Chip processing platform and installation method

Abstract

The chip processing platform comprises a heat conduction platform, a positioning assembly and a reference assembly, the positioning assembly is arranged on the periphery of the heat conduction platform, the positioning assembly comprises a positioning boss and a pressing plate arranged on the positioning boss, and the lower end face of the pressing plate is arranged on the upper end face of the heat conduction platform in a press fit mode; the multiple sets of reference assemblies are located on the side edges of the heat conduction platform correspondingly, each reference assembly comprises a reference plate and a protruding part arranged on the reference plate, each protruding part comprises a first arc-shaped part, a second arc-shaped part and a reference part arranged between the first arc-shaped part and the second arc-shaped part, and each reference part is provided with a first coating. The first coating is made of silicon carbide or aluminum nitride and has good heat conduction and thermal deformation prevention performance, so that the heat conduction platform can always keep good position precision in the installation and working links, and the processing precision of the chip is improved.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and in particular to a chip processing platform and mounting method. Background Technology In precision manufacturing and packaging testing, the chip processing platform, as a key component for carrying and positioning chips, directly affects the processing quality of processes such as photolithography, bonding, and testing due to its positional accuracy and thermal stability. Especially in high-temperature processes, such as reflow soldering, thermoforming, or high-temperature testing, the platform not only needs to provide a uniform and stable temperature field but also must maintain extremely high positioning repeatability during continuous heating and cooling to avoid micron-level displacement caused by thermal expansion or deformation, thereby ensuring the alignment accuracy and process consistency of chip processing.

[0002] Currently, most common chip processing platforms employ a combination of mechanical positioning and pressure bonding. For example, they use rigid blocks or pins for coarse positioning, followed by pressure from above using plates or cylinders for fixation. However, this structure has significant shortcomings during continuous heating: firstly, the contact area between the platform and the positioning reference is prone to slight deformation or displacement due to mismatched thermal expansion coefficients or uneven local temperature rise, leading to overall platform misalignment; secondly, the uneven heat dissipation of conventional metal reference components at high temperatures easily creates thermal gradients, further exacerbating the instability of the positioning surface. Especially in high-precision machining, even micron-level misalignment can severely affect overlay accuracy or wire bonding quality.

[0003] Therefore, how to ensure that the machining platform can be reliably constrained and maintain positional stability under thermal conditions in a working environment with alternating high and low temperatures has become an urgent problem to be solved in the existing technology. Summary of the Invention

[0004] The purpose of this invention is to provide a chip processing platform and installation method to solve the above-mentioned technical problems.

[0005] To achieve this objective, the present invention adopts the following technical solution: A chip processing platform, comprising: Heat conduction platform; A positioning component is disposed around the heat-conducting platform. The positioning component includes a positioning boss and a pressure plate disposed on the positioning boss. The lower end face of the pressure plate is pressed against the upper end face of the heat-conducting platform. The reference assembly is provided in multiple sets, and the multiple sets of reference assemblies are respectively located on each side of the heat conduction platform. The reference assembly includes a reference plate and a protrusion disposed on the reference plate. The protrusion includes a first arc-shaped portion and a second arc-shaped portion, and a reference portion disposed between the first arc-shaped portion and the second arc-shaped portion. The reference portion is provided with a first coating, which is made of silicon carbide or aluminum nitride.

[0006] Optionally, the chip fabrication platform may also include: A heating component is disposed on the lower end face of the heat-conducting platform, and the heating component is used to supply temperature to the heat-conducting platform.

[0007] Optionally, a calibration component is provided in the middle of the heat conduction platform, the calibration component including a first straight groove and a second straight groove arranged perpendicular to each other; A calibration hole is provided at the intersection of the first straight groove and the second straight groove. A reference mark is provided on the heating component at the position corresponding to the calibration hole. An optical imaging component is provided above the calibration component. The optical imaging component is used to obtain the overlapping area of ​​the calibration hole and the reference mark.

