Relay

Abstract

The invention discloses a relay, and relates to the technical field of relays, and the relay comprises a body; the shell is arranged outside the body in a covering manner, and the peripheral wall of the shell is hollow; the first semiconductor refrigerator is arranged in the peripheral wall, the first semiconductor refrigerator is provided with a first refrigeration surface and a first heat dissipation surface which are oppositely arranged, and the first refrigeration surface faces one side of the body so as to cool the body; and the first heat dissipation assembly is arranged on the first heat dissipation surface, and the first heat dissipation assembly is used for dissipating heat of the heat dissipation surface. According to the technical scheme, the heat dissipation effect of the heating position of the relay is improved.

Description

Technical Field

[0001] This invention relates to the field of relay technology, and in particular to a relay. Background Technology

[0002] High-voltage DC relays utilize the principle of electromagnetic induction. By energizing a coil, a magnetic field is generated to drive the armature to move, thereby closing and opening the moving and stationary contacts and controlling the on / off state of the main circuit.

[0003] Because high-voltage DC relays operate under high voltage and high current conditions, the internal contacts and conductive circuits generate a large amount of heat due to the Joule effect. If the heat dissipation design is inadequate, the internal temperature will rise sharply, accelerating the aging of insulation materials, reducing contact reliability, causing performance degradation or even thermal failure, seriously threatening the safety and stability of system operation. In addition, current heat dissipation methods have obvious shortcomings, such as limited accuracy of temperature control sensors, single cooling methods, and a lack of dynamic regulation capabilities that can intelligently respond to load changes, resulting in unsatisfactory temperature rise control, which in turn affects the long-term reliability and service life of the relay. Summary of the Invention

[0004] The main objective of this invention is to provide a relay that addresses the aforementioned technical problems.

[0005] To achieve the above objectives, the present invention provides a relay comprising: ontology; An outer shell is provided to cover the outside of the main body, and the outer peripheral wall of the outer shell is hollow; A first semiconductor cooler is disposed within the outer peripheral wall. The first semiconductor cooler has a first cooling surface and a first heat dissipation surface disposed opposite to each other. The first cooling surface faces the body to cool the body. A first heat dissipation component is disposed on the first heat dissipation surface, and the first heat dissipation component is used to dissipate heat from the heat dissipation surface.

[0006] In one embodiment, the first heat dissipation component includes a first airflow generating element disposed on the first heat dissipation surface, and the first airflow generating element is used to generate airflow outside the first semiconductor cooler.

[0007] In one embodiment, the body has terminals extending from the housing, and the relay further includes a second heat dissipation assembly thermally connected to the terminals to dissipate heat from the terminals.

[0008] In one embodiment, the second heat dissipation component includes: A second semiconductor cooler is sleeved on the outside of the terminal. The second semiconductor cooler has a second cooling surface and a second heat dissipation surface that are disposed opposite to each other. The second cooling surface is thermally connected to the terminal. A first heat-conducting element is disposed outside the second semiconductor cooler and extends away from the body, and the first heat-conducting element is thermally connected to the second heat dissipation surface.

[0009] In one embodiment, a plurality of fins are disposed on the outer wall of the first heat-conducting element away from the second semiconductor cooler.

[0010] In one embodiment, the body has a yoke, and the relay further includes a third heat dissipation assembly that is thermally connected to the yoke.

[0011] In one embodiment, the third heat dissipation component includes: A third semiconductor cooler is disposed outside the yoke. The third semiconductor cooler has a third cooling surface and a third heat dissipation surface disposed opposite to each other. The third cooling surface is thermally connected to the yoke. The second airflow generator is disposed on one side of the third heat dissipation surface and is used to generate airflow outside the third semiconductor cooler.

[0012] In one embodiment, the third heat dissipation component further includes a second heat-conducting element disposed on the third heat dissipation surface and thermally connected to the third heat dissipation surface. The outer wall of the second heat-conducting element is provided with a plurality of fins, and the second airflow generating element is disposed on the side of the second heat-conducting element away from the third semiconductor cooler.

