High-frequency blind hole circuit board manufacturing process and equipment thereof
By designing a support platform and a reciprocating moving mechanism, and combining ultrasonic cleaning and air drying technologies, the problems of high cost and high energy consumption in the transportation process of high-frequency blind via circuit board manufacturing equipment have been solved. Automated copper plating and electroplating have been achieved, improving the convenience of equipment operation and maintenance and the quality of the plating layer.
Patent Information
- Application Number
- CN202511834371.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-08
- Publication Date
- 2026-02-27
AI Technical Summary
Existing high-frequency blind via circuit board manufacturing equipment requires multiple driving components to work together precisely during the transfer process, resulting in high costs, high energy consumption, and inconvenient operation and maintenance.
The design incorporates a support platform, reciprocating movement mechanism, guiding components, and partitions. The circuit board is guided sequentially into the cleaning tank, copper plating tank, and electroplating tank via a sliding trough and trapezoidal blocks. Combined with ultrasonic cleaning and air drying technologies, the copper plating and electroplating processes are automated.
It reduces equipment costs, decreases energy consumption, improves ease of operation and maintenance, and ensures the density and uniformity of the coating.
Smart Images

Figure CN121586170A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board manufacturing technology, specifically a process and equipment for manufacturing high-frequency blind via circuit boards. Background Technology
[0002] High-frequency blind via circuit boards refer to blind via circuit boards designed for high frequencies. They are mainly used in high-frequency applications. They increase the wiring density on the circuit board by using tiny blind vias, thereby improving signal transmission speed and reducing signal interference.
[0003] The prior art discloses Chinese Patent No. CN 112714556 B: a fully automatic VCP electroplating device for horizontal copper plating of circuit boards, which discloses a circuit board copper plating mechanism, a transfer robotic arm and a circuit board electroplating mechanism. The transfer robotic arm is used to transfer the circuit board that has completed copper plating to the electroplating station for electroplating. During the electroplating process, multiple sets of lifting drive units are used in conjunction with suction cups to transfer the circuit board.
[0004] However, the aforementioned existing technologies still have certain drawbacks. In the process of use, the transfer of the circuit board requires precise coordination between multiple driving components, which is not only costly and energy-intensive, but also inconvenient for later maintenance. Summary of the Invention
[0005] The purpose of this invention is to provide a high-frequency blind via circuit board manufacturing process and equipment to solve the problems mentioned in the background art.
[0006] The objective of this invention can be achieved through the following technical solutions: A high-frequency blind via circuit board manufacturing equipment, comprising: The support platform has a processing chamber in the middle. The upper surface of the support platform is provided with a reciprocating moving mechanism on one side of the processing chamber. The reciprocating moving mechanism includes a sliding groove, a sliding seat that slides along the sliding groove, a moving seat fixed on the top of the sliding seat, a column rod that is installed through the top of the moving seat, a supporting part installed on one end of the column rod, and a clamping part installed on the supporting part. The guiding assembly includes a U-shaped frame fixed to the upper surface of the support platform and facing the processing chamber, and three trapezoidal blocks fixed to the middle of the inner side of the U-shaped frame; A partition is installed inside the processing chamber. There are four partitions, and each trapezoidal block is located at the midpoint between two adjacent partitions.
[0007] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, four partitions divide the processing chamber into a turnover pool, a cleaning pool, a copper deposition pool, an electroplating pool and a control pool arranged in sequence from left to right, and an ultrasonic vibration plate is arranged in the cleaning pool.
[0008] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the three trapezoidal blocks are all arranged in isosceles trapezoidal structures, and the thickness of the trapezoidal block corresponding to the cleaning pool is twice the thickness of the trapezoidal blocks corresponding to the copper deposition pool and the electroplating pool.
[0009] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the lifting part comprises a base block fixedly connected to the end of the column, a strip column vertically and movably arranged at the center of the base block, a ring plate one movably arranged at the outer side of the two ends of the strip column, a straight spring one fixedly connected to the ring plate one and the base block, and a top column fixedly arranged at the two end faces of the strip column.
[0010] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the clamping part comprises two groups, each group comprising two clamping parts, and each group of two clamping parts is arranged on the two sides of the corresponding end of the strip column, the clamping part comprises a jig disc and an L-shaped rod fixedly connected to the strip column, the other end of the L-shaped rod is fixedly connected to a disc, an embedding groove is arranged at the end face of one end of the disc, and the jig disc is rotatably embedded in the disc at one end.
[0011] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, a clamping assembly is arranged between the L-shaped rod and the jig disc, the clamping assembly comprises two symmetrically arranged clamping grooves arranged at the end face of one end of the jig disc extending into the embedding groove, and a clamping column movably arranged in the L-shaped rod and the disc, the clamping column is located on the movement track of the jig disc when the jig disc rotates, and the end of the clamping column away from the disc is fixedly connected to a blocking disc and a ring plate two movably arranged on the outer side of the clamping column, the blocking disc and the ring plate two are fixedly connected to a straight spring two arranged on the outer side of the clamping column. The clamping assembly further comprises a gear ring fixedly arranged on the outer side of the jig disc and a gear rack fixedly arranged on the inner side of the processing chamber, and the gear ring and the gear rack are engaged when the gear ring moves to the position of the gear rack.
