Aluminum-based hot tinning conductor wire and preparation method and application thereof

Abstract

The invention discloses an aluminum-based hot tinning conductor wire rod and a preparation method and application thereof, the aluminum-based hot tinning conductor wire rod comprises an inner layer structure and an outer layer structure, the inner layer structure is an aluminum-based wire rod, the outer layer structure is a hot tinning layer, the thickness of the hot tinning layer is 1-20 microns, and the transverse size of the aluminum-based wire rod is 0.1-3 mm; the aluminum-based hot tinning conductor wire comprises the following components in percentage by mass: 2-40% of tin and the balance of aluminum and impurities. The aluminum-based wire is subjected to oil removal, alkali etching, acid etching, water washing, soldering flux treatment and hot tinning processes, so that the problems of process route and efficiency of continuous hot tinning of the aluminum-based conductor wire are successfully solved, the binding force of an aluminum-based material and tin is greatly improved, the continuous hot tinning process of the aluminum wire is realized, and the binding force problem of aluminum and tin is well solved; the aluminum-based hot tinning conductor material has good wear resistance and toughness, various performance indexes of the aluminum-based conductor material are effectively optimized, and compared with electrotinning and hot tinning, the aluminum-based hot tinning conductor material is lower in cost, higher in benefit and simpler in process.

Description

Technical Field

[0001] This invention belongs to the field of conductor wire technology, specifically relating to an aluminum-based hot-dip tin-plated conductor wire, its preparation method, and its application. Background Technology

[0002] Tin-plated copper conductors are widely used in various fields such as power, electronics, photovoltaics, and new energy vehicles. Due to their good conductivity, corrosion resistance, and ease of welding, tin-plated copper conductors have a very wide range of applications and are used in large quantities. With the soaring prices of non-ferrous metals, the price of copper peaked at over 86,000 yuan per ton, nickel at over 140,000 yuan per ton, and tin at over 260,000 yuan per ton. Since the main raw materials for tin-plated copper conductors are copper and tin, these excessively high prices have placed enormous cost pressure on enterprises, significantly impacting the overall economy.

[0003] Aluminum is an excellent conductor material, and even at its peak, its price was only 20,000 yuan per ton, less than a quarter of that of copper, giving it a significant cost advantage. However, due to its highly reactive chemical properties and amphoteric nature, aluminum oxidizes easily in air, resulting in an aluminum oxide insulating film on its surface. This film makes aluminum's bonding strength very poor, making it difficult to bond with tin. Even if it does bond, it easily peels off. Therefore, the poor bonding strength between aluminum and tin makes it difficult to achieve large-scale industrial production of tin-plated aluminum conductor wires, making it difficult to realize the idea of ​​replacing tin-plated copper with tin-plated aluminum.

[0004] In recent years, research on tin-plated aluminum alloys has also begun to emerge. For example, patent CN202054913U discloses a three-layer structure of tin-plated aluminum alloy strip, consisting of an aluminum alloy strip, an electroplated shiny nickel layer, and an electroplated tin layer. Patent CN102881756A discloses a four-layer structure of aluminum-based tin-plated photovoltaic soldering ribbon, consisting of an aluminum base strip, a chemically deposited underlayer, an electrochemically deposited conductive layer, and an electrochemically deposited layer. Furthermore, patents CN116844754A ("A Tin-plated Aluminum Alloy Conductor Material for Cables and Cables, and Its Preparation Method and Application"), CN116936155A ("A Tin-plated Al-Fe-Cu Aluminum Alloy Conductor Material for Photovoltaic Cables, and Its Preparation Method and Application"), and CN116926518A ("A Tin-plated Aluminum Alloy Conductor Material for Photovoltaic Soldering Ribs, and Its Preparation Method and Application") all introduce a three-layer structure of tin-plated aluminum alloy conductor material, consisting of an aluminum alloy conductor, an electroplated nickel layer, and an electroplated tin layer.

[0005] Research on existing technologies has revealed that the current technical route for tin plating on aluminum-based materials is basically to first electroplate nickel onto the aluminum or aluminum alloy substrate, and then electroplate tin on the nickel layer. However, electroplating involves large equipment investment, high energy consumption, and low production efficiency. To achieve tin plating on aluminum-based materials, reduce costs and increase efficiency to replace copper tin plating, without excessively increasing production costs, presents a huge challenge for the large-scale industrial application of tin plating on aluminum-based materials. Summary of the Invention

[0006] The purpose of this invention is to provide an aluminum-based hot-dip tin-plated conductor wire, its preparation method, and its application, in order to solve the problems of complex and costly electroplating processes on the surface of aluminum alloy conductors.

[0007] To achieve the above objectives, the first aspect of the present invention provides an aluminum-based hot-dip tin-plated conductor wire, comprising an inner and outer two-layer structure, wherein the inner layer is an aluminum base material and the outer layer is a hot-dip tin-plated layer, the thickness of the hot-dip tin-plated layer is 1 to 20 μm, and the transverse dimension of the aluminum base material is 0.1 to 3 mm.

[0008] In aluminum-based hot-dip tin-plated conductor wires, tin accounts for 2-40% by mass percentage, with the remainder being aluminum and impurities.

