Heat dissipation device and electronic equipment

Abstract

The embodiment of the invention discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a heat exchange piece, a first heat dissipation piece and a second heat dissipation piece, a groove is formed in the first outer surface; at least part of the first structural part is arranged in the groove; the first structural part comprises a capillary structure, and the capillary structure is used for containing a liquid first medium separated from the heat-conducting medium of the first outer surface and allowing the first medium to flow.

Description

Technical Field

[0001] This application relates to heat dissipation technology, and more particularly to a heat dissipation device and electronic equipment. Background Technology

[0002] Heat dissipation structures are commonly used in electronic devices. In related technologies, thermal paste is often applied between the heat dissipation structure and the heat source. However, after a period of use, the thermal paste often becomes ineffective, thus affecting the thermal conductivity of the heat dissipation structure. Summary of the Invention

[0003] This disclosure provides a heat dissipation device and an electronic device that can improve the thermal conductivity of the heat dissipation device.

[0004] The technical solution of this disclosure embodiment is implemented as follows: This disclosure provides a heat dissipation device, including: The heat exchanger includes a first outer surface; the first outer surface has a groove. A first structural member is at least partially disposed within the groove; the first structural member includes a capillary structure for accommodating a liquid first medium separated from the thermally conductive medium on the first outer surface, and for supplying flow to the first medium.

[0005] In some embodiments, the first outer surface includes: a first region; the first region includes a first portion having the groove and a second portion not having the groove.

[0006] In some embodiments, the first outer surface includes a second region disposed adjacent to the first region; wherein the distribution density of the grooves in the first region is greater than the distribution density in the second region.

[0007] In some embodiments, the second region is not provided with a groove; or... The first region has a first groove, and the second region has a second groove; the second groove is connected to the first groove, and the distribution density of the second groove in the second region is less than the distribution density of the first groove in the first region, so that the first medium in the first structural member at the second groove flows into the capillary structure of the first structural member at the first groove.

[0008] In some embodiments, the first outer surface includes: a second region disposed adjacent to the first region; the first region has a first groove, and the second region has a second groove; the capillary size of the first structure at the first groove is smaller than the capillary size of the first structure at the second groove, so that the first medium in the first structure at the second groove flows into the capillary structure of the first structure at the first groove.

[0009] In some embodiments, the first structural member and the first outer surface are coplanar; or, the first structural member protrudes from the first outer surface and is elastic; and / or, The heat dissipation device includes: A thermally conductive medium covers the first outer surface and the first structural component; the thermally conductive medium is a medium whose thickness can be changed by external force; the first medium is a liquid metal, and the thermally conductive medium includes a second medium for reducing the fluidity of the first medium.

[0010] This disclosure provides an electronic device, including a heat-generating component, a heat dissipation device, and a heat-conducting medium. The heat dissipation device is used to provide heat dissipation to the heat-generating component, and the heat dissipation device includes: The heat exchanger includes a first outer surface; the first outer surface has a groove. A first structural member is at least partially disposed within the groove; the first structural member includes a capillary structure, and the heating element is disposed adjacent to the first outer surface and the first structural member. The heat-conducting medium is disposed between the heating element and the first outer surface, and also between the first structural member and the heating element; The capillary structure is used to contain the liquid first medium separated from the thermally conductive medium on the first outer surface, and to supply the flow of the first medium. The thermally conductive medium is a medium whose thickness can be changed by external force.

[0011] In some embodiments, the first outer surface includes: a first region and a second region disposed adjacently; the first region includes a first portion having the groove and a second portion not having the groove. The heating component includes a first heating portion corresponding to the location of the first region and a second heating portion corresponding to the location of the second region; in the first operating state of the electronic device, the temperature of the first heating portion is higher than the temperature of the second heating portion.

[0012] In some embodiments, the electronic device has a first temperature in an operating state and a second temperature in a non-operating state; the first temperature is greater than the second temperature. Under the influence of the changes in the first and second temperatures, the heat-conducting medium between the heat exchanger and the heating element is subjected to a force. The first medium in the heat-conducting medium separates from the second medium based on the force. The first structural member can accommodate the separated first medium in the heat-conducting medium through a capillary structure.

[0013] In some embodiments, the first outer surface includes: a first region and a second region disposed adjacent to each other; the first region includes a first portion having a first groove and a second portion not having a first groove; the second region includes a third portion having a second groove and a fourth portion not having a second groove. In the second state, the first medium in the first structural member at the second groove flows into the capillary structure of the first structural member at the first groove. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a heat dissipation device provided in an embodiment of this disclosure; Figure 2 This is another structural schematic diagram of the heat dissipation device provided in the embodiments of this disclosure; Figure 3 This is another structural schematic diagram of the heat dissipation device provided in the embodiments of this disclosure; Figure 4 This is another structural schematic diagram of the heat dissipation device provided in the embodiments of this disclosure; Figure 5 This is a structural cross-sectional view of the heat dissipation device provided in an embodiment of this disclosure; Figure 6 This is another structural cross-sectional view of the heat dissipation device provided in the embodiments of this disclosure; Figure 7 This is another structural schematic diagram of the heat dissipation device provided in the embodiments of this disclosure; Figure 8 This is a schematic diagram of the structure of the heat-generating part of the electronic device provided in this embodiment.