[0012] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the reciprocating movement mechanism further comprises a turnover part, the turnover part comprises a gear fixedly arranged at the other end of the column, an adjustment guide seat symmetrically arranged with respect to the vertical axis of the sliding groove, and a base plate fixedly arranged on the top of the bearing table and opposite to the gear, a gear block is fixedly arranged on the upper surface of the base plate at the position corresponding to the turnover chamber, and the gear block is located on the movement track of the gear moving to the processing station.
[0013] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the reciprocating moving mechanism further comprises a limiting part, the limiting part comprises a sink groove formed on the upper end of the moving seat, a ring groove formed on the outer side of the column rod, a ring block sleeved in the ring groove, and a guide column fixed on the outer side of the ring block, the sink groove is composed of a column groove and a square groove connected with each other, circular holes connected with the column groove are formed on both sides of the moving seat, the column rod is movably arranged in the column groove, and the guide column is movably arranged in the square groove. The limiting part further comprises a limiting assembly for preventing displacement of the column rod, the limiting assembly comprises a through groove formed at both ends of the square groove, a through hole formed on both sides of the square groove, a plug rod movably arranged in the through hole, a straight plate movably arranged in the through groove, and two clamping holes formed on the outer side of the guide column. One end of the plug rod extending to the outside of the sink groove is fixedly connected with a profile bar, the other end of the profile bar is fixedly connected with an anti-skid arc plate, a limiting plate is fixedly arranged on the outer side of the moving seat corresponding to the position of the plug rod, a limiting groove opposite to the limiting plate is formed on one end of the profile bar, the limiting plate is movably inserted into the limiting groove, and a connecting spring corresponding to the profile bar and the moving seat is sleeved on the outer side of the plug rod.
[0014] As a preferred scheme of the high-frequency blind hole circuit board manufacturing equipment, the reciprocating moving mechanism further comprises a limiting part, the limiting part comprises a sink groove formed on the upper end of the moving seat, a ring groove formed on the outer side of the column rod, a ring block sleeved in the ring groove, and a guide column fixed on the outer side of the ring block, the sink groove is composed of a column groove and a square groove connected with each other, circular holes connected with the column groove are formed on both sides of the moving seat, the column rod is movably arranged in the column groove, and the guide column is movably arranged in the square groove.
[0015] The application further provides a manufacturing method for copper plating and copper plating of blind holes on a circuit board by using the high-frequency blind hole circuit board manufacturing equipment. S1, loading: the circuit board to be processed is installed on the jig disc by using a mechanical arm or manual operation, and clamped by using the clamping jig on the jig disc; S2, processing: a. driving the moving seat to move along the sliding groove to sequentially pass through the control pool, the cleaning pool, the copper plating pool, the electroplating pool, and the control pool, to complete downward turning, ultrasonic cleaning, copper plating, electroplating, and switching the orientation of the material; b. driving the moving seat to retreat along the sliding groove to the cleaning pool to complete secondary ultrasonic cleaning, and triggering the air drying process when retreating from the cleaning pool to the inside of the turning pool to complete blowing and drying of the residual liquid in the blind hole; S3, unloading: the material after blowing and drying is unloaded, and new material to be processed is loaded for the next round of processing.
[0016] The application has the following beneficial effects: 1. The application guides the circuit board into the cleaning pool, copper deposition pool and electroplating pool in turn through the multiple groups of trapezoidal blocks inside the U-shaped frame during the forward rotation of the screw, to complete the ultrasonic cleaning, copper deposition and electroplating of the circuit board, and during the reverse rotation of the screw, the circuit board after electroplating is sunk into the cleaning pool for secondary ultrasonic cleaning, and the liquid remaining on the blind hole side of the circuit board after secondary ultrasonic cleaning is blown dry by air drying; 2. The application controls the alternate engagement of the gear and the tooth block on the base plate by using the two centrally symmetric adjustment guides, to complete the automatic indexing of the lifting part and the natural air drying of the liquid remaining on the non-blind hole side of the circuit board. 3. The application drives the 180° reverse rotation of the jig disc during the movement of the lifting part in the area where the control pool is located, to reduce the resistance of the liquid in the cleaning pool to the lifting part. DETAILED DESCRIPTION
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description, and obviously, other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings; Figure 1 is the first perspective view of the overall structure of the application; Figure 2 is the second perspective view of the overall structure of the application; Figure 3 is the schematic view of the bearing table structure of the application; Figure 4 is the schematic view of the guide assembly structure of the application; Figure 5 is the schematic view of the limiting part structure of the reciprocating movement mechanism of the application; Figure 6 is the schematic view of the limiting part structure of the reciprocating movement mechanism of the application; Figure 7 is the schematic view of the lifting part structure of the reciprocating movement mechanism of the application; Figure 8 is the schematic view of the clamping part structure of the reciprocating movement mechanism of the application; Figure 9 is the schematic view of the clamping part structure of the reciprocating movement mechanism of the application; Figure 10 is the schematic view of the installation of the circuit board on the jig disc of the application; Figure 11 is the schematic view of the blind hole structure on the circuit board of the application.