[0009] Currently, existing technologies for tin plating aluminum alloy wires generally involve a three-layer or higher structure, which increases the complexity of the reaction. This invention employs a two-layer structure, eliminating the intermediate nickel plating layer. Compared to electroplated tin conductor wires, this invention uses hot-dip tin plating, eliminating the intermediate nickel plating layer and reducing costs, as nickel is a precious metal and accounts for a significant portion of the cost of electroplated tin materials. Besides simplifying the material structure, this invention also avoids the problems associated with intermediate nickel plating and tin plating layers in electroplated tin materials, which can reduce the plasticity of the aluminum base material, increase its brittleness, and significantly reduce its tensile properties.

[0010] Referring to patent CN116875845A, "A Nickel-Plated Aluminum Alloy Conductor Material and Its Preparation Method," the elongation at break is greater than or equal to 15%, and patent CN116844754A, "A Tin-Plated Aluminum Alloy Conductor Material for Cables and Its Preparation Method and Application," the elongation at break is greater than or equal to 10%. These data show that electroplating affects the final tensile properties of the plating material. However, the hot-dip tin-plated wire developed in this invention has an elongation at break >25%. The hot-dip tin-plated aluminum base wire of this invention only requires degreasing, alkaline etching, acid etching, water washing, fluxing, and hot-dip tin plating processes. The impact on the tensile properties of the aluminum substrate is minimal, almost negligible. Without an intermediate plating layer, the plasticity of the aluminum base wire is not reduced. Furthermore, the hot-dip tin plating at 230–250°C serves as a secondary annealing process to reduce internal stress. Therefore, the hot-dip tin plating layer does not alter the original tensile properties of the aluminum substrate. In addition, the aluminum-based hot-dip tin-plated conductor wire prepared by this invention still maintains good comprehensive performance, with conductivity >61% IACS, yield strength ≤80MPa, and 90-degree fatigue bending >25 times.

[0011] Preferably, the aluminum baseline material comprises the following raw materials by weight percentage:

[0012] Fe 0~1.1%

[0013] Mg 0-0.8%

[0014] Cu 0–0.4%

[0015] B 0~0.08%

[0016] Si 0~0.02%

[0017] Zn 0~0.07%

[0018] Al≥97%

[0019] The balance represents unavoidable impurities.

[0020] Preferably, the hot-dip tin plating layer comprises the following raw materials by weight percentage:

[0021] A: 0.1%–40%;

[0022] The balance is Sn and unavoidable impurities;

[0023] The A is one or more of Pb, Bi, In, Ag, and Cd.

[0024] Preferably, A is at least two of Pb, Bi, In, Ag and Cd.

[0025] Preferably, the aluminum-based hot-dip tin-plated conductor wire has a conductivity >61% IACS, an elongation at break >25%, a yield strength ≤80MPa, and a fatigue bending resistance of >25 times at 90 degrees.

[0026] A second aspect of this invention provides a method for preparing an aluminum-based hot-dip tin-plated conductor wire, comprising the following steps:

[0027] 1) Raw materials are put into a furnace according to the proportion of metal elements in aluminum base material, and aluminum base rods are manufactured through smelting, casting and rolling processes. The aluminum base rods are then made into aluminum base material through continuous drawing and annealing process.

[0028] 2) The aluminum baseline material obtained in the above steps is then subjected to degreasing treatment;

[0029] 3) The aluminum baseline material obtained by the above steps through degreasing treatment is then subjected to alkaline etching treatment;

[0030] 4) The aluminum baseline material obtained by alkaline etching in the above steps is then subjected to acid etching.

[0031] 5) The aluminum baseline material obtained by acid etching in the above steps is then washed with water.

[0032] 6) The aluminum baseline material obtained by the above steps through water washing is then treated with flux to form a layer of flux on the surface of the aluminum baseline material.

[0033] 7) The aluminum baseline material treated with flux is then hot-dip tin-plated with a thickness of 1 to 20 μm in a tin bath at a temperature of 230 to 250°C for 1 to 5 seconds.

[0034] Because drawing oil is used during the processing of aluminum base wire, a layer of oil residue forms on its surface, severely affecting the hot-dip tin plating process. Degreasing treatment can remove this oil residue from the wire surface. Aluminum is chemically very reactive; when exposed to air during processing, it quickly oxidizes, forming an insulating aluminum oxide film. This aluminum oxide film on the surface of the aluminum base wire significantly affects the adhesion between aluminum and tin. If the surface aluminum oxide film is not removed, it is difficult for tin to be hot-dip plated onto the aluminum surface. This is why current technology requires nickel plating first, followed by tin plating—by pre-plating nickel, the adhesion problem between aluminum and tin is solved. This invention completely removes the oxide film on the aluminum surface through alkaline and acid etching, followed by a rapid water washing and flux application process to prevent the aluminum from oxidizing again. Since the flux contains activators, film-forming agents, corrosion inhibitors, and solubilizers, it can quickly protect the surface of the aluminum base material and further improve the adhesion between the aluminum surface and tin. In the high-temperature molten tin, a 1-20μm hot-dip tin layer is quickly formed, firmly covering the surface of the aluminum base material.

