A temperature control module of a microfluidic chip and a microfluidic detection system

Abstract

The present application relates to the technical field of microfluidic detection, and particularly relates to a temperature control module of a microfluidic chip and a microfluidic detection system. The temperature control module comprises a heat conduction block, the heat conduction block has a base surface and a plurality of bosses protruding from the base surface for contacting the microfluidic chip. The heat conduction block is internally provided with a heat regulation structure for compensating for the edge effect in the heat conduction process, so that the temperature difference between the bosses is reduced in the working state. The heat regulation structure comprises a cavity arranged in at least one boss for changing the heat load of the boss, and / or a heat regulation recess arranged on the base surface and around at least one boss for changing the heat load around the boss. The present application realizes high-precision temperature equalization through the structural design of the heat conduction block itself, without the need for external auxiliary temperature equalization means, simplifies the system structure, reduces the cost and control difficulty, and effectively improves the accuracy and consistency of microfluidic detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of microfluidic detection technology, and in particular to a temperature control module of a microfluidic chip and a microfluidic detection system. BACKGROUND

[0002] In the application of nucleic acid amplification (such as Polymerase Chain Reaction, PCR) of a microfluidic chip, the accuracy and uniformity of temperature are extremely demanding. A small temperature difference between reaction chambers may lead to different amplification efficiencies, resulting in deviations in results and affecting the accuracy and sensitivity of detection.

[0003] In the prior art, the temperature control module of a microfluidic chip usually adopts a planar heat conduction block in contact with the chip. Due to the "edge effect" of heat conduction, the temperature in the middle region of the heat conduction block is high, and the temperature in the edge region is low, which may lead to uneven actual heating temperature of each reaction chamber. To solve this problem, some existing solutions additionally increase auxiliary heating films or resistance wires on the back of the heat conduction block to supplement the temperature of the edge, and some use complex fluid channels for temperature equalization. These methods increase the complexity, cost and control difficulty of the system. SUMMARY

[0004] The purpose of the present application is to provide a temperature control module of a microfluidic chip and a microfluidic detection system, which can improve the temperature uniformity of each part of the heat conduction block without relying on any external auxiliary temperature equalization means, but only through the structural design of the heat conduction block itself.

[0005] To achieve the above purpose, in a first aspect, the present application provides a temperature control module of a microfluidic chip, comprising a heat conduction block having a base surface and a plurality of bosses protruding from the base surface for contacting a microfluidic chip;

[0006] The heat conduction block is configured to compensate for the edge effect in the heat conduction process through an internal thermal regulation structure, so as to reduce the temperature difference between each boss in the working state;

[0007] The thermal regulation structure comprises:

[0008] a cavity arranged in the interior of at least one of the bosses for changing the thermal load of the boss; and / or

[0009] a thermal regulation recess arranged on the base surface and around at least one of the bosses for changing the thermal load around the boss.

[0010] Optionally, the interior of the boss located in the edge region is provided with a cavity for changing the thermal load of the boss; and / or

[0011] The periphery of the boss on the base surface and in the edge region is provided with a thermal regulation recess for changing the thermal load of the periphery of the boss.

[0012] Optionally, each of the bosses is internally provided with a cavity for changing the thermal load of the boss, and the total volume of the cavity internally provided in the boss in the edge region of the heat conduction block is greater than the total volume of the cavity internally provided in the boss in the middle region of the heat conduction block.

[0013] Optionally, the periphery of each of the bosses on the base surface is provided with a thermal regulation recess for changing the thermal load of the periphery of the boss, and the total volume of the thermal regulation recess provided in the periphery of the boss in the edge region of the heat conduction block is greater than the total volume of the thermal regulation recess provided in the periphery of the boss in the middle region of the heat conduction block.

[0014] Optionally, the cavity is a blind hole; and / or

[0015] The thermal regulation recess is a blind hole, a cavity, an annular groove, an arc-shaped groove, or a strip-shaped groove.

[0016] Optionally, the region on the base surface where a plurality of the bosses are located is a boss region, and a special-shaped groove is arranged in a region other than the boss region on the base surface, for reducing the thermal load of the region other than the boss region of the heat conduction block.