[0008] Optionally, the heating assembly includes: A heating plate, wherein a heat spreader is provided on the upper end surface of the heating plate, and the heat spreader is attached to the lower end surface of the heat-conducting platform; A heating element is embedded in the heating plate, and multiple sets of heating elements are arranged in an array.

[0009] Optionally, the heating element is a ceramic heating element, which is divided into a first ceramic heating element group and a second ceramic heating element group; The first ceramic heating core assembly is provided in two sets, and the two sets of the first ceramic heating core assembly are respectively provided on both sides of the heating plate. The first ceramic heating core assembly includes multiple heating core units arranged in an array along the X-axis direction. The second ceramic heating core assembly is disposed in the middle of the heating plate, and the second ceramic heating core assembly includes heating core units arranged in an array along the Y-axis direction.

[0010] Optionally, the chip fabrication platform may also include: A heat dissipation component is disposed on the lower end face of the heating component. The heat dissipation component has several heat dissipation channels inside, and pipe interfaces are provided at the ports of the heat dissipation channels.

[0011] Optionally, a protective layer is sprayed onto the surfaces of both the first arc-shaped portion and the second arc-shaped portion. The protective layer is a silicon carbide-based composite coating, and the thickness of the protective layer is 1 μm to 50 μm.

[0012] Optionally, the positioning component further includes a mounting plate, with a positioning boss at each of the two ends of the mounting plate, and a mounting groove formed between the two positioning bosses, and the reference plate is installed in the mounting groove; The mounting groove has a positioning hole at a preset position, and the reference plate is fixedly connected to the positioning hole by positioning bolts.

[0013] The present invention also provides a method for installing a chip processing platform, applied to the chip processing platform described above, the method comprising the following steps: S1, install reference components on each side of the heat conduction platform, so that the protrusions on the reference plate face the heat conduction platform, in order to establish a surrounding positioning reference. S2, Install positioning components around the heat-conducting platform to press the lower end face of the pressure plate against the upper end face of the heat-conducting platform; S3, the heating component is installed on the lower end face of the fixed heat-conducting platform, and the relative position of the calibration hole and the reference mark dot set on the heating component is obtained by optical imaging using the calibration component set in the middle of the heat-conducting platform. The heating component is adjusted until the overlapping area of ​​the calibration hole and the reference mark dot meets the preset requirements.

[0014] Optionally, step S3 may further include: S4. Install a heat dissipation component on the lower end face of the heating component and connect the pipe interface to the heat dissipation channel port of the heat dissipation component to establish a cooling medium flow path.

[0015] Compared with the prior art, the present invention has the following beneficial effects: During operation, multiple sets of reference components are set on each side of the heat-conducting platform. The protrusions on the reference plate serve as positioning references for the heat-conducting platform. Due to the combined action of the first and second arc-shaped parts, when the heat-conducting platform is positioned, it spontaneously shifts towards the central reference part through the action of the two arc surfaces and abuts against it, forming a self-calibration effect on the heat-conducting platform. Then, the positioning components press the pressure plate onto the upper end surface of the heat-conducting platform, which serves to position the heat-conducting platform vertically. Since the reference part is provided with a first coating of silicon carbide or aluminum nitride, it has good thermal conductivity and heat deformation resistance, avoiding the displacement of the heat-conducting platform during heating. Thus, it ensures that the heat-conducting platform can always maintain good positional accuracy during installation and operation, providing processing accuracy for the chip. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0018] Figure 1 This is a schematic diagram of the overall structure of the chip processing platform in this embodiment. Figure 2 This is a schematic diagram of the structure of the reference components of the chip processing platform in this embodiment. Figure 3 This is a partially enlarged structural diagram of one end of the reference board of the chip processing platform in this embodiment. Figure 4 This is a schematic diagram of the calibration component of the chip processing platform in this embodiment. Figure 5 This is a schematic diagram of the heating assembly of the chip processing platform in this embodiment. Figure 6 This is a schematic diagram of the arrangement structure of the heating core of the chip processing platform in this embodiment.