[0016] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process.

[0017] Reference numerals: 100, heat exchanger; 110, first outer surface; 111, first region; 1111, first part; 1112, second part; 112, second region; 1121, third part; 1122, fourth part; 113, groove; 1131, first groove; 1132, second groove; 200, first structural component; 300, heating element; 310, first heating part; 320, second heating part; 400, heat-conducting medium; 510, heat pipe; 520, heat sink. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the embodiments described in this disclosure, it should be noted that, unless otherwise stated and limited, the term "connection" should be interpreted broadly. For example, it can refer to an electrical connection or a connection between two internal components. It can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above term according to the specific circumstances.

[0020] It should be noted that the terms "first," "second," and "third" used in the embodiments of this disclosure are merely to distinguish similar objects and do not represent a specific ordering of the objects. It is understood that "first," "second," and "third" can be interchanged in a specific order or sequence where permitted. It should be understood that the objects distinguished by "first," "second," and "third" can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in an order other than those illustrated or described herein.

[0021] The following combination Figures 1 to 8 The installation apparatus and electronic equipment described in the embodiments of this disclosure will be described in detail.

[0022] like Figure 1 As shown in the embodiments of this disclosure, the heat dissipation device may include a heat exchanger 100 and a first structural member 200. The heat exchanger 100 may include a first outer surface 110; the first outer surface 110 may have a groove 113 formed therein; at least a portion of the first structural member 200 may be disposed within the groove 113; the first structural member 200 may include a capillary structure for accommodating the liquid first medium separated from the heat-conducting medium 400 of the first outer surface 110, and for supplying the flow of the first medium.

[0023] The inventors discovered that thermal paste containing liquid metal is often placed between the heat dissipation structure and the heat source. After a period of use, the liquid metal in the thermal paste often precipitates out and escapes, causing the thermal conductivity of the thermal paste to fail, thereby affecting the thermal conductivity of the heat dissipation structure. In the heat dissipation device of this application, a groove 113 is formed on the first outer surface 110, and at least a portion of the first structural member 200 is disposed within the groove 113. The first structural member 200 includes a capillary structure. When a liquid first medium separates from the heat dissipation medium 400, the first structural member 200 can contain the liquid first medium separated from the heat dissipation medium 400 through the capillary structure. Thus, the liquid first medium located in the first structural member 200 can re-conduct heat for the heat exchanger 100, thereby improving the thermal conductivity of the heat dissipation device even when the liquid first medium separates from the heat dissipation medium 400.

[0024] In this embodiment, the heat-conducting medium 400 can be a medium whose thickness can be changed by external force. The heat-conducting medium 400 is not fluid when not subjected to external force, but can move under the influence of external force. The state of the heat-conducting medium 400 is not limited. For example, the heat-conducting medium 400 can be in the form of a paste, gel, etc.

[0025] The heat-conducting medium 400 may include a first medium and a second medium. The thermal conductivity of the first medium may be greater than that of the second medium. The first medium may be a liquid metal, liquid alloy, etc. For example, the first medium may include gallium, indium, tin, etc. The first medium may be liquid at room temperature and have fluidity. The second medium may be used to reduce the fluidity of the first medium so that the heat-conducting medium 400 is non-liquid and does not flow at room temperature. The manner in which the second medium reduces the fluidity of the first medium is not limited.

[0026] For example, a thermally conductive medium 400 can be formed by mixing a first medium and a second medium using an emulsion method. Here, the second medium can be a matrix. The thermally conductive medium 400 may also include a surfactant. As an example, the matrix, the first medium, and the surfactant are subjected to high-speed stirring, ultrasonication, or other treatments to "break" the bulk first medium into micron- and / or nano-sized droplets, and then the surfactant is used to stably disperse these small droplets in a matrix (such as silicone oil). The matrix can be silicone oil, silicone rubber, silicone gel, epoxy resin, etc. The surfactant can be a nanoparticle emulsifier, a small molecule surfactant, a polymeric surfactant, etc. This disclosure does not limit this.

[0027] For example, a thermally conductive medium 400 can be formed by mixing the first and second media using a physical filling method. Here, the second medium is the filler. The liquid first medium can be considered as a "base liquid," and then solid micro / nano particles of the second medium are incorporated into it as a filler. The second medium is then uniformly dispersed into the liquid first medium through mechanical stirring, ultrasonic treatment, or other methods until a uniform, non-flowing paste is formed. The second medium can be particles such as nickel powder, copper powder, silver powder, boron nitride nanosheets, zinc oxide, or aluminum oxide. This disclosure does not limit this.

