Halbach array magnet assembling device and method

Abstract

The invention belongs to the technical field of Halbach magnet assembling, and particularly relates to a Halbach array magnet assembling device and method.The assembling device comprises a bottom plate, a magnet assembly, a gluing assembly, a spacing assembly and a fixing assembly, and the magnet assembly comprises a back plate, a first magnet, a second magnet and a third magnet; the gluing assembly comprises a first gluing frame, a second gluing frame and a third gluing frame which are respectively used for gluing the back plate, so that a first magnet, a second magnet and a third magnet are adhered to the back plate; the spacing assembly is used for isolating the first magnet, the second magnet and the third magnet from the back plate respectively; the fixing assembly is mounted on the bottom plate, is used for mounting a second magnet and a third magnet on the back plate and is connected with the first magnet; and a first magnet, a second magnet and a third magnet are sequentially assembled on the back plate through the gluing assembly, the spacing assembly and the fixing assembly to form the magnet assembly.

Description

Technical Field

[0001] This invention belongs to the field of Heilbeck magnet assembly technology, specifically relating to an assembly device and method for Heilbeck array magnets. Background Technology

[0002] The Halbach Array, with its unique magnet arrangement, can generate a significantly enhanced strong magnetic field on one side while greatly weakening the stray magnetic field on the other side. It has significant advantages such as improving the power density and efficiency of equipment, saving materials, and reducing electromagnetic interference. It is widely used in high-precision motors, magnetic levitation systems and other fields.

[0003] Assembling Helbeck array magnets, especially when the magnets are already magnetized, presents significant challenges. The magnetization directions of adjacent magnets at specific angles in the array result in strong attractive or repulsive forces between them. This makes it difficult to accurately and stably install the magnets into their intended positions during assembly, making them prone to displacement and collisions. This not only seriously affects the final magnetic field performance of the array but also poses a safety risk of personal injury and equipment damage due to magnet shattering and flying debris. Although the "assemble first, then magnetize as a whole" approach can avoid magnetic interference during assembly, this approach is usually costly, the magnet performance is difficult to meet standards, and there are problems with high mechanical stress and low yield.

[0004] Therefore, it is necessary to improve the existing technology to overcome its shortcomings in practical applications. Summary of the Invention

[0005] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this invention is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this invention is to provide an assembly apparatus and method for a Heilbeck array magnet that meets one or more of the aforementioned requirements.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0007] This invention provides an assembly apparatus for a Hellbeck array magnet, comprising a base plate, a magnet assembly, an adhesive application assembly, a spacer assembly, and a fixing assembly. The magnet assembly includes a back plate, a first magnet, a second magnet, and a third magnet. The adhesive application assembly includes a first adhesive application frame, a second adhesive application frame, and a third adhesive application frame, respectively used to apply adhesive to the back plate to adhere the first magnet, the second magnet, and the third magnet to the back plate. The spacer assembly is used to isolate the first magnet, the second magnet, and the third magnet from the back plate. The fixing assembly is mounted on the base plate and is used to mount the second magnet and the third magnet to the back plate and connect to the first magnet. The first magnet, the second magnet, and the third magnet are assembled onto the back plate sequentially through the adhesive application assembly, the spacer assembly, and the fixing assembly to form the magnet assembly.

[0008] As a preferred embodiment, the first magnet, the second magnet, and the third magnet are mounted on the back plate, with the first magnet positioned between the second magnet and the third magnet.

[0009] As a preferred embodiment, the first adhesive application frame is used to apply adhesive to the first mounting position of the back panel, the second adhesive application frame is used to apply adhesive to the second mounting position of the back panel, and the third adhesive application frame is used to apply adhesive to the third mounting position of the back panel.

[0010] As a preferred embodiment, the spacer assembly includes a first partition, a second partition, a third partition, a pull block, and a pressure block. The first partition is used to isolate the first magnet from the back plate, the second partition is used to isolate the second magnet from the back plate, and the third partition is used to isolate the third magnet from the back plate. The pull block cooperates with the pressure block to isolate the corresponding first magnet, second magnet, and third magnet from the back plate through the first partition, second partition, and third partition, respectively, and to gradually adhere the first magnet, second magnet, and third magnet to the corresponding adhesive application area on the back plate.

[0011] As a preferred embodiment, the first partition, the second partition, and the third partition are each provided with a groove below, and the grooves correspond to the glue application area on the back plate respectively; a sliding groove is provided above the first partition, and the sliding groove cooperates with the first magnet.

