Sensor assembly and heat exchange device

Abstract

The invention provides a sensor assembly. The sensor assembly comprises a shell, a circuit assembly and a heat conduction piece. The shell is provided with an inner cavity and a through hole; the circuit assembly comprises a circuit board and a first sensing part; the first sensing part is electrically connected with the circuit board; the first sensing part and at least part of the circuit board are accommodated in the inner cavity; the shell comprises a bottom wall, and at least part of the circuit board is located on the side where the inner side surface of the bottom wall is located; the heat conduction piece comprises a first part and a second part, and the second part is located on the side where the outer side surface of the bottom wall is located; the first part extends from the second part to the direction close to the inner cavity; the bottom wall is arranged around at least part of the peripheral wall of the first part; the first portion is in direct contact with the first sensing portion, or a minimum distance (L) between the first portion and the first sensing portion satisfies 0 < L < = 5 mm. The sensor assembly is simple in overall structure and good in surface temperature sensing effect of the to-be-measured object.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a sensor assembly and a heat exchange device. Background Technology

[0002] In related technologies, such as Figure 1 The fog sensing device shown is mainly used on vehicle windows. A temperature and humidity sensing module 110 is mounted on the upper surface of a flexible printed circuit board 120. The module integrates a glass surface temperature sensor and a glass surface humidity sensor. The flexible printed circuit board 120 is connected to connection terminals on a substrate assembly 130. The substrate assembly 130 has a through-hole 131 into which the temperature and humidity sensing module 110 extends. A housing 140 covers the substrate assembly 130, and the substrate assembly is located between the housing 130 and the flexible printed circuit board 120. The fog sensing device can be fixed to the vehicle window using an adhesive layer 150.

[0003] However, for the temperature and humidity sensing module 110, there is a flexible circuit board 120 and an adhesive layer 150 between the temperature and humidity sensing module 110 and the object to be measured, namely the car window glass. Its effect of sensing the surface temperature of the car window is poor. Summary of the Invention

[0004] This application provides a sensor component with good surface temperature sensing effect on the object to be measured, and a heat exchange device having the sensor component.

[0005] The first aspect of this application provides a sensor assembly, which includes a housing, a circuit assembly, and a heat-conducting component; the housing has an inner cavity, and the housing is further provided with a through hole communicating the inner cavity with the outside;

[0006] The circuit assembly includes a circuit board and a first sensing unit; the first sensing unit is electrically connected to the circuit board; the first sensing unit is used to sense the temperature signal of the environment surrounding the first sensing unit; wherein the first sensing unit and at least a portion of the circuit board are housed within the cavity;

[0007] The housing includes a bottom wall having an inner surface and an outer surface located on opposite sides in its thickness direction, with at least a portion of the circuit board located on the inner surface of the bottom wall. The heat-conducting element includes a first part and a second part connected together, with the second part located on the outer surface of the bottom wall. The first part of the heat-conducting element extends from the second part toward the inner cavity. The bottom wall is disposed around at least a portion of the outer peripheral wall of the first part. The first part of the heat-conducting element is in direct contact with the first sensing part, or the minimum distance L between the first part of the heat-conducting element and the first sensing part satisfies 0 < L ≤ 5 mm.

[0008] A second aspect of this application also provides a heat exchange device, including a heat exchanger and the sensor assembly described above. The heat exchanger includes at least one manifold, a plurality of heat exchange tubes, and at least one fin. The heat exchange tubes are fixed to the manifold, and the inner cavity of the heat exchange tubes communicates with the inner cavity of the manifold. The fins are located between two adjacent heat exchange tubes.

[0009] The sensor assembly is fixed to the heat exchanger, and the second part of the heat-conducting element is in contact with at least a portion of the surface of the fins and / or the surface of the heat exchange tube.

[0010] The sensor assembly provided in this application has a second part of the heat-conducting element located on the outer surface of the bottom wall away from the inner cavity. This allows the second part of the heat-conducting element to be closer to the surface of the object to be detected. The first part of the heat-conducting element is in direct contact with the first sensing part, or the minimum distance L between the first part of the heat-conducting element and the first sensing part satisfies 0 < L ≤ 5 mm. This is beneficial for the first sensing part to obtain a more accurate surface temperature of the object to be detected, and correspondingly helps to improve the accuracy of judging the frosting information of the object to be detected. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of a fog sensing device in related technologies;

[0012] Figure 2 This is a three-dimensional structural diagram of the sensor assembly of this application;

[0013] Figure 3 For this application Figure 2 An exploded 3D view of a sensor component;

[0014] Figure 4 For this application Figure 2 An exploded 3D view of a sensor component;

[0015] Figure 5 This is a three-dimensional cross-sectional view of the sensor assembly of this application;

[0016] Figure 6 This is a schematic diagram of one connection method between the sensor assembly circuit board and the heat-conducting component in this application.