[0028] In this implementation example, the structure of the heat exchanger 100 is not limited. For example, the heat exchanger 100 can be a block structure, a plate structure, a heat pipe 510 structure, etc. This disclosure does not limit this. As an example, the heat exchanger 100 can be a plate structure. The thickness of the heat exchanger 100 is not limited. For example, the thickness of the heat exchanger 100 can be 0.5mm to 0.8mm, 0.6mm to 0.8mm, 0.5mm to 1mm, 1mm to 2mm, 0.6mm to 1mm, etc. This disclosure does not limit this.

[0029] The material of the heat exchanger 100 is not limited. For example, the material of the heat exchanger 100 can be copper, aluminum, or other materials with good thermal conductivity.

[0030] The first outer surface 110 of the heat exchanger 100 can be the outermost surface of the heat exchanger 100, and the first outer surface 110 can be used to conduct heat to the heating element 300. During use, a heat-conducting medium 400 can be provided between the heating element 300 and the first outer surface 110. The heat of the heating element 300 can be transferred to the first outer surface 110 through the heat-conducting medium 400, and then dissipated by the heat exchanger 100, so as to achieve heat dissipation for the heating element 300.

[0031] The shape, number, depth, and other characteristic parameters of the groove 113 are not limited. For example, the groove 113 can be strip-shaped, block-shaped, ring-shaped, mesh-shaped, etc. This disclosure does not limit this. The number of grooves 113 can be one, at least two, at least three, etc. This disclosure does not limit this. The depth of the groove 113 can be 0.1mm to 0.3mm, 0.2mm to 0.3mm, 0.1mm to 0.2mm, 0.1mm to 0.15mm, 0.12mm to 0.15mm, etc. This disclosure does not limit this.

[0032] The location of the groove 113 on the first outer surface 110 is not limited. For example, the groove 113 may be located in the side region of the first outer surface 110 or in the center of the first outer surface 110. This disclosure does not limit it in this way.

[0033] In this implementation example, the first structural member 200 can be entirely located within the groove 113, or it can be partially located within the groove 113 with the other part located outside the groove 113. When the first structural member 200 is entirely located within the groove 113, as follows: Figure 5 As shown, the first structural member 200 and the first outer surface 110 can satisfy the coplanar condition, which means coplanar or substantially coplanar. The coplanar arrangement of the first structural member 200 and the first outer surface 110 not only prevents the first structural member 200 from being damaged by impact, but also allows for a smaller distance between the first structural member 200 and the heating element 300, thereby improving the thermal conductivity between them. Of course, the first structural member 200 can also be recessed.

[0034] The first structural member 200 may also have a portion located within the groove 113 and another portion protruding beyond the first outer surface 110, thereby reducing the distance between the first structural member 200 and the heating element 300 and improving the thermal conductivity between them. As an example, such as... Figure 6 As shown, the first structural member 200 may also protrude from the first outer surface 110, and the first structural member 200 may be elastic. The first structural member 200 protruding from the first outer surface 110 can reduce the distance between the first structural member 200 and the heating element 300. The elasticity of the first structural member 200 can deform the first structural member 200 and prevent the first structural member 200 from interfering with the heating element 300 and damaging the heating element 300.

[0035] The first structural component 200 may include a capillary structure. The method of forming the first structural component 200 is not limited. For example, the first structural component 200 may be formed by sintering, foaming, machining, or physicochemical effects. This disclosure does not limit this method. The material of the first structural component 200 is not limited. For example, the material of the first structural component 200 may be copper, aluminum, or other materials with good thermal conductivity to improve the thermal conductivity of the first structural component 200. Of course, the material of the first structural component 200 may also be fiber, plastic, rubber, etc.; here, the first structural component 200 can conduct heat through a first medium in the capillary structure. As an example, the first structural component 200 may be formed by sintering copper powder, copper wire, aluminum powder, aluminum wire, etc.

[0036] It should be noted that since the first structural member 200 includes a capillary structure with capillary pores, the first structural member 200 is elastic and can deform. Of course, the first structural member 200 can also be formed by a filamentary structure, strip-like structure, or mesh-like structure. In these cases, the first structural member 200 has stronger elasticity and greater deformation capacity.

[0037] The heat-conducting medium 400 can be disposed on the surface of the first outer surface 110 and the surface of the first structural member 200. When a liquid first medium is separated from the heat-conducting medium 400, the capillary structure can draw the liquid first medium into the capillary structure through the capillary force of the capillary pores, and the capillary force of the capillary pores can keep the liquid first medium stably located in the capillary structure, which can prevent the liquid first medium from leaking to other areas, and can also conduct heat to the heat dissipation device again through the liquid first medium.

[0038] It should be noted that when the heat-conducting medium 400 is initially placed on the first outer surface 110, the liquid first medium is located within the second medium of the heat-conducting medium 400, and the liquid first medium does not flow. During the operation of the heating element 300, the temperature of the heat dissipation device and the heating element 300 is relatively high; when the heating element 300 is not operating, the temperature of the heat dissipation device and the heating element 300 is relatively low. Under the influence of the changes in higher and lower temperatures, the distance between the heat exchanger 100 and the heating element 300 will change. This allows the heat transfer medium 400 between the heat exchanger 100 and the heating element 300 to be subjected to shear forces, compressive forces, etc. The first medium in the heat transfer medium 400 can separate from the second medium based on these forces. Here, the first medium is fluid, and the capillary structure of the first structural member 200 can absorb the first medium through capillary force. The first structural member 200 can contain the first medium separated from the heat transfer medium 400 through its capillary structure, thereby improving the thermal conductivity of the heat dissipation device and preventing the liquid first medium from leaking to other areas.

