing member and the circuit board, wherein the first circuit board is one of the at least one circuit board assembly.

11. The electronic assembly of any one of claims 1 to 10, wherein, The first heat dissipation plate comprises a partially hollowed region, and the second heat dissipation plate is fixed to a non-hollowed region of the first heat dissipation plate.

12. The electronic assembly of any one of claims 1 to 11, wherein, The area of the first heat dissipation plate is greater than the area of the second heat dissipation plate.

13. The electronic assembly of claim 12, wherein, The second heat dissipation plate is located within the outer contour line of the first heat dissipation plate.

14. The electronic assembly of any one of claims 1 to 13, wherein, The first device and the second device are at different heights of the first circuit board assembly, and different parts of the heat dissipation module can adapt to electronic devices of different heights, wherein the first circuit board is one of the at least one circuit board assembly.

15. An electronic device, comprising: An electronic assembly comprising a working medium and the electronic assembly of any one of claims 1-14, the working medium flowing through the flow channel and the working medium cavity.

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