AWG dispensing method of optical module and optical module

Abstract

The invention relates to an AWG dispensing method of an optical module and the optical module. The AWG dispensing method comprises the steps that at least two glue lines are dispensed at the position, corresponding to an AWG, of a PCBA through first glue; forming at least one glue point between the at least two glue lines by adopting second glue; the fluidity of the second glue is better than that of the first glue; and the AWG is coupled to the PCBA through a glue line and a glue point. According to the application, the AWG and the PCBA are dispensed and coupled in a mode that the glue with good fluidity and the glue with poor fluidity are matched, and the problems that in the prior art, when the AWG and the PCBA are bonded through the glue, subsequent product failure is easily caused due to the fact that the contact area is too large, and coupling failure is easily caused due to the fact that the viscous force of the glue is too large are solved.

Description

Technical Field

[0001] This application relates to the field of optical module technology, and in particular to an AWG dispensing method for optical modules and an optical module. Background Technology

[0002] Optical modules, as key components in the field of communication, primarily function to convert optical signals into electrical signals and are widely used in fiber optic communication networks. An optical module mainly consists of three core parts: a Transmitter Optical Subassembly (TOSA), a Receiver Optical Subassembly (ROSA), and a circuit board. The Receiver Optical Subassembly, as the optical receiving part of the module, primarily converts the optical signals received from the fiber optic network into electrical signals, amplifies them, and processes them.

[0003] refer to Figure 1 and Figure 2 The diagram shows a schematic of an optical receiving submodule, including a printed circuit board assembly (PCBA) and transimpedance amplifiers (TIAs), photodiode (PD) arrays, and arrayed waveguide gratings (AWGs) mounted on the PCBA. The AWGs are fixed to the PCBA with adhesive. Typically, AWGs are made of glass or silicon. The coefficient of thermal expansion of the AWG differs significantly from that of the adhesive and PCBA materials, resulting in substantial residual stress when the AWG is fixed to the PCBA with adhesive. Therefore, reducing the residual stress between the AWG, adhesive, and PCBA is crucial to mitigating product reliability risks.

[0004] In current adhesive bonding processes for AWGs (Awrap-of-Growth Machines), low-thermal-expansion-coefficient adhesives are typically used to fix the AWG to the PCBA. However, if a highly fluid adhesive is used, the gap between the AWG and PCBA is very small, usually less than 50µm. The adhesive spreads quickly through capillary action, even covering the entire bottom surface of the AWG. This results in a large contact area between the adhesive and both the AWG and PCBA. Products with this type of bonding are more susceptible to temperature changes, leading to significant stress on the AWG and increasing the risk of cracking and product failure. Conversely, if a poorly fluid adhesive is used, the adhesive's viscous force is very high. If too little adhesive is used, the contact area between the AWG and the adhesive is too small, resulting in a weak bond. If too much adhesive is used, it is difficult to press the AWG to the required height when the gap between the AWG and PCBA is small. Furthermore, since vacuum nozzles are typically used to pick up the AWG, excessive adhesive viscous force can easily cause relative displacement between the AWG and the nozzle, leading to coupling failure.

[0005] Therefore, how to overcome the shortcomings of the existing technology and solve the problems that the existing technology can easily cause subsequent product failure due to excessive contact area and coupling failure due to excessive adhesive force when bonding AWG and PCBA with glue is a problem to be solved in this technical field. Summary of the Invention

[0006] In view of the above-mentioned defects or improvement needs of the prior art, and in order to solve the problems that the existing technology is prone to subsequent product failure due to excessive contact area and coupling failure due to excessive adhesive force when bonding AWG and PCBA with adhesive, this application provides an AWG dispensing method and an optical module, which uses a combination of adhesive with good flowability and adhesive with poor flowability to dispense and couple AWG and PCBA, thereby solving the above-mentioned problems of the prior art.

[0007] The embodiments of this application adopt the following technical solutions: In a first aspect, this application provides an AWG dispensing method for an optical module, comprising: Apply the first glue to the corresponding AWG position on the PCBA to form at least two glue lines; At least one glue dot is formed between at least two glue lines using a second glue; the second glue has better flowability than the first glue. AWGs are coupled to the PCBA via adhesive lines and adhesive dots.

[0008] By adopting the above technical solution, two glue lines are formed on both sides of the glue dot using a glue with poor flowability, preventing the glue from spreading significantly to both sides. Furthermore, by controlling the distance between the two glue lines, the area of ​​glue on the bottom of the AWG can be effectively controlled, thereby controlling the stress between the AWG and PCBA caused by temperature changes and reducing the probability of subsequent product failure due to excessive contact area of ​​the AWG. Further, using a glue dot with good flowability in the middle of the two glue lines ensures sufficient contact between the glue and the AWG within the allowable range without using excessive glue volume, preventing weak adhesion of the AWG and allowing the AWG to be easily pressed down to the required height. Simultaneously, due to the lower viscosity of the glue in the middle, there is no relative displacement between the AWG and the nozzle, solving the risk of coupling failure caused by excessive glue viscosity in traditional solutions.

