Welding solder paste combination structure of radiator and process thereof

Abstract

The invention discloses a welding solder paste combination structure of a radiator and a process thereof, the welding solder paste combination structure comprises a plurality of single fins, the plurality of single fins are arranged in an array and are mutually buckled to form a radiating fin group, each single fin is provided with a tin bar penetration hole, a gap is arranged between the tin bar penetration holes of two adjacent single fins, and the single fins are arranged in the gap. The gap is used for allowing the molten tin bar to pass through and flow to the surface of the heat pipe, so that the heat pipe and the heat dissipation fins are installed, welded and fixed; heat pipe mounting holes are formed in the heat dissipation fin set, heat pipes penetrate through the heat pipe mounting holes, and a gap is formed between every two adjacent heat pipe mounting holes. The invention has the technical effects and advantages that: the design of a tin dispensing groove on a heat pipe mounting hole is cancelled, and a tin rod penetrating hole is adopted, so that an FIN conduction surface in contact with the heat pipe is a whole round surface, the heat absorption surface is reduced, and the heat transfer performance is improved by about 16%; and tin bars are uniform, are directly cut into required lengths, and are directly put into the tin bars through the FIN round holes.

Description

Technical Field

[0001] This invention relates to the field of radiator manufacturing, and more specifically to a solder paste bonding structure and process for a radiator. Background Technology

[0002] Heat sink fins are thin metal sheets in a heat sink used to transfer heat to the air. In conventional heat dissipation processes that combine heat pipes and fins, solder grooves need to be opened on the heat pipe slots. Because the heat pipes and fins need to be inserted and joined, the conventional process involves liquid solder paste being inserted, requiring a long needle to apply the liquid solder paste from one end to the other.

[0003] shortcoming:

[0004] 1. A hole in the heat pipe groove (i.e., a hole forming a solder paste groove) reduces the fin's conductive surface by at least 1 / 6 of a circle, resulting in a 16% reduction in the heat absorption area;

[0005] 2. Employees used long needles to apply solder paste, which made it impossible to accurately control the amount of solder paste, resulting in insufficient solder paste and performance degradation.

[0006] 3. Employees use long needles to apply solder paste, which makes it impossible to accurately control the amount of solder paste. This results in excessive solder paste in some areas, causing it to flow down excessively, increasing air resistance, degrading performance, and failing to meet customer requirements in terms of appearance.

[0007] 4. This process cannot be used to produce exterior parts;

[0008] 5. This method has low production capacity and requires multiple operators. Summary of the Invention

[0009] In order to overcome the above-mentioned defects of the prior art, the present invention provides a solder paste bonding structure and process for a heat sink.

[0010] The technical solution of this invention is as follows:

[0011] This invention provides a solder paste bonding structure for a heat sink, comprising multiple single fins arranged in an array and interlocked to form a heat sink fin assembly. Each single fin has a hole for inserting a solder rod, and there is a gap between the solder rod insertion holes of two adjacent single fins. The gap allows the molten solder rod to pass through and flow onto the surface of a heat pipe, thereby soldering and fixing the heat pipe and the heat sink fin assembly. The heat sink fin assembly has heat pipe mounting holes for inserting a heat pipe, and there is a gap between two adjacent heat pipe mounting holes.

[0012] The heat pipe mounting hole is located directly below the solder rod insertion hole.

[0013] The number of heat pipe mounting holes is the same as the number of solder rod insertion holes.

[0014] The single fin is machined with protruding solder rod insertion hole walls and heat pipe mounting hole walls, so that the heat pipe mounting hole is separated from the solder rod insertion hole.

[0015] The solder bar can be directly cut to the required length and placed at a designated position in the solder bar insertion hole, thereby precisely controlling the solder paste / soldering area.

[0016] Another aspect of the present invention provides a solder paste bonding process for a heat sink, comprising the following steps:

[0017] S1. Make heat pipe mounting holes and solder rod insertion holes on the single fins respectively;

[0018] S2. Arrange the single fin array and interlock them to form a heat dissipation fin group;

[0019] S3. Insert the heat pipe into the heat pipe mounting hole and insert the solder rod into the solder rod insertion hole;

[0020] S4. The overall heating melts the solder rod and flows onto the surface of the heat pipe;

[0021] S5. It will be completed after cooling.

[0022] Furthermore, the heat pipe mounting holes and solder rod insertion holes are formed together during the fabrication of the single fin.

[0023] Furthermore, the heating process is as follows: preheating at 100 degrees Celsius for 90 seconds, heating at 125 degrees Celsius for 90-150 seconds, heating at 160-180 degrees Celsius for 60 seconds, and then cooling naturally.

[0024] The technical effects and advantages of this invention are as follows:

[0025] 1. The solder groove design on the heat pipe mounting hole has been eliminated, and a solder rod is inserted into the hole, making the fin conductive surface in contact with the heat pipe a complete circle. The heat absorption surface is reduced by 0, and the heat transfer performance is improved by about 16%.

[0026] 2. The solder rod is uniform; cut it to the required length and insert it directly through the fin hole.