[0035] Preferably, the aluminum baseline material undergoes a degreasing treatment, and the degreasing treatment solution includes:

[0036] Sodium carbonate 20-40 g / L;

[0037] Trisodium phosphate 50-60 g / L;

[0038] Surfactant concentration: 5–10 ml / L;

[0039] The degreasing treatment temperature is 50-60℃, and the soaking time is 3-15 seconds.

[0040] Preferably, the aluminum baseline material undergoes alkaline etching treatment, and the alkaline etching treatment solution includes:

[0041] Sodium hydroxide 5-10 g / L;

[0042] Trisodium phosphate 30-50 g / L;

[0043] Sodium bicarbonate 20-30 g / L;

[0044] Sodium silicate 5-10 g / L;

[0045] The temperature for alkaline etching treatment is 50–70℃, and the soaking time is 3–10 seconds.

[0046] Preferably, the aluminum baseline material is subjected to acid etching treatment, and the acid etching treatment solution includes: concentrated sulfuric acid 50-100 ml / L;

[0047] The acid etching treatment was performed at room temperature, and the immersion time was 3–10 seconds.

[0048] The preferred aluminum baseline material is treated with flux, and the flux treatment solution includes:

[0049] Surfactant 7-15 g / L;

[0050] Film-forming agent: 0.5–2.0 g / L;

[0051] Corrosion inhibitor 0.5–1.8 g / L;

[0052] Co-solvent 15-35 g / L;

[0053] The flux treatment temperature is room temperature, and the immersion time is 1 to 15 seconds.

[0054] The active agent in this invention is an organic acid, the film-forming agent is polyethylene glycol, the corrosion inhibitor is a nitrogen heterocyclic compound, and the cosolvent is isopropanol. The organic acid can be one of citric acid, oxalic acid, and acetic acid, and the corrosion inhibitor can be one of benzotriazole (BTA), methylbenzotriazole (TTA), and mercaptobenzothiazole (MBT).

[0055] The third aspect of this invention provides an application of aluminum-based hot-dip tin-plated conductor wire in photovoltaics, new energy vehicles, medium and low voltage electrical appliances and electrical equipment.

[0056] Therefore, the aluminum-based hot-dip tin-plated conductor wire with the above-described structure, its preparation method, and its application have the following beneficial effects:

[0057] (1) The aluminum-based hot-dip tin-plated conductor wire provided by the present invention improves the wear resistance and toughness of existing aluminum alloy conductor materials, especially the solderability, by hot-dip tin plating on the surface of aluminum substrate. The hot-dip tin-plated material has good tin plating layer adhesion, is not easy to fall off, is not easy to crack when bent, has a simple process, low equipment investment cost, high processing efficiency, and meets the requirements of usability and connectivity.

[0058] (2) Aluminum-based hot-dip tin-plated conductor wires meet the requirements of electrical performance, physical and mechanical performance and solderability. They can be used in photovoltaic special wires, photovoltaic welding strips, automotive wiring harnesses, electrical equipment wires, etc. They can be directly welded or cold-pressed with matching fittings. Moreover, the process is simple, the equipment investment cost is low, the production efficiency is high, the controllability is strong, and the on-site execution is high. They are suitable for the promotion and application of industrial-scale production.

[0059] (3) The hot-dip tin plating process for aluminum substrate provided by the present invention has solved the technical problem of hot-dip tin plating on the surface of aluminum conductor material. Through degreasing, alkaline etching, acid etching, water washing, flux treatment, and finally hot-dip tin plating, the hot-dip tin plating process is successfully realized on the surface of aluminum conductor material. The electrical connection problem of aluminum conductor material is solved without affecting the original electrical and mechanical properties of aluminum conductor.

[0060] (4) In the present invention, a 1-20μm hot-dip tin layer is rapidly formed in the high-temperature molten tin liquid, which firmly covers the surface of the aluminum base conductor wire. The present invention creatively realizes the hot-dip tin technology on the surface of aluminum base conductor wire, which not only solves the technical problem of hot-dip tinning of aluminum, but also solves the process problem of high-speed tinning, low cost and large-scale processing of aluminum base conductor wire. It solves the technical problem that aluminum cannot be welded in many application places. It can be cold-pressed with various existing power fittings or directly welded. It can be applied to various fields such as photovoltaic, new energy vehicles, medium and low voltage electrical appliances and electrical equipment. It provides an efficient, low-cost and large-scale industrial application solution for replacing tin-plated copper with tin-plated aluminum wire.

[0061] The technical solution of the present invention will be further described in detail below through embodiments. Detailed Implementation

[0062] The present invention will be further described below. It should be noted that this embodiment is based on the present technical solution and provides detailed implementation methods and specific operation processes, but the present invention is not limited to this embodiment.

[0063] Example 1

[0064] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based base materials through a continuous drawing and annealing process. The base material composition of the aluminum-based base materials is listed in Table 1.

[0065] The specific preparation process of aluminum alloy wire is as follows:

[0066] ① Weighing: Weigh the raw materials according to the mass percentages in Table 1;

[0067] ② Melting, casting, sawing, and descaling: The raw materials weighed in step ① are added to a melting furnace, heated to 720℃, and held at 720℃ for 3 hours. Then, they are refined using an Ar-Cl2 mixed gas and allowed to stand for 30 minutes to obtain an aluminum alloy melt. The aluminum alloy melt is then cast at a temperature of 710℃, a cooling water temperature of 25℃, a cooling water strength of 0.06MPa, and a casting speed of 85mm / min to obtain a casting rod. The casting rod is sawn to remove the oxide scale on the surface to obtain an aluminum alloy ingot.

