Anti-oxidation treatment method of circuit board substrate
By coating the surface of the circuit board substrate with an antioxidant coating composed of polyurethane and antioxidants, the oxidation and corrosion problems of the circuit board in harsh environments are solved, thereby improving stability and lifespan.
Patent Information
- Application Number
- CN202411176871.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2026-03-03
AI Technical Summary
Circuit boards are susceptible to adverse environments such as humidity and high temperature during manufacturing, storage and transportation, which can lead to oxidation and corrosion, affecting operational stability and service life.
An anti-oxidation coating is applied to the surface of the circuit board substrate. The coating consists of polyurethane and antioxidants. Adhesion is enhanced by an adhesion promoter primer, forming a protective layer 50-80μm thick.
It effectively prevents oxidation and corrosion on the surface and inside of the circuit board, ensuring operational stability and service life. It is simple to operate and low in cost.
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board processing, and more particularly to an antioxidant treatment method for circuit board substrates. Background Technology
[0002] In the electronics industry, circuit boards are frequently subjected to adverse environments such as humidity and high temperatures during manufacturing, storage, and transportation. This leads to oxidation and corrosion on their surface and internal components, affecting the overall stability and lifespan of the circuit board. For example, the following problems may arise: Humidity: Excessive humidity can cause the circuit board to become damp, affecting the normal operation of circuit components; Temperature: Both excessively high and low temperatures can affect the performance and stability of the circuit board; Oxidation: Surface and even internal oxidation can damage electronic components on the circuit board, causing short circuits or poor contact; Dust and contamination: Dust and contamination on the surface of the circuit board can affect signal transmission and heat dissipation. All of these problems affect the overall stability and lifespan of the circuit board.
[0003] Therefore, there is an urgent need to provide an improved method for anti-oxidation treatment of circuit board substrates to overcome the above defects. Summary of the Invention
[0004] The purpose of this invention is to provide an anti-oxidation treatment method for circuit board substrates. This method is simple and effective. An anti-oxidation coating is applied to the surface of the circuit board substrate to protect it from the effects of humidity, oxygen, temperature, etc., and to prevent oxidation and corrosion on its surface and inside, thereby ensuring the stable operation and service life of the circuit board.
[0005] To achieve the above objectives, the anti-oxidation treatment method for the circuit board substrate of the present invention includes the following steps:
[0006] An antioxidant coating is prepared, wherein the antioxidant coating comprises polyurethane and an antioxidant;
[0007] Provide circuit board substrates;
[0008] An adhesive primer is applied to the surface of the circuit board substrate;
[0009] The antioxidant coating is applied onto the adhesive primer to form an antioxidant coating; and
[0010] The antioxidant coating is then dried.
[0011] Compared with existing technologies, the method of this invention uses polyurethane and antioxidants as raw materials. A specific antioxidant coating is prepared, and before applying the antioxidant coating, an adhesion primer is applied to the surface of the circuit board substrate. This adhesion primer allows the antioxidant coating to adhere more firmly to the circuit board substrate. This method is simple and effective. The antioxidant coating can protect the circuit board substrate from the effects of humidity, oxygen, and temperature, preventing oxidation and corrosion on its surface and inside, thereby ensuring the stable operation and service life of the circuit board.
[0012] As one example, the preparation of the antioxidant coating includes mixing and reacting polyurethane and an antioxidant at a reaction temperature of 120-150°C for 5-6 hours.
[0013] As an example, the polyurethane is selected from polyvinyl alcohol esters.
[0014] As an example, the antioxidant is selected from butylthio-β-naphthol and p-hydroxystyrene.
[0015] As an example, the thickness of the adhesive primer is 30-40 μm.
[0016] As an example, the adhesive primer is selected from alkyd resin primers.
[0017] As one embodiment, the antioxidant coating is applied to the adhesive primer by spraying, dipping, or rolling.
[0018] As one example, the antioxidant coating also includes a reflective material.
[0019] As an example, the thickness of the antioxidant coating is 50-80 μm. Detailed Implementation
[0020] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific implementation methods of this application are described in detail below with reference to some embodiments. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0021] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0023] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0024] The method for anti-oxidation treatment of circuit board substrates according to the present invention will be further described below with reference to embodiments, but this does not limit the present invention. The method of the present invention aims to provide an anti-oxidation treatment method for circuit board substrates. The method is simple and effective. An anti-oxidation coating is applied to the surface of the circuit board substrate to protect it from the influence of humidity, oxygen, temperature, etc., and to prevent oxidation and corrosion on its surface and inside, thereby ensuring the stable operation and service life of the circuit board.
[0025] In one embodiment of the anti-oxidation treatment method for the circuit board substrate of the present invention, the method includes the following steps:
[0026] An antioxidant coating is prepared, wherein the antioxidant coating comprises polyurethane and an antioxidant;
[0027] Provide circuit board substrates;
[0028] An adhesive primer is applied to the surface of the circuit board substrate;
[0029] The antioxidant coating is applied onto the adhesive primer to form an antioxidant coating; and
[0030] The antioxidant coating is then dried.
[0031] The method of this invention uses polyurethane and antioxidants as raw materials. A specific antioxidant coating is prepared, and before applying the antioxidant coating, an adhesion primer is applied to the surface of the circuit board substrate. This adhesion primer allows the antioxidant coating to adhere more firmly to the circuit board substrate. This method is simple and effective. The antioxidant coating can protect the circuit board substrate from the effects of humidity, oxygen, and temperature, preventing oxidation and corrosion on its surface and internal structure, thereby ensuring the stable operation and service life of the circuit board.