[0017] Figure 7 This is a schematic diagram illustrating another connection method between the sensor assembly circuit board and the heat-conducting component in this application.

[0018] Figure 8 This is a schematic diagram of the structure of the first housing of the sensor assembly in this application;

[0019] Figure 9 This is a schematic diagram of the assembly structure of the first shell and the heat-conducting component of the sensor assembly in this application.

[0020] Figure 10 For this application Figure 9 Schematic diagram of the cross-sectional structure along the AA direction;

[0021] Figure 11 This is a schematic diagram of the view structure of the second shell of the sensor assembly of this application;

[0022] Figure 12 This is a schematic diagram of the second shell of the sensor assembly in this application from another perspective.

[0023] Figure 13 This is a schematic diagram of another three-dimensional cross-sectional structure of the sensor assembly of this application;

[0024] Figure 14 This is a schematic diagram of the assembly structure of the second shell and the circuit board in this application;

[0025] Figure 15 This is a three-dimensional structural diagram of the filter section of this application;

[0026] Figure 16 This is a three-dimensional structural diagram of the heat exchange device of this application;

[0027] Figure 17 For this application Figure 16 A three-dimensional cross-sectional structural diagram of the heat exchange device. Detailed Implementation

[0028] The dew point temperature is the temperature at which air reaches saturation under constant air pressure and constant water vapor content. During operation, when the surface temperature of a heat exchanger is lower than the dew point temperature and the ambient temperature is below zero, frost will form on the heat exchanger. Frost will cover the surface of the heat exchanger, such as the surface of the heat exchange tubes and fins. The frost not only increases the thickness of the wall surface of the heat exchange tubes and fins involved in heat exchange, but also easily blocks the gaps between adjacent heat exchange tubes, resulting in a reduction in airflow area, a decrease in the overall heat exchange capacity of the heat exchanger, and a decrease in the working efficiency of the thermal management system.

[0029] Related technologies sometimes determine whether a heat exchanger is about to frost by comparing its surface temperature with a preset temperature. However, the environment in which the heat exchanger operates is dynamic, with air temperature and water vapor content not being constant. The dew point temperature also fluctuates. Relying on a preset value to determine frost insecurity is prone to error; the thermal management system might activate its defrosting mode even when the heat exchanger is not ready to frost, leading to increased energy consumption. Therefore, accurately detecting both the heat exchanger's surface temperature and the ambient dew point temperature is crucial.

[0030] This application provides a compact and simple sensor assembly. In some embodiments, this sensor assembly can simultaneously detect ambient temperature, ambient humidity, and the surface temperature of the object being measured, so that the sensor assembly itself or the controller operating in the thermal management system can accurately determine whether the heat exchanger is about to frost. Please refer to... Figure 2 , Figure 3 As shown, the present application provides a sensor assembly 10, which includes a housing 20, a circuit assembly, and a heat-conducting component 13. The housing 20 has an inner cavity 30, and the housing 20 is also provided with a through hole 220 connecting the inner cavity 30 with the outside. Outside air can enter the inner cavity 30 through the through hole 220 to achieve consistency between the inner and outer air environments of the housing 20.

[0031] The circuit assembly includes a circuit board 14, a first sensing unit 141, and a second sensing unit 142. At least a portion of the circuit assembly is housed within a cavity 30, wherein both the first sensing unit 141 and at least a portion of the circuit board 14 are housed within the cavity 30. In the embodiments provided in this application, the circuit board 14, the second sensing unit 142, and the first sensing unit 141 are all housed within the cavity 30. In some other embodiments, the second sensing unit 142 and a portion of the circuit board 14 may be located outside the cavity 30. Alternatively, in some other embodiments, the sensor assembly 10 may not have a second sensing unit 142.

[0032] Both the second sensing unit 142 and the first sensing unit 141 are electrically connected to the circuit board 14. The second sensing unit 142 is used to sense at least one of a temperature signal and a humidity signal in the environment surrounding the second sensing unit 142, and the first sensing unit 141 is used to sense a temperature signal in the environment surrounding the first sensing unit 141. In one specific embodiment, the second sensing unit 142 integrates both temperature sensing and humidity sensing functions, and can sense both the temperature and humidity signals of the air entering the inner cavity 30. The first sensing unit 141 can be referenced... Figure 5 , Figure 6 and Figure 7 As illustrated, the first sensing unit 141 can be a sensing unit with temperature sensing function, which can sense the temperature signal of its surrounding environment. The first sensing unit 141 and the second sensing unit 142 can be independent sensing chips mounted on the circuit board 14. In the illustrated embodiment, the first sensing unit 141 and the second sensing unit 142 are surface-mounted to the circuit board 14 using surface mount technology (SMT). The surface mount technology of the first sensing unit 141 and the second sensing unit 142 results in a smaller size, which is beneficial for product miniaturization and facilitates automated soldering, simplifying the manufacturing process.