[0068] ③ Annealing, extrusion, intermediate annealing and stretching: The aluminum alloy ingot from step ② is homogenized and annealed at 510℃ for 20 hours, then placed in a resistance heating furnace and heated to 350℃. It is then placed in an aluminum alloy wire die and extruded at an extrusion temperature of 400℃ and an extrusion speed of 0.05mm / s to obtain aluminum alloy wire. The aluminum alloy wire is then intermediately annealed at 400℃ for 2 hours. Finally, the intermediately annealed aluminum alloy wire is cold-drawn through a stretching die at a deformation rate of 40% to obtain aluminum baseline material with a transverse dimension of 1mm.

[0069] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared in Example 1 of the present invention.

[0070] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 1 μm thickness. The hot-dip tin-plating temperature is 230℃ and the time is 1s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0071] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0072] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention.

[0073] Table 3 shows the composition (wt%) of the hot-dip tin coating in the embodiments of the present invention.

[0074] (3) The degreasing process conditions in step (2) are as follows:

[0075] Sodium carbonate 20g / L, trisodium phosphate 50g / L, surfactant (sodium dodecylbenzenesulfonate) 5ml / L, temperature 50℃, soaking time 3s.

[0076] (4) The alkaline etching process in step (2) is as follows:

[0077] Sodium hydroxide 5g / L, trisodium phosphate 30g / L, sodium bicarbonate 20g / L, sodium silicate 5g / L, temperature 50℃, soaking time 3s.

[0078] (5) The acid etching process in step (2) is as follows:

[0079] 50 ml / L concentrated sulfuric acid, temperature (room temperature), soaking time 3 seconds.

[0080] (6) The fluxing process in step (2) is as follows:

[0081] The active ingredient (citric acid) was 7 g / L, the film-forming agent (polyethylene glycol) was 0.5 g / L, the corrosion inhibitor (benzotriazole (BTA)) was 0.5 g / L, and the co-solvent (isopropanol) was 15 g / L. The temperature was room temperature, and the immersion time was 1 second. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0082] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0083] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0084] Example 2

[0085] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0086] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0087] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 10 μm thickness. The hot-dip tin-plating temperature is 235℃ and the time is 3s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0088] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0089] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention.

[0090] Table 3 shows the composition (wt%) of the hot-dip tin coating in the embodiments of the present invention.

[0091] (3) The degreasing process conditions in step (2) are as follows:

[0092] Sodium carbonate 40g / L, trisodium phosphate 60g / L, surfactant (sodium dodecylbenzenesulfonate) 10ml / L, temperature 60℃, soaking time 15s.

[0093] (4) The alkaline etching process in step (2) is as follows:

[0094] Sodium hydroxide 10g / L, trisodium phosphate 50g / L, sodium bicarbonate 30g / L, sodium silicate 10g / L, temperature 70℃, soaking time 10s.

[0095] (5) The acid etching process in step (2) is as follows:

[0096] Use 60 ml / L concentrated sulfuric acid, at room temperature, for 10 seconds of soaking.

[0097] (6) The fluxing process in step (2) is as follows:

[0098] The active ingredient (citric acid) was 15 g / L, the film-forming agent (polyethylene glycol) was 2.0 g / L, the corrosion inhibitor (benzotriazole (BTA)) was 1.8 g / L, and the co-solvent (isopropanol) was 35 g / L. The temperature was room temperature, and the soaking time was 10 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0099] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0100] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0101] Example 3

[0102] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0103] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0104] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 3μm thickness. The hot-dip tin-plating temperature is 250℃ and the time is 1s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0105] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0106] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention. Table 3 is a composition table (wt%) of the hot-dip tin-plated layer according to the embodiments of the present invention.

[0107] (3) The degreasing process conditions in step (2) are as follows:

[0108] Sodium carbonate 24g / L, trisodium phosphate 51g / L, surfactant (sodium dodecylbenzenesulfonate) 6ml / L, temperature 51℃, soaking time 5s.

[0109] (4) The alkaline etching process in step (2) is as follows:

[0110] Sodium hydroxide 6 g / L, trisodium phosphate 33 g / L, sodium bicarbonate 21 g / L, sodium silicate 6 g / L, temperature 52℃, soaking time 4 s.

[0111] (5) The acid etching process in step (2) is as follows:

[0112] 65 ml / L concentrated sulfuric acid, room temperature, soaking time 4 seconds.

[0113] (6) The fluxing process in step (2) is as follows:

[0114] The immersion conditions were as follows: surfactant (citric acid) 8 g / L, film-forming agent (polyethylene glycol) 0.8 g / L, corrosion inhibitor (benzotriazole (BTA)) 0.7 g / L, co-solvent (isopropanol) 18 g / L, room temperature, and immersion time 3 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0115] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0116] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0117] Example 4

[0118] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0119] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0120] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 5 μm thickness. The hot-dip tin-plating temperature is 240℃ and the time is 2s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0121] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0122] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention. Table 3 is a composition table (wt%) of the hot-dip tin-plated layer according to the embodiments of the present invention.

