Condensation cleaning system

Abstract

The invention discloses a condensation cleaning system which comprises at least one condensation cleaning module, and each condensation cleaning module comprises a condensation module and a cleaning module which correspond to each other. In the condensation module, the polarity of current flowing through a semiconductor refrigeration and heating Peltier patch is changed through a full-bridge converter or a relay to change the refrigeration and heating states of the semiconductor refrigeration and heating Peltier patch, so that the purposes of condensing impurities attached to gas, increasing the temperature and reducing the adhesive force of the impurities on the surface of the condensation module are achieved as required; an ultrasonic transducer is applied in the cleaning module to assist in cleaning impurities attached to the surface of the condensation module, the cleaning purpose is achieved, and meanwhile a half-bridge conversion circuit or a full-bridge conversion circuit is applied in the module to output a high-frequency power excitation source meeting the requirement of the ultrasonic transducer. When the condensation cleaning system is applied to the smoke exhaust pipeline, the quality of gas exhausted out of the pipeline can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of oil fume mixed gas treatment equipment, specifically a condensation cleaning system. Background Technology

[0002] Smoke containing oily particles and other impurities, such as oil-fume mixtures, is generally discharged directly through flues. Traditional venues, public catering establishments, and luxury hotels often use exhaust systems to extract the oil-fume mixtures generated during cooking and vent them outdoors. These cooking fumes contain various harmful substances, primarily volatile organic compounds (VOCs), including alkanes and alkenes, among which formaldehyde, benzene, and polycyclic aromatic hydrocarbons are potent carcinogens. Fine particulate matter accounts for 76% of kitchen particulate matter, mainly from the cracking and combustion products of oils; long-term inhalation can cause respiratory diseases. Trans fatty acids, such as 9t-C18:1, formed by the oxidative isomerization of unsaturated fatty acids at high temperatures, increase the risk of cardiovascular disease. Directly releasing these oil-fume mixtures into the air fails to meet the emission standards of the relevant regions, causing environmental pollution. Summary of the Invention

[0003] The purpose of this invention is to provide a condensation cleaning system to solve one or more of the problems mentioned in the background art.

[0004] To achieve the above objectives, This invention discloses a condensation cleaning system, which includes at least one condensation cleaning module, each of which includes a condensation module and a cleaning module arranged correspondingly to each other. The condensation module is used to condense and separate oil molecules in the oil fume mixture, that is, to condense impurities mixed in the gas by lowering the temperature. The cleaning module is used to clean impurities adhering to the surface of the condensation module, and an ultrasonic transducer is used in the cleaning module.

[0005] In some embodiments, the condensation cleaning system includes a control module, which includes a processor unit, a power supply unit, and a conversion unit. The conversion unit is connected to the power supply unit through the processor unit. The conversion unit is configured to correspond to the ultrasonic transducer. The conversion unit uses a half-bridge conversion circuit or a full-bridge conversion circuit to output a high-frequency power excitation source that meets the requirements of the ultrasonic transducer.

[0006] In some embodiments, the half-bridge converter circuit includes an auxiliary converter circuit, a modulation converter circuit, and a high-power converter circuit connected in series. The auxiliary conversion circuit includes a monolithic AC / DC conversion chip, resistors, optocouplers, diodes, a high-frequency isolation transformer, filters, and a common-mode inductor, which assist in providing power to the chips involved in the half-bridge conversion circuit; The modulation and conversion circuit includes a dual-channel PWM modulation chip, a dual-channel floating gate output power device driver chip, resistors, capacitors, and diodes. The PWM modulation chip outputs two complementary PWM waves with dead-time control, which are used as input signals to the dual-channel floating gate output power device driver chip, thus completing the two floating gate drive PWM signals required by the half-bridge converter. The high-power conversion circuit includes filters and common-mode inductors, fuses, lightning protection varistors, rectifier bridges, and power MOSFETs. The high-power conversion circuit is used to output a high-frequency power excitation source under the drive of two floating gate drive PWM signals. In the half-bridge conversion circuit, the load is directly applied to the midpoint between the connection point of the two power MOSFETs and the voltage divider filter network after rectification, so as to achieve floating output.