[0039] In some implementations of the embodiments of this disclosure, such as Figure 2 and Figure 3 As shown, the first outer surface 110 may include: a first region 111; the first region 111 may include a first part 1111 with a groove 113 and a second part 1112 without a groove 113.

[0040] In this implementation, the first region 111 can dissipate heat for the heat-generating component 300 through the first structural member 200 at the first part 1111, or through the second part 1112.

[0041] In this implementation, the second portion 1112 of the first region 111, which is not provided with the groove 113, can be a solid structure. The thermal conductivity of the second portion 1112 of the first region 111 can be greater than the thermal conductivity of the first structural member 200 at the first portion 1111 of the first region 111. When the heat dissipation device is initially used and a heat-conducting medium 400 is provided between the first region 111 and the heat-generating component 300, the thermal conductivity of the second portion 1112 of the first region 111 can be greater than the thermal conductivity of the first portion 1111 of the first region 111. During the use of the heat dissipation device, the distance between the heat exchanger 100 and the heat-generating component 300 can change based on temperature changes (e.g., thermal expansion and contraction of the heat exchanger 100 and / or the heat-generating component 300), and the heat-conducting medium 400 between the heat exchanger 100 and the heat-generating component 300 can be subjected to shear force, extrusion force, and other forces based on the change in distance. After the heat dissipation device has been used for a period of time, the first medium in the heat-conducting medium 400 can be separated from the second medium in the heat-conducting medium 400 based on the action force. Here, the first liquid medium is separated from the heat-conducting medium 400. The capillary structure can accommodate the liquid first medium separated from the heat-conducting medium 400 on the first outer surface 110. Since the liquid first medium enters the capillary pores of the capillary structure, the capillary pores conduct heat through the liquid first medium instead of air, thereby improving the thermal conductivity of the first part 1111 of the first region 111. At the same time, the liquid first medium is separated from the heat-conducting medium 400 at the second part 1112 of the first region 111, and the thermal conductivity of the second part 1112 of the first region 111 decreases. By improving the thermal conductivity of the first part 1111 of the first region 111, the heat exchange performance of the heat dissipation device after the liquid first medium is separated from the heat-conducting medium 400 can be improved.

[0042] In this implementation, the area of ​​the first part 1111 and the second part 1112 is not limited. For example, the area of ​​the first part 1111 can be larger than the area of ​​the second part 1112. Before the first medium is separated from the heat-conducting medium 400, the smaller second part 1112 has better thermal conductivity, while the larger first part 1111 has moderate thermal conductivity. After the first medium is separated from the heat-conducting medium 400, the thermal conductivity of the smaller second part 1112 decreases, while the thermal conductivity of the larger first part 1111 increases. By setting the area of ​​the first part 1111 to be larger, the thermal conductivity of the heat dissipation device can be significantly improved after the first medium is separated from the heat-conducting medium 400, thereby solving the problem that the thermal conductivity of the heat dissipation device drops significantly after the first medium is separated from the heat-conducting medium 400, failing to meet the heat dissipation requirements of the heat-generating component 300. Of course, in some other examples, the area of ​​the first part 1111 may be less than or equal to the area of ​​the second part 1112. Here, the heat dissipation device has better thermal conductivity before the first medium is separated from the heat-conducting medium 400.

[0043] In this implementation, the groove 113 is positioned in the first region 111 in a similar manner to the groove 113 positioned on the first outer surface 110 as described above, and will not be repeated here.

[0044] In this implementation, the first outer surface 110 may include a second region 112 disposed adjacent to the first region 111. The second region 112 is different from the first region 111, so that the first outer surface 110 has different heat exchange areas, thereby improving the adaptability of the heat dissipation device.

[0045] Here, the manner in which the first region 111 and the second region 112 differ is not limited. For example, the grooves 113 provided in the first region 111 and the second region 112 may be different. As another example, the first structural members 200 provided in the first region 111 and the second region 112 may be different.

[0046] Example 1: The distribution density of groove 113 in the first region 111 can be greater than the distribution density in the second region 112.

[0047] The distribution density of grooves 113 in the first region 111 can be the ratio of the area of ​​grooves 113 in the first region 111 to the area of ​​the first region 111. The distribution density of grooves 113 in the second region 112 can be the ratio of the area of ​​grooves 113 in the second region 112 to the area of ​​the second region 112.

[0048] In Example 1, such as Figure 2 and Figure 3 As shown. The second region 112 may not have grooves 113, where the distribution density of grooves 113 in the second region 112 is zero. By opening grooves 113 and providing the first structural member 200, the first part 1111 of the first region 111 can improve the thermal conductivity of the first portion 1111 after the first medium separates from the heat-conducting medium 400.