[0019] Figure description: Heat conduction platform 10, positioning component 20, positioning boss 21, pressure plate 22, reference component 30, reference plate 31, protrusion 32, first arc-shaped part 321, second arc-shaped part 322, reference part 323, heating component 40, calibration component 11, first straight groove 111, second straight groove 112, calibration hole 113, heating plate 41, heat spreader 42, heating core 43, first ceramic heating core assembly 431, second ceramic heating core assembly 432, heat dissipation component 50, pipe interface 51, mounting plate 23, positioning hole 24, reference mark dot 44. Detailed Implementation

[0020] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1: Combination Figures 1 to 6 As shown, this embodiment of the invention provides a chip processing platform, including: a heat-conducting platform 10, a positioning component 20, a reference component 30, a heating component 40, and a heat dissipation component 50.

[0024] Thermal platform 10; Thermal platform 10 is the core load-bearing and thermal management component of the chip processing platform. It is used to bear the chip being processed and to withstand the pressing force of the pressure plate 22 above. At the same time, it serves as a heat diffusion and conduction medium for the process heat source.

[0025] It should be noted that the heat conduction platform 10 is preferably made of metal or metal composite material with high thermal conductivity. The heat conduction platform 10 has a heat spreader 42 and a heat-generating component interface surface that are closely attached to it (or directly attached to the heat-generating plate 41) to ensure that the temperature inside the plate is uniform and the temperature field is stable after the heat source is introduced. The platform is surrounded by a mounting groove, a positioning hole 24 and a reference contact surface that cooperates with the reference component 30 and the positioning component 20.

[0026] The positioning component 20 is disposed around the heat conduction platform 10. The positioning component 20 includes a positioning boss 21 and a pressure plate 22 disposed on the positioning boss 21. The lower end face of the pressure plate 22 is pressed against the upper end face of the heat conduction platform 10.

[0027] Combination Figure 1 and Figure 6As shown, the positioning components 20 are arranged around the heat-conducting platform 10 and constrain and clamp the heat-conducting platform 10 in the vertical direction (up and down) and part of the lateral direction through the positioning bosses 21 and the pressure plate 22. Each positioning component 20 consists of an integral or separate positioning boss 21, an adjustable pressure plate 22, an elastic or preload adjustment mechanism, and a mounting plate 23. The positioning boss 21 serves as a load-bearing unit in contact with the heat-conducting platform 10, and its material is preferably high-strength heat-resistant stainless steel or ceramic inserts to withstand high temperatures and repeated contact wear. The lower end face of the pressure plate 22 is pressed against the upper end face of the heat-conducting platform 10, and the pressure plate 22 can achieve controllable clamping force through bolts, spring columns, or pneumatic actuators.

[0028] Combination Figures 1 to 3 As shown, the reference assembly 30 is provided in multiple sets, and the multiple sets of reference assemblies 30 are respectively located on each side of the heat conduction platform 10. The reference assembly 30 includes a reference plate 31 and a protrusion 32 provided on the reference plate 31. The protrusion 32 includes a first arc-shaped portion 321 and a second arc-shaped portion 322, and a reference portion 323 provided between the first arc-shaped portion 321 and the second arc-shaped portion 322. The reference portion 323 is provided with a first coating, which is made of silicon carbide or aluminum nitride.

[0029] It should be noted that each set of reference components 30 includes a reference plate 31 and a protrusion 32 disposed on the reference plate 31. The protrusion 32 is composed of a first arc-shaped portion 321, a second arc-shaped portion 322, and a reference portion 323 located between the two. The first coating (such as silicon carbide or aluminum nitride) provides excellent thermal conductivity and thermal stability to suppress local thermal displacement during heating, while also having high hardness and wear resistance to maintain accuracy during multiple contact processes. The reference component 30 as a whole can adopt a composite structure of metal substrate + ceramic coating to obtain rigid support and surface functionality.