[0013] In one embodiment, the third heat dissipation assembly further includes a heat spreader plate disposed between the second heat-conducting element and the third heat dissipation surface; and / or, The third semiconductor cooler is externally insulated.

[0014] In one embodiment, the third heat dissipation component is detachably connected to the yoke; and / or, A limiting body protrudes from the yoke toward the third heat dissipation component, and the limiting body abuts against the outer wall of the third heat dissipation component to fix the third heat dissipation component.

[0015] In the technical solution of the present invention, by integrating a first semiconductor cooler into the relay housing to absorb the heat of the body, and combining it with a first heat dissipation component to conduct the heat to the outside, a partitioned heat dissipation structure can be set for key parts such as terminals and yokes, which can optimize the heat conduction path and improve heat dissipation efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of a relay according to an embodiment of the present invention; Figure 2 for Figure 1 Exploded view of the structure in the Chinese embodiment; Figure 3 A schematic diagram of another embodiment of the relay provided by the present invention; Figure 4 for Figure 3 Exploded view of the structure in the Chinese embodiment; Figure 5 A schematic diagram of another embodiment of the relay provided by the present invention; Figure 6 for Figure 5 Exploded view of the structure of the Chinese embodiment.

[0018] Explanation of icon numbers: 10. Control board; 100. Body; 110. Terminal; 120. Yoke; 121. Limiting body; 200. Housing; 300. First semiconductor cooler; 400. First heat dissipation component; 500. Second heat dissipation component; 510. Second semiconductor cooler; 520. First heat conduction component; 600. Third heat dissipation component; 610. Third semiconductor cooler; 620. Second airflow generator; 630. Second heat conduction component; 640. Heat spreader; 650. Insulation body.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] Under high voltage and high current conditions, high-voltage DC relays generate a large amount of heat in their contacts and conductive circuits due to the Joule effect. Poor heat dissipation design can lead to a sharp rise in internal temperature, accelerating the aging of insulation materials, reducing contact reliability, and even causing thermal failure, seriously threatening the safety and stability of the system. Furthermore, existing heat dissipation methods suffer from limitations such as limited accuracy of temperature control sensors, a single cooling method, and a lack of intelligent dynamic control capabilities, making it difficult to effectively control temperature rise and affecting the long-term reliability and lifespan of the relay.

[0024] Therefore, this application proposes a relay comprising: Ontology 100; The outer shell 200 covers the outside of the main body 100, and the outer peripheral wall of the outer shell 200 is hollow; A first semiconductor cooler 300 is disposed within the outer peripheral wall. The first semiconductor cooler 300 has a first cooling surface and a first heat dissipation surface disposed opposite to each other. The first cooling surface faces the body 100 to cool the body 100. A first heat dissipation component 400 is disposed on a first heat dissipation surface, and the first heat dissipation component 400 is used to dissipate heat from the first heat dissipation surface.

[0025] In the technical solution of the present invention, by integrating a first semiconductor cooler 300 into the relay housing 200 to absorb the heat of the body 100, and combining it with a first heat dissipation component 400 to conduct the heat to the outside, a partitioned heat dissipation structure can be set for key parts such as the terminal 110 and the yoke 120, which can optimize the heat conduction path and improve the heat dissipation efficiency.

