Pressure sensor and preparation method thereof

Abstract

The invention discloses a pressure sensor and a preparation method thereof. The pressure sensor comprises a microstructure sensing layer; the microstructure sensing layer comprises a lower substrate and a plurality of spiral structure units positioned on the upper surface of the lower substrate, and each spiral structure unit is constructed by regularly rotating a spiral blade by taking a central shaft as a reference. As the spiral structure unit is arranged in the microstructure sensing layer in the pressure sensor provided by the invention, based on the fact that the spiral structure meets Hooke's law under a certain condition, the deformation of the spiral structure unit and the pressure load are in a linear relationship under the action of pressure, and the inherent property of structural hardening of the existing pressure sensor is overcome; the defects that a sensitivity curve of an existing pressure sensor tends to be saturated under the action of large pressure, and sensitivity is reduced are overcome.

Description

Technical Field

[0001] This invention relates to the field of pressure sensing technology, and in particular to a pressure sensor with high sensitivity and wide linear range and its fabrication method. Background Technology

[0002] Existing pressure sensors improve sensitivity and response time by introducing microstructure sensing layers. However, due to the inherent property of structural hardening of the microstructure sensing layer, its compressibility gradually decreases as pressure increases, and the sensitivity curve gradually becomes stable. The sensor's sensitivity decreases significantly over a wide pressure range, resulting in a nonlinear response throughout the pressure range. Therefore, it is impossible to maintain high sensitivity and high linearity over a wide range, and consequently, accurate pressure detection cannot be achieved.

[0003] Therefore, the methods in the existing technology need further improvement. Summary of the Invention

[0004] In view of the shortcomings of the above-mentioned related technologies, the purpose of this invention is to provide a pressure sensor and its manufacturing method, overcoming the defect of the prior art that cannot maintain high performance over a wide range.

[0005] The technical solution adopted by this invention to solve the technical problem is as follows: In a first aspect, the present invention provides a pressure sensor, comprising: a microstructure sensing layer; the microstructure sensing layer comprising: a lower substrate and a plurality of helical structural units located on the upper surface of the lower substrate, each helical structural unit being constructed by regularly rotating helical blades around a central axis.

[0006] Optionally, each of the spiral structural units is evenly arranged; the arrangement shape is circular, rectangular, annular, spiral, or triangular.

[0007] Optionally, the cross-section of the spiral structure unit is circular or rectangular.

[0008] Optionally, the spiral structural units are arranged to form an M×N spiral structural unit array with uniform horizontal and vertical arrangement, wherein both M and N are greater than 1.

[0009] Optionally, each of the spiral structural units contains less than 1 spiral turn.

[0010] Optionally, the cross-section of the helical blade is rectangular; under pressure, the deformation of the helical structural unit is: ; in, These are preset coefficients, depending on... And the ratio of twist D is the mean diameter of the helical blade, n is the effective number of turns of the helical blade, a is the length of the rectangular cross section of the helical blade, b is the width of the rectangular cross section of the helical blade, G is the shear modulus, F is the pressure load, M is the number of helical structural units in each row, and N is the number of helical structural units in each column.

[0011] Optionally, it further includes an upper substrate layer whose lower surface is attached to the upper surface of the microstructure sensing layer. The upper substrate layer includes: an upper substrate, an ion gel layer, a first conductive layer, and a first wire, wherein the first wire is connected to the second conductive layer. The microstructure sensing layer further includes: a second conductive layer covering each helical structural unit and the surface of the lower substrate, and a second wire connected to the second conductive layer. The second wire is connected to the second conductive layer.

[0012] Optionally, the helical blade is a continuous helical blade, a segmented helical blade, or a variable diameter helical blade.

[0013] Optionally, the material of the spiral structural unit is one or more of copper, silver, iron, graphite, steel, alloy and photosensitive resin.

[0014] Secondly, this application also provides a method for fabricating a pressure sensor, comprising: Preparation of the upper substrate layer; The lower substrate layer and multiple helical structural units located on the upper surface of the lower substrate layer were printed using micro-nano scale 3D printing technology. A conductive layer is covered on the upper surface of the lower substrate layer and the surface of each of the spiral structural units to obtain a microstructure sensing layer. The pressure sensor is obtained by attaching the lower surface of the upper substrate layer to the upper surface of the microstructure sensing layer.