[0012] As a preferred embodiment, the fixing assembly includes a front baffle, a rear baffle, a first limiting assembly, and a second limiting assembly. The front baffle and the rear baffle are respectively disposed on the front and rear sides of the base plate, and the two limiting assemblies are respectively disposed on both sides of the first magnet and are used to fix the second magnet and the third magnet, respectively.

[0013] As a preferred embodiment, the first limiting component and the second limiting component have the same structure, each including a fixing plate, a cover plate and a fixing ear. The fixing plate is used to restrict the degree of freedom of the first magnet, and the cover plate cooperates with the fixing ear to restrict the degree of freedom of the second magnet and the third magnet.

[0014] As a preferred embodiment, the fixing assembly further includes several bolts, which respectively cooperate with the cover plate, the fixing lug, the front baffle and the rear baffle to limit the first magnet, the second magnet and the third magnet.

[0015] The present invention also provides a method for assembling a Hellbeck array magnet, using the assembly apparatus described in any of the above embodiments, comprising the following steps:

[0016] S1. Install the back plate onto the base plate, apply adhesive to the first mounting position of the back plate through the first adhesive application frame, attach the first magnet to the first mounting position through the fixing component and the isolation component, and place it in the oven for curing.

[0017] S2. Apply adhesive to the second mounting position of the back panel using the second adhesive application frame;

[0018] S3. The second magnet is attached to the second mounting position using the spacer and fixing components, and then placed in an oven for curing.

[0019] S4. Apply adhesive to the third mounting position of the back panel through the third adhesive application frame;

[0020] S5. The third magnet is attached to the third mounting position by means of the spacer assembly and the fixing assembly, and then placed in an oven for curing, so that the first magnet, the second magnet and the third magnet are assembled on the back plate to form a magnet assembly.

[0021] Compared with the prior art, the beneficial effects of this invention are:

[0022] This invention provides an assembly device for a Hellbeck array magnet, which can safely, efficiently and accurately assemble magnetized Hellbeck array magnets to avoid displacement or collision during the installation of magnetized magnets, or even accidents such as personal injury and equipment damage caused by magnet breakage and splashing. Moreover, it is superior to the method of assembling first and then magnetizing the whole.

[0023] This invention provides an assembly device for Helbeck array magnets. The adhesive application component determines the adhesive application area to prevent excessive glue overflow during application. The spacer component prevents violent collisions under strong magnetic force when installing multiple magnets with a backplate. At the same time, the bottom of the spacer component has a groove to accommodate glue, which prevents large slippage and excessive glue extrusion during the bonding process between the magnet and the backplate.

[0024] This invention provides an assembly device for a Heilbeck array magnet. The magnet is constrained within a certain space by the cooperation of multiple components, which prevents the magnet from flying out under the action of strong mutual repulsion during the assembly process. The screws on the fixing components are used to finely adjust the position of the magnet, and the adjustment status can be observed through the grooves reserved on the fixing components. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of an assembly device for a Hellbeck array magnet according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the first adhesive application frame applying adhesive to the back panel according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram showing the state of the first magnet being installed on the back plate in an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the structure of the first partition plate according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the second or third partition in an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the second adhesive application frame applying adhesive to the back panel according to an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram showing the second magnet being mounted on the back plate in an embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram showing the second magnet being mounted on the back plate in an embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the structure of the magnet assembly according to an embodiment of the present invention;

[0035] In the diagram: 1. Base plate, 2. Magnet assembly, 21. Back plate, 22. First magnet, 23. Second magnet, 24. Third magnet, 3. Glue application assembly, 31. First glue application frame, 32. Second glue application frame, 33. Third glue application frame, 4. Spacer assembly, 41. First partition, 411. Slide groove, 412. Groove, 42. Second partition, 43. Third partition, 441. First pull block, 442. Second pull block, 451. First pressure block, 452. Second pressure block, 5. Fixing assembly, 51. Front baffle, 52. Rear baffle, 53. First limiting assembly, 531. First fixing plate, 532. First cover plate, 533. First fixing ear, 54. Second limiting assembly, 541. Second fixing plate, 542. Second cover plate, 543. Second fixing ear, 55. Bolt. Detailed Implementation