[0018] The figure marks are as follows: 1, bearing table; 2, processing bin; 3, guiding assembly; 31, U-shaped frame; 32, trapezoidal block; 4, reciprocating moving mechanism; 41, overturning part; 411, adjusting guide seat; 412, base plate; 413, gear; 42, limiting part; 421, sink groove; 422, ring block; 423, ring groove; 424, guide column; 425, straight plate; 426, clamping hole; 427, through groove; 428, through hole; 429, profile bar; 4210, limiting groove; 4211, limiting plate; 4212, anti-skid arc plate; 43, lifting part; 431, base block; 432, strip column; 433, ring plate one; 434, straight spring one; 435, top column; 44, clamping part; 441, L-shaped rod; 442, disc; 443, jig disc; 444, gear ring; 445, clamping groove; 446, clamping column; 447, blocking disc; 448, ring plate two; 449, straight spring two; 4410, gear rack; 5, partition plate; 6, ultrasonic vibration plate; 7, sliding groove; 8, moving seat; 9, sliding seat; 10, column rod; 11, infrared range finder; 12, air tank; 13, air pump. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
[0020] The high-frequency blind hole circuit board manufacturing equipment of the present application belongs to a part of the electronic core industry, and is one of the equipment for manufacturing printed circuit boards, which is used for copper plating and electroplating on the inner wall of the blind hole on the blind hole circuit board to form a dense, bright and uniform plating layer inside the blind hole on the circuit board.
[0021] Embodiment 1: refer to the description attached Figures 1-4 The present application provides a high-frequency blind hole circuit board manufacturing equipment, comprising: The bearing table 1 is provided with a processing bin 2 in the middle, and the upper surface of the bearing table 1 is provided with a reciprocating moving mechanism 4 on one side of the processing bin 2, the reciprocating moving mechanism 4 comprises a sliding groove 7, a sliding seat 9 is slidingly connected inside the sliding groove 7, a moving seat 8 is fixedly arranged on the top of the sliding seat 9, a column rod 10 is rotationally installed at the top end of the moving seat 8 in a penetrating manner, a lifting part 43 is installed at one end of the column rod 10, and a clamping part 44 is installed on the lifting part 43, wherein a screw rod driven to rotate by a driving motor installed on the outer side of the bearing table 1 is rotationally installed inside the sliding groove 7, and the sliding seat 9 is threadedly sleeved on the outer side of the screw rod; The guiding assembly 3 comprises a U-shaped frame 31 fixed on the upper surface of the bearing table 1 opposite to the processing bin 2 and three trapezoidal blocks 32 fixed in the middle of the inner side of the U-shaped frame 31. The partition plate 5 is arranged in the processing bin 2, and the processing bin 2 is divided into four partition plates 5, and each trapezoidal block 32 is arranged at the midpoint between two adjacent partition plates 5.
[0022] Further, the four partition plates 5 divide the processing bin 2 into a turnover pool, a cleaning pool, a copper deposition pool, an electroplating pool and a control pool arranged in sequence from left to right (see Figure 2 The power supply used in the electroplating process is arranged in the control pool, and the pulse electroplating is selected in the electroplating process to form a dense, bright and uniform plating layer on the surface of the copper deposition layer in the blind hole of the circuit board, improve the toughness of the plating layer, and complete the copper deposition layer and the electroplating layer in the blind hole of the processed circuit board as shown in Figure 11 The ultrasonic vibration plate 6 is installed in the cleaning pool, and the frequency, intensity and the like of the ultrasonic vibration plate 6 can be adjusted according to the actual electroplating plating layer to avoid damage to the plating layer in the blind hole during the ultrasonic cleaning process. The three trapezoidal blocks 32 are arranged in the middle of the cleaning pool, the copper deposition pool and the electroplating pool, respectively.
[0023] It should be noted that the driving motor is used to drive the screw to rotate forward and backward alternately to drive the sliding seat 9 to move back and forth along the sliding groove 7. When the driving screw rotates forward, the moving seat 8 moves with the sliding seat 9 from the turnover pool to the control pool. In the initial state or at the position between the two adjacent trapezoidal blocks 32, the lowest point of the lifting part 43 carrying the target material (hereinafter referred to as target material) is just above or higher than the upper surface of the partition plate 5, and in the process of passing through the three trapezoidal blocks 32 in sequence, it will enter the cleaning pool, the copper deposition pool and the electroplating pool in sequence under the guidance of the corresponding trapezoidal block 32 to perform ultrasonic cleaning, blind hole inner wall copper deposition and blind hole inner wall copper deposition layer surface electroplating, respectively. Conversely, when the driving screw rotates reversely, the moving seat 8 will move with the sliding seat 9 from the control pool to the turnover pool.
