Method for electrically connecting amorphous material, electrically connecting device and electric performance testing circuit

Abstract

The application provides an electric connection method of amorphous material, an electric connection device and an electric performance test circuit. The method uses a metal plate electrically connected with an external circuit, applies pressure to the metal plate, and connects the metal plate with the amorphous material under the pressure, so that the amorphous material is electrically connected with the external circuit. Since the heating and welding operation of the amorphous material is not needed, the problem that the electric performance of the circuit is affected due to the heating and crystallization of the amorphous material is effectively solved. The electric performance test circuit of the amorphous material is formed by using the electric connection method, and the electric performance test accuracy of the amorphous material is improved by using the test circuit.

Description

Technical Field

[0001] This invention belongs to the field of amorphous materials technology, and particularly relates to electrical connection methods, electrical connection devices, and electrical performance testing circuits for amorphous materials. Background Technology

[0002] Currently, the common method for connecting amorphous materials to circuits is welding. This involves electrically connecting the amorphous material to the external circuit (i.e., forming a contact connection between the amorphous material and the external circuit, and this connection is conductive). However, this method heats the amorphous material, inevitably causing it to crystallize and affecting its performance, which in turn affects the electrical performance of the circuit. In particular, welding amorphous materials to testing instruments (e.g., soldering) can lead to inaccurate test results when testing the impedance and other electrical properties of amorphous materials.

[0003] In addition, the contact resistance is increased when using welding to connect amorphous materials, which not only increases power loss but also has a greater impact on circuit performance. This is especially true for structural materials with small cross-sections but large lengths, such as amorphous wires, where the contact resistance increases significantly after welding, greatly affecting circuit performance. Summary of the Invention

[0004] In view of the above-mentioned technical status, the present invention provides an electrical connection method for amorphous materials. This method can form an electrical connection between amorphous materials and external circuits, which solves the problem that heating the amorphous materials to crystallize them when forming an electrical connection between amorphous materials and external circuits using welding methods, thereby affecting circuit performance.

[0005] The technical solution provided by this invention is: an electrical connection method for amorphous materials, employing a substrate and a metal plate, wherein the metal plate is electrically connected to an external circuit, the amorphous material is located between the substrate and the metal plate, pressure is applied to the metal plate, and under the action of pressure, the metal plate and the amorphous material are connected together on the substrate (i.e., this connection is a pressure connection, or simply press-fit). Since the amorphous material is a conductive material and the metal plate is electrically connected to an external circuit, this connection is an electrical connection; the portion of the amorphous material connected to the metal plate is referred to as the connection portion.

[0006] The method of electrically connecting the metal plate to the external circuit is not limited; for example, it can be connected by welding, bonding, pressure bonding, or by connecting with connectors. Considering that the contact resistance is relatively large and difficult to control during welding, it is preferable to use connecting with connectors or pressure bonding.

[0007] The structure of the amorphous material is not limited, and it can be in the form of a bulk, rod (generally with a cross-sectional diameter in the range of 500 micrometers to 10 millimeters), filament (generally with a cross-sectional diameter in the range of 5 micrometers to 500 micrometers), etc.

[0008] Amorphous materials generally have a higher hardness than metal plates. When the metal plate is pressed together with the connecting part to form an electrical connection, contact resistance exists. The contact resistance varies depending on the size of the contact area, and a smaller contact area is preferable, especially for rod-shaped amorphous materials (i.e., amorphous rods) or filamentous amorphous materials (i.e., amorphous wires). When the electrical connection is a line contact, the contact resistance is very high, which greatly affects the electrical performance of the circuit. Therefore, it is preferable that the hardness of the metal plate is lower than that of the amorphous material, and that the metal plate deforms under pressure to form a covering structure on the connecting part, thereby increasing the contact area with the amorphous material. At this time, one or more of the hardness, thickness, and cross-sectional dimensions of the metal plate can be adjusted to allow the metal plate to deform under pressure. However, in actual operation, the metal plate cannot be directly reused after deformation. Considering economic efficiency, it is preferable that the metal plate does not deform under pressure and remains flat (at this time, one or more of the hardness, thickness, and cross-sectional dimensions of the metal plate can be adjusted to allow the metal plate to remain flat under pressure). Therefore, the present invention proposes a preferred technical solution as follows:

[0009] The metal plate is made of a first metal material, referred to as the first metal plate; a thin sheet material made of a second metal is used, referred to as the second metal foil. The second metal foil is disposed between the amorphous material and the first metal plate. Under pressure, the first metal plate, the second metal foil, and the connecting part are electrically connected together on the substrate. The second metal foil deforms under pressure, covering the connecting part, thereby increasing the contact area between the second metal foil and the connecting part and reducing the contact resistance.