[0009] In some embodiments, the viscosity of the first adhesive is greater than 100,000 cps, and the viscosity of the second adhesive is less than 10,000 cps.

[0010] By adopting the above technical solution, an adhesive with a viscosity greater than 100,000 cps is selected as the first adhesive, which makes the first adhesive have poor flowability, thereby meeting the requirement of avoiding excessive diffusion of the adhesive; an adhesive with a viscosity less than 10,000 cps is selected as the second adhesive, which makes the second adhesive have good flowability, thereby avoiding the situation where the relative displacement between the AWG and the nozzle is caused by excessive viscous force.

[0011] In some embodiments, the first adhesive dots are formed into two parallel adhesive lines, each adhesive line being less than 0.5 mm wide, and the distance between the two adhesive lines being 1.4 mm to 2.1 mm.

[0012] By adopting the above technical solution, the two parallel glue lines with poor flowability can form a barrier on both sides, better restricting the glue dots with good flowability in the middle. This limits the diffusion range of the glue dots to the area between the two parallel glue lines, achieving the purpose of controlling the glue area at the bottom of the AWG. The width of each glue line is less than 0.5mm to avoid the problem of excessive adhesive force caused by excessive use of the first glue with poor flowability. The distance between the two glue lines is 1.4mm-2.1mm to ensure that the diffusion area of ​​the second glue with good flowability is appropriate, avoiding the problems of insufficient adhesion due to too small an area and excessive stress on the AWG due to too large an area.

[0013] In some embodiments, the second adhesive is applied as a dot between the two adhesive lines, and the diameter of the dot is 1mm-2mm.

[0014] By adopting the above technical solution, the diameter of the glue dot is 1mm-2mm to ensure that the amount of the second glue with good fluidity is appropriate, avoiding the problem of uncontrolled diffusion due to excessive amount and insufficient adhesion due to insufficient amount.

[0015] In some embodiments, prior to AWG dispensing, the method further includes mounting the TIA and PD array on the corresponding positions on the PCBA.

[0016] By adopting the above technical solution, the TIA and PD array are pre-mounted. When coupling the AWG later, the specific position of the AWG can be adjusted by the responsivity of the PD array, thereby completing the coupling and pasting of the AWG while ensuring the performance of the optical module.

[0017] In some embodiments, coupling the AWG to the PCBA via adhesive lines and adhesive dots specifically includes: Power on the PCBA and connect one end of the fiber optic adapter that connects to the AWG to the light source; Move the AWG above the corresponding glue line and glue dot, and position one end of the AWG above the PD array. Adjust the position of the AWG to maximize the responsiveness of the PD array, and then turn on the curing lamp to cure the glue. The coupled products are placed in an oven to bake, further curing the adhesive.

[0018] By adopting the above technical solution, the position of the AWG is adjusted based on the responsivity of the PD array to optimize the performance of the optical module. The adhesive is cured by a combination of curing lamp and oven baking, resulting in better adhesive curing effect.

[0019] In some embodiments, during the coupling of AWG and PCBA, a suction nozzle assembly is used to move PCBA and AWG to corresponding positions; the suction nozzle assembly includes a first suction nozzle head for picking up PCBA and a second suction nozzle head for picking up AWG, wherein the second suction surface of the second suction nozzle head is parallel to and higher than the first suction surface of the first suction nozzle head. Let the thickness of the AWG be a, the height difference between the upper surface of the PD array and the upper surface of the PCBA be b, the gap between the lower surface of the front end of the AWG and the upper surface of the PD array when the AWG is being coupled be c, the height difference between the second suction surface and the first suction surface be d, and the distance from the first suction surface to the PCBA when the AWG is being coupled be f, where d = a + b + cf. According to the formula d=a+b+cf, when the first nozzle picks up the PCBA and places it on the machine, the position of the first pick-up surface relative to the PCBA is set to 0. When the second nozzle picks up the AWG for coupling, the height difference of the first pick-up surface relative to the 0 position is controlled, that is, the distance f from the first pick-up surface to the PCBA is controlled, thereby controlling the gap c from the lower surface of the AWG front end to the upper surface of the PD array.

[0020] By adopting the above technical solution, when picking up AWG coupling, it is only necessary to control the height difference between the first picking surface and the PCBA when it is placed, that is, to control the distance f from the first picking surface to the PCBA, thereby controlling the gap c from the lower surface of the AWG front end to the upper surface of the PD array. This achieves precise control over the gap between the lower surface of the AWG front end and the upper surface of the PD array, avoiding the problem of low coupling efficiency caused by the distance between the lower surface of the AWG and the upper surface of the PD array being too far, and also avoiding the problem of the lower surface of the AWG being too close to or even in contact with the upper surface of the PD array, which could damage the PD array.

