Device and method for adjusting dispatching priority
By adjusting the dispatching priority method, based on the wafer priority and waiting time, batches of wafers with the same process parameters are dispatched first, solving the problem of excessively long hot plate temperature adjustment time and improving wafer production efficiency and capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-17
- Publication Date
- 2026-03-10
AI Technical Summary
In existing technologies, different photoresists have different temperature requirements at different baking stages, resulting in excessively long hot plate temperature adjustment time, which affects wafer production capacity.
By adjusting the dispatching priority method, based on the wafer priority and waiting time, batches of wafers with the same process parameters are dispatched first, reducing the number of temperature adjustments and improving production efficiency.
This reduces the time required to adjust the hot plate temperature, thereby improving wafer production efficiency and capacity.
Smart Images
Figure CN121634735A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor, in particular to a device and method for adjusting dispatching priority. BACKGROUND
[0002] Different hot plates have different functions in the photolithography process. The hot plate functions to bake the water vapor in the photoresist dry, so as to facilitate the subsequent exposure, development and etching processes, and form effective patterns. In the production process, due to different photoresists and different stages, different bake (Bake) temperatures are required. Assuming that there are three bake stages, namely soft bake (SB), post-exposure bake (PEB) and hard bake (HB) stages, the bake temperatures of different parameters in the three stages may be different.
[0003] The prior art dispatching method adopts the first lot priority dispatching, and the rest of the lot is randomly arranged and run. For example, if there are six batches of wafers, lot1 is generated first, and the rest of the lot is waiting. The SB temperature of the previous lot is 130℃, and the SB temperature of the next lot is 90℃, so the SB temperature needs to be reduced from 130℃ to 90℃ before the next lot is baked.
[0004] However, the wafers will wait on the cold plate before the hot plate temperature is adjusted, which takes about 50min~70min, so the daily wafer production capacity (WPD) of the machine is low, which affects the production capacity. SUMMARY
[0005] The purpose of the present application is to provide a device and method for adjusting dispatching priority, which can improve the production capacity.
[0006] In order to achieve the above purpose, the present application provides a method for adjusting dispatching priority, comprising:
[0007] S11: obtaining the priority, waiting time and process parameters of each batch of wafers, each process parameter comprising soft bake temperature, post-exposure bake temperature, hard bake temperature, wafer edge exposure and edge glue removal;
[0008] S12: sequentially judging whether the value of the priority of each batch of wafers reaches a first preset condition, and if the value of the priority reaches the first preset condition, issuing a dispatching instruction for the priority dispatching of the corresponding batch of wafers;
[0009] S13: for all batches of wafers whose priority value does not reach the first preset condition, sequentially judging whether the value of the waiting time of each batch of wafers reaches a second preset condition, and if the value of the waiting time reaches the second preset condition, issuing a dispatching instruction for the priority dispatching of the corresponding batch of wafers;
[0010] S14: for all batches of wafers whose waiting time values do not reach the second preset condition, collecting process parameters of the batches of wafers, counting the number of batches of wafers whose soft baking, post-exposure baking and hard baking temperatures are all the same, and sorting the number of batches of wafers from large to small, and issuing a dispatch instruction for dispatching the batches of wafers in the order from large to small.
[0011] Optionally, in the method for adjusting the dispatch priority, the first preset condition includes that the value of the priority is 1 or the value of the priority is 2.
[0012] Optionally, in the method for adjusting the dispatch priority, the second preset condition includes that the value of the waiting time is less than or equal to 180 min.
[0013] Optionally, in the method for adjusting the dispatch priority, one process parameter corresponds to one batch of wafers.
[0014] Optionally, in the method for adjusting the dispatch priority, after the dispatch, the wafer starts a process flow, and the process flow includes coating photoresist, soft baking, soft baking, exposure, post-exposure baking, development and hard baking.
[0015] Optionally, in the method for adjusting the dispatch priority, in step S12, after the dispatch instruction for preferentially dispatching the corresponding batch of wafers is issued, the batches of wafers subjected to the screening process are sequentially dispatched.
[0016] Optionally, in the method for adjusting the dispatch priority, in step S13, after the dispatch instruction for preferentially dispatching the corresponding batch of wafers is issued, the batches of wafers subjected to the screening process are sequentially dispatched.
[0017] Optionally, in the method for adjusting the dispatch priority, in step S15, after the dispatch instruction for dispatching the batches of wafers in the order from large to small is issued, the batches of wafers subjected to the screening process are sequentially dispatched in the order from large to small.