[0010] As a further preferred technical solution, a sheet-like material made of a third metal, referred to as a third metal foil, is also included. The third metal foil is disposed between the connecting portion and the substrate. Under pressure, the first metal plate, the second metal foil, the connecting portion, and the third metal foil are electrically connected together on the substrate. At least one of the second metal foil and the third metal foil deforms under pressure, forming a coating on the connecting portion, thereby increasing the contact area between the second metal foil, the third metal foil, and the connecting portion, and reducing the contact resistance.

[0011] As a more preferred technical solution, the second metal foil and the third metal foil have a connecting end, that is, at the connecting end, the second metal foil and the third metal foil are connected together, and the connecting portion is preferably close to the connecting end. Under pressure, the connecting end easily forms a coating on the amorphous material. As one implementation, the second metal foil is folded in half to form a top-bottom layer structure connected at one end, and the connecting portion is placed between the top and bottom layers; that is, the bottom layer can be considered as the third metal foil, and the fold position is the connecting end. Alternatively, the third metal foil is folded in half to form a top-bottom layer structure connected at one end, and the connecting portion is placed between the top and bottom layers; that is, the top layer can be considered as the second metal foil, and the fold position is the connecting end.

[0012] Preferably, the thickness of the second metal foil is in the range of 1 micrometer to 100 micrometers.

[0013] Preferably, the thickness of the third metal foil is in the range of 1 micrometer to 100 micrometers.

[0014] The first metal and the second metal may be the same or different.

[0015] The first metal and the third metal may be the same or different.

[0016] Preferably, the second metal has a lower hardness than the first metal, making it easier to deform under pressure.

[0017] Preferably, the hardness of the third metal is less than that of the first metal, and it is easily deformed under pressure.

[0018] The first metal is not limited, and can be, for example, copper, aluminum, silver, tin, nickel, palladium, etc.

[0019] The second metal is not limited, and can be, for example, copper, aluminum, silver, tin, nickel, palladium, etc.

[0020] The third metal is not limited, and can be, for example, copper, aluminum, silver, tin, nickel, palladium, etc.

[0021] The amorphous material is not limited, and may include, for example, iron-based amorphous materials (e.g., Fe-Si-B amorphous materials, i.e., the constituent elements mainly include Fe, Si, and B, as described similarly below), cobalt-based amorphous materials (e.g., Co-Fe-Si-B), nickel-based amorphous materials (e.g., Ni-P / Cr), zirconium-based amorphous materials (e.g., Zr-Cu-Al), copper-based amorphous materials (e.g., Cu-Zr), aluminum-based amorphous materials (e.g., Al-Y-Ni), titanium-based amorphous materials (e.g., Ti-Zr-Cu), magnesium-based amorphous materials (e.g., Mg-Cu-Y), and rare earth-based amorphous materials (e.g., Gd-Co / Tb-Fe).

[0022] The substrate material is not limited and can be either metallic or non-metallic. Alternatively, the substrate can be made of a first metallic material.

[0023] The electrical connection method of the present invention can be used to form an electrical performance testing circuit for amorphous materials, and to test the electrical performance of the amorphous materials, as detailed below:

[0024] An electrical performance testing circuit for an amorphous material, wherein the substrate comprises two substrates, referred to as a first substrate and a second substrate; and the metal plate comprises two metal plates, referred to as metal plate A and metal plate B.

[0025] One end of the amorphous material is located between the first substrate and the metal plate A. The metal plate A is electrically connected to the first electrode. Pressure is applied to the metal plate A, and under the pressure, the metal plate A and one end of the amorphous material are connected together on the first substrate.

[0026] The other end of the amorphous material is located between the second substrate and the metal plate B. The metal plate B is electrically connected to the second electrode. Pressure is applied to the metal plate B, and under the pressure, the metal plate B and the other end of the amorphous material are connected together on the second substrate.