[0123] (3) The degreasing process conditions in step (2) are as follows:

[0124] Sodium carbonate 26g / L, trisodium phosphate 52g / L, surfactant (sodium dodecylbenzenesulfonate) 7ml / L, temperature 52℃, soaking time 3~15s.

[0125] (4) The alkaline etching process in step (2) is as follows:

[0126] Sodium hydroxide 7g / L, trisodium phosphate 34g / L, sodium bicarbonate 22g / L, sodium silicate 7g / L, temperature 54℃, soaking time 5s.

[0127] (5) The acid etching process in step (2) is as follows:

[0128] 70 ml / L concentrated sulfuric acid, room temperature, soaking time 5 seconds.

[0129] (6) The fluxing process in step (2) is as follows:

[0130] The active ingredient (oxalic acid) was 9 g / L, the film-forming agent (polyethylene glycol) was 0.8 g / L, the corrosion inhibitor (methylbenzotriazole (TTA)) was 0.9 g / L, and the co-solvent (isopropanol) was 20 g / L. The temperature was room temperature, and the immersion time was 5 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0131] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0132] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0133] Example 5

[0134] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0135] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0136] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 8 μm thickness. The hot-dip tin-plating temperature is 238℃ and the time is 3s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0137] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0138] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention.

[0139] Table 3 shows the composition (wt%) of the hot-dip tin coating in the embodiments of the present invention.

[0140] (3) The degreasing process conditions in step (2) are as follows:

[0141] Sodium carbonate 28g / L, trisodium phosphate 55g / L, surfactant (sodium dodecylbenzenesulfonate) 8ml / L, temperature 55℃, soaking time 7s.

[0142] (4) The alkaline etching process in step (2) is as follows:

[0143] Sodium hydroxide 8g / L, trisodium phosphate 38g / L, sodium bicarbonate 25g / L, sodium silicate 8g / L, temperature 58℃, soaking time 7s.

[0144] (5) The acid etching process in step (2) is as follows:

[0145] 95 ml / L concentrated sulfuric acid, room temperature, soaking time 6 seconds.

[0146] (6) The fluxing process in step (2) is as follows:

[0147] The immersion conditions included: surfactant (oxalic acid) 11 g / L, film-forming agent (polyethylene glycol) 0.9 g / L, corrosion inhibitor (methylbenzotriazole (TTA)) 1.0 g / L, and co-solvent (isopropanol) 22 g / L. The temperature was room temperature, and the immersion time was 5 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0148] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0149] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0150] Example 6

[0151] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0152] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0153] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 12 μm thickness. The hot-dip tin-plating temperature is 245℃ and the time is 4s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0154] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0155] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention. Table 3 is a composition table (wt%) of the hot-dip tin-plated layer according to the embodiments of the present invention.

[0156] (3) The degreasing process conditions in step (2) are as follows:

[0157] Sodium carbonate 30g / L, trisodium phosphate 56g / L, surfactant (sodium dodecylbenzenesulfonate) 9ml / L, temperature 57℃, soaking time 10s.

[0158] (4) The alkaline etching process in step (2) is as follows:

[0159] Sodium hydroxide 9 g / L, trisodium phosphate 40 g / L, sodium bicarbonate 26 g / L, sodium silicate 10 g / L, temperature 62℃, soaking time 9 s.

[0160] (7) The acid etching process in step (2) is as follows:

[0161] 85 ml / L concentrated sulfuric acid, room temperature, soaking time 8 seconds.

[0162] (8) The fluxing process in step (2) is as follows:

[0163] The immersion conditions were as follows: surfactant (oxalic acid) 12 g / L, film-forming agent (polyethylene glycol) 1.2 g / L, corrosion inhibitor (methylbenzotriazole (TTA)) 1.1 g / L, co-solvent (isopropanol) 25 g / L, room temperature, and immersion time 8 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0164] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0165] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0166] Example 7

[0167] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0168] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0169] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 14 μm thickness. The hot-dip tin-plating temperature is 233℃ and the time is 5s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0170] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0171] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention.

[0172] Table 3 shows the composition (wt%) of the hot-dip tin coating in the embodiments of the present invention.

[0173] (3) The degreasing process conditions in step (2) are as follows:

[0174] Sodium carbonate 24g / L, trisodium phosphate 57g / L, surfactant (sodium dodecylbenzenesulfonate) 9ml / L, temperature 56℃, soaking time 13s.

[0175] (4) The alkaline etching process in step (2) is as follows:

[0176] Sodium hydroxide 8 g / L, trisodium phosphate 44 g / L, sodium bicarbonate 27 g / L, sodium silicate 8 g / L, temperature 64℃, soaking time 10 s.

[0177] (5) The acid etching process in step (2) is as follows:

[0178] 72 ml / L concentrated sulfuric acid, room temperature, soaking time 4 seconds.