[0026] like Figure 1 and Figure 2 The outer casing 200 is a ceramic cover and is an inherent component of the relay. The outer casing 200 provides protection for the body 100 and improves its insulation performance. The outer peripheral wall of the outer casing 200 is a side wall surrounding the body 100, and the interior of the outer peripheral wall forms a cavity structure. This cavity structure can extend throughout the entire outer peripheral wall or be located only in areas of the body 100 where heat is concentrated. A first semiconductor cooler 300 is embedded in the cavity of the outer peripheral wall of the outer casing 200. Specifically, the first semiconductor cooler 300 can be a semiconductor cooler made of bismuth telluride. The first semiconductor cooler 300 can be connected to external wires and receive a DC signal. When current is applied to the first semiconductor cooler 300, it has a first cooling surface with a lower temperature and a first heat dissipation surface with a higher temperature. The first cooling surface faces the body 100, and the first heat dissipation surface faces away from the body 100. Its function is to cool the body 100 using the first cooling surface and transfer the heat of the body 100 to the first heat dissipation surface. To prevent heat accumulation inside the housing 200, a first heat dissipation component 400 is provided on the first heat dissipation surface. This component 400 can be a finned heat sink, a fan, or similar device. Its function is to dissipate heat from the first heat dissipation surface to the external environment through thermal conduction or forced convection, forming active heat dissipation and thus improving the heat dissipation effect of the main body 100. This multi-layered heat dissipation structure achieves directional heat conduction from the inside to the outside of the relay. Integrating the heat dissipation structure into the relay housing 200 reduces the relay size, transforms passive heat dissipation into active heat dissipation, improves heat dissipation efficiency, effectively controls the internal temperature rise of the relay, reduces the risk of insulation material aging and decreased contact reliability, and enhances the stability and service life of the relay under high-voltage, high-current operating environments.

[0027] like Figure 2 The diagram illustrates one structural form of a first heat dissipation component 400. In this embodiment, the first heat dissipation component 400 includes a first airflow generator disposed on a first heat dissipation surface, which is used to generate airflow outside the first heat dissipation surface.

[0028] To improve heat transfer efficiency, a window can be opened on one side of the outer casing 200 to expose the first heat dissipation surface. A heat spreader 640 or other high thermal conductivity devices can be installed on the first heat dissipation surface to quickly transfer heat to the outside of the outer casing 200. The first airflow generator can be attached to the first heat dissipation surface. To improve efficiency, the size of the first heat dissipation surface can be adjusted according to the requirements of heat dissipation efficiency and heat dissipation volume. Alternatively, the first airflow generator can be a small fan that generates airflow on the surface of the first heat dissipation surface. To ensure the airflow coverage area, the blade diameter of the first airflow generator can match the width of the first heat dissipation surface. When heat is transferred to the first heat dissipation surface, the airflow generated by the first airflow generator acts on the surface of the first heat dissipation surface, accelerating airflow and carrying away heat. In this way, the heat of the body 100 can be continuously dissipated to the external environment through the above path, accelerating heat dissipation efficiency and avoiding the problem of excessive local temperature rise. Furthermore, by adopting this heat dissipation method, the designer can adjust the position and heat dissipation efficiency of the first heat dissipation component 400 according to the heat generation of the body 100 to adapt to different heat dissipation needs.

[0029] In addition, for ease of control, a temperature sensor can be installed inside the housing 200. The temperature sensor can be located on the first cooling surface to monitor the temperature of the body 100 at that location in real time. A control board 10 can be installed outside the housing 200, and a controller is installed on the control board 10. The temperature sensor and the first semiconductor cooler 300 can be connected to the control board 10 through an auxiliary adapter terminal 110. Since the relay in this solution is a DC relay, the power supply of the control board 10 can be connected in parallel with the control circuit of the relay to simplify the structure. During operation, the temperature sensor transmits the real-time temperature of the body 100 to the controller on the control board 10. The controller can respond quickly and further control the current of the first semiconductor cooler 300 to regulate the heat dissipation power, keeping the temperature within a safe range, realizing intelligent adjustment of the relay temperature, and improving the reliability and stability of the relay operation.

[0030] like Figure 3 and Figure 4 In another embodiment of this application, the body 100 has a terminal 110 extending from the housing 200, and the relay further includes a second heat dissipation assembly 500, which is thermally connected to the terminal 110 to dissipate heat from the terminal 110.