[0027] When a voltage is applied between the first electrode and the second electrode, current flows through the amorphous material to form a conductive circuit. This circuit can be used to test the electrical properties of the amorphous material; that is, a conductive circuit is formed between the first electrode and the second electrode in the working state. The electrical properties are not limited and include one or more of the following: resistance, impedance, etc.

[0028] The present invention also provides an apparatus for realizing the electrical connection method of the amorphous material, comprising an insulating fixing stage, the substrate, the metal plate and a pressure application mechanism;

[0029] The substrate is fixed on the fixing platform; the metal plate is electrically connected to the external circuit.

[0030] The pressure application mechanism includes a pressure head and a structural unit that can drive the pressure head to rise and fall.

[0031] The pressure head is connected to the metal plate;

[0032] In operation, the connecting part is placed on the substrate, and the pressure head falls under the drive of the structural unit, and the metal plate presses on the connecting part, so that the metal plate and the connecting part are connected together.

[0033] Preferably, the structural unit can also control the pressure generated by the pressure head.

[0034] The structure of the structural unit is not limited. For example, the structural unit includes a pressure plate and a spring. The pressure plate is connected to the support surface through the spring, and the front end of the pressure plate is connected to the pressure head. The lifting and lowering of the front end of the pressure plate is realized through the lever principle, and the pressure is adjusted by the elastic deformation of the spring.

[0035] This device can be used to construct an electrical performance testing device for amorphous materials. Specifically, the electrical performance testing device for amorphous materials includes the fixed stage, two substrates, referred to as the first substrate and the second substrate; two metal plates, referred to as metal plate A and metal plate B; and two pressure application mechanisms, referred to as the first pressure application mechanism and the second pressure application mechanism.

[0036] The first pressure application mechanism includes a first pressure head and a first structural unit that can drive the first pressure head to lift and fall.

[0037] The second pressure application mechanism includes a second pressure head and a second structural unit that can drive the second pressure head to lift and fall.

[0038] The first pressure head is connected to the metal plate A;

[0039] The second pressure head is connected to the metal plate B;

[0040] In operation, one end of the amorphous material is placed on the first substrate. Under the drive of the first structural unit, the first pressure head falls, and the metal plate A presses against one end of the amorphous material, connecting the metal plate A to one end of the amorphous material. The other end of the amorphous material is placed on the second substrate. Under the drive of the second structural unit, the second pressure head falls, and the metal plate B presses against the other end of the amorphous material, connecting the metal plate B to the other end of the amorphous material. The metal plate A is electrically connected to the first electrode, and the metal plate B is electrically connected to the second electrode. A voltage is applied between the first electrode and the second electrode, and current flows through the amorphous material to form a conductive circuit.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] (1) The present invention provides a cold pressing electrical connection method for amorphous materials (i.e., pressure connection without heat treatment). A substrate and a metal plate are used. Pressure is applied to the metal plate to connect the metal plate to the amorphous material. Since the metal plate is electrically connected to the external circuit, the amorphous material forms an electrical connection with the external circuit. When a closed loop is formed with the external circuit, a conductive circuit is formed. Therefore, the present invention connects the external circuit through the conductive connection of the metal plate, thereby eliminating the need for heating and welding of the amorphous material and effectively avoiding the problem that the electrical performance of the circuit is affected by the crystallization of the amorphous material due to heating.

[0043] (2) The electrical connection method of the present invention can be used in the electrical performance testing circuit of amorphous materials, which can avoid the problem that the electrical performance testing accuracy of amorphous materials is affected by heating and crystallization. It is an electrical performance testing circuit of amorphous materials that can provide high testing accuracy.

[0044] (3) In the electrical connection method of amorphous materials of the present invention, in order to reduce the contact resistance of amorphous materials caused by pressing, it is preferable to provide a thin sheet of metal material (referred to as metal foil) between the metal plate and the amorphous material. When pressure is applied to the metal plate by the pressure application mechanism, the metal foil deforms under the pressure and forms a coating on the amorphous material, thereby increasing the contact area between the metal foil and the amorphous material and reducing the contact resistance;

[0045] (4) The electrical connection device for amorphous materials provided by the present invention has a simple structure. The electrical properties of amorphous materials can be tested using this device, which can reduce interference caused by other factors and improve the accuracy of the test. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of an electrical connection method for amorphous materials.