[0024] Further, as shown in Figure 2 and Figure 7As shown, the lifting part 43 comprises a base block 431 fixedly connected to the end of the column 10, and a strip column 432 vertically movably arranged in the center of the base block 431, wherein the strip column 432 is provided in the form of a four-angled prism with four rounded edges, which can effectively prevent the strip column 432 from rotating axially during movement along the sliding groove 7. The outer sides of the two ends of the strip column 432 are movably sleeved with a ring plate one 433 and a straight spring one 434 fixedly connected between the corresponding ring plate one 433 and the base block 431, so that the relative position of the strip column 432 can be limited by the two straight springs one 434 located at the top and bottom of the base block 431. The two end faces of the strip column 432 are fixedly provided with a top column 435, and the end of the top column 435 is provided in the form of a hemispherical structure.
[0025] It should be noted that, during the process of lifting the target material along the sliding groove 7 to the direction of the processing station by the lifting part 43, the top column 435 at the upper end of the lifting part 43 is pressed by the trapezoidal block 32 when the lifting part 43 moves to the corresponding position, so that the strip column 432 gradually moves downward under the guidance of the inclined edge of the corresponding trapezoidal block 32, and the target material carried on the clamping part 44 at the bottom end of the strip column 432 sinks into the corresponding processing area for processing. After the top column 435 at the upper end of the strip column 432 is separated from the pressing of the corresponding trapezoidal block 32, the target material carried on the clamping part 44 at the bottom end of the strip column 432 will be separated from the processing area of the corresponding processing station.
[0026] Further, as shown in Figures 7-9 The clamping part 44 is provided with two groups, each group having two clamping parts, and the two clamping parts of each group are arranged on the two sides of the corresponding end of the strip column 432. The clamping part 44 comprises a jig disc 443 and an L-shaped rod 441 fixedly connected with the strip column 432. The other end of the L-shaped rod 441 is fixedly connected with a disc 442, and the end face of one end of the disc 442 is provided with an embedding groove. The one end of the jig disc 443 is rotatably embedded in the inside of the disc 442 through a bearing, wherein the workpiece clamping side of the jig disc 442 is further provided with a clamping jig (using existing mature technology, not specifically shown in the figure), and the installation position of the target material on the jig disc 443 is as shown in Figure 10 As shown, the clamping part 44 is provided with two groups, each group having two clamping parts, and the two clamping parts of each group are arranged on the two sides of the corresponding end of the strip column 432. The clamping part 44 comprises a jig disc 443 and an L-shaped rod 441 fixedly connected with the strip column 432. The other end of the L-shaped rod 441 is fixedly connected with a disc 442, and the end face of one end of the disc 442 is provided with an embedding groove. The one end of the jig disc 443 is rotatably embedded in the inside of the disc 442 through a bearing, wherein the workpiece clamping side of the jig disc 442 is further provided with a clamping jig (using existing mature technology, not specifically shown in the figure), and the installation position of the target material on the jig disc 443 is as shown in
[0027] Further, the L-shaped rod 441 and the jig disc 443 are provided with a clamping assembly, the clamping assembly comprises two symmetrically arranged clamping grooves 445 opened on the end face of the jig disc 443 extending into the embedding groove, and a clamping column 446 movably penetrating the L-shaped rod 441 and the disc 442 in sequence, the clamping column 446 is on the movement track of the jig disc 443 when rotating, wherein one end of the clamping groove 445 and the clamping column 446 is provided with a hemispherical structure, which facilitates the clamping column 446 to be separated from the corresponding clamping groove 445 during the rotation of the jig disc 443, and the end of the clamping column 446 away from the disc 442 is fixedly connected with a baffle 447 and a ring plate two 448 movably sleeved outside the clamping column 446, the baffle 447 and the ring plate two 448 are fixedly connected with a straight spring two 449 sleeved outside the clamping column 446, when the straight spring two 449 is in a natural state (i.e. the state shown in Figure 9 ), the spherical section of the clamping column 446 is just completely inserted into the corresponding clamping groove 445, and in order to improve the clamping effect of the jig disc 443, the ring plate two 448 can be fixedly installed outside the L-shaped rod 441, at this time, the straight spring two 449 is in a stretched state as shown in Figure 9 , which can ensure that the clamping column 446 is tightly inserted into the corresponding clamping groove 445.
[0028] It should be noted that in the process of clamping the target material by the clamping part 44, the target material is installed on the jig disc 443 according to a specific arrangement (as shown in Figure 10 ) by using a mechanical arm or manual operation, and clamped by using the clamping jig on the jig disc 443, and then the orientation of the jig disc 443 is adjusted, so that the end of the clamping column 446 is inserted into the hemispherical clamping groove 445 on the jig disc 443 opposite to the clamping column 446 under the action of the straight spring two 449, the position of the jig disc 443 is limited, and the target material maintains a specific orientation during the circulation between the stations.