[0031] The relay includes two terminals 110, which are controlled to open and close via a relay. These terminals 110 can be connected to a high-voltage DC line. During operation, the terminals 110 generate significant heat due to the large current flowing through them, making this a heat-concentrating area within the relay. This embodiment addresses heat dissipation in this area. In this embodiment, the terminals 110 extend from the outer casing 200 for electrical connection to an external circuit. The second heat dissipation component 500 can employ a structure similar to the first semiconductor cooler 300. The second heat dissipation component 500 contacts and conducts heat to the terminals 110, transferring heat to the second heat dissipation component 500 and dissipating it into the surrounding air. In this design, since the second heat dissipation component 500 operates independently in the terminal 110 area outside the outer casing 200, its heat dissipation path does not interfere with the first heat dissipation component 400, forming a regional heat dissipation architecture. This achieves temperature control of critical heat-generating components while maintaining the overall compactness of the relay structure.

[0032] like Figure 4 One structural form of the second heat dissipation assembly 500 is shown. In this embodiment, the second heat dissipation assembly 500 includes: The second semiconductor cooler 510 is sleeved on the outside of the terminal 110. The second semiconductor cooler 510 has a second cooling surface and a second heat dissipation surface that are arranged opposite to each other. The second cooling surface is thermally connected to the terminal 110. The first heat-conducting element 520 is disposed outside the second semiconductor cooler 510 and extends away from the body 100. The first heat-conducting element 520 is thermally connected to the second heat dissipation surface.

[0033] The second thermoelectric cooler 510 can adopt a structure similar to that of the first thermoelectric cooler 300. In this embodiment, the second thermoelectric cooler 510 can use an annular or cylindrical structure to wrap the outer surface of the terminal 110 to increase the contact area and improve the efficiency of heat conduction. In addition, to prevent short circuits, an insulating material can be provided between the second thermoelectric cooler 510 and the terminal 110. Furthermore, thermally conductive silicone grease can be filled between the second thermoelectric cooler 510 and the terminal 110 to reduce contact thermal resistance. The second thermoelectric cooler 510 has a second cooling surface and a second heat dissipation surface similar to those of the first thermoelectric cooler 300. The second cooling surface is attached to the outer peripheral wall of the terminal 110, and the second heat dissipation surface is disposed away from the terminal 110. In addition, the second thermoelectric cooler 510 can also be connected to the control board 10 through the adapter terminal 110, thereby realizing active heat dissipation of the terminal 110 and improving the heat dissipation effect. In addition, a temperature sensor can be installed on terminal 110. The temperature sensor is electrically connected to control board 10. By monitoring the temperature of terminal 110 in real time, control board 10 can adjust the current in real time to control the cooling capacity of the second semiconductor cooler 510, thereby achieving intelligent heat dissipation of terminal 110 and reducing energy consumption while meeting heat dissipation requirements. Furthermore, the first heat-conducting element 520 can be sleeved on the outside of the second semiconductor cooler 510. The first heat-conducting element 520 also has a structure extending away from terminal 110. This structure can be fins or other structures that facilitate heat dissipation. During operation, heat from terminal 110 can be transferred radially to the first heat-conducting element 520 and then to the surrounding air, achieving heat dissipation of terminal 110. Because the first heat-conducting element 520 extends away from terminal 110, heat accumulation around terminal 110 is reduced, which is beneficial for controlling the temperature of terminal 110. The above technical solution can achieve efficient heat dissipation of terminal 110. At the same time, the first heat-conducting component 520 transfers heat to a wider heat dissipation area, preventing heat from flowing back into the body 100 and improving heat dissipation efficiency.

[0034] like Figure 3 In another embodiment of this application, a plurality of fins are provided on the outer wall of the first heat-conducting element 520 away from the second semiconductor cooler 510. These fins can be arranged in parallel and extend along the direction of airflow passing through the relay to ensure smooth airflow. The number, spacing, and height of the fins can be set according to the heat dissipation requirements. The arrangement of the fins can increase the contact area between the first heat-conducting element 520 and the air, thereby further improving the heat dissipation effect.

[0035] like Figure 5 and Figure 6 In another embodiment of this application, the body 100 has a yoke 120, and the relay further includes a third heat dissipation component 600, which is thermally connected to the yoke 120.