[0021] Secondly, this application provides an optical module including a PCBA and an AWG, wherein a first adhesive and a second adhesive are disposed between the AWG and the PCBA, the first adhesive including at least two adhesive lines, and the second adhesive including at least one adhesive dot disposed between the at least two adhesive lines, wherein the flowability of the second adhesive is better than that of the first adhesive.

[0022] By adopting the above technical solution, a combination of adhesives with good and poor flowability is used for dispensing and coupling AWG and PCBA. The adhesive with poor flowability forms two adhesive lines, preventing the adhesive from spreading significantly to both sides, thereby reducing the probability of subsequent product failure due to excessive contact area of ​​AWG. The adhesive with good flowability forms adhesive dots in the middle of the two adhesive lines to avoid relative displacement between AWG and nozzle due to excessive adhesive viscosity.

[0023] In some embodiments, a PD array and a TIA are sequentially disposed on one side of the first adhesive and the second adhesive in a direction away from the adhesive, and both the PD array and the TIA are mounted on the PCBA; one end of the AWG is located above the PD array, and the other end of the AWG is connected to an optical fiber adapter via an optical fiber.

[0024] By adopting the above technical solution, the installation of each component of the optical receiving sub-module is realized. One end of the AWG is located above the PD array. By controlling the gap between the AWG and the PD array, the low coupling efficiency is avoided due to the distance between the lower surface of the AWG and the upper surface of the PD array being too far. It is also avoided that the lower surface of the AWG is too close to the upper surface of the PD array or even touches the upper surface of the PD array, which would damage the PD array.

[0025] In some embodiments, the viscosity of the first adhesive is greater than 100,000 cps, and the viscosity of the second adhesive is less than 10,000 cps; the first adhesive includes two parallel adhesive lines, each adhesive line being less than 0.5 mm wide, and the distance between the two adhesive lines being 1.4 mm to 2.1 mm; the second adhesive includes an adhesive dot disposed between the two adhesive lines, the diameter of the adhesive dot being 1 mm to 2 mm.

[0026] By adopting the above technical solution, the first glue has poor flowability, while the second glue has good flowability. The two glue lines with poor flowability are set in parallel, which limits the diffusion range of the glue dots to between the two parallel glue lines, thereby achieving the purpose of controlling the glue area at the bottom of the AWG. In addition, the size design of the glue lines and glue dots ensures that the amount of the first and second glues is appropriate, avoiding the problems of using too much or too little glue.

[0027] Compared with the prior art, the beneficial effects of this application include, but are not limited to, the following: 1. Two adhesive lines are formed on both sides of the adhesive dot using a less fluid adhesive, preventing the adhesive from spreading significantly to either side. By controlling the distance between these two adhesive lines, the area of ​​adhesive on the bottom of the AWG can be effectively controlled, thereby controlling the stress between the AWG and PCBA caused by temperature changes and reducing the probability of subsequent product failure due to excessive contact area of ​​the AWG. Furthermore, an adhesive dot is formed in the middle of the two adhesive lines using a more fluid adhesive. This ensures sufficient contact between the adhesive and the AWG within the allowable range without using excessive adhesive, preventing weak adhesion of the AWG and allowing the AWG to be easily pressed down to the required height. At the same time, due to the lower viscosity of the adhesive in the middle, there will be no relative displacement between the AWG and the nozzle, solving the risk of coupling failure caused by relative displacement of the AWG and nozzle due to excessive adhesive viscosity in traditional solutions.

[0028] 2. Select an adhesive with a viscosity greater than 100,000 cps as the first adhesive to make the first adhesive have poor flowability, thereby meeting the requirement of avoiding excessive diffusion of the adhesive; select an adhesive with a viscosity less than 10,000 cps as the second adhesive to make the second adhesive have good flowability, thereby avoiding the situation where the relative displacement between the AWG and the nozzle is caused by excessive adhesion. The two parallel adhesive lines with poor flowability act as barriers on both sides, better restricting the flowable adhesive dots in the middle. This limits the spread of the adhesive dots to the area between the two parallel adhesive lines, thus controlling the adhesive area at the bottom of the AWG. The width of each adhesive line is less than 0.5mm to avoid excessive application of the first adhesive with poor flowability, which could lead to excessive adhesion. The distance between the two adhesive lines is 1.4mm-2.1mm to ensure an appropriate spread area for the second adhesive with good flowability, avoiding insufficient adhesion due to an area that is too small or excessive stress on the AWG due to an area that is too large. The diameter of the adhesive dots is 1mm-2mm to ensure an appropriate amount of the second adhesive with good flowability, avoiding uncontrolled spread due to excessive application or insufficient adhesion due to insufficient application.