[0018] The application further provides a device for adjusting the dispatch priority, which is used for implementing the method for adjusting the dispatch priority and includes:
[0019] The first module is used for obtaining the priority, waiting time and process parameters of each batch wafer, each process parameter comprises a soft baking temperature, a post-exposure baking temperature, a hard baking temperature, wafer edge exposure and edge adhesive removal; and is further used for sequentially judging whether the value of the priority of each batch wafer reaches a first preset condition, if the value of the priority reaches the first preset condition, the corresponding batch wafer is preferentially dispatched; and for all batch wafers whose value of the priority does not reach the first preset condition, the first module is further used for sequentially judging whether the value of the waiting time of each batch wafer reaches a second preset condition, if the value of the waiting time reaches the second preset condition, a dispatching instruction of preferentially dispatching the corresponding batch wafer is sent out;
[0020] The second module is used for collecting the process parameters of each batch wafer, and is further used for counting the number of batch wafers whose soft baking temperature, post-exposure baking temperature and hard baking temperature are all the same, and sorting the batch wafers from large to small, and sending out a dispatching instruction of dispatching the batch wafers in the order from large to small.
[0021] Optionally, in the device for adjusting the dispatching priority, the first module and the second module both send out the dispatching instruction every certain period of time.
[0022] In the device and method for adjusting the dispatching priority provided by the application, the first module adjusts the dispatching priority of the batch wafers according to the priority and the waiting time. The second module adjusts the dispatching priority of the batch wafers according to the number of batch wafers whose soft baking temperature, post-exposure baking temperature and hard baking temperature are all the same. The number of times of increasing or decreasing the baking temperature is reduced, the waiting time is reduced, and the WPD and the production capacity are improved. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is a flow chart of the method for adjusting the dispatching priority according to an embodiment of the application. DETAILED DESCRIPTION
[0024] The specific embodiments of the application will be described in more detail below with reference to the accompanying drawings. The advantages and features of the application will be more apparent according to the following description. It should be noted that the drawings are very simplified and use non-precise proportions, and are only used to facilitate and clarify the purpose of assisting the description of the embodiments of the application.
[0025] Hereinafter, the terms "first", "second", etc. are used to distinguish between similar elements, and are not necessarily used to describe a particular order or time sequence. It is to be understood that these terms, as used herein, can be replaced where appropriate. Similarly, if the method described herein includes a series of steps, and the order of these steps presented herein is not necessarily the only order in which the steps can be performed, and some of the steps described can be omitted and / or some other steps not described herein can be added to the method.
[0026] Reference should be made to Figure 1 The present application provides a method for adjusting dispatch priority, comprising:
[0027] S11: Obtain the priority, waiting time and process parameters of each batch of wafers, each process parameter comprising soft baking temperature, post-exposure baking temperature, hard baking temperature, wafer edge exposure and edge adhesive removal;
[0028] S12: Determine whether the value of the priority of each batch of wafers reaches a first preset condition in turn, and if the value of the priority reaches the first preset condition, issue a dispatch instruction for preferential dispatch of the corresponding batch of wafers;
[0029] S13: For all batches of wafers whose priority value does not reach the first preset condition, determine whether the value of the waiting time of each batch of wafers reaches a second preset condition in turn, and if the value of the waiting time reaches the second preset condition, issue a dispatch instruction for preferential dispatch of the corresponding batch of wafers;
[0030] S14: For all batches of wafers whose waiting time value does not reach the second preset condition, collect the process parameters of each batch of wafers, count the number of batches of wafers whose soft baking, post-exposure baking and hard baking temperatures are the same, and sort them from large to small, and issue a dispatch instruction for dispatching the batches of wafers in the order from large to small.
[0031] Correspondingly, the present application also provides a device for adjusting dispatch priority, for implementing the method for adjusting dispatch priority, comprising:
[0032] The first module is used for acquiring the priority, waiting time and process parameters of each batch wafer, each process parameter comprises a soft bake temperature, a post-exposure bake temperature, a hard bake temperature, wafer edge exposure and edge adhesive removal, and is further used for sequentially judging whether the value of the priority of each batch wafer reaches a first preset condition, if the value of the priority reaches the first preset condition, the corresponding batch wafer is preferentially dispatched, and for all batch wafers whose value of the priority does not reach the first preset condition, the module is further used for sequentially judging whether the value of the waiting time of each batch wafer reaches a second preset condition, if the value of the waiting time reaches the second preset condition, a dispatch instruction of preferentially dispatching the corresponding batch wafer is sent out;
[0033] The second module is used for collecting the process parameters of each batch wafer, and further used for counting the number of batch wafers whose soft bake temperature, post-exposure bake temperature and hard bake temperature are all the same, and sorting the batch wafers from large to small, and sending out a dispatch instruction of dispatching the batch wafers in the order from large to small.