[0017] Optionally, each of the bosses is arranged at intervals in the long side direction of the heat conduction block and is flush in the short side direction of the heat conduction block, and an equal-diameter circle is drawn with the center of the center of each of the bosses as the center, the equal-diameter circles of two adjacent bosses are tangent to each other, and the special-shaped groove is arranged outside the main body region defined by each of the equal-diameter circles.

[0018] Optionally, the temperature control module further comprises an elastomer layer, the elastomer layer covers a region other than the boss on the base surface, and the thickness of the elastomer layer is less than the height by which the boss protrudes from the base surface.

[0019] Optionally, the temperature control module further comprises a pressing plate, the pressing plate is provided with a through hole through which the boss passes, the pressing plate is pressed on the elastomer layer, thereby compressing and fixing the heat conduction block, and the boss passes through the through hole and extends out of the pressing plate.

[0020] Optionally, the pressing plate is provided with two guide strips arranged at intervals, for defining the position of the microfluidic chip; and / or

[0021] The pressing plate is further provided with a temperature sensing hole, and the temperature sensing hole is provided with a heat conduction medium.

[0022] A temperature protection module is arranged outside the pressing plate, and a temperature fuse is arranged at a position corresponding to the temperature sensing hole of the temperature protection module, so that when the temperature of the detection point reaches a threshold value, the temperature fuse is fused to cut off the power supply to the heating component of the heat conducting block.

[0023] Optionally, the temperature control module further comprises a Peltier device, which is arranged on the other side of the heat conducting block away from the base surface.

[0024] Optionally, the temperature control module further comprises a heat sink, an air duct and a cooling fan, the Peltier device is arranged between the heat conducting block and the heat sink, the cooling fan is arranged at one end of the air duct, and a ventilation opening is arranged at the other end of the air duct.

[0025] The heat sink is arranged as or on the side wall of the air duct facing the heat conducting block.

[0026] Preferably, in the working state, the temperature difference between the bosses is within 0.5℃.

[0027] In a second aspect, the application further provides a microfluidic detection system comprising the temperature control module according to any one of the implementations of the first aspect.

[0028] Optionally, the number of the temperature control modules is two, and the two temperature control modules are arranged oppositely.

[0029] The above technical solutions of the application have the following advantages:

[0030] The temperature control module of the microfluidic chip provided by the application comprises a heat conducting block, the heat conducting block has a base surface and a plurality of bosses protruding from the base surface, and is used for directly contacting the microfluidic chip. A heat regulation structure is arranged inside the heat conducting block, which is used for compensating the edge effect in the heat conduction process. By arranging the differential heat regulation structure (such as a cavity or a recess) at different positions of the bosses or the periphery thereof, the heat load of each region is effectively adjusted, the temperature unevenness caused by the edge effect is compensated, and the temperature difference between the bosses is reduced. The heat regulation structure is directly integrated inside the heat conducting block, without the need for additional auxiliary components, which simplifies the system structure, reduces the manufacturing cost and control complexity, and reduces the space occupation.

[0031] The microfluidic detection system provided by the application comprises the above temperature control module, and by arranging the differential heat regulation structure (such as a cavity or a recess) at different positions of the bosses or the periphery thereof, the heat load of each region is effectively adjusted, the temperature unevenness caused by the edge effect is compensated, and the temperature difference between the bosses is reduced. The problem of inconsistent amplification efficiency caused by temperature difference is effectively avoided, and the accuracy and repeatability of the microfluidic detection system are improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] The proportions and quantities of the components in the drawings of the present application are not necessarily consistent with the actual products.