[0047] Figure 2 This is a schematic diagram of an optimized electrical connection method for amorphous materials.

[0048] Figure 3 This is a schematic diagram of another optimized electrical connection method for amorphous materials.

[0049] Figure 4 yes Figure 3 A schematic diagram showing the connection between the second and third metal foils.

[0050] Figure 5 Under pressure Figure 4 Enlarged schematic diagram of the second metal foil, the connecting part, and the third metal foil.

[0051] Figure 6 This is a schematic diagram of an electrical performance testing circuit for an amorphous material.

[0052] Figure 7 This is a schematic diagram of an electrical connection device made of amorphous material.

[0053] Figure 8 This is a schematic diagram of a device for testing the electrical properties of amorphous materials.

[0054] Figure 1-8The numerical markings are as follows: amorphous material 10, substrate 20, metal plate 30, connection part between amorphous material and metal plate 11, first metal plate 31, second metal foil 32, third metal foil 33, connection end 50, metal plate A31-1, metal plate B31-2, first substrate 21, second substrate 22, fixed platform 60, pressure head 71, manual pressure handle 72, spring pad 73, base 77, nut 79, front end of pressure plate 80, bolt 82. Detailed Implementation

[0055] The present invention will be further described in detail below with reference to the embodiments. It should be noted that the embodiments described below are intended to facilitate the understanding of the present invention. Non-essential improvements and adjustments made to the present invention by those skilled in the art based on the above description of the present invention are still within the protection scope of the present invention.

[0056] In this invention, the terms "including" and "comprising" should be interpreted as including rather than exclusive or exhaustive; that is, "including but not limited to".

[0057] In this invention, terms such as "first," "second," "third," and "fourth" should be interpreted as being used to modify various constituent elements, regardless of their order and / or importance, and are only used to distinguish one constituent element from another, without limiting the corresponding constituent element.

[0058] like Figure 1 As shown, the electrical connection method for the amorphous material 10 employs a substrate 20 and a metal plate 30. The metal plate 30 is electrically connected to an external circuit, and the amorphous material 10 is located between the substrate 20 and the metal plate 30. Pressure is applied to the metal plate 30, and under the pressure, the metal plate 30 and the amorphous material 10 are connected together on the substrate 20. The portion of the amorphous material 10 connected to the metal plate 30 is designated as the connection portion 11. Since the amorphous material is a conductive material, and the metal plate 30 is electrically connected to the external circuit, the amorphous material 10 and the external circuit form an electrical connection. When the amorphous material 10 and the external circuit form a closed loop, a conductive circuit is constituted.

[0059] The method of electrically connecting the metal plate 30 to the external circuit is not limited; for example, it can be connected by welding, bonding, pressure bonding, or by connecting with connectors. Considering that the contact resistance is relatively large and difficult to control during welding, it is preferable to use connecting with connectors or pressure bonding.

[0060] In some embodiments, such as Figure 1 As shown, the amorphous material 10 is a filamentous amorphous material with a diameter of 25 micrometers, i.e., an amorphous filament. In some embodiments, the molecular formula of the amorphous filament material is Co. 66 Fe4Si 14Mo2. In some embodiments, the amorphous material 10 may be in the form of a bulk, rod (e.g., with a cross-sectional diameter in the range of 500 micrometers to 10 millimeters), or filament (e.g., with a cross-sectional diameter in the range of 5 micrometers to 500 micrometers, excluding 25 micrometers).