[0036] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0037] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0038] According to some embodiments of this application, please refer to Figures 1 to 9 As shown, an assembly device for a Hellbeck array magnet is provided, including a base plate 1, a magnet assembly 2, an adhesive application assembly 3, a spacer assembly 4, and a fixing assembly 5. The magnet assembly 2 includes a back plate 21, a first magnet 22, a second magnet 23, and a third magnet 24. The adhesive application assembly 3 includes a first adhesive application frame 31, a second adhesive application frame 32, and a third adhesive application frame 33, which are respectively used to apply adhesive to the back plate 21 so that the first magnet 22, the second magnet 23, and the third magnet 24 are adhered to the back plate 21. The spacer assembly 4 is used to isolate the first magnet 22, the second magnet 23, and the third magnet 24 from the back plate 21. The fixing assembly 5 is mounted on the base plate 1 and is used to mount the second magnet 22 and the third magnet 23 to the back plate 21 and connect them to the first magnet 22. The first magnet 22, the second magnet 23, and the third magnet 24 are assembled onto the back plate 21 in sequence through the adhesive application assembly 3, the spacer assembly 4, and the fixing assembly 5 to form the magnet assembly 2.

[0039] In some specific embodiments, a first magnet 22, a second magnet 23, and a third magnet 24 are mounted on a back plate 21, with the first magnet 22 positioned between the second magnet 23 and the third magnet 24. The first magnet 22, the second magnet 23, and the third magnet 24 are glued to the back plate 21 in a Hellbeck array configuration to form a magnet assembly 2, such that the area above the magnets is a magnetic field enhancement region, and one side of the back plate is a magnetic field weakening region.

[0040] In some specific embodiments, the first adhesive application frame 31 is used to apply adhesive to the first mounting position of the back panel 21, the second adhesive application frame 32 is used to apply adhesive to the second mounting position of the back panel 21, and the third adhesive application frame 33 is used to apply adhesive to the third mounting position of the back panel 21. By using the first adhesive application frame 31, the second adhesive application frame 32, and the third adhesive application frame 33, the adhesive can be accurately applied to the corresponding mounting positions of the back panel 21, avoiding excessive use of adhesive.

[0041] Furthermore, the first glue-applying frame 31 has a groove at its lower part that can be fastened to the back plate 21, and a through groove corresponding to the first magnet 22 at its upper part. Before installing the first magnet 22, glue can be applied to the back plate 21 through the first glue-applying frame 31. The second glue-applying frame 32 and the third glue-applying frame 33 are used to apply glue to the corresponding areas of the second magnet 23 and the third magnet 24 on the back plate 21.

[0042] In some specific embodiments, the spacer assembly 4 includes a first partition 41, a second partition 42, a third partition 43, a first pull block 441, a first pressing block 451, a second pull block 442, and a second pressing block 452. The first partition 41 is used to isolate the first magnet 22 from the back plate 21, the second partition 42 is used to isolate the second magnet 23 from the back plate 21, and the third partition 43 is used to isolate the third magnet 24 from the back plate 21. The first pull block 441 cooperates with the first pressing block 451, and the second pull block 442 cooperates with the second pressing block 452. The first partition 41, the second partition 42, and the third partition 43 respectively isolate the corresponding first magnet 22, second magnet 23, and third magnet 24 from the back plate 21, so that the first magnet 22, second magnet 23, and third magnet 24 are gradually pasted onto the corresponding adhesive areas on the back plate 21.

[0043] In some specific embodiments, the first partition 41, the second partition 42, and the third partition 43 are each provided with a groove below, which corresponds to the glue application area on the back plate 21; a sliding groove 411 is provided above the first partition 41, which cooperates with the first magnet 22. The grooves of the first partition 41, the second partition 42, and the third partition 43 are adapted to the glue-containing area on the back plate 21 to prevent the glue from being squeezed out.

[0044] In some specific embodiments, the fixing component 5 includes a front baffle 51, a rear baffle 52, a first limiting component 53, and a second limiting component 54. The front baffle 51 and the rear baffle 52 are respectively disposed on the front and rear sides of the base plate 1, and the two limiting components are respectively disposed on both sides of the first magnet 22, and are used to fix the second magnet 22 and the third magnet 23 respectively.

[0045] In some specific embodiments, the first limiting component 53 and the second limiting component 54 have the same structure, each including a fixing plate, a cover plate, and a fixing ear. The fixing plate is used to restrict the degree of freedom of the first magnet 22, and the cover plate cooperates with the fixing ear to restrict the degree of freedom of the second magnet 23 and the third magnet 24. When assembling the second magnet 23 and the third magnet 24, the fixing plate isolates them from the base plate, which can prevent the risk of magnet breakage caused by excessive attraction.