[0033] Figure 1 is a structural schematic diagram of a temperature control module of a microfluidic chip in an embodiment of the present application;

[0034] Figure 2 is Figure 1 a local partial exploded state schematic diagram of the temperature control module;

[0035] Figure 3 is a structural schematic diagram of a heat conduction block in an embodiment of the present application;

[0036] Figure 4 is Figure 3 a front view schematic diagram of the heat conduction block;

[0037] Figure 5 is a schematic diagram of the heat conduction block demarcating a boss region in an embodiment of the present application;

[0038] Figure 6 is a schematic diagram of the heat conduction block and the elastomer layer in a separated state in an embodiment of the present application;

[0039] Figure 7 is a structural schematic diagram of another heat conduction block in an embodiment of the present application;

[0040] Figure 8 is a structural schematic diagram of two temperature control modules in a relative arrangement in a microfluidic detection system in an embodiment of the present application.

[0041] In the drawings:

[0042] 100: temperature control module;

[0043] 110: heat conduction block; 111: base surface; 112: boss; 113: cavity; 114: thermal regulation recess; 115: special-shaped groove; 116: equal-diameter circle;

[0044] 120: elastomer layer;

[0045] 130: pressing plate; 131: via hole; 132: guide strip; 133: temperature sensing hole;

[0046] 140: over-temperature protection module;

[0047] 150: Peltier;

[0048] 160: heat sink;

[0049] 170: air duct; 171: air vent;

[0050] 180: heat dissipation fan. DETAILED DESCRIPTION

[0051] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0052] In the description of the present application, in order to distinguish the regions formed on the heat-conducting block due to different heat conduction characteristics, the expressions of “edge region” and “intermediate region” are adopted. Among them, the “edge region” generally refers to the region close to the physical boundary of the heat-conducting block, and this region usually shows lower thermal inertia due to faster heat dissipation; on the contrary, the “intermediate region” generally refers to the region located near the geometric center and relatively far away from the physical boundary, and this region usually shows higher thermal inertia during the heating process. It can be understood that the above division is based on the general law of heat conduction, rather than strict geometric partitioning. For example, for a row of four bosses, the regions where the bosses on both sides are located can be defined as “edge regions”, and the regions where the two bosses in the center are located can be defined as “intermediate regions”.

[0053] The “temperature control module” in the present application mainly refers to a module with heating function. The “temperature control module” using Peltier for heating has heating function, and can also be selected for rapid cooling according to needs.

[0054] Referring to Figures 1 to 4 The core inventive concept of the present application is to design the internal structure of the heat-conducting block 110 in the temperature control module 100, so that it itself has the ability to balance the thermal state of different regions, thereby compensating for the “edge effect”.

[0055] The heat-conducting block 110 has a base surface 111 as a reference, and a plurality of bosses 112 protruding from the base surface 111. These bosses 112 are functional surfaces that directly make thermal contact with each independent reaction chamber on the microfluidic chip (not shown in the figure). The number of bosses 112 is set according to the number and distribution of reaction chambers on the microfluidic chip.

[0056] The key of the present application is to creatively build a thermal regulation structure inside the heat-conducting block 110. This structure is not an independent element added externally, but a structural feature formed on the heat-conducting block body by removing materials in specific regions, which can directly regulate its thermal load (i.e. change the amount of heat absorbed or released per unit temperature).

[0057] Specifically, the thermal regulation structure includes two categories:

[0058] One: cavity 113 is formed in the interior of at least one boss 112. The cavity 113 directly changes the heat capacity (thermal load) of the specific boss area by precisely reducing the solid mass of the area. The area with small heat capacity rises faster in temperature when heated. The present application utilizes this principle to compensate for the "edge effect" by differentiating the thermal load design of the boss at different positions, thereby achieving precise temperature balance of the microfluidic chip contact surface.

[0059] Two: thermal regulation recess 114 is formed on the base surface 111 and located in the peripheral area of at least one boss 112. Its principle of action is: by removing the material of the boss peripheral base, the total thermal load associated with the boss is reduced, making the boss area exhibit smaller thermal inertia macroscopically, and it can reach the target temperature faster when heated. At the same time, by setting different volumes and / or numbers of thermal regulation recesses 114 around the bosses 112 at different positions, each boss 112 has different thermal load, achieving precise temperature balance.

[0060] The above two thermal regulation structures can be set up alone or together.