[0049] Here, the operator can determine the first region 111 and the second region 112 by whether or not the groove 113 is set, such as Figure 2 and Figure 3 As shown, the dashed box can be the first region 111.

[0050] In Example 1, such as Figure 4As shown, a first groove 113 may be formed in the first region 111, and a second groove 113 may be formed in the second region 112; the second groove 113 and the first groove 113 may be connected, and the distribution density of the second groove 113 in the second region 112 may be less than the distribution density of the first groove 113 in the first region 111, so that the first medium in the first structural member 200 at the second groove 113 flows into the capillary structure of the first structural member 200 at the first groove 113.

[0051] Here, the distribution density of the first groove 1131 in the first region 111 can be the ratio of the area of ​​the first groove 1131 in the first region 111 to the area of ​​the first region 111. The distribution density of the second groove 1132 in the second region 112 can be the ratio of the area of ​​the second groove 1132 in the second region 112 to the area of ​​the second region 112.

[0052] Here, the second region 112 may include a third part 1121 with a second groove 113 and a fourth part 1122 without a second groove 113. The third part 1121 of the second region 112 is provided with a first structural member 200, and the fourth part 1122 of the second region 112 may be a solid structure.

[0053] Here, after the first medium separates from the heat-conducting medium 400, the first medium at the first region 111 enters the capillary structure of the first structural member 200 within the first groove 113, and the first medium at the second region 112 enters the capillary structure of the first structural member 200 within the second groove 113. Because the distribution density of the first groove 113 in the first region 111 is relatively high, the area of ​​the second part 1112 of the first region 111 is relatively small, and the amount of heat-conducting medium 400 provided is relatively small, the amount of first medium that can enter the first structural member 200 within the first groove 113 is relatively small. Therefore, the amount of first medium per unit volume of the first structural member 200 within the first groove 113 is relatively small. Because the second groove 113 in the second region 112... The distribution density is relatively low, the fourth part 1122 of the second region 112 has a relatively large area, and the amount of heat-conducting medium 400 provided is relatively large. The amount of first medium that can enter the first structural member 200 in the second groove 113 is relatively large, so that the amount of first medium per unit volume of the first structural member 200 in the second groove 113 is relatively large. At the same time, since the second groove 113 is connected to the first groove 113, the first medium in the first structural member 200 in the second groove 113 can flow into the capillary structure of the first structural member 200 in the first groove 113, thereby further increasing the amount of first medium in the capillary structure of the first structural member 200 in the first groove 113, and thus improving the heat conduction capacity of the first region 111.

[0054] Here, the amount of the first medium per unit volume of the first structural component 200 can be the volume, weight, etc. of the first medium within 1 cubic meter of the first structural component 200.

[0055] Here, if the heat exchanger 100 is placed horizontally, since the distribution density of the second groove 113 in the second region 112 is less than the distribution density of the first groove 113 in the first region 111, after the first medium separates from the heat-conducting medium 400, the height of the first medium in the first structural member 200 in the second groove 113 can be greater than the height of the first medium in the first structural member 200 in the first groove 113. Here, the first medium in the first structural member 200 in the second groove 113 can flow into the capillary structure of the first structural member 200 in the first groove 113 based on gravity.

[0056] During use, the first region 111 can be associated with the region with a higher temperature of the heat-generating component 300 to improve the heat dissipation capacity of the heat dissipation device for the region with a higher temperature of the heat-generating component 300 after the first medium is separated from the heat-conducting medium 400.

[0057] Here, the capillary structure of the first structural member 200 in the first groove 113 and the capillary structure of the first structural member 200 in the second groove 113 can be the same or different.

[0058] Example 2: A first groove 113 may be formed in the first region 111, and a second groove 113 may be formed in the second region 112; the capillary size of the first structural member 200 at the first groove 113 may be smaller than the capillary size of the first structural member 200 at the second groove 113, so that the first medium in the first structural member 200 at the second groove 113 flows into the capillary structure of the first structural member 200 at the first groove 113.

[0059] In Example 2, the capillary pore size of the first structural member 200 can be the diameter, width, etc. of the capillary through-hole of the capillary structure of the first structural member 200.

[0060] In Example 2, since the capillary size of the first structural member 200 at the first groove 113 is smaller than the capillary size of the first structural member 200 at the second groove 113, the capillary force of the first structural member 200 at the first groove 113 is greater than the capillary force of the first structural member 200 at the second groove 113.

[0061] In Example 2, after the first medium separates from the thermally conductive medium 400, the first medium at the first region 111 enters the capillary structure of the first structural member 200 in the first groove 113, and the first medium at the second region 112 enters the capillary structure of the first structural member 200 in the second groove 113. Since the capillary force of the first structural member 200 at the first groove 1131 is greater than the capillary force of the first structural member 200 at the second groove 1132, the first medium in the first structural member 200 at the second groove 113 can enter the capillary structure of the first structural member 200 in the first groove 113 based on the capillary force, thereby improving the thermal conductivity of the first region 111.