[0029] Example 2: refer to the attached Figures 3-4 and Figure 8The second embodiment of the present application is different from the first embodiment in that the reciprocating movement mechanism 4 further comprises a turnover part 41, which comprises a gear 413 fixed to the other end of the columnar rod 10, an adjusting guide base 411 arranged in central symmetry about the vertical axis of the sliding groove 7, and a base plate 412 fixed to the top of the bearing table 1 and opposite to the gear 413. The adjusting guide base 411 is composed of a square column fixed to the upper surface of the bearing table 1 and a guide groove plate fixed to the top end of the square column, and the slots in the two guide groove plates are arranged in staggered manner. A tooth block is fixed to the upper surface of the base plate 412 at a position corresponding to the turnover bin, and the thickness of the tooth block is equal to the thickness of the gear 413, while the sum of the thicknesses of the tooth block and the gear 413 is less than the width of the base plate 412. The tooth block is located on the movement trajectory of the gear 413 towards the processing station.
[0030] Further, the reciprocating movement mechanism 4 further comprises a limiting part 42, which comprises a sink groove 421 opened at the upper end of the moving seat 8, a ring groove 423 opened at the outer side of the columnar rod 10, a ring block 422 sleeved in the ring groove 423, and a guide column 424 fixed to the outer side of the ring block 422. The sink groove 421 is composed of a column groove and a square groove connected in communication, and circular holes connected in communication with the column groove are opened at both sides of the moving seat 8. The columnar rod 10 is movably penetrated in the column groove, and the guide column 424 is movably penetrated in the square groove. The diameter of the columnar rod 10 is equal to the hole diameter of the circular hole, the outer diameter of the ring block 422 is greater than the diameter of the columnar rod 10, and the diameter of the guide column 424 is equal to the width of the square groove, so that the guide column 424 drives the columnar rod 10 to stably move in a straight line in the area where the sink groove 421 is located.
[0031] Further, the limiting part 42 further comprises a limiting assembly for preventing the columnar rod 10 from moving, which comprises a through groove 427 opened at both ends of the square groove, a through hole 428 opened at both sides of the square groove, a plug rod movably penetrated in the through hole 428, a straight plate 425 movably penetrated in the through groove 427, and two clamping holes 426 opened at the outer side of the guide column 424. The clamping hole 426 and the end of the plug rod inserted into the clamping hole are also provided in a hemispherical structure, which ensures that the guide column 424 can smoothly push the plug rod away from the corresponding clamping hole 426 under the guidance of the guide groove plate of the adjusting guide base 411, and the straight plate 425 always remains in a state of being penetrated in the corresponding through groove 427 during the process of moving the columnar rod 10 in a straight line by using the guide column 424 to push the columnar rod 10; One end of the insertion rod extending to the outside of the recess 421 is fixedly connected to a profile 429, and the other end of the profile 429 is fixedly connected to an anti-slip arc plate 4212. A limiting plate 4211 is fixedly provided on the outside of the movable seat 8 at the position corresponding to the insertion rod. One end of the profile 429 has a limiting groove 4210 that is directly opposite to the limiting plate 4211. The limiting plate 4211 is movably inserted into the limiting groove 4210. Through the cooperation of the limiting plate 4211 and the limiting groove 4210, the anti-slip arc plate that fits against the column rod 10 can be ensured. The plate 4212 and the column rod 10 are concentrically arranged. The outer side of the insertion rod is fitted with a connecting spring that fixes the corresponding strip 429 and the movable seat 8. When one end of the insertion rod extends into the square groove and is inserted into the corresponding card hole 426, the corresponding connecting spring is still stretched. In this way, it can be ensured that the anti-slip arc plate 4212 is tightly pressed against the surface of the column rod 10, thereby preventing the column rod 10 from rotating due to fluid resistance during the processing of the target material.
[0032] It should be noted that the process of driving the lifting unit 43 carrying the target material to move between various workstations specifically includes the following two parts: In the first process, by controlling the screw to rotate forward, the rotating screw drives the moving base 8 to move from the tilting pool towards the control pool along with the sliding base 9. During this process, the gear 413 is vertically coplanar with the toothed block on the base plate 412, and is located at the left end (refer to...). Figure 2 The end of the insertion rod is tightly pressed against the inside of the corresponding hole 426 on the guide post 424. At the same time, the anti-slip arc plate 4212 located on the left end is tightly attached to the outside of the column rod 10 between the moving seat 8 and the base block 431, thereby limiting the column rod 10 and the guide post 424 at the current position. When the lifting part 43 moves to the area of the control pool, as the moving seat 8 continues to move, the guide post 424 begins to enter the inclined groove section of the guide groove plate on the right end adjustment guide seat 411, and under the guidance of the inclined groove section, the guide post 424 moves towards the gear 413. During this process, gear 413 moves synchronously with the guide post 424, and the left-end insertion rod is gradually pushed away from the corresponding locking hole. Then, the straight plate 425, which moves synchronously with the guide post 424, blocks the left-end insertion rod, while the right-end insertion rod is gradually released from the blocked state. When the guide post 424 is separated from the slotted section of the right-end guide plate, the right-end insertion rod is inserted into the corresponding locking hole 426 under the tension and restoring force of the corresponding connecting spring. At the same time, the right-end anti-slip arc plate 4212 tightly fastens the outside of the column rod 10 between gear 413 and moving seat 8, and gear 413 moves to a state completely displaced from the tooth block, and then enters process two. Process two, by controlling the reverse rotation of the screw, the rotating screw drives the moving seat 8 to move with the slide 9 from the control pool to the direction of the turnover pool, during which the gear 413 does not intersect with the movement of the moving seat 8, and after the lifting part 43 moves to the area of the turnover pool, the movement process of the guide column 424, the column rod 10, the plug rod and the straight plate 425 is the same as process one, only the orientation is different.