[0033] refer to Figure 3 , Figure 5 and Figure 10The outer casing 20 includes a bottom wall 211, which has an inner surface 300 and an outer surface 400 located on opposite sides of its thickness direction. The inner surface 300 is disposed towards the inner cavity 30, and the outer surface 400 is disposed away from the inner cavity 30. At least a portion of the circuit board 14 is located on the side where the inner surface of the bottom wall 211 is located. The heat-conducting element 13 includes a first portion 131 and a second portion 132. The first portion 131 of the heat-conducting element 13 is closer to the inner cavity 30 than the second portion 132. The second portion 132 of the heat-conducting element 13 is located on the side where the outer surface 400 of the outer casing 20 is located. The boundary line between the first portion 131 and the second portion 132 of the heat-conducting element 13 can be referenced. Figure 5 The dotted line in the middle is a diagram.

[0034] In one embodiment provided in this application, the outer shell 20 is provided with a cavity 24. Specifically, the cavity 24 is located on the bottom wall 211. The inner surface 300 of the outer shell 20 facing the inner cavity 30 is provided with a first cavity opening 241, and the outer surface 400 of the outer shell 20 away from the inner cavity 30 is provided with a second cavity opening 242. The first cavity opening 241 and the second cavity opening 242 are located on both sides of the cavity 24, respectively. That is, a cavity 24 penetrating the outer shell 20 is formed between the first cavity opening 241 and the second cavity opening 242. The cavity 24 can be formed by providing a through hole penetrating the outer shell 20. The cross-section of the through hole, i.e., the cross-section of the cavity 24, can be circular, elliptical, rectangular, or other irregular shapes. The first part 131 of the heat-conducting member 13 is at least partially housed in the cavity 24, and the first part 131 is located on the side of the second cavity opening 242 closer to the inner cavity 30. The second part 132 of the heat-conducting member 13 is located on the side of the second cavity opening 242 away from the inner cavity 30. During assembly, the heat-conducting component 13 can extend into the cavity 24 from the side where the cavity 30 is located and eventually be fixed together with the outer shell 20. The first part 131 of the heat-conducting component 13 can be completely located in the cavity 24, or the first part 131 of the heat-conducting component 13 can be located partly in the cavity 24 and partly in the inner cavity 30.

[0035] Specifically, such as Figure 10As shown, the first part 131 of the heat conductor 13 includes a top portion 136 and a first cylindrical portion 137. The top portion 136 is housed in the inner cavity 30, and the first cylindrical portion 137 is housed in the cavity 24. The second part 132 of the heat conductor 13 includes a second cylindrical portion 138 and a terminal portion 139. The first cylindrical portion 138 is connected between the top portion 136 and the second cylindrical portion 139, and the second cylindrical portion 138 is connected between the first cylindrical portion 137 and the terminal portion 139. The first cylindrical portion 137 and the second cylindrical portion 138 can be cylindrical, and the top portion 136 can also be cylindrical. The size of the terminal portion 139 can gradually decrease from the side connected to the second cylindrical portion 138, so that the terminal portion 139 has a relatively sharp free end. In this way, when the sensor assembly 10 is applied to the heat exchanger, the terminal portion 139 can be more easily inserted into the gap of the heat exchanger fins. The radial dimensions of the first column portion 137 and the second column portion 138 can be equal, and both are smaller than the radial dimension of the top portion 136, which is larger than the radial dimension of the cavity 24. Thus, after the heat-conducting component 13 is assembled with the outer casing 20, the top portion 136 can be positioned relative to the surrounding casing of the cavity 24 along the assembly direction, preventing the heat-conducting component 13 from dislodging from the cavity 24. The radial dimension of the first column portion 137 can be slightly smaller than the radial dimension of the cavity 24, and the first column portion 137 and the bottom wall 21 can be in a clearance fit relationship. Alternatively, the first column portion 137 can also be in an interference fit or an interference fit with the bottom wall 21, in which case the column portion 137 can at least partially fill the cavity 24.

[0036] In other embodiments of this application, the cavity 24 may be omitted, and at least a portion of the outer shell 20 may be manufactured by injection molding. That is, at least a portion of the outer shell 20 may be injection molded with the heat-conducting element 13 as an injection molding insert, thus making at least a portion of the outer shell 20 and the heat-conducting element 13 an integral structure. This is beneficial to the stability of the connection between the outer shell 20 and the heat-conducting element 13.