[0007] In some implementations... The temperature of the condenser module is adjustable; the temperature of the condenser module can be increased to reduce the adhesion of impurities on the surface of the condenser module. The condensation module includes a working plate and a semiconductor cooling and heating Pellets, with one end face of the semiconductor cooling and heating Pellets attached to the working plate; the control module includes a converter, which is connected between the power supply unit and the processor unit, and the processor unit is connected to the converter; the converter, converter unit, and power supply unit are all configured correspondingly to the condensation cleaning module; The converter is a full-bridge converter or a relay. The converter is configured to correspond to the semiconductor cooling and heating Pellets. By changing the polarity of the current flowing through the corresponding semiconductor cooling and heating Pellets, the working state of the semiconductor cooling and heating Pellets attached to the working board is changed. The working state of the semiconductor cooling and heating Pellets includes cooling state and heating state.

[0008] In some implementations... The full-bridge converter includes power MOSFETs, resistors, and sockets; The condensation module also includes a cooling component, which is disposed on the other end face of the semiconductor cooling and heating Pel patch.

[0009] In some implementations... The cleaning module also includes a cleaning component and a transmission component. The transmission component includes a driver and a mechanical transmission mechanism. The driver controls the operation of the ultrasonic transducer and the cleaning component through the mechanical transmission mechanism to achieve scanning cleaning on the condensation module. The control module is also equipped with a drive unit connected to the processor, which is used to control the operating status of the driver.

[0010] In some embodiments, the working plate is rectangular, and the transmission assembly controls the ultrasonic transducer and the cleaning assembly to move up and down or left and right; the cleaning module includes at least one set of ultrasonic transducers, and one set of ultrasonic transducers includes multiple ultrasonic transducers. The ultrasonic transducers in the same set are equidistantly arranged along a direction perpendicular to the direction of movement of the ultrasonic transducers, and the ultrasonic transducers on the same cleaning module are connected to one or more conversion units.

[0011] In some implementations... The condensation cleaning system also includes a triggering unit, which is connected to the processor unit. The triggering unit is an oil fume concentration sensor. The control module is also equipped with a communication unit.

[0012] In some implementations, the condensation cleaning system employs a multi-level control structure, which includes: The condensation cleaning module includes multiple condensation cleaning modules, and one of the condensation cleaning modules includes one or more sets of semiconductor cooling and heating Pellets. and / or The condensation cleaning module includes a condensation cleaning module, which includes multiple sets of semiconductor cooling and heating PAL patches. Each group of semiconductor cooling and heating Pellets includes at least one semiconductor cooling and heating Pellet, and each group of semiconductor cooling and heating Pellets corresponds to one converter. The number of power supplies in the power supply unit corresponds to the number of converters.

[0013] In some implementations, the processor unit includes a microprocessor, an integrated temperature measurement chip, capacitors, resistors, diodes, a crystal oscillator, and switches. The integrated temperature measurement chip is used to monitor the temperature of one end face of a semiconductor cooling / heating Peltier patch.

[0014] Compared with the prior art, the beneficial effects of the present invention are: It can filter impurities in the gas by lowering the temperature and condensing the impurities, or it can reduce the adhesion of impurities on the surface of the condensation module by raising the temperature, which is beneficial to improving the cleaning speed and cleaning effect of the cleaning module on the condensation module. The condensation module can automatically adjust the temperature of the working plate surface. When oil molecules need to be condensed and separated, the end face of the semiconductor Peltier cooler connected to the working plate can be adjusted to a cooling state to reduce the temperature of the working plate. This effectively condenses impurities in the gas (such as oil molecules in the oil fume mixture) onto the working plate through temperature difference, thus achieving gas filtration. In cleaning mode, the polarity of the current flowing through the semiconductor Peltier cooler is changed by a converter, switching the end face of the semiconductor Peltier cooler connected to the working plate to a heating state. This facilitates the separation of impurities (such as oil stains) condensed on the working plate surface from the working plate. The cleaning components are used to perform scanning cleaning on the surface of the workpiece. The use of an ultrasonic transducer to assist in cleaning can further enhance the cleaning effect, thus cleaning the workpiece. In addition, the above-mentioned conversion unit can help provide a high-frequency power excitation source for the ultrasonic transducer. When the above-mentioned condensation cleaning system is installed in the flue, the oil molecules in the oil fume mixture can be condensed and separated, and the corresponding area can be cleaned to ensure the cleanliness of the corresponding area and condensation module in the flue. Attached Figure Description