[0061] The hardness of the amorphous material 10 is generally greater than that of the metal plate 30. When the metal plate 30 and the connecting part 11 are pressed together to form an electrical connection, there is contact resistance. The contact resistance varies depending on the size of the contact area, and it is preferable to have a smaller contact area, especially for rod-shaped amorphous materials (i.e., amorphous rods) or filamentous amorphous materials (i.e., amorphous filaments). When the electrical connection is a line contact, the contact resistance is very large, which has a great impact on the electrical performance of the circuit. Therefore, it is preferable that the hardness of the metal plate 30 is less than that of the amorphous material 10, and the metal plate 30 undergoes slight deformation under pressure to form a covering structure on the connecting part 11, thereby increasing the contact area with the amorphous material. At this time, one or more of the hardness, thickness, and cross-sectional dimensions of the metal plate are adjusted to meet the requirement that the metal plate deforms under pressure. For example, in some embodiments, the diameter of the amorphous material is 120 micrometers and the thickness of the metal plate is about 2 millimeters. However, in practice, once the metal plate 30 deforms, it cannot be directly reused. Considering economic efficiency, it is preferable for the metal plate 30 to remain flat without deforming under pressure. In this case, one or more of the hardness, thickness, and cross-sectional dimensions of the metal plate can be adjusted to ensure that the metal plate does not deform under pressure. A preferred embodiment is proposed as follows:

[0062] like Figure 2 As shown, the metal plate 30 is made of a first metal material and is referred to as the first metal plate 31; a thin sheet material made of a second metal (referred to as the second metal foil 32) is disposed between the amorphous material 10 and the first metal plate 31. Under pressure, the first metal plate 31, the second metal foil 32 and the connecting part 11 are electrically connected together on the substrate 20, and the second metal foil 32 deforms under the pressure to cover the connecting part 11, thereby increasing the contact area between the second metal foil 32 and the connecting part 11 and reducing the contact resistance.

[0063] As a further preferred embodiment, such as Figure 3 As shown, it also includes a sheet-like material made of a third metal (denoted as third metal foil 33). The third metal foil 33 is disposed between the connecting portion 11 and the substrate 20. Under pressure, the first metal plate 31, the second metal foil 32, the connecting portion 11, and the third metal foil 33 are electrically connected together on the substrate 20. At least one of the second metal foil 32 and the third metal foil 33 deforms under pressure, forming a covering on the connecting portion 11, thereby increasing the contact area between the second metal foil 32, the third metal foil 33 and the connecting portion 11 and reducing the contact resistance.

[0064] As a more preferred embodiment, such as Figure 4 As shown, the second metal foil 32 and the third metal foil 33 have a connection end 50, that is, at the connection end 50, the second metal foil 32 and the third metal foil 33 are connected together, and the connection part 11 is closer to the connection end 50. Under pressure, the connection end 50 can easily form a coating on the amorphous material 10.

[0065] In some embodiments, the second metal foil 32 is folded in half to form a top-bottom layer structure with one end connected, and the connecting portion 11 of the amorphous material 10 is placed between the top and bottom layers. That is, the bottom layer can be regarded as the third metal foil 33, and the fold position is the connecting end 50. Alternatively, the third metal foil 33 is folded in half to form a top-bottom layer structure with one end connected, and the connecting portion 11 of the amorphous material 10 is placed between the top and bottom layers. That is, the top layer can be regarded as the second metal foil 32, and the fold position is the connecting end 50. An enlarged schematic diagram of the second metal foil 32, the connecting portion 11, and the third metal foil 33 under pressure is shown below. Figure 5 As shown, the second metal foil 32 and the third metal foil 33 deform under pressure, and the connecting end 50 covers the connecting part 11 of the amorphous material 10.

[0066] In some embodiments, the thickness of the first metal plate 31 is approximately 2 millimeters.

[0067] In some embodiments, the thickness of the second metal foil 32 is in the range of 1 micrometer to 100 micrometers.

[0068] In some embodiments, the thickness of the third metal foil 33 is in the range of 1 micrometer to 100 micrometers.

[0069] The first, second, and third metals can be the same or different from each other, and can be selected from copper, aluminum, silver, tin, nickel, palladium, etc. Considering that they are easily deformed under pressure, it is preferable that the hardness of the second metal is less than that of the first metal, and the hardness of the third metal is preferably less than that of the first metal.

[0070] The amorphous material is not limited to 10, and can be iron-based amorphous material (e.g., Fe-Si-B), cobalt-based amorphous material (e.g., Co-Fe-Si-B), nickel-based amorphous material (e.g., Ni-P / Cr), zirconium-based amorphous material (e.g., Zr-Cu-Al), copper-based amorphous material (e.g., Cu-Zr), aluminum-based amorphous material (e.g., Al-Y-Ni), titanium-based amorphous material (e.g., Ti-Zr-Cu), magnesium-based amorphous material (e.g., Mg-Cu-Y), or rare earth-based amorphous material (e.g., Gd-Co / Tb-Fe).