[0062] During use, the first region 111 can be associated with the region with a higher temperature of the heat-generating component 300 to improve the heat dissipation capacity of the heat dissipation device for the region with a higher temperature of the heat-generating component 300 after the first medium is separated from the heat-conducting medium 400.

[0063] In Example 2, the amount of the first medium per unit volume of the first structural member 200 at the first groove 1131 is greater than the amount of the first medium per unit volume of the first structural member 200 at the second groove 1132. If the heat exchanger 100 is placed horizontally, since the capillary force of the first structural member 200 at the first groove 113 is greater than the capillary force of the first structural member 200 at the second groove 113, after the first medium separates from the heat-conducting medium 400, the first medium in the first structural member 200 in the second groove 113 will flow into the capillary structure of the first structural member 200 in the first groove 113, thereby making the height of the first medium in the first structural member 200 in the first groove 113 greater than the height of the first medium in the first structural member 200 in the second groove 113.

[0064] In Example 2, the distribution density of the second groove 113 in the second region 112 is not limited. The distribution density of the first groove 113 in the first region 111 is not limited. As an example, the distribution density of the first groove 113 in the first region 111 can be greater than the distribution density of the second groove 1132 in the second region 112, so as to further increase the amount of the first medium in the first structural member 200 at the first groove 113 after the first medium separates from the heat-conducting medium 400, thereby further improving the heat transfer capacity of the first region 111.

[0065] In some implementations of the embodiments of this disclosure, such as Figure 7 As shown, the heat dissipation device may include a thermally conductive medium 400, which may cover the first outer surface 110 and the first structural member 200, so that the first outer surface 110 and the first structural member 200 can dissipate heat for the heat-generating component 300 through the thermally conductive medium 400.

[0066] In this implementation, by pre-setting the heat-conducting medium 400 in the heat dissipation device, the installation difficulty of the heat dissipation device for the heat-generating component 300 can be reduced.

[0067] In this implementation, the heat-conducting medium 400 has already been described above, and will not be repeated here. The thickness of the heat-conducting medium 400 is not limited. For example, the thickness of the heat-conducting medium 400 can be 0.1 mm to 0.3 mm, 0.1 mm to 0.2 mm, 0.2 mm to 0.3 mm, etc. This disclosure does not limit this.

[0068] It should be noted that when the heat dissipation device dissipates heat to the heat-generating component 300 through the first outer surface 110, the first thickness of the heat-conducting medium 400 between the first outer surface 110 and the heat-generating component 300 is less than the set thickness. Here, during the installation of the heat dissipation device, some of the heat-conducting medium 400 can be squeezed out from between the first outer surface 110 and the heat-generating component 300 to improve the adhesion between the heat-conducting medium 400 and the heat-generating component 300, thereby improving the thermal conductivity.

[0069] Here, the first thickness is not limited. For example, the first thickness can be 0.03mm to 0.1mm, 0.03mm to 0.09mm, 0.03mm to 0.09mm, 0.03mm to 0.08mm, 0.03mm to 0.07mm, 0.03mm to 0.05mm, 0.04mm to 0.06mm, 0.05mm to 0.08mm, etc. This disclosure does not limit it in this respect.

[0070] In some implementations of the embodiments of this disclosure, such as Figure 7 As shown, the heat dissipation device may include a heat pipe 510, which is connected to the heat exchanger 100. The heat pipe 510 can carry away the heat absorbed by the heat-generating component 300 by the heat exchanger 100, thereby further improving the heat dissipation capacity of the heat dissipation device.

[0071] In this implementation, the heat exchanger 100 can be a solid structure, or it can be a heat exchange structure other than a heat pipe 510 or a heat spreader plate.

[0072] It should be noted that in this embodiment, without the heat-conducting medium 400, the first structural member 200 can be exposed, and the groove 113 is a non-sealed space, allowing the first medium to be stably located within the first structural member 200 based on the capillary force of the capillary structure. The non-sealed space provided in the first structural member 200 is different from the sealed space provided in the heat pipe 510, the heat spreader, etc.

[0073] In this implementation, the location of the heat pipe 510 is not limited. For example, as Figure 7As shown, the groove 113 and the heat pipe 510 can be located on opposite sides of the heat exchanger 100.

[0074] In this implementation, such as Figure 7 As shown, the heat dissipation device may include a heat sink 520, and the heat sink 520 and the heat exchanger 100 may be located at opposite ends of the heat pipe 510. During operation, the heat pipe 510 is used to carry the heat absorbed by the heat exchanger 100 to the heat sink 520 for rapid dissipation.