[0036] In this embodiment, the yoke 120, as a magnetically conductive component, may generate heat due to hysteresis and eddy current losses under continuous high voltage and high current conditions. If this heat cannot be effectively dissipated, it will lead to excessive local temperature rise, causing problems such as magnetic performance degradation and decreased armature operation accuracy. Therefore, this embodiment provides a third heat dissipation component 600 on the yoke 120. The third heat dissipation component 600 is thermally connected to the yoke 120, allowing heat from the yoke 120 to be transferred to the third heat dissipation component 600. The third heat dissipation component 600 can be a semiconductor cooling chip or heat sink, as described above. By guiding some of the heat from the yoke 120 to the outside, the problem of heat accumulation due to magnetic losses in the yoke 120 can be specifically solved, thereby improving the relay's operational stability and long-term reliability.

[0037] like Figure 6 In another embodiment of this application, the third heat dissipation component 600 includes: The third semiconductor cooler 610 is disposed outside the yoke 120. The third semiconductor cooler 610 has a third cooling surface and a third heat dissipation surface disposed opposite to each other. The third cooling surface is thermally connected to the yoke 120. The second airflow generator 620 is disposed on one side of the third heat dissipation surface and is used to generate airflow outside the third semiconductor cooler 610.

[0038] The third semiconductor cooler 610 can adopt a structure similar to that of the first semiconductor cooler 300. The third semiconductor cooler 610 also has a third cooling surface and a third heat dissipation surface. The third cooling surface is attached to the outer wall of the yoke 120. The third semiconductor cooler 610 is electrically connected to the control board 10. The control board 10 can control the heat dissipation efficiency by controlling the current, thereby achieving precise temperature control of the yoke 120. The second airflow generator 620 can be an axial flow fan or a centrifugal fan. By closely adhering to the outer surface of the yoke 120, the third semiconductor cooler 610 conducts the heat accumulated inside the yoke 120 to the third heat dissipation surface. The airflow generated by the second airflow generator 620 acts on the third heat dissipation surface, dissipating the heat from the third heat dissipation surface to the external environment. This achieves active heat dissipation of the yoke 120, improving the heat dissipation effect.

[0039] like Figure 6In another embodiment of this application, the third heat dissipation assembly 600 further includes a second heat-conducting element 630 disposed outside the third semiconductor cooler 610. The second heat-conducting element 630 is thermally connected to the third semiconductor cooler 610, and its outer wall is provided with multiple fins. A second airflow generating element 620 is disposed on the side of the second heat-conducting element 630 away from the third semiconductor cooler 610. Specifically, the heat generated by the yoke 120 is transferred to the second heat-conducting element 630 through the third semiconductor cooler 610. The fins on the outer wall of the second heat-conducting element 630 diffuse the heat to a larger surface area. By increasing the contact area with the air, the fins improve the heat dissipation efficiency. When the second airflow generating element 620 is running, the airflow directly washes over the fin surface, allowing the heat of the second heat-conducting element 630 to be fully dissipated, thus avoiding the problem of heat accumulation.

[0040] like Figure 6 In another embodiment of this application, the third heat dissipation component 600 further includes a heat spreader 640, which is disposed between the second heat-conducting element 630 and the third thermoelectric cooler 610. The second heat-conducting element 630 and the third thermoelectric cooler 610 are respectively attached to both sides of the heat spreader 640. The heat spreader 640 can adopt a conventional structure available on the market. Its internal capillary structure can quickly conduct heat along the planar direction, which can ensure the uniformity of heat transfer between the second heat-conducting element 630 and the third thermoelectric cooler 610, thereby ensuring heat dissipation efficiency.

[0041] like Figure 6 In another embodiment of this application, a heat insulation body 650 is provided on the outside of the third semiconductor cooler 610; wherein, the heat insulation body 650 may be made of materials such as sponge, and the heat insulation body 650 is arranged around the third semiconductor cooler 610, so as to prevent heat from dissipating from the side wall of the third semiconductor cooler 610 and flowing back to the yoke 120, ensuring that heat is more fully transferred to the second heat conductor 630, thereby ensuring the heat dissipation effect.