[0029] 3. When picking up AWG for coupling, it is only necessary to control the height difference between the first picking surface and the PCBA when it is placed, that is, to control the distance f from the first picking surface to the PCBA, and thus control the gap c from the lower surface of the AWG front end to the upper surface of the PD array. This achieves precise control over the gap between the lower surface of the AWG front end and the upper surface of the PD array, avoiding the problem of low coupling efficiency caused by the distance between the lower surface of the AWG and the upper surface of the PD array being too far, and also avoiding the problem of the lower surface of the AWG being too close to the upper surface of the PD array or even contacting the upper surface of the PD array, which could damage the PD array. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly described below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A front view of the optical receiving submodule provided in this application; Figure 2 A top view of the optical receiving submodule provided in this application; Figure 3 A flowchart of an AWG dispensing method for an optical module provided in this application; Figure 4 This is a schematic diagram of the dispensing process provided in this application; Figure 5 A schematic diagram of the height of each component provided in this application; Figure 6 A front view of the nozzle assembly provided in this application; Figure 7 A side view of the nozzle assembly provided in this application; Figure 8 A bottom view of the nozzle assembly provided in this application; Figure 9 A schematic diagram illustrating the suction nozzle assembly provided in this application when it picks up a PCBA; Figure 10 A schematic diagram of the suction nozzle assembly provided in this application when sucking up AWG.

[0032] Explanation of reference numerals in the attached figures: 1. PCBA; 2. AWG; 3. Adhesive; 4. PD array; 5. TIA; 6. Fiber optic cable; 7. Fiber optic adapter; 8. Adhesive wire; 9. Adhesive dot; 10. Nozzle assembly; 101. First nozzle head; 1011. First suction surface; 1012. First vacuum hole; 102. Second nozzle head; 1021. Second suction surface; 1022. Second vacuum hole; 1023. Groove. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0034] Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments. Example 1

[0035] like Figure 3 As shown, in order to solve the problems of subsequent product failure due to excessive contact area and coupling failure due to excessive adhesive force when bonding AWG and PCBA with glue in the prior art, Embodiment 1 of this application provides an AWG dispensing method for optical modules, including the following process: Step 100: Apply the first adhesive to the location on PCBA 1 corresponding to the AWG 2 to form at least two adhesive lines 8. The number of adhesive lines 8 can be two or more; two lines are preferred as an example. Figure 4 As shown, the first adhesive dot is formed by two parallel adhesive lines 8, which are distributed sequentially along the direction of the TIA 5 and the PD array 4. Each adhesive line 8 is less than 0.5 mm wide, and the distance between the two adhesive lines 8 is 1.4 mm to 2.1 mm. By arranging the two less fluid adhesive lines 8 in parallel, a barrier is formed on both sides, which better restricts the more fluid adhesive dot 9 in the middle, limiting the diffusion range of the adhesive dot 9 to between the two parallel adhesive lines 8. This achieves the purpose of controlling the adhesive area at the bottom of the AWG 2. The width of each adhesive line 8 is less than 0.5 mm to avoid the problem of excessive adhesive force due to excessive use of the less fluid first adhesive. The distance between the two adhesive lines 8 is 1.4 mm to 2.1 mm to ensure that the diffusion area of ​​the more fluid second adhesive is appropriate, avoiding the problem of insufficient adhesion due to an insufficient area or excessive stress on the AWG 2 due to an excessive area. In addition, before applying adhesive to AWG 2, the following steps are also taken: mounting TIA 5 and PD array 4 on the corresponding positions on PCBA1. By completing the mounting of TIA 5 and PD array 4 in advance, the specific position of AWG 2 can be adjusted by the responsiveness of PD array 4 during subsequent AWG 2 coupling, thereby completing the coupling and bonding of AWG 2 while ensuring the performance of the optical module.

[0036] Step 200: Apply a second adhesive to form at least one adhesive dot 9 between at least two adhesive lines 8; the second adhesive has better flowability than the first adhesive. The number of adhesive dots 9 can be one or more, preferably one, for example, see reference. Figure 4As shown, the second adhesive is applied as a dot 9 between the two adhesive lines 8, with a diameter of 1mm-2mm. The 1mm-2mm diameter of the dot 9 ensures an appropriate amount of the highly fluid second adhesive is used, avoiding both excessive application leading to uncontrolled diffusion and insufficient application resulting in weak adhesion. Specifically, during application, the diameter of the dot 9 is less than or equal to the distance between the two adhesive lines 8. Furthermore, a combination of a less fluid first adhesive and a more fluid second adhesive is used to fix the AWG. The less fluid first adhesive has a viscosity greater than 100,000 cps to prevent excessive diffusion, while the more fluid second adhesive has a viscosity less than 10,000 cps to prevent excessive adhesion that could cause relative displacement between the AWG 2 and the nozzle.