[0015] Beneficial effects: This invention discloses a pressure sensor and its fabrication method. The pressure sensor includes a microstructure sensing layer; the microstructure sensing layer includes a lower substrate and multiple helical structural units located on the upper surface of the lower substrate. Each helical structural unit is constructed by regularly rotating helical blades around a central axis. Because the pressure sensor provided by this invention has helical structural units within the microstructure sensing layer, and based on the fact that the helical structure satisfies Hooke's law under certain conditions, the deformation of the helical structural unit under pressure is linearly related to the pressure load. This overcomes the inherent property of structural hardening in existing pressure sensors and solves the defect of existing pressure sensors where the sensitivity curve tends to saturate and sensitivity decreases under high pressure. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the pressure sensor disclosed in this invention; Figure 2This is a schematic diagram of the spiral structure unit in the pressure sensor disclosed in this invention; Figure 3 This is a flowchart of the steps involved in the fabrication method of the pressure sensor disclosed in this invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] Pressure sensors are crucial for robots, prosthetics, and other AI-powered devices to perceive changes in their environment and manipulate objects. By sensing pressure changes and converting them into electrical signals, pressure sensors provide robots with tactile feedback, proprioception, and environmental awareness, thereby enhancing their operational accuracy, adaptability, and safety.

[0019] Existing pressure sensors improve sensitivity and response time by introducing microstructure sensing layers, which mainly include steady-state microstructures such as pyramids, hemispheres, cones, waves, and microdots, as well as unsteady-state microstructures such as high aspect ratio cylinders and gradient-fillable structures. However, due to the inherent property of structural hardening of the microstructure sensing layer, as the pressure increases, the compressibility of the microstructure sensing layer gradually decreases, and the sensitivity curve gradually tends to be stable. The sensitivity of the sensor decreases significantly in the high pressure range, resulting in a nonlinear response of the pressure sensor across the entire pressure range.

[0020] To overcome the problem in existing technologies where the compressibility of the microstructure sensing layer gradually decreases with increasing pressure, this invention discloses a pressure sensor and its fabrication method. The pressure sensor incorporates a microstructure sensing layer, which includes a lower substrate and multiple helical structural units located on the upper surface of the lower substrate. Each helical structural unit is constructed by regularly rotating helical blades around a central axis. The pressure sensor provided in this application incorporates multiple helical structural units within the microstructure sensing layer. Based on the linear relationship between the deformation of the helical structural units under pressure and the pressure load, this overcomes the shortcomings of existing microstructure sensing layers, such as small pressure response range and low sensitivity.

[0021] The following description, in conjunction with the accompanying drawings, further illustrates a pressure sensor and its fabrication method disclosed in this embodiment.

[0022] In a first aspect, the present invention provides a pressure sensor, such as... Figure 1As shown, it includes: a microstructure sensing layer 20; the microstructure sensing layer 20 includes: a lower substrate 203 and a plurality of helical structural units 201 located on the upper surface of the lower substrate 203, each of the helical structural units 201 being constructed by regularly rotating helical blades around the central axis.

[0023] The pressure sensor provided in this embodiment can be a flexible pressure sensor, applicable to fields such as robotics, healthcare, smart homes, and automobiles, where pressure changes need to be monitored and responded to promptly. Therefore, to achieve high-sensitivity detection of pressure changes, the microstructure sensing layer of the pressure sensor disclosed in this embodiment incorporates helical structural units. The elastic deformation of these helical structural units differs from the inherent properties of steady-state and unstable microstructures in existing technologies. This overcomes the defect in existing technologies where the compressibility of the microstructure sensing layer gradually decreases, causing the sensitivity curve to gradually stabilize and resulting in a significant decrease in sensor sensitivity over high pressure ranges.

[0024] Specifically, the spiral structural unit provided in this embodiment has a spiral shape, specifically extending spirally around a central axis to form a continuous curve or curved surface structural unit. This spiral structural unit is disposed on the upper surface of the lower substrate. In specific implementations, there are multiple spiral structural units, which can be connected to each other or distributed independently.

[0025] In use, when external pressure is applied to the pressure sensor, the individual spiral structural units in the sensor's microstructure sensing layer deform. This deformation includes bending, stretching, or compression, and the specific form of deformation is related to the direction of the external pressure. This deformation is converted into an electrical signal through physical effects. The electrical signal conversion can be achieved through the piezoresistive effect (resistivity change of semiconductor materials under pressure leading to a change in resistance), the capacitive effect (capacitance of parallel-plate capacitors is inversely proportional to the distance between the plates), or the piezoelectric effect (charge generated by piezoelectric materials under pressure, with the amount of charge proportional to the pressure).