[0030] The reference plate 31 is fixed to the positioning hole 24 in the mounting groove by positioning bolts, and is designed with a small adjustment margin to allow for fine-tuning of position during optical calibration or debugging. To improve durability, a wear-resistant protective layer can be applied to the contact surface of the first arc-shaped part 321 and the second arc-shaped part 322, and the bonding strength between the coating and the first coating of the reference part 323 is ensured by appropriate surface pretreatment and spraying / CVD process.

[0031] The working principle of this invention is as follows: During operation, multiple sets of reference components 30 are set on each side of the heat-conducting platform 10. The protrusion 32 on the reference plate 31 serves as a positioning reference for the heat-conducting platform 10. Due to the combined action of the first arc-shaped part 321 and the second arc-shaped part 322, when the heat-conducting platform 10 is positioned, it spontaneously shifts towards the reference part 323 in the middle through the action of the two arc surfaces, forming a self-calibration effect on the heat-conducting platform 10. Then, the positioning component 20 presses the pressure plate 22 onto the upper end surface of the heat-conducting platform 10, which serves as the upper and lower positioning effect for the heat-conducting platform 10. Since the reference part 323 is provided with a first coating of silicon carbide or aluminum nitride, it has good thermal conductivity and heat deformation resistance, avoiding the deviation of the heat-conducting platform 10 during the heating process. Thus, it ensures that the heat-conducting platform 10 can always maintain good positional accuracy during installation and operation, providing processing accuracy for the chip.

[0032] In this embodiment, combined with Figure 5 and Figure 6 As shown, the chip processing platform also includes a heating component 40, which is disposed on the lower end face of the heat conduction platform 10. The heating component 40 is used to supply heat to the heat conduction platform 10.

[0033] It should be noted that the heating component 40 is arranged on the lower end face of the heat-conducting platform 10 to maintain a stable temperature field within the required process temperature range. To ensure heat transfer efficiency and temperature field uniformity, the upper end face of the heating component 40 and the lower end face of the heat-conducting platform 10 should be in close thermal contact. Contact thermal resistance can be improved by pressing the contact surfaces together, filling with thermal interface materials, or using aluminum / copper alloy thermally conductive pads. The support structure of the heating component 40 should have sufficient mechanical rigidity and thermal isolation design to reduce the transmission of mechanical stress caused by thermal expansion to the positioning and reference system.

[0034] The heating element 40 is typically combined with a temperature sensor (such as a platinum resistance thermometer Pt100 or a thermocouple) and a temperature control unit for closed-loop control to achieve rapid temperature rise, steady-state maintenance, and controlled cooling.

[0035] In this embodiment, it is further explained that, in combination with Figure 1 and Figure 4 As shown, a calibration component 11 is provided in the middle of the heat conduction platform 10. The calibration component 11 includes a first straight groove 111 and a second straight groove 112 arranged perpendicularly to each other. A calibration hole 113 is provided at the intersection of the first straight groove 111 and the second straight groove 112. A reference mark dot 44 is provided on the heating component 40 at the position corresponding to the calibration hole 113. An optical imaging component is provided above the calibration component 11. The optical imaging component is used to obtain the overlapping area of ​​the calibration hole 113 and the reference mark dot 44.

[0036] It should be noted that the heating component 40 has a reference mark 44 (e.g., a high-contrast laser-engraved mark or a metal / ceramic dot) set at the corresponding position. After the heat conduction platform 10 is in place, the optical imaging component is positioned above the calibration component 11 to simultaneously acquire the projected images of the calibration hole 113 and the reference mark. By calculating the overlap area or overlap center deviation of the two through image processing algorithms, the radial and planar deviations of the heat conduction platform 10 relative to the heating component 40 can be quantitatively evaluated and used as a basis for automatic or manual fine-tuning.