[0015] Figure 1 This is a control block diagram of the condensation cleaning system in some embodiments of the present invention; Figure 2 This is a circuit diagram of the auxiliary conversion circuit in some embodiments of the present invention; Figure 3 This is a circuit diagram of the modulation conversion circuit in some embodiments of the present invention; Figure 4 This is a circuit schematic diagram of a high-power conversion circuit in some embodiments of the present invention; Figure 5 This is a schematic diagram of the power supply circuit for a full-bridge converter in some embodiments of the present invention; Figure 6 This is a circuit schematic diagram of the full-bridge converter A in some embodiments of the present invention; Figure 7 This is a circuit schematic diagram of the full-bridge converter B in some embodiments of the present invention; Figure 8 This is a circuit diagram of the driving circuit in some embodiments of the present invention; Figure 9 The circuit schematics of the processor unit and the communication unit are shown in some embodiments of the present invention. Figure 10 This is a front view of a condensation cleaning system in some embodiments of the present invention; Figure 11 This is a side view of a condensation cleaning system according to some embodiments of the present invention. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] The principles and methods of this invention will be described in detail below with reference to embodiments, taking multiple large stoves using electric heat sources as an example. Parentheses (XY) are defined as follows: X - reference numeral, Y - unit number within the reference numeral. Figure 10 and Figure 11 The corresponding figure label is uniformly 10.

[0018] Please see Figure 1 The figure shows a preferred embodiment of the present invention, taking a condensation cleaning system for separating oil molecules in a mixture of oily fumes as an example. The condensation cleaning system includes a processor unit (1-1), a power supply unit (1-2), a converter (1-3), a conversion unit (1-4), a communication unit (1-5), a high-power cleaning ultrasonic array, a semiconductor cooling and heating Peltier patch, a drive unit (1-6), a driver and mechanical transmission mechanism, and a trigger unit (1-7). The processor unit (1-1) can be a microprocessor unit; the converter (1-3) can be a two-way full-bridge converter, including full-bridge converter A and full-bridge converter B; the conversion unit (1-4) can be a 28kHz high-frequency half-bridge power conversion unit corresponding to a 28kHz ultrasonic converter; the communication unit (1-5) can be an RS485 bidirectional information interaction unit; the high-power cleaning ultrasonic array can be a 28kHz ultrasonic converter; the driver can be a stepper motor; and the trigger unit (1-7) can be an electrochemical oil fume concentration sensor. Since the high-power cleaning ultrasonic transducer array, semiconductor cooling and heating Pellets, and electrochemical oil fume concentration sensor are all commercially available finished products, their principles will not be described in detail except for their connection relationship with this unit.

[0019] The task of the condensation cleaning system is to separate oil molecules from the oil-fume mixture generated during stove operation. To ensure effective oil-gas separation, a condensation surface made of grade III mirror-finished stainless steel is used as the working plate to condense oil molecules in the oil-fume mixture. After the stove is no longer in use, the mirror-finished stainless steel condensation surface and its surrounding components are automatically cleaned. Utilizing the characteristic of semiconductor cooling and heating Pellets that can both cool and heat, the system cools and separates oil molecules during stove operation; during cleaning, it switches to heating to enhance the cleaning effect. A 28kHz ultrasonic transducer is used for optimal cleaning performance. In this embodiment, the mirror-finished stainless steel forms a 50... 2 An array of five 60-watt ultrasonic cleaning transducers is evenly mounted on a horizontal support approximately 1.5 cm away from the condensation surface. During cleaning, the support with the five ultrasonic transducers scans horizontally up and down along the condensation surface, constrained by a stepper motor and its related transmission mechanism. By controlling the distance between the ultrasonic cleaning array and the condensation plate being cleaned to within 1 cm, the influence of air molecule absorption on the ultrasonic energy is negligible, achieving excellent cavitation even without water. Furthermore, due to the elastic mechanical wave properties of multiple high-power ultrasonic cleaning transducers, a dense reflection field is inevitably formed in the surrounding space, incidentally cleaning nearby objects.

[0020] Combination Figure 9 As shown in the diagram, the processor unit (1-1) of the condensation cleaning system may include a microprocessor IC11 (STM32F405), an integrated temperature measurement chip IC14 (DS18B20), and its peripheral passive components. The peripheral passive components include: capacitors C31, C32, C33, C34, C35, C36, and C37; resistors R38, R39, R40, and R43; crystal oscillators JZ1 (8MHz) and JZ2 (32.768kHz); a micro push-button switch KG2; a power strip CT5; and indicator lights LEDs and LED2. The micro push-button switch KG2 provides a reset function; the power strip CT5 provides a program download interface. The integrated temperature measurement chip IC14 (DS18B20) and its peripheral passive components are used to monitor the temperature of a specific end face of a semiconductor Peltier patch. Diodes, current-limiting resistors, supercapacitors, etc. can be added to form a backup power supply, which can support the microprocessor IC11 for 100 hours of backup power supply in the event of power failure (when other external operations are turned off).