[0033] Embodiment 3: refer to the description attached Figure 2 and Figures 5-6 This embodiment is the third embodiment of the present application, which is different from the second embodiment: the clamping assembly further comprises a gear ring 444 fixedly sleeved outside the jig disc 443 and a rack 4410 fixed inside the processing bin 2, the gear ring 444 is engaged with the rack 4410 when it moves to the position of the rack 4410, and this engagement state is the state when the top column 435 on the lifting part 43 carrying the target material is guided away from the trapezoidal block 32, and the rack 4410 can be arranged on the corresponding side of the advancing direction of the lifting part 43 or the corresponding side of the retreating direction, for driving the jig disc 443 to rotate 180° during the advancing or retreating of the lifting part 43, so as to adjust the orientation of the target material.
[0034] Further, the three trapezoidal blocks 32 are all arranged in isosceles trapezoidal structure, and the thickness of the trapezoidal block 32 corresponding to the cleaning pool is twice the thickness of the trapezoidal block 32 corresponding to the copper deposition pool and the electroplating pool, wherein the thickness of the trapezoidal block 32 corresponding to the copper deposition pool and the electroplating pool is equal to the diameter of the top column 435, and is equal to the distance of the movement of the guide column 424 under the guidance of the adjusting guide 411, which can ensure that the lifting part 43 will not contact the trapezoidal block 32 corresponding to the copper deposition pool and the electroplating pool during the retreating of the lifting part 43 under the reverse rotation of the screw, and under the guidance of the trapezoidal block 32 corresponding to the cleaning pool, the target material after electroplating will be sent into the cleaning pool for secondary ultrasonic cleaning, so as to completely remove the impurities such as plating solution and oil stains remaining on the surface of the electroplated part, and ensure the quality and appearance of the plating layer.
[0035] Still further, the infrared range finder 11 and the air tank 12 are fixedly installed at one end of the U-shaped frame 31 inside the U-shaped frame 31 close to the turnover pool, and the air pump 13 for supplying gas into the air tank 12 is fixedly installed outside the U-shaped frame 31, and the air exhaust pipe is communicated outside the air tank 12, wherein the infrared range finder 11 is installed on the path of the retreating of the lifting part 43, and the horizontal distance between the top column 435 on the lifting part 43 and the air tank 12 can be detected by the infrared range finder 11, for controlling the air pump 13 to work, so that the wind blown out of the air exhaust pipe can blow dry the water remaining on the surface of the target material after secondary ultrasonic cleaning, to avoid subsequent corrosion or quality problems of the electroplated part.
[0036] It should be noted that in the aforementioned process one, when the lifting part 43 is separated from the guiding of the trapezoidal block 32 in the area of the electroplating tank and enters the area of the control tank, as the lifting part 43 continues to move, the gear ring 444 installed on the outside of the jig disc 443 will be engaged with the corresponding gear rack 4410, and under the action of the gear rack 4410, the jig disc 443 is driven to rotate 180°, ensuring that the target material in the lifting part 43 has resistance to the liquid in the tank when it is withdrawn to the area of the cleaning tank.
[0037] In summary, the working principle of the high-frequency blind hole circuit board manufacturing equipment is as follows: after the installation of the target material (i.e. the target material is installed on each clamping part 44), the driving screw is driven to rotate forward, the lifting part 43 is rotated 180° under the meshing action of the gear 413 and the gear block in the area of the turnover tank, the target material installed on the upper end of the lifting part 43 is turned over and enters the cleaning tank, and then as the lifting part 43 moves horizontally, the target material at the lower end will move downward under the guidance of the corresponding trapezoidal block 32, sink into the cleaning liquid in the cleaning tank and complete the first ultrasonic cleaning, after the first ultrasonic cleaning, the target material at the lower end will move upward under the guidance of the corresponding trapezoidal block 32, enter the copper deposition station, and the copper deposition process is the same as the ultrasonic cleaning process, and the electroplating process is also the same, after the electroplating is completed, the jig disc 443 on the lifting part 43 will be rotated 180° under the guidance of the corresponding gear rack 4410, and then the driving screw is reversed to make the lifting part 43 retreat, and when it retreats to the area of the cleaning tank, it will sink into the cleaning tank for the second ultrasonic cleaning under the guidance of the corresponding trapezoidal block 32; After the second cleaning is completed, when the infrared distance meter 11 detects that the top column 435 on the lifting part 43 at the upper end enters the corresponding area of the turnover tank, it will transmit a signal to the control end, and the control end will start the air pump 13 to work, and the air blown out by the exhaust pipe is used to blow dry the residual moisture in the blind hole of the circuit board, after blowing dry, the circuit board is not removed temporarily, and the above process is repeated to make the initially turned over target material turn over downward to enter the corresponding processing station for cleaning, and the initially turned over target material after processing is turned over upward, and the residual liquid on the non-blind hole side of the circuit board after one round of processing is naturally dried in the second round of processing, and the target workpiece after two rounds of processing enters the area of the turnover tank for blowing dry, the circuit board on the upper end of the lifting part 43 is removed, and a new target circuit board is installed.