[0034] The first preset condition of the embodiment of the application comprises that the value of the priority is 1 or the value of the priority is 2. If the value of the priority of a batch wafer is 1 or 2, the corresponding batch wafer is preferentially dispatched. If there are multiple batches of wafers whose value of the priority is 1 or 2, the multiple batch wafers are sequentially dispatched for production. In other embodiments of the application, the first preset condition can also be other values, for example, the value of the priority is less than or equal to 3.
[0035] When the value of the priority is greater than or equal to 3, whether the second preset condition is reached is judged. The second preset condition of the embodiment of the application comprises that the value of the waiting time is less than or equal to 180 min. If the value of the priority of a batch wafer is 1 or 2, the corresponding batch wafer is preferentially dispatched. If there are multiple batches of wafers whose value of the priority is 1 or 2, the multiple batch wafers are sequentially dispatched for production. In other embodiments of the application, the second preset condition can also be other values, for example, the value of the waiting time is less than or equal to 160 min.
[0036] As shown in Table 1, A1~A10 are wafer batch IDs, with corresponding priority values (Pri) of 1, 2, 3, 4, 4, 5, 6, 6, 7, and 7, respectively. The corresponding waiting times (Q-time) are 10 min, 20 min, 30 min, 40 min, 50 min, 60 min, 70 min, 80 min, 90 min, and 100 min, respectively. The corresponding process parameter (Recipe) IDs are Recipe1 to Recipe10. Generally, one process parameter corresponds to one batch of wafers. A process parameter includes soft bake temperature, post-exposure bake temperature, hard bake temperature, wafer edge exposure, and edge resist removal. Therefore, batches with identical process parameters may exist. The acquisition and judgment of all parameters in Table 1, as well as the output of instructions, are all executed by the first module.
[0037] Table 1
[0038] The soft bake temperature is 80℃~130℃. The post-exposure bake temperature is 100℃~120℃. The hard bake temperature is 110℃~140℃. As shown in Table 2, taking six batches of wafers as an example, the Lot IDs are lot~lot6. The corresponding process parameters are Recipe1~Recipe6, each process parameter including a soft bake (SB) temperature, a post-exposure bake (edge resist removal) temperature, a hard bake (HB) temperature, WEE, and EBR. For Lot1, the soft bake (SB) temperature, post-exposure bake (edge resist removal) temperature, hard bake (HB) temperature, WEE, and EBR are 120℃, 105℃, 135℃, 0, and 0.5, respectively. For Lot2, the soft bake (SB) temperature, post-exposure bake (edge resist removal) temperature, hard bake (HB) temperature, WEE, and EBR are 90℃, 110℃, 120℃, 1.2, and 1.0, respectively. If Lots 1 through 6 are not sorted, the dispatching order is generally in the order of Lots 1 through 6. While Lot 1 is undergoing the baking process, the other Lots wait. If the baking temperature of the previous Lot differs from that of the next Lot, temperature adjustment is required, either raising or lowering the temperature. For example, Lot 1 is produced first, followed by Lot 2. The SB temperature difference is 30℃, requiring a drop from 120℃ to 90℃; the edge-removing temperature difference is 5℃, requiring a drop from 105℃ to 110℃; the HB temperature difference is 15℃, requiring a drop from 135℃ to 120℃. However, it takes approximately 50-70 minutes for the SB temperature to cool naturally from 135℃ to 90℃. After Lot 1 finishes, Lot 2 must wait for the SB temperature to drop to 90℃ before continuing production. If this happens once, the machine will waste approximately one hour of work. If this happens repeatedly, a significant amount of time will be wasted.
[0039] The second module calculates the SB temperature, edge-removal temperature, and HB temperature of the currently available Lots. If these temperatures are the same, they are assigned to the same combination, regardless of WEE and EBR values. For example, if there are currently 6 Lots, define combination A as having an SB temperature of 110℃, an edge-removal temperature of 105℃, and an HB temperature of 135℃. Combination A has 3 Lots. Define combination B as having an SB temperature of 90℃, an edge-removal temperature of 110℃, and an HB temperature of 120℃. Combination B has 2 Lots. Define combination C as having an SB temperature of 120℃, an edge-removal temperature of 105℃, and an HB temperature of 120℃. Combination C has 1 Lot. The second module will then feed back to the system, prioritizing the processing of the 3 Lots in combination A: Lot1, Lot5, and Lot6. Next, it will dispatch the 2 Lots in combination B: Lot2 and Lot3. Dispatching goods according to the statistical quantity from largest to smallest will greatly improve the utilization rate of the machine. It can save at least 1 hour per day and run about 250 more pieces of goods.