[0075] This disclosure also describes an electronic device, which may include a heat-generating component 300, a heat dissipation device, and a heat-conducting medium 400. The heat dissipation device can be used to provide heat dissipation to the heat-generating component 300, and the heat dissipation device may include a heat exchanger 100 and a first structural component 200. The heat exchanger 100 may include a first outer surface 110; the first outer surface 110 may have a groove 113; at least a portion of the first structural component 200 may be disposed in the groove 113; the first structural component 200 may include a capillary structure, and the heat-generating component 300 is disposed adjacent to the first outer surface 110 and the first structural component 200; the heat-conducting medium 400 may be disposed between the heat-generating component 300 and the first outer surface 110, and between the first structural component 200 and the heat-generating component 300; wherein, the capillary structure is used to contain the liquid first medium separated from the heat-conducting medium 400 on the first outer surface 110, and to supply the flow of the first medium, and the heat-conducting medium 400 is a medium whose thickness can be changed by external force.

[0076] In the embodiments disclosed herein, the heat dissipation device, heat exchanger 100, first structural member 200, heat-conducting medium 400 and first medium have been described above, and will not be repeated here.

[0077] In the embodiments disclosed herein, the structure of the electronic device is not limited. For example, the electronic device may be a mobile phone, computer, tablet, game console, etc. This disclosure does not limit it in this regard.

[0078] In this embodiment, the structure of the heat-generating component 300 is not limited. For example, the heat-generating component 300 can be an electronic component. As another example, the heat-generating component 300 can be a processor or processing chip with processing capabilities, such as a central processing unit (CPU) or a graphics processing unit (GPU). As yet another example, the heat-generating component 300 can be a structure with functions such as storage, current adjustment, and voltage adjustment. This disclosure does not limit its scope.

[0079] In some implementations of the embodiments of this disclosure, the first outer surface 110 may include: a first region 111 and a second region 112 disposed adjacently; the first region 111 may include a first portion 1111 with a groove 113 and a second portion 1112 without a groove 113; the heating element 300 may include a first heating portion 310 corresponding to the position of the first region 111 and a second heating portion 320 corresponding to the position of the second region 112, such as... Figure 8 As shown; in the first operating state of the electronic device, the temperature of the first heating part 310 is higher than the temperature of the second heating part 320.

[0080] In this implementation, the first part 1111 of the first region 111 is provided with a groove 113 and a first structural member 200. When the first liquid medium is separated from the heat-conducting medium 400, the first medium can be contained by the capillary structure of the first structural member 200 of the first region 111, thereby improving the heat conduction capacity of the first region 111.

[0081] In this implementation, in the first operating state of the electronic device, the temperature of the first heating element 310 can be higher than the temperature of the second heating element 320. Here, the first operating state can be a certain state during the operation of the electronic device, or it can be all states during the operation of the electronic device. In the first operating state, the first heating element 310 can be the part of the heating component 300 with a higher temperature. By positioning the first region 111 corresponding to the first heating element 310, the heat of the first heating element 310 can be quickly conducted away through the first region 111. Thus, when the liquid first medium is separated in the heat-conducting medium 400, the heat dissipation capacity of the first heating element 310 can be improved through the first region 111, thereby reducing the maximum temperature of the heating component 300 and improving the safety of the operation of the heating component 300.

[0082] In some implementations of this embodiment, the electronic device may have a first temperature when in operation and a second temperature when not in operation; the first temperature is greater than the second temperature; under the action of the change between the first and second temperatures, the heat-conducting medium 400 between the heat exchanger 100 and the heat-generating component 300 may be subjected to a force, and the first medium in the heat-conducting medium 400 may be separated from the second medium in the heat-conducting medium 400 based on the force. The first structural component 200 may contain the first medium separated from the heat-conducting medium 400 through a capillary structure, thereby enabling heat to be conducted again through the first medium to improve the heat dissipation capacity of the heat dissipation device, and also fixing the first medium through the capillary structure to prevent the first medium from flowing into the electronic device and affecting the performance of the electronic device.

[0083] In this implementation, the first temperature is not limited. For example, the first temperature can be 20 to 60 degrees, 30 to 70 degrees, 40 to 50 degrees, etc. The second temperature is not limited. For example, the second temperature can be the ambient temperature of the electronic device.

[0084] In this implementation, under the influence of the changes in the first and second temperatures, the distance between the heat exchanger 100 and the heating element 300 will change slightly, thereby subjecting the heat-conducting medium 400 between the heat exchanger 100 and the heating element 300 to a force.

[0085] In this implementation, the form of the force is not limited. For example, the force can be shear force, compressive force, etc.

[0086] In this implementation, the first medium in the heat-conducting medium 400 can be separated from the second medium in the heat-conducting medium 400 based on the action force. The separated smaller particles of the first medium can be aggregated to form larger particles of the first medium that can flow or roll. The first structural member 200 can absorb the larger particles of the first medium into the capillary pores of the capillary structure through the capillary force of the capillary structure to accommodate the first medium separated from the heat-conducting medium 400.

[0087] In some implementations of the embodiments of this disclosure, the first outer surface 110 may include: a first region 111 and a second region 112 disposed adjacently; the first region 111 may include a first portion 1111 with a first groove 113 and a second portion 1112 without the first groove 113; the second region 112 may include a third portion 1121 with a second groove 113 and a fourth portion 1122 without the second groove 113; in the second state, the first medium in the first structural member 200 at the second groove 113 flows into the capillary structure of the first structural member 200 at the first groove 113; thereby increasing the amount of the first medium in the first structural member 200 at the first groove 113, so as to further improve the heat dissipation capacity of the first region 111 and reduce the maximum temperature of the electronic device.