[0046] Specifically, the first limiting component 53 includes a first fixing plate 531, a first cover plate 532, and a first fixing ear 533, and the second limiting component 54 includes a second fixing plate 541, a second cover plate 542, and a second fixing ear 543. When the first magnet 22 in the middle is installed, the base plate 1 provides support from below, the front baffle 51 is used to restrict the degree of freedom of the first magnet 22 in the front-back direction, and the first fixing plate 531 and the second fixing plate 541 are used to restrict the degree of freedom of the first magnet 22 in the left-right direction, the up-down direction, and the three rotational degrees of freedom, so as to ensure that the position of the first magnet 22 is completely determined. When installing the second magnet 23 and the third magnet 24, the base plate 1 provides support from below. The front baffle 51 and the rear baffle 52 are used to restrict the degree of freedom of the magnet in the front-back direction. The first cover plate 532, the first fixing ear 533, the second cover plate 542, and the second fixing ear 543 are used to restrict the degree of freedom in the left-right direction, the up-down direction, and the three rotational degrees of freedom. The attitude angle of each magnet can be finely adjusted by adjusting bolts on the first cover plate 532, the first fixing ear 533, the second cover plate 542, and the second fixing ear 543.

[0047] In some specific embodiments, the fixing component 5 further includes several bolts 55, which respectively cooperate with the cover plate, fixing lugs, front baffle, and rear baffle to limit the positions of the first magnet 22, the second magnet 23, and the third magnet 24. The bolts 55 are used to finely adjust the position and angle of the first magnet 22, the second magnet 23, and the third magnet 24.

[0048] According to some embodiments of this application, a method for assembling a Hellbeck array magnet is also provided, using the assembly apparatus described above, including the following steps:

[0049] S1. Install the back plate onto the base plate, apply adhesive to the first mounting position of the back plate through the first adhesive application frame, attach the first magnet to the first mounting position through the fixing component and the isolation component, and place it in the oven for curing.

[0050] The back plate and the bottom plate are assembled by bolts. The front baffle is connected to the back plate by screws. Glue is evenly applied to the middle area of ​​the back plate, i.e. the first mounting position, through the first glue application frame. The first partition is covered on top to isolate the first magnet from the back plate. The first fixing plate and the second fixing plate are fixed to the bottom plate by bolts. The first magnet is installed along the reserved groove of the first partition.

[0051] Furthermore, the first magnet is slowly dropped onto the back plate in the correct position, and the entire device is placed in an oven and heated to 80°C for curing. After heating, the first and second fixing plates are removed.

[0052] S2. Apply adhesive to the second mounting position of the back panel using the second adhesive application frame.

[0053] Apply glue evenly to the left side area of ​​the back panel, i.e. the second mounting position, using the second glue application frame. After the glue application is completed, remove the second glue application frame.

[0054] S3. The second magnet is attached to the second mounting position using the spacer and fixing components, and then placed in an oven for curing.

[0055] The first pull block, first pressure block, and second partition are bolted together and fixed between the front baffle, rear baffle, and back plate. The second magnet is slowly inserted and positioned approximately. The first cover plate and first fixing ear are then fixed above the front and rear baffles, so that the second magnet is surrounded by the first cover plate, first fixing ear, front baffle, rear baffle, and the first magnet. The first pull block, first pressure block, and first partition are then removed, allowing the second magnet to contact the back plate. The entire assembly is then placed in an oven and heated to 80°C for curing.

[0056] S4. Apply adhesive to the third mounting position of the back panel using the third adhesive application frame.

[0057] Apply glue evenly to the right side area of ​​the back panel, i.e. the third mounting position, using the third glue application frame. After the glue application is complete, remove the third glue application frame.

[0058] S5. The third magnet is attached to the third mounting position by means of the spacer assembly and the fixing assembly, and then placed in an oven for curing, so that the first magnet, the second magnet and the third magnet are assembled on the back plate to form a magnet assembly.

[0059] The second pull block, the second pressure block, and the third partition are bolted together and fixed in the middle of the front baffle, the rear baffle, and the back plate. The third magnet is slowly inserted and positioned roughly. The second cover plate and the second fixing ear are fixed above the front baffle and the rear baffle, so that the third magnet is surrounded by the second cover plate, the second fixing ear, the front baffle, the rear baffle, and the first magnet. Then the second pull block, the second pressure block, and the third partition are pulled out so that the third magnet contacts the back plate.

[0060] The positions of the second and third magnets are finely adjusted by alternately adjusting the screws on the first cover plate, the first fixing ear, the second cover plate, and the second fixing ear. The position of the second and third magnets is checked through the observation holes on the first cover plate, the front baffle, and the rear baffle. After the second and third magnets reach the desired positions, the entire device is placed in an oven and heated to 80°C for curing.