[0026] In this embodiment, because the microstructure sensing layer is provided with multiple helical structural units, each helical structural unit can undergo significant deformation under pressure, thereby improving sensitivity. Moreover, the helical structural unit is constructed by regularly rotating helical blades around the central axis. Therefore, based on the linear relationship between the deformation of the helical structure under pressure and the pressure value, the problem of sensitivity curve saturation and sensitivity reduction of existing pressure sensors under high pressure is overcome.

[0027] In this embodiment, the arrangement of the various helical structural units on the upper surface of the lower substrate can be uniform or non-uniform. Non-uniform components can be designed for scenarios with specific pressure distributions (e.g., the pressure load itself is non-uniform, in order to achieve a balance between high sensitivity and linearity over a wide pressure range), while uniform distribution is more suitable for scenarios with uniform pressure distribution. In one implementation, to facilitate more accurate prediction of deformation response, the helical structural units are arranged uniformly. The specific arrangement shape can be circular, rectangular, annular, helical, or triangular.

[0028] Furthermore, the cross-section of the spiral structural unit is either circular or rectangular. Different cross-sectional shapes of the spiral structural unit offer different advantages. If designed as a circle, the spiral structural unit with a circular cross-section distributes stress evenly along the circumference under load, eliminating stress concentration points. This makes it more suitable for dynamic or cyclic pressure load scenarios, such as vibration monitoring or heart pulse monitoring. Furthermore, spiral structural units with a circular cross-section are easier to fabricate using photolithography or 3D printing processes. If designed as a rectangle, the rectangular structure has a simple deformation mode under pressure (such as tension or bending), resulting in a near-linear stress-strain relationship, suitable for scenarios requiring high linearity. Rectangular structures are also easier to arrange compactly, resulting in high space utilization and high integration density.

[0029] In this embodiment, the cross-section of the helical blade is preferably set to a rectangle, and the helical diameter D of the helical structure is increased. The side length (a, b) of the rectangular cross-section can improve the elastic modulus of the microstructure sensing layer under the same structural deformation and pressure load, which in turn helps to improve the pressure response range of the microstructure sensing layer. This realizes that the pressure sensor has the advantages of both high sensitivity and wide linear range, thus broadening the application range of the pressure sensor.

[0030] Specifically, in combination Figure 1 As shown, the spiral structural units are arranged in an M×N uniformly spaced spiral structural unit array, where both M and N are greater than 1. When the spiral structural units undergo uniform linear deformation under pressure, this overcomes the structural hardening defect of existing microstructure pressure sensors.

[0031] Furthermore, in order to simplify the fabrication process of the pressure sensor provided in this embodiment and improve the fabrication efficiency, the number of turns of the spiral in each spiral structure unit is less than 1.

[0032] In detail, when the spiral structural units are arranged in an array, the number of spiral turns in each spiral structural unit is less than 1, and the cross-section of the spiral blade is rectangular, then the deformation of the spiral structural unit under pressure can be derived as follows: ; in, These are preset coefficients, depending on... And the ratio of twist D is the mean diameter of the helical blade, n is the effective number of turns of the helical blade, a is the length of the rectangular cross section of the helical blade, b is the width of the rectangular cross section of the helical blade, G is the shear modulus, F is the pressure load, M is the number of helical structural units in each row, and N is the number of helical structural units in each column.

[0033] Combination Figure 2 As shown, the pitch p of the helical blade can be adjusted as needed. Appropriately increasing the pitch p can increase the initial distance between the plates, which helps to improve the relative change in capacitance in the high-sensitivity capacitive pressure sensor structure based on a rectangular helical structure, thereby improving sensitivity. Under pressure, the deformation of the helical structure unit 201 is linearly related to the pressure load, overcoming the inherent property of hardening in existing microstructures; it achieves the effect that, under the same parameters, increasing the pitch of the helical blade 2011 can increase the deformable range of the helical structure unit 21, thereby improving the pressure response range of the sensor.

[0034] Furthermore, the pressure sensor also includes an upper substrate layer whose lower surface is attached to the upper surface of the microstructure sensing layer. The upper substrate layer includes an upper substrate and a second conductive layer. The microstructure sensing layer also includes a first ionogel layer and a first wire disposed above the first conductive layer. The upper substrate layer also includes a second ionogel layer and a second wire disposed above the second conductive layer. The first wire is connected to the first conductive layer, and the second wire is connected to the second conductive layer.

