Glue brushing process for pasting ESOP-8IC on FR-1 single-sided board
By combining solder paste stencil and adhesive mesh, the problem of not being able to use ESOP-8IC on FR-1 single-sided boards was solved, resulting in cost reduction and enhanced market competitiveness of LED lights.
Patent Information
- Application Number
- CN202411122201.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2026-03-03
AI Technical Summary
Existing technology cannot use ESOP-8IC on FR-1 single-sided panels, resulting in high costs and limiting the market competitiveness of LED lights.
The process employs a combination of solder paste stencil and adhesive mesh. The solder paste stencil has a first clearance opening at the ESOP-8IC pad position, and the adhesive mesh has a clearance groove between the ESOP-8IC pad and the FR-1 single-sided board pad. The mounting of the ESOP-8IC is achieved through specific steps.
Costs were reduced by enabling the use of the ESOP-8IC on the FR-1 single-sided board, thus lowering the overall cost of the LED lights.
Smart Images
Figure CN121604304A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an adhesive application process for attaching ESOP-8 ICs to an FR-1 single-sided PCB. Background Technology
[0002] Currently, the ICs used on FR-1 single-sided boards are mostly SOP-8 ICs, as ESOP-8 ICs cannot be used due to limitations in the adhesive application process. Furthermore, SOP-8 IC solutions are often more expensive than ESOP-8 ICs, resulting in a higher overall cost for LED lights and hindering market sales. Summary of the Invention
[0003] The main technical problem to be solved by the present invention is to provide a process for applying adhesive to attach ESOP-8 ICs to FR-1 single-sided boards.
[0004] To solve the above-mentioned technical problems, the present invention provides a process for applying adhesive to mount ESOP-8 ICs on an FR-1 single-sided board, characterized by the use of solder paste stencil and adhesive stencil; the solder paste stencil has a first clearance opening through the ESOP-8 IC pads; the adhesive stencil has a clearance groove through the ESOP-8 IC pads, and a second clearance opening through the adhesive stencil between the electronic component pads on the FR-1 single-sided board;
[0005] The solder paste stencil corresponding to ESOP-8IC includes the following steps:
[0006] 1) Apply solder paste to the pads of the ESOP-8IC using a solder paste stencil;
[0007] 2) Remove the solder paste stencil, cover the ESOP-8IC with adhesive stencil, and use the clearance groove to avoid the solder paste on the pads of the ESOP-8IC;
[0008] 3) Apply red glue to the glue net;
[0009] 4) Fix the ESOP-8I C with red glue on it onto the FR-1 single-sided panel.
[0010] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:
[0011] This invention provides a process for applying ESOP-8I C adhesive to FR-1 single-sided panels, which reduces costs compared to using SOP-8I C. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the solder paste stencil in a preferred embodiment of the present invention;
[0013] Figure 2This is a schematic diagram of the adhesive mesh in a preferred embodiment of the present invention. Detailed Implementation
[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0015] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed", "equipped", "sleeved / connected", "connected", etc., should be interpreted broadly. For example, "connection" can be a wall-mounted connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.
[0016] This embodiment provides a process for applying adhesive to ESOP-8I C on an FR-1 single-sided board, characterized by the use of solder paste stencil and adhesive stencil; the solder paste stencil has a first clearance opening through the ESOP-8I C pads; the adhesive stencil has a clearance groove through the ESOP-8I C pads, and a second clearance opening through the adhesive stencil between the electronic component pads on the FR-1 single-sided board;
[0017] The solder paste stencil corresponding to ESOP-8IC includes the following steps:
[0018] 1) Apply solder paste to the pads of ESOP-8IC using a solder paste stencil;
[0019] 2) Remove the solder paste stencil, cover the ESOP-8I C with adhesive mesh, and use the clearance groove to avoid the solder paste on the pads of the ESOP-8I C;
[0020] 3) Apply red glue to the glue net;
[0021] 4) Fix the ESOP-8I C with red glue on it onto the FR-1 single-sided panel.
[0022] The above description is merely a preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Any technically equivalent modifications made based on the content of this specification shall fall within the protection scope of the present invention.
Claims
1. A process for applying adhesive to ESOP-8 ICs on an FR-1 single-sided PCB, characterized in that... Solder paste stencil and adhesive mesh are used; the solder paste stencil has a first clearance opening through the position corresponding to the ESOP-8IC pad; the adhesive mesh has a clearance groove through the position corresponding to the ESOP-8IC pad, and a second clearance opening through the position corresponding to the position between the electronic component pads on the FR-1 single-sided board. The solder paste stencil corresponding to ESOP-8IC includes the following steps: 1) Apply solder paste to the pads of the ESOP-8IC using a solder paste stencil; 2) Remove the solder paste stencil, cover the ESOP-8IC with adhesive stencil, and use the clearance groove to avoid the solder paste on the pads of the ESOP-8IC; 3) Apply red glue to the glue net; 4) Fix the ESOP-8IC with red glue onto the FR-1 single-sided board.