[0038] In the above technical solution, the air pump 13 is a diaphragm air pump with a model number of D08L; the ultrasonic vibration plate 6 is an ultrasonic vibration plate with a model number of KP-1012; and the infrared distance meter 11 is an infrared distance meter with a model number of SW-E60. Further, in the above technical solution, the processing station can be lengthened according to the copper deposition and electroplating process requirements of the blind hole of the circuit board, such as roughening (micro-etching), activation, and desmear before copper deposition, and multi-stage processing during electroplating, but cleaning is required after processing in each station to avoid cross-contamination.
[0039] Based on the above embodiments, the application further provides a manufacturing method for copper deposition and electroplating of blind holes on a circuit board using the above high-frequency blind hole circuit board manufacturing equipment, which specifically includes the following operation steps: S1, loading: using a mechanical arm or manual operation to install the to-be-processed circuit board on the jig disc 443, and clamping using the clamping jig on the jig disc 443; S2, processing: a. driving the moving seat 8 to move along the sliding groove 7 to sequentially pass through the control pool, the cleaning pool, the copper deposition pool, the electroplating pool, and the control pool, to complete the downward turning, ultrasonic cleaning, copper deposition, electroplating, and switching the orientation of the material; b. driving the moving seat 8 to retreat along the sliding groove 7 to the cleaning pool to complete the second ultrasonic cleaning, and when retreating from the cleaning pool to the inside of the turning pool, triggering the air drying process to complete the blowing dry of the liquid remaining in the blind hole; S3, unloading: unloading the material after blowing dry, and replacing it with new to-be-processed material to enter the next round of processing.
[0040] The above shows and describes the basic principles, main features, and advantages of the application. Those skilled in the art should understand that the application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the application. Without departing from the spirit and scope of the application, various changes and improvements can be made to the application, and these changes and improvements all fall within the scope of the claimed application.
Claims
1. A high-frequency blind via circuit board manufacturing equipment, characterized in that, include: A support platform (1) is provided in the middle of the support platform (1), and a reciprocating moving mechanism (4) is provided on the upper surface of the support platform (1) on one side of the processing chamber (2). The reciprocating moving mechanism (4) includes a sliding groove (7), a sliding seat (9) that slides along the sliding groove (7), a moving seat (8) fixed on the top of the sliding seat (9), a column rod (10) that is installed through the top of the moving seat (8), a lifting part (43) installed on one end of the column rod (10), and a clamping part (44) installed on the lifting part (43). The guide assembly (3) includes a U-shaped frame (31) fixed on the upper surface of the support platform (1) and facing the processing chamber (2), and three trapezoidal blocks (32) fixed in the middle of the inner side of the U-shaped frame (31). A partition (5) is provided inside the processing chamber (2). There are four partitions (5), and each trapezoidal block (32) is located at the midpoint between two adjacent partitions (5).
2. The high-frequency blind via circuit board manufacturing equipment according to claim 1, characterized in that, The four partitions (5) divide the processing chamber (2) into a flipping pool, a cleaning pool, a copper plating pool, an electroplating pool and a control pool arranged sequentially from left to right. An ultrasonic vibration plate (6) is installed inside the cleaning pool, and three trapezoidal blocks (32) are respectively located in the middle of the corresponding cleaning pool, copper plating pool and electroplating pool.
3. The high-frequency blind via circuit board manufacturing equipment according to claim 2, characterized in that, All three trapezoidal blocks (32) are configured as isosceles trapezoidal structures, and the thickness of the trapezoidal block (32) corresponding to the cleaning pool is twice the thickness of the trapezoidal block (32) corresponding to the copper plating pool and the electroplating pool.
4. The high-frequency blind via circuit board manufacturing equipment according to claim 1, characterized in that, The supporting part (43) includes a base block (431) fixedly connected to the end of the column (10). A strip column (432) is vertically and movably inserted through the center of the base block (431). A ring plate (433) and a straight spring (434) fixedly connected to the corresponding ring plate (433) and the base block (431) are movably sleeved on the outer sides of both ends of the strip column (432). A top column (435) is fixedly provided on both ends of the strip column (432).