[0088] The first region 111 and the second region 112 have been described in the above embodiments, and will not be repeated here.

[0089] In this implementation, the second state can be the state in which the first medium has separated from the thermally conductive medium 400. As an example, the second state can be the state in which the first medium has separated from the thermally conductive medium 400 after the electronic device has been used for a period of time.

[0090] In this implementation, the method by which the first medium in the first structural member 200 at the second groove 113 flows into the capillary structure of the first structural member 200 at the first groove 113 is not limited. For example, the flow of the first medium in the first structural member 200 at the second groove 113 into the capillary structure of the first structural member 200 at the first groove 113 can be achieved through the methods described in Examples 1, 2, 1, and 2 above. Further details will not be elaborated here.

[0091] The various specific technical features described in the embodiments of this disclosure can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the various specific technical features in the embodiments of this disclosure will not be described separately.

[0092] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of this application are included within the scope of protection of this application.

Claims

1. A heat dissipation device, comprising: a heat exchange element comprising a first outer surface; the first outer surface is provided with grooves; a first structure element is at least partially disposed in the grooves; the first structure element comprises a capillary structure for containing and flowing a liquid first medium separated from a heat conductive medium of the first outer surface.

2. The heat dissipating device of claim 1, the first outer surface comprising: a first region; the first region comprises a first part provided with the grooves and a second part not provided with the grooves.

3. The heat dissipating device of claim 2, the first outer surface comprising: a second region adjacent to the first region; a distribution density of the grooves in the first region is greater than a distribution density of the grooves in the second region. 4.The heat dissipation device of claim 3, wherein the second region is not provided with the grooves; or, the first region is provided with first grooves, and the second region is provided with second grooves; the second grooves are in communication with the first grooves, and a distribution density of the second grooves in the second region is less than a distribution density of the first grooves in the first region, so that the first medium in the first structure element at the second grooves flows into the capillary structure of the first structure element at the first grooves.

5. The heat dissipating device of claim 2, the first outer surface comprising: the first region is provided with first grooves, and the second region is provided with second grooves; a capillary pore size of the first structure element at the first grooves is less than a capillary pore size of the first structure element at the second grooves, so that the first medium in the first structure element at the second grooves flows into the capillary structure of the first structure element at the first grooves.

6. The heat dissipating device according to any one of claims 1 to 5, wherein the first structural member is coplanar with the first outer surface, or the first structural member protrudes from the first outer surface, and the first structural member is elastic. and / or, the heat dissipation device comprises: a heat conductive medium covering the first outer surface and the first structure element; the heat conductive medium is a medium capable of changing a setting thickness by an external force; the first medium is a liquid metal, and the heat conductive medium comprises a second medium for reducing a flowability of the first medium. 7.An electronic device comprising a heat generating component, a heat dissipation device for providing heat dissipation to the heat generating component, and a heat conductive medium, the heat dissipation device comprising: a heat exchange element comprising a first outer surface; the first outer surface is provided with grooves; a first structure element is at least partially disposed in the grooves; the first structure element comprises a capillary structure for containing and flowing a liquid first medium separated from a heat conductive medium of the first outer surface; the heat generating component is disposed adjacent to the first outer surface and the first structure element; the heat conductive medium is disposed between the heat generating component and the first outer surface, and between the first structure element and the heat generating component; wherein the capillary structure is for containing and flowing the liquid first medium separated from the heat conductive medium of the first outer surface, and the heat conductive medium is a medium capable of changing a setting thickness by an external force.

8. The electronic device of claim 7, the first outer surface comprising: a first region and a second region disposed adjacent to each other; the first region comprises a first part provided with the grooves and a second part not provided with the grooves; the heat generating component comprises a first heat generating part corresponding to a position of the first region, and a second heat generating part corresponding to a position of the second region; in a first working state of the electronic device, a temperature of the first heat generating part is higher than a temperature of the second heat generating part.

9. The electronic device of claim 7, the electronic device having a first temperature in an active state and a second temperature in an inactive state; the first temperature being greater than the second temperature; Under the action of the change of the first temperature and the second temperature, the heat-conducting medium between the heat-exchanging member and the heat-generating component is subjected to a force, a first medium in the heat-conducting medium is separated from a second medium in the heat-conducting medium based on the force, and the first structure member is capable of containing the first medium separated from the heat-conducting medium through the capillary structure.

10. The electronic device of any of claims 7-9, the first outer surface comprising: The first region and the second region are adjacently arranged; the first region comprises a first part provided with the first groove and a second part not provided with the first groove; and the second region comprises a third part provided with the second groove and a fourth part not provided with the second groove. In the second state, the first medium in the first structure member at the second groove flows into the capillary structure of the first structure member at the first groove.

Images