[0021] Combination Figures 5 to 8The structure shown includes a power supply unit (1-2) that may include two Mean Well switching power supplies, POW1 and POW2 (LRS350-12), and a Mean Well switching power supply, POW3 (RSP-100-24), along with capacitors C15, C16, and C17. These three switching power supplies provide +12A 29 amps, +12B 29 amps, and +24 4 amps DC regulated power supplies, respectively; the +12A 29 amps power supply for full-bridge converter A, the +12B 29 amps power supply for full-bridge converter B, and the +24 4 amps power supply for drive unit (1-6) DRV1 (DM860H). Full-bridge converter A (1-3) may include... Figure 6 The power MOSFETs BG1, BG2, BG3, and BG4, and resistors R25, R26, R27, and R28, and socket CT3 are shown. The full-bridge converter B (1-3) may include, as follows: Figure 7 The power MOSFETs BG5, BG6, BG7, and BG8, along with resistors R29, R30, R31, and R32, and socket CT4 are shown. The power devices in the converters (1-3) are all low-threshold drive voltage, high-current output power MOSFETs (IRFR / U1205). The upper and lower arms of the converter use four floating-gate power device driver chips (IR2104) and four semiconductor-cooled Peltier mounts, with each pair controlled by a full-bridge circuit for commutation. Taking the full-bridge converter A (1-3) as an example, this describes how the microprocessor controls the converter (1-3) to switch the semiconductor Peltier patch from cooling mode to heating mode: Assume that the two electrodes of the two semiconductor Peltier patches are connected to the socket CT3. When the power MOSFETs BG1 and BG3 are turned on and BG2 and BG4 are turned off, the +12A current flows through BG1-BP point-through the semiconductor Peltier patch to AP point-through BG3 to ground. Assume that the above current path makes the A side of the semiconductor Peltier patch the cooling side. Then, control the power MOSFETs BG1 and BG3 to turn off and BG2 and BG4 to turn on. The +12A current flows through BG2-AP point-through the semiconductor Peltier patch to BP point-through BG4 to ground. Obviously, the direction of the current applied to the semiconductor Peltier patch is reversed. Therefore, the original cooling side is turned into the heating side. In this way, the high current polarity switching is successfully achieved using microelectronics technology. Additionally, the power supply unit (1-2) may also include a stable low-voltage, low-power power supply for the microprocessor (STM32F405) and related chips; a branch line is taken from the +12A 29 amp output of the switching power supply POW1 as the power source for forming a pure 3.3V chip power supply. The +12A is fed to the input terminal of the BUCK step-down chip IC9 (TPSM82902), and after BUCK conversion, it outputs +6V. To purify the +6V, it is then output as 3.3V by the linear chip IC10 (TPS736).

[0022] The aforementioned conversion units (1-4) provide the high-frequency, high-power excitation source required to drive 15 28kHz 60W / each ultrasonic transducers. This is a special high-frequency power source, and no ready-made product is available. Since the 15 28kHz 60W / each ultrasonic transducers require a total of 900W of excitation source, a 1200W 28kHz high-frequency half-bridge power source was developed to provide a margin. This invention utilizes half-bridge non-isolated circuit topology conversion technology to provide a 1200W floating output high-frequency excitation source.