[0037] Step 300: Couple AWG 2 to PCBA 1 via adhesive wire 8 and adhesive dot 9. Specifically, power on PCBA 1, connect one end of the fiber optic adapter 7 connected to AWG 2 to a light source; move AWG 2 above the corresponding positions of adhesive wire 8 and adhesive dot 9, positioning one end of AWG 2 above PD array 4. Adjust the position of AWG 2 to maximize the responsivity of PD array 4, then turn on the curing lamp to cure the adhesive; place the coupled product in an oven to further cure the adhesive. Adjusting the position of AWG 2 based on the responsivity of PD array 4 optimizes the optical module performance. The dual curing process—curing the adhesive with a curing lamp and baking in an oven—results in a better adhesive curing effect.

[0038] Through the above technical solution, two adhesive lines 8 are formed on both sides of the adhesive dot 9 using adhesive with poor flowability, preventing the adhesive from spreading significantly to both sides. Furthermore, by controlling the distance between the two adhesive lines 8, the area of ​​adhesive at the bottom of the AWG 2 can be effectively controlled, thereby controlling the stress between the AWG 2 and PCBA 1 caused by temperature changes and reducing the probability of subsequent product failure due to excessive contact area of ​​the AWG 2. Further, adhesive dots 9 are formed in the middle of the two adhesive lines 8 using adhesive with good flowability. This ensures sufficient contact between the adhesive and the AWG 2 within the allowable range without using excessive adhesive, preventing weak adhesion of the AWG 2 and allowing the AWG 2 to be easily pressed down to the required height. Simultaneously, due to the lower viscosity of the adhesive in the middle, there is no relative displacement between the AWG 2 and the nozzle, solving the risk of coupling failure caused by excessive adhesive viscosity in traditional solutions.

[0039] The following example illustrates the mounting process of the components of a specific optical receiving submodule in further detail: 1. Mount TIA 5 and PD array 4 onto PCBA 1; 2. According to Figure 4 In this manner, two glue lines 8 are drawn on the corresponding position of PCBA 1 using high-viscosity UV glue. The width of glue line 8 is about 0.4mm, and the distance between the two glue lines is about 1.5mm. 3. Apply a small amount of low-viscosity UV glue between the two glue lines 8 to form a glue dot 9, with a diameter of approximately 1.5 mm. 4. Power on PCBA 1, and... Figure 1 One end of the fiber optic adapter 7 shown is connected to a light source; 5. Move one end of AWG 2 above PD array 4, adjust the position of AWG 2 so that the responsivity of PD array 4 reaches its maximum at the same time, and then turn on the ultraviolet (UV) lamp to cure the UV adhesive. 6. Place the coupled products in an oven to bake and further cure the UV adhesive. Example 2

[0040] In the coupling process between AWG 2 and PCBA 1 described in Example 1, it is typically necessary to control the height from the lower surface of the front end of AWG 2 to the upper surface of PD array 4. This is to avoid an excessively large distance between the lower surface of AWG 2 and the upper surface of PD array 4, which would result in low coupling efficiency, and also to avoid the lower surface of AWG 2 being too close to or even in contact with the upper surface of PD array 4, which could damage PD array 4. Simultaneously, it is also necessary to ensure that the lower surface of AWG 2 remains parallel to the upper surface of PCBA 1, preventing AWG 2 from tilting at an excessive angle, which could cause AWG 2 to warp and affect coupling efficiency. Traditional coupling methods primarily rely on manual vision to control the distance between the lower surface of the AWG 2 front end and the upper surface of the PD array 4, as well as the tilt of the AWG 2. This method has low control precision and can easily lead to contact between the AWG 2 and the PD array 4, causing damage to the PD array 4. Alternatively, laser height measurement can be used to measure the height of the upper surface of the PCBA 1 and the tilt of the PCBA 1 before coupling. The measured height and tilt of the PCBA 1 are then used to determine the descent height and tilt of the AWG 2. While this method can accurately control the distance between the AWG 2 and the PD array 4, as well as the tilt of the AWG 2, it is expensive and complex to operate.