5. The high-frequency blind via circuit board fabrication equipment according to claim 4, characterized in that, The clamping part (44) is provided in two sets, two in each set, and the two in each set are respectively located on both sides of the corresponding end of the bar column (432). The clamping part (44) includes a jig disc (443) and an L-shaped rod (441) fixedly connected to the bar column (432). The other end of the L-shaped rod (441) is fixedly connected to a disc (442). A groove is provided on the end face of one end of the disc (442). One end of the jig disc (443) is rotatably fitted into the disc (442) through a bearing.
6. The high-frequency blind via circuit board fabrication equipment according to claim 5, characterized in that, A locking assembly is provided between the L-shaped rod (441) and the jig plate (443). The locking assembly includes two symmetrically arranged slots (445) opened on one end face of the jig plate (443) extending into the groove, and a locking post (446) that moves through the L-shaped rod (441) and the disc (442) in sequence. The locking post (446) is on the movement trajectory when the jig plate (443) rotates. A baffle (447) is fixedly connected to the end of the locking post (446) away from the disc (442), and a ring plate (448) is movably sleeved on the outside of the locking post (446). A straight spring (449) is fixedly connected between the baffle (447) and the ring plate (448) and sleeved on the outside of the locking post (446). The positioning assembly also includes a gear ring (444) fixedly sleeved on the outside of the jig disc (443) and a rack (4410) fixed on the inside of the processing chamber (2). When the gear ring (444) moves to the position of the rack (4410), the two mesh.
7. The high-frequency blind via circuit board fabrication equipment according to claim 2, characterized in that, The reciprocating moving mechanism (4) also includes a flipping part (41), which includes a gear (413) fixed to the other end of the column (10), an adjustment guide (411) arranged symmetrically about the vertical axis of the sliding groove (7), and a base plate (412) fixed on the top of the support platform (1) opposite to the gear (413). A tooth block is fixed on the upper surface of the base plate (412) at the position corresponding to the flipping chamber, and the tooth block is located on the movement trajectory of the gear (413) moving towards the processing station.
8. The high-frequency blind via circuit board fabrication equipment according to claim 1, characterized in that, The reciprocating moving mechanism (4) also includes a limiting part (42), which includes a groove (421) opened at the upper end of the moving seat (8), an annular groove (423) opened on the outside of the column rod (10), an annular block (422) sleeved inside the annular groove (423), and a guide post (424) fixed on the outside of the annular block (422). The groove (421) is composed of a column groove and a square groove connected together. Both sides of the moving seat (8) are provided with round holes connected to the column groove. The column rod (10) is movably inserted inside the column groove, and the guide post (424) is movably inserted inside the square groove. The limiting part (42) also includes a limiting component for preventing the column rod (10) from shifting. The limiting component includes through slots (427) at both ends of the square slot, through holes (428) on both sides of the square slot, a plug rod that is movably inserted into the through hole (428), a straight plate (425) that is movably inserted into the through slot (427), and two locking holes (426) on the outside of the guide post (424). One end of the insertion rod extending to the outside of the sinker (421) is fixedly connected to a profile strip (429), and the other end of the profile strip (429) is fixedly connected to an anti-slip arc plate (4212). A limiting plate (4211) is fixedly provided on the outside of the movable seat (8) at the position corresponding to the insertion rod. A limiting groove (4210) is opened at one end of the profile strip (429) and is directly opposite to the limiting plate (4211). The limiting plate (4211) is movably inserted into the limiting groove (4210). A connecting spring is sleeved on the outside of the insertion rod to fix the corresponding profile strip (429) and the movable seat (8).
9. A high-frequency blind via circuit board fabrication equipment according to claim 2, characterized in that, An infrared rangefinder (11) and a wind chamber (12) are fixedly installed on the inner side of the U-shaped frame (31) near the tipping pool. An air pump (13) for supplying gas to the inside of the wind chamber (12) is fixedly installed on the outer side of the U-shaped frame (31). An exhaust pipe is connected to the outer side of the wind chamber (12).
10. A high-frequency blind via circuit board manufacturing process, comprising using the high-frequency blind via circuit board manufacturing equipment as described in any one of claims 1-9 to perform copper plating and electroplating on the blind vias on the circuit board, characterized in that, The specific steps include the following: S1. Loading: The circuit board to be processed is installed onto the jig plate (443) by a robotic arm or by manual labor, and clamped by the clamping fixture on the jig plate (443). S2, Processing: a. Drive the moving seat (8) to move along the sliding groove (7) and pass through the control tank, cleaning tank, copper plating tank, electroplating tank and control tank in sequence to complete the downward flipping of the material, ultrasonic cleaning, copper plating, electroplating and switching of the material orientation; b. Drive the moving seat (8) to retract along the sliding groove (7) to the cleaning tank to complete the secondary ultrasonic cleaning, and trigger the air drying process when it retracts from the cleaning tank to the inside of the tilting tank to dry the residual liquid inside the blind hole; S3. Unloading: Unload the dried material and replace it with new material to be processed, and proceed to the next round of processing.
Citation Information
Patent Citations
A fully automatic VCP electroplating device for horizontal copper plating of circuit boards
CN112714556B