[0037] The first part 131 of the heat-conducting component 13 is in direct contact with the first sensing part 141. For details, please refer to... Figure 6 As shown, the top end 136 of the first part 131 is in direct contact with the end face of the first column part 137 away from the first column part 137. This facilitates the transmission of the surface temperature of the object to be measured to the first sensing part 141 through the end part 139 of the heat conductor 13 via the second column part 138, the first column part 137 and the top end 136. As a result, the temperature information sensed by the first sensing part 141 is closer to the surface temperature of the object to be measured.

[0038] Of course, the first part 131 of the heat-conducting element 13 may not be in direct contact with the first sensing part 141. The two can be arranged close to each other and spaced a certain distance apart, or they can achieve indirect thermal contact through other materials with good thermal conductivity, such as thermally conductive adhesive 40. The minimum distance L between the first part 131 of the heat-conducting element 13 and the first sensing part 141 satisfies 0 < L ≤ 5 mm. Generally, the heat-conducting component 13 is usually made of metal, while the first sensing part 141 is relatively small. Furthermore, the metal pins of the first sensing part 141 need to be soldered to the circuit board 14, and the circuit board 14 itself typically has many metal circuit components, such as pads and leads. If the heat-conducting component 13 and the first sensing part 141 are in direct contact, there is a risk of short circuits caused by direct connection between the metal pins of the heat-conducting component 13 and the metal components of the circuit board 14. Therefore, when assembling the sensor assembly, the minimum distance L between the first part 131 of the heat-conducting component 13 and the first sensing part 141 can be considered to satisfy 0 < L ≤ 5 mm. This improves the reliability of the product's safe use and avoids the minimum distance L being too large, which could affect the accuracy of the temperature signal sensing by the first sensing part 141. In some embodiments, the minimum distance L between the first part 131 of the heat-conducting component 13 and the first sensing part 141 satisfies 0.2 mm ≤ L ≤ 0.5 mm. The relatively close distance between the first part 131 of the heat-conducting element 13 and the first sensing part 141 can minimize heat loss and improve the accuracy of the temperature signal sensed by the first sensing part 141.

[0039] This application provides a specific implementation method reference. Figure 3 The exploded diagram shown is as follows Figure 5 As shown, the sensor assembly 10 also includes thermally conductive adhesive 40, which is at least partially located on the side 149 of the second side of the circuit board 14. The first sensing part 141 and the first part 131 of the thermally conductive component 13 are bonded and fixed together by the thermally conductive adhesive 40. The thermally conductive adhesive 40 is a non-conductive material with relatively good thermal conductivity. The thermally conductive adhesive 40 is at least partially located between the first sensing part 141 and the first part 131, which can prevent the first sensing part 141 and the first part 131 from directly contacting each other, reducing the risk of short circuit. Furthermore, the thermally conductive adhesive 40 can improve the stability of the relative position between the first sensing part 141 and the first part 131, ensuring that the minimum distance L between them meets the requirements of not being too far away or directly contacting each other.

[0040] The material of the heat-conducting component 13 can be a metal material. Of course, in other embodiments, the material of the heat-conducting component 13 can also be a non-metal material, such as a heat-conducting aluminum pillar, or a heat-conducting rubber filled with ceramic particles such as boron nitride and alumina.

[0041] refer to Figure 3 ,Figure 6 and Figure 7 As shown, the circuit board 14 has a first side surface 148 and a second side surface 149 located on opposite sides of its thickness direction. At least a portion of the second sensing part 142 and the through hole 220 are located on the side where the first sensing part 148 is located, and at least a portion of the first sensing part 141 and the cavity 24 are located on the side where the second side surface 149 is located. That is, the second sensing part 142 and the first sensing part 141 can be located on opposite sides of the thickness direction of the circuit board 14, and the second sensing part 142 can be disposed closer to the through hole 220. In this way, the second sensing part 142 can more accurately sense the temperature signal and / or humidity signal in the environment. The first sensing unit 141 can be positioned closer to the cavity 24. In this way, the first sensing unit 141 and the heat conductor 13 are close to each other, and the temperature sensed by the first sensing unit 141 is closer to the temperature transmitted by the heat conductor 13. Furthermore, the temperature of the environment surrounding the first sensing unit 141 is isolated from the second sensing unit 142 by the circuit board 14. The circuit board 14 can be a poor conductor of heat, which helps to improve the accuracy of the first sensing unit 141 in measuring the surface temperature of the object to be measured and makes it less likely to transfer heat to the second sensing unit 142. The ambient temperature signal sensed by the second sensing unit 142 is also relatively more accurate.