[0061] The present embodiment can force all bosses 112 to have consistent temperatures when reaching thermal equilibrium by precisely designing to reduce the thermal load in the area where the temperature is lower (usually the edge area) or reducing the thermal load in the area where the temperature is lower more than in the area where the temperature is higher (usually the center area). The heat conduction block in the present embodiment reduces the thermal load of a specific area (such as the edge) to make it reach the target temperature faster during heating, thereby achieving fast and balanced thermal equilibrium on the whole, reducing the temperature difference between the bosses 112, and controlling the temperature difference between the bosses 112 to within 0.5°C, preferably within 0.3°C or even within 0.2°C. Moreover, the thermal regulation structure is directly integrated into the heat conduction block, without the need for additional auxiliary heating film, resistance wire or complex fluid channels, simplifying the system structure, reducing the manufacturing cost and control complexity.

[0062] In addition, the shape, position and volume of the cavity and the thermal regulation recess can be easily designed differently according to the actual temperature distribution requirements, and are suitable for microfluidic chips of different sizes and different reaction chamber layouts.

[0063] In an example, a cavity 113 is arranged inside the boss 112 at the edge region of the heat-conducting block 110 to change the thermal load thereof, and the boss 112 at the middle region is not provided with the cavity 113. For example, four bosses 112 are arranged in a row, and the bosses 112 at the two sides are provided with the cavities 113, and the two bosses 112 at the middle are not provided with the cavities 113. Thus, under the same heating power, the boss at the edge region can obtain a faster temperature rising rate than the boss at the middle region, so as to “catch up” with the middle region which has a faster temperature rising rate, and the temperature difference of each boss is controlled within a very small range during the whole heating process.

[0064] Based on the same concept, in an example, a thermal regulation recess 114 is arranged around the boss 112 at the edge region on the base surface 111 to reduce the thermal load of the local base body supporting the boss at the edge region, so as to control the temperature difference of each boss within a very small range during the whole heating process.

[0065] In an example, referring to Figure 3 , the total volume of the cavities 113 inside the bosses 112 at the edge region is greater than the total volume of the cavities 113 inside the bosses 112 at the middle region.

[0066] In an example, referring to Figure 4 , the thermal regulation recess 114 is arranged around each boss 112 on the base surface 111, and the total volume of the thermal regulation recess 114 around the boss 112 at the edge region is greater than the total volume of the thermal regulation recess 114 around the boss 112 at the middle region. Of course, in another embodiment, the temperature of each boss 112 can also be adjusted and controlled by the distance between the thermal regulation recess 114 and the boss 112. For example, the thermal regulation recess 114 around the boss 112 at the edge region is closer to the boss 112 at the edge region, and is farther away from the boss 112 at the middle region.

[0067] In the present embodiment, the cavity 113 can be a cavity inside the boss 112, for example, the boss 112 is a split structure, and has a main body structure with the cavity and a cover or a sealing head sealing the open end of the cavity; the cavity 113 can also be a blind hole. Referring to Figure 3 , the number of cavities 113 on one boss 112 can be one or more. Preferably, when the cavity 113 of the boss 112 is a blind hole, the blind hole is arranged on the side of the boss 112 perpendicular to the base surface 111.

[0068] In the present embodiment, referring to Figure 4 and Figure 7 , the thermal regulation recess 114 can be a blind hole, a cavity, an annular groove, an arc-shaped groove or a strip-shaped groove, etc., which is not limited herein. Different forms mainly affect the concentration and range of thermal load adjustment.

[0069] In an example, referring to Figure 4 and Figure 5 , a special-shaped groove 115 is processed in the non-functional area (area other than the area where the boss is located) of the heat conduction block 110, which plays a key role in stripping a large amount of useless heat load in this area, thereby reducing the total heat capacity of the entire heat conduction block 110.