[0041] Based on the above-mentioned deficiencies, in Embodiment 2 of this application, during the coupling process of AWG 2 and PCBA 1, a suction nozzle assembly 10 is used to move PCBA 1 and AWG 2 to corresponding positions; see reference. Figure 6 , Figure 7 and Figure 8As shown, the suction nozzle assembly 10 includes a first suction nozzle head 101 for suctioning PCBA 1 and a second suction nozzle head 102 for suctioning AWG 2. The second suction surface 1021 of the second suction nozzle head 102 is parallel to and higher than the first suction surface 1011 of the first suction nozzle head 101. The two nozzles are integrated on one suction nozzle assembly 10, so that the first suction surface 1011 and the second suction surface 1021 have a fixed difference. In order to prevent the nozzle from interfering with the product during suction and coupling, there is a height difference between the lower end surface of the first suction nozzle head 101 and the lower end surface of the second suction nozzle head 102, and this height difference is at least greater than the height of TIA 5 and PD array 4 on PCBA 1. In order to make AWG 2 and PCBA 1 parallel, the first suction surface 1011 of the first suction nozzle head 101 and the second suction surface 1021 of the second suction nozzle head 102 are parallel. When suctioning PCBA 1, the first suction surface 1011 is in contact with the surface of PCBA 1, and when suctioning AWG 2, the second suction surface 1021 is parallel to the surface of AWG 2. 2. Surface contact, thus keeping AWG 2 and PCBA 1 parallel. The bottom of the first suction head 101 has a first vacuum hole 1012, and the area around the opening of the first vacuum hole 1012 is the first suction surface 1011; the bottom of the second suction head 102 has a groove 1023, and the top surface of the groove 1023 has a second vacuum hole 1022, and the area around the second vacuum hole 1022 is the second suction surface 1021. The first vacuum hole 1012 and the second vacuum hole 1022 are controlled separately; the width of the groove 1023 matches the width of AWG 2. After the second suction head 102 picks up AWG 2, the groove 1023 can restrict the rotation of AWG 2 in the horizontal direction, thereby preventing AWG 2 from rotating during coupling.

[0042] Based on the structural configuration of the above-mentioned nozzle assembly 10 and the structural configuration of the optical receiving sub-module, refer to Figure 5 and Figure 6 As shown, the thickness of AWG 2 is set to 'a', the height difference between the upper surface of PD array 4 and the upper surface of PCBA 1 is 'b', the gap between the lower surface of the front end of AWG 2 and the upper surface of PD array 4 when AWG 2 is coupled is 'c', the height difference between the second suction surface 1021 and the first suction surface 1011 is 'd', and the distance from the first suction surface 1011 to PCBA 1 when AWG 2 is coupled is 'f', where 'd' = a + b + 'cf'. (Reference) Figure 9 and Figure 10As shown, when PCBA 1 is picked up, the first vacuum hole 1012 corresponding to the first suction head 101 is open, and the second vacuum hole 1022 corresponding to the second suction head 102 is closed; when AWG 2 is picked up, the second vacuum hole 1022 corresponding to the second suction head 102 is open, and the first vacuum hole 1012 corresponding to the first suction head 101 is closed. To prevent AWG 2 from rotating during coupling, a groove 1023 is provided on the second suction head 102 to restrict the AWG 2 from rotating in the horizontal direction.

[0043] Furthermore, under the above settings, according to the formula d=a+b+cf, when the first suction head 101 picks up PCBA 1 and places it on the machine, the position of the first suction surface 1011 relative to PCBA 1 is set to position 0. When the second suction head 102 picks up AWG 2 for coupling, the height difference of the first suction surface 1011 relative to position 0 is controlled, that is, the distance f from the first suction surface 1011 to PCBA 1 is controlled, thereby controlling the gap c from the lower surface of the front end of AWG 2 to the upper surface of PD array 4. Specifically, when picking up PCBA 1 and placing it on the machine and picking up AWG 2 for coupling, the above-mentioned values ​​of a, b, and d are fixed, so only the value of f needs to be controlled to control the value of c. f is the distance from the first suction surface 1011 of the first suction head 101 to the upper surface of the PCBA 1 when the second suction head 102 picks up the AWG 2 for coupling. When the first suction head 101 picks up the PCBA 1 and places it on the machine, the first suction surface 1011 of the first suction head 101 is in contact with the upper surface of the PCBA 1, that is, the distance is zero. Therefore, if the position of the first suction surface 1011 in the vertical direction is set to 0 when the first suction head 101 picks up the PCBA 1 and places it on the machine, then it is only necessary to control the position of the first suction surface 1011 in the vertical direction to f when the second suction head 102 picks up the AWG 2 for coupling, so as to ensure the distance c from the lower surface of the front end of the AWG 2 to the upper surface of the PD array 4.