[0042] refer to Figure 2 , Figure 3 , Figure 4 , Figure 8 , Figure 9 and Figure 10 As shown, the outer casing 20 includes a first casing 21 and a second casing 22. Both the first casing 21 and the second casing 22 can be made of plastic, which is not only easy to process but also reduces costs. Furthermore, plastic has good heat insulation properties, which can isolate the heat from the object being measured, such as a heat exchanger. Along the height H direction of the sensor assembly 10, the second casing 22 is above the first casing 21, and the inner cavity 30 is located between the first casing 21 and the second casing 22. Both the first casing 21 and the second casing 22 may each have a portion of the inner cavity 30, or only one of the two casings may have the inner cavity 30. In one specific embodiment, the first casing 21 includes a bottom wall 211 and several side walls 212. The side walls 212 extend from the bottom wall 211 towards the second casing 22 and may be perpendicular to the bottom wall 211. The second casing 22 is fixed to the side walls 212 of the first casing 21. The first casing 21 and the second casing 22 can be fixedly connected, such as by laser welding or thermoforming welding, or they can be detachably connected by snap-fit ​​mechanisms. The circuit board 14 is fixedly mounted on the first shell 21. The bottom wall 211 of the first shell 21 is located on the side where the second side 149 of the circuit board 14 is located, and the second shell 22 is located on the side where the first side 148 of the circuit board 14 is located.

[0043] The first housing 21 has a stepped portion 214, which protrudes from the bottom wall 211 towards the side near the circuit board 14, and is located at the junction of the bottom wall 211 and the side wall 212. At least a portion of the stepped surface 2141 of the stepped portion 214 is in contact with the second side surface 149 of the circuit board 14, allowing the circuit board 14 to be supported on the stepped portion 214 for easy installation. The stepped portion 214 is surrounded by thermally conductive adhesive 40, and the circuit board 14 is bonded and fixed to the bottom wall 211 by the thermally conductive adhesive 40. The stepped portion 214 can form a circumferentially closed structure around the thermally conductive adhesive 40. The stepped portion 214 facilitates the application of adhesive to the bottom wall 211 of the first housing 21 and ensures a certain adhesive thickness, preventing the thermally conductive adhesive 40 from being squeezed out during the pressing process of the circuit board 14, thus affecting the fixing strength between the circuit board 14 and the bottom 211 of the first housing 21.

[0044] To facilitate the positioning of the heat-conducting component 13, the first shell 21 is also provided with a boss portion 215. The boss portion 215 protrudes from the bottom wall 211 toward the side near the inner cavity 30, and the boss portion 215 is arranged circumferentially around the top end portion 136 of the heat-conducting component 13.

[0045] refer to Figure 5 , Figure 11 , Figure 12 and Figure 13 As shown, a through hole 220 is provided in the second housing 22, and the number of through holes 220 is at least one. The second sensing part 142 and the through hole 220 are disposed opposite each other in at least a partial area along the thickness direction of the circuit board 14. This is beneficial for air entering the inner cavity 30 through the through hole 220 to reach the second sensing part 142 more quickly, which helps to improve the accuracy of the sensing signal of the second sensing part 142.

[0046] The sensor assembly 10 also includes a filter section 50, which is bonded to the second housing 22. (Ref) Figure 15 The filter section 50 has an edge region 501 and a central filter region 502. The edge region 501 is located on the outer periphery of the central filter region 502. The filter section 50 can be in the form of a thin film, and its shape can be rectangular, circular, elliptical, or other irregular shapes. The edge region 501 of the filter section 50 is bonded to the second shell 22. The central filter region 502 of the filter section 50 at least partially covers the side of the through hole 220 near the second sensing part 142, or at least a portion of the central filter region 502 of the filter section 50 covers the side of the through hole 220 away from the second sensing part 142. In this application, the filter section 50 is exemplified as being entirely located on the inner side of the second shell 22 near the cavity 30. The central filter region 503 of the filter section 50 can have a plurality of small holes. The aperture of these small holes can block foreign objects in solid or liquid form, while only allowing gaseous substances to enter the inner cavity 30. The filter section 50 can be a waterproof and dustproof breathable membrane.

[0047] For example, when the heat exchange device assembled with the sensor assembly 10 is installed in an environment such as a vehicle, a significant amount of liquid water may accumulate near the sensor assembly 10 during rain, car washes, or wading scenarios. If this liquid water enters the inner cavity 30 through the through-hole 220, the second sensing unit 142 will overestimate the humidity signal it senses due to the presence of this liquid water, affecting the accuracy of the dew point temperature calculation. Therefore, providing a filter 50 near the through-hole 220 can reduce the impact of sudden local humidity fluctuations on the accuracy of the actual humidity detection in the air environment. Solid foreign objects are generally dust, impurities, etc., while liquid foreign objects can be water droplets, other liquid fluids, etc. This can improve the detection performance of the second sensing unit 142 and extend its sensing lifespan.