[0179] (6) The fluxing process in step (2) is as follows:

[0180] The immersion conditions were as follows: surfactant (acetic acid) 13 g / L, film-forming agent (polyethylene glycol) 1.4 g / L, corrosion inhibitor (mercaptobenzothiazole (MBT)) 1.5 g / L, co-solvent (isopropanol) 28 g / L, room temperature, and immersion time 14 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0181] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0182] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0183] Example 8

[0184] (1) Aluminum ingots and other aluminum-metal alloy ingots are put into a furnace and manufactured into aluminum-based rods through smelting, casting and rolling processes. The aluminum-based rods are then made into aluminum-based baselines through a continuous drawing and annealing process. The base material composition of the aluminum-based baselines is listed in Table 1. The specific preparation process of the aluminum-based baselines is the same as in Example 1.

[0185] See Table 1, which is a composition table (wt%) of the aluminum baseline material prepared according to the embodiments of the present invention.

[0186] (2) The surface of the aluminum baseline material obtained in step (1) is hot-dip tin-plated with a tin layer of 20 μm thickness. The hot-dip tin-plating temperature is 235℃ and the time is 5s. The hot-dip tin-plating process of the aluminum baseline material surface is as follows:

[0187] The process for aluminum baseline material is as follows: surface degreasing → alkaline etching → acid etching → water washing → flux application → hot-dip tinning → wire winding → inspection → hot-dip tinned aluminum baseline material. The composition of the material after hot-dip tinning of the aluminum baseline material is listed in Table 2.

[0188] See Table 2, which is a composition table (wt%) of the hot-dip tin-plated aluminum baseline material prepared according to the embodiments of the present invention.

[0189] Table 3 shows the composition (wt%) of the hot-dip tin coating in the embodiments of the present invention.

[0190] (3) The degreasing process conditions in step (2) are as follows:

[0191] Sodium carbonate 38g / L, trisodium phosphate 59g / L, surfactant (sodium dodecylbenzenesulfonate) 9ml / L, temperature 58℃, soaking time 14s.

[0192] (4) The alkaline etching process in step (2) is as follows:

[0193] Sodium hydroxide 10g / L, trisodium phosphate 48g / L, sodium bicarbonate 28g / L, sodium silicate 10g / L, temperature 68℃, soaking time 9s.

[0194] (5) The acid etching process in step (2) is as follows:

[0195] 52 ml / L concentrated sulfuric acid, room temperature, soaking time 3 seconds.

[0196] (6) The fluxing process in step (2) is as follows:

[0197] The active ingredient (acetic acid) was 14 g / L, the film-forming agent (polyethylene glycol) was 1.8 g / L, the corrosion inhibitor (mercaptobenzothiazole (MBT)) was 1.6 g / L, and the co-solvent (isopropanol) was 33 g / L. The temperature was room temperature, and the immersion time was 13 seconds. The polyethylene glycol was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-4000, with a molecular weight of 3600-4400 and a viscosity of 8.0-11.

[0198] The above-mentioned degreasing, alkaline etching, acid etching, and flux solutions are all aqueous solutions.

[0199] The properties of the hot-dip tin-plated aluminum baseline material prepared according to the above method were tested, and the results are shown in Table 4.

[0200] Table 1. Composition of Aluminum Base Material (wt%)

[0201]

[0202] Table 2. Composition (wt%) of aluminum baseline material after hot-dip tin plating

[0203]

[0204] Table 3. Composition of hot-dip tin coating (wt%)

[0205]

[0206]

[0207] Table 4 Performance Test Data of Aluminum-Based Hot-Dip Tin-Dip Wire

[0208]

[0209]

[0210] See Table 5, which shows the performance test data of the untreated aluminum baseline materials prepared in the comparative examples. The aluminum baseline materials in Comparative Examples 1-8 are the same as those used in Examples 1-8 for hot-dip tin plating.

[0211] Table 5 Performance Test Data of Aluminum Base Material

[0212]

[0213] See Table 6, which shows the performance test data of the prepared aluminum baseline material after electroplating with nickel and then tin. The aluminum baseline materials in Comparative Examples 9-16 are the same as those in Examples 1-8.

[0214] The electroplating process was carried out in accordance with patent CN116936155A, and the specific electroplating process is as follows:

[0215] ① The aluminum baseline material was obtained according to the preparation process in Example 1;

[0216] ② Electroplating a layer of tin onto the surface of the aluminum baseline material obtained in step ①, with the tin plating thickness being the same as in Examples 1-8. The tin plating process for the aluminum baseline material surface is as follows:

[0217] Chemical degreasing of aluminum alloy wire blank surface → hot water washing → cold water washing → strong alkali etching → water rinsing → brightening → water rinsing → zinc immersion → water rinsing → bright nickel plating → water rinsing → tin plating → water rinsing → drying → inspection → tin-plated aluminum alloy wire blank. The composition of the tin plating layer is listed in Table 3.

[0218] ③ The zinc immersion process conditions are as follows:

[0219] NaOH 180g / L, ZnO 30g / L, potassium sodium tartrate 50g / L, FeCl3·6H2O 16g / L, NaNO3 16g / L, at room temperature for 5min;

[0220] The electroplating bright nickel process is as follows:

[0221] NiSO4·6H2O 400g / L, NiCl2·6H2O 150g / L, H3BO4 80g / L, saccharin 10g / L, 1,4-butynediol 6g / L, coumarin 1g / L, sodium dodecyl sulfate 1g / L, pH 3.5g / L, Dk 6A / dm 2 Temperature 40℃, time 40min;

[0222] The tin plating process is as follows:

[0223] SnSO4 140g / L, H2SO4 240mL / L, SS-8 20 55mL / L (for initial tank setup). SS-8 2 15mL / L (additive), temperature 20℃, Dk 6A / dm 2 Time: 30 minutes.