[0044] Through the above technical solution, when coupling the AWG 2, it is only necessary to control the height difference between the first suction surface 1011 and the PCBA 1 when it is placed, that is, to control the distance f between the first suction surface 1011 and the PCBA 1, thereby controlling the gap c between the lower surface of the front end of the AWG 2 and the upper surface of the PD array 4. This achieves precise control of the gap c between the lower surface of the front end of the AWG 2 and the upper surface of the PD array 4, avoiding the problem of low coupling efficiency caused by the distance between the lower surface of the AWG 2 and the upper surface of the PD array 4 being too far, and also avoiding the problem of the lower surface of the AWG 2 being too close to or even contacting the upper surface of the PD array 4, which could damage the PD array 4. Furthermore, since the first suction surface 1011 of the first nozzle head 101 and the second suction surface 1021 of the second nozzle head 102 are parallel, the upper surface of the PCBA 1 is also parallel to the upper surface of the AWG 2 during coupling. Therefore, this application can automatically ensure that the upper surface of the AWG 2 is parallel to the upper surface of the PCBA 1.

[0045] The following example, illustrating the adsorption coupling process between AWG 2 and PCBA 1 using a specific nozzle assembly, further illustrates the solution of Embodiment 2 of this application: 1. Align the first suction nozzle 101 with PCBA 1, and simultaneously open the first vacuum hole 1012 of the first suction nozzle 101 to suck up PCBA 1; 2. Place PCBA 1 on the machine base, then lock PCBA 1 on the machine base, and remember the position of the nozzle assembly 10 in the vertical direction (perpendicular to the upper surface of PCBA 1). Let the vertical position of the nozzle assembly 10 at this time be Z0. 3. Close the first vacuum port 1012 of the first suction nozzle head 101; 4. Power on PCBA 1; 5. Align the second suction nozzle 102 with the AWG 2, and simultaneously open the second vacuum port 1022 of the second suction nozzle 102 to suck up the AWG 2; 6. Move AWG 2 above PD array 4 and connect the fiber optic adapter 7 connected to AWG 2 to the light source. At the same time, move the nozzle assembly 10 to the Z0+f position in the vertical direction. 7. Adjust the position of the nozzle assembly 10 in two directions in the horizontal plane (parallel to the upper surface of PCBA 1) to maximize the responsivity coupled to the PD array 4; 8. Lift AWG 2 and apply UV glue below AWG 2; This step of applying glue adopts the glue application method in Example 1, that is, use the first glue with poor flowability to apply two glue lines 8, and use the second glue with good flowability to apply a glue dot 9 between the two glue lines 8. 9. Return AWG 2 to the position where the PD array 4 has the highest responsivity obtained in step 7, and adjust the position of the nozzle assembly 10 in the horizontal plane (parallel to the upper surface of PCBA 1) in two directions to maximize the responsivity coupled to the PD array 4. 10. Turn on the UV lamp to cure the UV adhesive; 11. Close the second vacuum port 1022 of the second suction head 102, lift the suction assembly 10 and disconnect the fiber optic adapter 7 from the light source; 12. Remove the coupled product from the machine and continue coupling the next product; 13. After all products are coupled, place them in an oven to further cure the adhesive. Example 3

[0046] Based on the AWG 2 dispensing method for the optical module provided in Embodiment 1, Embodiment 3 provides an optical module, which is an optical receiving sub-module, including PCBA 1 and AWG 2. A first adhesive and a second adhesive are disposed between AWG 2 and PCBA 1. The first adhesive includes at least two adhesive lines 8, and the second adhesive includes at least one adhesive dot 9 disposed between the at least two adhesive lines 8. The second adhesive has better flowability than the first adhesive. Preferably, two adhesive lines 8 and one adhesive dot 9 are provided. Through the above technical solution, a combination of adhesives with good flowability and adhesives with poor flowability is used for dispensing and coupling AWG 2 and PCBA 1. The use of adhesives with poor flowability to form two adhesive lines 8 prevents significant diffusion of the adhesive to both sides, thereby reducing the probability of subsequent product failure due to excessive contact area of ​​AWG 2. The use of adhesives with good flowability to form adhesive dots 9 between the two adhesive lines 8 avoids relative displacement between AWG 2 and the nozzle due to excessive adhesive viscosity.

[0047] In some embodiments, a PD array 4 and a TIA 5 are sequentially disposed on one side of the first and second adhesives, away from the adhesives, and both the PD array 4 and TIA 5 are mounted on the PCBA 1. One end of the AWG 2 is located above the PD array 4, and the other end of the AWG 2 is connected to an optical fiber adapter 7 via an optical fiber 6. This technical solution enables the installation of the components of the optical receiving submodule. With one end of the AWG 2 above the PD array 4, the gap between the AWG 2 and the PD array 4 is controlled to prevent excessive distance between the lower surface of the AWG 2 and the upper surface of the PD array 4, thus avoiding low coupling efficiency, and also preventing the lower surface of the AWG 2 from being too close to or even contacting the upper surface of the PD array 4, which could damage the PD array 4.