[0048] In some embodiments provided in this application, the second shell 22 includes a base 221 and a cap 222 protruding from the base 221 toward the side away from the inner cavity 30. A through hole 220 is provided through the base 221. The cap 222 has a first sub-cavity 224 and an opening 225 communicating with the first sub-cavity 224. The first sub-cavity 224 communicates with the through hole 220, and the opening direction of the opening 225 does not coincide with the axial direction of the through hole 220. The axial direction of the through hole 220 can be set approximately along the height H direction of the sensor assembly 10. The opening direction of the opening 225 can be set horizontally perpendicular to the height H direction of the sensor assembly 10. The cap 222 provides a certain degree of protection for the filter section 50. This can prevent strong water flows such as rainwater or car wash water from washing away the thin film filter section 50 and affecting the measurement accuracy of temperature and humidity.

[0049] like Figure 3 , Figure 4 and Figure 13As shown, the first side 148 of the circuit board 14 is also provided with a plurality of circuit elements 143 electrically connected to the circuit board 14. In some embodiments, the circuit elements 143 may include a control computing unit, which may be a microcontroller. The control computing unit is mounted on the circuit board 14 and enables the sensor assembly 10 to have autonomous data processing capabilities, making the sensor assembly more intelligent. The circuit elements 143 can convert the electrical signals generated by the second sensing unit 142 and the first sensing unit 141 into more intuitive and easily identifiable signals, such as digital signals. In one specific embodiment, the control computing unit can directly output data on ambient temperature, ambient humidity, and the surface temperature of the object to be measured, such as the heat exchange tube and / or fins. Alternatively, the control computing unit can calculate the dew point temperature from the ambient temperature and ambient humidity sensed by the second sensing unit 142 and compare the dew point temperature with the surface temperature of the heat exchange tube and / or fins sensed by the first sensing unit 141. The output signal may be a judgment result on whether the heat exchange tube and / or fins are frosted, or a working instruction that needs to adjust the working state of the heat exchanger.

[0050] The second housing 22 is provided with a partition 226, which protrudes from the base 221 toward the side near the inner cavity 30. The free end of the partition 226 away from the base 221 is in contact with or clearance-fitted with the circuit board 14. At least some of the circuit elements 143 and the second sensing unit 142 are separated from each other by the partition 226. That is, at least some of the circuit elements 143 and the second sensing unit 142 are located on opposite sides of the thickness direction of the partition 226.

[0051] The partition 226 separates at least some of the circuit elements 143 and the second sensing unit 142. Some of the circuit elements 143 may generate heat during operation. The partition 226 can reduce the possibility that the heat generated by the circuit elements 143 during operation is directly transferred to the location of the second sensing unit 142, further reducing the impact of the heat generated by the circuit elements 143, such as the control computing unit, on the detection results of the second sensing unit 142, and improving the accuracy of the detection results.

[0052] The partition 226 can circumferentially enclose a portion of the current element 143 that generates significant heat. The partition 226 can have a notch 2261. The second housing 22 has a wiring harness mating hole 223, which penetrates the second housing 22. In some embodiments, the sensor assembly 10 also has a wire portion 145 adapted to the wiring harness mating hole 223. The wire portion 145 is electrically connected to the circuit board 14 and extends through the wiring harness mating hole 223 to the outside of the second housing 22 away from the inner cavity 30. A portion of the wire portion 145 may be located within the notch 2261, as shown in the reference diagram. Figure 13 and Figure 14As shown, the conductor portion 145 can extend from the circuit board through the notch 2261 and the wire harness mating hole 223 to the outside of the second housing 22. The root of the conductor portion 145 can be located on both sides of the partition 226 in the thickness direction with some circuit elements 143.

[0053] refer to Figure 8 The first housing 21 is also provided with at least one pin 26, which extends from the bottom wall 221 toward the side away from the inner cavity 30, and at least a portion of the surface of the pin 26 forms a plurality of outwardly protruding serrated structures. The pin 26 extends in the same direction as the second part 132 of the heat-conducting element 13.

[0054] During processing, the pin 26 can be integrally formed with the second shell 21 of the housing 20, or it can be formed separately and then assembled and fixed with the second shell 21. The second part 132 of the heat-conducting element 13 and the pin 26 are spaced apart along the length of the bottom wall 221, and the second part 132 of the heat-conducting element 13 and the pin 26 can be distributed in a straight line. In some specific embodiments, the first shell 21 can be provided with multiple pins 26, and each pin 26 and the second part 132 can be arranged in one direction, which is beneficial for fixing the relative positions of the sensor assembly 10 and the heat exchanger.