[0035] In detail, combined Figure 1 As shown in the figure, this embodiment of the invention provides a high-sensitivity and wide linear range pressure sensor based on a spiral structure. Inspired by spring structures, a spiral structure unit 201 with a uniform horizontal and vertical array is arranged on the microstructure sensing layer. When subjected to pressure, the pressure load is applied to the spiral structure unit 201 through the upper base layer 10, causing the spiral structure unit 201 to undergo elastic deformation. This results in displacement between the first conductive layer 102 and the second conductive layer 202, changing the capacitance value. Consequently, the charge in the ionogel layer 103 changes, and current is generated in the first wire 104 and the second wire 204. By setting the spiral structure unit 201 with a uniform horizontal and vertical array in the microstructure sensing layer, under the same parameters, increasing the number of spiral turns of the spiral blade 2011 can increase the deformation of the spiral structure unit 201, thereby improving the pressure response range of the sensor. Alternatively, according to the basic formula for deformation, adjusting the length, width, or diameter of the cross-section, or the shear modulus, can also improve the pressure response range of the sensor.

[0036] Because the spiral structure unit 201 is a spring structure that satisfies Hooke's Law, the deformation of the spiral structure unit 201 under pressure is linearly related to the pressure load. This overcomes the inherent property of structural hardening in existing pressure sensors and solves the problem that the sensitivity curve of existing pressure sensors tends to saturate and the sensitivity decreases under high pressure. By setting the cross-section of the spiral blade to a rectangle, under the same structural deformation and pressure load, increasing the pitch p can increase the initial distance between the plates, which can reduce the initial capacitance and increase the capacitance change, thereby helping to improve the sensitivity. Ultimately, this achieves an effective balance between high sensitivity and applicability of the pressure sensor, greatly expanding the application range of the pressure sensor.

[0037] Furthermore, under pressure, the area change between the ionogel layer 103 and the helical structural unit 201 is as follows: ; in, The helix angle is the angle of the helical structure.

[0038] The capacitance of capacitive sensors based on ion gels is proportional to the contact area: ; The capacitance change rate of this capacitive sensor is: ; in, This represents the change in capacitance. This is the initial capacitance value of the capacitive pressure sensor. The capacitance value is the value after the spiral structure unit 201 has deformed. The value, determined by the material system of the capacitive sensor, remains constant during the compression process of the pressure sensor. This represents the initial contact area between the ionogel layer 103 and the microstructure sensing layer 20. This represents the contact area between the ionogel layer 103 and the microstructure sensing layer 20 after the helical structure has deformed.

[0039] The sensitivity of this capacitive sensor: ; P represents the pressure load per unit area (Pa), and S represents the area of ​​the pressure load F applied to the sensor. Therefore, under pressure, the relative change in capacitance of the capacitive pressure sensor changes linearly with the pressure load, solving the problem of sensitivity saturation and reduced sensitivity under high pressure caused by the inherent hardening property of existing pressure sensors. Furthermore, under the same pressure load and structural deformation, by increasing the contact area between the ionogel layer 103 and the microstructure sensing layer 20 through the structural parameters of the spiral structure, the rate of change of capacitance is greatly improved, thus contributing to increased sensitivity.

[0040] Furthermore, the helical blade can be a continuous helical blade, a segmented helical blade, or a variable diameter helical blade. Different types of helical blades are used to suit different scenarios.

[0041] Furthermore, to ensure the spiral structure can be molded and used, the spiral structure unit material is one or more of copper, silver, iron, graphite, steel, alloys, and photosensitive resin. Since excessively soft materials can easily cause deformation of the spiral structure unit, this embodiment selects a material with suitable softness as the material for the spiral structure unit.

[0042] In detail, in this embodiment of the invention, the lower substrate 203 material can be selected from one or more materials such as epoxy resin, photosensitive resin, copper, steel, and alloy. The upper substrate 101 material is selected from one or more polymer films such as polydimethylsiloxane (PDMS), styrene-ethylene-butene-styrene block copolymer (SEBS), ecological elastomer (ECOFLEX), polyurethane, and polyimide. In this embodiment of the invention, the materials of the first conductive layer and the second conductive layer can be selected from one or more conductive materials such as carbon nanoparticles, gold nanoparticles, platinum nanoparticles, silver nanoparticles, copper nanoparticles, and composite conductive materials.