[0048] In some embodiments, the viscosity of the first adhesive is greater than 100,000 cps, and the viscosity of the second adhesive is less than 10,000 cps. The first adhesive includes two parallel adhesive lines 8, each less than 0.5 mm wide, with a distance of 1.4 mm to 2.1 mm between them. The second adhesive includes an adhesive dot 9 disposed between the two adhesive lines 8, with a diameter of 1 mm to 2 mm. This technical solution achieves a poor flowability of the first adhesive and a good flowability of the second adhesive. The parallel arrangement of the two less flowable adhesive lines 8 limits the diffusion range of the adhesive dot 9 to the area between the two parallel adhesive lines 8, thus controlling the adhesive area at the bottom of the AWG2. Furthermore, the size design of the adhesive lines 8 and the adhesive dot 9 ensures appropriate amounts of both the first and second adhesives, avoiding problems caused by excessive or insufficient adhesive usage.

[0049] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An AWG dispensing method for an optical module, characterized in that, include: Apply the first glue to the corresponding AWG position on the PCBA to form at least two glue lines; At least one glue dot is formed between at least two glue lines using a second glue; the second glue has better flowability than the first glue. AWGs are coupled to the PCBA via adhesive lines and adhesive dots.

2. The AWG dispensing method for an optical module according to claim 1, characterized in that, The viscosity of the first adhesive is greater than 100,000 cps, and the viscosity of the second adhesive is less than 10,000 cps.

3. The AWG dispensing method for an optical module according to claim 1, characterized in that, The first glue dot is formed into two parallel glue lines, each glue line being less than 0.5mm wide, and the distance between the two glue lines being 1.4mm-2.1mm.

4. The AWG dispensing method for an optical module according to claim 3, characterized in that, The second adhesive is applied as a dot between the two adhesive lines, and the diameter of the dot is 1mm-2mm.

5. The AWG dispensing method for an optical module according to claim 1, characterized in that, Before applying AWG adhesive, the process also includes mounting the TIA and PD array on the corresponding positions on the PCBA.

6. The AWG dispensing method for an optical module according to claim 5, characterized in that, The process of coupling AWG onto PCBA via adhesive lines and adhesive dots specifically includes: Power on the PCBA and connect one end of the fiber optic adapter that connects to the AWG to the light source; Move the AWG above the corresponding glue line and glue dot, and position one end of the AWG above the PD array. Adjust the position of the AWG to maximize the responsiveness of the PD array, and then turn on the curing lamp to cure the glue. The coupled products are placed in an oven to bake, further curing the adhesive.

7. The AWG dispensing method for an optical module according to claim 6, characterized in that, During the coupling of AWG and PCBA, a suction nozzle assembly is used to move PCBA and AWG to the corresponding positions; the suction nozzle assembly includes a first suction nozzle head for picking up PCBA and a second suction nozzle head for picking up AWG, wherein the second suction surface of the second suction nozzle head is parallel to and higher than the first suction surface of the first suction nozzle head. Let the thickness of the AWG be a, the height difference between the upper surface of the PD array and the upper surface of the PCBA be b, the gap between the lower surface of the front end of the AWG and the upper surface of the PD array when the AWG is being coupled be c, the height difference between the second suction surface and the first suction surface be d, and the distance from the first suction surface to the PCBA when the AWG is being coupled be f, where d = a + b + cf. According to the formula d=a+b+cf, when the first nozzle picks up the PCBA and places it on the machine, the position of the first pick-up surface relative to the PCBA is set to 0. When the second nozzle picks up the AWG for coupling, the height difference of the first pick-up surface relative to the 0 position is controlled, that is, the distance f from the first pick-up surface to the PCBA is controlled, thereby controlling the gap c from the lower surface of the AWG front end to the upper surface of the PD array.

8. An optical module, characterized in that, The device includes a PCBA and an AWG, with a first adhesive and a second adhesive disposed between the AWG and the PCBA. The first adhesive includes at least two adhesive lines, and the second adhesive includes at least one adhesive dot disposed between the at least two adhesive lines. The second adhesive has better flowability than the first adhesive.

9. The optical module according to claim 8, characterized in that, A PD array and a TIA are sequentially arranged on one side of the first and second adhesives in a direction away from the adhesives, and both the PD array and the TIA are mounted on the PCBA; one end of the AWG is located above the PD array, and the other end of the AWG is connected to an optical fiber adapter via an optical fiber.

10. The optical module according to claim 8, characterized in that, The first adhesive has a viscosity greater than 100,000 cps, and the second adhesive has a viscosity less than 10,000 cps; the first adhesive includes two parallel adhesive lines, each with a width of less than 0.5 mm, and the distance between the two adhesive lines is 1.4 mm to 2.1 mm; the second adhesive includes an adhesive dot disposed between the two adhesive lines, and the diameter of the adhesive dot is 1 mm to 2 mm.

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