[0037] The advantages of this calibration scheme are that it can perform precise testing before and after assembly and hot working, and can detect and compensate for initial assembly errors and relative displacement caused by thermal expansion, thereby ensuring that the relative position between the heat conduction platform 10 and the heating component always meets the processing accuracy requirements during the heating process.

[0038] Combination Figure 5 and Figure 6 As shown in this embodiment, the heating component 40 specifically includes: Heating plate 41, with a heat spreader 42 on the upper surface of heating plate 41, the heat spreader 42 being attached to the lower surface of heat conduction platform 10; The heating element 43 is embedded in the heating plate 41. Multiple sets of heating elements 43 are arranged in an array.

[0039] It should be noted that the upper layer is a heat spreader plate 42 (also known as a heat diffusion plate). The lower or upper surface of the heat spreader plate 42 is in surface contact with the lower end face of the heat conduction platform 10 to achieve thermal balance and temperature field uniformity. Below the heat spreader plate 42 is a load-bearing heating plate 41. Multiple sets of heating cores 43 (heating units) are embedded in the heating plate 41 or on its main body. The heating cores 43 are arranged in an array to form controlled heating zones. By implementing independent power supply and closed-loop temperature control for each set of heating cores 43, local temperature adjustment, compensation for local heat loss, and rapid thermal response can be achieved.

[0040] Combination Figure 6 As shown, in this embodiment, as an optional solution, the heating element 43 is a ceramic heating element 43, which is divided into a first ceramic heating element group 431 and a second ceramic heating element group 432. Among them, the first ceramic heating core group 431 is provided in two groups, and the two groups of first ceramic heating core groups 431 are respectively provided on both sides of the heating plate 41. The first ceramic heating core group 431 includes multiple heating core 43 units arranged in an array along the X-axis direction. The second ceramic heating core assembly 432 is disposed in the middle of the heating plate 41. The second ceramic heating core assembly 432 includes heating core 43 units arranged in an array along the Y-axis direction.

[0041] It should be noted that the heating element 43 is a single ceramic heating element 43, functionally divided into a first ceramic heating element group 431 and a second ceramic heating element group 432 to form an array heating structure. Specifically, the two first ceramic heating element groups 431 are respectively arranged on both sides of the heating plate 41, each group consisting of several heating element 43 units arranged along the X-axis, used to compensate for heat loss at the edges and enhance side edge temperature control; the second ceramic heating element group 432 is located in the middle of the heating plate 41, consisting of heating element 43 units arranged along the Y-axis, used to control the temperature uniformity and rapid response of the central area. Each heating element group 43 can be independently powered and equipped with independent temperature sensing and closed-loop control loops to achieve temperature gradient compensation and dynamic adjustment in different areas.

[0042] The advantages of using ceramic heating core 43 are: ceramic materials have good high temperature stability, electrical insulation and thermal shock resistance. The arrayed and partitioned arrangement helps to optimize the temperature field distribution of the heat conduction platform 10 by local heating or local power reduction, thereby significantly improving the temperature field uniformity and thermal response speed when facing different process requirements, and reducing dimensional drift and assembly errors caused by local temperature differences.

[0043] Combination Figure 5 As shown, in this embodiment, the chip processing platform further includes: The heat dissipation component 50 is disposed on the lower end face of the heating component 40. The heat dissipation component 50 has several heat dissipation channels inside, and the ports of the heat dissipation channels are provided with pipe interfaces 51.

[0044] The heat dissipation component 50 has several interconnected or independent heat dissipation channels inside. Standardized pipe interfaces 51 are set at the channel ports to facilitate quick connection with the cooling circuit (such as a coolant or gas cooling system). The heat dissipation channels can be designed to be distributed sequentially or in parallel, and flow equalization chambers and distribution manifolds are set at key points to ensure the uniformity of flow in each channel.