[0043] In this embodiment of the invention, the material of the ionogel layer is selected from one or more polymers such as polyacrylamide and polyvinyl alcohol, and is compounded with one or more ionic salts such as lithium salt and sodium salt. At the same time, one or more nano-reinforcing materials such as silica nanoparticles and nanocellulose can be added for modification.

[0044] In this embodiment of the invention, the materials of the first and second conductors are selected from one or more of the following materials: copper, silver, iron, graphite, steel, alloys, etc.

[0045] Furthermore, when connecting the upper substrate layer to the microstructure sensing layer, the stability of the connection and the prevention of mutual interference between the various helical structural units need to be considered. The various helical structural units are not connected to each other and are kept at a preset distance from each other to avoid mutual interference that could lead to inaccurate detection results.

[0046] This invention discloses a high-sensitivity and wide-linear-range pressure sensor based on a helical structure, aiming to solve the problem of the difficulty in balancing sensitivity and linear range in traditional pressure sensors. The sensor mainly consists of an upper substrate layer and a microstructure sensing layer. The upper substrate layer includes an upper substrate, a first conductive layer, an ionomer gel layer, and a first conductive wire; the microstructure sensing layer includes M×N uniformly arranged helical structural units, a second conductive layer, a lower substrate, and a second conductive wire. Compared to other structures, the helical structure satisfies Hooke's Law under certain conditions, and the deformation of the helical structural units under pressure is linearly related to the pressure load. This overcomes the inherent property of structural hardening in existing pressure sensors and solves the problem of sensitivity curve saturation and sensitivity reduction under high pressure. Furthermore, by adjusting the relevant parameters of the helical structure, the pressure response range can be improved, ultimately achieving an effective balance between high sensitivity and wide linear range in the pressure sensor.

[0047] Secondly, this application also provides a method for fabricating a pressure sensor, such as... Figure 3 As shown, it includes: Step H1: Prepare the upper base layer.

[0048] Since the pressure sensor disclosed in this application is composed of an upper substrate layer and a lower substrate layer bonded together, the upper substrate layer is first prepared in this step. The upper substrate layer includes an upper substrate, a first conductive layer, an ionogel layer, and a first wire connected to the first conductive layer. Specifically, in the preparation process, firstly, an upper substrate is provided; a layer of gold nanoparticles is sputtered onto the surface of the upper substrate; an ionogel layer is then coated onto the surface of the gold nanoparticles layer; and a copper wire is soldered to the surface of the gold nanoparticles layer to obtain the upper substrate layer.

[0049] Step H2: Use micro-nano scale 3D printing technology to print the lower substrate layer and multiple helical structural units located on the upper surface of the lower substrate layer.

[0050] Step H2 first prepares the lower substrate layer and multiple helical structural units. In practice, to reduce fabrication steps, high-precision micro / nano-scale 3D printing technology can be used to simultaneously print the lower substrate layer and the multiple helical structural units located on its upper surface. This achieves integrated molding of the lower substrate layer and each helical structural unit, eliminating the need for additional manufacturing processes and reducing the assembly steps of attaching the helical structural units to the upper surface of the lower substrate layer, thus improving production efficiency. Alternatively, in practice, the lower substrate layer and each helical structural unit can be prepared separately, and then the helical structural units can be glued to the upper surface of the lower substrate layer.

[0051] Furthermore, 3D printing technology can print the lower base layer and each spiral structure unit without molds, and can print directly with only design files. Therefore, it can meet the needs of personalized customization, especially for designing non-uniformly arranged spiral structure units for specific pressure distribution scenarios, which can quickly meet customization needs.

[0052] In one implementation, a lower substrate and a 10×10 helical structural unit array are printed using high-precision micro-nano scale 3D printing technology. The 10×10 helical structural unit array is uniformly distributed on the upper surface of the lower substrate.

[0053] Step H3: Cover the upper surface of the lower substrate layer and the surface of each of the spiral structural units with a conductive layer to obtain a microstructure sensing layer.

[0054] A second conductive layer is prepared on the surface of the lower substrate and the helical structural unit. Specifically, in this step, a gold nanoparticle layer is sputtered on the upper surface of the helical structural unit array and the lower substrate. This gold nanoparticle layer is the second conductive layer. Then, copper wires are soldered to the surface of the gold nanoparticle layer to prepare the microstructure sensing layer.