[0224] Table 6 Performance Test Data of Aluminum-Based Electroplated Tin Wire

[0225]

[0226]

[0227] A comparison of the examples and comparative examples 1-16 revealed that the examples involved hot-dip tin plating on the surface of the aluminum base wire, while the comparative examples showed untreated aluminum base wire and aluminum base wire with electroplated tin plating, respectively. The untreated aluminum base wire showed little difference in electrical properties, elongation at break, yield strength, and 90-degree fatigue bending performance compared to the hot-dip tin-plated aluminum base wire in the examples, indicating that hot-dip tin plating did not significantly alter the original electrical and mechanical properties of the aluminum base wire. However, the electroplated tin aluminum base wire, while showing no significant change in electrical properties, exhibited significantly worse elongation at break, yield strength, and 90-degree fatigue bending performance. This indicates that the electroplating process greatly affects the mechanical and physical properties of the aluminum base wire, primarily because electroplating tin before nickel plating increases the brittleness and reduces the material's plasticity. Hot-dip tin-plated aluminum base wire, on the other hand, is not affected by the hot-dip tin plating layer, which essentially does not alter the mechanical and physical properties of the aluminum base wire. Referring to GB / T 4910 "Tinized Round Copper Wire" standard, the solderability of the hot-dip tin-plated layer was tested, and referring to GB / T4909.9 "Test Methods for Bare Conductors" Part 11: Coating Adhesion Test, the adhesion of the hot-dip tin-plated layer on aluminum baseline materials was tested. Through the adhesion and solderability tests of hot-dip tin-plated and electroplated tin-plated aluminum baseline materials, the test results showed that there was basically no difference in the adhesion and solderability of the coating, indicating that the technical effect of hot-dip tin-plated layer is basically the same as that of electroplated tin in terms of the adhesion and solderability of the tin-plated layer.

[0228] Comparative Example 17

[0229] The difference from Example 1 is that pure tin is used in the hot-dip tin plating process, and it basically does not contain other metals.

[0230] Comparative Example 18

[0231] The difference from Example 1 is that the raw materials used in the hot-dip tin plating process are Sn and Pb, and do not contain In and Bi.

[0232] Comparative Example 19

[0233] The difference from Example 1 is that the raw materials used in the hot-dip tin plating process are Sn and Pb, In, Bi, Ag, and Cd. The hot-dip tin plating layer comprises, by mass percentage, 25.28% Pb, 0.09% In, 2.88% Bi, 9.47% Ag, 1.28% Cd, and the balance Sn and impurities. The total amount of Pb, In, Bi, Ag, and Cd added in this comparative example is 50%, which exceeds the limitations of this invention.

[0234] Comparative Example 20

[0235] The difference from Example 1 is the parameters of the polyethylene glycol. The polyethylene glycol used in this comparative example was purchased from Tesco Chemical (Hubei) Co., Ltd., model PEG-2000, with a molecular weight of 1800-2200 and a viscosity of 5.0-6.7.

[0236] Comparative Example 21

[0237] The difference from Example 1 is that the concentration of polyethylene glycol is 5.0 g / L, which is higher than the range defined in this invention.

[0238] The aluminum-based hot-dip tin-plated conductor wires prepared in Comparative Examples 17–21 were tested, and the test results are shown in Table 7.

[0239] Table 7. Performance test data of aluminum-based hot-dip tin-plated conductor wires in Comparative Examples 17-21

[0240]

[0241] In Comparative Example 17, pure tin was used in the hot-dip tinning process, and all performance indicators met the requirements. The soldering temperature of the tin layer was high, generally exceeding 230°C, and the soldering time was relatively long, generally exceeding 2 seconds. Furthermore, its elongation at break and fatigue bending cycles were lower than those of the Example. In Comparative Example 18, the raw materials used in the hot-dip tinning process were Sn and Pb, including other raw materials. All performance indicators met the requirements. Because the raw material was a tin-lead alloy, the melting point was lower, and soldering could be achieved at approximately 183°C. The soldering time was less than 2 seconds, but its mechanical properties were somewhat reduced. In Comparative Example 19, the raw materials used in the hot-dip tinning process were Sn and Pb, In, Bi, Ag, and Cd. All performance indicators met the requirements. Because the raw material was a tin multi-element alloy, the melting point was lower, generally around 180°C. Welding can be achieved in less than 1 second, but the increased proportion of raw materials other than selenium leads to a decrease in elongation at break and fatigue bending cycles. Comparative Example 20 changed the molecular weight and viscosity of polyethylene glycol in the flux. The results showed that although the prepared wire material met all the requirements, its mechanical properties also decreased significantly, indicating that the parameters of polyethylene glycol affect the bonding performance between the aluminum alloy wire and the hot-dip tin layer. Comparative Example 21 changed the concentration of polyethylene glycol in the flux. Although the prepared wire material met all the requirements, its mechanical properties also decreased significantly, indicating that the concentration of polyethylene glycol affects the bonding performance between the aluminum alloy wire and the hot-dip tin layer, and thus affects the mechanical properties of the conductor wire.