[0070] As shown in Figure 5 , in an example, a method for defining the boss area and the non-functional area outside the boss area is provided. Each boss 112 is arranged at intervals in the long edge direction of the heat conduction block 110 and flush in the short edge direction of the heat conduction block 110. An equal-diameter circle 116 is drawn with the center of each boss 112 as the center, and the equal-diameter circles 116 of two adjacent bosses 112 are tangent to each other. The special-shaped groove 115 is arranged outside the main body area defined by each of the equal-diameter circles 116. The "equal-diameter circle" in this embodiment is a circle shown by the dashed line in Figure 5 , and the "equal diameter" mainly refers to the diameter of the circle drawn with the center of each boss being the same. In a preferred embodiment, referring to Figure 5 , the special-shaped groove 115 around the boss 112 in the middle area has a boundary that is farther away from the boss 112 at the edge of the middle area. The special-shaped groove 115 around the boss 112 on both sides has a boundary that is closer to the boss 112 at the edge.

[0071] In an example, referring to Figure 2 and Figure 6 , the temperature control module 100 further comprises an elastomer layer 120 covering the area on the base surface 111 other than the bosses. The thickness of the elastomer layer 120 is less than the height of the boss 112 protruding from the base surface 111, so that the end surface of the boss 112 is still higher than the elastomer layer 120 and contacts the reaction chamber of the microfluidic chip. The elastomer layer 120 can form a sealed cavity with the special-shaped groove 115 and the thermal regulation recess 114. When the cavity 113 is arranged on the side of the boss 112 perpendicular to the base surface 111, the cavity 113 is also sealed by the elastomer layer 120 to form a sealed cavity. The air in the sealed cavity becomes a good heat preservation layer, reducing the heat loss of the heat conduction block 110. In a specific embodiment, the elastomer layer 120 is a special-shaped silica gel pad or other long-term high-temperature-resistant elastomer with small thermal conductivity.

[0072] Further, in order to more simply and conveniently fix the heat conduction block, referring to Figure 2The temperature control module 100 further comprises a pressing plate 130, which is provided with a through hole 131 for the boss 112 to pass through. The pressing plate 130 is pressed on the elastic layer 120, so as to compress and fix the heat-conducting block 110. At this time, the boss 112 passes through the through hole 131 and extends out of the pressing plate 130. In this example, the low thermal conductivity of the elastic layer 120 blocks the heat dissipation path of the heat-conducting block 110 in the direction of the pressing plate 130 (i.e. increases the thermal resistance in this direction), so as to force the heat to be more effectively conducted to the boss 112. The pressing plate 130 can be fixed to the structure (such as an air duct or a heat sink) at the periphery by screws, so as to fix the heat-conducting block 110 and facilitate disassembly and replacement. In this example, if the heat source of the heat-conducting block 110 is a Peltier element, the elastic layer 120 also has the function of uniformly distributing pressure and providing a certain buffer, so as to avoid uneven stress from causing the Peltier element to be cracked or damaged.

[0073] Of course, in some embodiments, the elastic layer 120 can not be provided, i.e. the pressing plate 130 is directly pressed on the heat-conducting block 110.

[0074] In this embodiment, preferably, the pressing plate 130 is an L-shaped piece (see Figure 2 The pressing plate 130 can be fixed from two directions.

[0075] In an example, the pressing plate 130 is provided with two guide strips 132 arranged at intervals, which are used to define the position of the microfluidic chip and ensure the accurate alignment of the microfluidic chip and the boss 112.

[0076] In order to improve safety, in an example, the temperature control module 100 further comprises an over-temperature protection module 140, the core component of which is a temperature fuse. When the temperature of the heat-conducting block 110 continuously rises and the temperature at the detection point reaches a threshold value, the temperature fuse is melted, so as to cut off the power supply to the heating component of the heat-conducting block 110. In a specific embodiment, the pressing plate 130 is further provided with a temperature sensing hole 133, and the temperature sensing hole 133 is provided with a heat-conducting medium (such as heat-conducting silicone grease, heat-conducting glue, etc.). In this example, the temperature sensing hole is the detection point, and the temperature fuse is arranged at the position of the temperature sensing hole 133 and contacts the heat-conducting medium.

[0077] In an example, the heat source (heating component) of the heat-conducting block 110 is a Peltier element 150, which is covered on the side of the heat-conducting block 110 away from the base surface 111, so as to facilitate arrangement and uniform heating. At the same time, it also has the function of refrigeration and can quickly cool down.