[0055] refer to Figure 16 and Figure 17 As shown, one embodiment of this application also provides a heat exchange device 100, including a heat exchanger 101 and the sensor assembly 10 in the above embodiments. The heat exchanger 101 includes at least one manifold 102, a plurality of heat exchange tubes 103 and at least one fin 104. The heat exchange tubes 101 are fixed to the manifold 102, and the inner cavity of the heat exchange tubes 101 is in communication with the inner cavity of the manifold 102. The fins 104 are located between two adjacent heat exchange tubes 103.

[0056] The sensor assembly 10 is fixed to the heat exchanger 101, and the second part 132 of the heat conductor 13 is in contact with at least a portion of the surface of the fins 104 and / or the surface of the heat exchange tube 103.

[0057] Specifically, the fins 104 can be corrugated fins, and the sensor assembly 10 can extend into the gaps of the fins 104 through its pins 26. The second part 132 of the heat-conducting element 13 can also extend into the gaps of the fins 104. The heat exchange tube 103 can be a microchannel flat tube, and the length of the second part 132 can be greater than, equal to, or less than the width of the heat exchange tube 103. Of course, the second part 132 of the heat-conducting element 13 can also directly contact the surface of the heat exchange tube 103 to detect the surface temperature of the heat exchange tube 103.

[0058] In some other embodiments, the sensor component 10 provided in this application can also be used to sense the surface temperature information of other products, or to determine whether other products are frosted, and is not limited to the application scenario of heat exchanger 101. For example, the sensor component 10 provided in this application can also be combined with the window glass of a vehicle to realize signal sensing and judgment of whether the window glass is frosted.

[0059] The above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. The understanding of this specification should be based on those skilled in the art. For example, the directional descriptions such as "front", "back", "left", "right", "up", and "down" are important. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.

Claims

1. A sensor assembly (10), characterized by The sensor assembly (10) comprises a housing (20) and a circuit assembly, the housing (20) has an inner cavity (30) in which at least part of the circuit assembly is accommodated, and the housing (20) is further provided with a through hole (220) communicating the inner cavity (30) with the outside; The circuit assembly comprises a circuit board (14), a first sensing part (141) and a second sensing part (142), the first sensing part (141) is electrically connected with the circuit board (14), and the second sensing part (142) is electrically connected with the circuit board (14), the first sensing part (141) is used for sensing a temperature signal of the environment around the first sensing part (141), and the second sensing part (142) is used for sensing at least one of a temperature signal and a humidity signal of the environment around the second sensing part (142); The first sensing part (141) and the second sensing part (142) are located on opposite sides of the thickness direction of the circuit board (14) respectively.

2. The sensor assembly (10) according to claim 1, characterized in that The circuit board (14) has a first side (148) and a second side (149) located on opposite sides of the thickness direction thereof; at least part of the second sensing part (142) and the through hole (220) are located on the side where the first side (148) is located; and at least part of the first sensing part (141) is located on the side where the second side (149) is located. The second sensing part (142) and the through hole (220) are oppositely arranged in at least part of the area along the thickness direction of the circuit board (14). The first sensing part (141) and the second sensing part (142) are surface soldered to the circuit board (14).

3. The sensor assembly (10) according to claim 2, characterized in that The housing (20) comprises a first shell (21) and a second shell (22); the inner cavity (30) is located between the first shell (21) and the second shell (22), the second shell (22) is fixed with the first shell (21), the through hole (220) is arranged on the second shell (22), and the number of the through hole (220) is at least one; The sensor assembly (10) further comprises a filter part (50), the filter part (50) has a rim area (501) and a central filter area (502), the rim area (501) is located at the outer periphery of the central filter area (502); the rim area (501) of the filter part (50) is bonded with the second shell (22), and the central filter area (501) of the filter part (50) is at least partially arranged on one side of the through hole (220) close to the second sensing part (142), or at least part of the central filter area (501) of the filter part (50) is arranged on one side of the through hole (220) away from the second sensing part (142); and the central filter area (501) of the filter part (50) is used for blocking foreign matters in solid or liquid state.

4. The sensor assembly (10) according to claim 3, characterized in that The first side (148) of the circuit board (14) is further provided with a plurality of circuit elements (143) electrically connected with the circuit board (14), and the second shell (22) is provided with a partition plate (226), at least part of the circuit elements (143) being separated from the second sensing part (142) by the partition plate (226).