[0045] To improve heat exchange efficiency, microstructures (such as microfins or vortex generators) can be adopted on the inner wall of the channel to enhance turbulence and increase the heat exchange area. At the same time, high thermal conductivity and corrosion resistance materials (such as copper alloys or anodized aluminum alloys, and anti-corrosion surface treatment can be applied to the internal contact area with the cooling medium) should be selected.

[0046] As a preferred embodiment, the surfaces of the first arc-shaped portion 321 and the second arc-shaped portion 322 are both coated with a protective layer. The protective layer is a silicon carbide-based composite coating, and the thickness of the protective layer is 1μm to 50μm, so as to provide the necessary mechanical protection and thermal function without significantly increasing the contact thermal resistance.

[0047] The silicon carbide-based composite coating possesses high thermal conductivity, high hardness, and excellent oxidation resistance. It is thermally compatible with the reference surface 323 (if it is SiC or a material with matching thermal expansion), significantly reducing stress accumulation caused by interfacial thermal expansion differences during thermal cycling. In mechanical contact, the coating improves wear resistance and reduces microscale plastic deformation, thereby extending the service life of the reference surface and maintaining positioning repeatability. The coating is preferably prepared using plasma spraying, chemical vapor deposition, or a thermal spraying-post-treatment combination process.

[0048] Combination Figure 1 and Figure 6 As shown, in this embodiment, the positioning component 20 further includes a mounting plate 23. A positioning boss 21 is provided at each of the two ends of the mounting plate 23. A mounting groove is formed between the two positioning bosses 21. The reference plate 31 is installed in the mounting groove. A positioning hole 24 is provided at a preset position of the mounting groove. The reference plate 31 is fixedly connected to the positioning hole 24 by a positioning bolt.

[0049] Example 2: The present invention also provides a method for installing a chip processing platform, applicable to the chip processing platform as described in Embodiment 1, the method comprising the following steps: S1, install reference components 30 on each side of the heat conduction platform 10, so that the protrusions 32 on the reference plate 31 face the heat conduction platform 10, so as to establish a surrounding positioning reference. S2, install positioning components 20 around the heat conduction platform 10 to press the lower end face of the pressure plate 22 onto the upper end face of the heat conduction platform 10; S3, the heating component 40 is installed on the lower end face of the fixed heat-conducting platform 10, and the relative position of the calibration hole 113 and the reference mark dot set on the heating component 40 is obtained by optical imaging using the calibration component 11 set in the middle of the heat-conducting platform 10. The heating component 40 is adjusted until the overlapping area of ​​the calibration hole 113 and the reference mark dot meets the preset requirements.

[0050] S4. Install the heat dissipation component 50 on the lower end face of the heating component 40, and connect the pipe interface 51 to the heat dissipation channel port of the heat dissipation component 50 to establish a cooling medium flow path.

[0051] The beneficial effects of this invention are as follows: This installation process sequentially integrates mechanical reference, pressing and positioning, optical calibration, and cooling connection. It utilizes the surrounding reference component 30 and the pressure plate 22 to achieve stable constraint of the heat-conducting platform 10, and achieves precise alignment of the heating component 40 and the heat-conducting platform 10 in planar position through optical coincidence detection of the reference mark and calibration hole 113. Subsequently, the heat dissipation component 50 is incorporated into the cooling circuit to ensure positional stability under thermal steady-state conditions. The overall process can effectively eliminate the relative displacement caused by assembly errors and thermal expansion, improve the repeatability of the positioning between the heat-conducting platform 10 and the heat source during processing, thereby improving the dimensional accuracy of chip processing.

[0052] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip processing platform, characterized by, The chip processing platform comprises: a heat-conducting platform; a positioning assembly arranged at the periphery of the heat-conducting platform, the positioning assembly comprising a positioning boss and a pressing plate arranged on the positioning boss, the lower end surface of the pressing plate being pressed against the upper end surface of the heat-conducting platform; a plurality of reference assemblies, each of which is arranged at a side of the heat-conducting platform, the reference assembly comprising a reference plate and a protruding part arranged on the reference plate, the protruding part comprising a first arc-shaped part and a second arc-shaped part, and a reference part arranged between the first arc-shaped part and the second arc-shaped part, the reference part being provided with a first coating, the first coating being made of silicon carbide or aluminum nitride.