[0078] In an example, the temperature control module 100 further comprises a heat sink 160, an air duct 170 and a heat dissipation fan 180, the Peltier 150 is located between the heat conduction block 110 and the heat sink 160, the heat dissipation fan 180 is arranged at one end of the air duct 170, and a vent 171 is arranged at the other end of the air duct 170. In this example, the air duct 170 is a sheet metal body with a U-shaped or "mouth"-shaped cross section. The heat sink 160 is a fin plate. When the air duct 170 is a sheet metal body with a U-shaped cross section, the heat sink 160 serves as a side wall of the air duct 170 and is located on the side facing the heat conduction block 110, and together with the U-shaped sheet metal part it forms a cross-sectionally closed air duct. When the air duct 170 is a sheet metal body with a "mouth"-shaped cross section, the heat sink 160 is fixed to the side wall of the air duct 170 facing the heat conduction block 110.

[0079] The present embodiment also provides a microfluidic detection system, which uses single-sided heating for the microfluidic chip, and the heating uses any one of the temperature control modules 100 in the above examples.

[0080] Referring to Figure 8 , the present embodiment also provides another microfluidic detection system, which uses double-sided heating for the microfluidic chip, and the heating uses two oppositely arranged temperature control modules 100.

[0081] The microfluidic detection system of the present embodiment effectively adjusts the heat load of each region by arranging different thermal regulation structures (such as cavities, recesses) on the bosses of the heat conduction block of its temperature control module or around them, compensates for the temperature unevenness caused by the edge effect, realizes high-precision temperature control of the temperature difference between the bosses, and reduces the temperature difference between the bosses. The problem of inconsistent amplification efficiency caused by temperature difference is effectively avoided, and the accuracy and repeatability of the microfluidic detection system are improved.

[0082] In the present embodiment, temperature difference measurement is performed on a microfluidic detection system with two oppositely arranged temperature control modules as shown in Figure 8 , the heat conduction block 110 adopts the structure as shown in Figure 3 , and is heated by a Peltier 150, and an elastomer layer 120 of silica gel material is covered on the heat conduction block 110, and the heat conduction block 110 is tightly fixed by a pressing plate 130. When the heat conduction block of the system is heated to 95℃ and 60℃ respectively, the corresponding microfluidic chip amplification chambers (four chambers) are measured, and the measurement results are as shown in Tables 1 and 2.

[0083]

[0084] Table 1: Temperature measurement values of the microfluidic chip amplification chambers when the heat conduction block of the present embodiment is heated to 95℃, the difference between the maximum temperature and the minimum temperature is 0.201℃.

[0085]

[0086] Table 2: The temperature measurement value of the microfluidic chip amplification chamber corresponding to the heat block heated at 60℃, the difference between the maximum temperature and the minimum temperature is 0.097℃.

[0087] Comparative Example

[0088] In this comparative example, the heat block is a flat heat block (without a boss) in the prior art, and a Peltier is used as a heat source. The flat heat block is directly attached to the microfluidic chip, and a double-sided heating method is also used, that is, the microfluidic detection system has two temperature control modules arranged oppositely.

[0089] The microfluidic chip amplification chamber (four chambers) corresponding to the heat block of the system is measured when heated at 95℃ and 60℃, respectively, and the measurement results are shown in Tables 3 and 4.

[0090]

[0091] Table 3: The temperature measurement value of the chip amplification chamber corresponding to the flat heat block heated at 95℃, the difference between the maximum temperature and the minimum temperature is 0.843℃.

[0092]

[0093] Table 4: The temperature measurement value of the chip amplification chamber corresponding to the flat heat block heated at 60℃, the difference between the maximum temperature and the minimum temperature is 0.703℃.

[0094] By comparing the data in Tables 1 and 3, and Tables 2 and 4, it can be seen that the heating temperature uniformity of the chip chamber of the microfluidic detection system using the heat block of the present application is significantly better than that of the flat heat block of the comparative example.

[0095] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that not every example contains only one independent technical solution, and in the absence of solution conflicts, various technical features mentioned in each example can be combined in any way to form other embodiments that can be understood by those skilled in the art.