[0071] The material of the substrate 20 is not limited; for example, it can be a metallic material or a non-metallic material. In some embodiments, the substrate 20 may also be made of a first metallic material.

[0072] The electrical connection method of the amorphous material 10 can be used to form an electrical performance testing circuit for the amorphous material 10, and to test the electrical performance of the amorphous material, as follows:

[0073] like Figure 6 As shown, an electrical performance testing circuit for an amorphous material 10 includes two substrates, referred to as the first substrate 21 and the second substrate 22, and two metal plates, referred to as metal plate A31-1 and metal plate B31-2.

[0074] One end of the amorphous material 10 is located between the first substrate 21 and the metal plate A31-1. The metal plate A31-1 is electrically connected to the first electrode. Pressure is applied to the metal plate A31-1 to connect the metal plate A31-1 and one end of the amorphous material 10 together on the first substrate 21.

[0075] The other end of the amorphous material 10 is located between the second substrate 22 and the metal plate B31-2. The metal plate B31-2 is electrically connected to the second electrode. Pressure is applied to the metal plate B31-2, and the metal plate B31-2 is connected to the other end of the amorphous material 10 on the second substrate 22.

[0076] When a voltage is applied between the first electrode and the second electrode, and current flows through the amorphous material 10 to form a conductive circuit, that is, the first electrode, metal plate A31-1, amorphous material 10, metal plate B31-2 and the second electrode form a conductive loop. The electrical properties of the amorphous material 10 can be tested using this circuit.

[0077] Figure 6 The two ends of the amorphous material 10 can also be used Figure 2 , 3 The electrical connection method in section 4.

[0078] This embodiment also provides a device for electrical connection of amorphous materials, such as... Figure 7 As shown, it includes an insulating fixing platform 60, a base plate 20, a metal plate 30, and a pressure application mechanism 70; the base plate 20 is fixed on the fixing platform 60; the metal plate 30 is electrically connected to an external circuit.

[0079] The pressure application mechanism 70 includes a pressure head 71 and a structural unit that can drive the pressure head to rise and fall;

[0080] The pressure head 71 is connected to the metal plate 30;

[0081] In the working state, one end of the amorphous material 10 is placed on the substrate 20. Under the drive of the structural unit, the pressure head 71 falls and the metal plate 30 presses against the connecting part 11, so that the metal plate 30 and the connecting part 11 are connected together.

[0082] In some embodiments, the structural unit can also control the pressure generated by the pressure head 71.

[0083] Figure 7 The middle metal plate 30 and the connecting part 11 can also be adopted Figure 2 , 3 The electrical connection method in section 4, that is, the device further includes a first metal plate 31, a second metal foil 32, or further includes a first metal plate 31, a second metal foil 32 and a third metal foil 33.

[0084] When this device is used to test the electrical properties of the amorphous material, such as Figure 7 As shown, the same device is also provided at the other end of the amorphous material 10. The metal plates 30 at both ends are electrically connected to the first electrode and the second electrode, respectively. When a voltage is applied between the first electrode and the second electrode, and current flows through the amorphous material 10 to form a conductive circuit, the electrical properties of the amorphous material 10 can be tested using this circuit. The structure of the structural unit is not limited. For example, in some embodiments, such as... Figure 8 As shown, the structural unit adopts a horizontal quick clamp of model GH-201-SS from Shenzhen Bogong Hardware Co., Ltd., whose base 77 is connected to the fixed platform 60 by bolts 82, nuts 79 and spring washers 73. The pressing plate includes a manual pressing handle 72 and a pressing plate front end 80. The pressing plate front end 80 is connected to the pressing head 71. The lifting and lowering of the pressing plate front end 80 is realized by lever principle, and the pressure is adjusted by the elastic deformation of the spring washers 73.