[0055] Furthermore, in specific implementation, if the number of spiral turns in each spiral structure unit is greater than 1, since the gold nanoparticle layer is generally sputtered vertically downwards when using sputtering as the conductive layer, if the number of spiral turns exceeds 1, the spiral structure may have the upper spiral blocking the lower spiral. Therefore, when the number of spiral turns exceeds 1, it is necessary to sputter conductive particles from different directions multiple times to ensure that the gold nanoparticle layer is sputtered on the surface of the entire spiral structure unit.

[0056] Step H4: Adhere the lower surface of the upper substrate layer to the upper surface of the microstructure sensing layer to obtain a pressure sensor.

[0057] After the upper substrate layer and the microstructure sensing layer are prepared separately, the lower surface of the upper substrate layer is bonded to the upper surface of the microstructure sensing layer to obtain a pressure sensor.

[0058] This invention discloses a pressure sensor and its fabrication method. The pressure sensor includes a microstructure sensing layer; the microstructure sensing layer includes a lower substrate, a first conductive layer located on the upper surface of the lower substrate, and multiple helical structural units located on the upper surface of the first conductive layer. Each helical structural unit is constructed by regularly rotating helical blades around a central axis. Because the pressure sensor provided by this invention has helical structural units within the microstructure sensing layer, and based on the fact that the helical structure satisfies Hooke's law under certain conditions, the deformation of the helical structural unit under pressure is linearly related to the pressure load. This overcomes the inherent property of structural hardening in existing pressure sensors and solves the defect of sensitivity curve saturation and sensitivity reduction under high pressure in existing pressure sensors.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A pressure sensor, characterized in that, include: Microstructure sensing layer; The microstructure sensing layer includes: a lower substrate and multiple helical structural units located on the upper surface of the lower substrate, each of the helical structural units being constructed by regularly rotating helical blades around a central axis.

2. The pressure sensor according to claim 1, characterized in that, Each of the spiral structural units is evenly arranged; the arrangement shape is circular, rectangular, annular, spiral, or triangular.

3. The pressure sensor according to claim 1, characterized in that, The cross-section of the spiral structure unit is circular or rectangular.

4. The pressure sensor according to claim 1, characterized in that, The spiral structural units are arranged to form an M×N spiral structural unit array with uniform horizontal and vertical arrangement, wherein both M and N are greater than 1.

5. The pressure sensor according to claim 4, characterized in that, Each of the aforementioned helical structural units contains less than 1 helix.

6. The pressure sensor according to claim 5, characterized in that, The cross-section of the helical blade is rectangular; under pressure, the deformation of the helical structural unit is: ； in, These are preset coefficients, depending on... And the ratio of twist D is the mean diameter of the helical blade, n is the effective number of turns of the helical blade, a is the length of the rectangular cross section of the helical blade, b is the width of the rectangular cross section of the helical blade, G is the shear modulus, F is the pressure load, M is the number of helical structural units in each row, and N is the number of helical structural units in each column.

7. The pressure sensor according to claim 6, characterized in that, It also includes an upper substrate layer whose lower surface is attached to the upper surface of the microstructure sensing layer. The upper substrate layer includes: an upper substrate, an ion gel layer, a first conductive layer, and a first wire, wherein the first wire is connected to the second conductive layer. The microstructure sensing layer also includes: a second conductive layer covering each helical structural unit and the surface of the lower substrate, and a second wire connected to the second conductive layer. The second wire is connected to the second conductive layer.

8. The pressure sensor according to claim 1, characterized in that, The helical blades are continuous helical blades, segmented helical blades, or variable diameter helical blades.

9. The pressure sensor according to claim 1, characterized in that, The material of the spiral structure unit is one or more of copper, silver, iron, graphite, steel, alloy and photosensitive resin.

10. A method for manufacturing a pressure sensor, characterized in that, include: Preparation of the upper substrate layer; The lower substrate layer and multiple helical structural units located on the upper surface of the lower substrate layer were printed using micro-nano scale 3D printing technology. A conductive layer is covered on the upper surface of the lower substrate layer and the surface of each of the spiral structural units to obtain a microstructure sensing layer. The pressure sensor is obtained by attaching the lower surface of the upper substrate layer to the upper surface of the microstructure sensing layer.

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