[0096] In addition, without departing from the scope of the present application, the technical solutions described in the foregoing examples are modified, or some of the technical features are replaced with equivalents, without changing the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A temperature control module for a microfluidic chip, comprising a heat-conducting block, characterized in that: The heat-conducting block has a base surface and multiple protrusions protruding from the base surface for contacting the individual reaction chambers on the microfluidic chip. The heat-conducting block is configured to compensate for edge effects during the heat conduction process through its internal thermal regulation structure, thereby reducing the temperature difference between the various bosses during operation. The thermal regulation structure includes: A cavity is provided inside the boss located in the edge region to change the heat load of the boss; and / or A thermal regulation recess for changing the thermal load around the boss is provided around the boss on the base surface and in the edge region. or The thermal regulation structure includes: Each of the bosses has a cavity inside for changing the heat load of that boss, and the total volume of the cavity inside the boss located at the edge of the heat-conducting block is greater than the total volume of the cavity inside the boss located in the middle region of the heat-conducting block; and / or Each boss on the base surface is provided with a heat-regulating recess for changing the heat load around the boss. The total volume of the heat-regulating recesses around the boss located at the edge of the heat-conducting block is greater than the total volume of the heat-regulating recesses around the boss located in the middle of the heat-conducting block.

2. The temperature control module according to claim 1, characterized in that: The cavity is a blind hole; and / or The thermal regulation recess is a blind hole, an annular groove, an arc-shaped groove, or a strip groove.

3. The temperature control module according to claim 1, characterized in that: The area where the multiple protrusions are located on the base surface is a protrusion area. A groove is provided in the area outside the protrusion area on the base surface to reduce the heat load in the area outside the protrusion area of ​​the heat-conducting block.

4. The temperature control module according to claim 3, characterized in that: The protrusions are spaced apart along the long side of the heat-conducting block and aligned with each other along the short side. A circle of equal diameter is drawn with the center of each protrusion as the center, and the circles of equal diameter of two adjacent protrusions are tangent to each other. The irregular groove is located outside the main area defined by each circle of equal diameter.

5. The temperature control module according to claim 3, characterized in that: It also includes an elastomer layer that covers the area on the base surface other than the boss, and the thickness of the elastomer layer is less than the height of the boss protruding from the base surface.

6. The temperature control module according to claim 5, characterized in that: It also includes a pressure plate, which has a through hole for the boss to pass through. The pressure plate presses on the elastomer layer, thereby pressing and fixing the heat-conducting block. The boss passes through the through hole and extends out of it.

7. The temperature control module according to claim 6, characterized in that: The pressure plate is provided with two spaced guide strips to define the position of the microfluidic chip; and / or The pressure plate is also provided with a temperature sensing hole, and a heat-conducting medium is provided inside the temperature sensing hole; An over-temperature protection module is provided outside the pressure plate. The over-temperature protection module is equipped with a temperature fuse at the position corresponding to the temperature sensing hole. When the temperature at the detection point reaches the threshold, the temperature fuse melts and cuts off the power supply to the heating component of the heat-conducting block.

8. The temperature control module according to claim 1, characterized in that: It also includes a Peltier, which covers the side of the heat-conducting block opposite to the base surface.

9. The temperature control module according to claim 8, characterized in that: The temperature control module also includes a heat sink, an air duct, and a cooling fan. The Peltier is located between the heat-conducting block and the heat sink. The cooling fan is located at one end of the air duct, and a vent is provided at the other end of the air duct. The radiator serves as the sidewall of the air duct facing the heat-conducting block or is disposed on the sidewall of the air duct facing the heat-conducting block.

10. The temperature control module according to claim 1, characterized in that: When the heat-conducting block is in operation, the temperature difference between each boss is within 0.5℃.

11. A microfluidic detection system, characterized in that: Includes the temperature control module as described in any one of claims 1 to 10.

12. The microfluidic detection system according to claim 11, characterized in that: The number of temperature control modules is two, and the two temperature control modules are arranged opposite to each other.

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