[0040] Table 2
[0041] Furthermore, after dispatching, the wafer begins the process flow, which includes photoresist coating, soft baking, exposure, post-exposure baking, development, and hard baking, etc., i.e., the wafer forms a semiconductor. There are many process flows involved. After dispatching, the wafer begins all process flows until the semiconductor fabrication is completed. Both the first module and the second module execute steps S11~S16 and issue dispatching instructions at regular intervals. For example, steps S11~S16 can be executed and dispatching instructions can be issued once every hour.
[0042] In summary, in the device and method for adjusting dispatch priority provided in this embodiment of the invention, the first module adjusts the dispatch priority of multiple batches of wafers based on priority and waiting time. The second module adjusts the dispatch priority of multiple batches of wafers based on the number of wafer batches with the same soft baking temperature, post-exposure baking temperature, and hard baking temperature in the process parameters. This reduces the number of times the baking temperature is raised or lowered, reduces waiting time, and improves WPD and throughput.
[0043] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.
Claims
1. A method of adjusting dispatching priority, characterized by, Comprising: S11: obtaining the priority, waiting time and process parameters of each batch wafer, each process parameter comprising soft baking temperature, post-exposure baking temperature, hard baking temperature, wafer edge exposure and edge glue removal; S12: sequentially judging whether the value of the priority of each batch wafer reaches a first preset condition, and if the value of the priority reaches the first preset condition, issuing a dispatch instruction for preferentially dispatching the corresponding batch wafer; S13: for all batch wafers whose value of the priority does not reach the first preset condition, sequentially judging whether the value of the waiting time of each batch wafer reaches a second preset condition, and if the value of the waiting time reaches the second preset condition, issuing a dispatch instruction for preferentially dispatching the corresponding batch wafer; S14: for all batch wafers whose value of the waiting time does not reach the second preset condition, collecting the process parameters of each batch wafer, counting the number of batch wafers whose soft baking, post-exposure baking and hard baking temperatures are the same, and sorting from large to small, and issuing a dispatch instruction for dispatching the batch wafers in the order from large to small.
2. The method of adjusting dispatch priority of claim 1, wherein, The first preset condition comprises that the value of the priority is 1 or the value of the priority is 2.
3. The method of adjusting dispatch priority of claim 1, wherein, The second preset condition comprises that the value of the waiting time is less than or equal to 180 min.
4. The method of adjusting dispatch priority of claim 1, wherein, One process parameter corresponds to one batch wafer.
5. The method of adjusting dispatch priority of claim 1, wherein, After dispatching, the wafer starts the process flow, which comprises coating photoresist, soft baking, soft baking, exposure, post-exposure baking, development and hard baking.
6. The method of adjusting dispatch priority of claim 1, wherein, In step S12, after issuing the dispatch instruction for preferentially dispatching the corresponding batch wafer, the batch wafers subjected to the screening process are sequentially dispatched.
7. The method of adjusting dispatch priority of claim 1, wherein, In step S13, after issuing the dispatch instruction for preferentially dispatching the corresponding batch wafer, the batch wafers subjected to the screening process are sequentially dispatched.
8. The method of adjusting dispatch priority of claim 1, wherein, In step S15, after issuing the dispatch instruction for dispatching the batch wafers in the order from large to small, the batch wafers subjected to the screening process are sequentially dispatched in the order from large to small.
9. An apparatus for adjusting a dispatch priority, for implementing the method of adjusting a dispatch priority according to any one of claims 1 to 8, characterized in that, Comprising: A first module for obtaining the priority, waiting time and process parameters of each batch wafer, each process parameter comprising soft baking temperature, post-exposure baking temperature, hard baking temperature, wafer edge exposure and edge glue removal; Further for sequentially judging whether the value of the priority of each batch wafer reaches a first preset condition, and if the value of the priority reaches the first preset condition, preferentially dispatching the corresponding batch wafer; for all batch wafers whose value of the priority does not reach the first preset condition, further for sequentially judging whether the value of the waiting time of each batch wafer reaches a second preset condition, and if the value of the waiting time reaches the second preset condition, issuing a dispatch instruction for preferentially dispatching the corresponding batch wafer; A second module for, for all batch wafers whose value of the waiting time does not reach the second preset condition, collecting the process parameters of each batch wafer, further for counting the number of batch wafers whose soft baking, post-exposure baking and hard baking temperatures are the same, and sorting from large to small, and issuing a dispatch instruction for dispatching the batch wafers in the order from large to small.
10. The apparatus for adjusting dispatch priority of claim 9, wherein, The first module and the second module each issue dispatching instructions at intervals.