[0027] 3. This process allows for precise control of the solder paste / soldering area, making it suitable for exterior parts;

[0028] 4. This method increases production capacity by 500% compared to the traditional method, and only requires one person. Attached Figure Description

[0029] Figure 1 and Figure 2 These are schematic diagrams of the structure of the present invention from different perspectives.

[0030] Figure 3 This is a planar structural diagram of the present invention;

[0031] Figure 4 for Figure 3 Enlarged view inside the middle circle;

[0032] Figure 5 This is a heating curve graph;

[0033] Figure 6 This is a comparison diagram between the present invention and existing processes. Detailed Implementation

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1

[0036] like Figures 1-4 The solder paste bonding structure of a heat sink shown includes multiple single fins 1, which are arranged in an array and interlocked to form a heat sink fin assembly. Each single fin has a hole 11 for inserting a solder rod. There is a gap a between the solder rod insertion holes of two adjacent single fins. The gap allows the solder rod to pass through after melting and flow to the surface of the heat pipe, thereby soldering and fixing the heat pipe and the heat sink fin assembly. The heat sink fin assembly has a heat pipe mounting hole 12 for inserting the heat pipe. There is a gap b between two adjacent heat pipe mounting holes.

[0037] Furthermore, the heat pipe mounting hole is located directly below the solder rod insertion hole.

[0038] Furthermore, the number of heat pipe mounting holes is the same as the number of solder rod insertion holes.

[0039] Furthermore, the single fin is machined with protruding solder rod insertion hole wall 11a and heat pipe mounting hole wall 12a, thus separating the heat pipe mounting hole from the solder rod insertion hole. For aesthetic purposes, the leftmost single fin does not have protruding solder rod insertion hole wall and heat pipe mounting hole wall machined.

[0040] Furthermore, the solder bar can be directly cut to the required length, and the solder bar can be placed at a designated position in the solder bar insertion hole, thereby precisely controlling the solder paste / soldering area.

[0041] Example 2

[0042] Another aspect of the present invention provides a solder paste bonding process for a heat sink, comprising the following steps:

[0043] S1. Make heat pipe mounting holes and solder rod insertion holes on the single fins respectively;

[0044] S2. Arrange the single fin array and interlock them to form a heat dissipation fin group;

[0045] S3. Insert the heat pipe into the heat pipe mounting hole and insert the solder rod into the solder rod insertion hole;

[0046] S4. The overall heating melts the solder rod and flows onto the surface of the heat pipe;

[0047] S5. It will be completed after cooling.

[0048] Furthermore, the heat pipe mounting holes and solder rod insertion holes are formed together during the fabrication of the single fin.

[0049] Furthermore, such as Figure 5 As shown, the heating process is as follows: preheating at 100 degrees Celsius for 90 seconds, heating at 125 degrees Celsius for 90-150 seconds, heating at 160-180 degrees Celsius for 60 seconds, and then cooling naturally.

[0050] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solder paste bonding structure for a heat sink, characterized in that: The device comprises multiple single fins arranged in an array and interlocked to form a heat dissipation fin assembly. Each single fin has a hole for inserting a solder rod. There is a gap between the solder rod insertion holes of two adjacent single fins. The gap allows the molten solder rod to pass through and flow onto the surface of the heat pipe, thereby welding and fixing the heat pipe and the heat dissipation fin assembly together. The heat dissipation fin assembly has heat pipe mounting holes for inserting the heat pipe. There is a gap between two adjacent heat pipe mounting holes.

2. The solder paste bonding structure of a heat sink according to claim 1, characterized in that: The heat pipe mounting hole is located directly below the solder rod insertion hole.

3. The solder paste bonding structure of a heat sink according to claim 1, characterized in that: The number of heat pipe mounting holes is the same as the number of solder rod insertion holes.

4. The solder paste bonding structure of a heat sink according to claim 1, characterized in that: The single fin is machined with protruding solder rod insertion hole walls and heat pipe mounting hole walls, so that the heat pipe mounting hole is separated from the solder rod insertion hole.

5. The solder paste bonding structure of a heat sink according to claim 1, characterized in that: The solder bar can be directly cut to the required length and placed at the designated position of the solder bar insertion hole, thereby precisely controlling the solder paste / soldering area.

6. A solder paste bonding process for a heat sink, characterized in that: Includes the following steps: S1. Make heat pipe mounting holes and solder rod insertion holes on the single fins respectively; S2. Arrange the single fin array and interlock them to form a heat dissipation fin group; S3. Insert the heat pipe into the heat pipe mounting hole and insert the solder rod into the solder rod insertion hole; S4. The overall heating melts the solder rod and flows onto the surface of the heat pipe; S5. It will be completed after cooling.

7. The solder paste bonding process for a heat sink according to claim 6, characterized in that: The heat pipe mounting holes and solder rod insertion holes are formed together during the fabrication of the single fin.

8. The solder paste bonding process for a heat sink according to claim 6, characterized in that: The heating process is as follows: preheating at 100 degrees Celsius for 90 seconds, heating at 125 degrees Celsius for 90-150 seconds, heating at 160-180 degrees Celsius for 60 seconds, and then cooling naturally.

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