[0061] Furthermore, after all the magnets have cured, all the magnet fixing components are disassembled, leaving the magnet components to be bonded together with the cured glue as designed. At this point, the magnetized Helbeck array is assembled.

[0062] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0063] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation based on the ideas provided by this invention, and these changes should also be considered within the scope of protection of this application.

Claims

1. An assembly apparatus for a Hellbeck array magnet, characterized in that, The device includes a base plate, a magnet assembly, an adhesive application assembly, a spacer assembly, and a fixing assembly. The magnet assembly includes a back plate, a first magnet, a second magnet, and a third magnet. The adhesive application assembly includes a first adhesive application frame, a second adhesive application frame, and a third adhesive application frame, which are respectively used to apply adhesive to the back plate so that the first magnet, the second magnet, and the third magnet are attached to the back plate. The spacer assembly is used to isolate the first magnet, the second magnet, and the third magnet from the back plate respectively; the fixing assembly is installed on the base plate and is used to install the second magnet and the third magnet on the back plate and connect to the first magnet; the first magnet, the second magnet, and the third magnet are assembled on the back plate in sequence by the adhesive application assembly, the spacer assembly, and the fixing assembly to form a magnet assembly.

2. The assembly apparatus for a Hellbeck array magnet according to claim 1, characterized in that, The first magnet, the second magnet, and the third magnet are mounted on the back plate, with the first magnet positioned between the second magnet and the third magnet.

3. The assembly apparatus for a Hellbeck array magnet according to claim 1, characterized in that, The first adhesive application frame is used to apply adhesive to the first mounting position of the back panel, the second adhesive application frame is used to apply adhesive to the second mounting position of the back panel, and the third adhesive application frame is used to apply adhesive to the third mounting position of the back panel.

4. The assembly apparatus for a Hellbeck array magnet according to claim 1, characterized in that, The spacer assembly includes a first spacer, a second spacer, a third spacer, a pull block, and a pressure block. The first spacer is used to isolate the first magnet from the back plate, the second spacer is used to isolate the second magnet from the back plate, and the third spacer is used to isolate the third magnet from the back plate. The pull block cooperates with the pressure block to isolate the corresponding first magnet, second magnet, and third magnet from the back plate through the first spacer, second spacer, and third spacer, respectively, and to gradually adhere the first magnet, second magnet, and third magnet to the corresponding adhesive area on the back plate.

5. The assembly apparatus for a Hellbeck array magnet according to claim 4, characterized in that, The first partition, the second partition, and the third partition are each provided with a groove below them, and the grooves correspond to the glue application area on the back plate respectively; the first partition is provided with a sliding groove above it, and the sliding groove cooperates with the first magnet.

6. The assembly apparatus for a Hellbeck array magnet according to claim 1, characterized in that, The fixing assembly includes a front baffle, a rear baffle, a first limiting assembly, and a second limiting assembly. The front baffle and the rear baffle are respectively disposed on the front and rear sides of the base plate, and the two limiting assemblies are respectively disposed on both sides of the first magnet and are used to fix the second magnet and the third magnet respectively.

7. The assembly apparatus for a Hellbeck array magnet according to claim 6, characterized in that, The first limiting component and the second limiting component have the same structure, including a fixing plate, a cover plate and a fixing ear respectively. The fixing plate is used to restrict the degree of freedom of the first magnet, and the cover plate cooperates with the fixing ear to restrict the degree of freedom of the second magnet and the third magnet.

8. The assembly apparatus for a Heilbeck array magnet according to claim 7, characterized in that, The fixing assembly also includes several bolts, which respectively cooperate with the cover plate, the fixing lug, the front baffle and the rear baffle to limit the first magnet, the second magnet and the third magnet.

9. A method for assembling a Hellbeck array magnet, characterized in that, The assembly apparatus according to any one of claims 1 to 8 includes the following steps: S1. Install the back plate onto the base plate, apply adhesive to the first mounting position of the back plate through the first adhesive application frame, attach the first magnet to the first mounting position through the fixing component and the isolation component, and place it in the oven for curing. S2. Apply adhesive to the second mounting position of the back panel using the second adhesive application frame; S3. The second magnet is attached to the second mounting position using the spacer and fixing components, and then placed in an oven for curing. S4. Apply adhesive to the third mounting position of the back panel through the third adhesive application frame; S5. The third magnet is attached to the third mounting position by means of the spacer assembly and the fixing assembly, and then placed in an oven for curing, so that the first magnet, the second magnet and the third magnet are assembled on the back plate to form a magnet assembly.

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