[0085] Using a 120-micrometer-diameter iron-based amorphous wire as a sample, Figure 7 , 8 The device shown is used as a testing device. Figure 7 The middle metal plate 30 and the two ends of the sample are used Figure 3 , 4The electrical connection method described in the test device is used to test the electrical performance of the sample. The substrate 20 and metal plate 30 are both copper plates. During pressing, both ends of the sample are placed on the two substrates 20 respectively. Driven by the structural unit, the pressing head falls, connecting the two metal plates to both ends of the sample. A voltage is applied between the first and second electrodes, and current flows through the sample to form a conductive circuit. The electrical performance of the sample is tested using this circuit. The measured results are: resistance 1.488 ohms; under the conditions of 0.4 Gs (geomagnetic field), 100 kHz, and 1 mA, the test results are: geomagnetic field impedance 3.14388 ohms, phase angle 33.6572 degrees, and the calculated inductance value is 2.72 μH. In contrast, this testing device was used, but the two ends of the sample were electrically connected to two substrates by soldering. One end of the sample was electrically connected to the first electrode, and the other end was electrically connected to the second electrode. The same voltage was applied between the first and second electrodes, and the current flowed through the sample to form a conductive circuit. The electrical performance of the sample was tested using this circuit, and the results were as follows: resistance was 2.604 ohms; under the conditions of 0.4 Gs (geomagnetic field), 100 kHz, and 1 mA, the results were as follows: geomagnetic field impedance was 5.97103 ohms, phase angle was 14.9873 degrees, and the inductance was calculated to be 2.46 μH. The comparison shows that compared with soldering, crimping can significantly reduce the contact resistance value. Compared with crimping, soldering leads to contact resistance contamination, resulting in a falsely high total impedance and a severely reduced phase angle, which masks the true inductive characteristics of the material. It cannot restore the intrinsic electromagnetic properties of the material and cannot provide true reference data for improving material performance. This inaccuracy is more obvious when testing low-resistance materials, high magnetic fields, and high frequencies. However, the crimping method can significantly reduce the contact resistance and the influence of material heating and welding crystallization, thereby significantly improving the test accuracy.

[0086] The above embodiments provide a detailed description of the technical solution of the present invention. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, additions, or similar substitutions made within the scope of the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circuit for testing the electrical properties of amorphous materials, characterized in that: A substrate and a metal plate are used, the metal plate being electrically connected to an external circuit, and an amorphous material being located between the substrate and the metal plate. Pressure is applied to the metal plate, and under the pressure, the metal plate and the amorphous material are connected together on the substrate; the portion of the amorphous material that is connected to the metal plate is referred to as the connecting portion. The substrate includes two substrates, referred to as the first substrate and the second substrate; the metal plate includes two metal plates, referred to as metal plate A and metal plate B. One end of the amorphous material is located between the first substrate and the metal plate A. The metal plate A is electrically connected to the first electrode. Pressure is applied to the metal plate A, and under the pressure, the metal plate A and one end of the amorphous material are connected together on the first substrate. The other end of the amorphous material is located between the second substrate and the metal plate B. The metal plate B is electrically connected to the second electrode. Pressure is applied to the metal plate B, and under the pressure, the metal plate B and the other end of the amorphous material are connected together on the second substrate. In operation, a voltage is applied between the first electrode and the second electrode, and current flows through the amorphous material to form a conductive circuit.

2. The electrical performance testing circuit for amorphous materials as described in claim 1, characterized in that: The metal plate is made of a first metal material and is referred to as the first metal plate; a thin sheet material made of a second metal is referred to as the second metal foil. The second metal foil is disposed between the amorphous material and the first metal plate. Under pressure, the first metal plate, the second metal foil and the connecting part are electrically connected together on the substrate, and the second metal foil deforms under pressure to cover the connecting part.

3. The electrical performance testing circuit for amorphous materials as described in claim 2, characterized in that: It also includes a sheet-like material made of a third metal, referred to as a third metal foil, which is disposed between the connecting portion and the substrate. Under pressure, the first metal plate, the second metal foil, the connecting portion, and the third metal foil are connected together on the substrate, and at least one of the second metal foil and the third metal foil deforms under pressure to cover the connecting portion.

4. The electrical performance testing circuit for amorphous materials as described in claim 3, characterized in that: The second metal foil and the third metal foil have a connecting end, and the connecting portion is close to the connecting end.

5. The electrical performance testing circuit for amorphous materials as described in claim 4, characterized in that: The second metal foil is folded in half to form an upper and lower layer structure connected at one end, and the connecting part is placed between the upper and lower layers; or, the third metal foil is folded in half to form an upper and lower layer structure connected at one end, and the connecting part is placed between the upper and lower layers.