[0042] In another embodiment of this application, the third heat dissipation component 600 and the yoke 120 are detachable. The detachment can be achieved through magnetic snap-fit ​​or similar methods. In this solution, a magnet can be provided on the third heat dissipation component 600 to magnetically fix it to the yoke 120. By designing it as a detachable connection, users can flexibly install and remove the third heat dissipation component 600 as needed, allowing for a smaller relay size or stronger heat dissipation to meet different usage requirements. Furthermore, as... Figure 6In another embodiment of this application, a limiting body 121 is provided on the side of the yoke 120 facing the third heat dissipation component 600. The limiting body 121 can be a protrusion or other structure. The limiting body 121 can be arranged around the third heat dissipation component 600. When the third heat dissipation component 600 is fixedly installed on the yoke 120, the limiting body 121 can restrict the movement of the third heat dissipation component 600, prevent the position of the third heat dissipation component 600 from changing during use and affecting the heat dissipation effect, and improve the reliability of use.

[0043] The above are merely exemplary embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A relay, characterized in that, include: ontology; An outer shell is provided to cover the outside of the main body, and the outer peripheral wall of the outer shell is hollow; A first semiconductor cooler is disposed within the outer peripheral wall. The first semiconductor cooler has a first cooling surface and a first heat dissipation surface disposed opposite to each other. The first cooling surface faces the body to cool the body. A first heat dissipation component is disposed on the first heat dissipation surface, and the first heat dissipation component is used to dissipate heat from the first heat dissipation surface.

2. The relay as described in claim 1, characterized in that, The first heat dissipation component includes a first airflow generating element, which is disposed on the first heat dissipation surface and is used to generate airflow outside the first semiconductor cooler.

3. The relay as described in claim 1, characterized in that, The body has terminals extending from the housing, and the relay further includes a second heat dissipation assembly, which is thermally connected to the terminals to dissipate heat from the terminals.

4. The relay as described in claim 3, characterized in that, The second heat dissipation component includes: A second semiconductor cooler is sleeved on the outside of the terminal. The second semiconductor cooler has a second cooling surface and a second heat dissipation surface that are disposed opposite to each other. The second cooling surface is thermally connected to the terminal. A first heat-conducting element is disposed outside the second semiconductor cooler and extends away from the body, and the first heat-conducting element is thermally connected to the second heat dissipation surface.

5. The relay as described in claim 4, characterized in that, Multiple fins are disposed on the outer wall of the first heat-conducting element away from the second semiconductor cooler.

6. The relay as described in claim 1, characterized in that, The body has a yoke, and the relay further includes a third heat dissipation component, which is thermally connected to the yoke.

7. The relay as described in claim 6, characterized in that, The third heat dissipation component includes: A third semiconductor cooler is disposed outside the yoke. The third semiconductor cooler has a third cooling surface and a third heat dissipation surface disposed opposite to each other. The third cooling surface is thermally connected to the yoke. The second airflow generator is disposed on one side of the third heat dissipation surface and is used to generate airflow outside the third semiconductor cooler.

8. The relay as described in claim 7, characterized in that, The third heat dissipation component further includes a second heat-conducting element, which is disposed on the third heat dissipation surface and thermally connected to the third heat dissipation surface. The outer wall of the second heat-conducting element is provided with multiple fins, and the second airflow generating element is disposed on the side of the second heat-conducting element away from the third semiconductor cooler.

9. The relay as described in claim 8, characterized in that, The third heat dissipation component further includes a heat spreader plate, which is disposed between the second heat-conducting element and the third heat dissipation surface; and / or, The third semiconductor cooler is externally insulated.

10. The relay as claimed in claim 6, characterized in that, The third heat dissipation component is detachably connected to the yoke; and / or A limiting body protrudes from the yoke toward the third heat dissipation component, and the limiting body abuts against the outer wall of the third heat dissipation component to fix the third heat dissipation component.

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