[0023] Combination Figures 2 to 4The conversion units (1-4) shown may include a single-chip AC / DC converter IC1 (TOP222P), a dual-output PWM modulation chip IC2 (SG2525), a dual-channel floating-gate output power device driver chip IC3 (IR2110), and passive components. Passive components include resistors numbered R1, R3 up to R24, capacitors numbered C1 up to C12, electrolytic capacitors numbered E1 up to E13, various diodes numbered D1 up to D7, optocoupler OP1 (ITV817A), high-frequency isolation transformer TI, filter and common-mode inductors L1, L2, L3, and L4, fuse F1 (15A), surge protector varistor RT1, rectifier bridge RCT1 (KBJ2010), power MOSFETs M1 and M2 (MTM26N50), etc. This section is rather lengthy, so a brief description of the circuit function is provided below: The single-chip AC / DC converter IC1 (TOP222P), optocoupler OP1 (ITV817A), high-frequency isolation transformer TI, filters and common-mode inductors L1, L2, L3, and other passive components form the initial DC power supply for the half-bridge converter control chip and circuit. After connecting to 220V AC, it outputs low-power +12V, -12V, and +6V DC operating power supplies. The commonly used PWM modulation chip IC2 (SG2525) outputs two complementary PWM waves with dead-time control, which serve as input signals for the dual-channel floating-gate output power device driver chip IC3 (IR2110). This completes the two floating-gate drive PWM signals required for the half-bridge converter. Common-mode inductors L1, L2, L3, and L4, fuse F1 (15A), surge protector varistor RT1, rectifier bridge RCT1 (KBJ2010), power MOSFETs M1 and M2 (MTM26N50), and related passive components constitute a high-power high-frequency half-bridge converter. Driven by two floating-gate PWM signals, it outputs a 28kHz 1200W high-frequency power excitation source to meet the needs of the ultrasonic transducer. It is worth noting that the 28kHz 1200W high-frequency half-bridge converter (1-4) described in this invention does not employ the usual isolated output. Instead, the load FZ is directly applied to the midpoint between the connection point of the two power MOSFETs and the rectified capacitor voltage divider filter network, achieving a floating output without a high-frequency isolation transformer. This design has at least the following advantages: 1. It greatly simplifies the structure of a standard half-bridge converter; 2. It uses a high-frequency isolation transformer only in the initial DC power supply circuit, avoiding magnetic saturation problems and increasing operating life; 3. It significantly reduces size and component costs.

[0024] Combination Figure 9As shown, the communication units (1-5) can be RS485 chips IC12, IC13, and IC15 (THVD1406), passive components: resistors R41, R42, R44, R45, R46, R47, R48, R49, R50, R51, and R52, capacitors C38, C39, C40, and C41, Zener diodes W2, W3, W4, and W5, and connectors CT5, CT6, and CT7, forming an RS485 long-distance bidirectional communication, 4-bit operation network. Among them, RS485 chips IC12 (THVD1406), IC13 (THVD1406), and IC15 (THVD1406) communicate with other external devices. The four-bit operation network, consisting of resistors R45 and R46, capacitor C38, and Zener diode W2, is designed for possible bit setting or other bit operations by certain auxiliary components. The network is described as follows: When a bit setting operation is required, the 12V bit operation logic signal is sent to resistor R45 and capacitor C38 via the "1" pin of connector CT8 in the condenser cleaning system. C38 filters out noise superimposed during long-distance transmission. R45 acts as a current-limiting resistor for Zener diode W2, and the Zener diode clamps the received logic signals within a certain range to a 3V logic level suitable for microprocessor processing.

[0025] The triggering units (1-7) involved in the condensation cleaning system can simply provide microprocessor sampling data and judgment, and will not be elaborated further.

[0026] The specific structure of the high-power ultrasonic transducer array, semiconductor refrigeration and heating Pellets, stepper motor, and its transmission mechanism involved in the condensation cleaning system can be shown below: Combination Figure 10 and Figure 11 The content shown is as follows. The cleaning components and working plate (10-7) are fixed in place and can be fixed to the wall of the flue. The semiconductor cooling and heating Pel patch is connected to the back of the working board 7, and the temperature of the working board (10-7) is controlled by the semiconductor cooling and heating Pel patch. The cleaning assembly includes a transmission assembly and an ultrasonic cleaning assembly. The ultrasonic cleaning component is positioned on the front of the working plate (10-7) and is used to clean the front of the working plate (10-7). The transmission assembly is connected to the ultrasonic cleaning assembly and is used to control the operation of the ultrasonic cleaning assembly to perform scanning cleaning on the work plate (10-7).

[0027] The two ends of the semiconductor Peltier (10-6) are not distinguished as hot or cold. If the initial polarity of the power supply applied to the semiconductor Peltier makes one end a cold side, changing the polarity of the applied power supply voltage will change the cold side to a hot side. The semiconductor Peltier cooler (10-6) is connected to a conversion circuit. The converter controls the polarity of the current power supply applied to the semiconductor Peltier cooler (10-6) to switch whether the end of the semiconductor Peltier cooler (10-6) closest to the working board (10-7) is in a cooling or heating state.