[0032] In one specific embodiment, a polyurethane antioxidant coating is used. Preferably, polyvinyl alcohol ester is selected, and an antioxidant is added to react under the following conditions: 120-150°C for 5-6 hours, resulting in a polyurethane antioxidant coating with excellent antioxidant properties and high durability. As an optional embodiment, the antioxidant is selected from butylthio-β-naphthol and p-hydroxystyrene.
[0033] Next, a circuit board substrate is provided, and its surface is first cleaned to remove oil and impurities.
[0034] A layer of adhesion promoter primer, preferably an alkyd resin primer, is applied to the surface of the circuit board substrate, with a thickness of 30-40 μm. The purpose of the adhesion promoter primer is to enhance the adhesion between the coating and the substrate. Alkyd resin primers are preferred because they have excellent compatibility with polyurethane coatings.
[0035] Subsequently, the aforementioned polyurethane anti-oxidation coating is applied to the surface of the circuit board substrate using methods such as spraying, dipping, or roller coating to form a protective layer. Due to the presence of the adhesive primer, the anti-oxidation coating adheres very well to the substrate surface. The thickness of the anti-oxidation coating formed by this coating is 50-80 μm. As a preferred embodiment, reflective materials can be added to the anti-oxidation coating to prevent the surface of the circuit board substrate from being damaged by ultraviolet rays.
[0036] Finally, the antioxidant coating is dried at room temperature to allow it to adhere firmly to the circuit board surface and form an effective protective layer.
[0037] The advantages of polyurethane antioxidant coatings lie in their simple preparation and low cost, as well as their ease of subsequent removal. For example, they can be removed using the following steps.
[0038] First, spray a certain amount of solvent, such as ethanol, acetone, or methanol, onto the surface of the polyurethane anti-oxidation coating. Then, seal the solvent-coated surface with a plastic film and leave it for approximately 40-50 minutes. Afterward, remove the plastic film and use a high-pressure air pump to remove the solvent and coating from the surface. Finally, clean the metal surface with water and a neutral detergent to remove any remaining coating and solvent.
[0039] Cleaning alkyd resin primers is also very simple, for example, it can be done through the following steps.
[0040] First, select an acidic, alkaline, or neutral cleaning agent. The choice of cleaning agent should be based on a comprehensive consideration of factors such as the desired cleaning effect, the characteristics of the primer, and its environmental impact. Next, add the cleaning agent to the cleaning tank according to a specific ratio, controlling the temperature and cleaning time of the cleaning solution, and then perform the cleaning operation using cleaning equipment. During the cleaning process, pay close attention to controlling the concentration, temperature, and time of the cleaning solution to avoid damaging the primer surface. Finally, after cleaning, neutralize the cleaning solution on the primer surface to prevent residue from remaining.
[0041] In summary, the method of this invention uses polyurethane and antioxidants as raw materials. By preparing a specific antioxidant coating, an adhesion primer is applied to the surface of the circuit board substrate before applying the antioxidant coating. This adhesion primer allows the antioxidant coating to adhere more firmly to the circuit board substrate. This method is simple and effective. The antioxidant coating can protect the circuit board substrate from the effects of humidity, oxygen, and temperature, preventing oxidation and corrosion on its surface and internal structure, thereby ensuring the stable operation and service life of the circuit board.
[0042] This invention uses polyurethane and antioxidants as raw materials. A specific antioxidant coating is prepared, and before applying the antioxidant coating, an adhesion primer is applied to the surface of the circuit board substrate. This adhesion primer allows the antioxidant coating to adhere more firmly to the circuit board substrate. This method is simple and effective. The antioxidant coating protects the circuit board substrate from the effects of humidity, oxygen, and temperature, preventing oxidation and corrosion on its surface and internal structure, thereby ensuring the stable operation and lifespan of the circuit board. This invention is simple to operate, low in cost, and suitable for industrial application.
[0043] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.
Claims
1. A method for anti-oxidation treatment of a circuit board substrate, characterized in that, Includes the following steps: An antioxidant coating is prepared, the antioxidant coating comprising polyurethane and an antioxidant; Provide circuit board substrates; An adhesive primer is applied to the surface of the circuit board substrate; The antioxidant coating is applied onto the adhesive primer to form an antioxidant coating; as well as The antioxidant coating is then dried.
2. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The preparation of the antioxidant coating involves mixing and reacting polyurethane and antioxidants at a reaction temperature of 120-150°C for 5-6 hours.
3. The method for anti-oxidation treatment of circuit board substrate as described in claim 2, characterized in that, The polyurethane is selected from polyvinyl alcohol ester.
4. The method for anti-oxidation treatment of circuit board substrate as described in claim 2, characterized in that, The antioxidant is selected from butylthio-β-naphthol and p-hydroxystyrene.
5. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The thickness of the adhesive primer is 30-40 μm.
6. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The adhesive primer is selected from alkyd resin primers.
7. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The antioxidant coating is applied to the adhesive primer by spraying, dipping, or rolling.
8. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The antioxidant coating also includes reflective materials.
9. The method for anti-oxidation treatment of circuit board substrate as described in claim 1, characterized in that, The thickness of the antioxidant coating is 50-80 μm.