6. The electrical performance testing circuit for amorphous materials as described in claim 1, characterized in that: The amorphous material is in the form of a block, rod, or filament.

7. The electrical performance testing circuit for amorphous materials as described in claim 3, characterized in that: The thickness of the second metal foil is in the range of 1 micrometer to 100 micrometers; or / and the thickness of the third metal foil is in the range of 1 micrometer to 100 micrometers.

8. An apparatus for realizing an electrical connection method for amorphous materials, characterized in that: The electrical connection method of the amorphous material employs a substrate and a metal plate, with the metal plate electrically connected to an external circuit. The amorphous material is located between the substrate and the metal plate. Pressure is applied to the metal plate, and under the pressure, the metal plate and the amorphous material are connected together on the substrate. The portion of the amorphous material connected to the metal plate is referred to as the connection portion. The device includes an insulating fixing platform, the substrate, the metal plate, and a pressure application mechanism; The substrate is fixed on the fixing platform; the metal plate is electrically connected to the external circuit. The pressure application mechanism includes a pressure head and a structural unit that can drive the pressure head to rise and fall. The pressure head is connected to the metal plate; In operation, the connecting part is placed on the substrate, and the pressure head falls under the drive of the structural unit, and the metal plate presses on the connecting part, so that the metal plate and the connecting part are connected together.

9. The apparatus as claimed in claim 8, characterized in that: The metal plate is made of a first metal material and is referred to as the first metal plate; a thin sheet material made of a second metal is referred to as the second metal foil. The second metal foil is disposed between the amorphous material and the first metal plate. Under pressure, the first metal plate, the second metal foil and the connecting part are electrically connected together on the substrate, and the second metal foil deforms under pressure to cover the connecting part.

10. The apparatus as claimed in claim 9, characterized in that: It also includes a sheet-like material made of a third metal, referred to as a third metal foil, which is disposed between the connecting portion and the substrate. Under pressure, the first metal plate, the second metal foil, the connecting portion, and the third metal foil are connected together on the substrate, and at least one of the second metal foil and the third metal foil deforms under pressure to cover the connecting portion.

11. The apparatus of claim 10, characterized in that: The second metal foil and the third metal foil have a connecting end, and the connecting portion is close to the connecting end.

12. The apparatus of claim 11, characterized in that: The second metal foil is folded in half to form an upper and lower layer structure connected at one end, and the connecting part is placed between the upper and lower layers; or, the third metal foil is folded in half to form an upper and lower layer structure connected at one end, and the connecting part is placed between the upper and lower layers.

13. The apparatus as claimed in claim 8, characterized in that: The amorphous material is in the form of a block, rod, or filament.

14. The apparatus as claimed in claim 10, characterized in that: The thickness of the second metal foil is in the range of 1 micrometer to 100 micrometers; or / and the thickness of the third metal foil is in the range of 1 micrometer to 100 micrometers.

15. An electrical performance testing device for amorphous materials, characterized in that: The device includes the apparatus according to any one of claims 8 to 14, wherein the substrate comprises two substrates, referred to as a first substrate and a second substrate; the metal plate comprises two metal plates, referred to as metal plate A and metal plate B; and the pressure applying mechanism comprises two pressure applying mechanisms, referred to as a first pressure applying mechanism and a second pressure applying mechanism. The first pressure application mechanism includes a first pressure head and a first structural unit that can drive the first pressure head to lift and fall. The second pressure application mechanism includes a second pressure head and a second structural unit that can drive the second pressure head to lift and fall. The first pressure head is connected to the metal plate A; The second pressure head is connected to the metal plate B; In operation, one end of the amorphous material is placed on the first substrate. Under the drive of the first structural unit, the first pressure head falls, and the metal plate A presses against one end of the amorphous material, connecting the metal plate A to one end of the amorphous material. The other end of the amorphous material is placed on the second substrate. Under the drive of the second structural unit, the second pressure head falls, and the metal plate B presses against the other end of the amorphous material, connecting the metal plate B to the other end of the amorphous material. The metal plate A is electrically connected to the first electrode, and the metal plate B is electrically connected to the second electrode. A voltage is applied between the first electrode and the second electrode, and current flows through the amorphous material to form a conductive circuit.

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