5. The sensor assembly (10) according to claim 4, characterized in that The second shell (22) comprises a base (221) and a cap (222) protruding from the base (221) to a side away from the inner cavity (30), and the through hole (220) is arranged through the base (221); the cap (222) has a first sub-cavity (224) and an opening (225), the first sub-cavity (224) being in communication with the through hole (220) and the opening (225); and the opening direction of the opening (225) is not coincident with the axial direction of the through hole (220). The partition plate (226) protrudes from the base (221) to a side close to the inner cavity (30); and the free end of the partition plate (226) away from the base (221) is in contact with at least part of the first side (148) of the circuit board (14).

6. The sensor assembly (10) according to claims 3 to 5, characterized in that The sensor assembly (10) further comprises a heat-conducting adhesive (40); and the heat-conducting adhesive (40) is located at least partially on the side where the second side (149) of the circuit board (14) is located. The first shell (21) comprises a bottom wall (211) and a plurality of side walls (212), the side walls (212) extending from the bottom wall (211) to the second shell (22), and the second shell (22) is fixed with the side walls (212) of the first shell (21); the circuit board (14) is fixed to the first shell (21); the bottom wall (211) is located on the side where the second side (149) of the circuit board (14) is located, and the second shell (22) is located on the side where the first side (148) of the circuit board (14) is located. The first shell (21) is provided with a stepped portion (214) protruding from the bottom wall (211) to a side close to the inner cavity (30); the stepped portion (214) is arranged along the intersection of the bottom wall (211) and the side wall (212); the stepped surface (2141) of the stepped portion (214) is at least partially fitted with the second side (149) of the circuit board (14); the stepped portion (214) is arranged around the heat-conducting adhesive (40), and the circuit board (14) and the bottom wall (211) are fixedly bonded by the heat-conducting adhesive (40).

7. The sensor assembly (10) according to claims 1 to 5, characterized in that The sensor assembly (10) comprises a heat-conducting member (13), the shell (20) comprises a bottom wall (211), the bottom wall (211) has an inner side surface (300) and an outer side surface (400) located on opposite sides in the thickness direction of the bottom wall (211), and at least part of the circuit board (14) is located on the side where the inner side surface (300) of the bottom wall (211) is located. The heat-conducting member (13) is fixedly connected with the shell (20), the heat-conducting member (13) comprises a first part (131) and a second part (132), the second part (132) of the heat-conducting member (13) is located on the side of the outer side surface (400) of the bottom wall (211), the first part (131) of the heat-conducting member (13) extends from the second part (132) to the direction close to the inner cavity (30), the bottom wall (211) is arranged around at least part of the outer peripheral wall of the first part (131), the first part (131) of the heat-conducting member (13) is in direct contact with the first sensing part (141), or the minimum distance (L) between the first part (131) of the heat-conducting member (13) and the first sensing part (141) satisfies 0 < L ≤ 5 mm.

8. The sensor assembly (10) according to claim 7, characterized in that The bottom wall (211) is provided with a containing cavity (24) and first and second cavity openings (241, 242) located on both sides of the containing cavity (24), the first cavity opening (241) is arranged on the inner side surface (300) of the bottom wall (211), and the second cavity opening (242) is arranged on the outer side surface (400) of the bottom wall (211); the first part (131) of the heat-conducting member (13) is at least partially accommodated in the containing cavity (24), and the first part (131) is located on the side of the second cavity opening (242) close to the inner cavity (30), and the second part (132) of the heat-conducting member (13) is located on the side of the second cavity opening (242) away from the inner cavity (30).

9. The sensor assembly (10) according to claim 8, characterized in that The first part (131) of the heat-conducting member (13) comprises a top end part (136) and a first columnar part (137), and the second part (132) of the heat-conducting member (13) comprises a second columnar part (138); the first columnar part (137) is connected between the top end part (136) and the second columnar part (138); The top end part (136) is accommodated in the inner cavity (30), and the first columnar part (137) is accommodated in the containing cavity (24); the radial dimension of the first columnar part (137) and the radial dimension of the second columnar part (138) are both smaller than the radial dimension of the top end part (136), and the radial dimension of the top end part (136) is greater than the radial dimension of the containing cavity (24); The shell (20) is further provided with a boss part (215), the boss part (215) protrudes from the bottom wall (211) to the side close to the inner cavity (30), and the boss part (215) is circumferentially arranged around the top end part (136).

10. A heat exchange device (100), characterized in that The heat exchanger (101) comprises at least one header (102), a plurality of heat exchange tubes (103) and at least one fin (104), the heat exchange tubes (103) are fixed with the header (102), the inner cavities of the heat exchange tubes (103) are communicated with the inner cavity of the header (102); the fin (104) is located between two adjacent heat exchange tubes (103), and the sensor assembly (10) is fixed with the heat exchanger (101).

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