2. The chip processing platform of claim 1, wherein, Further comprising: a heating assembly arranged at the lower end surface of the heat-conducting platform, the heating assembly being used for heating the heat-conducting platform.

3. The chip processing platform of claim 2, wherein, The middle part of the heat-conducting platform is provided with a calibration assembly, the calibration assembly comprising a first straight slot and a second straight slot arranged perpendicularly to each other; wherein the intersection of the first straight slot and the second straight slot is provided with a calibration hole, the heating assembly is provided with a reference Mark dot at a position corresponding to the calibration hole, and the upper part of the calibration assembly is provided with an optical imaging assembly, the optical imaging assembly being used for acquiring the overlapping area of the calibration hole and the reference Mark dot.

4. The chip processing platform of claim 2, wherein, The heating assembly comprises: a heating plate, the upper end surface of the heating plate being provided with a heat spreading plate, the heat spreading plate being arranged against the lower end surface of the heat-conducting platform; a heating core, the heating core being embeddedly installed on the heating plate, the heating core being provided with a plurality of groups, and the groups of the heating core being arranged in an array.

5. The chip processing platform of claim 4, wherein, The heating core is a ceramic heating core, the ceramic heating core being divided into a first ceramic heating core group and a second ceramic heating core group; wherein the first ceramic heating core group is provided with two groups, the two groups of the first ceramic heating core group being arranged at the two side parts of the heating plate respectively, and the first ceramic heating core group comprising a plurality of heating core monomers arranged in an array along the X-axis direction; the second ceramic heating core group being arranged at the middle part of the heating plate, and the second ceramic heating core group comprising heating core monomers arranged in an array along the Y-axis direction.

6. The chip processing platform of claim 1, wherein, Further comprising: a heat dissipation assembly arranged at the lower end surface of the heating assembly, the heat dissipation assembly being internally provided with a plurality of heat dissipation channels, and the ports of the heat dissipation channels being provided with pipe interfaces.

7. The chip processing platform of claim 1, wherein, The surfaces of the first arc-shaped part and the second arc-shaped part are each provided with a protective layer, the protective layer being a silicon carbide-based composite coating, and the thickness of the protective layer being 1 μm-50 μm.

8. The chip processing platform of claim 1, wherein, The positioning assembly further comprises a mounting plate, the two ends of the mounting plate being respectively provided with the positioning boss, and a mounting groove being formed between the two positioning bosses, the reference plate being mounted in the mounting groove; wherein the mounting groove is provided with a positioning hole at a predetermined position, and the reference plate is fixedly connected to the positioning hole through a positioning bolt.

9. A method of mounting a chip processing platform, characterized by, The mounting method is applied to the chip processing platform according to any one of claims 1-8, and the mounting method comprises the following steps: S1, installing the reference assembly at each side of the heat-conducting platform, so that the protruding part on the reference plate faces the heat-conducting platform, to establish a surrounding positioning reference. S2, installing a positioning assembly around the periphery of the heat-conducting platform, and pressing the lower end surface of the pressing plate against the upper end surface of the heat-conducting platform; S3, installing a heating assembly on the lower end surface of the fixed heat-conducting platform, and using a calibration assembly arranged in the middle of the heat-conducting platform to obtain the relative positions of a calibration hole and a reference Mark dot arranged on the heating assembly through optical imaging, and adjusting the heating assembly until the overlapping area of the calibration hole and the reference Mark dot meets preset requirements.

10. The method of claim 9, wherein The step S3 is followed by further steps of: S4, installing a heat-dissipating assembly on the lower end surface of the heating assembly, and connecting a pipeline interface to the heat-dissipating channel port of the heat-dissipating assembly to establish a cooling medium flow path.

Images