[0028] The aforementioned transmission assembly may include a moving component and a moving base. The moving base is mounted on the moving component, which controls the moving base to move along the surface of the working plate. The ultrasonic cleaning component is mounted on the moving base and moves with the moving base to achieve scanning cleaning of the surface of the working plate (10-7). The specific structure of the moving component may be as follows: the moving component includes a stepper motor (10-1) and a lead screw (10-10). The moving base is sleeved on the lead screw (10-10), and the motor (10-1) controls the rotation of the lead screw (10-10) to drive the moving base to move. The moving component may also include a guide rod (10-4), which is parallel to the lead screw (10-10). The moving base is sleeved on the guide rod (10-4), and the guide rod (10-4) better constrains the movement direction of the moving base. The lead screw (10-10), the moving base, and the guide rod (10-4) constitute a transmission mechanism. An ultrasonic transducer (10-5) is installed in an ultrasonic cleaning assembly, which also includes a water-cooling assembly. Both the ultrasonic transducer and the water-cooling assembly are arranged in a direction perpendicular to the direction of movement of the moving base. The distance between the ultrasonic transducer (10-5) and the working plate is less than or equal to 1.5 cm, and further less than or equal to 1 cm. By controlling the distance between the ultrasonic cleaning array and the condenser plate being cleaned to within 1 cm, the influence of air molecule absorption on ultrasonic energy can be ignored. In this case, excellent cavitation effect can be achieved even without a water medium. In addition, due to the elastic mechanical wave properties of multiple high-power ultrasonic cleaning transducers, a dense reflection field will inevitably be formed in the surrounding space, thereby cleaning the surrounding objects. Alternatively, this type of water-cleaning component can be implemented directly using existing technologies, such as: hoses (10-9) with water outlets on one side of several corresponding working plates (10-7) arranged in an array to introduce cleaning liquid and achieve rinsing of the working plates (10-7); and existing devices that can rinse the working plates (10-7), such as spray components.

[0029] A protective cover 2 can be added to the ultrasonic cleaning component (the protective cover 2 can be set on the top of the frame when the ultrasonic cleaning component moves up and down). By covering the ultrasonic cleaning component with the protective cover 2, the probability of oil stains adhering to the ultrasonic cleaning component is reduced, ensuring the cleanliness of the surface of the ultrasonic cleaning component, and ensuring the working effect and service life of the ultrasonic cleaning component. The protective cover can be set independently to cover the ultrasonic cleaning component when it is not in operation; the protective cover can also be connected to the movable base to move with the ultrasonic cleaning component.

[0030] A heat dissipation assembly can be added to the corresponding Peltier semiconductor patch for both cooling and heating. The structure of the heat dissipation assembly includes a cooling water tank (10-11) with a cooling water inlet (10-3) and a cooling water outlet (10-8). In cooling mode, the cold side of the Peltier semiconductor patch is in close contact with the mirrored stainless steel plate, and its hot side is in close contact with the stainless steel cooling water tank (10-11). Cooling water flows into the stainless steel water tank (10-11) from the cooling inlet (10-3) and flows out of the stainless steel water tank (10-11) from the cooling outlet (10-8), providing a good heat dissipation environment for the Peltier semiconductor patch.

[0031] All of the above-mentioned undisclosed matters can be implemented using existing technologies, so they will not be elaborated here.

[0032] The aforementioned half-bridge converter circuit can also be applied to the power supply circuits of other devices that require a high-frequency power excitation source.

[0033] The full-bridge converter described above can also be applied to other power supply circuits that require power polarity reversal.

[0034] Finally, it should be noted that in the description of this invention, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "install", "connect", and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0036] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted herein.

Claims

1. A condensation cleaning system, characterized in that, It includes at least one condensation cleaning module, and each condensation cleaning module includes a condensation module and a cleaning module arranged correspondingly to each other. The condensation module is used to perform oil molecule condensation and separation. The cleaning module is used to clean impurities adhering to the surface of the condensation module, and an ultrasonic transducer is used in the cleaning module.

2. The condensation cleaning system according to claim 1, characterized in that, The condensation cleaning system includes a control module, which comprises a processor unit, a power supply unit, and a conversion unit. The conversion unit is connected to the power supply unit through the processor unit. The conversion unit is configured to correspond to the ultrasonic transducer. The conversion unit uses a half-bridge conversion circuit or a full-bridge conversion circuit to output a high-frequency power excitation source that meets the requirements of the ultrasonic transducer.