[0242] Therefore, this invention provides an aluminum-based hot-dip tin-plated conductor wire with the above-mentioned structure, its preparation method, and its application. The aluminum-based conductor wire undergoes degreasing, alkaline etching, acid etching, water washing, flux treatment, and hot-dip tin plating. This process successfully solves the problems of continuous hot-dip tin plating process and efficiency for aluminum-based conductor wires, greatly improving the bonding force between aluminum-based materials and tin. This results in aluminum-based hot-dip tin-plated conductor materials with better wear resistance and toughness, effectively optimizing various performance indicators of aluminum-based conductor materials. It solves the problem of aluminum weldability while maintaining good ductility, yield strength, and electrical properties.

[0243] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. An aluminum-based hot-dip tin-plated conductor wire, characterized in that, It includes an inner and outer two-layer structure. The inner layer is an aluminum base material, and the outer layer is a hot-dip tin-plated layer. The thickness of the hot-dip tin-plated layer is 1 to 20 μm, and the transverse dimension of the aluminum base material is 0.1 to 3 mm. In aluminum-based hot-dip tin-plated conductor wires, tin accounts for 2-40% by mass percentage, with the remainder being aluminum and impurities.

2. The aluminum-based hot-dip tin-plated conductor wire according to claim 1, characterized in that, By weight percentage, aluminum base materials include the following raw materials: Fe 0~1.1% Mg 0-0.8% Cu 0–0.4% B 0～0.08％ Si 0~0.10% Zn 0~0.07% Al≥97％ The balance represents unavoidable impurities.

3. The aluminum-based hot-dip tin-plated conductor wire according to claim 1, characterized in that, By mass percentage, the hot-dip tin plating layer comprises the following raw materials: A：0.1％～40％； The balance is Sn and unavoidable impurities; A can be one or more of Pb, Bi, In, Ag, and Cd.

4. The aluminum-based hot-dip tin-plated conductor wire according to claim 1, characterized in that, The conductivity of aluminum-based hot-dip tin-plated conductor wire is >61% IACS, the elongation at break is >25%, the yield strength is ≤80MPa, and the fatigue bending at 90 degrees is >25 times.

5. A method for preparing an aluminum-based hot-dip tin-plated conductor wire according to any one of claims 1 to 4, characterized in that, Includes the following steps: 1) Raw materials are put into a furnace according to the proportion of metal elements in aluminum base material, and aluminum base rods are manufactured through smelting, casting and rolling processes. The aluminum base rods are then made into aluminum base material through continuous drawing and annealing process. 2) The aluminum baseline material obtained in the above steps is then subjected to degreasing treatment; 3) The aluminum baseline material obtained by the above steps through degreasing treatment is then subjected to alkaline etching treatment; 4) The aluminum baseline material obtained by alkaline etching in the above steps is then subjected to acid etching. 5) The aluminum baseline material obtained by acid etching in the above steps is then washed with water. 6) The aluminum baseline material obtained by the above steps through water washing is then treated with flux to form a layer of flux on the surface of the aluminum baseline material. 7) The aluminum baseline material treated with flux is then hot-dip tin-plated with a thickness of 1 to 20 μm in a tin bath at a temperature of 230 to 250°C for 1 to 5 seconds.

6. The method for preparing an aluminum-based hot-dip tin-plated conductor wire according to claim 5, characterized in that, Aluminum baseline materials undergo degreasing treatment, and the degreasing treatment solution includes: Sodium carbonate 20-40 g / L; Trisodium phosphate 50-60 g / L; Surfactant concentration: 5–10 ml / L; The degreasing treatment temperature is 50-60℃, and the soaking time is 3-15 seconds.

7. The method for preparing an aluminum-based hot-dip tin-plated conductor wire according to claim 5, characterized in that, Aluminum baseline materials undergo alkaline etching treatment. The alkaline etching treatment solution includes: Sodium hydroxide 5-10 g / L; Trisodium phosphate 30-50 g / L; Sodium bicarbonate 20-30 g / L; Sodium silicate 5-10 g / L; The temperature for alkaline etching treatment is 50–70℃, and the soaking time is 3–10 seconds.

8. The method for preparing an aluminum-based hot-dip tin-plated conductor wire according to claim 5, characterized in that, Aluminum baseline materials undergo acid etching treatment, and the acid etching solution includes: concentrated sulfuric acid 50-100 ml / L; The acid etching treatment was performed at room temperature, and the immersion time was 3–10 seconds.

9. The method for preparing an aluminum-based hot-dip tin-plated conductor wire according to claim 5, characterized in that, Aluminum baseline materials are treated with flux, and the flux treatment solution includes: Surfactant 7-15 g / L; Film-forming agent: 0.5–2.0 g / L; Corrosion inhibitor 0.5–1.8 g / L; Co-solvent 15-35 g / L; The flux treatment temperature is room temperature, and the immersion time is 1 to 15 seconds.

10. The application of an aluminum-based hot-dip tin-plated conductor wire as described in any one of claims 1 to 4 in photovoltaics, new energy vehicles, medium and low voltage electrical appliances and electrical equipment.

Images