3. The condensation cleaning system according to claim 2, characterized in that, The half-bridge converter circuit includes an auxiliary converter circuit, a modulation converter circuit, and a high-power converter circuit connected in series. The auxiliary conversion circuit includes a monolithic AC / DC conversion chip, resistors, optocouplers, diodes, a high-frequency isolation transformer, filters, and a common-mode inductor, which assist in providing power to the chips involved in the half-bridge conversion circuit; The modulation and conversion circuit includes a dual-channel PWM modulation chip, a dual-channel floating gate output power device driver chip, resistors, capacitors, and diodes. The PWM modulation chip outputs two complementary PWM waves with dead-time control, which serve as the two floating gate drive PWM signals required by the half-bridge converter. The high-power conversion circuit includes filters and common-mode inductors, fuses, lightning protection varistors, rectifier bridges, and power MOSFETs. The high-power conversion circuit is used to output a high-frequency power excitation source under the drive of two floating gate drive PWM signals. In the half-bridge conversion circuit, the load is directly applied to the midpoint between the connection point of the two power MOSFETs and the voltage divider filter network after rectification, realizing floating output.

4. The condensation cleaning system according to claim 2, characterized in that, The temperature of the condenser module is adjustable; The condensation module includes a working plate and a semiconductor cooling and heating Pellets, with one end face of the semiconductor cooling and heating Pellets attached to the working plate; the control module includes a converter, which is connected between the power supply unit and the processor unit, and the processor unit is connected to the converter; the converter, converter unit, and power supply unit are all configured correspondingly to the condensation cleaning module; The converter is a full-bridge converter or a relay. The converter is configured to correspond to the semiconductor cooling and heating Pel patch. The converter changes the polarity of the current passing through the corresponding semiconductor cooling and heating Pel patch, thereby changing the working state of the semiconductor cooling and heating Pel patch attached to the working board. The working state of the semiconductor cooling and heating Pel patch includes cooling state and heating state.

5. The condensation cleaning system according to claim 4, characterized in that, The full-bridge converter includes power MOSFETs, resistors, and sockets; The condensation module also includes a cooling component, which is disposed on the other end face of the semiconductor cooling and heating Pel patch.

6. The condensation cleaning system according to claim 4, characterized in that, The cleaning module also includes a cleaning component and a transmission component. The transmission component includes a driver and a mechanical transmission mechanism. The driver controls the operation of the ultrasonic transducer and the cleaning component through the mechanical transmission mechanism to achieve scanning cleaning on the condensation module. The control module is also equipped with a drive unit connected to the processor, which is used to control the operating status of the driver.

7. The condensation cleaning system according to claim 6, characterized in that, The working plate is rectangular, and the transmission component controls the ultrasonic transducer and the cleaning component to move up and down or left and right. The cleaning module includes at least one set of ultrasonic transducers, and one set of ultrasonic transducers includes multiple ultrasonic transducers. The ultrasonic transducers in the same set are equidistantly arranged along a direction perpendicular to the direction of movement of the ultrasonic transducers. The ultrasonic transducers on the same cleaning module are connected to one or more conversion units.

8. The condensation cleaning system according to claim 4, characterized in that, The condensation cleaning system also includes a triggering unit, which is connected to the processor unit. The triggering unit is an oil fume concentration sensor. The control module is also equipped with a communication unit.

9. The condensation cleaning system according to claim 7, characterized in that, The condensation cleaning system adopts a multi-level control structure, which includes: The condensation cleaning module includes multiple condensation cleaning modules, and one of the condensation cleaning modules includes one or more sets of semiconductor cooling and heating Pellets. and / or The condensation cleaning module includes a condensation cleaning module, which includes multiple sets of semiconductor cooling and heating PAL patches. Each group of semiconductor cooling and heating Pellets includes at least one semiconductor cooling and heating Pellet, and each group of semiconductor cooling and heating Pellets corresponds to one converter. The number of power supplies in the power supply unit corresponds to the number of converters.

10. The condensation cleaning system according to any one of claims 1-8, characterized in that, The processor unit includes a microprocessor, an integrated temperature measurement chip, capacitors, resistors, diodes, a crystal oscillator, and switches. The integrated temperature measurement chip is used to monitor the temperature of a certain end face of the semiconductor cooling and heating Peltier patch.

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